Motorola MCM32515SG20, MCM32515SG25 Datasheet

MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
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MCM32515
512K x 32 Bit Fast Static RAM Module
The MCM32515 is a 16M bit static random access memory module organized as 524,288 words of 32 bits. The module is offered in a 72–lead single in–line memory module (SIMM). Four MCM6246 fast static RAMs, packaged in 36–lead SOJ packages are mounted on a printed circuit board along with eight decoupling capacitors.
The MCM6246 is a high–performance CMOS fast static RAM organized as 524,288 words of 8 bits. Static design eliminates the need for external clocks or timing strobes, while CMOS circuitry reduces power consumption and provides for greater reliability .
The MCM32515 is equipped with output enable (G able (E1 – E4) inputs, allowing for greater system flexibility. The G input, when high, will force the outputs to high impedance. Ex
Single 5 V ± 10% Power Supply
Fast Access Times: 20/25 ns
Three–State Outputs
Fully TTL Compatible
JEDEC Standard Pinout
Power Requirement: 800/740 mA Maximum, Active AC
High Board Density SIMM Package
Byte Operation: Four Separate Chip Enables, One for Each Byte
High Quality Six–Layer FR4 PWB with Separate Internal Power and
Ground Planes
Incorporates Motorola’s State–of–the–Art Fast Static RAMs
PIN NAMES
A0 – A18 Address Inputs. . . . . . . . . . . . . . . . . . . . . . . . . . .
W G E1
– E4 Byte Enables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DQ0 – DQ31 Data Input/Output. . . . . . . . . . . . . . . . . . . . . .
V
CC
V
SS
PD0 – PD3 Package Density. . . . . . . . . . . . . . . . . . . . . . . .
NC No Connect. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
For proper operation of the device, VSS must be connected to ground.
) and four separate byte en-
high will do the same for byte x.
Write Enable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Enable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
+ 5 V Power Supply. . . . . . . . . . . . . . . . . . . . . . . . . . .
Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PIN ASSIGNMENT
TOP VIEW
72 LEAD SIMM — CASE TBD
1
11 13 15 17 19 21 23 25 27 29 31 33 35
37 39 41 43 45 47 49 51 53 55 57 59 61 63 65 67 69 71
NC
3
PD2 V
5
SS
7
PD1 DQ8
9
DQ9 DQ10 DQ11 A0 A1 A2
DQ12 DQ13 DQ14 DQ15 V
SS
A15 E2
E4 A17
G DQ24 DQ25 DQ26 DQ27 A3 A4 A5 V
CC
A6 DQ28 DQ29 DQ30 DQ31 A18 NC
NC
PD3
PD0 DQ0 DQ1 DQ2
DQ3 V
CC
A7 A8
A9 DQ4 DQ5 DQ6 DQ7
W
A14
E1
E3 38
A16
V
SS
DQ16 DQ17 DQ18 DQ19
A10 A11 A12
A13 DQ20 DQ21 DQ22 DQ23
V
SS NC NC
2 4 6
8
10 12 14
16 18 20 22 24 26 28
30 32
34 36
40 42 44 46 48 50 52 54 56 58 60 62 64 66 68
70 72
This document contains information on a new product. Specifications and information herein are subject to change without notice.
REV 2 4/7/97
Motorola, Inc. 1997
MOTOROLA FAST SRAM
MCM32515
1
FUNCTIONAL BLOCK DIAGRAM
512K x 32 MEMORY MODULE
DQ0 – DQ7
E1
DQ8 – DQ15
E2
W
G
V
CC
V
SS
8
DQ0 – DQ7 A0 – A18
E W G
MCM6246
8
DQ0 – DQ7 A0 – A18
E W G
MCM6246 MCM6246
DQ16 – DQ23
E3
DQ24 – DQ31
E4
8
8
DQ0 – DQ7
A0 – A18
E W G
MCM6246
DQ0 – DQ7 A0 – A18
E W G
A0 – A18
PD0 – PD2
GND OPEN
MCM32515 2
MOTOROLA FAST SRAM
TRUTH TABLE
Ex G W Mode VCC Current Output Cycle
H X X Not Selected I
L H H Read I L L H Read I L X L Write I
SB1
or I
CCA CCA CCA
SB2
High–Z — High–Z
D
out
D
in
Read Cycle Write Cycle
ABSOLUTE MAXIMUM RATINGS (Voltages referenced to V
Rating
Power Supply Voltage V Voltage Relative to V Output Current (per I/O) I Power Dissipation P Temperature Under Bias T Operating Temperature T Storage Temperatrue T
NOTE: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are
exceeded. Functional operation should be restricted to RECOMMENDED OPERATING CONDITIONS. Exposure to higher than recommended voltages for extended periods of time could affect device reliability.
SS
Symbol Value Unit
CC
Vin, V
out
bias
stg
– 0.5 to VCC + 0.5 V
out
D
A
= 0 V)
SS
– 0.5 to 7.0 V
± 30 mA
4.0 W
– 10 to + 85 °C
0 to + 70 °C
– 25 to + 125 °C
DC OPERA TING CONDITIONS AND CHARACTERISTICS
(VCC = 5.0 V ± 10%, TA = 0 to + 70°C, Unless Otherwise Noted)
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage (Operating Voltage Range) V Input High Voltage V Input Low Voltage V
*VIH (max) = VCC + 0.3 V dc; VIH (max) = VCC + 2 V ac (pulse width 20 ns)
**VIL (min) = – 3.0 V ac (pulse width 20 ns)
(Voltages referenced to VSS = 0 V)
The devices on this module contain circuitry to protect the inputs against damage due to high static voltages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum rated voltages to these high imped­ance circuits.
These CMOS memory circuits have been designed to meet the dc and ac specifications shown in the tables, after thermal equilibrium has been established. The module is in a test socket or mounted on a printed circuit board and transverse air flow of at least 500 linear feet per minute is maintained.
Symbol Min Typ Max Unit
CC
IH
IL
4.5 5.0 5.5 V
2.2 VCC+0.3* V
– 0.5** 0.8 V
DC CHARACTERISTICS
Parameter Symbol Min Typ Max Unit
Input Leakage Current (All Inputs, Vin = 0 to VCC) I Output Leakage Current (G, Ex = VIH, V AC Active Supply Current (G, Ex = VIL, I
Cycle time t AC Standby Current (Ex = VIH, Cycle time t CMOS Standby Current (Ex VCC – 0.2 V, All Inputs VCC – 0.2 V or 0.2 V) I Output Low Voltage (IOL = + 8.0 mA) V Output High Voltage (IOH = – 4.0 mA) V
NOTE: Good decoupling of the local power supply should always be used.
min) MCM32515–25: t
AVAV
CAPACITANCE (f = 1.0 MHz, dV = 3.0 V, T
Input Capacitance (All pins except DQ0 – DQ31, W, G, and E1 – E4)
Input/Output Capacitance (DQ0 – DQ31) C
= 0 to VCC) I
out
= 0 mA, MCM32515–20: t
out
min) I
AVAV
= 25°C, Periodically Sampled Rather Than 100% Tested)
A
Characteristic
AVAV AVAV
= 20 ns = 25 ns
(E1
– E4)
(W
, G)
lkg(I)
lkg(O) I
CCA
SB1 SB2
OL OH
± 4 µA — ± 4 µA —
— — 220 240 mA — 40 60 mA — 0.4 V
2.4 V
Symbol Typ Max Unit
C
in
out
760 700
16 10 20
8 9 pF
800 740
24 14 32
mA
pF
MOTOROLA FAST SRAM
MCM32515
3
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