MXIC MX10C8050PI, MX10C8051FC, MX10C8050QC, MX10C8054PI, MX10C8054FI Datasheet

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P/N:PM0591 REV. 0.3, APR. 09, 1999
MX10C805X
SINGLE-CHIP 8-BIT MICROCONTROLLER
ADVANCED INFORMATION
FEATURE
• High performance CMOS ROM CPU
• Operation Voltage 5V
• Three 16-bit timer/counters
• 256 Bytes of on-chip data RAM
• 4/8/16/32/64 Kbytes on-chip Program memory
• 32 Programmable I/O lines
• On-chip Watch-Dog-Timer (WDT)
• 6 interrupt Sources
• ROM Code protection
• Two priority levels
• Power saving Idle and power down modes
• 64 K external program memory space
• 64 K external data memory space
• Available in PLCC, PQFP, and PDIP package
• Four 8-bit I/O ports
• Full-duplex enhanced UART compatible with the stan­dard 80C51 and the 80C52
• Extended Temperature Range (-40°C to +85°C)
GENERAL DESCRIPTION
The single-chip 8-bit microcontroller is manufactured in MXIC's advanced CMOS process. This de vice uses the same powerful instruction set, has the same architec­ture, and is pin-to-pin compatible with the existing 80C51. The added features make it an even more powerful
microcontroller for applications that require clock out­put, and up/down counting capabilities such as motor control. It also has a more v ersatile serial channel that facilitates multi-processor communications .
PIN CONFIGURATIONS
40 PDIP
44 PLCC
44 PQFP
MX10C805X
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
(T2) P1.0
(T2EX) P1.1
P1.2 P1.3 P1.4 P1.5 P1.6 P1.7
RESET
(RXD) P3.0
(TXD)P3.1 (INT0) P3.2 (INT1) P3.3
(T0) P3.4 (T1) P3.5
(WR) P3.6
(RD) P3.7
XTAL2 XTAL1
VSS
40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21
VCC P0.0 (AD0) P0.1 (AD1) P0.2 (AD2) P0.3 (AD3) P0.4 (AD4) P0.5 (AD5) P0.6 (AD6) P0.7 (AD7) EA ALE PSEN P2.7 (A15) P2.6 (A14) P2.5 (A13) P2.4 (A12) P2.3 (A11) P2.2 (A10) P2.1 (A9) P2.0 (A8)
MX10C805X
P1.5 P1.6 P1.7 RST P3.0 N.C. P3.1 P3.2 P3.3 P3.4 P3.5
P0.4 P0.5 P0.6 P0.7 EA N.C. ALE PSEN P2.7 P2.6 P2.5
P1.4
P1.3
P1.2
P1.1
P1.0
N.C.
VCC
P0.0
P0.1
P0.2
P0.3
P3.6
P3.7
XTAL2
XTAL1
VSS
N.C.
P2.0
P2.1
P2.2
P2.3
P2.4
64440
39
34
29
7
12
17
18 23 28
1
1
11
12 22
23
33
34
44
P0.4 P0.5 P0.6 P0.7 EA N.C. ALE PSEN P2.7 P2.6 P2.5
P1.5 P1.6 P1.7 RST P3.0 N.C. P3.1 P3.2 P3.3 P3.4 P3.5
P1.4
P1.3
P1.2
P1.1
P1.0
N.C.
VCC
P0.0
P0.1
P0.2
P0.3
P3.6
P3.7
XTAL2
XTAL1
VSS
N.C.
P2.0
P2.1
P2.2
P2.3
P2.4
MX10C805X
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MX10C805X
BLOCK DIAGRAM
PORT 0
DRIVERS
PORT 0
LATCH
ACC
PSW
TMP2
PORT 1
LATCH
PORT 1
DRIVERS
P1.0-P1.7
XTAL2
XTAL1
OSC.
TMP1
ALU
B
REGISTER
TIMING
AND
CONTROL
RAM
Vcc Vss
RAM ADDR.
REGISTER
INSTRUCTION
REGISTER
PORT 2
LATCH
STACK
POINTER
ROM
PORT 2
DRIVERS
BUFFER
DPTR
PROGRAM
ADDR.
