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products forany particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in
different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
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and reasonableattorney fees arising out of, directly or indirectly,any claim of personal injuryor death associated with such unintended or unauthorizeduse, even if such claim alleges
that Motorola was negligent regarding the design or manufacture of the part. Motorola andare registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
00.0125.JAN.03 25.JAN.03Original Version. Based on C32 user guide version 01.12
00.0207.FEB.03 07.FEB.03
00.0325.FEB.03 25.FEB.03
00.0415.APR.03 15.APR03
00.0505.MAY.03 05.MAY.03
00.0621.MAY.03 21.MAY.03
01.0015.JUL.0315.JUL03
01.0112.AUG.03 12.AUG.03Updated PARTID listing due to C128 ECO revision
01.0220.NOV.03 20.NOV.03
01.0327.NOV.03 27.NOV.03
01.0427.JAN.04 27.JAN.04
01.0511.FEB.04 11.FEB.04
Revision
Date
Effective
Date
AuthorDescription of Changes
Enhanced PortK description
Part number table revision in preface
QFP112 Emulation pinout correction
Enhanced part number explanation in preface
Reduced pseudo STOP current spec. for C64,C96,C128
Enhanced PortAD signal description
Corrected VDDR description in 2.4.2
Revised pin leakage in electrical parameters
SPI timing parameter table correction
Output drive high value reduced in 3V range
PE[4:2] Pull-Up spec out of reset changed
3V Expansion bus timing parameters not tested in production
Minimum bus frequency specification increased to 0.25MHz.
Parameter classification added to Appendix Table C-2.
IOH changed to 4mA for 3V range.
LVR level defined.for C32. Run IDD changed for C32.
Block guide reference table updated
Added PCB layout guide for Pierce oscillator configuration
IOL parameter updated in 3.3V range
Changed DOC number and CPU DOC reference number
Included separate C32 LVI levels
Changed PortM pull up reset state to enabled.
Added References to the CAN-less GC-Family
No major revision number increment, since silicon functionality is
not changed.
Added VDDX connection in PCB layout figures 8-1.to 8-6
Added Part ID for 2L45J mask set to Part ID table
Table A-4 VDD/VDDPLL min when supplied externally now 2.35V
Reference S12FTS128K1 in Preface (was S12FTS128K)
Reference to CPU Guide corrected to Version2
Corrected flash sector sizes for C-Family devices with >64K Flash
Corrected Preface Table 0-1 16K part listing to GC16 without CAN
Added PPAGE specifications to memory map diagrams
Added flash timing parameters for 1024 byte sector size
TheDeviceUser Guide provides information about the MC9S12C-Family as well the MC9S12GC-Family
devices made up of standard HCS12 blocks and the HCS12 processor core. This document is part of the
customer documentation. A completeset of device manualsalso includes the HCS12Core User Guide and
all the individual Block User Guides of the implemented modules. In an effort to reduce redundancy all
module specific information is located only in the respective Block User Guide. If applicable, special
implementation details of the module are given in the block description sections of this document.
The C-Family and the GC-Family offer an extensive range of package, temperature and speed options.
The members of the GC-Family do not feature a CAN module.
Table 0-1 shows a feature overview of the MC9S12C and MC9S12GC Family members.
Table 0-2 summarizes the package option and size configuration.
Table 0-3 lists the part number coding based on the package, speed and temperature and preliminary die
options for the C-Family.
Table 0-4 lists the part number coding based on the package, speed and temperature and preliminary die
options for the GC-Family.
Table 0-1 List of MC9S12C and MC9S12GC Family members
FlashRAMDeviceCANSCISPIA/DPWM Timer
128K4K
96K4KMC9S12C961118ch6ch8ch
64K4K
32K2K
16K1KMC9S12GC16—118ch6ch8ch
MC9S12C1281118ch6ch8ch
MC9S12GC128—118ch6ch8ch
MC9S12C641118ch6ch8ch
MC9S12GC64—118ch6ch8ch
MC9S12C321118ch6ch8ch
MC9S12GC32—118ch6ch8ch
Table 0-2 MC9S12C-Family Package Option Summary
1
PackageDevicePart Number
48LQFPMC9S12C128MC9S12C1280L09SM, V, C
52LQFPMC9S12C128MC9S12C1280L09SM, V, C35
80QFPMC9S12C128MC9S12C1280L09SM, V, C60
48LQFPMC9S12C96MC9S12C96TBDM, V, C
52LQFPMC9S12C96MC9S12C96TBDM, V, C35
80QFPMC9S12C96MC9S12C96TBDM, V, C60
Mask
set
Options
Temp.
