Motorola reserves the right to make changes without further notice to any products herein to improve reliability, function or
design. Motorola does not assume any liability arising out of the application or use of any product or circuit described herein;
neither does it convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where
personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized
application,Buyershallindemnify andhold Motorolaand itsofficers, employees,subsidiaries, affiliates,and distributorsharmless
against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly orindirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was
negligent regarding the design or manufacture of the part.
1
Revision History
DOCUMENT NUMBER
9S12DT256DGV3/D
Version
Number
V03.00
V03.01
V03.02
V03.03
V03.04
V03.05
V03.06
V03.07
Revision
Date
24 March
2003
30 June
2003
24 July
2003
26 July
2003
15 March
2004
4 April
2005
12 Oct
2005
02 Jan
2006
Effective
Date
AuthorDescription of Changes
Initial version for Maskset L91N , based on MC9S12DP256B
V02.11.
•added new HCS12 core documentation
•added cumulative program/erase cyclelimitation
to Table A-12 for EEPROM
•updated Table 0-2 Document References
•removed cumulative program/erase cycle
limitation from Table A-12 for EEPROM
•added LRAE generic load and execute info to
section 15
•Added MC9S12DT256 in QFP 80 to Table 0-1
•Added Masksets 0L01Y and 4L91N
•Changed NVM data retention specification
Table A-12
•CorrectedFlashBurst ProgrammingTimeTable
A-11,
•NVM Reliability Spec Table A-12,Figure A-2
•CorrectedFlashBurst ProgrammingTimeTableA-11,
Motorola reserves the right to make changes without further notice to any products herein to improve reliability, function or
design. Motorola does not assume any liability arising out of the application or use of any product or circuit described herein;
neither does it convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where
personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized
application,Buyer shallindemnify andhold Motorolaand itsofficers, employees,subsidiaries, affiliates,and distributorsharmless
against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly orindirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was
negligent regarding the design or manufacture of the part.
2
MC9S12DT256 Device User Guide — 9S12DT256DGV3/D V03.07
3
MC9S12DT256 Device User Guide — 9S12DT256DGV3/D V03.074MC9S12DT256 Device User Guide — V03.07
The following figure provides an ordering number example for the MC9S12H-Family devices.
MC9S12 DT256C FU
Package Option
Temperature Option
Temperature Options
C = -40˚C to85˚C
V = -40˚C to 105˚C
M = -40˚C to 125˚C
Device Title
Package Options
Controller Family
FU =80QFP
PV = 112 LQFP
Figure 0-1 Order Partnumber Example
15
MC9S12DT256 Device User Guide — V03.07
The following items should be considered when using a derivative (Table 0-1):
•Registers
–Do not write or read CAN0 registers (after reset: address range $0140 - $017F), if using a
derivative without CAN0.
–Do not write or read CAN1registers (after reset: address range $0180 - $01BF), if using a
derivative without CAN1.
–Do not write or read CAN4 registers (after reset: address range $0280 - $02BF), if using a
derivative without CAN4.
–Do not write or read BDLC registers (after reset: address range $00E8 - $00EF), if using a
derivative without BDLC.
•Interrupts
–Fill the four CAN0 interrupt vectors ($FFB0 - $FFB7) according to your coding policies for
unused interrupts, if using a derivative without CAN0.
–Fill the four CAN1 interrupt vectors ($FFA8 - $FFAF) according to your coding policies for
unused interrupts, if using a derivative without CAN1.
–Fill the four CAN4 interrupt vectors ($FF90 - $FF97) according to your coding policies for
unused interrupts, if using a derivative without CAN4.
–Fill the BDLC interrupt vector ($FFC2, $FFC3) according to your coding policies for unused
interrupts, if using a derivative without BDLC.
•Ports
–The CAN0 pin functionality (TXCAN0, RXCAN0) is not available on port PJ7, PJ6, PM5,
PM4, PM3, PM2, PM1 and PM0, if using a derivative without CAN0.
–The CAN1 pin functionality (TXCAN1, RXCAN1) is not available on port PM3 and PM2, if
using a derivative without CAN1.
–The CAN4 pin functionality (TXCAN4, RXCAN4) is not available on port PJ7, PJ6, PM5,
PM7, PM6, PM5 and PM4, if using a derivative without CAN0.
–The BDLC pin functionality (TXB, RXB) is not available on port PM1 and PM0, if using a
derivative without BDLC.
–Do not write MODRR1 and MODRR0 bits of Module Routing Register (PIM_9DP256 Block
Guide), if using a derivative without CAN0.
–Do not write MODRR3 and MODRR2 bits of Module Routing Register (PIM_9DP256 Block
Guide), if using a derivative without CAN4.
Document References
16
MC9S12DT256 Device User Guide — V03.07
The Device Guide provides information about the MC9S12DT256 device made up of standard HCS12
blocks and the HCS12 processor core.
