MSI MS-95R9 Schematic 0A

A B C

D

REVISIONS

1

BOM options

SUB=NP Always no-pop

8 = Development/Debug (ST parts)
9 = Development/Debug (non-ST parts)
5 = X00 Build (With through-hole RJ45, no EMI clip, and no SD)

AMEA

REV

X00

DESCRIPTIONECO DATE

Initial Prototype Release

TABLE OF CONTENTS

Page 1.
Page 2. STACKUP

Page 4. BCM 5221, RJ45
Page 5. Mechanicals and Impedance Coupons

TOC

Planar Connector, FRU, SD ConnectorPage 3.

APPROVED

1

2

2

3

4

PWA: MU531
ASSY: GP344
PWB: FY460
SCH: RN341

EXPORT RESTRICTION:

THE EXPORT OF THE INFORMATION, SCHEMATICS AND OTHER TECHNICAL DATA CONTAINED IN THIS DOCUMENT
IS CONTROLLED BY THE U.S. GOVERNMENT. THE EXPORT, DEEMED EXPORT OR OTHER TRANSFER OF THIS DATA
TO CERTAIN COUNTRIES AND INDIVIDUALS IS RESTRICTED. ANY TRANSFER, EXPORT OR REEXPORT, MUST BE
IN COMPLIANCE WITH THE U.S. EXPORT ADMINISTRATION REGULATIONS.

PROPRIETARY NOTE

THIS ITEM IS THE PROPERTY OF DELL INC. ROUND ROCK, TEXAS
AND CONTAINS CONFIDENTIAL AND TRADE SECRET INFORMATION. THIS
ITEM MAY NOT BE TRANSFERRED FROM THE CUSTODY OF DELL INC.,
EXCEPT AS AUTHORIZED BY DELL INC., AND THEN ONLY BY WAY
OF LOAN FOR LIMITED PURPOSES. IT MUST NOT BE REPRODUCED IN
WHOLE OR IN PART AND MUST BE RETURNED TO DELL INC.
UPON REQUEST AND IN ALL EVENTS UPON COMPLETION OF THE PURPOSE
OF THE LOAN. NEITHER THIS ITEM NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO PERSONS NOT HAVING A NEED
FOR SUCH USE OR DISCLOSURE CONSISTENT WITH THE PURPOSE OF THE
LOAN WITHOUT THE PRIOR WRITTEN CONSENT OF DELL INC.

DRAWN

DESIGNED

CHECKED

APPROVED

APPROVED

APPROVED

APPROVED

RELEASED

Jimmy Johnson 8/1/2007

8/1/2007Jimmy Johnson

A CURRENT ISSUE OF THIS DRAWING MUST
INCLUDE A COPY OF THE FOLLOWING
ECO'S:
ECO

ECO
ECO
ECO
ECO
ECO
ECO
ECO

DATE
DATE
DATE
DATE
DATE
DATE
DATE
DATE

INC.

ROUND ROCK,TEXAS

TITLE

SCHEM,RSR,SV,DELL,AMEA

DWG NO.

RN341

DATE

SHEET

3

4

REV.

X01

1 OF 511/19/2007

DCBA

A B C

D

1

1

2

2

3

3

P00_DT16020: Change stack-up BGA constraint area name to just BGA not CA_BGA.

4

PROPRIETARY NOTE: THIS ITEM IS THE PROPERTY OF DELL INC. ROUND ROCK, TEXAS AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS ITEM MAY NOT BE TRANSFERRED FROM THE CUSTODY OF DELL INC. EXCEPT
AS AUTHORIZED BY DELL INC., AND THEN ONLY BY WAY OF LOAN FOR LIMITED PURPOSES. IT MUST NOT BE REPRODUCED IN WHOLE
OR IN PART AND MUST BE RETURNED TO DELL INC. UPON REQUEST AND IN ALL EVENTS UPON COMPLETION OF THE PURPOSE OF THE
LOAN. NEITHER THIS ITEM OR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO PERSONS NOT HAVING A NEED FOR SUCH
USE OR DISCLOSURE CONSISTENT WITH THE PURPOSE OF THE LOAN WITHOUT THE PRIOR WRITTEN CONSENT OF DELL INC.

TITLE

DWG NO.

DATE

INC.

ROUND ROCK,TEXAS

SCHEM,RSR,SV,DELL,AMEA

RN341

SHEET

DCBA

4

REV.

