The LM4904 is an audio power amplifier primarily designed
for demanding applications in mobile phones and other portable communication device applications. It is capable of
delivering 1 watt of continuous average power to an 8Ω BTL
load with less than 1% distortion (THD+N) from a 5V
power supply.
Boomer audio power amplifiers were designed specifically to
provide high quality output power with a minimal amount of
external components. The LM4904 does not require output
coupling capacitors or bootstrap capacitors, and therefore is
ideally suited for mobile phone and other low voltage applications where minimal power consumption is a primary requirement.
The LM4904 features a low-power consumption shutdown
mode, which is achieved by driving the shutdown pin with
logic high. Additionally, the LM4904 features an internal thermal shutdown protection mechanism.
The LM4904 contains advanced pop & click circuitry which
eliminates noise which would otherwise occur during turn-on
and turn-off transitions.
The LM4904 is unity-gain stable and can be configured by
external gain-setting resistors.
DC
Key Specifications
j
Improved PSRR at 217Hz & 1KHz62dB
j
Power Output at 5.0V, 1% THD, 8Ω1.07W (typ)
j
Power Output at 3.0V, 1% THD, 4Ω525mW (typ)
j
Power Output at 3.0V, 1% THD, 8Ω390mW (typ)
j
Shutdown Current0.1µA (typ)
Features
n Available in space-saving micro SMD package
n Ultra low current shutdown mode
n BTL output can drive capacitive loads
n Improved pop & click circuitry eliminates noise during
turn-on and turn-off transitions
n 2.0 - 5.5V operation
n No output coupling capacitors, snubber networks or
bootstrap capacitors required
n Unity-gain stable
n External gain configuration capability
Applications
n Mobile Phones
n PDAs
n Portable electronic devices
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (Note 11)6.0V
Thermal Resistance
θ
(micro SMD) (Note 12)210˚C/W
JA
Soldering Information
See AN-1112 "microSMD Wafers Level Chip Scale
Package."
Storage Temperature−65˚C to +150˚C
Input Voltage−0.3V to V
DD
+0.3V
Operating Ratings
Power Dissipation (Notes 3, 13)Internally Limited
ESD Susceptibility (Note 4)2000V
ESD Susceptibility (Note 5)200V
Junction Temperature150˚C
Temperature Range
T
≤ TA≤ T
MIN
MAX
Supply Voltage2.0V ≤ V
Electrical Characteristics VDD=5V (Notes 1, 2)
The following specifications apply for the circuit shown in Figure 1, unless otherwise specified. Limits apply for T
LM4904
SymbolParameterConditions
= 0V, Io= 0A, No Load37mA (max)
V
I
DD
I
SD
V
SDIH
V
SDIL
V
OS
R
OUT
P
o
T
WU
Quiescent Power Supply Current
Shutdown CurrentVSD=VDD(Note 8)0.12.0µA (max)
Shutdown Voltage Input High1.5V (min)
Shutdown Voltage Input Low1.3V (max)
Output Offset Voltage750mV (max)
Resistor Output to GND (Note 10)8.5
Output PowerTHD = 1% (max);f=1kHz1.070.9W
Wake-up time100mS (max)
THD+NTotal Harmonic Distortion+NoiseP
PSRRPower Supply Rejection Ratio
IN
V
= 0V, Io= 0A, 8Ω Load410mA (max)
IN
= 0.5 Wrms; f = 1kHz0.2%
o
V
= 200mV sine p-p
ripple
Input terminated with 10Ω
TypicalLimit
(Note 6)(Notes 7, 9)
60 (f =
217Hz)
64 (f = 1kHz)
9.7kΩ (max)
7.0kΩ (min)
55dB (min)
−40˚C ≤ TA≤ 85˚C
≤ 5.5V
DD
= 25˚C.
