MOTOROLA MCM67B618A Technical data

查询MCM67B618A供应商
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
64K x 18 Bit BurstRAM Synchronous Fast Static RAM
With Burst Counter and Self–Timed Write
The MCM67B618A is a 1,179,648 bit synchronous fast static random access memory designed to provide a burstable, high–performance, secondary cache for the i486 and Pentium microprocessors. It is organized as 65,536 words of 18 bits. The device integrates input registers, a 2–bit counter, high speed SRAM, and high drive capability outputs onto a single monolithic circuit for re­duced parts count implementation of cache data RAM applications. Synchro­nous design allows precise cycle control with the use of an external clock (K). BiCMOS circuitry reduces the overall power consumption of the integrated func­tions for greater reliability .
Addresses (A0 – A15), data inputs (D0 – D17), and all control signals except output enable (G triggered noninverting registers.
Bursts can be initiated with either address status processor (ADSP address status cache controller (ADSC addresses can be generated internally by the MCM67B618A (burst sequence imitates that of the i486 and Pentium) and controlled by the burst address advance (ADV tailed information on burst controls.
Write cycles are internally self–timed and are initiated by the rising edge of the clock (K) input. This feature eliminates complex off–chip write pulse generation and provides increased flexibility for incoming signals.
Dual write enables (L W able bytes. LW
controls DQ0 – DQ8 (the lower bits), while UW controls
DQ9 – DQ17 (the upper bits).
This device is ideally suited for systems that require wide data bus widths and cache memory . See Figure 2 for applications information.
Single 5 V
± 5% Power Supply
Fast Access Times: 9/10/12 ns Max
Byte Writeable via Dual Write Enables
Internal Input Registers (Address, Data, Control)
Internally Self–Timed Write Cycle
ADSP
, ADSC, and ADV Burst Control Pins
Asynchronous Output Enable Controlled Three–State Outputs
Common Data Inputs and Data Outputs
3.3 V I/O Compatible
High Board Density 52–Lead PLCC Package
) are clock (K) controlled through positive–edge–
) or
) input pins. Subsequent burst
) input pin. The following pages provide more de-
and UW) are provided to allow individually write-
DQ9
DQ10
V
CC
V
SS DQ11 DQ12 DQ13 DQ14
V
SS
V
CC DQ15
DQ16 DQ17
Order this document
by MCM67B618A/D
MCM67B618A
FN PACKAGE
PLASTIC
CASE 778–02
PIN ASSIGNMENTS
A6A7E
7 654 321525150494847
8 9
10 11 12
13 14 15 16 17 18 19 20
21 22 23 24 25 26 27 28 29 30 31 32 33
A4A3A2
A5
UW
LW
A1
ADSC
A0
SS
V
ADSP
PIN NAMES
A0 – A15 Address Inputs. . . . . . . . . . . . . . . .
K Clock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ADV LW UW ADSC ADSP E G
DQ0 – DQ17 Data Input/Output. . . . . . . . . .
V
CC
V
SS
NC No Connection. . . . . . . . . . . . . . . . . . . . .
All power supply and ground pins must be connected for proper operation of the device.
Lower Byte Write Enable. . . . . . . . . . . .
Upper Byte Write Enable. . . . . . . . . . . .
Controller Address Status. . . . . . . . .
Processor Address Status. . . . . . . . .
Burst Address Advance. . . . . . . . . . . .
ADV
CC
V
+ 5 V Power Supply. . . . . . . . . . . . . . . .
K
A15
G
A8A9A10
A13
A14
Chip Enable. . . . . . . . . . . . . . . . . . . . . . . . .
Output Enable. . . . . . . . . . . . . . . . . . . . . .
A12
46 45
44 43 42 41 40 39 38 37 36 35 34
A11
Ground. . . . . . . . . . . . . . . . . . . . . . . . . .
DQ8 DQ7
DQ6 V
CC
V
SS
DQ5 DQ4 DQ3 DQ2 V
SS
V
CC
DQ1 DQ0
BurstRAM is a trademark of Motorola, Inc. i486 and Pentium are trademarks of Intel Corp.