X01

2 OF 511/19/2007

1

2

A B C

SD Connector

Planar BTB Connector

ROOM=PLNR_CONN

AMEA_PRES_N

3

SD_DAT1

3

SD_DAT0

3

AMEA_RST_N

4

SD_CLK

3

SD_DAT2

3

SD_DAT3

3

I2C_AMEA_VAUX_SDA

3

I2C_AMEA_VAUX_SCL

3

PHY_BMC_INTR_R_N

3

SD_CMD

3

AMEA_SD_PWR_CTRL

3

SD_CD_N

3

SD_WP_N

3

PHY_BMC_INTR_R_N

3

J_PLANAR
B1 A1
B2
B3
B4
B5
B6
B7
B8
B9

B10
B11
B12
B13
B14
B15
B16
B17
B18
B19
B20

2X20 B TO B

PLUG 6.60mm HT

+3.3VAUX

R45

1 2

R44

NP

0-5%

21

X

+3.3VAUX

A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20

4.75K-1%

PHY_BMC_INTR_N

MDIO

RMII_RX_ER

RMII_CRS_DV

MDC

RMII_RXD1

CK_50M_RMII

RMII_RXD0
RMII_TXD0

RMII_TXD1

RMII_TX_EN

AMEA_PRES_N

4
4

4
4

4
4

4
4

4
4

3

X01_KB_DTxxxx: add circuit for SD power control

R50

AMEA_SD_PWR_CTRL

3

150-1%

4

21

C30

.1uF

1 2

16V-10%

R48

1 2

1

G

200K-1%

3

Q2

D

S

2N7002

3

2

SD_DETECT_R_N

NP

R51

X

C8

1 2

R11

1 2

R23

1 2

4.75K-1%

21

0-5%

RC Time Constant = 11-14 mS

33

+3.3VAUX

C3

.1uF

16V-10%

8.45K-1%

ROOM=SD

10uF

1 2

6.3V-20%

SD_DETECT_N

NET_PHYSICAL_TYPE=PWR_PNG

SD_3P3V_PWR

3

SD_DAT3

3

SD_CMD

3

SD_CLK

3

SD_DAT0

3

SD_DAT1

3

SD_DAT2

3

SD_WP

3

SD_DETECT_R_N

3

+3.3VAUX

FS1

1 2

1.5A
6V

C7

+3.3VAUX

10uF

1 2

6.3V-20%

G

NTR4101

D

SD_3P3V_PWR

3

1

J_SD

1

DAT_3

2

CMD

3

VSS

4

VDD

5

CLK

6

VSS2

7

DAT_0

8

DAT_1

9

DAT_2

10

WP

11

DETECT

12

GND1

13

GND2

SDCARD HOUSING

1X11 RT ANGLE

PUSH/PUSH, 1.8MM ELEV.

NP5

3
3
3
3
3
3

R58

1 2

SD_CLK
SD_DAT0
SD_DAT1
SD_DAT2
SD_DAT3
SD_CMD

X01_KB_DTxxxx: add PU to SD lines

R57

8.45K-1%

1 2

R53

8.45K-1%

1 2

R54

8.45K-1%

1 2

R56

8.45K-1%

1 2

R55

8.45K-1%

1 2

8.45K-1%

2

NET_PHYSICAL_TYPE=PWR_PNG

Q1

S

2

1

D

3

NET_PHYSICAL_TYPE=PWR_PNG

R49

1 2

C29

8.45K-1%

SD_3P3V_PWR

10uF

1 2

6.3V-20%

3

+3.3VAUX

14

U2

5

+3.3VAUX

6

VHC14

NC_U2_P2

3

4

AMEA FRU

ROOM=FRU

C25

.1uF

1 2

16V-10%

+3.3VAUX

R14

1 2

21

R13

X01_KB_DTxxxx: Added sub NN266

4.75K-1%

1

A0

2

A1

3 6

A2 SCL

4

GND

TSSOP8

SUB=SUB*_NN266

150-1%

U_FRU

24C02

X01_KB_DTxxxx: PHY_INT is not needed

+3.3VAUX

TODO: Find correctly sized FRU.

8

VCC

WC_N

SDA

7

I2C_AMEA_VAUX_SCL_R

5

I2C_AMEA_VAUX_SDA_R

R10

4.75K-1%

1 2

R5

21

0-5%

R6

21

0-5%

I2C_AMEA_VAUX_SCL

I2C_AMEA_VAUX_SDA

3

14

U2

SD_3P3V_PWR

3

3

X01_KB_DTxxxx: updated delay circuit for SD power

+3.3VAUX

R52

1 2

SD_WP

C9

VAUX LED

.1uF

1 2

16V-10%

ROOM=PLNR_CONN

+3.3VAUX

DS3

1 2

A C

LED,GREEN

3

R46

21

150-1%

ECAD: Place C9 near U2.