2
FlashRAM
128K4K
96K4K
I/O3,
31
31
4
15
Device User Guide — 9S12C128DGV1/D V01.05
y
1
PackageDevicePart Number
48LQFPMC9S12C64MC9S12C64TBDM, V, C
52LQFPMC9S12C64MC9S12C64TBDM, V, C35
80QFPMC9S12C64MC9S12C64TBDM, V, C60
48LQFPMC9S12C32MC9S12C321L45JM, V, C
52LQFPMC9S12C32MC9S12C321L45JM, V, C35
3. All C-Family derivatives feature 1 CAN, 1 SCI, 1 SPI, an 8-channel A/D, a 6-channel PWM and an 8
4. I/O is the sum of ports capable to act as digital input or output.
= 85˚C, f = 25MHz. V: TA=105˚C, f = 25MHz. M: TA= 125˚C, f = 25MHz
A
channel timer. The GC-Family members do not have the CAN module
Mask
set
Options
Temp.
2
FlashRAM
64K4K
32K2K
128K4K
64K4K
32K2K
16K2K
I/O3,
31
31
31
31
31
31
4
MC9S12 C32 (P)C FU25
Temperature Options
C = -40˚C to85˚C
Speed Option
Package Option
Temperature Option
V = -40˚C to 105˚C
M = -40˚C to 125˚C
Package Options
FU =80QFP
PB = 52LQFP
Preliminary Option
FA = 48LQFP
Speed Options
Device Title
25 = 25MHz bus
16 = 16MHz bus
Controller Famil
Figure 0-1 Order Part number Coding
Table 0-3 MC9S12C-Family Part Number Coding
Part Number
MC9S12C128CFA16TBD-40˚C, 85˚C48LQFP16MHzC128 die
Mask
set
Temp.PackageSpeedDescription
16
Device User Guide — 9S12C128DGV1/D V01.05
Part Number
MC9S12C128CPB16TBD-40˚C, 85˚C52LQFP16MHzC128 die
MC9S12C128CFU16TBD-40˚C, 85˚C80QFP16MHzC128 die
MC9S12C128VFA16TBD-40˚C,105˚C48LQFP16MHzC128 die
MC9S12C128VPB16TBD-40˚C,105˚C52LQFP16MHzC128 die
MC9S12C128VFU16TBD-40˚C, 105˚C80QFP16MHzC128 die
MC9S12C128MFA16TBD-40˚C,125˚C48LQFP16MHzC128 die
MC9S12C128MPB16TBD-40˚C,125˚C52LQFP16MHzC128 die
MC9S12C128MFU16TBD-40˚C, 125˚C80QFP16MHzC128 die
MC9S12C128CFA25TBD-40˚C, 85˚C48LQFP25MHzC128 die
MC9S12C128CPB25TBD-40˚C, 85˚C52LQFP25MHzC128 die
MC9S12C128CFU25TBD-40˚C, 85˚C80QFP25MHzC128 die
MC9S12C128VFA25TBD-40˚C,105˚C48LQFP25MHzC128 die
MC9S12C128VPB25TBD-40˚C,105˚C52LQFP25MHzC128 die
MC9S12C128VFU25TBD-40˚C, 105˚C80QFP25MHzC128 die
MC9S12C128MFA25TBD-40˚C,125˚C48LQFP25MHzC128 die
MC9S12C128MPB25TBD-40˚C,125˚C52LQFP25MHzC128 die
MC9S12C128MFU25TBD-40˚C, 125˚C80QFP25MHzC128 die
MC9S12C96PCFA160L09S-40˚C, 85˚C48LQFP16MHzPreliminary C96 using C128 die
MC9S12C96PCPB160L09S-40˚C, 85˚C52LQFP16MHzPreliminary C96 using C128 die
MC9S12C96PCFU160L09S-40˚C, 85˚C80QFP16MHzPreliminary C96 using C128 die
MC9S12C96CFA16TBD-40˚C, 85˚C48LQFP16MHzFinal C96 using C96 die
MC9S12C96CPB16TBD-40˚C, 85˚C52LQFP16MHzFinal C96 using C96 die
MC9S12C96CFU16TBD-40˚C, 85˚C80QFP16MHzFinal C96 using C96 die
MC9S12C96PVFA160L09S-40˚C, 105˚C48LQFP16MHzPreliminary C96 using C128 die
MC9S12C96PVPB160L09S-40˚C, 105˚C52LQFP16MHzPreliminary C96 using C128 die
