A B C
D
REVISIONS
1
11G TPM MODULE
BLOCK DIAGRAM
REV
X00 Initial Prototype Release
X01
DESCRIPTIONECO DATE
TABLE OF CONTENTS
APPROVED
08/09/07
1
2
Pg. 1 Block Diagram
Pg. 2
Pg. 3
Pg. 4
Stack Up
Planar Connector
TPM Micro controller, SEEPROM
CouponsPg. 5
2
3
BOARD OUTLINE
Build Options
1 = STMicro (ROW)
2 = Sinuson (China)
3 = Winbond (ROW)
9 = Debug
3
4
(15.82mm x 17.2mm)
PWA
PWB
Schem.
Assy. Dwg.
EXPORT RESTRICTION:
THE EXPORT OF THE INFORMATION, SCHEMATICS AND OTHER TECHNICAL DATA CONTAINED IN THIS DOCUMENT
IS CONTROLLED BY THE U.S. GOVERNMENT. THE EXPORT, DEEMED EXPORT OR OTHER TRANSFER OF THIS DATA
TO CERTAIN COUNTRIES AND INDIVIDUALS IS RESTRICTED. ANY TRANSFER, EXPORT OR REEXPORT, MUST BE
IN COMPLIANCE WITH THE U.S. EXPORT ADMINISTRATION REGULATIONS.
FY465 (ROW), MT458 (China)
GP353
MU538
XT291
PROPRIETARY NOTE
THIS ITEM IS THE PROPERTY OF DELL INC. ROUND ROCK, TEXAS
AND CONTAINS CONFIDENTIAL AND TRADE SECRET INFORMATION. THIS
ITEM MAY NOT BE TRANSFERRED FROM THE CUSTODY OF DELL INC.,
EXCEPT AS AUTHORIZED BY DELL INC., AND THEN ONLY BY WAY
OF LOAN FOR LIMITED PURPOSES. IT MUST NOT BE REPRODUCED IN
WHOLE OR IN PART AND MUST BE RETURNED TO DELL INC.
UPON REQUEST AND IN ALL EVENTS UPON COMPLETION OF THE PURPOSE
OF THE LOAN. NEITHER THIS ITEM NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO PERSONS NOT HAVING A NEED
FOR SUCH USE OR DISCLOSURE CONSISTENT WITH THE PURPOSE OF THE
LOAN WITHOUT THE PRIOR WRITTEN CONSENT OF DELL INC.
DRAWN
DESIGNED
CHECKED
APPROVED
APPROVED
APPROVED
APPROVED
RELEASED
Indrani Paul
Indrani Paul 08/09/07
08/09/07
A CURRENT ISSUE OF THIS DRAWING MUST
INCLUDE A COPY OF THE FOLLOWING
ECO'S:
ECO
ECO
ECO
ECO
ECO
ECO
ECO
ECO
TITLE
SCHEM,RSR,SV,DELL,TRPM
DWG NO.
DATE
DATE
DATE
DATE
DATE
DATE
DATE
DATE
INC.
ROUND ROCK,TEXAS
MU538
DATE
SHEET
10/12/2007
4
REV.
X00
1 OF 5
DCBA
A B C
TPM Stack Up
D
1
1
2
2
3
3
4
PROPRIETARY NOTE: THIS ITEM IS THE PROPERTY OF DELL INC. ROUND ROCK, TEXAS AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS ITEM MAY NOT BE TRANSFERRED FROM THE CUSTODY OF DELL INC. EXCEPT
AS AUTHORIZED BY DELL INC., AND THEN ONLY BY WAY OF LOAN FOR LIMITED PURPOSES. IT MUST NOT BE REPRODUCED IN WHOLE
OR IN PART AND MUST BE RETURNED TO DELL INC. UPON REQUEST AND IN ALL EVENTS UPON COMPLETION OF THE PURPOSE OF THE
LOAN. NEITHER THIS ITEM OR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO PERSONS NOT HAVING A NEED FOR SUCH
USE OR DISCLOSURE CONSISTENT WITH THE PURPOSE OF THE LOAN WITHOUT THE PRIOR WRITTEN CONSENT OF DELL INC.