REV 2 11/5/96
Motorola, Inc. 1996
MOTOROLA FAST SRAM
MCM67B618A
1
BLOCK DIAGRAM (See Note)
K
ADSC ADSP
A0 – A15
UW
LW
E
G
DQ0 – DQ8
DQ9 – DQ17
ADV
CLR
ADDRESS
REGISTER
WRITE
REGISTER
ENABLE
REGISTER
9 9
BINARY
16
BURST LOGIC
Q0
A0
COUNTER
Q1
A1
A1 – A0
2
A2 – A15
A0
A1
INTERNAL ADDRESS
16
DATA–IN
REGISTERS
9 9
18
64K
×
18
MEMORY
ARRAY
9
OUTPUT BUFFER
9
NOTE: All registers are positive–edge triggered. The ADSC or ADSP signals control the duration of the burst and the start of the
next burst. When ADSP
is sampled low, any ongoing burst is interrupted and a read (independent of W and ADSC) is per-
formed using the new external address. Alternatively , an ADSP–initiated two cycle WRITE can be performed by asserting
and a valid address on the first cycle, then negating both ADSP and ADSC and asserting LW and/or UW with valid
ADSP data on the second cycle (see Single Write Cycle in WRITE CYCLES timing diagram). When ADSC on W After the first cycle of the burst, ADV is advanced prior to the operation. When ADV
is sampled low (and ADSP is sampled high), any ongoing burst is interrupted and a read or write (dependent
) is performed using the new external address. Chip enable (E) is sampled only when a new base address is loaded.
controls subsequent burst cycles. When ADV is sampled low, the internal address
is sampled high, the internal address is not advanced, thus inserting a wait state into the burst sequence accesses. Upon completion of a burst, the address will wrap around to its initial state. See BURST SEQUENCE TABLE. Write refers to either or both byte write enables (L W
, UW).
BURST SEQUENCE TABLE (See Note)
External Address A15 – A2 A1 A0 1st Burst Address A15 – A2 A1 A0 2nd Burst Address A15 – A2 A1 A0 3rd Burst Address A15 – A2 A1 A0
NOTE: The burst wraps around to its initial state upon completion.
MCM67B618A 2
MOTOROLA FAST SRAM
SYNCHRONOUS TRUTH TABLE (See Notes 1, 2, and 3)
ADSP ADSC ADV UW or LW K Address Used Operation
E
H L X X X L–H N/A Deselected H X L X X L–H N/A Deselected L L X X X L–H External Address Read Cycle, Begin Burst L H L X L L–H External Address Write Cycle, Begin Burst L H L X H L–H External Address Read Cycle, Begin Burst X H H L L L–H Next Address Write Cycle, Continue Burst X H H L H L–H Next Address Read Cycle, Continue Burst X H H H L L–H Current Address Write Cycle, Suspend Burst X H H H H L–H Current Address Read Cycle, Suspend Burst
NOTES:
1. X means Don’t Care.
2. All inputs except G
3. Wait states are inserted by suspending burst.
must meet setup and hold times for the low–to–high transition of clock (K).
ASYNCHRONOUS TRUTH TABLE (See Notes 1 and 2)
Operation
Read L Data Out Read H High–Z Write X High–Z — Data In
Deselected X High–Z
NOTES:
1. X means Don’t Care.
2. For a write operation following a read operation, G required setup time and held high through the input data hold time.
G I/O Status
must be high before the input data
ABSOLUTE MAXIMUM RATINGS (Voltages Referenced to V
Rating
Power Supply Voltage V Voltage Relative to VSS for Any
Pin Except V Output Current (per I/O) I Power Dissipation P Temperature Under Bias T Operating Temperature T Storage Temperature T
NOTE: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are
CC
exceeded. Functional operation should be restricted to RECOMMENDED OPER­ATING CONDITIONS. Exposure to higher than recommended voltages for extended periods of time could affect device reliability.
