MSI MS-95R9 Schematic 0A

Page 1
A B C
D
REVISIONS
1
BOM options
SUB=NP Always no-pop
8 = Development/Debug (ST parts) 9 = Development/Debug (non-ST parts) 5 = X00 Build (With through-hole RJ45, no EMI clip, and no SD)
REV
X00
DESCRIPTIONECO DATE
Initial Prototype Release
TABLE OF CONTENTS
Page 1. Page 2. STACKUP
Page 4. BCM 5221, RJ45 Page 5. Mechanicals and Impedance Coupons
TOC
Planar Connector, FRU, SD ConnectorPage 3.
APPROVED
1
2
2
3
4
PWA: MU531 ASSY: GP344 PWB: FY460 SCH: RN341
EXPORT RESTRICTION:
THE EXPORT OF THE INFORMATION, SCHEMATICS AND OTHER TECHNICAL DATA CONTAINED IN THIS DOCUMENT IS CONTROLLED BY THE U.S. GOVERNMENT. THE EXPORT, DEEMED EXPORT OR OTHER TRANSFER OF THIS DATA TO CERTAIN COUNTRIES AND INDIVIDUALS IS RESTRICTED. ANY TRANSFER, EXPORT OR REEXPORT, MUST BE IN COMPLIANCE WITH THE U.S. EXPORT ADMINISTRATION REGULATIONS.
THIS ITEM IS THE PROPERTY OF DELL INC. ROUND ROCK, TEXAS AND CONTAINS CONFIDENTIAL AND TRADE SECRET INFORMATION. THIS ITEM MAY NOT BE TRANSFERRED FROM THE CUSTODY OF DELL INC., EXCEPT AS AUTHORIZED BY DELL INC., AND THEN ONLY BY WAY OF LOAN FOR LIMITED PURPOSES. IT MUST NOT BE REPRODUCED IN WHOLE OR IN PART AND MUST BE RETURNED TO DELL INC. UPON REQUEST AND IN ALL EVENTS UPON COMPLETION OF THE PURPOSE OF THE LOAN. NEITHER THIS ITEM NOR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO PERSONS NOT HAVING A NEED FOR SUCH USE OR DISCLOSURE CONSISTENT WITH THE PURPOSE OF THE LOAN WITHOUT THE PRIOR WRITTEN CONSENT OF DELL INC.
DRAWN
DESIGNED
CHECKED
APPROVED
APPROVED
APPROVED
APPROVED
RELEASED
Jimmy Johnson 8/1/2007
8/1/2007Jimmy Johnson
A CURRENT ISSUE OF THIS DRAWING MUST INCLUDE A COPY OF THE FOLLOWING ECO'S: ECO
ECO ECO ECO ECO ECO ECO ECO
DATE DATE DATE DATE DATE DATE DATE DATE
INC.
ROUND ROCK,TEXAS
TITLE
SCHEM,RSR,SV,DELL,AMEA
DWG NO.
RN341
DATE
SHEET
3
4
REV.
X01
1 OF 511/19/2007
DCBA
Page 2
A B C
D
1
1
2
2
3
3
P00_DT16020: Change stack-up BGA constraint area name to just BGA not CA_BGA.
4
PROPRIETARY NOTE: THIS ITEM IS THE PROPERTY OF DELL INC. ROUND ROCK, TEXAS AND CONTAINS CONFIDENTIAL AND TRADE SECRET INFORMATION. THIS ITEM MAY NOT BE TRANSFERRED FROM THE CUSTODY OF DELL INC. EXCEPT AS AUTHORIZED BY DELL INC., AND THEN ONLY BY WAY OF LOAN FOR LIMITED PURPOSES. IT MUST NOT BE REPRODUCED IN WHOLE OR IN PART AND MUST BE RETURNED TO DELL INC. UPON REQUEST AND IN ALL EVENTS UPON COMPLETION OF THE PURPOSE OF THE LOAN. NEITHER THIS ITEM OR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO PERSONS NOT HAVING A NEED FOR SUCH USE OR DISCLOSURE CONSISTENT WITH THE PURPOSE OF THE LOAN WITHOUT THE PRIOR WRITTEN CONSENT OF DELL INC.
TITLE
DWG NO.
DATE
INC.
ROUND ROCK,TEXAS
SCHEM,RSR,SV,DELL,AMEA
RN341
SHEET
DCBA
4
REV.