TITLE
DWG NO.
DATE
INC.
ROUND ROCK,TEXAS
SCHEM,RSR,SV,DELL,TRPM
REV.
MU538
SHEET
10/12/2007 2 OF 5
DCBA
4
X00
A B C
TPM Connector
D
1
1
2
3,4
3,4
+3.3V +3.3VAUX
21
C1
I2C_TPM_SCL
I2C_TPM_SDA
4
4
4
3
3
LPC_LAD3
ICH_SIO_SERIRQ
LPC_LAD2
TPM_PRES_N
10uF
21
C2
6.3V-20%
.1uF
16V-10%
J_PLANAR
20
19 2
18
17
16
15
14
13
12
11
1
3
4
5
6
7
8
9
10
TPM_PRES_N
LPC_LAD0
LPC_LAD1
SEEPROM_E0
RST_TPM_N
LPC_LFRAME_N
CK_33M_TPM
C9
21
.1uF
16V-10%
C7
1 2
1uF 6.3V
3
4
4
3,4
4
4
4
X00_IP_DT16270: Routed SEEPROM_E0 to connector
2
3
Loop back presence: GNDed on planar
I2C_TPM_SDA - alternately TPM_ID2 as contingency, BOM option on planar
I2C_TPM_SCL - alternately TPM_ID1 as contingency, BOM option on planar
SEEPROM_E0 - alternately TPM_ID0 as contingency, BOM option on planar
All ID GPIOs are pulled up on planar.
Pull them low or floating on the module (depending on the version)
If ID contingency plan is used, then populate the PDs according to the table below
21
C11
X00_IP_DT16258: Added 0.1uf cap
3,4
3,4
3,4
I2C_TPM_SDA
I2C_TPM_SCL
SEEPROM_E0
.1uF
16V-10%
ID2
ID1
ID0
2x10 TPM
PLUG
ADD1=ADD*_XT291_ASSY
ADD2=ADD*_GP353_PWB
ADD3=ADD*_MU538_SCH
ADD4=ADD*_KY144_PLST_HLDR
ADD5=ADD*_HP126_LBL_PPID
NP
NP
NP
Current rating per pin on the connector: 0.5amp
Current draw
ST Micro
Sinuson
SEEPROM
X00_IP_DT16257: Added current draw table
3.3V 3.3V Aux
30mA
60mA
10mA
N/A
N/A
50mAWinbond
3mA
3
4
ID2
0
0 0
0
TPM Version Table
ID1
0
ID0
0
1
01
011 - 110
11 1
VENDOR
STMicro
(ROW)
Sinosun
(China)
Winbond
(ROW)
RSVD
RSVD
X00_IP_DT16273: Updated table for 111 combo
R27
X
PROPRIETARY NOTE: THIS ITEM IS THE PROPERTY OF DELL INC. ROUND ROCK, TEXAS AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS ITEM MAY NOT BE TRANSFERRED FROM THE CUSTODY OF DELL INC. EXCEPT
AS AUTHORIZED BY DELL INC., AND THEN ONLY BY WAY OF LOAN FOR LIMITED PURPOSES. IT MUST NOT BE REPRODUCED IN WHOLE
OR IN PART AND MUST BE RETURNED TO DELL INC. UPON REQUEST AND IN ALL EVENTS UPON COMPLETION OF THE PURPOSE OF THE
LOAN. NEITHER THIS ITEM OR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO PERSONS NOT HAVING A NEED FOR SUCH
USE OR DISCLOSURE CONSISTENT WITH THE PURPOSE OF THE LOAN WITHOUT THE PRIOR WRITTEN CONSENT OF DELL INC.
1 2
220-5%
R28
X
1 2
220-5%
R29
X
1 2
220-5%
TITLE
DWG NO.
