Motorola MRF8372 Schematic [ru]


SEMICONDUCTOR TECHNICAL DATA
The RF Line
     
Designed primarily for wideband large signal predriver stages in 800 MHz
and UHF frequency ranges.
Specified @ 12.5 V, 870 MHz Characteristics Output Power = 750 mW Minimum Gain = 8.0 dB Efficiency 60% (Typ)
State–of–the–Art Technology Fine Line Geometry Gold Top Metal and Wires Silicon Nitride Passivated Ion Implanted Arsenic Emitters
Circuit board photomaster available upon request by contacting
RF Tactical Marketing in Phoenix, AZ.
Order MRF8372 in tape and reel packaging by adding suffix: R1 suffix = 500 units per reel R2 suffix = 2,500 units per reel
Order this document
by MRF8372/D

750 mW, 870 MHz
RF LOW POWER
TRANSISTOR NPN SILICON
CASE 751–05, STYLE 1
SORF (SO–8)
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector–Emitter Voltage V Collector–Base Voltage V Emitter–Base Voltage V Collector Current — Continuous I Total Device Dissipation @ TC = 75°C (1)
Derate above 75°C Storage Temperature Range TJ, T Maximum Junction Temperature T
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Case R
DEVICE MARKING
MRF8372 = 8372
NOTE:
1. Case temperature measured on collector lead immediately adjacent to body of package.
CEO CBO EBO
C
P
D
stg
Jmax
θJC
16 Vdc 36 Vdc
4.0 Vdc
200 mAdc
1.67
22.2
–55 to +150 °C
150 °C
45 °C/W
Watts
mW/°C
Motorola, Inc. 1997
(Replaces MRF837/D)
MRF8372R1, R2MOTOROLA RF DEVICE DATA
1
ELECTRICAL CHARACTERISTICS (T
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Collector–Emitter Breakdown V oltage
(IC = 5.0 mAdc, IB = 0) Collector–Emitter Breakdown Voltage
(IC = 5.0 mAdc, VBE = 0) Emitter–Base Breakdown Voltage
(IE = 0.1 mAdc, IC = 0) Collector Cutoff Current
(VCE = 15 Vdc, VBE = 0, TC = 25°C)
ON CHARACTERISTICS
DC Current Gain
(IC = 50 mAdc, VCE = 10 Vdc)
DYNAMIC CHARACTERISTICS
Output Capacitance
(VCB = 15 Vdc, IE = 0, f = 1.0 MHz)
FUNCTIONAL TESTS
Common–Emitter Amplifier Power Gain
(VCC = 12.5 Vdc, P Collector Efficiency
(VCC = 12.5 Vdc, P
= 0.75 W, f = 870 MHz)
out
= 0.75 W, f = 870 MHz)
out
= 25°C unless otherwise noted.)
C
V
V
V
(BR)CEO
(BR)CES
(BR)EBO
I
CES
h
FE
C
ob
G
pe
η 55 60 %
16 Vdc
36 Vdc
4.0 Vdc
0.1 mAdc
30 90 200
1.8 2.5 pF
8.0 10 dB
MRF8372R1, R2 2
MOTOROLA RF DEVICE DATA
C6
B
L1 L2
Z1 Z2 Z3 Z4 DUT
C1
C2 C3
L3
B
C7 C8
C4
Z6Z5
C5
+
+
V
CC
C1, C5 — 0.8–8.0 pF Johanson Gigatrim C2, C3 — 10 pF Ceramic Chip Capacitor C6 — 91 pF Clamped Mica, Mini–Underwood C4 — 47 pF Ceramic Chip Capacitor C7 — 91 pF Clamped Mica, Mini–Underwood C8 — 1.0 µF 25 V Tantalum B — Bead, Ferroxcube 56–590–65/3B
Figure 1. 800–900 MHz Broadband Circuit
800/900 MHz BAND DATA
12
10
8
, GAIN (dB)
6
PE
G
4
2
820 840 860 880 900800
f, FREQUENCY (MHz)
G
η
IRL
PE
c
L1, L2 — 4 Turns, #21 AWG, 5/32 ID L3 — 7 Turns, #21 AWG, 5/32 ID Z1, Z2 — 1 x 0.078 Microstrip, Zo = 50 Ohms Z3 — 0.25 x 0.078 Microstrip, Zo = 50 Ohms Z4 — 0.15 x 0.078 Microstrip, Zo = 50 Ohms Z5 — 0.30 x 0.078Microstrip, Zo = 50 Ohms Z6 — 1.63 x 0.078 Microstrip, Zo = 50 Ohms PCB — 1/32 Glass Teflon, εr = 2.56
P
= 750 mW
out
VCC = 12.5 Vdc
70
60
, COLLECTOR
c
EFFICIENCY (%)
50
η
10 15
20 25
IRL, INPUT
RETURN LOSS (dB)
Figure 2. T ypical Broadband Performance
MRF8372R1, R2MOTOROLA RF DEVICE DATA
3
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