Symbol Value Unit
CC
Vin, V
– 0.5 to VCC + 0.5 V
out
out
D
bias
A
stg
= 0 V)
SS
– 0.5 to + 7.0 V
± 30 mA
1.6 W
– 10 to + 85 °C
0 to +70 °C
– 55 to + 125 °C
This device contains circuitry to protect the inputs against damage due to high static volt­ages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than maxi­mum rated voltages to this high–impedance circuit.
This BiCMOS memory circuit has been designed to meet the dc and ac specifications shown in the tables, after thermal equilibrium has been established.
This device contains circuitry that will ensure the output devices are in High–Z at power up.
MOTOROLA FAST SRAM
MCM67B618A
3
DC OPERA TING CONDITIONS AND CHARACTERISTICS
(VCC = 5.0 V ± 5%, TA = 0 to + 70°C, Unless Otherwise Noted)
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage (Operating Voltage Range) V Input High Voltage V Input Low Voltage V
*VIL (min) = – 0.5 V dc; VIL (min) = – 2.0 V ac (pulse width 20.0 ns) for I 20.0 mA.
**VIH (max) = VCC + 0.3 V dc; VIH (max) = VCC + 2.0 V ac (pulse width 20.0 ns) for I 20.0 mA.
(Voltages Referenced to VSS = 0 V)
Symbol Min Max Unit
CC
IH
IL
4.75 5.25 V
2.2 VCC + 0.3
– 0.5* 0.8 V
**
V
DC CHARACTERISTICS AND SUPPLY CURRENTS
Parameter Symbol Min Max Unit
Input Leakage Current (All Inputs, Vin = 0 to VCC) I Output Leakage Current (G = VIH) I AC Supply Current (G = VIH, E = VIL, I
VIL = 0.0 V and VIH 3.0 V, Cycle Time t
AC Standby Current (E = VIH, I
VIL = 0.0 V and VIH 3.0 V, Cycle Time t Output Low Voltage (IOL = + 8.0 mA) V Output High Voltage (IOH = – 4.0 mA) V
NOTE: Good decoupling of the local power supply should always be used. DC characteristics are guaranteed for all possible i486 and Pentium
bus cycles.
out
= 0 mA, All Inputs = VIL or VIH,
out
= 0 mA, All Inputs = VIL and V
KHKH
KHKH
min)
min)
IH,
lkg(I)
lkg(O)
I
CCA9
I
CCA10
I
CCA12
I
SB1
OL OH
±1.0 µA — ±1.0 µA — 275
265 250
95 mA
0.4 V
2.4 3.3 V
mA
CAPACITANCE (f = 1.0 MHz, dV = 3.0 V, T
Input Capacitance (All Pins Except DQ0 – DQ17) C Input/Output Capacitance (DQ0 – DQ17) C
= 25°C, Periodically Sampled Rather Than 100% Tested)
A
Parameter
Symbol Typ Max Unit
in
I/O
4 5 pF 6 8 pF
MCM67B618A 4
MOTOROLA FAST SRAM
AC OPERA TING CONDITIONS AND CHARACTERISTICS
(VCC = 5.0 V ± 5%, TA = 0 to + 70°C, Unless Otherwise Noted)
Input Timing Measurement Reference Level 1.5 V. . . . . . . . . . . . . . .
Input Pulse Levels 0 to 3.0 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Rise/Fall Time 3 ns. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Timing Reference Level 1.5 V. . . . . . . . . . . . . . . . . . . . . . . . . .
Output Load See Figure 1a Unless Otherwise Noted. . . . . . . . . . . . .
READ/WRITE CYCLE TIMING (See Notes 1, 2, 3, and 4)
MCM67B618A–9 MCM67B618A–10 MCM67B618A–12
Parameter Symbol Min Max Min Max Min Max Unit Notes
Cycle Time t Clock Access Time t Output Enable to Output Valid t Clock High to Output Active t Clock High to Output Change t Output Enable to Output Active t Output Disable to Q High–Z t Clock High to Q High–Z t Clock High Pulse Width t Clock Low Pulse Width t Setup Times: Address
Hold Times: Address
NOTES:
1. In setup and hold times, W (write) refers to either one or both byte write enables LW
2. A read cycle is defined by UW high for the setup and hold times.
3. All read and write cycle timings are referenced from K or G
4. G
is a don’t care when UW or LW is sampled low.
