MSI MS-S1311 User Manual

i

MS-S1311

(v1.X) Server Board

ii

Preface MS-S1311

Copyright Notice

The material in this document is the intellectual property of MICRO-STAR IN­TERNATIONAL. We take every care in the preparation of this document, but no
guarantee is given as to the correctness of its contents. Our products are under
continual improvement and we reserve the right to make changes without notice.

Trademarks

All trademarks are the properties of their respective owners.

Revision History

Revision Date

V1.0 2014/12

Technical Support

If a problem arises with your system and no solution can be obtained from the
user’s manual, please contact your place of purchase or local distributor. Alterna­tively, please try the following help resources for further guidance.

Visit the MSI website for technical guide, BIOS updates, driver updates and other

information, or contact our technical sta󰘯 via http://www.msi.com/support/

iii

Safety Instructions

￭ Always read the safety instructions carefully.
￭ Keep this User’s Manual for future reference.
￭ Keep this equipment away from humidity.
￭ Lay this equipment on a reliable at surface before setting it up.
￭ The openings on the enclosure are for air convection hence protects the

equipment from overheating. DO NOT COVER THE OPENINGS.

￭ Make sure the voltage of the power source and adjust properly before con-

necting the equipment to the power inlet.

￭ Place the power cord such a way that people can not step on it. Do not place

anything over the power cord.

￭ Always Unplug the Power Cord before inserting any add-on card or module.
￭ All cautions and warnings on the equipment should be noted.
￭ Never pour any liquid into the opening that could damage or cause electrical

shock.

￭ If any of the following situations arises, get the equipment checked by ser-

vice personnel:

◯ The power cord or plug is damaged.
◯ Liquid has penetrated into the equipment.
◯ The equipment has been exposed to moisture.
◯ The equipment does not work well or you can not get it work according

to User’s Manual.

◯ The equipment has dropped and damaged.
◯ The equipment has obvious sign of breakage.

￭ DO NOT LEAVE THIS EQUIPMENT IN AN ENVIRONMENT UNCONDI-

TIONED, STORAGE TEMPERATURE ABOVE 60oC (140oF), IT MAY DAM­AGE THE EQUIPMENT.

iv

Preface MS-S1311

Chemical Substances Information

In compliance with chemical substances regulations, such as the EU REACH
Regulation (Regulation EC No. 1907/2006 of the European Parliament and the

Council), MSI provides the information of chemical substances in products at:
http://www.msi.com/html/popup/csr/evmtprtt_pcm.html

Battery Information

European Union:

Batteries, battery packs, and accumulators should not be
disposed of as unsorted household waste. Please use the
public collection system to return, recycle, or treat them in
compliance with the local regulations.

廢電池請回收

Taiwan:

For better environmental protection, waste batteries should
be collected separately for recycling or special disposal.

California, USA:

The button cell battery may contain perchlorate material
and requires special handling when recycled or disposed
of in California.

For further information please visit:
http://www.dtsc.ca.gov/hazardouswaste/perchlorate/

Danger of explosion if battery is incorrectly replaced. Replace only with the
same or equivalent type recommended by the manufacturer.

v

CE Conformity

Hereby, Micro-Star International CO., LTD declares that this de­vice is in compliance with the essential safety requirements and
other relevant provisions set out in the European Directive.

FCC-A Radio Frequency
Interference Statement

This equipment has been tested and found to comply with the
limits for a Class A digital device, pursuant to Part 15 of the
FCC Rules. These limits are designed to provide reasonable protection against
harmful interference when the equipment is operated in a commercial environ­ment. This equipment generates, uses and can radiate radio frequency energy
and, if not installed and used in accordance with the instruction manual, may
cause harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference, in which case the user
will be required to correct the interference at his own expense.

Notice 1

The changes or modi󰘰cations not expressly approved by the party responsible for

compliance could void the user’s authority to operate the equipment.

Notice 2

Shielded interface cables and AC power cord, if any, must be used in order to
comply with the emission limits.

VOIR LA NOTICE D’INSTALLATION AVANT DE RACCORDER AU RESEAU.

This device complies with Part 15 of the FCC Rules. Operation is subject to the

following two conditions:

1) this device may not cause harmful interference, and

2) this device must accept any interference received, including interference that
may cause undesired operation.