This document is part of the customer documentation. A complete set of device manuals also includes the
HCS12 Core User Guide and all the individual Block Guides of the implemented modules. In a effort to
reduce redundancy all module specific information is located only in the respective Block Guide. If
applicable, special implementation details of the module are given in the block description sections of this
document.
See Table 0-2 for names and versions of the referenced documents throughout the Device User Guide.
Table 0-2 Document References
User GuideVersionDocument Order Number
CPU12 Reference ManualV04CPU12RM/AD
HCS12 Multiplexed External Bus Interface (MEBI) Block GuideV03S12MEBIV3/D
HCS12 Module Mapping Control (MMC) Block GuideV04S12MMCV4/D
The state of PK7/ROMCTL is latched into ROMON Bit during RESET into
Emulation Mode or Normal Expanded Mode
17
MC9S12DT256 Device User Guide — V03.07
Table 0-3 Specification Change Summary for Maskset L91N
BlockSpec Change
EETS4K/FTS256KReliability Specification for Non Volatile Memories
PIM_9DP256CAN0 can be routed to PORTJ
18
MC9S12DT256 Device User Guide — V03.07
Section 1 IntroductionMC9S12DT256
1.1 Overview
The MC9S12DT256 microcontroller unit (MCU) is a 16-bit device composed of standard on-chip
peripherals including a 16-bit central processing unit(HCS12 CPU), 256K bytes of Flash EEPROM, 12K
bytes of RAM, 4K bytes of EEPROM, two asynchronous serial communications interfaces (SCI), three
serial peripheral interfaces (SPI), an 8-channel IC/OC enhanced capture timer, two 8-channel, 10-bit
analog-to-digital converters(ADC),an 8-channel pulse-width modulator(PWM),a digital Byte Data Link
Controller (BDLC), 29 discrete digital I/O channels (Port A, Port B, Port K and Port E), 20 discrete digital
I/O lines with interrupt and wakeup capability, three CAN 2.0 A, B software compatible modules
(MSCAN12), and an Inter-IC Bus. The MC9S12DT256 has full 16-bit data paths throughout. However,
the external bus can operate in an 8-bit narrow mode so single 8-bit wide memory can be interfaced for
lower cost systems. The inclusion of a PLL circuit allows power consumption and performance to be
adjusted to suit operational requirements.
1.2 Features
•HCS12 Core
–16-bit HCS12 CPU
i. Upward compatible with M68HC11 instruction set
ii. Interrupt stacking and programmer’s model identical to M68HC11
iii.Instruction queue
•Three 1M bit per second, CAN 2.0 A, B software compatible modules
–Five receive and three transmit buffers
–Flexible identifier filter programmable as 2 x 32 bit, 4 x 16 bit or 8 x 8 bit
–Four separate interrupt channels for Rx, Tx, error and wake-up
–Low-pass filter wake-up function
–Loop-back for self test operation
•Enhanced Capture Timer
–16-bit main counter with 7-bit prescaler
–8 programmable input capture or output compare channels
–Four 8-bit or two 16-bit pulse accumulators
•8 PWM channels
–Programmable period and duty cycle
–8-bit 8-channel or 16-bit 4-channel
–Separate control for each pulse width and duty cycle
–Center-aligned or left-aligned outputs
–Programmable clock select logic with a wide range of frequencies
–Fast emergency shutdown input
–Usable as interrupt inputs
•Serial interfaces
–Two asynchronous Serial Communications Interfaces (SCI)
–Three Synchronous Serial Peripheral Interface (SPI)
•Byte Data Link Controller (BDLC)
–SAE J1850 Class B Data Communications Network Interface Compatible and ISO Compatible
for Low-Speed (<125 Kbps) Serial Data Communications in Automotive Applications
•Inter-IC Bus (IIC)
20
–Compatible with I2C Bus standard
–Multi-master operation
–Software programmable for one of 256 different serial clock frequencies
•112-Pin LQFP package
–I/O lines with 5V input and drive capability
–5V A/D converter inputs
–Operation at 50MHz equivalent to 25MHz Bus Speed
–Development support
–Single-wire background debug™ mode (BDM)
–On-chip hardware breakpoints
•Special Operating Modes
–Special Single-Chip Mode with active Background Debug Mode
–Special Test Mode (Motorola use only)
–Special Peripheral Mode (Motorola use only)
Low power modes
•Stop Mode
•Pseudo Stop Mode
•Wait Mode
21
MC9S12DT256 Device User Guide — V03.07
1.4 Block Diagram
Figure 1-1 shows a block diagram of the MC9S12DT256 device.
