Motorola MCM69L819AZP9R, MCM69L737AZP9, MCM69L737AZP9.5, MCM69L737AZP9.5R, MCM69L737AZP9R Datasheet

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Advance Information

4M Late Write LVTTL

The MCM69L737A/819A is a 4 megabit synchronous late write fast static RAM
designed to provide high performance in secondary cache and ATM switch,
Telecom, and other high speed memory applications. The MCM69L819A
organized as 256K words by 18 bits, and the MCM69L737A organized as 128K
words by 36 bits wide are fabricated in Motorola’s high performance silicon gate
BiCMOS technology .

The differential CK clock inputs control the timing of read/write operations of
the RAM. At the rising edge of the CK clock all addresses, write enables, and
synchronous selects are registered. An internal buffer and special logic enable
the memory to accept write data on the rising edge of the CK clock a cycle after
address and control signals. Read data is available at the falling edge of the CK
clock.

The RAM uses L VTTL 3.3 V inputs and outputs.

The synchronous write and byte enables allow writing to individual bytes or the
entire word.

• Byte Write Control

• Single 3.3 V + 10%, – 5% Operation

• LVTTL 3.3 V I/O (V

• Register to Latch Synchronous Operation

• Asynchronous Output Enable

• Boundary Scan (JTAG) IEEE 1149.1 Compatible

• Differential Clock Inputs

• Optional x18 or x36 organization

• MCM69L737A/819A–8.5 = 8.5 ns

MCM69L737A/819A–9 = 9 ns
MCM69L737A/819A–9.5 = 9.5 ns

• Sleep Mode Operation (ZZ Pin)

• 1 19 Bump, 50 mil (1.27 mm) Pitch, 14 mm x 22 mm Plastic Ball Grid Array

(PBGA) Package

DDQ

)

Order this document

by MCM69L737A/D

MCM69L737A
MCM69L819A

ZP PACKAGE

PBGA

CASE 999–01

This document contains information on a new product. Specifications and information herein are subject to change without notice.