MC9S12C96PVFU160L09S-40˚C, 105˚C80QFP16MHzPreliminary C96 using C128 die
MC9S12C96VFA16TBD-40˚C,105˚C48LQFP16MHzFinal C96 using C96 die
MC9S12C96VPB16TBD-40˚C,105˚C52LQFP16MHzFinal C96 using C96die
MC9S12C96VFU16TBD-40˚C, 105˚C80QFP16MHzFinal C96 using C96 die
MC9S12C96PMFA160L09S-40˚C, 125˚C48LQFP16MHzPreliminary C96 using C128 die
MC9S12C96PMPB160L09S-40˚C, 125˚C52LQFP16MHzPreliminary C96 using C128 die
MC9S12C96PMFU160L09S-40˚C, 125˚C80QFP16MHzPreliminary C96 using C128 die
MC9S12C96MFA16TBD-40˚C,125˚C48LQFP16MHzFinal C96 using C96 die
MC9S12C96MPB16TBD-40˚C,125˚C52LQFP16MHzFinal C96 using C96 die
MC9S12C96MFU16TBD-40˚C, 125˚C80QFP16MHzFinal C96 using C96 die
MC9S12C96PCFA250L09S-40˚C, 85˚C48LQFP25MHzPreliminary C96 using C128 die
MC9S12C96PCPB250L09S-40˚C, 85˚C52LQFP25MHzPreliminary C96 using C128 die
MC9S12C96PCFU250L09S-40˚C, 85˚C80QFP25MHzPreliminary C96 using C128 die
MC9S12C96CFA25TBD-40˚C, 85˚C48LQFP25MHzFinal C96 using C96 die
MC9S12C96CPB25TBD-40˚C, 85˚C52LQFP25MHzFinal C96 using C96 die
MC9S12C96CFU25TBD-40˚C, 85˚C80QFP25MHzFinal C96 using C96 die
MC9S12C96PVFA250L09S-40˚C, 105˚C48LQFP25MHzPreliminary C96 using C128 die
MC9S12C96PVPB250L09S-40˚C, 105˚C52LQFP25MHzPreliminary C96 using C128 die
MC9S12C96PVFU250L09S-40˚C, 105˚C80QFP25MHzPreliminary C96 using C128 die
Mask
set
Temp.PackageSpeedDescription
17
Device User Guide — 9S12C128DGV1/D V01.05
Part Number
MC9S12C96VFA25TBD-40˚C,105˚C48LQFP25MHzFinal C96 using C96 die
MC9S12C96VPB25TBD-40˚C,105˚C52LQFP25MHzFinal C96 using C96 die
MC9S12C96VFU25TBD-40˚C, 105˚C80QFP25MHzFinal C96 using C96 die
MC9S12C96PMFA250L09S-40˚C, 125˚C48LQFP25MHzPreliminary C96 using C128 die
MC9S12C96PMPB250L09S-40˚C, 125˚C52LQFP25MHzPreliminary C96 using C128 die
MC9S12C96PMFU250L09S-40˚C, 125˚C80QFP25MHzPreliminary C96 using C128 die
MC9S12C96MFA25TBD-40˚C,125˚C48LQFP25MHzFinal C96 using C96 die
MC9S12C96MPB25TBD-40˚C,125˚C52LQFP25MHzFinal C96 using C96 die
MC9S12C96MFU25TBD-40˚C, 125˚C80QFP25MHzFinal C96 using C96 die
MC9S12C64PCFA160L09S-40˚C, 85˚C48LQFP16MHzPreliminary C64 using C128 die
MC9S12C64PCPB160L09S-40˚C, 85˚C52LQFP16MHzPreliminary C64 using C128 die
MC9S12C64PCFU160L09S-40˚C, 85˚C80QFP16MHzPreliminary C64 using C128 die
MC9S12C64CFA16TBD-40˚C, 85˚C48LQFP16MHzFinal C64 using C64 die
MC9S12C64CPB16TBD-40˚C, 85˚C52LQFP16MHzFinal C64 using C64 die
MC9S12C64CFU16TBD-40˚C, 85˚C80QFP16MHzFinal C64 using C64 die
MC9S12C64PVFA160L09S-40˚C, 105˚C48LQFP16MHzPreliminary C64 using C128 die
MC9S12C64PVPB160L09S-40˚C, 105˚C52LQFP16MHzPreliminary C64 using C128 die