22
MC9S12DT256 Device User Guide — V03.07
Figure 1-1 MC9S12DT256 Block Diagram
VDDR
VSSR
VREGEN
VDD1,2
VSS1,2
BKGD
XFC
VDDPLL
VSSPLL
EXTAL
XTAL
RESET
PE0
PE1
PE2
PE3
PE4
PE5
PE6
PE7
TEST
Multiplexed
Wide Bus
Multiplexed
Narrow Bus
Internal Logic 2.5V
VDD1,2
VSS1,2
PLL 2.5V
VDDPLL
VSSPLL
256K Byte Flash EEPROM
12K Byte RAM
4K Byte EEPROM
Voltage Regulator
Single-wire Background
Debug Module
Clock and
Reset
PLL
Generation
Module
XIRQ
IRQ
W
R/
LSTRB
DDRE
ECLK
MODA
MODB
NOACC/
XCLKS
PTE
Multiplexed Address/Data Bus
DDRADDRB
PTAPTB
PA4
PA3
PA2
PA1
ADDR11
ADDR10
ADDR9
DATA11
DATA10
DATA9
DATA3
DATA2
DATA1
PA0
ADDR8
DATA8
DATA0
PA7
PA6
PA5
ADDR15
ADDR14
ADDR13
DATA15
DATA14
DATA13
DATA7
DATA6
DATA5
ADDR12
DATA12
DATA4
I/O Driver 5V
VDDX
VSSX
A/D Converter 5V &
Voltage Regulator Reference
VDDA
VSSA
Voltage Regulator 5V & I/O
VDDR
VSSR
CPU12
Periodic Interrupt
COP Watchdog
Clock Monitor
Breakpoints
System
Integration
Module
(SIM)
PB4
PB6
PB5
ADDR6
ADDR5
DATA6
DATA5
PB3
ADDR4
ADDR3
DATA4
DATA3
PB7
ADDR7
DATA7
PB2
PB1
ADDR2
ADDR1
DATA2
DATA1
ATD0
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
Enhanced Capture
Timer
SCI0
SCI1
SPI0
BDLC
(J1850)
CAN0
PB0
CAN1
ADDR0
CAN4
DATA0
IIC
PWM
SPI1
SPI2
VRH
VRL
VDDA
VSSA
PPAGE
MISO
MOSI
SCK
RXB
TXB
RXCAN
TXCAN
RXCAN
TXCAN
RXCAN
TXCAN
SDA
SCL
PWM0
PWM1
PWM2
PWM3
PWM4
PWM5
PWM6
PWM7
MISO
MOSI
SCK
MISO
MOSI
SCK
SS
SS
SS
AD0
ATD1
PAD00
PAD01
PAD02
PAD03
PAD04
PAD05
PAD06
PAD07
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
PIX0
PIX1
PIX2
PIX3
PIX4
PIX5
ECS
IOC0
IOC1
IOC2
IOC3
IOC4
IOC5
IOC6
IOC7
RXD
TXD
RXD
TXD
Module to Port Routing
KWJ0
KWJ1
KWJ6
KWJ7
KWP0
KWP1
KWP2
KWP3
KWP4
KWP5
KWP6
KWP7
KWH0
KWH1
KWH2
KWH3
KWH4
KWH5
KWH6
KWH7
VRH
VRL
VDDA
VSSA
DDRK
DDRT
DDRS
DDRM
DDRJ
DDRP
DDRH
AD1
PTK
PTT
PTS
PTM
PTJ
PTP
PTH
VRH
VRL
VDDA
VSSA
PAD08
PAD09
PAD10
PAD11
PAD12
PAD13
PAD14
PAD15
PK0
PK1
PK2
PK3
PK4
PK5
PK7
PT0
PT1
PT2
PT3
PT4
PT5
PT6
PT7
PS0
PS1
PS2
PS3
PS4
PS5
PS6
PS7
PM0
PM1
PM2
PM3
PM4
PM5
PM6
PM7
PJ0
PJ1
PJ6
PJ7
PP0
PP1
PP2
PP3
PP4
PP5
PP6
PP7
PH0
PH1
PH2
PH3
PH4
PH5
PH6
PH7
XADDR14
XADDR15
XADDR16
XADDR17
XADDR18
XADDR19
ECS
Signals shown in Bold are not available on the 80 Pin Package
reset the bottom 1k of the EEPROM ($0000 - $03FF) are hidden by the register space.