REV 1
8/15/97

 Motorola, Inc. 1997

MOTOROLA FAST SRAM

MCM69L737A•MCM69L819A

1

FUNCTIONAL BLOCK DIAGRAM

SA

SW

SBx

CK

SS

ADDRESS

REGISTERS

SW

REGISTERS

G

SS

REGISTERS

MEMORY

ARRAY

CONTROL

LOGIC

DATA IN

REGISTER

DQ

DATA OUT

LATCH

PIN ASSIGNMENTS

TOP VIEW

MCM69L737A

6543217

MCM69L819A

6543217
A
B
C

D
E

F
G

H
J

K
L
M
N
P

R
T
U

SA SA SA SA

V

DDQ

NC NC SA NC

SA SA SA SA

NC

DQc DQc VSSNC DQb

DQc

DQc

V

DQc V

DDQ

DQcDQc

DQc

DQc VSSNC DQb
V

V

V

V

DD

DDQ

DQd DQd VSSCK V

DQd V

DDQ

DQdDQd

DQd DQd VSSSA

SA SA

NC
NC

NC SA SA NC

DDQ

SBdDQdDQd

V

TDITMS

SS
SS

NC

SS
SS

DD

NC

NC

SA

V

DD

V

SS

V

DQbSSV

SS

V

G

V

DD

CK

SW

V

DD

SA

TCK

SS

SBb
V

SS

NC

SS

V

SS

V

SS

V

SS

V

SS

TDO

DQb
DQbNCSBc

V
DQa
DQaSBa

DQa
DQaSAV
DQa

NC

DD

V

V

V

V

V

DDQ
NC

NC
DQb
DQb

DDQ
DQb

DQb

DDQ
DQa

DQa

DDQ
DQa

DQa

NC

ZZ

DDQ

A
B
C
D
E
F

G
H
J
K
L
M
N
P

R
T
U

SA SA SA SA

V

DDQ

NC NC SA NC

SA SA SA SA

NC

DQb NC VSSNC DQa

DQbNC

V

NC V

DDQ

DQbNC

DQb

NC VSSNC DQa

V

V

V

V

DD

DDQ
NC DQb VSSCK V

NCDQb

DQb V

DDQ

NCDQb

NC DQb VSSSA

SA SA

NC

SA SA SA SA

NC

DDQ

V

V

TDITMS

SS
SS

NC

SS
SS

SS

DD

NC

SA

NC

V

DD

V

SS

V

NCSSV

SS

V

G

V

DD

CK

SW

V

DD

NC

TCK

SS

V

SS

V

SS

NC

SS

V

SS

V

SS

V

SS

V

SS

TDO

DQa

NCNCSBb

V

NC

DQaSBa

NC

DQaSAV

NC

NC

DD

V

V

V

V

V

DDQ

NC
NC
NC

DQa

DDQ

DQa

NC

DDQ
DQa

NC

DDQ

NC

DQa

NC

ZZ

DDQ

MCM69L737A•MCM69L819A
2

MOTOROLA FAST SRAM

MCM69L737A PIN DESCRIPTIONS

PBGA Pin Locations Symbol

4K CK Input Address, data in and control input register clock. Active high.
4L CK Input Address, data in and control input register clock. Active low.

(a) 6K, 7K, 6L, 7L, 6M, 6N, 7N, 6P, 7P
(b) 6D, 7D, 6E, 7E, 6F, 6G, 7G, 6H, 7H
(c) 1D, 2D, 1E, 2E, 2F, 1G, 2G, 1H, 2H

(d) 1K, 2K, 1L, 2L, 2M, 1N, 2N, 1P, 2P

4F G Input Output Enable: Asynchronous pin, active low.

2A, 3A, 5A, 6A, 3B, 5B, 2C, 3C,

5C, 6C, 4N, 4P, 2R, 6R, 3T, 4T, 5T

5L, 5G, 3G, 3L
(a), (b), (c), (d)

4E SS Input Synchronous Chip Enable: Registered on the rising clock edge, active

4M SW Input Synchronous Write: Registered on the rising clock edge, active low.

4U TCK Input Test Clock (JTAG).
3U TDI Input Test Data In (JT AG).
5U TDO Output Test Data Out (JTAG).
2U TMS Input T est Mode Select (JTAG).
7T ZZ Input Enables sleep mode.

4C, 2J, 4J, 6J, 4R, 3R V

1A, 7A, 1F, 7F, 1J, 7J, 1M, 7M, 1U, 7U V

3D, 5D, 3E, 5E, 3F, 5F, 3H, 5H,

3K, 5K, 3M, 5M, 3N, 5N, 3P, 5P, 5R

4A, 1B, 2B, 4B, 6B, 7B, 1C, 7C, 4D, 4G,

4H, 3J, 5J, 1R, 7R, 1T, 2T, 6T, 6U

Type Description

DQx I/O Synchronous Data I/O.

SA Input Synchronous Address Inputs: Registered on the rising clock edge.

SBx Input Synchronous Byte Write Enable: Enables writes to byte x in

DD

DDQ

V

SS

NC — No Connection: There is no connection to the chip.

Supply Core Power Supply.
Supply Output Power Supply: provides operating power for output buffers.
Supply Ground.

conjunction with the SW
low.

low.

Writes all enabled bytes.

Note: 3J and 5J are tied common.

input. Has no effect on read cycles, active

MOTOROLA FAST SRAM

MCM69L737A•MCM69L819A

3

MCM69L819A PIN DESCRIPTIONS

PBGA Pin Locations Symbol

4K CK Input Address, data in and control input register clock. Active high.
4L CK Input Address, data in and control input register clock. Active low.

(a) 6D, 7E, 6F, 7G, 6H, 7K, 6L, 6N, 7P
(b) 1D, 2E, 2G, 1H, 2K, 1L, 2M, 1N, 2P

4F G Input Output Enable: Asynchronous pin, active low.

2A, 3A, 5A, 6A, 3B, 5B, 2C, 3C, 5C,

6C, 4N, 4P, 2R, 6R, 2T, 3T, 5T, 6T

5L, 3G
(a), (b)

4E SS Input Synchronous Chip Enable: Registered on the rising clock edge, active

4M SW Input Synchronous Write: Registered on the rising clock edge, active low.

4U TCK Input Test Clock (JTAG).
3U TDI Input Test Data In (JT AG).
5U TDO Output Test Data Out (JTAG).
2U TMS Input T est Mode Select (JTAG).
7T ZZ Input Enables sleep mode.