DATE
INC.
ROUND ROCK,TEXAS
SCHEM,RSR,SV,DELL,TRPM
MU538
SHEET
4
REV.
X00
3 OF 510/12/2007
DCBA
1
A B C
TPM Microcontroller and SEEPROM
Output
Input
Input/Output
Series resistor
Series resistor with pull-down
Defaults outputting low
Defaults outputting high
VAux rail
VBat rail
Open-drain
+3.3V
C4
D
1
+3.3V
NP
21
.1uF
16V-10%
R35
X
1 2
2
Both vendors specific:
PP: Physical Presence, active high, internal PD. Indicates Physical Presence to the TPM
Sinuson specific:
TESTBI/BADD: TESBI used in Test Mode. BADD Straps LPC address for Sinuson, internal PU, defaults to 4E, PD straps to 2E
TESTI: Pull low to disable test mode
CLKRUN#: If not used must be connected to GND
GPIO1, GPIO2: defaults high, weak internal PU
STMicro specific:
VNC: Vendor-controlled NC: internal pull-up, Can be left NC, Must not be tied to GND
+3.3V
+3.3V
C5
U_SEEPROM
E0
E1
E2
VSS
34C02_TSSOP8
SUB1=SUB1_FX876
SUB2=SUB2_GN546
VCC
SCL
SDA
WC
8
7
6
5
SEEPROM_WP
I2C_TPM_SCL_R
I2C_TPM_SDA_R
X00_IP_DT16287: Depopulated PU to enable write operations
R2
1 2
0-5%
R3
1 2
0-5%
I2C_TPM_SCL
I2C_TPM_SDA
3
3
I2C PUs on planar
3
SEEPROM_E0
R34
1 2
0-5%
SEEPROM_E0_R 1
R30
1 2
220-5%
2
3
4
Software write protect
R21
4.7K-5% 4.7K-5%
SMBUS Address = 0xA0/0xA2 for normal operations
1 2
0x60/0x62 for write protect register operations
E0 strapping on planar for I2C addressing flexibility
21
.1uF
16V-10%
C6
1 2
+3.3VAUX
1uF 6.3V
X00_IP_DT16288: Replaced 1uf with 0.1uf
ROW: IC Prog FX876, Blank part T8557, Disk Prog xxxxx
2
R25
1 2
R33
3
X00_IP_DT16282: Added zero ohm
RST_TPM_N
1 2
0-5%
8.2K-5%
RST_TPM_R_N
X00_IP_DT16335: Removed series R
3
3
3
3
3
3
3
R9
1 2
LPC_LAD0
LPC_LAD1
LPC_LAD2
LPC_LAD3
LPC_LPCPD_N
LPC_LFRAME_N
CK_33M_TPM
ICH_SIO_SERIRQ
TPM_CLKRUN
1 2
4.7K-5%
0-5%
R32
PWR_PNG
NP1
26
LAD0
23
LAD1
20
LAD2
17
LAD3
28
LPCPD_N
22
LFRAME_N
16
LRESET_N
21
LCLK
27
SERIRQ
15
CLKRUN_N/GPIO5
4
GND_4
11
GND_11
18
GND_18
25
GND_25/NC
U_TPM
VDD_19/NC
GPIO_X_00/GPIO3
TESTBI/BADD/GPIO4
GENERIC DUAL FOOTPRINT TPM1.2 IC
CHINA (8.1mm) & ROW (6.4mm)
VDD_10
VDD_24
NC_5
NC_12
VNC
PP
GPIO1
GPIO2
TESTI/NC
NC_13
NC_14
X00_IP_DT16266: Added pwr attributes
10
19
24
5
12
3
7
6
1
2
9
8
13
14
R22
PWR_PNG
PWR_PNG
TPM_5PWR_PNG
TPM_12PWR_PNG
NTP_TPM_3
NTP_TPM_PP
TPM_GPIO_X_00
NTP_TPM_GPIO1
NTP_TPM_GPIO2
NTP_TPM_BADD
TPM_TESTI
NTP_TPM_13
NTP_TPM_14
X00_IP_DT16336: Renamed nets
1 2
0-5%
POP3
NP3
R23
1 2
0-5%
R4
1 2