Table 1-1 Device Memory Map
AddressModule
$0000 - $0017
$0018 - $0019
$001A - $001B
$001C - $001F
$0020 - $0027
$0028 - $002F
$0030 - $0033
$0034 - $003F
$0040 - $007F
$0080 - $009F
$00A0 - $00C7
$00C8 - $00CF
$00D0 - $00D7
$00D8 - $00DF
$00E0 - $00E7
$00E8 - $00EF
$00F0 - $00F7
$00F8 - $00FF
$0100- $010F
$0110 - $011B
$011C - $011F
$0120 - $013F
$0140 - $017F
$0180 - $01BF
$01C0 - $01FF Reserved64
$0200 - $023F
$0240 - $027F Port Integration Module (PIM)64
$0280 - $02BF
$02C0 - $03FF
$0000 - $0FFF
CORE (Ports A, B, E, Modes, Inits, Test)
Reserved
Device ID register (PARTID)
CORE (MEMSIZ, IRQ, HPRIO)
Reserved
CORE (Background Debug Mode)
CORE (PPAGE, Port K)
Clock and Reset Generator (PLL, RTI, COP)
Enhanced Capture Timer 16-bit 8 channels
Analog to Digital Converter 10-bit 8 channels (ATD0)
Pulse Width Modulator 8-bit 8 channels (PWM)
Serial Communications Interface (SCI0)
Serial Communications Interface (SCI1)
Serial Peripheral Interface (SPI0)
Inter IC Bus
Byte Data Link Controller (BDLC)
Serial Peripheral Interface (SPI1)
Serial Peripheral Interface (SPI2)
Flash Control Register
EEPROM Control Register
Reserved
Analog to Digital Converter 10-bit 8 channels (ATD1)
Motorola Scalable Can (CAN0)
Motorola Scalable Can (CAN1)
Reserved
Motorola Scalable Can (CAN4)
Reserved
EEPROM array
Size
(Bytes)
24
12
64
32
40
16
12
32
64
64
64
64
320
4096
2
2
4
8
8
4
8
8
8
8
8
8
8
4
24
MC9S12DT256 Device User Guide — V03.07
Table 1-1 Device Memory Map
AddressModule
$1000 - $3FFF
$4000 - $7FFF
$8000 - $BFFF
$C000 - $FFFF
RAM array
Fixed Flash EEPROM array
incl. 0.5K, 1K, 2K or 4K Protected Sector at start
Flash EEPROM Page Window
Fixed Flash EEPROM array
incl. 0.5K, 1K, 2K or 4K Protected Sector at end
and 256 bytes of Vector Space at $FF80 - $FFFF
Size
(Bytes)
12288
16384
16384
16384
25
MC9S12DT256 Device User Guide — V03.07
Figure 1-2 MC9S12DT256 Memory Map
$0000
$0400
$1000
$4000
$8000
EXTERN
$0000
$03FF
$0000
$0FFF
$1000
$3FFF
$4000
$7FFF
$8000
REGISTERS
(Mappable to any 2k Block
within the first 32K)
4K Bytes EEPROM
(Mappable to any 4K Block)
12K Bytes RAM
(Mappable to any 16K
and alignable to top or
bottom)
16K Fixed Flash
Page $3E = 62
(This is dependant on the
state of the ROMHM bit)
16K Page Window
16 x 16K Flash EEPROM
pages
$C000
$FF00
$FFFF
VECTORS
EXPANDED*
* Assuming that a ‘0’ was driven onto port K bit 7 during MCU
is reset into normal expanded wide or narrow mode.
VECTORS
NORMAL
SINGLE CHIP
SINGLE CHIP
VECTORS
SPECIAL
$BFFF
$C000
16K Fixed Flash
Page $3F = 63
$FFFF
$FF00
BDM
(if active)
$FFFF
26
MC9S12DT256 Device User Guide — V03.07
1.6 Detailed Register Map
The following tables show the detailed register map of the MC9S12DT256.
The part ID is located in two 8-bit registers PARTIDH and PARTIDL (addresses $001A and $001B after
reset). The read-only value is a uniquepartIDforeachrevisionof the chip. Table 1-3showstheassigned
part ID number.
1. The coding is as follows:
Bit 15-12: Major family identifier
Bit 11-8: Minor family identifier
Bit 7-4: Major mask set revision number including FAB transfers
Bit 3-0: Minor - non full - mask set revision
Part ID
1
$0030
The device memory sizes are located in two 8-bit registers MEMSIZ0 and MEMSIZ1 (addresses $001C
and $001D after reset). Table 1-4 shows the read-only values of these registers. Refer to section Module
Mapping and Control (MMC) of HCS12 Core User Guide for further details.
Table 1-4 Memory size registers
Register nameValue
MEMSIZ0
MEMSIZ1
$25
$81
50
MC9S12DT256 Device User Guide — V03.07
Section 2 Signal Description
This section describes signals that connect off-chip. It includes a pinout diagram, a table of signal
properties, and detailed discussion of signals. It is built from the signal description sections of the Block
User Guides of the individual IP blocks on the device.
2.1 Device Pinout
The MC9S12DT256/MC9S12DJ256/MC9S12DG256 and MC9S12A256 is available in a 112-pin low
profile quad flat pack (LQFP) andMC9S12DJ256/MC9S12DG256andMC9S12A256is also available in
a 80-pin quad flat pack (QFP). Most pins perform two or more functions, as described in the Signal
Descriptions. Figure 2-1 and Figure 2-2 show the pin assignments.