4C, 2J, 4J, 6J, 4R, 3R V

1A, 7A, 1F, 7F, 1J, 7J, 1M, 7M, 1U, 7U V

3D, 5D, 3E, 5E, 3F, 5F, 5G, 3H, 5H,

3K, 5K, 3L, 3M, 5M, 3N, 5N, 3P, 5P, 5R

4A, 1B, 2B, 4B, 6B, 7B, 1C, 7C,

2D, 4D, 7D, 1E, 6E, 2F, 1G, 4G, 6G,

2H, 4H, 7H, 3J, 5J, 1K, 6K, 2L, 7L, 6M, 2N,

7N, 1P, 6P, 1R, 7R, 1T, 4T, 6U

Type Description

DQx I/O Synchronous Data I/O.

SA Input Synchronous Address Inputs: Registered on the rising clock edge.

SBx Input Synchronous Byte Write Enable: Enables writes to byte x in

DD

DDQ

V

SS

NC — No Connection: There is no connection to the chip.

Supply Core Power Supply.
Supply Output Power Supply: provides operating power for output buffers.
Supply Ground.

conjunction with the SW
low.

low.

Writes all enabled bytes.

Note: 3J and 5J are tied common.

input. Has no effect on read cycles, active

MCM69L737A•MCM69L819A
4

MOTOROLA FAST SRAM

ABSOLUTE MAXIMUM RATINGS (Voltages Referenced to V

Rating

Core Supply Voltage V
Output Supply Voltage V
Voltage On Any Pin V
Input Current (per I/O) I
Output Current (per I/O) I
Power Dissipation (See Note 2) P
Operating Temperature T
Temperature Under Bias T
Storage Temperature T

NOTES:

1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are

exceeded. Functional operation should be restricted to RECOMMENDED OPER­ATING CONDITIONS. Exposure to higher than recommended voltages for extended
periods of time could affect device reliability.

2. Power dissipation capability will be dependent upon package characteristics and use

environment. See enclosed thermal impedance data.

Symbol Value Unit

DD

DDQ

– 0.5 to VDD + 0.5 V
– 0.5 to VDD + 0.5 V

in

in

out

D
A

bias

stg

, See Note 1)

SS

– 0.5 to + 4.6 V

± 50 mA
± 70 mA

— W

0 to + 70 °C

– 10 to + 85 °C

– 55 to + 125 °C

This device contains circuitry to protect the
inputs against damage due to high static volt­ages or electric fields; however, it is advised
that normal precautions be taken to avoid
application of any voltage higher than maxi­mum rated voltages to this high–impedance
circuit.

This BiCMOS memory circuit has been
designed to meet the dc and ac specifications
shown in the tables, after thermal equilibrium
has been established.

This device contains circuitry that will ensure
the output devices are in High–Z at power up.

PBGA PACKAGE THERMAL CHARACTERISTICS

Rating Symbol Max Unit Notes

Junction to Ambient (Still Air) R
Junction to Ambient (@200 ft/min) Single Layer Board R
Junction to Ambient (@200 ft/min) Four Layer Board R
Junction to Board (Bottom) R
Junction to Case (Top) R

NOTES:

1. Junction temperature is a function of on–chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

2. Per SEMI G38–87.

3. Indicates the average thermal resistance between the die and the printed circuit board.

4. Indicates the average thermal resistance between the die and the case top surfac e as measured by the cold plate method (MIL SPEC–883
Method 1012.1).

θJA
θJA
θJA
θJB
θJC

53 °C/W 1, 2
38 °C/W 1, 2
22 °C/W
14 °C/W 3

5 °C/W 4

CLOCK TRUTH TABLE

K CLK ZZ SS SW SBa SBb SBc SBd DQ (n) DQ (n+1) Mode

L – H L L H X X X X D
L – H L L L L H H H High–Z Din 0–8 Write Cycle 1st Byte
L – H L L L H L H H High–Z Din 9–17 Write Cycle 2nd Byte
L – H L L L H H L H High–Z Din 18–26 Write Cycle 3rd Byte
L – H L L L H H H L High–Z Din 27–35 Write Cycle 4th Byte
L – H L L L L L L L High–Z Din 0–35 Write Cycle All Bytes
L – H L L L H H H H High–Z High–Z Abort Write Cycle
L – H L H X X X X X High–Z X Deselect Cycle