1

+3.3VAUX

4.75K-1%
3

2

VHC14

14

VHC14

X01_KB_DTxxxx: invert SD_WP

3

P00_DT16021: Noted SMBus address is 8 bit.

P00_DT16007: Add power LED.

P00_DT16003: Strengthen R13 PD.

P00_DT16038: Change to Schmitt trigger gate.

P00_DT16039: Change to RC time in mS.

P00_DT16027: Add decoupling for FRU.

P00_DT16034: Change detect to planar to be output from RC.

U2

4

SD_CD_N

SD_WP_N

3

3

21

R42

150-1%

TITLE

14

9

VHC14

+3.3VAUX

14

11

VHC14

+3.3VAUX

14

13

VHC14

U2

U2

U2

8

10

12

NC_U2_P4

NC_U2_P6

NC_U2_P8

4

INC.

ROUND ROCK,TEXAS

SMBus Address = 0xA2 (8-bit address)

PROPRIETARY NOTE: THIS ITEM IS THE PROPERTY OF DELL INC. ROUND ROCK, TEXAS AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS ITEM MAY NOT BE TRANSFERRED FROM THE CUSTODY OF DELL INC. EXCEPT
AS AUTHORIZED BY DELL INC., AND THEN ONLY BY WAY OF LOAN FOR LIMITED PURPOSES. IT MUST NOT BE REPRODUCED IN WHOLE
OR IN PART AND MUST BE RETURNED TO DELL INC. UPON REQUEST AND IN ALL EVENTS UPON COMPLETION OF THE PURPOSE OF THE
LOAN. NEITHER THIS ITEM OR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO PERSONS NOT HAVING A NEED FOR SUCH
USE OR DISCLOSURE CONSISTENT WITH THE PURPOSE OF THE LOAN WITHOUT THE PRIOR WRITTEN CONSENT OF DELL INC.

DWG NO.

DATE

SCHEM,RSR,SV,DELL,AMEA

RN341

SHEET

DCBA

REV.

X01

3 OF 511/19/2007

A B C

D

1

C18

R47

21

0-5%

NP

X1

X

1 3

25MHz-50ppm

+3.3VAUX

R3

.1uF

1 2

16V-10%

1 2

R4

49.9-1%

1 2

49.9-1%

PHY_RD_DP
PHY_RD_DN

NP

4
4

C22

22pF

50V-5%

21

X

AMEA_RST_N

3

PHY_RD_DP

4

PHY_RD_DN

4

NC_PHY_RXC

6
5

9

26
25

50

XTALI
XTALO

RESET_N

RDP
RDN

RXC

BCM 5221 PHY

ROOM=PHY

X01_KB_DTxxxx: changed 49.9 ohm from 0603 to 0805

U_PHY

RCVLED_N/ACTLED_N/MDIX_DIS/TDO

LNKLED_N/MEDIA_CONV_N/TDI

SPDLED_N/ADV_PAUSE_N/TMS
FDXLED_N/INTR_N/XMTLED_N

TDP
TDN

TXC

33
35
36
34

31
30

53

PHY_MDIX

PHY_LNKLED_N

NC_PHY_SPDLED_N

PHY_BMC_INTR_N

NC_PHY_TXC

4
4

3

PHY_TD_DP
PHY_TD_DN

+3.3VAUX

R1

49.9-1%

1 2

R2

1 2

C17

49.9-1%

1 2

4
4

.1uF

16V-10%

+3.3VAUX

NET_PHYSICAL_TYPE=PWR_PNG

PHY_AVDD

4

4

NET_PHYSICAL_TYPE=PWR_PNG

PHY_DVDD_P2

4

PHY_DVDD

4

NET_PHYSICAL_TYPE=PWR_PNG

R35

21

0-5%

U_PHY

27

AVDD_27

28

AVDD_28

2

DVDD_2

55

DVDD_55

1

OVDD_1

8

OVDD_8/NC

46

OVDD_46

20

REGAVDD

3 7

REGDVDD XTALGND

22

BIASVDD

BCM5221

HETERO 2 OF 2

BIASGND

AGND_29
AGND_32

DGND_54
DGND_63

OGND_40
OGND_45

24

29
32

54
63

40
45

ECAD: Place C1,C2,C15 near pins 27 & 28.