REGISTER
T0/T1/T2
SFRs
TIMERS
PORT 3
LATCH
PORT 3
DRIVERS
PC
INCREMENTER
PROGRAM
COUNTER
P0.0-P0.7 P2.0-P2.7
P3.0-P3.7
PSEN
ALE
EA
RST
T3
WATCHDOG
TIMER
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MX10C805X
PIN DESCRIPTIONS
VCC : Supply v oltage. VSS : Circuit ground. Port 0 : Port 0 is an 8-bit, open drain, bidirectional I/O
port. As an output port each pin can sink several LS TTL inputs. Port 0 pins that have 1's written to them float, and in that state can be used as high-impedance inputs.
Port 0 is also the multiplex ed low-order address and data bus during accesses to external Program and Data Memory. In this application it uses strong internal pullups when emitting 1's, and can source and sink serveral LS TTL inputs.
Port 1 : P ort 1 is an 8-bit bidirectional I/O port with inter­nal pullups. The port 1 output buffers can drive LS TTL inputs. Port 1 pins that have 1's written to them are pulled high by the internal pullups, and in that state can be used as inputs. As inputs, P ort 1 pins that are exter­nally pulled low will source current (IIL, on the data sheet) because of the internal pullups.
In additional, Port 1 serves the functions of the following special features of the MX10C805X :
Port Pin Alternate Function P1.0 T2 (Exter nal Count Input to Timer/
Counter 2), Clock-Out
P1.1 T2EX (Timer/Counter 2 Capture/Reload
Trigger and Direction Control)
Port 2 : P ort 2 is an 8-bit bidirectional I/O port with inter­nal pullups. The port 2 output buffers can drive LS TTL inputs. Port 2 pins that have 1's written to them are pulled high by the internal pullups, and in that state can be used as inputs. As inputs, P ort 2 pins that are exter­nally pulled low will source current (IIL, on the data sheet) because of the internal pullups.
Port 2 emits the high-order address byte during fetches from external Program Memory and during accesses to external Data Memory that use 16-bit addresses (MOVX @DPTR). In this application it uses strong internal pullups when emitting 1's. During accesses to external Data Memory that use 8-bit addresses (MOVX @Ri), Port 2 emits the contents of the P2 Special Function Register.
Port 3 : P ort 3 is an 8-bit bidirectional I/O port with inter­nal pullups. The port 3 output buffers can drive LS TTL inputs. Port 3 pins that have 1's written to them are pulled high by the internal pullups, and in that state can be used as inputs. As inputs, P ort 3 pins that are exter­nally pulled low will source current (IIL, on the data sheet) because of the internal pullups.
Port 3 also serves the function of various special fea­tures of the 8051 Family, as listed below :
Port Pin Alternate Function P3.0 RXD (serial input port) P3.1 TXD (serial output port) P3.2 INT0 (external interrupt 0) P3.3 INT1 (external interrupt 1) P3.4 T0 (Timer 0 external input) P3.5 T1 (Timer 1 external input) P3.6 WR (external data memory write sttobe) P3.7 RD (external data memory read strobe)
PROCESS INFORMATION
This device is manuf actured on a MXIC CMOS process.
P A CKAGES
MX10C805 1 P C
T emperature C=0°C to 70°C I=-40°C to 85°C
Package P=PDIP Q=PLCC F=PQFP
ROM Size 0=64K Bytes 1=4K Bytes 2=8K Bytes 4=16K Bytes 8=32K Bytes
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MX10C805X
RST : Reset input. A high on this pin for two machine cycles while the oscillator is running resets the device. The port pins will be driven to their reset condition when a minimum VIHI voltage is applied whether the oscilla­tor is running or not. An internal pulldown resistor per­mits a power-on reset with only a capacitor connected to VCC.
ALE : Address Latch Enable output pulse for latching the low byte of the address during accesses to external memory .
In normal operation ALE is emitted at a constant rate of 1/6 the oscillator frequency, and may be used for e xter­nal timing or clocking purposes. Note, however, that one ALE pulse is skipped during each access to exter­nal Data Memory .
If desired, ALE operation can be disabled by setting bit 5 of SFR location 87H (PCON). With this bit set, the pin is weakly pulled high. Howe ver, the ALE disab le feature will be suspended during a MOVX or MO VC instruction, idle mode, power do wn mode. The ALE disable f eature will be terminated by reset. When the ALE disable f ea­ture is suspended or terminated, the ALE pin will no longer be pulled up weakly. Setting the ALE-disable bit has no affect if the micrcontroller is in external execu­tion mode.