X01
2 OF 511/19/2007
Page 3
1
2
A B C
SD Connector
Planar BTB Connector
ROOM=PLNR_CONN
AMEA_PRES_N
3
SD_DAT1
3
SD_DAT0
3
AMEA_RST_N
4
SD_CLK
3
SD_DAT2
3
SD_DAT3
3
I2C_AMEA_VAUX_SDA
3
I2C_AMEA_VAUX_SCL
3
PHY_BMC_INTR_R_N
3
SD_CMD
3
AMEA_SD_PWR_CTRL
3
SD_CD_N
3
SD_WP_N
3
PHY_BMC_INTR_R_N
3
J_PLANAR B1 A1 B2 B3 B4 B5 B6 B7 B8 B9
B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20
2X20 B TO B
PLUG 6.60mm HT
+3.3VAUX
R45
1 2
R44
NP
0-5%
21
X
+3.3VAUX
A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20
4.75K-1%
PHY_BMC_INTR_N
MDIO
RMII_RX_ER
RMII_CRS_DV
MDC
RMII_RXD1
CK_50M_RMII
RMII_RXD0 RMII_TXD0
RMII_TXD1
RMII_TX_EN
AMEA_PRES_N
4 4
4 4
4 4
4 4
4 4
3
X01_KB_DTxxxx: add circuit for SD power control
R50
AMEA_SD_PWR_CTRL
3
150-1%
4
21
C30
.1uF
1 2
16V-10%
R48
1 2
1
G
200K-1%
3
Q2
D
S
2N7002
3
2
SD_DETECT_R_N
NP
R51
X
C8
1 2
R11
1 2
R23
1 2
4.75K-1%
21
0-5%
RC Time Constant = 11-14 mS
33
+3.3VAUX
C3
.1uF
16V-10%
8.45K-1%
ROOM=SD
10uF
1 2
6.3V-20%
SD_DETECT_N
NET_PHYSICAL_TYPE=PWR_PNG
SD_3P3V_PWR
3
SD_DAT3
3
SD_CMD
3
SD_CLK
3
SD_DAT0
3
SD_DAT1
3
SD_DAT2
3
SD_WP
3
SD_DETECT_R_N
3
+3.3VAUX
FS1
1 2
1.5A 6V
C7
+3.3VAUX
10uF
1 2
6.3V-20%
G
NTR4101
D
SD_3P3V_PWR
3
1
J_SD
1
DAT_3
2
CMD
3
VSS
4
VDD
5
CLK
6
VSS2
7
DAT_0
8
DAT_1
9
DAT_2
10
WP
11
DETECT
12
GND1
13
GND2
SDCARD HOUSING
1X11 RT ANGLE
PUSH/PUSH, 1.8MM ELEV.
NP5
3 3 3 3 3 3
R58
1 2
SD_CLK SD_DAT0 SD_DAT1 SD_DAT2 SD_DAT3 SD_CMD
X01_KB_DTxxxx: add PU to SD lines
R57
8.45K-1%
1 2
R53
8.45K-1%
1 2
R54
8.45K-1%
1 2
R56
8.45K-1%
1 2
R55
8.45K-1%
1 2
8.45K-1%
2
NET_PHYSICAL_TYPE=PWR_PNG
Q1
S
2
1
D
3
NET_PHYSICAL_TYPE=PWR_PNG
R49
1 2
C29
8.45K-1%
SD_3P3V_PWR
10uF
1 2
6.3V-20%
3
+3.3VAUX
14
U2
5
+3.3VAUX
6
VHC14
NC_U2_P2
3
4
AMEA FRU
ROOM=FRU
C25
.1uF
1 2
16V-10%
+3.3VAUX
R14
1 2
21
R13
X01_KB_DTxxxx: Added sub NN266
4.75K-1%
1
A0
2
A1
3 6
A2 SCL
4
GND
TSSOP8
SUB=SUB*_NN266
150-1%
U_FRU
24C02
X01_KB_DTxxxx: PHY_INT is not needed
+3.3VAUX
TODO: Find correctly sized FRU.
8
VCC
WC_N
SDA
7
I2C_AMEA_VAUX_SCL_R
5
I2C_AMEA_VAUX_SDA_R
R10
4.75K-1%
1 2
R5
21
0-5%
R6
21
0-5%
I2C_AMEA_VAUX_SCL
I2C_AMEA_VAUX_SDA
3
14
U2
SD_3P3V_PWR
3
3
X01_KB_DTxxxx: updated delay circuit for SD power
+3.3VAUX
R52
1 2
SD_WP
C9
VAUX LED
.1uF
1 2
16V-10%
ROOM=PLNR_CONN
+3.3VAUX
DS3
1 2
A C
LED,GREEN
3
R46
21
150-1%
ECAD: Place C9 near U2.
