The MPX5100 series piezoresistive transducer is a state–of–the–art monolithic silicon
pressure sensor designed for a wide range of applications, but particularly those
employing a microcontroller or microprocessor with A/D inputs. This patented, single
element transducer combines advanced micromachining techniques, thin–film metallization, and bipolar processing to provide an accurate, high level analog output signal that is
proportional to the applied pressure.
Features
• 2.5% Maximum Error over 0° to 85°C
• Ideally suited for Microprocessor or Microcontroller–Based Systems
• Patented Silicon Shear Stress Strain Gauge
• Available in Absolute, Differential and Gauge Configurations
SensitivityV/P—45—mV/kPa
Response Time
Output Source Current at Full Scale OutputI
Warm–Up Time
Offset Stability
(7)
(8)
(9)
t
R
o+
—1.0—mS
—0.1—mAdc
——20—mSec
——
"
0.5—%V
Decoupling circuit shown in Figure 4 required to meet electrical specifications.
MECHANICAL CHARACTERISTICS
CharacteristicSymbolMinTypMaxUnit
Weight, Basic Element (Case 867)——4.0—Grams
Common Mode Line Pressure
NOTES:
1. 1.0kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (V
) is defined as the output voltage at the minimum rated pressure.
off
4. Full Scale Output (V
5. Full Scale Span (V
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
• Linearity:Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
• Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from
• TcSpan:Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
• TcOffset:Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of V
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
8. Warm–up is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
10. Common mode pressures beyond what is specified may result in leakage at the case–to–lead interface.
11. Pressure Range: Vacuum sensor is rated to 100 kPa; part is tested to a vacuum pressure equivalent to 80 kPa.
(10)
) is defined as the output voltage at the maximum or full rated pressure.
FSO
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
FSS
———690kPa
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
ON–CHIP TEMPERATURE COMPENSATION, CALIBRATION and SIGNAL CONDITIONING
Figure 2 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature
range of 0° to 85°C using the decoupling circuit below.
(The output will saturate outside of the specified pressure range.)
F
GEL DIE COAT
WIRE BOND
DIE
METAL COVER
EPOXY PLASTIC
CASE
OUTPUT (V)
5
VS = 5 Vdc
4.5
T
3.5
2.5
1.5
0.5
4
3
2
1
0
= 25°C
A
MPX5100
0
10
20
30
40
PRESSURE (kPa)
TYP
50
MAX
60
MIN
70
Figure 2. Output versus Pressure Differential
FLUORO SILICONE
GEL DIE COAT
WIRE BOND
DIE
SPAN RANGE (TYP)
OUTPUT RANGE (TYP)
80
90
110
100
METAL COVER
EPOXY PLASTIC
CASE
OFFSET
(TYP)
LEAD FRAME
DIFFERENTIAL/GAUGE ELEMENT
DIE
BOND
Figure 3. Cross–Sectional Diagrams
(Not to Scale)
Figure 3 illustrates both the Differential/Gauge and the
Absolute Sensing Chip in the basic chip carrier (Case 867). A
fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the sensor diaphragm.
The MPX5100 series pressure sensor operating char-
1.0mF
0.01mF
LEAD FRAME
ABSOLUTE ELEMENT
acteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long–term reliability. Contact the factory for information regarding media compatibility in your
application.
+
5 V
V
V
IPS
S
out
GND
OUTPUT
DIE
BOND
Figure 4. Recommended Power Supply Decoupling.
For output filtering recommendations, please refer to
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION T ABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluoro silicone gel
which protects the die from harsh media. The Motorola MPX
Part NumberCase Type
MPX5100A, MPX5100D867–08Stainless Steel Cap
MPX5100DP867C–05Side with Part Marking
MPX5100AP, MPX5100GP867B–04Side with Port Attached
MPX5100GVP867D–04Stainless Steel Cap
MPX5100AS, MPX5100GS867E–03Side with Port Attached
MPX5100GVS867A–04Stainless Steel Cap
MPX5100ASX, MPX5100GSX867F–03Side with Port Attached
MPX5100GVSX867G–03Stainless Steel Cap
pressure sensor is designed to operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
Table below:
Pressure (P1)
Side Identifier
ORDERING INFORMATION:
The MPX5100 pressure sensor is available in absolute, differential, and gauge configurations. Devices are available in the
basic element package or with pressure port fittings that provide printed circuit board mounting ease and barbed hose pressure connections.