National Semiconductor DAC128S085 Technical data

September 2007
DAC128S085 12-Bit Micro Power OCTAL Digital-to-Analog Converter with Rail-to-Rail Outputs
DAC128S085 12-Bit Micro Power OCTAL Digital-to-Analog Converter with Rail-to-Rail Outputs

General Description

The DAC128S085 is a full-featured, general purpose OCTAL 12-bit voltage-output digital-to-analog converter (DAC) that can operate from a single +2.7V to +5.5V supply and con­sumes 1.95 mW at 3V and 4.85 mW at 5V. The DAC128S085 is packaged in a 16-lead LLP package and a 16-lead TSSOP package. The LLP package makes the DAC128S085 the smallest OCTAL DAC in its class. The on-chip output ampli­fiers allow rail-to-rail output swing and the three wire serial interface operates at clock rates up to 40 MHz over the entire supply voltage range. Competitive devices are limited to 25 MHz clock rates at supply voltages in the 2.7V to 3.6V range. The serial interface is compatible with standard SPI, QSPI, MICROWIRE and DSP interfaces. The DAC128S085 also of­fers daisy chain operation where an unlimited number of DAC128S085s can be updated simultaneously using a single serial interface.
There are two references for the DAC128S085. One refer­ence input serves channels A through D while the other reference serves channels E through H. Each reference can be set independently between 0.5V and VA, providing the widest possible output dynamic range. The DAC128S085 has a 16-bit input shift register that controls the mode of operation, the power-down condition, and the DAC channels' register/ output value. All eight DAC outputs can be updated simulta­neously or individually.
A power-on reset circuit ensures that the DAC outputs power up to zero volts and remain there until there is a valid write to the device. The power-down feature of the DAC128S085 al­lows each DAC to be independently powered with three dif­ferent termination options. With all the DAC channels powered down, power consumption reduces to less than 0.3 µW at 3V and less than 1 µW at 5V. The low power consump­tion and small packages of the DAC128S085 make it an excellent choice for use in battery operated equipment.
The DAC128S085 is one of a family of pin compatible DACs, including the 8-bit DAC088S085 and the 10-bit DAC108S085. All three parts are offered with the same pinout, allowing sys­tem designers to select a resolution appropriate for their application without redesigning their printed circuit board. The DAC128S085 operates over the extended industrial temper­ature range of −40°C to +125°C.

Features

Guaranteed Monotonicity
Low Power Operation
Rail-to-Rail Voltage Output
Daisy Chain Capability
Power-on Reset to 0V
Simultaneous Output Updating
Individual Channel Power Down Capability
Wide power supply range (+2.7V to +5.5V)
Dual Reference Voltages with range of 0.5V to V
Operating Temperature Range of −40°C to +125°C
Industry's Smallest Package

Key Specifications

Resolution 12 bits
INL ±8 LSB (max)
DNL +0.75 / −0.4 LSB (max)
Settling Time 8.5 µs (max)
Zero Code Error +15 mV (max)
Full-Scale Error −0.75 %FSR (max)
Supply Power
Normal 1.95 mW (3V) / 4.85 mW (5V) typ
Power Down 0.3 µW (3V) / 1 µW (5V) typ

Applications

Battery-Powered Instruments
Digital Gain and Offset Adjustment
Programmable Voltage & Current Sources
Programmable Attenuators
Voltage Reference for ADCs
Sensor Supply Voltage
Range Detectors
A

Ordering Information

Order Numbers Temperature Range Package Top Mark
DAC128S085CISQ
DAC128S085CISQX
DAC128S085CIMT
DAC128S085CIMTX
DAC128S085EB Evaluation Board - BOTH
SPI is a trademark of Motorola, Inc.
© 2007 National Semiconductor Corporation 300169 www.national.com
−40°C TA +125°C
−40°C TA +125°C
−40°C TA +125°C
−40°C TA +125°C
16-Lead LLP
LLP Tape-and-Reel
16-Lead TSSOP X78C
TSSOP Tape-and-Reel X78C