1
+3.3VAUX
4.75K-1% 3
2
VHC14
14
VHC14
X01_KB_DTxxxx: invert SD_WP
3
P00_DT16021: Noted SMBus address is 8 bit.
P00_DT16007: Add power LED.
P00_DT16003: Strengthen R13 PD.
P00_DT16038: Change to Schmitt trigger gate.
P00_DT16039: Change to RC time in mS.
P00_DT16027: Add decoupling for FRU.
P00_DT16034: Change detect to planar to be output from RC.
U2
4
SD_CD_N
SD_WP_N
3
3
21
R42
150-1%
TITLE
14
9
VHC14
+3.3VAUX
14
11
VHC14
+3.3VAUX
14
13
VHC14
U2
U2
U2
8
10
12
NC_U2_P4
NC_U2_P6
NC_U2_P8
4
INC.
ROUND ROCK,TEXAS
SMBus Address = 0xA2 (8-bit address)
PROPRIETARY NOTE: THIS ITEM IS THE PROPERTY OF DELL INC. ROUND ROCK, TEXAS AND CONTAINS CONFIDENTIAL AND TRADE SECRET INFORMATION. THIS ITEM MAY NOT BE TRANSFERRED FROM THE CUSTODY OF DELL INC. EXCEPT AS AUTHORIZED BY DELL INC., AND THEN ONLY BY WAY OF LOAN FOR LIMITED PURPOSES. IT MUST NOT BE REPRODUCED IN WHOLE OR IN PART AND MUST BE RETURNED TO DELL INC. UPON REQUEST AND IN ALL EVENTS UPON COMPLETION OF THE PURPOSE OF THE LOAN. NEITHER THIS ITEM OR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO PERSONS NOT HAVING A NEED FOR SUCH USE OR DISCLOSURE CONSISTENT WITH THE PURPOSE OF THE LOAN WITHOUT THE PRIOR WRITTEN CONSENT OF DELL INC.
DWG NO.
DATE
SCHEM,RSR,SV,DELL,AMEA
RN341
SHEET
DCBA
REV.
X01
3 OF 511/19/2007
Page 4
A B C
D
1
C18
R47
21
0-5%
NP
X1
X
1 3
25MHz-50ppm
+3.3VAUX
R3
.1uF
1 2
16V-10%
1 2
R4
49.9-1%
1 2
49.9-1%
PHY_RD_DP PHY_RD_DN
NP
4 4
C22
22pF
50V-5%
21
X
AMEA_RST_N
3
PHY_RD_DP
4
PHY_RD_DN
4
NC_PHY_RXC
6 5
9
26 25
50
XTALI XTALO
RESET_N
RDP RDN
RXC
BCM 5221 PHY
ROOM=PHY
X01_KB_DTxxxx: changed 49.9 ohm from 0603 to 0805
U_PHY
RCVLED_N/ACTLED_N/MDIX_DIS/TDO
LNKLED_N/MEDIA_CONV_N/TDI
SPDLED_N/ADV_PAUSE_N/TMS FDXLED_N/INTR_N/XMTLED_N
TDP TDN
TXC
33 35 36 34
31 30
53
PHY_MDIX
PHY_LNKLED_N
NC_PHY_SPDLED_N
PHY_BMC_INTR_N
NC_PHY_TXC
4 4
3
PHY_TD_DP PHY_TD_DN
+3.3VAUX
R1
49.9-1%
1 2
R2
1 2
C17
49.9-1%
1 2
4 4
.1uF
16V-10%
+3.3VAUX
NET_PHYSICAL_TYPE=PWR_PNG
PHY_AVDD
4
4
NET_PHYSICAL_TYPE=PWR_PNG
PHY_DVDD_P2
4
PHY_DVDD
4
NET_PHYSICAL_TYPE=PWR_PNG
R35
21
0-5%
U_PHY
27
AVDD_27
28
AVDD_28
2
DVDD_2
55
DVDD_55
1
OVDD_1
8
OVDD_8/NC
46
OVDD_46
20
REGAVDD
3 7
REGDVDD XTALGND
22
BIASVDD
BCM5221
HETERO 2 OF 2
BIASGND
AGND_29 AGND_32
DGND_54 DGND_63
OGND_40 OGND_45
24
29 32
54 63
40 45
ECAD: Place C1,C2,C15 near pins 27 & 28.