WEEE Statement

Under the European Union (“EU”) Directive on Waste Electrical and

Electronic Equipment, Directive 2002/96/EC, which takes e󰘯ect on

August 13, 2005, products of “electrical and electronic equipment”
cannot be discarded as municipal waste anymore and manufacturers
of covered electronic equipment will be obligated to take back such
products at the end of their useful life. MSI will comply with the prod­uct take back requirements at the end of life of MSI-branded products that are
sold into the EU. You can return these products to local collection points.

vi

Preface MS-S1311

Japan JIS C 0950 Material
Declaration

A Japanese regulatory requirement, de󰘰ned by speci󰘰cation JIS C 0950, man­dates that manufacturers provide material declarations for certain categories of

electronic products o󰘯ered for sale after July 1, 2006.
http://www.msi.com/html/popup/csr/cemm_jp.html
http://tw.msi.com/html/popup/csr_tw/cemm_jp.html
日本JIS C 0950材質宣言
日本工業規格JIS C 0950により、2006年7月1日以降に販売される特定分野の

電気および電子機器について、製造者による含有物質の表示が義務付けられま
す。

http://www.msi.com/html/popup/csr/cemm_jp.html
http://tw.msi.com/html/popup/csr_tw/cemm_jp.html

India RoHS

This product complies with the "India E-waste (Management and Handling) Rule
2011" and prohibits use of lead, mercury, hexavalent chromium, polybrominat­ed biphenyls or polybrominated diphenyl ethers in concentrations exceeding

0.1 weight % and 0.01 weight % for cadmium, except for the exemptions set in

Schedule 2 of the Rule.

Turkey EEE Regulation

Conforms to the EEE Regulations of the Republic Of Turkey

Türkiye EEE yönetmeliği
Türkiye Cumhuriyeti: EEE Yönetmeliğine Uygundur

Ukraine Restriction of Hazardous
Substances

The equipment complies with requirements of the Technical Regulation, ap­proved by the Resolution of Cabinet of Ministry of Ukraine as of December 3,

2008 № 1057, in terms of restrictions for the use of certain dangerous substances

in electrical and electronic equipment.

Україна обмеження на наявність небезпечних речовин
Обладнання відповідає вимогам Технічного регламенту щодо обмеження

використання деяких небезпечних речовин в електричному та електронному
обладнані, затвердженого постановою Кабінету Міністрів України від 3
грудня 2008 № 1057.

vii

Vietnam RoHS

As from December 1, 2012, all products manufactured by MSI comply with
Circular 30/2011/TT-BCT temporarily regulating the permitted limits for a number

of hazardous substances in electronic and electric products.

Việt Nam RoHS

Kể từ ngày 01/12/2012, tất cả các sản phẩm do công ty MSI sản xuất tuân thủ
Thông tư số 30/2011/TT-BCT quy định tạm thời về giới hạn hàm lượng cho phép
của một số hóa chất độc hại có trong các sản phẩm điện, điện tử"

viii

Preface MS-S1311

CONTENTS

Copyright Notice ............................................................................................ ii

Trademarks ................................................................................................... ii

Revision History ............................................................................................ ii

Technical Support .......................................................................................... ii

Safety Instructions .........................................................................................iii

Chemical Substances Information ............................................................... iv

Battery Information ....................................................................................... iv

CE Conformity ............................................................................................... v

FCC-A Radio Frequency Interference Statement ......................................... v

WEEE Statement .......................................................................................... v

Japan JIS C 0950 Material Declaration ........................................................ vi

India RoHS ................................................................................................... vi

Turkey EEE Regulation ................................................................................ vi

Ukraine Restriction of Hazardous Substances ............................................. vi

Vietnam RoHS .............................................................................................vii

1. Overview.......................................................................................1-1

Motherboard Specications ........................................................................1-2

Motherboard Layout ................................................................................... 1-5

2. Hardware Setup ...........................................................................2-1

CPU (Central Processing Unit) ..................................................................2-3

Memory ......................................................................................................2-7

Storage .....................................................................................................2-10

Power Supply ........................................................................................... 2-12

Rear Panel I/O .........................................................................................2-13

Connector .................................................................................................2-15

Jumper .....................................................................................................2-21

Slot ........................................................................................................... 2-22

3. BIOS Setup ...................................................................................3-1

Entering Setup ...........................................................................................3-2

The Menu Bar ............................................................................................3-4

Main ...........................................................................................................3-5

Advanced ...................................................................................................3-6

Intel RC Setup .......................................................................................... 3-15

ix

Server Mgmt .............................................................................................3-22

Security ....................................................................................................3-24

Boot .......................................................................................................... 3-25

Save & Exit ...............................................................................................3-26

4. Drivers & Utilities.........................................................................4-1

Installation .................................................................................................. 4-2

Server Drivers ............................................................................................4-2

Manual .......................................................................................................4-3

Download Website .....................................................................................4-3

1-1-1

Thank you for choosing the MS-S1311 v1.X, an excellent server board
from MSI.