Block Diagram

DAC128S085
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30016903

Pin Configuration

DAC128S085
30016901

Pin Descriptions

LLP
Pin No.
1 3
2 4
3 5
4 6
5 7
6 8
7 9
8 10 GND Ground Ground reference for all on-chip circuitry.
9 11
10 12
11 13
12 14
13 15 SYNC Digital Input
14 16 SCLK Digital Input
15 1
16 2
17
TSSOP Pin No.
Symbol Type Description
V
V
V
V
V
V
V
V
V
V
OUTA
OUTB
OUTC
OUTD
V
A
REF1
REF2
OUTH
OUTG
OUTF
OUTE
Analog Output Channel A Analog Output Voltage.
Analog Output Channel B Analog Output Voltage.
Analog Output Channel C Analog Output Voltage.
Analog Output Channel D Analog Output Voltage.
Supply Power supply input. Must be decoupled to GND.
Analog Input
Analog Input
Unbuffered reference voltage shared by Channels A, B, C, and D. Must be decoupled to GND.
Unbuffered reference voltage shared by Channels E, F, G, and H. Must be decoupled to GND.
Analog Output Channel H Analog Output Voltage.
Analog Output Channel G Analog Output Voltage.
Analog Output Channel F Analog Output Voltage.
Analog Output Channel E Analog Output Voltage.
Frame Synchronization Input. When this pin goes low, data is written into the DAC's input shift register on the falling edges of SCLK. After the 16th falling edge of SCLK, a rising edge of SYNC causes the DAC to be updated. If SYNC is brought high before the 15th falling edge of SCLK, the rising edge of SYNC acts as an interrupt and the write sequence is ignored by the DAC.
Serial Clock Input. Data is clocked into the input shift register on the falling edges of this pin.
D
IN
D
OUT
Digital Input
Digital Output
Serial Data Input. Data is clocked into the 16-bit shift register on the falling edges of SCLK after the fall of SYNC.
Serial Data Output. D
is utilized in daisy chain operation and is
OUT
connected directly to a DIN pin on another DAC128S085. Data is not available at D
unless SYNC remains low for more than 16
OUT
SCLK cycles.
PAD
(LLP only)
Ground
Exposed die attach pad can be connected to ground or left floating. Soldering the pad to the PCB offers optimal thermal performance and enhances package self-alignment during reflow.
30016902
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Absolute Maximum Ratings (Notes 1, 2)

If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
DAC128S085
Supply Voltage, V
Voltage on any Input Pin −0.3V to 6.5V Input Current at Any Pin (Note 3) 10 mA Package Input Current (Note 3) 30 mA Power Consumption at TA = 25°C
ESD Susceptibility (Note 5) Human Body Model Machine Model Charge Device Mode
Junction Temperature +150°C Storage Temperature −65°C to +150°C
A
See (Note 4)
6.5V
2500V
250V
1000V

Operating Ratings (Notes 1, 2)

Operating Temperature Range
Supply Voltage, V
Reference Voltage, V
A
REF1,2
Digital Input Voltage (Note 7) 0.0V to 5.5V Output Load 0 to 1500 pF SCLK Frequency Up to 40 MHz
−40°C TA +125°C

Package Thermal Resistances

Package
16-Lead LLP 38°C/W
16-Lead TSSOP 130°C/W
Soldering process must comply with National Semiconductor's Reflow Temperature Profile specifications.
θ
JA
Refer to www.national.com/packaging. (Note 6)