5. Maximum access times are guaranteed for all possible i486 and Pentium external bus cycles.
6. Transition is measured ± 500 mV from steady–state voltage with load of Figure 1b. This parameter is sampled rather than 100% tested. At any given voltage and temperature, t
7. This is a synchronous device. All addresses must meet the specified setup and hold times for is low, and the chip is selected. All other synchronous inputs must meet the specified setup and hold times for the chip is enabled. Chip enable must be valid at each rising edge of clock for the device (when ADSP
Address Status
Data In
Write
Address Advance
Chip Enable
Address Status
Data In
Write
Address Advance
Chip Enable
and LW high or ADSP low for the setup and hold times. A write cycle is defined by LW or UW low and ADSP
KHKH KHQV
GLQV KHQX1 KHQX2
GLQX
GHQZ KHQZ
KHKL
KLKH
t
AVKH
t
ADSVKH
t
DVKH
t
WVKH
t
ADVVKH
t
EVKH
t
KHAX
t
KHADSX
t
KHDX
t
KHWX
t
KHADVX
t
KHEX
max is less than t
KHQZ
15 16.6 20 ns — 9 10 12 ns 5 — 5 5 6 ns
6 6 6 ns 3 3 3 ns 0 0 0 ns
6 7 7 ns 6
3 6 3 7 7 ns 5 5 6 ns 5 5 6 ns
2.5 2.5 2.5 ns 7
0.5 0.5 0.5 ns 7
and UW.
.
min for a given device and from device to device.
KHQZ1
ALL
rising edges of K whenever ADSP or ADSC
ALL
or ADSC is low) to remain enabled.
rising edges of K when
OUTPUT
MOTOROLA FAST SRAM
Z0 = 50
RL = 50
VL = 1.5 V
OUTPUT
255
(a) (b)
Figure 1. T est Loads
+ 5 V
480
5 pF
MCM67B618A
5
Q(A2 + 2)Q(A2 + 1)Q(A2)Q(A2 + 3)Q(A2 + 2)Q(A2 + 1)Q(A2)Q(A1)
KHQZ
t
(BURST WRAPS AROUND
TO ITS INITIAL STATE)
READ CYCLES
t
KHKH
t
t
KLKH
KHKL
KHADSX
t
ADSVKH
t
KHAX
t
KHWX
t
WVKH
t
KHEX
t
KHADVX
t
ADVVKH
t
(ADV SUSPENDS BURST)
KHQV
t
KHQX2
t
GHQZ
t
GLQV
t
KHQV
t
BURST READ
SINGLE READ
KHADSX
t
MCM67B618A 6
K
ADSVKH
t
ADSP
ADSC
AVKH
t
A1 A2
ADDRESS
LW, UW
EVKH
t
GLQX
t
E
ADV
G
DATA OUT
NOTE: Q(A2) represents the first output data from the base address A2; Q(A2 + 1) represents the next output data in the burst sequence with A2 as the base address.
