Motorola MTP5P06V Datasheet

1
Motorola TMOS Power MOSFET Transistor Device Data
  
    
P–Channel Enhancement–Mode Silicon Gate
New Features of TMOS V
On–resistance Area Product about One–half that of Standard
MOSFETs with New Low Voltage, Low R
DS(on)
Technology
Faster Switching than E–FET Predecessors
Features Common to TMOS V and TMOS E–FETS
Avalanche Energy Specified
I
DSS
and V
DS(on)
Specified at Elevated Temperature
Static Parameters are the Same for both TMOS V and
TMOS E–FET
MAXIMUM RATINGS
(TC = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain–to–Source Voltage V
DSS
60 Vdc
Drain–to–Gate Voltage (RGS = 1.0 M) V
DGR
60 Vdc
Gate–to–Source Voltage — Continuous
Gate–to–Source Voltage — Non–repetitive (tp 10 ms)
V
GS
V
GSM
± 15 ± 25
Vdc Vpk
Drain Current — Continuous @ 25°C
Drain Current — Continuous @ 100°C Drain Current — Single Pulse (tp 10 µs)
I
D
I
D
I
DM
5 4
18
Adc
Apk
Total Power Dissipation @ TC = 25°C
Derate above 25°C
P
D
40
0.27
Watts
W/°C
Operating and Storage Temperature Range TJ, T
stg
–55 to 175 °C
Single Pulse Drain–to–Source Avalanche Energy — STARTING TJ = 25°C
(VDD = 25 Vdc, VGS = 10 Vdc, PEAK IL = 5 Apk, L = 10 mH, RG = 25 )
E
AS
125 mJ
Thermal Resistance — Junction to Case
Thermal Resistance — Junction to Ambient
R
θJC
R
θJA
3.75
62.5
°C/W
Maximum Lead Temperature for Soldering Purposes, 1/8″ from Case for 10 seconds T
L
260 °C
Designer’s Data for “Worst Case” Conditions —The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.
E–FET, Designer’s and TMOS V are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
Preferred devices are Motorola recommended choices for future use and best overall value.
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SEMICONDUCTOR TECHNICAL DATA
TMOS POWER FET
5 AMPERES
60 VOLTS
R
DS(on)
= 0.450 OHM
Motorola Preferred Device
D
S
G
CASE 221A–06, Style 5
TO–220AB
TM