Electrical Characteristics

The following specifications apply for VA = +2.7V to +5.5V, V range 48 to 4047. Boldface limits apply for T
TA T
MIN
Symbol Parameter Conditions Typical
STATIC PERFORMANCE
Resolution 12 Bits (min)
Monotonicity 12 Bits (min)
INL Integral Non-Linearity ±2.0 ±8 LSB (max)
DNL Differential Non-Linearity
I
ZE Zero Code Error
FSE Full-Scale Error
OUT
I
OUT
= 0
= 0
GE Gain Error −0.2 −1.0 % FSR (max)
ZCED Zero Code Error Drift −20 µV/°C
TC GE Gain Error Tempco −1.0 ppm/°C
OUTPUT CHARACTERISTICS
Output Voltage Range
I
High-Impedance Output
OZ
Leakage Current (Note 9)
±1 µA (max)
VA = 3V, I
ZCO Zero Code Output
VA = 3V, I
VA = 5V, I
VA = 5V, I
VA = 3V, I
FSO Full Scale Output
VA = 3V, I
VA = 5V, I
VA = 5V, I
VA = 3V, V
I
Output Short Circuit Current
OS
(source) (Note 10)
Input Code = FFFh
VA = 5V, V Input Code = FFFh
= V
REF1
and all other limits are at TA = 25°C, unless otherwise specified.
MAX
= VA, CL = 200 pF to GND, f
REF2
= 30 MHz, input code
SCLK
Limits
(Note 8)
+0.15 +0.75 LSB (max)
−0.09 −0.4 LSB (min)
+5 +15 mV (max)
−0.1 −0.75 % FSR (max)
0
V
REF1,2
= 200 µA
OUT
= 1 mA
OUT
= 200 µA
OUT
= 1 mA
OUT
= 200 µA
OUT
= 1 mA
OUT
= 200 µA
OUT
= 1 mA
OUT
OUT
OUT
= 0V,
= 0V,
10 mV
45 mV
8 mV
34 mV
2.984 V
2.933 V
4.987 V
4.955 V
−50 mA
−60 mA
+2.7V to 5.5V
+0.5V to V
Units
(Limits)
V (min)
V (max)
A
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DAC128S085
Symbol Parameter Conditions Typical
VA = 3V, V
I
OS
Output Short Circuit Current (sink) (Note 10)
Input Code = 000h
VA = 5V, V
OUT
OUT
= 3V,
= 5V,
Input Code = 000h
TA = 105°C
TA = 125°C
RL =
RL = 2k
1500 pF
1500 pF
Z
I
O
C
OUT
Continuous Output Current per channel (Note 9)
Maximum Load Capacitance
L
DC Output Impedance 8
REFERENCE INPUT CHARACTERISTICS
Input Range Minimum 0.5 2.7 V (min)
VREF1,2
Input Range Maximum
Input Impedance 30
LOGIC INPUT CHARACTERISTICS
I
V
V
C
Input Current (Note 9) ±1 µA (max)
IN
Input Low Voltage
IL
Input High Voltage
IH
Input Capacitance (Note 9) 3 pF (max)
IN
VA = 2.7V to 3.6V
VA = 4.5V to 5.5V
VA = 2.7V to 3.6V
VA = 4.5V to 5.5V
POWER REQUIREMENTS
V
Supply Voltage Minimum 2.7 V (min)
A
Supply Voltage Maximum 5.5 V (max)
VA = 2.7V
Normal Supply Current for supply pin V
A
I
N
Normal Supply Current for V V
REF2
REF1
f
= 30 MHz,
SCLK
output unloaded
or
f
= 30 MHz,
SCLK
output unloaded
to 3.6V
VA = 4.5V to 5.5V
VA = 2.7V to 3.6V
VA = 4.5V to 5.5V
VA = 2.7V
Static Supply Current for supply pin V
A
I
ST
Static Supply Current for V V
REF2
REF1
f
SCLK
output unloaded
or
f
SCLK
output unloaded
= 0,
= 0,
to 3.6V
VA = 4.5V to 5.5V
VA = 2.7V to 3.6V
VA = 4.5V to 5.5V
f
= 30 MHz, SYNC =
SCLK
VA and DIN = 0V after PD
Total Power Down Supply Current
I
PD
for all PD Modes (Note 9)
mode loaded
f
= 0, SYNC = VA and
SCLK
DIN = 0V after PD mode loaded
VA = 2.7V to 3.6V
VA = 4.5V to 5.5V
VA = 2.7V to 3.6V
VA = 4.5V to 5.5V
Limits
(Note 8)
Units
(Limits)
50 mA
70 mA
10 mA (max)
6.5 mA (max)
V
A
V (max)
k
1.0 0.6 V (max)
1.1 0.8 V (max)
1.4 2.1 V (min)
2.0 2.4 V (min)
460 560 µA (max)
650 830 µA (max)
95 130 µA (max)
160 220 µA (max)
370 µA
440 µA
95 µA
160 µA
0.2 1.5 µA (max)
0.5 3.0 µA (max)
0.1 1.0 µA (max)
0.2 2.0 µA (max)
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Symbol Parameter Conditions Typical
VA = 2.7V to 3.6V
VA = 4.5V to 5.5V
VA = 2.7V to 3.6V
VA = 4.5V
DAC128S085
P
N
Total Power Consumption (output unloaded)
f
= 30 MHz
SCLK
output unloaded
f
= 0
SCLK
output unloaded
to 5.5V
f
= 30 MHz, SYNC =
SCLK
VA and DIN = 0V after PD
Total Power Consumption in all PD
P
PD
Modes, (Note 9)
mode loaded
f
= 0, SYNC = VA and
SCLK
DIN = 0V after PD mode loaded
VA = 2.7V to 3.6V
VA = 4.5V to 5.5V
VA = 2.7V to 3.6V
VA = 4.5V to 5.5V
1.95 3.0 mW (max)
4.85 7.0 mW (max)
1.68 mW
3.80 mW
0.6 5.4 µW (max)
2.5 16.5 µW (max)
0.3 3.6 µW (max)
1 11 µW (max)
Limits
(Note 8)