A
Units
(Limits)
Electrical Characteristics VDD=3V (Notes 1, 2)
The following specifications apply for the circuit shown in Figure 1, unless otherwise specified. Limits apply for T
LM4904
SymbolParameterConditions
= 0V, Io= 0A, No Load27mA (max)
V
I
DD
I
SD
V
SDIH
V
SDIL
V
OS
R
OUT
P
o
T
WU
Quiescent Power Supply Current
Shutdown CurrentVSD=VDD(Note 8)0.12.0µA (max)
Shutdown Voltage Input High1.1V (min)
Shutdown Voltage Input Low0.9V (max)
Output Offset Voltage750mV (max)
Resistor Output to GND (Note 10)8.5
Output Power (8Ω)THD = 1% (max);f=1kHz390mW
(4Ω)THD = 1% (max);f=1kHz525
Wake-up time75mS (max)
THD+NTotal Harmonic Distortion+NoiseP
PSRRPower Supply Rejection Ratio
IN
V
= 0V, Io= 0A, 8Ω Load39mA (max)
IN
= 0.25 Wrms; f = 1kHz0.1%
o
V
= 200mV sine p-p
ripple
Input terminated with 10Ω
TypicalLimit
(Note 6)(Notes 7, 9)
62 (f =
217Hz)
68 (f = 1kHz)
9.7kΩ (max)
7.0kΩ (min)
55dB (min)
= 25˚C.
A
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Units
(Limits)
Electrical Characteristics VDD= 2.6V (Notes 1, 2)
The following specifications apply for the circuit shown in Figure 1, unless otherwise specified. Limits apply for T
LM4904
LM4904
SymbolParameterConditions
= 0V, Io= 0A, No Load2.0mA (max)
V
I
DD
I
SD
V
SDIH
V
SDIL
V
OS
R
OUT
P
o
Quiescent Power Supply Current
Shutdown CurrentVSD=VDD(Note 8)0.1µA (max)
Shutdown Voltage Input High1.0V (min)
Shutdown Voltage Input Low0.9V (max)
Output Offset Voltage550mV (max)
Resistor Output to GND (Note 10)8.5
Output Power ( 8Ω )THD = 1% (max);f=1kHz275
IN
V
= 0V, Io= 0A, 8Ω Load3.0mA (max)
IN
(4Ω )THD = 1% (max);f=1kHz340
T
WU
THD+NTotal Harmonic Distortion+NoiseP
PSRRPower Supply Rejection Ratio
Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified.
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC andAC electrical specifications under particular test conditions which
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit
is given, however, the typical value is a good indication of device performance.
Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by T
allowable power dissipation is P
curves for additional information.
Note 4: Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Note 5: Machine Model, 220 pF–240 pF discharged through all pins.
Note 6: Typicals are measured at 25˚C and represent the parametric norm.
Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 8: For micro SMD only, shutdown current is measured in a Normal Room Environment. Exposure to direct sunlight will increase I
Note 9: Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis.
Note 10: R
Note 11: If the product is in Shutdown mode and V
If the source impedance limits the current to a max of 10mA, then the device will be protected. If the device is enabled when V
6.5V, no damage will occur, although operation life will be reduced. Operation above 6.5V with no current limit will result in permanent damage.
Note 12: All bumps have the same thermal resistance and contribute equally when used to lower thermal resistance. The LM4904ITL demo board (views featured
in the Application Information section) has two inner layers, one for V
and aid in spreading heat due to power dissipation within the IC.
Note 13: Maximum power dissipation in the device (P
Equation 1 shown in the Application Information section. It may also be obtained from the power dissipation graphs.
Wake-up time70mS (max)
= 0.15 Wrms; f = 1kHz0.1%
o
V
= 200mV sine p-p
ripple
Input terminated with 10Ω
=(T
DMAX
is measured from the output pin to ground. This value represents the parallel combination of the 10kΩ output resistors and the two 20kΩ resistors.
ROUT
)/θJAor the number given inAbsolute Maximum Ratings, whichever is lower. For the LM4904, see power derating
JMAX–TA
exceeds 6V (to a max of 8V VDD), then most of the excess current will flow through the ESD protection circuits.
DD
and one for GND. The planes each measure 600mils x 600mils (15.24mm x 15.24mm)
DD
) occurs at an output power level significantly below full output power. P
DMAX
TypicalLimit
(Note 6)(Notes 7, 9)
9.7kΩ (max)
7.0kΩ (min)
51 (f =
217Hz)
51 (f = 1kHz)
, θJA, and the ambient temperature TA. The maximum
JMAX
by a maximum of 2µA.
SD
is greater than 5.5V and less than
DD
can be calculated using
DMAX
= 25˚C.