Figure 2-2 Pin Assignments in 80-pin QFP for MC9S12DJ256
2.2 Signal Properties Summary
Table 2-1summarizes the pin functionality. Signalsshownin bold are not available in the 80 pin package.
Table 2-1 Signal Properties
53
MC9S12DT256 Device User Guide — V03.07
Internal Pull
Pin Name
Funct. 1
EXTAL————VDDPLLNANA
XTAL————VDDPLLNANA
RESET————VDDR
TEST————N.A.NANATest Input
VREGEN————VDDXNANA
XFC————VDDPLLNANA
BKGD
PAD[15]AN1[7]ETRIG1——VDDA
PAD[14:8]AN1[6:0]———VDDA
PAD[7]AN0[7]ETRIG0——VDDA
PAD[6:0]AN0[6:0]———VDDA
PA[7:0]
PB[7:0]
PE7NOACC
PE6IPIPE1MODB——VDDR
PE5IPIPE0MODA——VDDR
PE4ECLK———VDDR
PE3
PE2R/
PE1
PE0
PH7KWH7SS2——VDDR
PH6KWH6SCK2——VDDR
PH5KWH5MOSI2——VDDR
Pin Name
Funct. 2
TAGHIMODC——VDDR
ADDR[15:8]/
DATA[15:8]
ADDR[7:0]/
DATA[7:0]
LSTRBTAGLO——VDDR
W———VDDR
IRQ———VDDRPUCRUp
XIRQ———VDDRPUCRUp
Pin Name
Funct. 3
———VDDR
———VDDR
XCLKS——VDDR
Pin Name
Funct. 4
Pin Name
Funct. 5
Power
Supply
Resistor
CTRL
NoneNoneExternal Reset
Always
Up
NoneNone
NoneNone
NoneNone
NoneNone
PUCRDisabledPort A I/O, Multiplexed Address/Data
PUCRDisabledPort B I/O, Multiplexed Address/Data
PUCRUpPort E I/O, Access, Clock Select
While
While RESET
PUCRUpPort E I/O, Bus Clock Output
PUCRUpPort E I/O, Byte Strobe, Tag Low
PUCRUpPort E I/O, R/
PERH/
PPSH
PERH/
PPSH
PERH/
PPSH
Reset
State
Oscillator Pins
Voltage Regulator Enable Input
PLL Loop Filter
Up
RESET
pin is low:
Down
pin is low:
Down
Disabled Port H I/O, Interrupt,
Disabled Port H I/O, Interrupt, SCK of SPI2
Disabled Port H I/O, Interrupt, MOSI of SPI2
Background Debug, Tag High, Mode
Input
Port AD Input, Analog Input AN7
of ATD1, External Trigger Input of
ATD1
Port AD Inputs, Analog Inputs
AN[6:0] of ATD1
Port AD Input, Analog Input AN7 of
ATD0, External Trigger Input of ATD0
Port AD Inputs, Analog Inputs
AN[6:0] of ATD0
Port E I/O, Pipe Status, Mode Input
Port E I/O, Pipe Status, Mode Input
Port E Input, Maskable Interrupt
Port E Input, Non Maskable Interrupt
Description
W in expanded modes
SS of SPI2
54
Pin Name
Funct. 1
PH4KWH4MISO2——VDDR
PH3KWH3
PH2KWH2SCK1——VDDR
PH1KWH1MOSI1——VDDR
PH0KWH0MISO1——VDDR
PJ7KWJ7TXCAN4SCLTXCAN0VDDX
PJ6KWJ6RXCAN4SDARXCAN0VDDX
PJ[1:0]KWJ[1:0]———VDDX
PK7ECSROMONE——VDDX
PK[5:0]
PM7TXCAN4———VDDX
PM6RXCAN4———VDDX
PM5TXCAN0TXCAN4SCK0—VDDX
PM4RXCAN0RXCAN4MOSI0—VDDX
PM3TXCAN1TXCAN0—
PM2RXCAN1RXCAN0—MISO0VDDX
PM1TXCAN0TXB——VDDX
PM0RXCAN0RXB——VDDX
PP7KWP7PWM7SCK2—VDDX
PP6KWP6PWM6
PP5KWP5PWM5MOSI2—VDDX
Pin Name
Funct. 2
XADDR
[19:14]
Pin Name
Funct. 3
SS1——VDDR
———VDDX
Pin Name
Funct. 4
SS2—VDDX
Pin Name
Funct. 5
SS0VDDX
Power
Supply
MC9S12DT256 Device User Guide — V03.07
Internal Pull
Resistor
CTRL
PERH/
PPSH
PERH/
PPSH
PERH/
PPSH
PERH/
PPSH
PERH/
PPSH
PERJ/
PPSJ
PERJ/
PPSJ
PERJ/
PSJ
PUCRUp
PUCRUpPort K I/O, Extended Addresses
PERM/
PPSM
PERM/
PPSM
PERM/
PPSM
PERM/
PPSM
PERM/
PPSM
PERM/
PPSM
PERM/
PPSM
PERM/
PPSM
PERP/
PPSP
PERP/
PPSP
PERP/
PPSP
Reset
State
Disabled Port H I/O, Interrupt, MISO of SPI2
Disabled Port H I/O, Interrupt,
Disabled Port H I/O, Interrupt, SCK of SPI1