A.C. and Timing Characteristics

The following specifications apply for VA = +2.7V to +5.5V, V 48 to 4047. Boldface limits apply for T
TA T
MIN
and all other limits are at TA = 25°C, unless otherwise specified.
MAX
Symbol Parameter Conductions Typical
f
SCLK Frequency 40 30 MHz (max)
SCLK
Output Voltage Settling Time
t
s
(Note 9)
400h to C00h code change
RL = 2k, CL = 200 pF
SR Output Slew Rate 1 V/µs
GI Glitch Impulse Code change from 800h to 7FFh 40 nV-sec
DF Digital Feedthrough 0.5 nV-sec
DC Digital Crosstalk 0.5 nV-sec
CROSS DAC-to-DAC Crosstalk 1 nV-sec
V
MBW Multiplying Bandwidth
THD+N Total Harmonic Distortion Plus Noise
= 2.5V ± 2Vpp
REF1,2
V
= 2.5V ± 0.5Vpp
REF1,2
100Hz < fIN < 20kHz
ONSD Output Noise Spectral Density DAC Code = 800h, 10kHz 40 nV/sqrt(Hz)
ON Output Noise BW = 30kHz 14 µV
VA = 3V
VA = 5V
1.0 2.5 ns (min)
1.0 2.5 ns (min)
1/f
t
t
WU
SCLK
t
CH
t
CL
t
SS
t
DS
t
DH
t
SH
SYNC
Wake-Up Time
SCLK Cycle Time 25 33 ns (min)
SCLK High time 7 10 ns (min)
SCLK Low Time 7 10 ns (min)
SYNC Set-up Time prior to SCLK Falling Edge
Data Set-Up Time prior to SCLK Falling Edge
Data Hold Time after SCLK Falling Edge
SYNC Hold Time after the 16th falling edge of SCLK
SYNC High Time 5 15 ns (min)
= VA, CL = 200 pF to GND, f
REF1,2
= 30 MHz, input code range
SCLK
Limits
(Note 8)
6 8.5 µs (max)
360 kHz
−80 dB
3 µsec
20 µsec
3 10 ns (min)
1 / f
SCLK
- 3
0 3 ns (min)
1 / f
SCLK
- 3
Units
(Limits)
Units
(Limits)
ns (max)
ns (max)
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Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the maximum Operating Ratings is not recommended.
Note 2: All voltages are measured with respect to GND = 0V, unless otherwise specified.
Note 3: When the input voltage at any pin exceeds 5.5V or is less than GND, the current at that pin should be limited to 10 mA. The 30 mA maximum package
input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10 mA to three.
Note 4: The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula PDMAX = (TJmax − TA) / θJA. The values for maximum power dissipation will be reached only when the device is operated in a severe fault condition (e.g., when input or output pins are driven beyond the operating ratings, or the power supply polarity is reversed). Such conditions should always be avoided.
Note 5: Human body model is 100 pF capacitor discharged through a 1.5 k resistor. Machine model is 220 pF discharged through 0 . Charge device model simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated assembler) then rapidly being discharged.
Note 6: Reflow temperature profiles are different for lead-free packages.
Note 7: The inputs are protected as shown below. Input voltage magnitudes up to 5.5V, regardless of VA, will not cause errors in the conversion result. For
example, if VA is 3V, the digital input pins can be driven with a 5V logic device.
30016904
Note 8: Test limits are guaranteed to National's AOQL (Average Outgoing Quality Level).
Note 9: This parameter is guaranteed by design and/or characterization and is not tested in production.
Note 10: This parameter does not represent a condition which the DAC can sustain continuously. See the continuous output current specification for the maximum
DAC output current per channel.
DAC128S085