NET_PHYSICAL_TYPE=PWR_PNG
PHY_AVDD
4
C2
1 2
2.2uF 16V
C1
21
.01uF
21
C15
16V-10%
ECAD: Place C24 near pin 2.
.1uF
16V-10%
1
2
RMII_RXD0_R
4
RMII_RXD1_R
4
RMII_RX_ER_R
4
RMII_CRS_DV_R
4
R30
33-5%
R31
33-5%
R32
33-5%
R33
33-5%
NC_PHY_RXD3 NC_PHY_RXD2 RMII_RXD1_R
4
RMII_RXD0_R
4
NC_PHY_RX_DV RMII_RX_ER_R
21
21
21
RMII_RXD0
RMII_RXD1
RMII_RX_ER
3
3
3
4
PHY_AD4
4
PHY_AD3
4
PHY_ACTLED_N
4
PHY_AD1
4
PHY_AD0
4
43
RXD3
44
RXD2
47
RXD1
48
RXD0
49
RXDV
51
RXER
14
PHYAD4
13
PHYAD3/PAUSE
12
PHYAD2/ACT_LED_N
11
PHYAD1/COL_LED_N
10
PHYAD0/FDX_LED_N
TXD3 TXD2 TXD1 TXD0
TXEN TXER
60 59 58 57
56 52
PHY_TXD3_PD PHY_TXD2_PD
RMII_TXD1 RMII_TXD0
RMII_TX_EN
PHY_TX_ER_PD
4 4 3 3
3 4
+3.3VAUX
NP
ECAD: Place near pins 1,3,20,46.
NET_PHYSICAL_TYPE=PWR_PNG
PHY_DVDD
4
C26
1 2
2.2uF 16V
ECAD: Place C26,C23,C16 near pin 55.
R43
C23
21
C16
.01uF
16V-10%
21
0-5%
.1uF
1 2
16V-10%
C24
1 2
1000pF
PHY_DVDD_P2
50V-10%
4
2
.1uF
PHY_LOW_PWR
4
21
RMII_CRS_DV
3
CK_50M_RMII
3
PHY_RBIAS
PHY_SD_PD
4
PHY_TEST_EN
16
4
23
21 19
15
LOWPWR
REF_CLK RDAC
SDP SDN
TESTEN
CRS/CRS_DV
MDIO
MII_EN
COL
MDC
61 62
41 42 18
NC_PHY_COL
RMII_CRS_DV_R
MDIO_R
MDC
PHY_MII_EN
C6
1 2
4
R41
21
3
33-5%
MDIO
3
C4
10uF
X
6.3V-20%
10uF
1 2
C10
1 2
6.3V-20%
C13
16V-10%
.1uF
1 2
C12
16V-10%
.1uF
1 2
C11
16V-10%
.1uF
1 2
16V-10%
+3.3VAUX
ECAD: Place C27 near pin 20.
3
PHY_ACTLED_N
4
PHY_ANEN
4
PHY_FDX
4
PHY_LOW_PWR
4
PHY_TX_ER_PD
4
PHY_TXD2_PD
4
PHY_TXD3_PD
4
PHY_SD_PD
4
PHY_AD4
4
PHY_AD3
4
PHY_AD1
4
PHY_AD0
4
PHY_MDIX
4
R34
1 2
21
R7
1.27K-1%
4
150-1%
4
NC_PHY_JTAG_EN PHY_ANEN NC_PHY_ENGY_DET NC_PHY_F100 PHY_FDX
R40
1 2
+3.3VAUX
R15
4.75K-1%
1 2
64
JTAG_EN
38
ANEN/TRST_N
17
ENERGY_DET
37
F100/TCK
39
FDX
R16
4.75K-1%
1 2
NP
R17
X
4.75K-1%
1 2
4.75K-1%
BCM5221
HETERO 1 OF 2
R9
21
150-1%
+3.3VAUX
C19
1 2
.1uF
C20
16V-10%
C27
1 2
C28
1000pF
50V-10%
1 2
1000pF
50V-10%
ECAD: Place C28 near pin 3.