NET_PHYSICAL_TYPE=PWR_PNG

PHY_AVDD

4

C2

1 2

2.2uF 16V

C1

21

.01uF

21

C15

16V-10%

ECAD: Place C24 near pin 2.

.1uF

16V-10%

1

2

RMII_RXD0_R

4

RMII_RXD1_R

4

RMII_RX_ER_R

4

RMII_CRS_DV_R

4

R30

33-5%

R31

33-5%

R32

33-5%

R33

33-5%

NC_PHY_RXD3
NC_PHY_RXD2
RMII_RXD1_R

4

RMII_RXD0_R

4

NC_PHY_RX_DV
RMII_RX_ER_R

21

21

21

RMII_RXD0

RMII_RXD1

RMII_RX_ER

3

3

3

4

PHY_AD4

4

PHY_AD3

4

PHY_ACTLED_N

4

PHY_AD1

4

PHY_AD0

4

43

RXD3

44

RXD2

47

RXD1

48

RXD0

49

RXDV

51

RXER

14

PHYAD4

13

PHYAD3/PAUSE

12

PHYAD2/ACT_LED_N

11

PHYAD1/COL_LED_N

10

PHYAD0/FDX_LED_N

TXD3
TXD2
TXD1
TXD0

TXEN
TXER

60
59
58
57

56
52

PHY_TXD3_PD
PHY_TXD2_PD

RMII_TXD1
RMII_TXD0

RMII_TX_EN

PHY_TX_ER_PD

4
4
3
3

3
4

+3.3VAUX

NP

ECAD: Place near pins 1,3,20,46.

NET_PHYSICAL_TYPE=PWR_PNG

PHY_DVDD

4

C26

1 2

2.2uF 16V

ECAD: Place C26,C23,C16 near pin 55.

R43

C23

21

C16

.01uF

16V-10%

21

0-5%

.1uF

1 2

16V-10%

C24

1 2

1000pF

PHY_DVDD_P2

50V-10%

4

2

.1uF

PHY_LOW_PWR

4

21

RMII_CRS_DV

3

CK_50M_RMII

3

PHY_RBIAS

PHY_SD_PD

4

PHY_TEST_EN

16

4

23

21
19

15

LOWPWR

REF_CLK
RDAC

SDP
SDN

TESTEN

CRS/CRS_DV

MDIO

MII_EN

COL

MDC

61
62

41
42
18

NC_PHY_COL

RMII_CRS_DV_R

MDIO_R

MDC

PHY_MII_EN

C6

1 2

4

R41

21

3

33-5%

MDIO

3

C4

10uF

X

6.3V-20%

10uF

1 2

C10

1 2

6.3V-20%

C13

16V-10%

.1uF

1 2

C12

16V-10%

.1uF

1 2

C11

16V-10%

.1uF

1 2

16V-10%

+3.3VAUX

ECAD: Place C27 near pin 20.

3

PHY_ACTLED_N

4

PHY_ANEN

4

PHY_FDX

4

PHY_LOW_PWR

4

PHY_TX_ER_PD

4

PHY_TXD2_PD

4

PHY_TXD3_PD

4

PHY_SD_PD

4

PHY_AD4

4

PHY_AD3

4

PHY_AD1

4

PHY_AD0

4

PHY_MDIX

4

R34

1 2

21

R7

1.27K-1%

4

150-1%

4

NC_PHY_JTAG_EN
PHY_ANEN
NC_PHY_ENGY_DET
NC_PHY_F100
PHY_FDX

R40

1 2

+3.3VAUX

R15

4.75K-1%

1 2

64

JTAG_EN

38

ANEN/TRST_N

17

ENERGY_DET

37

F100/TCK

39

FDX

R16

4.75K-1%

1 2

NP

R17

X

4.75K-1%

1 2

4.75K-1%

BCM5221

HETERO 1 OF 2

R9

21

150-1%

+3.3VAUX

C19

1 2

.1uF

C20

16V-10%

C27

1 2

C28

1000pF

50V-10%

1 2

1000pF

50V-10%

ECAD: Place C28 near pin 3.

