The MPX4080D series piezoresistive transducer is a state–of–the–art monolithic
silicon pressure sensor designed for a wide range of applications, but particularly those
employing a microcontroller or microprocessor with A/D inputs. This patented, single
element transducer combines advanced micromachining techniques, thin–film metallization, and bipolar processing to provide an accurate, high level analog output signal that is
proportional to the applied pressure.
Features
• 3.0% Maximum Error over 0° to 85°C
• Ideally suited for Microprocessor or Microcontroller–Based Systems
• Patented Silicon Shear Stress Strain Gauge
• Durable Epoxy Unibody Element
• Easy–to–Use Chip Carrier Option
V
S
SENSING
ELEMENT
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
PINS 4, 5 AND 6 ARE NO CONNECTS
V
out
SERIES
OPERATING OVERVIEW
INTEGRATED PRESSURE
SENSOR
0 to 80 kPa (0 to 11.6 psi)
0.58 to 4.9 V olts Output
BASIC CHIP CARRIER
ELEMENT
CASE 867–08
NOTE: Pin 1 is the notched pin.
PIN NUMBER
4
1
V
out
2
Gnd
3
NOTE: Pins 4, 5, and 6 are internal
device connections. Do not connect
to external circuitry or ground.
ON–CHIP TEMPERATURE COMPENSATION, CALIBRATION and SIGNAL CONDITIONING
Figure 2 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature
range of 0° to 85°C using the decoupling circuit below.
(The output will saturate outside of the specified pressure range.)
FLUORO SILICONE
GEL DIE COAT
WIRE BOND
4.5
3.5
2.5
OUTPUT (V)
1.5
0.5
DIE
5
VS = 5.1 Vdc
TA = 25°C
4
MPX4080
3
2
1
0
0
10
20
30
PRESSURE (kPa)
TYP
MAX
MIN
40
50
Figure 2. Output versus Pressure Differential
STAINLESS STEEL
METAL COVER
EPOXY PLASTIC
CASE
SPAN RANGE (TYP)
OUTPUT RANGE (TYP)
60
70
80
OFFSET
(TYP)
LEAD FRAME
DIFFERENTIAL/GAUGE ELEMENT
Figure 3. Cross–Sectional Diagrams
(Not to Scale)
Figure 3 illustrates the Differential Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the
die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm.
The MPX4080D series pressure sensor operating char -
1.0mF
0.01mF
DIE
BOND
acteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long–term reliability. Contact the factory for information regarding media compatibility in your
application.
+
5 V
V
V
S
IPS
out
GND
OUTPUT
Figure 4. Recommended Power Supply Decoupling.
For output filtering recommendations, please refer to
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluoro silicone gel
which protects the die from harsh media. The Motorola MPX
Part NumberCase Type
MPX4080D867–08Stainless Steel Cap
pressure sensor is designed to operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
Table below:
Pressure (P1)
Side Identifier
ORDERING INFORMATION:
The MPX4080D is available only in the basic element package.