RJ45 Connector
ROOM=ETH
+3.3VAUX
X01_KB_DTxxxx: changed RJ45to press fit
3
J_ETH
DS1
RJ45
PHY_TD_DP
4
PHY_TD_DN
4
PHY_RD_DP
4
PHY_RD_DN
4
.1uF
1 2
16V-10%
3
1
2
4
6
5
TRD1+
TRCT1
TRD1-
TRD2+
TRCT2
TRD2-
1
2
3
6
4
5
7
4x75ohms 1/16W,5%
1 2
A C
LED,GREEN
DS2
1 2
A C
LED,YELLOW
R28
150-1%
R29
150-1%
21
21
PHY_LNKLED_N
PHY_ACTLED_N
4
4
4
R22
1 2
P00_DT16042: Change MDIX to PD and remove SPDLED PU.
P00_DT16041: Add PD's to PHY_ADx to set mgmt address.
P00_DT16015: Add series term to MDIO.
P00_DT16002: Change 0 ohm PD's to 150 ohm or other similar value on board.
P00_DT16018: Change power supply scheme from 2.5 to all 3.3.
P00_DT16043: Change caps to follow spec for AVDD/DVDD and app note for other power pins.
P00_DT16012: Swap out 49.9 ohm's for 603 size.
R39
4.75K-1%
1 2
R38
4.75K-1%
1 2
4.75K-1%
R37
1 2
R36
4.75K-1%
1 2
21
R25
4.75K-1%
R20
150-1%
1 2
R19
4.75K-1%
1 2
R18
4.75K-1%
1 2
R8
4.75K-1%
1 2
150-1%
P00_DT16045: GND XTALI and leave XTALO unconnected when using REF_CLK
P00_DT16040: Make connection from INTR# to J_PLANAR.
P00_DT16022: Reduce number of 10 uF bulk caps for PHY.
P00_DT16035: Change RBIAS to 1.27K PD.
PROPRIETARY NOTE: THIS ITEM IS THE PROPERTY OF DELL INC. ROUND ROCK, TEXAS AND CONTAINS CONFIDENTIAL AND TRADE SECRET INFORMATION. THIS ITEM MAY NOT BE TRANSFERRED FROM THE CUSTODY OF DELL INC. EXCEPT AS AUTHORIZED BY DELL INC., AND THEN ONLY BY WAY OF LOAN FOR LIMITED PURPOSES. IT MUST NOT BE REPRODUCED IN WHOLE OR IN PART AND MUST BE RETURNED TO DELL INC. UPON REQUEST AND IN ALL EVENTS UPON COMPLETION OF THE PURPOSE OF THE LOAN. NEITHER THIS ITEM OR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO PERSONS NOT HAVING A NEED FOR SUCH USE OR DISCLOSURE CONSISTENT WITH THE PURPOSE OF THE LOAN WITHOUT THE PRIOR WRITTEN CONSENT OF DELL INC.
1000pF
2kV
Shield
PRESS-FIT
8
SH1
7
SH2
8
SH3
9
SH4
10
4
INC.
ROUND ROCK,TEXAS
TITLE
SCHEM,RSR,SV,DELL,AMEA
DWG NO.
DATE
RN341
SHEET
REV.
X01
11/19/2007 4 OF 5
DCBA
Page 5
1
TPC4
1
1
2
2
3
3
4
4
1X4 SPC COUPON
40 MIL PITCH
TPC5
1
1
2
2
3
3
4
4
A B C
SPC COUPONS
PROPAGATION_DELAY=L:S:995:1005 NET_PHYSICAL_TYPE=Z50_PNG NET_SPACING_TYPE=5H_4H_SNG
PC_Z50_SE_TOP_REF_DP
PC_Z50_SE_TOP_REF_DN
AGND
PROPAGATION_DELAY=L:S:995:1005 NET_PHYSICAL_TYPE=Z50_PNG NET_SPACING_TYPE=5H_4H_SNG
PC_Z50_SE_BOT_REF_DP
PC_Z50_SE_BOT_REF_DN PC_Z50_SE_BOT_DN
TPC1
A1
A2 B2
A2
A3
A3
A4
A4
2X4 SPC COUPON
40 MIL PITCH
TPC2
A1 B1
A1
A2
+
A3
A3
-
A4
A4
B1A1
B1
B2
+
B3
B3
­B4
B4
B1
B2A2
B2
B3
B3
B4
B4
PROPAGATION_DELAY=L:S:5995:6005 NET_PHYSICAL_TYPE=Z50_PNG NET_SPACING_TYPE=5H_4H_SNG
PC_Z50_SE_TOP_DP
PC_Z50_SE_TOP_DN
AGNDAGNDAGND
PROPAGATION_DELAY=L:S:5995:6005 NET_PHYSICAL_TYPE=Z50_PNG NET_SPACING_TYPE=5H_4H_SNG
PC_Z50_SE_BOT_DP
TPC3
1
1
2
2
3
3
4
4
1X4 SPC COUPON
40 MIL PITCH
TPC6
1
1
2
2
3
3
4
4
P00_DT16037: Add board P/N's and 2D label.