MOTOROLA FAST SRAM
KHWX
t
KHADVX
t
KHDX
t
D(A3 + 2)D(A3 + 1)D(A3)D(A2 + 3)D(A2 + 2)D(A2 + 1)D(A2) D(A2 + 1)
NEW BURST WRITEBURST WRITE
WRITE CYCLES
ADSC STAR TS NEW BURST
A3
WVKH
t
ADVVKH
t
DVKH
t
ADV SUSPENDS BURST
(WITH A SUSPENDED CYCLE)
KHKH
t
KHADSX
t
KLKH
t
ADSVKH
t
KHKL
KHADSX
t
t
ADSVKH
t
K
ADSP
ADSC
KHAX
t
AVKH
t
W IS IGNORED FOR FIRST CYCLE WHEN ADSP INITIATES BURST
A1 A2
ADDRESS
LW, UW
KHEX
t
t
EVKH
E
ADV
G
D(A1)
DATA IN
GHQZ
t
SINGLE WRITEBURST READ
Q(An – 1) Q(An)
DATA OUT
MOTOROLA FAST SRAM
MCM67B618A
7
COMBINATION READ/WRITE CYCLE (E low, ADSC high)
t
KHKH
K
ADSP
ADDRESS
, UW
LW
ADV
G
DATA IN
t
ADSVKH
t
AVKH
t
t
KHADSX
t
KHAX
A1 A2 A3
t
KHQV
KHKL
t
WVKH
t
ADVVKH
t
DVKH
D(A2)
t
KLKH
t
KHWX
t
KHADVX
t
KHDX
t
GLQV
DATA OUT
t
KHQX1
t
GHQZ
Q(A1)
READ WRITE BURST READ
t
GLQX
t
KHQX2
Q(A3) Q(A3 + 1) Q(A3 + 2)
MCM67B618A 8
MOTOROLA FAST SRAM
ADDRESS
Pentium
CONTROL
APPLICATION EXAMPLE
DATA BUS
DATA
ADDRESS BUS
CLOCK
CLK
ADS
512K Byte Burstable, Secondary Cache
Using Four MCM67B618AFN9s with a 66 MHz Pentium
ADDR ADDR DA TA
K
CACHE
CONTROL
LOGIC
K ADSC
MCM67B618AFN9
W G
ADV
ADSP
Figure 2
MOTOROLA FAST SRAM
MCM67B618A
9
Motorola Memory Prefix
ORDERING INFORMATION
(Order by Full Part Number)
MCM 67B618A XX XX
Speed (9 = 9 ns, 10 = 10 ns, 12 = 12 ns)
Part Number
Package (FN = PLCC)
Full Part Numbers — MCM67B618AFN9 MCM67B618AFN10 MCM67B618AFN12
MCM67B618A 10
MOTOROLA FAST SRAM
P ACKAGE DIMENSIONS
FN PACKAGE
52–LEAD PLCC
CASE 778–02
0.007 (0.180) T L
B
–M
SNSM
-L-
ACTUAL
(NOTE
1)
52
Z
C
(NOTE
1)
52
0.010 (0.250) T L
52
LEADS
G
G1
-N-
1
–M
Y BRK
0.007 (0.180) T L
U
–M
SNSM
D
-M-
Z
W
V
A
0.007 (0.180) T L
R
0.007 (0.180) T L
E
-T-
J
VIEW S
D
0.004 (0.100)
SEATING PLANE
–M
–M
X
VIEW D-D
SNSM
SNSM
K1
K
G1
0.010 (0.250) T L
H
0.007 (0.180) T L
F
0.007 (0.180) T L
–M
–M
–M
SNSS
SNSM
SNSM
VIEW S
SNSS
NOTES:
1. DUE TO SPACE LIMITATION, CASE 778-02 SHALL BE REPRESENTED BY A GENERAL (SMALLER) CASE OUTLINE DRAWING RATHER THAN SHOWING ALL 52 LEADS.
2. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.
3. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE.
4. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
5. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
6. CONTROLLING DIMENSION: INCH.
7. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY.
8. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
INCHES MILLIMETERS
MIN MINMAX MAX
DIM
A
0.785
0.785
0.165
0.090
0.013
0.026
0.020
0.025
0.750
0.750
0.042
0.042
0.042 —
°
2
0.710
0.040
0.795
0.795
0.180
0.110
0.019
0.032 — —
0.756
0.756
0.048
0.048
0.056
0.020
°
10
0.730 —
G1 K1
B C E F G H J K R U V W X Y Z
19.94
20.19
19.94
20.19
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC0.050 BSC
0.66
0.81
0.51
0.64
19.05
19.20
19.05
19.20
1.07
1.21
1.07
1.21
1.07
1.42
0.50
°
2
18.04
1.02
°
10
18.54 —
MOTOROLA FAST SRAM
MCM67B618A
11
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
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MCM67B618A 12
MOTOROLA FAST SRAM
MCM67B618A/D
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