MC9S12C64PVFU160L09S-40˚C, 105˚C80QFP16MHzPreliminary C64 using C128 die
MC9S12C64VFA16TBD-40˚C,105˚C48LQFP16MHzFinal C64 using C64 die
MC9S12C64VPB16TBD-40˚C,105˚C52LQFP16MHzFinal C64 using C64 die
MC9S12C64VFU16TBD-40˚C, 105˚C80QFP16MHzFinal C64 using C64 die
MC9S12C64PMFA160L09S-40˚C, 125˚C48LQFP16MHzPreliminary C64 using C128 die
MC9S12C64PMPB160L09S-40˚C, 125˚C52LQFP16MHzPreliminary C64 using C128 die
MC9S12C64PMFU160L09S-40˚C, 125˚C80QFP16MHzPreliminary C64 using C128 die
MC9S12C64MFA16TBD-40˚C,125˚C48LQFP16MHzFinal C64 using C64 die
MC9S12C64MPB16TBD-40˚C,125˚C52LQFP16MHzFinal C64 using C64 die
MC9S12C64MFU16TBD-40˚C, 125˚C80QFP16MHzFinal C64 using C64 die
MC9S12C64PCFA250L09S-40˚C, 85˚C48LQFP25MHzPreliminary C64 using C128 die
MC9S12C64PCPB250L09S-40˚C, 85˚C52LQFP25MHzPreliminary C64 using C128 die
MC9S12C64PCFU250L09S-40˚C, 85˚C80QFP25MHzPreliminaryC64 using C128 die
MC9S12C64CFA25TBD-40˚C, 85˚C48LQFP25MHzFinal C64 using C64 die
MC9S12C64CPB25TBD-40˚C, 85˚C52LQFP25MHzFinal C64 using C64 die
MC9S12C64CFU25TBD-40˚C, 85˚C80QFP25MHzFinal C64 using C64 die
MC9S12C64PVFA250L09S-40˚C, 105˚C48LQFP25MHzPreliminary C64 using C128 die
MC9S12C64PVPB250L09S-40˚C, 105˚C52LQFP25MHzPreliminary C64 using C128 die
MC9S12C64PVFU250L09S-40˚C, 105˚C80QFP25MHzPreliminary C64 using C128 die
MC9S12C64VFA25TBD-40˚C,105˚C48LQFP25MHzFinal C64 using C64 die
MC9S12C64VPB25TBD-40˚C,105˚C52LQFP25MHzFinal C64 using C64 die
MC9S12C64VFU25TBD-40˚C, 105˚C80QFP25MHzFinal C64 using C64 die
MC9S12C64PMFA250L09S-40˚C, 125˚C48LQFP25MHzPreliminary C64 using C128 die
MC9S12C64PMPB250L09S-40˚C, 125˚C52LQFP25MHzPreliminary C64 using C128 die
MC9S12C64PMFU250L09S-40˚C, 125˚C80QFP25MHzPreliminary C64 using C128 die
MC9S12C64MFA25TBD-40˚C,125˚C48LQFP25MHzFinal C64 using C64 die
MC9S12C64MPB25TBD-40˚C,125˚C52LQFP25MHzFinal C64 using C64 die
Mask
set
Temp.PackageSpeedDescription
18
Device User Guide — 9S12C128DGV1/D V01.05
Part Number
MC9S12C64MFU25TBD-40˚C, 125˚C80QFP25MHzFinal C64 using C64 die
MC9S12C32CFA161L45J-40˚C, 85˚C48LQFP16MHzC32 die
MC9S12C32CPB161L45J-40˚C, 85˚C52LQFP16MHzC32 die
MC9S12C32CFU161L45J-40˚C, 85˚C80QFP16MHzC32 die
MC9S12C32VFA161L45J-40˚C,105˚C48LQFP16MHzC32 die
MC9S12C32VPB161L45J-40˚C,105˚C52LQFP16MHzC32 die
MC9S12C32VFU161L45J-40˚C, 105˚C80QFP16MHzC32 die
MC9S12C32MFA161L45J-40˚C,125˚C48LQFP16MHzC32 die
MC9S12C32MPB161L45J-40˚C,125˚C52LQFP16MHzC32 die
MC9S12C32MFU161L45J-40˚C, 125˚C80QFP16MHzC32 die
MC9S12C32CFA251L45J-40˚C, 85˚C48LQFP25MHzC32 die
MC9S12C32CPB251L45J-40˚C, 85˚C52LQFP25MHzC32 die
MC9S12C32CFU251L45J-40˚C, 85˚C80QFP25MHzC32 die
MC9S12C32VFA251L45J-40˚C,105˚C48LQFP25MHzC32 die