Disabled Port H I/O, Interrupt, MOSI of SPI1
Disabled Port H I/O, Interrupt, MISO of SPI1
Up
Up
UpPort J I/O, Interrupts
Disabled Port M I/O, TX of CAN4
Disabled Port M I/O RX of CAN4
Disabled
Disabled
Disabled
Disabled
DisabledPort M I/O, TX of CAN0, TX of BDLC
DisabledPort MI/O, RX of CAN0, RX ofBDLC
Disabled
Disabled
Disabled
Port J I/O, Interrupt, TX of CAN4,
SCL of IIC, TX of CAN0
Port J I/O, Interrupt, RX of CAN4,
SDA of IIC, RX of CAN0
Port K I/O, Emulation Chip Select,
ROM On Enable
Port M I/OCAN0, CAN4, SCK of
SPI0
Port M I/O, CAN0, CAN4, MOSI of
SPI0
Port M I/O, TX of CAN1, CAN0,
of SPI0
Port M I/O, RX of CAN1, CAN0,
MISO of SPI0
Port P I/O, Interrupt, Channel 7 of
PWM, SCK of SPI2
Port P I/O, Interrupt, Channel 6 of
PWM,
Port P I/O, Interrupt, Channel 5 of
PWM, MOSI of SPI2
Description
SS of SPI1
SS of SPI2
SS
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MC9S12DT256 Device User Guide — V03.07
Pin Name
Funct. 1
PP4KWP4PWM4MISO2—VDDX
PP3KWP3PWM3
PP2KWP2PWM2SCK1—VDDX
PP1KWP1PWM1MOSI1—VDDX
PP0KWP0PWM0MISO1—VDDX
PS7
PS6SCK0———VDDX
PS5MOSI0———VDDX
PS4MISO0———VDDX
PS3TXD1———VDDX
PS2RXD1———VDDX
PS1TXD0———VDDX
PS0RXD0———VDDX
PT[7:0]IOC[7:0]———VDDX
Pin Name
Funct. 2
SS0———VDDX
Pin Name
Funct. 3
Pin Name
Funct. 4
SS1—VDDX
Pin Name
Funct. 5
Power
Supply
Internal Pull
Resistor
CTRL
PERP/
PPSP
PERP/
PPSP
PERP/
PPSP
PERP/
PPSP
PERP/
PPSP
PERS/
PPSS
PERS/
PPSS
PERS/
PPSS
PERS/
PPSS
PERS/
PPSS
PERS/
PPSS
PERS/
PPSS
PERS/
PPSS
PERT/
PPST
Reset
State
Disabled
Disabled
Disabled
Disabled
Disabled
UpPort S I/O,
UpPort S I/O, SCK of SPI0
UpPort S I/O, MOSI of SPI0
UpPort S I/O, MISO of SPI0
UpPort S I/O, TXD of SCI1
UpPort S I/O, RXD of SCI1
UpPort S I/O, TXD of SCI0
UpPort S I/O, RXD of SCI0
DisabledPort T I/O, Timer channels
Port P I/O, Interrupt, Channel 4 of
PWM, MISO2 of SPI2
Port P I/O, Interrupt, Channel 3 of
PWM,
Port P I/O, Interrupt, Channel 2 of
PWM, SCK of SPI1
Port P I/O, Interrupt, Channel 1 of
PWM, MOSI of SPI1
Port P I/O, Interrupt, Channel 0 of
PWM, MISO2 of SPI1
Description
SS of SPI1
SS of SPI0
2.3 Detailed Signal Descriptions
2.3.1 EXTAL, XTAL — Oscillator Pins
EXTAL andXTALare the crystal driver and externalclockpins.On reset all the device clocksarederived
from the EXTAL input frequency. XTAL is the crystal output.
2.3.2 RESET — External Reset Pin
An active low bidirectional control signal, it acts as an input to initialize the MCU to a known start-up
state, and an output when an internal MCU function causes a reset.
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MC9S12DT256 Device User Guide — V03.07
2.3.3 TEST — Test Pin
This input only pin is reserved for test.
NOTE:The TEST pin must be tied to VSS in all applications.
2.3.4 VREGEN — Voltage Regulator Enable Pin
This input only pin enables or disables the on-chip voltage regulator.
2.3.5 XFC — PLL Loop Filter Pin
PLL loop filter. Please ask your Motorola representative for the interactive application note to compute
PLL loop filter elements. Any current leakage on this pin must be avoided.