A
Units
(Limits)
mW
dB (min)
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External Components Description
(Figure 1)
ComponentsFunctional Description
1.R
2.C
3.R
4.C
Inverting input resistance which sets the closed-loop gain in conjunction with Rf. This resistor also forms a
i
high pass filter with C
Input coupling capacitor which blocks the DC voltage at the amplifiers input terminals. Also creates a
i
highpass filter with R
for an explanation of how to determine the value of C
Feedback resistance which sets the closed-loop gain in conjunction with Ri.
f
Supply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing
S
at fC= 1/(2π RiCi).
i
at fc= 1/(2π RiCi). Refer to the section, Proper Selection of External Components,
i
.
i
section for information concerning proper placement and selection of the supply bypass capacitor.
5.C
Bypass pin capacitor which provides half-supply filtering. Refer to the section, Proper Selection of External
B
Components, for information concerning proper placement and selection of C
Typical Performance Characteristics
LM4904
.
B
THD+N vs Frequency
= 5V, 8Ω RL, and PWR = 500mW
at V
DD
THD+N vs Frequency
= 2.6V, 8Ω RL, and PWR = 150mW
at V
DD
THD+N vs Frequency
at VDD= 3V, 8Ω RL, and PWR = 250mW
2004373020043731
THD+N vs Frequency
at VDD= 2.6V, 4Ω RL, and PWR = 150mW
2004373220043733
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Typical Performance Characteristics (Continued)
LM4904
THD+N vs Power Out
at V
= 5V, 8Ω RL, 1kHz
DD
THD+N vs Power Out
= 2.6V, 8Ω RL, 1kHz
at V
DD
THD+N vs Power Out
at VDD= 3V, 8Ω RL, 1kHz
2004373420043783
THD+N vs Power Out
at VDD= 2.6V, 4Ω RL, 1kHz
2004378420043785
Power Supply Rejection Ratio (PSRR) vs Frequency
= 5V, 8Ω R
at V
DD
L
20043786
Input terminated with 10Ω
Power Supply Rejection Ratio (PSRR) vs Frequency
= 5V, 8Ω R
at V
DD
L
20043787
Input Floating
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Typical Performance Characteristics (Continued)
LM4904
Power Supply Rejection Ratio (PSRR) vs Frequency
at V
= 3V, 8Ω R
DD
L
20043788
Input terminated with 10Ω
Power Supply Rejection Ratio (PSRR) vs Frequency
= 2.6V, 8Ω R
at V
DD
L
Power Supply Rejection Ratio (PSRR) vs Frequency
= 3V, 8Ω R
at V
DD
L
20043789
Input Floating
Power Supply Rejection Ratio (PSRR) vs Frequency
= 2.6V, 8Ω R
at V
DD
L
Input terminated with 10Ω
20043790
Input Floating
20043791
Open Loop Frequency Response, 5VOpen Loop Frequency Response, 3V
2004379220043793
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Typical Performance Characteristics (Continued)
LM4904
Open Loop Frequency Response, 2.6VNoise Floor, 5V, 8Ω
80kHz Bandwidth, Input to GND
20043794
20043795
Power Derating CurvesPower Dissipation vs
Output Power, 5V, 8Ω
20043769
200437C8
20043797
200437C9
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Typical Performance Characteristics (Continued)
LM4904
Shutdown Hysteresis Voltage,
5V
Shutdown Hysteresis Voltage,
2.6V
Shutdown Hysteresis Voltage,
3V
200437A0200437A2
Output Power vs
Supply Voltage, 8Ω
Output Power vs
Supply Voltage, 16Ω
200437A4200437A6
Output Power vs
Supply Voltage, 32Ω
200437A7
200437A8
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Typical Performance Characteristics (Continued)
LM4904
Frequency Response vs
Input Capacitor Size
20043754
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Application Information
BRIDGE CONFIGURATION EXPLANATION
As shown in Figure 1, the LM4904 has two internal operational amplifiers. The first amplifier’s gain is externally configurable, while the second amplifier is internally fixed in a
unity-gain, inverting configuration. The closed-loop gain of
the first amplifier is set by selecting the ratio of R
the second amplifier’s gain is fixed by the two internal 20kΩ
resistors. Figure 1 shows that the output of amplifier one
serves as the input to amplifier two which results in both
amplifiers producing signals identical in magnitude, but out
of phase by 180˚. Consequently, the differential gain for the
IC is
= 2 *(Rf/Ri)
A
VD
By driving the load differentially through outputs Vo1 and
Vo2, an amplifier configuration commonly referred to as
“bridged mode” is established. Bridged mode operation is
different from the classical single-ended amplifier configuration where one side of the load is connected to ground.