RJ45 Connector

ROOM=ETH

+3.3VAUX

X01_KB_DTxxxx: changed RJ45to press fit

3

J_ETH

DS1

RJ45

PHY_TD_DP

4

PHY_TD_DN

4

PHY_RD_DP

4

PHY_RD_DN

4

.1uF

1 2

16V-10%

3

1

2

4

6

5

TRD1+

TRCT1

TRD1-

TRD2+

TRCT2

TRD2-

1

2

3

6

4

5

7

4x75ohms
1/16W,5%

1 2

A C

LED,GREEN

DS2

1 2

A C

LED,YELLOW

R28

150-1%

R29

150-1%

21

21

PHY_LNKLED_N

PHY_ACTLED_N

4

4

4

R22

1 2

P00_DT16042: Change MDIX to PD and remove SPDLED PU.

P00_DT16041: Add PD's to PHY_ADx to set mgmt address.

P00_DT16015: Add series term to MDIO.

P00_DT16002: Change 0 ohm PD's to 150 ohm or other similar value on board.

P00_DT16018: Change power supply scheme from 2.5 to all 3.3.

P00_DT16043: Change caps to follow spec for AVDD/DVDD and app note for other power pins.

P00_DT16012: Swap out 49.9 ohm's for 603 size.

R39

4.75K-1%

1 2

R38

4.75K-1%

1 2

4.75K-1%

R37

1 2

R36

4.75K-1%

1 2

21

R25

4.75K-1%

R20

150-1%

1 2

R19

4.75K-1%

1 2

R18

4.75K-1%

1 2

R8

4.75K-1%

1 2

150-1%

P00_DT16045: GND XTALI and leave XTALO unconnected when using REF_CLK

P00_DT16040: Make connection from INTR# to J_PLANAR.

P00_DT16022: Reduce number of 10 uF bulk caps for PHY.

P00_DT16035: Change RBIAS to 1.27K PD.

PROPRIETARY NOTE: THIS ITEM IS THE PROPERTY OF DELL INC. ROUND ROCK, TEXAS AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS ITEM MAY NOT BE TRANSFERRED FROM THE CUSTODY OF DELL INC. EXCEPT
AS AUTHORIZED BY DELL INC., AND THEN ONLY BY WAY OF LOAN FOR LIMITED PURPOSES. IT MUST NOT BE REPRODUCED IN WHOLE
OR IN PART AND MUST BE RETURNED TO DELL INC. UPON REQUEST AND IN ALL EVENTS UPON COMPLETION OF THE PURPOSE OF THE
LOAN. NEITHER THIS ITEM OR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO PERSONS NOT HAVING A NEED FOR SUCH
USE OR DISCLOSURE CONSISTENT WITH THE PURPOSE OF THE LOAN WITHOUT THE PRIOR WRITTEN CONSENT OF DELL INC.

1000pF

2kV

Shield

RJ45 MAGNETIC JACK W/2 LIGHT PIPES

PRESS-FIT

8

SH1

7

SH2

8

SH3

9

SH4

10

4

INC.

ROUND ROCK,TEXAS

TITLE

SCHEM,RSR,SV,DELL,AMEA

DWG NO.

DATE

RN341

SHEET

REV.

X01

11/19/2007 4 OF 5

DCBA

1

TPC4

1

1

2

2

3

3

4

4

1X4 SPC COUPON

40 MIL PITCH

TPC5

1

1

2

2

3

3

4

4

A B C

SPC COUPONS

PROPAGATION_DELAY=L:S:995:1005
NET_PHYSICAL_TYPE=Z50_PNG
NET_SPACING_TYPE=5H_4H_SNG

PC_Z50_SE_TOP_REF_DP

PC_Z50_SE_TOP_REF_DN

AGND

PROPAGATION_DELAY=L:S:995:1005
NET_PHYSICAL_TYPE=Z50_PNG
NET_SPACING_TYPE=5H_4H_SNG

PC_Z50_SE_BOT_REF_DP

PC_Z50_SE_BOT_REF_DN PC_Z50_SE_BOT_DN

TPC1

A1

A2 B2

A2

A3

A3

A4

A4

2X4 SPC COUPON

40 MIL PITCH

TPC2

A1 B1

A1

A2

+

A3

A3

-

A4

A4

B1A1

B1

B2

+

B3

B3

­B4

B4

B1

B2A2

B2

B3

B3

B4

B4

PROPAGATION_DELAY=L:S:5995:6005
NET_PHYSICAL_TYPE=Z50_PNG
NET_SPACING_TYPE=5H_4H_SNG

PC_Z50_SE_TOP_DP

PC_Z50_SE_TOP_DN

AGNDAGNDAGND

PROPAGATION_DELAY=L:S:5995:6005
NET_PHYSICAL_TYPE=Z50_PNG
NET_SPACING_TYPE=5H_4H_SNG

PC_Z50_SE_BOT_DP

TPC3

1

1

2

2

3

3

4

4

1X4 SPC COUPON

40 MIL PITCH

TPC6

1

1

2

2

3

3

4

4

P00_DT16037: Add board P/N's and 2D label.