0-5%
1 2
NP1
R24
0-5%
POP3
C10
21
.1uF
16V-10%
21
C12
LPC base address defaults to 4E for Sinuson
R17
4.7K-5%
1 2
.1uF
16V-10%
POP2
+3.3V
R19
1 2
China: IC Prog GN546, Blank part T8557, Disk Prog xxxxx
20K-5%
3
SUB1=SUB1_FR445
SUB2=SUB2_WT214
RST_TPM_N pulled down on planar to ensure chip is in reset until CPLD/ICH drives this line
3
If Winbond gets included for ROW TPM, SUB Winbond part and IC Prog
4
PROPRIETARY NOTE: THIS ITEM IS THE PROPERTY OF DELL INC. ROUND ROCK, TEXAS AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS ITEM MAY NOT BE TRANSFERRED FROM THE CUSTODY OF DELL INC. EXCEPT
AS AUTHORIZED BY DELL INC., AND THEN ONLY BY WAY OF LOAN FOR LIMITED PURPOSES. IT MUST NOT BE REPRODUCED IN WHOLE
OR IN PART AND MUST BE RETURNED TO DELL INC. UPON REQUEST AND IN ALL EVENTS UPON COMPLETION OF THE PURPOSE OF THE
LOAN. NEITHER THIS ITEM OR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO PERSONS NOT HAVING A NEED FOR SUCH
USE OR DISCLOSURE CONSISTENT WITH THE PURPOSE OF THE LOAN WITHOUT THE PRIOR WRITTEN CONSENT OF DELL INC.
TITLE
DWG NO.
DATE
INC.
ROUND ROCK,TEXAS
SCHEM,RSR,SV,DELL,TRPM
REV.
MU538
SHEET
10/12/2007 4 OF 5
DCBA
4
X00
A B C
Impedance Coupons/Mechanicals
D
1
1
X00_IP_DT16292: impedance coupons removed
Impedance coupons removed.
2
Put note in Fab drawing: Impedance controlled through stackup
2
3
+3.3VAUX
NET_PHYSICAL_TYPE=PWR_PNG
RATSNEST_SCHEDULE=MIN_TREE
VOLTAGE=3.3
NET_PHYSICAL_TYPE=PWR_PNG
RATSNEST_SCHEDULE=MIN_TREE
VOLTAGE=3.3
NET_PHYSICAL_TYPE=PWR_PNG
RATSNEST_SCHEDULE=MIN_TREE
VOLTAGE=0
+3.3VAUX
3
+3.3V+3.3V
4
PROPRIETARY NOTE: THIS ITEM IS THE PROPERTY OF DELL INC. ROUND ROCK, TEXAS AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS ITEM MAY NOT BE TRANSFERRED FROM THE CUSTODY OF DELL INC. EXCEPT
AS AUTHORIZED BY DELL INC., AND THEN ONLY BY WAY OF LOAN FOR LIMITED PURPOSES. IT MUST NOT BE REPRODUCED IN WHOLE
OR IN PART AND MUST BE RETURNED TO DELL INC. UPON REQUEST AND IN ALL EVENTS UPON COMPLETION OF THE PURPOSE OF THE
LOAN. NEITHER THIS ITEM OR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO PERSONS NOT HAVING A NEED FOR SUCH
USE OR DISCLOSURE CONSISTENT WITH THE PURPOSE OF THE LOAN WITHOUT THE PRIOR WRITTEN CONSENT OF DELL INC.
TITLE
DWG NO.
DATE
INC.
ROUND ROCK,TEXAS
SCHEM,RSR,SV,DELL,TRPM
MU538
SHEET
DCBA
4
REV.
X00
5 OF 510/12/2007
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