Motorola MCM67C618BFN5, MCM67C618BFN7 Datasheet

MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Product Preview
64K x 18 Bit BurstRAM Synchronous Fast Static RAM
With Burst Counter and Registered Outputs
The MCM67C618B is a 1,179,648 bit synchronous static random access memory designed to provide a burstable, high–performance, secondary cache for the i486 and Pentium microprocessors. It is organized as 65,536 words of 18 bits, fabricated with Motorola’s high–performance silicon–gate BiCMOS technology. The device integrates input registers, a 2–bit counter, high speed SRAM, and high drive registered output drivers onto a single monolithic circuit for reduced parts count implementation of cache data RAM applications. Syn­chronous design allows precise cycle control with the use of an external clock (K). BiCMOS circuitry reduces the overall power consumption of the integrated functions for greater reliability .
Addresses (A0 – A15), data inputs (D0 – D17), and all control signals except output enable (G inverting registers.
This device contains output registers for pipeline operations. At the rising edge of K, the RAM provides the output data from the previous cycle.
Output enable (G
Burst can be initiated with either address status processor (ADSP) or address status cache controller (ADSC generated internally by the MCM67C618B (burst sequence imitates that of the i486 and Pentium) and controlled by the burst address advance (ADV The following pages provide more detailed information on burst controls.
Write cycles are internally self–timed and are initiated by the rising edge of the clock (K) input. This feature eliminates complex off–chip write pulse generation and provides increased flexibility for incoming signals.
Dual write enables (LW bytes. L W (the upper bits).
This device is ideally suited for systems that require wide data bus widths and cache memory . See Figure 2 for applications information.
Single 5 V
Fast Access Time/Fast Cycle Time = 5 ns/100 MHz, 7 ns/80 MHz
Byte Writeable via Dual Write Enables
Internal Input Registers (Address, Data, Control)
Output Registers for Pipelined Applications
Internally Self–Timed Write Cycle
ADSP
, ADSC, and ADV Burst Control Pins
Asynchronous Output Enable Controlled Three–State Outputs
Common Data Inputs and Data Outputs
3.3 V I/O Compatible
High Board Density 52–Lead PLCC Package
) are clock (K) controlled through positive–edge–triggered non-
) is asynchronous for maximum system design flexibility.
) input pins. Subsequent burst addresses can be
) input pin.
and UW) are provided to allow individually writeable
controls DQ0 – DQ8 (the lower bits), while UW controls DQ9 – DQ17
± 5% Power Supply
DQ10
DQ11 DQ12 DQ13
DQ14
DQ15 DQ16 DQ17
MCM67C618B
FN PACKAGE
PLASTIC
CASE 778–02
PIN NAMES
A0 – A15 Address Inputs. . . . . . . . . . . . . . . .
K Clock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ADV LW UW ADSC ADSP E G
DQ0 – DQ17 Data Input/Output. . . . . . . . . .
V
CC
V
SS
NC No Connection. . . . . . . . . . . . . . . . . . . . .
All power supply and ground pins must be connected for proper operation of the device.
PIN ASSIGNMENT
A6A7E
7 6 5 4 3 2 1525150494847
8
DQ9
9
V
10
CC
V
11
SS
12 13 14
15
V
16
SS
V
17
CC
18 19 20
21 22 23 24 25 26 2728 29 30 31 32 33
A4A3A2
A5
UW
LW
A1
ADSC
A0
Order this document
by MCM67C618B/D
Burst Address Advance. . . . . . . . . . . .
Lower Byte Write Enable. . . . . . . . . . . .
Upper Byte Write Enable. . . . . . . . . . . .
Controller Address Status. . . . . . . . .
Processor Address Status. . . . . . . . .
ADSP
ADV
SS
CC
V
V
+ 5 V Power Supply. . . . . . . . . . . . . . . .
K
A15
Chip Enable. . . . . . . . . . . . . . . . . . . . . . . . .
Output Enable. . . . . . . . . . . . . . . . . . . . . .
G
A8A9A10
A13
A14
A12
46 45
44 43 42 41 40 39 38 37 36 35 34
Ground. . . . . . . . . . . . . . . . . . . . . . . . . .
DQ8 DQ7 DQ6 V
CC
V
SS
DQ5 DQ4
DQ3 DQ2 V
SS
V
CC
DQ1 DQ0
A11
BurstRAM is a trademark of Motorola, Inc. i486 and Pentium are trademarks of Intel Corp.
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
7/96
Motorola, Inc. 1996
MOTOROLA FAST SRAM
MCM67C618B
1
BLOCK DIAGRAM (See Note)
K
ADSC ADSP
A0 – A15
UW
LW
E
G
DQ0 – DQ8
DQ9 – DQ17
ADV
CLR
ADDRESS
REGISTER
WRITE
REGISTER
ENABLE
REGISTER
9 9
BURST LOGIC
Q0
BINARY
COUNTER
Q1
A1 – A0
16
A0
A1
2
A2 – A15
A0
INTERNAL ADDRESS
16
18
DATA–IN
REGISTERS
9 9
64K x 18
MEMORY
ARRAY
9
9
DATA–OUT
REGISTERS
OUTPUT BUFFER
NOTE: All registers are positive–edge triggered. The ADSC or ADSP signals control the duration of the burst and the start of the
next burst. When ADSP
is sampled low, any ongoing burst is interrupted and a read (independent of W and ADSC) is per-
formed using the new external address. Alternatively , an ADSP–initiated two cycle WRITE can be performed by asserting
and a valid address on the first cycle, then negating both ADSP and ADSC and asserting LW and/or UW with valid
ADSP data on the second cycle (see Single Write cycle in WRITE CYCLES timing diagram). When ADSC on W
is sampled low (and ADSP is sampled high), any ongoing burst is interrupted and a read or write (dependent
) is performed using the new external address. Chip enable (E) is sampled only when a new base address is loaded. After the first cycle of the burst, ADV controls subsequent burst cycles. When ADV is sampled low, the internal address is advanced prior to the operation. When ADV
is sampled high, the internal address is not advanced, thus inserting a wait state
into the burst sequence accesses. Upon completion of a burst, the address will wrap around to its initial state. See BURST
SEQUENCE TABLE. W rite refers to either or both byte write enables (LW
BURST SEQUENCE TABLE
External Address A15 – A2 1st Burst Address A15 – A2 A1 A0 2nd Burst Address A15 – A2 A1 A0 3rd Burst Address A15 – A2 A1 A0
NOTE: The burst wraps around to its initial state upon
completion.