MC9S12C32VPB251L45J-40˚C,105˚C52LQFP25MHzC32 die
MC9S12C32VFU251L45J-40˚C, 105˚C80QFP25MHzC32 die
MC9S12C32MFA251L45J-40˚C,125˚C48LQFP25MHzC32 die
MC9S12C32MPB251L45J-40˚C,125˚C52LQFP25MHzC32 die
MC9S12C32MFU251L45J-40˚C, 125˚C80QFP25MHzC32 die
Mask
set
Temp.PackageSpeedDescription
Table 0-4 MC9S12GC-Family Part Number Coding
Part Number
MC9S12GC128PCFA250L09S-40˚C, 85˚C48LQFP25MHzPreliminary GC128 using C128 die
MC9S12GC128PCPB250L09S-40˚C, 85˚C52LQFP25MHzPreliminary GC128 using C128 die
MC9S12GC128PCFU250L09S-40˚C, 85˚C80QFP25MHzPreliminary GC128 using C128 die
MC9S12GC128CFA25TBD-40˚C, 85˚C48LQFP25MHzFinal GC128 using GC128 die
MC9S12GC128CPB25TBD-40˚C, 85˚C52LQFP25MHzFinal GC128 using GC128 die
MC9S12GC128CFU25TBD-40˚C, 85˚C80QFP25MHzFinal GC128 using GC128 die
MC9S12GC128PVFA250L09S-40˚C, 105˚C48LQFP25MHzPreliminary GC128 using C128 die
MC9S12GC128PVPB250L09S-40˚C, 105˚C52LQFP25MHzPreliminary GC128 using C128 die
MC9S12GC128PVFU250L09S-40˚C, 105˚C80QFP25MHzPreliminary GC128 using C128 die
MC9S12GC128VFA25TBD-40˚C, 105˚C48LQFP25MHzFinal GC128 using GC128 die
MC9S12GC128VPB25TBD-40˚C, 105˚C52LQFP25MHzFinal GC128 using GC128 die
MC9S12GC128VFU25TBD-40˚C, 105˚C80QFP25MHzFinal GC128 using GC128 die
MC9S12GC128PMFA250L09S-40˚C, 125˚C48LQFP25MHzPreliminary GC128 using C128 die
MC9S12GC128PMPB250L09S-40˚C, 125˚C52LQFP25MHzPreliminary GC128 using C128 die
MC9S12GC128PMFU250L09S-40˚C, 125˚C80QFP25MHzPreliminary GC128 using C128 die
MC9S12GC128MFA25TBD-40˚C, 125˚C48LQFP25MHzFinal GC128 using GC128 die
MC9S12GC128MPB25TBD-40˚C, 125˚C52LQFP25MHzFinal GC128 using GC128 die
MC9S12GC128MFU25TBD-40˚C, 125˚C80QFP25MHzFinal GC128 using GC128 die
MC9S12GC64PCFA250L09S-40˚C, 85˚C48LQFP25MHzPreliminary GC64 using C128 die
MC9S12GC64PCPB250L09S-40˚C, 85˚C52LQFP25MHzPreliminary GC64 using C128 die
MC9S12GC64PCFU250L09S-40˚C, 85˚C80QFP25MHzPreliminary GC64 using C128 die
Mask
set
Temp.PackageSpeedDescription
19
Device User Guide — 9S12C128DGV1/D V01.05
Part Number
MC9S12GC64CFA25TBD-40˚C, 85˚C48LQFP25MHzFinal GC64 using GC64 die
MC9S12GC64CPB25TBD-40˚C, 85˚C52LQFP25MHzFinal GC64 using GC64 die
MC9S12GC64CFU25TBD-40˚C, 85˚C80QFP25MHzFinal GC64 using GC64 die
MC9S12GC64PVFA250L09S-40˚C, 105˚C48LQFP25MHzPreliminary GC64 using C128 die
MC9S12GC64PVPB250L09S-40˚C, 105˚C52LQFP25MHzPreliminary GC64 using C128 die
MC9S12GC64PVFU250L09S-40˚C, 105˚C80QFP25MHzPreliminary GC64 using C128 die
MC9S12GC64VFA25TBD-40˚C, 105˚C48LQFP25MHzFinal GC64 using GC64 die
MC9S12GC64VPB25TBD-40˚C, 105˚C52LQFP25MHzFinal GC64 using GC64 die
MC9S12GC64VFU25TBD-40˚C, 105˚C80QFP25MHzFinal GC64 using GC64 die