A bridge amplifier design has a few distinct advantages over
the single-ended configuration, as it provides differential
drive to the load, thus doubling output swing for a specified
supply voltage. Four times the output power is possible as
compared to a single-ended amplifier under the same conditions. This increase in attainable output power assumes
that the amplifier is not current limited or clipped. In order to
choose an amplifier’s closed-loop gain without causing excessive clipping, please refer to the Audio Power AmplifierDesign section.
A bridge configuration, such as the one used in LM4904,
also creates a second advantage over single-ended amplifiers. Since the differential outputs, Vo1 and Vo2, are biased
at half-supply, no net DC voltage exists across the load. This
eliminates the need for an output coupling capacitor which is
required in a single supply, single-ended amplifier configuration. Without an output coupling capacitor, the half-supply
bias across the load would result in both increased internal
IC power dissipation and also possible loudspeaker damage.
to Riwhile
f
especially effective when connected to V
, GND, and the
DD
output pins. Refer to the application information on the
LM4904 reference design board for an example of good heat
sinking. If T
still exceeds 150˚C, then additional
JMAX
changes must be made. These changes can include reduced supply voltage, higher load impedance, or reduced
ambient temperature. Internal power dissipation is a function
of output power. Refer to the Typical Performance Charac-teristics curves for power dissipation information for different output powers and output loading.
POWER SUPPLY BYPASSING
As with any amplifier, proper supply bypassing is critical for
low noise performance and high power supply rejection. The
capacitor location on both the bypass and power supply pins
should be as close to the device as possible. Typical applications employ a 5V regulator with 10 µF tantalum or electrolytic capacitor and a ceramic bypass capacitor which aid
in supply stability. This does not eliminate the need for
bypassing the supply nodes of the LM4904. The selection of
a bypass capacitor, especially C
, is dependent upon PSRR
B
requirements, click and pop performance (as explained in
the section, Proper Selection of External Components),
system cost, and size constraints.
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the
LM4904 contains shutdown circuitry that is used to turn off
the amplifier’s bias circuitry. This shutdown feature turns the
amplifier off when logic high is placed on the shutdown pin.
By switching the shutdown pin to V
, the LM4904 supply
DD
current draw will be minimized in idle mode. Idle current is
measured with the shutdown pin connected to V
DD
. The
trigger point for shutdown is shown as a typical value in the
Shutdown Hysteresis Voltage graphs in the Typical Perfor-mance Characteristics section. It is best to switch between
ground and supply for maximum performance. While the
device may be disabled with shutdown voltages in between
ground and supply, the idle current may be greater than the
typical value of 0.1µA. In either case, the shutdown pin
should be tied to a definite voltage to avoid unwanted state
changes.
LM4904
POWER DISSIPATION
Power dissipation is a major concern when designing a
successful amplifier, whether the amplifier is bridged or
single-ended. A direct consequence of the increased power
delivered to the load by a bridge amplifier is an increase in
internal power dissipation. Since the LM4904 has two operational amplifiers in one package, the maximum internal
power dissipation is 4 times that of a single-ended amplifier.
The maximum power dissipation for a given application can
be derived from the power dissipation graphs or from Equation 1.
= 4*(VDD)2/(2π2RL)(1)
P
DMAX
It is critical that the maximum junction temperature T
150˚C is not exceeded. T
power derating curves by using P
can be determined from the
JMAX
and the PC board foil
DMAX
JMAX
area. By adding copper foil, the thermal resistance of the
application can be reduced from the free air value of θ
resulting in higher P
values without thermal shutdown
DMAX
JA
protection circuitry being activated. Additional copper foil can
be added to any of the leads connected to the LM4904. It is
In many applications, a microcontroller or microprocessor
output is used to control the shutdown circuitry, which provides a quick, smooth transition to shutdown. Another solution is to use a single-throw switch in conjunction with an
external pull-up resistor. This scheme guarantees that the
shutdown pin will not float, thus preventing unwanted state
changes.