XFC
R
MCU
0
C
S
C
P
VDDPLLVDDPLL
Figure 2-3 PLL Loop Filter Connections
2.3.6 BKGD / TAGHI / MODC — Background Debug, Tag High, and Mode Pin
The BKGD/TAGHI/MODC pin is used as a pseudo-open-drain pin for the background debug
communication. In MCU expanded modes of operation when instruction tagging is on, an input low on
this pin during the falling edge of E-clock tags the high half of the instruction word being read into the
instruction queue. It is used as a MCU operating mode select pin during reset. The state of this pin is
latched to the MODC bit at the rising edge of
RESET. This pin has a permanently enabled pull-up device.
2.3.7 PAD15 / AN15 / ETRIG1 — Port AD Input Pin of ATD1
PAD15 is a general purpose input pin and analog input AN7 of the analog to digital converter ATD1. It
can act as an external trigger input for the ATD1.
2.3.8 PAD[14:08] / AN[14:08] — Port AD Input Pins of ATD1
PAD14 - PAD08 are general purpose input pins and analog inputs AN[6:0] of the analog to digital
converter ATD1.
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2.3.9 PAD7 / AN07 / ETRIG0 — Port AD Input Pin of ATD0
PAD7 is a general purpose input pin andanalog input AN7 of the analog to digital converter ATD0. Itcan
act as an external trigger input for the ATD0.
2.3.10 PAD[06:00] / AN[06:00] — Port AD Input Pins of ATD0
PAD06 - PAD00 are general purpose input pins and analog inputs AN[6:0] of the analog to digital
converter ATD0.
2.3.11 PA[7:0] / ADDR[15:8] / DATA[15:8] — Port A I/O Pins
PA7-PA0 are general purpose input or output pins. In MCU expanded modes of operation, these pins are
used for the multiplexed external address and data bus.
2.3.12 PB[7:0] / ADDR[7:0] / DATA[7:0] — Port B I/O Pins
PB7-PB0 are general purpose input or output pins. In MCU expanded modes of operation, these pins are
used for the multiplexed external address and data bus.
2.3.13 PE7 / NOACC / XCLKS — Port E I/O Pin 7
PE7 is a general purpose input or output pin. During MCU expanded modes of operation, the NOACC
signal, when enabled, is used to indicate that the current bus cycle is an unused or “free” cycle. This signal
will assert when the CPU is not using the bus.The
crystal in combination with the internal Colpitts (low power) oscillator is used or whether Pierce
oscillator/external clock circuitry is used. The state of this pin is latched at the rising edge of
the input is a logic low the EXTAL pin is configured for an external clock drive or a Pierce Oscillator. If
input is a logic high a Colpitts oscillator circuit is configured on EXTAL and XTAL. Since this pin is an
input with a pull-up device during reset, if the pin is left floating, the default configuration is a Colpitts
oscillator circuit on EXTAL and XTAL.
* Due to the nature of a translated ground Colpitts oscillator a
DC voltage bias is applied to the crystal
.Please contact the crystal manufacturer for crystal DC
C
1
Crystal or
ceramic resonator
C
2
VSSPLL
Figure 2-5 Pierce Oscillator Connections (PE7=0)
EXTAL
C
1
MCU
XTAL
* Rs can be zero (shorted) when use with higher frequency crystals.
Refer to manufacturer’s data.
R
B
*
R
S
Crystal or
ceramic resonator
C
2
VSSPLL
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Figure 2-6 External Clock Connections (PE7=0)
MCU
EXTAL
XTAL
not connected
CMOS-COMPATIBLE
EXTERNAL OSCILLATOR
(VDDPLL-Level)
2.3.14 PE6 / MODB / IPIPE1 — Port E I/O Pin 6
PE6 is a general purpose input or output pin. It is used as a MCU operating mode select pin during reset.
The state of this pin is latched to the MODB bit at the rising edge of
RESET. This pin is shared with the
instruction queue tracking signalIPIPE1.Thispinis an input with a pull-down device which is only active
RESET is low.
when
2.3.15 PE5 / MODA / IPIPE0 — Port E I/O Pin 5
PE5 is a general purpose input or output pin. It is used as a MCU operating mode select pin during reset.
The state of this pin is latched to the MODA bit at the rising edge of
RESET. This pin is shared with the
instruction queue tracking signalIPIPE0.Thispinis an input with a pull-down device which is only active
RESET is low.
when
2.3.16 PE4 / ECLK — Port E I/O Pin 4
PE4 is a general purpose input or output pin. It can be configured to drive the internal bus clock ECLK.
ECLK can be used as a timing reference.