Timing Diagrams

30016906

FIGURE 1. Serial Timing Diagram

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Specification Definitions

DIFFERENTIAL NON-LINEARITY (DNL) is the measure of
the maximum deviation from the ideal step size of 1 LSB, which is V
DAC128S085
DAC-to-DAC CROSSTALK is the glitch impulse transferred
to a DAC output in response to a full-scale change in the out­put of another DAC.
DIGITAL CROSSTALK is the glitch impulse transferred to a DAC output at mid-scale in response to a full-scale change in the input register of another DAC.
DIGITAL FEEDTHROUGH is a measure of the energy inject­ed into the analog output of the DAC from the digital inputs when the DAC outputs are not updated. It is measured with a full-scale code change on the data bus.
FULL-SCALE ERROR is the difference between the actual output voltage with a full scale code (FFFh) loaded into the DAC and the value of VA x 4095 / 4096.
GAIN ERROR is the deviation from the ideal slope of the transfer function. It can be calculated from Zero and Full­Scale Errors as GE = FSE - ZE, where GE is Gain error, FSE is Full-Scale Error and ZE is Zero Error.
GLITCH IMPULSE is the energy injected into the analog out­put when the input code to the DAC register changes. It is specified as the area of the glitch in nanovolt-seconds.
INTEGRAL NON-LINEARITY (INL) is a measure of the de­viation of each individual code from a straight line through the input to output transfer function. The deviation of any given code from this straight line is measured from the center of that code value. The end point method is used. INL for this product is specified over a limited range, per the Electrical Tables.
LEAST SIGNIFICANT BIT (LSB) is the bit that has the small­est value or weight of all bits in a word. This value is
/ 4096 = VA / 4096.
REF
LSB = V
REF
/ 2
n
where V the DAC resolution in bits, which is 12 for the DAC128S085.
is the supply voltage for this product, and "n" is
REF
MAXIMUM LOAD CAPACITANCE is the maximum capaci­tance that can be driven by the DAC with output stability maintained.
MONOTONICITY is the condition of being monotonic, where the DAC has an output that never decreases when the input code increases.
MOST SIGNIFICANT BIT (MSB) is the bit that has the largest value or weight of all bits in a word. Its value is 1/2 of VA.
MULTIPLYING BANDWIDTH is the frequency at which the output amplitude falls 3dB below the input sine wave on V
with the DAC code at full-scale.
REF1,2
NOISE SPECTRAL DENSITY is the internally generated ran­dom noise. It is measured by loading the DAC to mid-scale and measuring the noise at the output.
POWER EFFICIENCY is the ratio of the output current to the total supply current. The output current comes from the power supply. The difference between the supply and output cur­rents is the power consumed by the device without a load.
SETTLING TIME is the time for the output to settle to within 1/2 LSB of the final value after the input code is updated.
TOTAL HARMONIC DISTORTION PLUS NOISE (THD+N)
is the ratio of the harmonics plus the noise present at the out­put of the DACs to the rms level of an ideal sine wave applied to V
with the DAC code at mid-scale.
REF1,2
WAKE-UP TIME is the time for the output to exit power-down mode. This is the time from the rising edge of SYNC to when the output voltage deviates from the power-down voltage of 0V.
ZERO CODE ERROR is the output error, or voltage, present at the DAC output after a code of 000h has been entered.

Transfer Characteristic

30016905

FIGURE 2. Input / Output Transfer Characteristic

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