PROPER SELECTION OF EXTERNAL COMPONENTS
Proper selection of external components in applications using integrated power amplifiers is critical to optimize device
and system performance. While the LM4904 is tolerant of
external component combinations, consideration to component values must be used to maximize overall system quality.
of
The LM4904 is unity-gain stable which gives the designer
maximum system flexibility. The LM4904 should be used in
low gain configurations to minimize THD+N values, and
maximize the signal to noise ratio. Low gain configurations
,
require large input signals to obtain a given output power.
Input signals equal to or greater than 1 Vrms are available
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Application Information (Continued)
from sources such as audio codecs. Please refer to the
LM4904
section, Audio Power Amplifier Design, for a more complete explanation of proper gain selection.
Besides gain, one of the major considerations is the closedloop bandwidth of the amplifier. To a large extent, the bandwidth is dictated by the choice of external components
shown in Figure 1. The input coupling capacitor, C
first order high pass filter which limits low frequency response. This value should be chosen based on needed
frequency response for a few distinct reasons.
Selection Of Input Capacitor Size
Large input capacitors are both expensive and space hungry
for portable designs. Clearly, a certain sized capacitor is
needed to couple in low frequencies without severe attenuation. But in many cases the speakers used in portable
systems, whether internal or external, have little ability to
reproduce signals below 100 Hz to 150 Hz. Thus, using a
large input capacitor may not increase actual system performance.
In addition to system cost and size, click and pop performance is effected by the size of the input coupling capacitor,
A larger input coupling capacitor requires more charge to
C
i.
reach its quiescent DC voltage (nominally 1/2 V
charge comes from the output via the feedback and is apt to
create pops upon device enable. Thus, by minimizing the
capacitor size based on necessary low frequency response,
turn-on pops can be minimized.
Besides minimizing the input capacitor size, careful consideration should be paid to the bypass capacitor value. Bypass
capacitor, C
turn-on pops since it determines how fast the LM4904 turns
on. The slower the LM4904’s outputs ramp to their quiescent
DC voltage (nominally 1/2 V
Choosing C
(in the range of 0.1 µF to 0.39 µF), should produce a virtually
clickless and popless shutdown function. While the device
will function properly, (no oscillations or motorboating), with
equal to 0.1 µF, the device will be much more susceptible
C
B
to turn-on clicks and pops. Thus, a value of C
1.0 µF is recommended in all but the most cost sensitive
designs.
AUDIO POWER AMPLIFIER DESIGN
, is the most critical component to minimize
B
), the smaller the turn-on pop.
equal to 1.0 µF along with a small value of C
B
DD
, forms a
i
). This
DD
equal to
B
Bandwidth100 Hz– 20 kHz
A designer must first determine the minimum supply rail to
obtain the specified output power. By extrapolating from the
Output Power vs Supply Voltage graphs in the Typical Per-formance Characteristics section, the supply rail can be
easily found.
5V is a standard voltage in most applications, it is chosen for
the supply rail. Extra supply voltage creates headroom that
allows the LM4904 to reproduce peaks in excess of 1W
without producing audible distortion. At this time, the designer must make sure that the power supply choice along
with the output impedance does not violate the conditions
explained in the Power Dissipation section.
Once the power dissipation equations have been addressed,
the required differential gain can be determined from Equation 2.
R
f/Ri=AVD
/2
From Equation 2, the minimum AVDis 2.83; use AVD=3.
Since the desired input impedance was 20 kΩ, and with a
impedance of 2, a ratio of 1.5:1 of Rfto Riresults in an
A
VD
allocation of R
=20kΩ and Rf=30kΩ. The final design step
i
is to address the bandwidth requirements which must be
stated as a pair of −3 dB frequency points. Five times away
from a −3 dB point is 0.17 dB down from passband response
±
which is better than the required
i
fL= 100 Hz/5 = 20 Hz
=20kHz*5=100kHz
f
H
0.25 dB specified.