Based on the innovative Intel® C612 for optimal system efciency, the
MS-S1311 accommodates Intel® Xeon® E5-2600v3/ E5-1600v3 series
processor and supports 8 DDR4 slots for up to 512 GB of DDR4 RDIMM/
LRDIMM in quad-channel memory bus.

In the advanced-level and mid-range market segment, the MS-S1311 can
provide a high-performance solution for today’s front-end and general
purpose server, as well as in the future.

1 Overview

1-2

Overview MS-S1311

Motherboard Specications

Processor

■ Single Intel® Xeon® E5-2600v3/ E5-1600v3 series

Chipset

■ Intel® C612

Memory Capacity

■ DIMM Quantity:

- 8 x DDR4 slots

■ DIMM Type/ Speed:

- DDR4 1866MHz (2 DPC)/ 2133MHz (1 DPC) RDIMM

- DDR4 2133MHz (2 DPC/ 1 DPC) LRDIMM

■ Capacity:

- Up to 512GB of LRDIMM

- Up to 256GB of RDIMM

■ Channel:

- Quad-channel memory per processor

Storage

■ 9 x SATA 3.0 connectors

■ 1 x SATA 3.0 connector for SATA DOM (SSATA3)

System Management

■ Aspeed AST2400

Graphics

■ Aspeed AST2400

Networking

■ SKU 1

- 2 x Intel® I210AT GbE controllers

- 1 x Realtek RTL8211E BMC LAN (for Mgmt only)

■ SKU 2

- 2 x Intel® I210AT GbE controllers

- 1 x Intel® I350 2-channel Gigabit Ethernet controller

- 1 x Realtek RTL8211E BMC LAN (for Mgmt only)

- SKU 2 supports fail-over function between LAN port 2 (Port A) & LAN

port 3 (Port A)

1-3

Expansion Slot

■ PCIE_1: PCIe 2.0 x8 slot (x4 signal, optional with Intel® I350)

Important

Intel® I350 Gigabit Ethernet controller will work only when the PCIE_1 slot is
vacant.

■ PCIE_2: PCIe 3.0 x8 slot

■ PCIE_4: PCIe 3.0 x16 slot

■ PCIE_6: PCIe 3.0 x16 slot

■ MINIPCIE1: Mini PCIe slot

Rear I/O

■ SKU 1

- 1 x Serial port

- 1 x VGA port

- 3 x RJ45 GbE LAN ports (one

for Mgmt)

- 2 x USB 3.0 ports

- 2 x USB 2.0 ports

■ SKU 2

- 1 x Serial port

- 1 x VGA port

- 5 x RJ45 GbE LAN ports (one

for Mgmt)

- 2 x USB 3.0 ports

- 2 x USB 2.0 ports

Onboard Headers/ Connectors/ Jumpers

■ 1 x 8-pin power connector

■ 1 x 24-pin power connector

■ 5 x system fan connectors

■ 1 x CPU fan connector

■ 9 x SATA 3.0 connectors

■ 1 x SATA 3.0 connector for SATA DOM (SSATA3)

■ 1 x SATA DOM power connecter

■ 1 x USB 2.0 port

■ 2 x USB 2.0 headers (4 ports)

■ 1 x USB 3.0 connector (2 ports)

■ 1 x VGA header

■ 1 x serial port header

■ 1 x front panel header

■ 1 x GPIO header

■ 2 x SGPIO headers

■ 1 x IPMB connector

■ 1 x PMBus connector

■ 1 x TPM header

■ 1 x chassis intrusion header

■ 1 x clear CMOS jumper

■ 1 x recovery jumper

■ 1 x BIOS ash protection jumper

1-4

Overview MS-S1311

Form Factor

■ ATX, 12” (304.8mm) x 9.6” (243.84mm)

Mounting

■ 10 x mounting holes

SKU Comparison

SKUs

Features

SKU 1 SKU 2

Intel® I350 V

Rear I/O GbE LAN ports 3 5

1-5

Motherboard Layout

2-2-1

This chapter provides you with the information about hardware setup
procedures. While doing the installation, be careful in holding the com­ponents and follow the installation procedures. For some components, if
you install in the wrong orientation, the components will not work prop-

erly.