MC9S12GC64PMFA250L09S-40˚C, 125˚C48LQFP25MHzPreliminary GC64 using C128 die
MC9S12GC64PMPB250L09S-40˚C, 125˚C52LQFP25MHzPreliminary GC64 using C128 die
MC9S12GC64PMFU250L09S-40˚C, 125˚C80QFP25MHzPreliminary GC64 using C128 die
MC9S12GC64MFA25TBD-40˚C, 125˚C48LQFP25MHzFinal GC64 using GC64 die
MC9S12GC64MPB25TBD-40˚C, 125˚C52LQFP25MHzFinal GC64 using GC64 die
MC9S12GC64MFU25TBD-40˚C, 125˚C80QFP25MHzFinal GC64 using GC64 die
MC9S12GC32PCFA251L45J-40˚C, 85˚C48LQFP25MHzPreliminary GC32 using C32 die
MC9S12GC32PCPB251L45J-40˚C, 85˚C52LQFP25MHzPreliminary GC32 using C32 die
MC9S12GC32PCFU251L45J-40˚C, 85˚C80QFP25MHzPreliminary GC32 using C32 die
MC9S12GC32CFA25TBD-40˚C, 85˚C48LQFP25MHzFinal GC32 using GC32 die
MC9S12GC32CPB25TBD-40˚C, 85˚C52LQFP25MHzFinal GC32 using GC32 die
MC9S12GC32CFU25TBD-40˚C, 85˚C80QFP25MHzFinal GC32 using GC32 die
MC9S12GC32PVFA251L45J-40˚C,105˚C48LQFP25MHzPreliminary GC32 using C32 die
MC9S12GC32PVPB251L45J-40˚C,105˚C52LQFP25MHzPreliminary GC32 using C32 die
MC9S12GC32PVFU251L45J-40˚C, 105˚C80QFP25MHzPreliminary GC32 using C32 die
MC9S12GC32VFA25TBD-40˚C,105˚C48LQFP25MHzFinal GC32 using GC32 die
MC9S12GC32VPB25TBD-40˚C,105˚C52LQFP25MHzFinal GC32 using GC32 die
MC9S12GC32VFU25TBD-40˚C, 105˚C80QFP25MHzFinal GC32 using GC32 die
MC9S12GC32PMFA251L45J-40˚C,125˚C48LQFP25MHzPreliminary GC32 using C32 die
MC9S12GC32PMPB251L45J-40˚C,125˚C52LQFP25MHzPreliminary GC32 using C32 die
MC9S12GC32PMFU251L45J-40˚C, 125˚C80QFP25MHzPreliminary GC32 using C32 die
MC9S12GC32MFA25TBD-40˚C,125˚C48LQFP25MHzFinal GC32 using GC32 die
MC9S12GC32MPB25TBD-40˚C,125˚C52LQFP25MHzFinal GC32 using GC32 die
MC9S12GC32MFU25TBD-40˚C, 125˚C80QFP25MHzFinal GC32 using GC32 die
MC9S12GC16PCFA251L45J-40˚C, 85˚C48LQFP25MHzPreliminary GC16 using C32 die
MC9S12GC16PCPB251L45J-40˚C, 85˚C52LQFP25MHzPreliminary GC16 using C32 die
MC9S12GC16PCFU251L45J-40˚C, 85˚C80QFP25MHzPreliminary GC16 using C32 die
MC9S12GC16CFA25TBD-40˚C, 85˚C48LQFP25MHzFinal GC16 using GC16 die
MC9S12GC16CPB25TBD-40˚C, 85˚C52LQFP25MHzFinal GC16 using GC16 die
MC9S12GC16CFU25TBD-40˚C, 85˚C80QFP25MHzFinal GC16 using GC16 die
MC9S12GC16PVFA251L45J-40˚C,105˚C48LQFP25MHzPreliminary GC16 using C32 die
MC9S12GC16PVPB251L45J-40˚C,105˚C52LQFP25MHzPreliminary GC16 using C32 die
MC9S12GC16PVFU251L45J-40˚C, 105˚C80QFP25MHzPreliminary GC16 using C32 die
MC9S12GC16VFA25TBD-40˚C,105˚C48LQFP25MHzFinal GC16 using GC16 die
MC9S12GC16VPB25TBD-40˚C,105˚C52LQFP25MHzFinal GC16 using GC16 die
Mask
set
Temp.PackageSpeedDescription
20
Device User Guide — 9S12C128DGV1/D V01.05
Part Number