P00_DT16044: Add EMI clip for RJ45.
P00_DT16017: Change AGND to GND on coupons.
Board DPN's - Attached to MH1
ADD1=ADD*_RU395_LBL ADD2=ADD*_FY460_PWB ADD3=ADD*_GP344_ASSYDWG ADD4=ADD*_RN341_SCHEM ADD5=ADD*_TN260_EMIBRKT
ADD6=ADD*_GY010_INSL
Metal clip for EMI
X01_KB_DTxxxx: changed PPID lable to W type
Mounting Holes
MH2
1
GND
.145 DRILL
.250 PAD TOP/BTM
8 GND VIAS
MH1
1
GND
.145 DRILL
.250 PAD TOP/BTM
8 GND VIAS
D
1
2
1X4 SPC COUPON
40 MIL PITCH
2X4 SPC COUPON
40 MIL PITCH
AGND AGND AGND AGND
1X4 SPC COUPON
40 MIL PITCH
G1 G2
SHIELD
AMEA EMI
NP5
SH1
1 2
2
+3.3VAUX +3.3VAUX
NET_PHYSICAL_TYPE=PWR_PNG RATSNEST_SCHEDULE=MIN_TREE
VOLTAGE=3.3
NET_PHYSICAL_TYPE=PWR_PNG RATSNEST_SCHEDULE=MIN_TREE
VOLTAGE=0
3
Z_50_TOP
3
RY
ZSE3PINS2R
COUPON TEST
IMPEDANCE COUPONS
PROPAGATION_DELAY=L:S:5995:6005
NET_SPACING_TYPE=5H_3H_SNG
PROPAGATION_DELAY=L:S:5995:6005
21
+RX
NET_SPACING_TYPE=5H_3H_SNG
Z_50_TOP
AGNDAGND
Z_50_TOP_END
1
1
2
2
3
3
IMPEDENCE SINGLE END
TEST POINT
AGND
Z_100D_BOT
1
RX
3
RY
ZDI4PINS2R
COUPON TEST
2
+
4
-
PROPAGATION_DELAY=L:S:5995:6005
Z_100D_BOT_DP
Z_100D_BOT_DN
AGND
Z_100D_BOT_END
1
1
2
2
3
3
4
4
IMPEDENCE DIFFERENTIAL
TEST POINT
Z_100D_TOP_END
3
4
AGND
Z_50_BOT
3
RY
ZSE3PINS2R
COUPON TEST
PROPAGATION_DELAY=L:S:5995:6005
21
+RX
Z_50_BOT
AGND
Z_50_BOT_END
1
1
2
2
3
3
IMPEDENCE SINGLE END
TEST POINT
Z_100D_TOP
1
RX
3
RY
ZDI4PINS2R
COUPON TEST
AGND
PROPRIETARY NOTE: THIS ITEM IS THE PROPERTY OF DELL INC. ROUND ROCK, TEXAS AND CONTAINS CONFIDENTIAL AND TRADE SECRET INFORMATION. THIS ITEM MAY NOT BE TRANSFERRED FROM THE CUSTODY OF DELL INC. EXCEPT AS AUTHORIZED BY DELL INC., AND THEN ONLY BY WAY OF LOAN FOR LIMITED PURPOSES. IT MUST NOT BE REPRODUCED IN WHOLE OR IN PART AND MUST BE RETURNED TO DELL INC. UPON REQUEST AND IN ALL EVENTS UPON COMPLETION OF THE PURPOSE OF THE LOAN. NEITHER THIS ITEM OR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO PERSONS NOT HAVING A NEED FOR SUCH USE OR DISCLOSURE CONSISTENT WITH THE PURPOSE OF THE LOAN WITHOUT THE PRIOR WRITTEN CONSENT OF DELL INC.
2
+
4
-
Z_100D_TOP_DP
Z_100D_TOP_DN
AGND
1
1
2
2
3
3
4
4
IMPEDENCE DIFFERENTIAL
TEST POINT
TITLE
DWG NO.
DATE
INC.
ROUND ROCK,TEXAS
SCHEM,RSR,SV,DELL,AMEA
RN341
SHEET
4
REV.
X01
5 OF 511/19/2007
DCBA
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