Use a grounded wrist strap before handling computer components. Static
electricity may damage the components.

2 Hardware Setup

2-2

Hardware Setup MS-S1311

Components Reference Guide

CPU (Central Processing Unit) ........................................................2-3

Memory ..............................................................................................2-7

Storage ............................................................................................2-10

Power Supply ..................................................................................2-12

System Power Connector: JPWR3 ..........................................................2-12

CPU Power Connector: JPWR1 ...............................................................2-12

SATA DOM Power Connector: JSDOMPWR1 .........................................2-12

Rear Panel I/O .................................................................................2-13

Connector ........................................................................................2-15

Fan Power Connector: CPU_FAN, SYS_FAN1 ~ SYS_FAN5 .................2-15

I2C Bus Connector: JPMBUS1 ................................................................2-15

IPMB Connector: J_IPMB1 ......................................................................2-15

Front USB Connector: JUSB2, JUSB3, USB2 ......................................... 2-16

USB 3.0 Connector: JUSB1 ..................................................................... 2-16

SGPIO Header: J_SGPIO1, J_SSGPIO1 ................................................2-17

Front Panel Header: JFP1 .......................................................................2-17

Chassis Intrusion Switch Header: JCI1 .................................................... 2-18

GPIO Header: JGPIO1 .............................................................................2-18

TPM Module Header: JTPM1 ...................................................................2-19

Serial Port Header: JCOM1 .....................................................................2-20

VGA Header: JVGA1 ................................................................................2-20

Jumper.............................................................................................2-21

Clear CMOS Jumper: JBAT1 ...................................................................2-21

Flash Security Override Jumper: JSDO1 ................................................. 2-21

BIOS Recovery Jumper: JBIOS_RECOVERY1 ....................................... 2-21

Slot ...................................................................................................2-22

PCIe (Peripheral Component Interconnect Express) Slot ........................ 2-22

Mini-PCIe (Peripheral Component Interconnect Express) Slot ................ 2-22

2-3

CPU (Central Processing Unit)

Introduction to the LGA2011-3 CPU

The surface of the LGA2011­3 CPU has four alignment
keys and a yellow triangle
to assist in correctly lining
up the CPU for mainboard
placement. The yellow
triangle is the Pin 1 indicator.

Yellow triangle is the
Pin 1 indicator

Alignment Key

Important

Overheating
Overheating can seriously damage the CPU and motherboard. Always make

sure the cooling fans work properly to protect the CPU from overheating. Be
sure to apply an even layer of thermal paste (or thermal tape) between the CPU
and the heatsink to enhance heat dissipation.

Replacing the CPU

When replacing the CPU, always turn o󰘯 the system’s power supply and unplug

the power supply’s power cord to ensure the safety of the CPU.

2-4

Hardware Setup MS-S1311

CPU & Heatsink Installation

When installing a CPU, always remember to install a CPU heatsink. A CPU heatsink is
necessary to prevent overheating and maintain system stability. Follow the steps below
to ensure correct CPU and heatsink installation. Wrong installation can damage both
the CPU and the motherboard.

3. Open the load plate by pushing down on the hinge lever.

4. Grasp the tab, only it has risen away from the socket, open load plate to full open
position.

1. Open hinge lever. You can identify the hinge lever as below shown, it with a
interlocking feature on the other end.

2. Open active lever.

Active lever

Hinge lever

Interlock

2-5

7. Close the active lever with a smooth uniform motion and latch to the socket.

8. Close the hinge lever with a smooth uniform motion and latch to the socket.

5. Line up the CPU to 󰘰t the CPU socket. Be sure to hold the CPU by the base with the

metal contacts facing downward. The alignment keys on the CPU will line up with

the edges of the CPU socket to ensure a correct 󰘰t.

6. Carefully close the load plate and remove the plastic protective cap.

Alignment Key