MC9S12GC16VFU25TBD-40˚C, 105˚C80QFP25MHzFinal GC16 using GC16 die
MC9S12GC16PMFA251L45J-40˚C,125˚C48LQFP25MHzPreliminary GC16 using C32 die
MC9S12GC16PMPB251L45J-40˚C,125˚C52LQFP25MHzPreliminary GC16 using C32 die
MC9S12GC16PMFU251L45J-40˚C, 125˚C80QFP25MHzPreliminary GC16 using C32 die
MC9S12GC16MFA25TBD-40˚C,125˚C48LQFP25MHzFinal GC16 using GC16 die
MC9S12GC16MPB25TBD-40˚C,125˚C52LQFP25MHzFinal GC16 using GC16 die
MC9S12GC16MFU25TBD-40˚C, 125˚C80QFP25MHzFinal GC16 using GC16 die
1. For the GC16 refer to the 16K flash, for the C32 and GC32 refer to the 32K flash, for the C64 and GC64 the 64K flash, for
the C96 the 96K flash and C128 the 128K flash document.
2. Not available on the GC-Family members
1
CPU12 Reference ManualV02S12CPUV2/D
HCS12 Debug (DBG) Block GuideV01S12DBGV1/D
HCS12 Interrupt (INT) Block GuideV01S12INTV1/D
Voltage Regulator (VREG) Block GuideV02S12VREG3V3V2/D
Oscillator (OSC) Block GuideV02S12OSCV2/D
VersionDocument Order Number
2
V02S12MSCANV2/D
Terminology
Acronyms and Abbreviations
New or invented terms, symbols, and notations
21
Device User Guide — 9S12C128DGV1/D V01.05
22
Device User Guide — 9S12C128DGV1/D V01.05
Section 1 Introduction
1.1 Overview
The MC9S12C-Family and the MC9S12GC-Family is a 48/52/80 pin Flash-based Industrial/Automotive
network control MCU family. Members of the MC9S12C-Family and the MC9S12GC-Family deliver the
power and flexibility of our 16 Bit core (CPU12) family to a whole new range of cost and space sensitive,
general purpose Industrial and Automotive network applications. All MC9S12C-Family and
MC9S12GC-Family members are comprised of standard on-chip peripherals including a 16-bit central
processing unit (CPU12), up to 128K bytes of Flash EEPROM, up to 4K bytes of RAM, an asynchronous
serial communications interface (SCI), a serial peripheral interface (SPI), an 8-channel 16-bit timer
module (TIM), a 6-channel 8-bit Pulse Width Modulator (PWM), an 8-channel, 10-bit analog-to-digital
converter (ADC). The MC9S12C-Family members also feature a CAN 2.0 A, B software compatible
module (MSCAN12). The MC9S12C-Family as well as the MC9S12GC-Family has full 16-bit data paths
throughout. The inclusion of a PLL circuit allows power consumption and performance to be adjusted to
suit operational requirements. In addition to the I/O ports available in each module, up to 10 dedicated I/O
port bits are available with Wake-Up capability from STOP or WAIT mode. The MC9S12C-Family and
the MC9S12GC-Family devices are available in 48, 52 and 80 pin QFP packages, with the 80 Pin version
pin compatible to the HCS12 A, B and D- Family derivatives.