As stated in the External Components section, R
junction with C
≥ 1/(2π*20 kΩ*20 Hz) = 0.397 µF; use 0.39 µF
C
i
create a highpass filter.
i
±
0.25 dB
in con-
i
(2)
A 1W/8Ω Audio Amplifier
Given:
Power Output1 Wrms
Load Impedance8Ω
Input Level1 Vrms
Input Impedance20 kΩ
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The high frequency pole is determined by the product of the
desired frequency pole, f
With a A
= 3 and fH= 100 kHz, the resulting GBWP =
VD
, and the differential gain, AVD.
H
300kHz which is much smaller than the LM4904 GBWP of
2.5MHz. This figure displays that if a designer has a need to
design an amplifier with a higher differential gain, the
LM4904 can still be used without running into bandwidth
limitations.
Application Information (Continued)
LM4904
FIGURE 2. HIGHER GAIN AUDIO AMPLIFIER
The LM4904 is unity-gain stable and requires no external
components besides gain-setting resistors, an input coupling
capacitor, and proper supply bypassing in the typical application. However, if a closed-loop differential gain of greater
than 10 is required, a feedback capacitor (C4) may be
needed as shown in Figure 2 to bandwidth limit the amplifier.
This feedback capacitor creates a low pass filter that elimi-
200437B7
nates possible high frequency oscillations. Care should be
taken when calculating the -3dB frequency in that an incorrect combination of R
and C4will cause rolloff before
3
20kHz. A typical combination of feedback resistor and capacitor that will not produce audio band high frequency rolloff
= 20kΩ and C4= 25pf. These components result in a
is R
3
-3dB point of approximately 320 kHz.
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Application Information (Continued)
LM4904
FIGURE 3. DIFFERENTIAL AMPLIFIER CONFIGURATION FOR LM4904
200437B8
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Application Information (Continued)
LM4904
FIGURE 4. REFERENCE DESIGN BOARD SCHEMATIC
200437C7
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Application Information (Continued)
LM4904 micro SMD BOARD ARTWORK
LM4904
Composite ViewSilk Screen
200437C0
Top LayerInner VDDLayer
200437C2
Inner GND LayerBottom Layer
200437C1
200437C3
200437C4
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200437C6
Application Information (Continued)
Mono LM4904 Reference Design Boards
Bill of Material
Part DescriptionQuantityReference Designator
LM4904 Audio AMP1U1
Tantalum Capcitor, 1µF2C1, C3
Ceramic Capacitor, 0.39µF1C2
Resistor, 20kΩ, 1/10W2R2, R3
Resistor, 100kΩ, 1/10W1R1
Jumper Header Vertical Mount 2X1 0.100“ spacing1J1
LM4904
PCB LAYOUT GUIDELINES
This section provides practical guidelines for mixed signal
PCB layout that involves various digital/analog power and
ground traces. Designers should note that these are only
"rule-of-thumb" recommendations and the actual results will
depend heavily on the final layout.
GENERAL MIXED SIGNAL LAYOUT
RECOMMENDATION
Power and Ground Circuits
For 2 layer mixed signal design, it is important to isolate the
digital power and ground trace paths from the analog power
and ground trace paths. Star trace routing techniques (bringing individual traces back to a central point rather than daisy
chaining traces together in a serial manner) can have a
major impact on low level signal performance. Star trace
routing refers to using individual traces to feed power and
ground to each circuit or even device. This technique will
require a greater amount of design time but will not increase
the final price of the board. The only extra parts required will
be some jumpers.
Single-Point Power / Ground Connections
The analog power traces should be connected to the digital
traces through a single point (link). A "Pi-filter" can be helpful
in minimizing High Frequency noise coupling between the
analog and digital sections. It is further recommended to put
digital and analog power traces over the corresponding digital and analog ground traces to minimize noise coupling.
Placement of Digital and Analog Components
All digital components and high-speed digital signal traces
should be located as far away as possible from analog
components and circuit traces.
Avoiding Typical Design / Layout Problems
Avoid ground loops or running digital and analog traces
parallel to each other (side-by-side) on the same PCB layer.
When traces must cross over each other do it at 90 degrees.
Running digital and analog traces at 90 degrees to each
other from the top to the bottom side as much as possible will
minimize capacitive noise coupling and cross talk.
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DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
labeling, can be reasonably expected to result in a
significant injury to the user.
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National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification
(CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2.
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National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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