X H X X X X X X High–Z High–Z Sleep Mode

MOTOROLA FAST SRAM

0–35 X Read Cycle All Bytes

out

MCM69L737A•MCM69L819A

5

DC OPERA TING CONDITIONS AND CHARACTERISTICS

(0°C ≤ TA ≤ 70°C, Unless Otherwise Noted)

RECOMMENDED OPERATING CONDITIONS

Parameter

Core Power Supply Voltage V
Output Driver Supply Voltage V
Active Power Supply Current (x18)

Quiescent Active Power
Supply Current

Active Standby Power Supply Current I
Quiescent Standby Power

Supply Current
Sleep Mode Power Supply Current I

NOTES:

1. All data sheet parameters specified to full range of VDD unless otherwise noted. All voltages are referenced to voltage applied to VSS bumps.

2. Supply voltage applied to VDD connections.

3. Supply voltage applied to V

4. All power supply currents measured with outputs open or deselected.

5. VDD = VDD (max), t

6. VDD = VDD (max), t

7. VDD = VDD (max), t

8. VDD = VDD (max), t

9. VDD = VDD (max), t

10. 200 mV ≥ Vin ≥ V

KHKH
KHKH
KHKH
KHKH
KHKH

DDQ

– 200 mV.

connections.

DDQ

= t

KHKH

= dc, SS
= t

KHKH

= dc, SS
= dc, SS

(min), SS

registered active.

(min), SS
registered inactive, ZZ low.
registered inactive, ZZ high.

(See Notes 1 through 4)

Typical

Symbol Min

DD

DDQ

I

(x36)

DD1

I

DD2

SB1

I

SB2

SB3

registered active, 50% read cycles.

registered inactive.

3.15 — — — 3.6 V

3.15 — — — 3.6 V
—

—
— 180 180 180 250 mA 6, 10

— 170 170 170 250 mA 7
— 150 150 150 230 mA 8, 10

— 30 30 30 50 mA 9, 10

–8.5

320
370

Typical–9Typical

320
370

–9.5

300
350

Max Unit Notes

480
550

mA 5

DC INPUT CHARACTERISTICS

Parameter Symbol Min Max Unit Notes

DC Input Logic High VIH (dc) 2.0 VDD + 0.3 V
DC Input Logic Low VIL (dc) – 0.3 0.8 V 1
Input Leakage Current I
Clock Input Leakage Current I
Clock Input Signal Voltage V
Clock Input Differential V oltage V
Clock Input Common Mode Voltage Range (See Figure 3) VCM (dc) 1.1 2.1 V 4

NOTES:

1. Inputs may undershoot to – 0.5 V (peak) for up to 20% t

2. 0 V ≤ Vin ≤ V

3. Minimum instantaneous differential input voltage required for differential input clock operation.

4. Maximum rejectable common mode input voltage variation.

DDQ

for all pins.

(e.g., 2 ns at a clock cycle time of 10 ns).

KHKH

lkg

clkg

in

(dc) 0.2 VDD + 0.6 V 3

DIF

— ± 5 µA 2
— ± 8 µA 2

– 0.3 VDD + 0.3 V

DC OUTPUT CHARACTERISTICS

Parameter Symbol Min Max Unit Notes

Output Leakage Current I
Output Low Voltage V
Output High Voltage V

NOTES:

1. IOL = 8.0 mA.

2. IOH = – 8.0 mA.

CAPACITANCE (f = 1.0 MHz, dV = 3.0 V, 0°C ≤ T

Characteristic

Input Capacitance C
Input/Output Capacitance C
CK, CK Capacitance C

≤ 70°C, Periodically Sampled Rather Than 100% Tested)

A

lkg

OL

OH

MCM69L737A•MCM69L819A
6

– 1.0 1.0 µA

— 0.4 V 1

2.4 — V 2

Symbol Typ Max Unit

in
I/O
CK

4 5 pF
7 8 pF
4 5 pF

MOTOROLA FAST SRAM