Motorola, Inc. 1996
MTP5P06V
2
Motorola TMOS Power MOSFET Transistor Device Data
ELECTRICAL CHARACTERISTICS
(T
J
= 25°C unless otherwise noted)
Characteristic
Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Drain–Source Breakdown Voltage
(VGS = 0 Vdc, ID = 0.25 mAdc) Temperature Coefficient (Positive)
V
(BR)DSS
60 —
61.2
— —
Vdc
mV/°C
Zero Gate Voltage Drain Current
(VDS = 60 Vdc, VGS = 0 Vdc) (VDS = 60 Vdc, VGS = 0 Vdc, TJ = 150°C)
I
DSS
— —
— —
10
100
µAdc
Gate–Body Leakage Current (VGS = ± 15 Vdc, VDS = 0 Vdc) I
GSS
100 nAdc
ON CHARACTERISTICS (1)
Gate Threshold Voltage
(VDS = VGS, ID = 250 µAdc) Threshold Temperature Coefficient (Negative)
V
GS(th)
2.0 —
2.8
4.7
4.0 —
Vdc
mV/°C
Static Drain–Source On–Resistance (VGS = 10 Vdc, ID = 2.5 Adc) R
DS(on)
0.34 0.45 Ohm
Drain–Source On–Voltage
(VGS = 10 Vdc, ID = 5 Adc) (VGS = 10 Vdc, ID = 2.5 Adc, TJ = 150°C)
V
DS(on)
— —
— —
2.7
2.6
Vdc
Forward Transconductance
(VDS = 15 Vdc, ID = 2.5 Adc)
g
FS
1.5 3.6
Mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
C
iss
367 510 pF
Output Capacitance
(VDS = 25 Vdc, VGS = 0 Vdc,
f = 1.0 MHz)
C
oss
140 200
Transfer Capacitance
f = 1.0 MHz)
C
rss
29 60
SWITCHING CHARACTERISTICS (2)
Turn–On Delay Time
t
d(on)
11 20 ns
Rise Time
t
r
26 50
Turn–Off Delay Time
VGS = 10 Vdc,
RG = 9.1 )
t
d(off)
17 30
Fall Time
G
= 9.1 )
t
f
19 40
Q
T
12 20 nC
(See Figure 8)
DS
= 48 Vdc, ID = 5 Adc,
Q
1
3.0
(VDS = 48 Vdc, ID = 5 Adc,
VGS = 10 Vdc)
Q
2
5.0
Q
3
5.0
SOURCE–DRAIN DIODE CHARACTERISTICS
Forward On–Voltage
(IS = 5 Adc, VGS = 0 Vdc)
(IS = 5 Adc, VGS = 0 Vdc, TJ = 150°C)
V
SD
— —
1.72
1.34
3.5 —
Vdc
t
rr
97
S
= 5 Adc, VGS = 0 Vdc,
t
a
73
(IS = 5 Adc, VGS = 0 Vdc,
dIS/dt = 100 A/µs)
t
b
24
Reverse Recovery Stored Charge Q
RR
0.42 µC
INTERNAL PACKAGE INDUCTANCE
Internal Drain Inductance
(Measured from contact screw on tab to center of die) (Measured from the drain lead 0.25″ from package to center of die)
L
D
3.5
4.5
nH
Internal Source Inductance
(Measured from the source lead 0.25″ from package to source bond pad)
L
S
7.5 nH
(1) Pulse Test: Pulse Width 300 µs, Duty Cycle 2%. (2) Switching characteristics are independent of operating junction temperature.
Gate Charge
Reverse Recovery Time
(VDD = 30 Vdc, ID = 5 Adc,
(V
(I
ns
MTP5P06V
3
Motorola TMOS Power MOSFET Transistor Device Data
TYPICAL ELECTRICAL CHARACTERISTICS
R
DS(on)
, DRAIN–TO–SOURCE RESISTANCE (OHMS)
R
DS(on)
, DRAIN–TO–SOURCE RESISTANCE
(NORMALIZED)
0 1 2 3 4 5
0
7
2
4
10
VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS)
Figure 1. On–Region Characteristics
I
D
, DRAIN CURRENT (AMPS)
7
8
2 3 4 8
0
1
2
3
6
I
D
, DRAIN CURRENT (AMPS)
VGS, GATE–TO–SOURCE VOLTAGE (VOLTS)
Figure 2. Transfer Characteristics
1 2 3 4 5 6
0.2
0.25
0.3
0.35
0.6
R
DS(on)
, DRAIN–TO–SOURCE RESISTANCE (OHMS)
1 2 3 4 5 7
0.2 8
0.25
0.3
0.4
ID, DRAIN CURRENT (AMPS)
Figure 3. On–Resistance versus Drain Current
and Temperature
ID, DRAIN CURRENT (AMPS)
Figure 4. On–Resistance versus Drain Current
and Gate Voltage
–50
1.8
0.2
0.4
0.6
0 10 20 30 40
1
50
10
100
TJ, JUNCTION TEMPERATURE (
°
C)
Figure 5. On–Resistance Variation with
Temperature
VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS)
Figure 6. Drain–To–Source Leakage
Current versus Voltage
I
DSS
, LEAKAGE (nA)
TJ = 125°C
15 V
–25 0 25 50 75 100 150
TJ = 25
°C
VDS ≥ 10 V
TJ = –55
°C
25
°C
100°C
TJ = 100
°C
25
°C
–55
°C
TJ = 25
°C
VGS = 0 V
VGS = 10V
VGS = 10 V
VGS = 10 V
VGS = 10 V ID = 2.5 A
6
8
6
7 V
6 V
5 V
4 V
8 V
9 V
4
5
5 6 7
0.4
0.45
7
0.35
96
0.8
1
1.2
1.4
1.6
125
60
8 9
9
10
8 9 10
0.5
0.55
10
175
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