, UW).
(See Note)
A1 A0
MCM67C618B 2
MOTOROLA FAST SRAM
SYNCHRONOUS TRUTH TABLE (See Notes 1, 2, and 3)
ADSP ADSC ADV UW or LW K Address Used Operation
E
H L X X X L–H N/A Deselected H X L X X L–H N/A Deselected L L X X X L–H External Address Read Cycle, Begin Burst L H L X L L–H External Address Write Cycle, Begin Burst L H L X H L–H External Address Read Cycle, Begin Burst X H H L L L–H Next Address Write Cycle, Continue Burst X H H L H L–H Next Address Read Cycle, Continue Burst X H H H L L–H Current Address Write Cycle, Suspend Burst X H H H H L–H Current Address Read Cycle, Suspend Burst
NOTES:
1. X means Don’t Care.
2. All inputs except G
3. Wait states are inserted by suspending burst.
must meet setup and hold times for the low–to–high transition of clock (K).
ASYNCHRONOUS TRUTH TABLE (See Notes 1 and 2)
Operation
Read L Data Out Read H High–Z Write X High–Z — Data In
Deselected X High–Z
NOTES:
1. X means Don’t Care.
2. For a write operation following a read operation, G required setup time and held high through the input data hold time.
G I/O Status
must be high before the input data
ABSOLUTE MAXIMUM RATINGS (Voltages Referenced to V
Rating
Power Supply Voltage V Voltage Relative to VSS for Any
Pin Except V Output Current (per I/O) I Power Dissipation P Temperature Under Bias T Operating Temperature T Storage Temperature T
NOTE: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are
CC
exceeded. Functional operation should be restricted to RECOMMENDED OPER­ATING CONDITIONS. Exposure to higher than recommended voltages for extended periods of time could affect device reliability.
Symbol Value Unit
CC
Vin, V
– 0.5 to VCC + 0.5 V
out
out
D
bias
A
stg
= 0 V)
SS
– 0.5 to + 7.0 V
± 30 mA
1.6 W
– 10 to + 85 °C
0 to +70 °C
– 55 to + 125 °C
This device contains circuitry to protect the inputs against damage due to high static volt­ages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than maxi­mum rated voltages to this high–impedance circuit.
This BiCMOS memory circuit has been designed to meet the dc and ac specifications shown in the tables, after thermal equilibrium has been established.
This device contains circuitry that will ensure the output devices are in High–Z at power up.
MOTOROLA FAST SRAM
MCM67C618B
3
DC OPERA TING CONDITIONS AND CHARACTERISTICS
(VCC = 5.0 V ± 5%, TA = 0 to + 70°C, Unless Otherwise Noted)
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage (Operating Voltage Range) V Input High Voltage V Input Low Voltage V
*VIL (min) = – 0.5 V dc; VIL (min) = – 2.0 V ac (pulse width 20 ns) for I 20.0 mA.
**VIH (max) = VCC + 0.3 V dc; VIH (max) = VCC + 2.0 V ac (pulse width 20 ns) for I 20.0 mA.
(Voltages Referenced to VSS = 0 V)
Symbol Min Max Unit
CC
IH
IL
4.75 5.25 V
2.2 VCC + 0.3** V
– 0.5* 0.8 V
DC CHARACTERISTICS
Parameter Symbol Min Max Unit
Input Leakage Current (All Inputs, Vin = 0 to VCC) I Output Leakage Current (G = VIH) I AC Supply Current (G = VIH, E = VIL, I
VIL = 0.0 V and VIH 3.0 V, Cycle T ime ≥ t
AC Standby Current (E = VIH, I
VIL = 0.0 V and VIH 3.0 V, Cycle T ime ≥ t Output Low Voltage (IOL = + 8.0 mA) V Output High Voltage (IOH = – 4.0 mA) V
NOTE: Good decoupling of the local power supply should always be used. DC characteristics are guaranteed for all possible i486 and Pentium
bus cycles.
out
CAPACITANCE (f = 1.0 MHz, dV = 3.0 V, T
Input Capacitance (All Pins Except DQ0 – DQ17) C Input/Output Capacitance (DQ0 – DQ17) C
= 0 mA, All Inputs = VIL or VIH,
out
= 0 mA, All Inputs = VIL and V
Parameter
min)
KHKH
min)
KHKH
= 25°C, Periodically Sampled Rather Than 100% Tested)
A
IH,
lkg(I)
lkg(O)
I
CCA5
I
CCA7
I
SB1
OL OH
Symbol Typ Max Unit
in
I/O
± 1.0 µA — ± 1.0 µA — 310
290
95 mA
0.4 V
2.4 3.3 V
4 5 pF 6 8 pF
mA
MCM67C618B 4
MOTOROLA FAST SRAM
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