P00_DT16044: Add EMI clip for RJ45.

P00_DT16017: Change AGND to GND on coupons.

Board DPN's - Attached to MH1

ADD1=ADD*_RU395_LBL
ADD2=ADD*_FY460_PWB
ADD3=ADD*_GP344_ASSYDWG
ADD4=ADD*_RN341_SCHEM
ADD5=ADD*_TN260_EMIBRKT

ADD6=ADD*_GY010_INSL

Metal clip for EMI

X01_KB_DTxxxx: changed PPID lable to W type

Mounting Holes

MH2

1

GND

.145 DRILL

.250 PAD TOP/BTM

8 GND VIAS

MH1

1

GND

.145 DRILL

.250 PAD TOP/BTM

8 GND VIAS

D

1

2

1X4 SPC COUPON

40 MIL PITCH

2X4 SPC COUPON

40 MIL PITCH

AGND AGND AGND AGND

1X4 SPC COUPON

40 MIL PITCH

G1
G2

SHIELD

AMEA EMI

NP5

SH1

1
2

2

+3.3VAUX +3.3VAUX

NET_PHYSICAL_TYPE=PWR_PNG
RATSNEST_SCHEDULE=MIN_TREE

VOLTAGE=3.3

NET_PHYSICAL_TYPE=PWR_PNG
RATSNEST_SCHEDULE=MIN_TREE

VOLTAGE=0

3

Z_50_TOP

3

RY

ZSE3PINS2R

COUPON TEST

IMPEDANCE COUPONS

PROPAGATION_DELAY=L:S:5995:6005

NET_SPACING_TYPE=5H_3H_SNG

PROPAGATION_DELAY=L:S:5995:6005

21

+RX

NET_SPACING_TYPE=5H_3H_SNG

Z_50_TOP

AGNDAGND

Z_50_TOP_END

1

1

2

2

3

3

IMPEDENCE SINGLE END

TEST POINT

AGND

Z_100D_BOT

1

RX

3

RY

ZDI4PINS2R

COUPON TEST

2

+

4

-

PROPAGATION_DELAY=L:S:5995:6005

Z_100D_BOT_DP

Z_100D_BOT_DN

AGND

Z_100D_BOT_END

1

1

2

2

3

3

4

4

IMPEDENCE DIFFERENTIAL

TEST POINT

Z_100D_TOP_END

3

4

AGND

Z_50_BOT

3

RY

ZSE3PINS2R

COUPON TEST

PROPAGATION_DELAY=L:S:5995:6005

21

+RX

Z_50_BOT

AGND

Z_50_BOT_END

1

1

2

2

3

3

IMPEDENCE SINGLE END

TEST POINT

Z_100D_TOP

1

RX

3

RY

ZDI4PINS2R

COUPON TEST

AGND

PROPRIETARY NOTE: THIS ITEM IS THE PROPERTY OF DELL INC. ROUND ROCK, TEXAS AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS ITEM MAY NOT BE TRANSFERRED FROM THE CUSTODY OF DELL INC. EXCEPT
AS AUTHORIZED BY DELL INC., AND THEN ONLY BY WAY OF LOAN FOR LIMITED PURPOSES. IT MUST NOT BE REPRODUCED IN WHOLE
OR IN PART AND MUST BE RETURNED TO DELL INC. UPON REQUEST AND IN ALL EVENTS UPON COMPLETION OF THE PURPOSE OF THE
LOAN. NEITHER THIS ITEM OR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO PERSONS NOT HAVING A NEED FOR SUCH
USE OR DISCLOSURE CONSISTENT WITH THE PURPOSE OF THE LOAN WITHOUT THE PRIOR WRITTEN CONSENT OF DELL INC.

2

+

4

-

Z_100D_TOP_DP

Z_100D_TOP_DN

AGND

1

1

2

2

3

3

4

4

IMPEDENCE DIFFERENTIAL

TEST POINT

TITLE

DWG NO.

DATE

INC.

ROUND ROCK,TEXAS

SCHEM,RSR,SV,DELL,AMEA

RN341

SHEET

4

REV.

X01

5 OF 511/19/2007

DCBA