Throughout the remainder of this data sheet, ALE will refer to the signal coming out of the ALE pin, and the pin will be referred to as the ALE pin.
PSEN : Progr am Store Enable is the read strobe to ex­ternal Program Memory.
When the MX10C805X is executing code from e xternal Program memory, PSEN is activated twice each ma­chine cycle, except that two PSEN activations are skipped during each access to external Data memory.
EA/VPP : Extrernal Access enable. EA must be str apped to VSS in order to enable the twiceto fetch code from external Program Memory locations 0000H to 0FFFFH. EA will be internally latched on reset.
EA should be strapped to VCC f or internal program ex­ecutions.
XTAL1 : Input to the inverting oscillator amplifier. XTAL2 : Output from the inverting oscillator amplifier.
T o drive the de vice from an external clock source, XTAL1 should be driven, while XTAL2 floats, as shown in Fig­ure 4. There are no requirememts on the duty cycle of the external clock signal, since the input to the internal clocking circuitry is through a divide-by-two flip-flop, b ut minimum and maximum high and low times specified on the data sheet must be observed.
An external oscillator may encounter as much as a 100 pF load at XTAL1 when it starts up. This is due to inter­action between the amplifer and its feedback capaci­tance. Once the e xternal signal meets the VIL and VIH specifications the capacitance will not exceed 20 pF.
C2
XTAL2
XTAL1
VSS
Figure 3. Oscillator Connections
C1, C2 = 30 pF is equal to or less than 10 pF for Crystal
For Ceramic Resonators,contact resonator manufacture.
C1
N/C
XTAL1
VSS
XTAL2
EXTERNAL
OSCILLATOR
SIGNAL
Figure 4. External Clock Drive Configuration
OSCILLA T OR CHARA CTERISTICS
XT AL1 and XTAL2 are the input and output, respectively , of a inverting amplifier which can be configured for use as an on-chip oscillator, as sho wn in Figure 3. Either a quartz crystal or ceramic resonator may be used.
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MX10C805X
T a ble 2. Status of the External Pins during Idle and Power Do wn
Mode Program Memory ALE PSEN PORT0 PORT1 PORT2 PORT3 Idle Internal 1 1 Data Data Data Data Idle External 1 1 Float Data Address Data Pow er Down Internal 0 0 Data Data Data Data Pow er Down External 0 0 Float Data Data Data
POWER DOWN MODE
To save even more power, a Po wer Down mode can be invok ed by software. If this mode, the oscillator is stopped and the instruction that invoked Power Down is the last instruction executed. The on-chip RAM and Special Function Registers retain their values until the Power Down mode is terminated.
On the MX10C805X either a hardware reset or an ex­ternal interrupt can cause an exit from Power Down. Re­set redefines all the SFRs but does not change the on­chip RAM. An external interrupt allows both the SFRs and on-chip RAM to retain their values.
ABSOLUTE MAXIMUM RATING*
Ambient Temperature Under Bias -40°C to +85°C Storage T emperature -65°C to +150°C Voltage on Any Other Pin to VSS -0.5V to +6.5V IOL Per I/O Pin 15mA Pow er Dissipation 1.5W
(Based on PACKAGE heat transfer limitations, not de­vice consumption)
IDLE MODE
The user's software can invoke the Idle Mode. When the microcontroller is in this mode, power consumption is reduced. The Special Function Registers and the onboard RAM retain their values during Idle, but the pro­cessor stops executing instructions. Idle Mode will be exited if the chip is reset or if an enabled interrupt oc­curs.
OPERATING CONDITIONS
Symbol Description Min Max Units TA Ambient Temperature Under Bias
Commerical 0 +70 °C
Industrial -40 +85 °C VCC 4.5 5.5 V fOSC Oscillator Frequency 3.5 40 MHz
To properly terminate Power Down, the reset or exter­nal interrupt should not be executed before VCC is re­stored to its normal operating level, and must be held active long enough for the oscillator to restart and stabi­lize (normally less than 10 ms).
With an external interrupt, INT0 and INT1 must be en­abled and configured as lev el-sensitive. Holding the pin low restarts the oscillator but bringing the pin back high completes the exit. Once the interrupt is serviced, the next instruction to be executed after RETI will be the one following the instruction that put the de vice into Power Down.
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