1.2 Features
•16-bit HCS12 CORE
–HCS12 CPU
i. Upward compatible with M68HC11 instruction set
ii. Interrupt stacking and programmer’s model identical to M68HC11
iii.Instruction queue
iv.Enhanced indexed addressing
–MMC (memory map and interface)
–INT (interrupt control)
–BDM (background debug mode)
–DBG12 (enhanced debug12 module, including breakpoints and change-of-flow trace buffer)
–MEBI: Multiplexed Expansion Bus Interface (available only in 80 pin package version)
•Wake-up interrupt inputs
–Up to 12-port bits available for wake up interrupt function with digital filtering
•Memory options
–16K or 32KByte Flash EEPROM (erasable in 512-byte sectors)
64K, 96K or 128KByte Flash EEPROM (erasable in 1024-byte sectors)
•Available on MC9S12C-Family:
One 1M bit per second, CAN 2.0 A, B software compatible module
–Five receive and three transmit buffers
–Flexible identifier filter programmable as 2 x 32 bit, 4 x 16 bit or 8x8bit
–Four separate interrupt channels for Rx, Tx, error and wake-up
–Low-pass filter wake-up function
–Loop-back for self test operation
•Timer Module (TIM)
–8-Channel Timer
–Each Channel Configurable as either Input Capture or Output Compare
–Simple PWM Mode
–Modulo Reset of Timer Counter
–16-Bit Pulse Accumulator
–External Event Counting
–Gated Time Accumulation
•6 PWM channels
–Programmable period and duty cycle
–8-bit 6-channel or 16-bit 3-channel
–Separate control for each pulse width and duty cycle
–Center-aligned or left-aligned outputs
–Programmable clock select logic with a wide range of frequencies
–Fast emergency shutdown input
•Serial interfaces
–One asynchronous serial communications interface (SCI)
–One synchronous serial peripheral interface (SPI)
–Pierce or low current Colpitts oscillator
–Phase-locked loop clock frequency multiplier
–Limp home mode in absence of external clock
–Low power 0.5 to 16 MHz crystal oscillator reference clock
•Operating frequency
–32MHz equivalent to 16MHz Bus Speed for single chip
–32MHz equivalent to 16MHz Bus Speed in expanded bus modes
–Option of 9S12C-Family: 50MHz equivalent to 25MHz Bus Speed
–All 9S12GC-Family Members allow a 50MHz operting frequency.
•Internal 2.5V Regulator
–Supports an input voltage range from 2.97V to 5.5V
–Low power mode capability
–Includes low voltage reset (LVR) circuitry
–Includes low voltage interrupt (LVI) circuitry
•48-Pin LQFP, 52-Pin LQFP or 80-Pin QFP package
–Up to 58 I/O lines with 5V input and drive capability (80 pin package)
–Up to 2 dedicated 5V input only lines (IRQ, XIRQ)
–5V 8 A/D converter inputs and 5V I/O
•Development support
–Single-wire background debug™ mode (BDM)
–On-chip hardware breakpoints
–Enhanced DBG12 debug features
1.3 Modes of Operation
User modes (Expanded modes are only available in the 80 pin package version).