2.3.17 PE3 / LSTRB / TAGLO — Port E I/O Pin 3
PE3 is a general purpose input or output pin. In MCU expanded modes of operation, LSTRB can be used
for the low-byte strobe function to indicate the type of bus access and when instruction tagging is on,
TAGLO is used to tag the low half of the instruction word being read into the instruction queue.
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2.3.18 PE2 / R/W—Port E I/O Pin 2
PE2 is a general purpose input or output pin. In MCU expanded modes of operations, this pin drives the
read/write output signal for the external bus. It indicates the direction of data on the external bus.
2.3.19 PE1 / IRQ — Port E Input Pin 1
PE1 is a general purpose input pin and the maskable interrupt request input that provides a means of
applying asynchronous interrupt requests. This will wake up the MCU from STOP or WAIT mode.
2.3.20 PE0 / XIRQ — Port E Input Pin 0
PE0 is a general purpose input pin and the non-maskable interrupt request input that provides a means of
applying asynchronous interrupt requests. This will wake up the MCU from STOP or WAIT mode.
2.3.21 PH7 / KWH7 / SS2 — Port H I/O Pin 7
PH7isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode. It can be configured as slave select pin
2 (SPI2).
SS of the Serial Peripheral Interface
2.3.22 PH6 / KWH6 / SCK2 — Port H I/O Pin 6
PH6isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
toexitSTOP or WAIT mode.It can be configuredas serial clock pinSCKof the SerialPeripheralInterface
2 (SPI2).
2.3.23 PH5 / KWH5 / MOSI2 — Port H I/O Pin 5
PH5isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode. It can be configured as master output (during master mode) or slave input
pin (during slave mode) MOSI of the Serial Peripheral Interface 2 (SPI2).
2.3.24 PH4 / KWH4 / MISO2 — Port H I/O Pin 2
PH4isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode. It can be configured as master input (during master mode) or slave output
(during slave mode) pin MISO of the Serial Peripheral Interface 2 (SPI2).
2.3.25 PH3 / KWH3 / SS1 — Port H I/O Pin 3
PH3isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode. It can be configured as slave select pin
1 (SPI1).
SS of the Serial Peripheral Interface
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2.3.26 PH2 / KWH2 / SCK1 — Port H I/O Pin 2
PH2isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
toexitSTOP or WAITmode.It can beconfigured as serial clockpin SCK
1 (SPI1).
oftheSerial Peripheral Interface
2.3.27 PH1 / KWH1 / MOSI1 — Port H I/O Pin 1
PH1isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode. It can be configured as master output (during master mode) or slave input
pin (during slave mode) MOSI
of the Serial Peripheral Interface 1 (SPI1).
2.3.28 PH0 / KWH0 / MISO1 — Port H I/O Pin 0
PH0isa general purpose inputor output pin. Itcan be configured togeneratean interrupt causingtheMCU
to exit STOP or WAIT mode. It can be configured as master input (during master mode) or slave output
(during slave mode) pin MISO
PJ7 is a generalpurposeinputoroutput pin. It can be configured to generate an interrupt causing theMCU
to exit STOP or WAIT mode. It can be configured as the transmit pin TXCAN for the Motorola Scalable
Controller Area Network controller 4 (CAN4) or the serial clock pin SCL of the IIC module.
PJ6 is a generalpurposeinputoroutput pin. It can be configured to generate an interrupt causing theMCU
to exit STOP or WAIT mode. It can be configured as the receive pin RXCAN for the Motorola Scalable
Controller Area Network controller 4 (CAN4) or the serial data pin SDA of the IIC module.
2.3.31 PJ[1:0] / KWJ[1:0] — Port J I/O Pins [1:0]
PJ1 and PJ0 are general purpose input or output pins. They can be configured to generate an interrupt
causing the MCU to exit STOP or WAIT mode .
2.3.32 PK7 / ECS / ROMONE — Port K I/O Pin 7
PK7 is a general purpose input or output pin. During MCU expanded modes of operation, this pin is used
as the emulation chip select output (
operation, this pin is used to enable the Flash EEPROM memory in the memory map (ROMONE). At the
rising edge of
RESET, the state of this pin is latched to the ROMON bit.
ECS). During MCU normal expanded wide and narrow modes of
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2.3.33 PK[5:0] / XADDR[19:14] — Port K I/O Pins [5:0]
PK5-PK0 are general purpose input or output pins. In MCU expanded modes of operation, these pins
provide the expanded address XADDR[19:14] for the external bus.
2.3.34 PM7 / TXCAN4 — Port M I/O Pin 7
PM7 is a general purpose input or output pin. It can be configured as the transmit pin TXCAN of the
Motorola Scalable Controller Area Network controller 4 (CAN4 ).
2.3.35 PM6 / RXCAN4 — Port M I/O Pin 6
PM6 is a general purpose input or output pin. It can be configured as the receive pin RXCAN of the
Motorola Scalable Controller Area Network controller 4 (CAN4).
2.3.36 PM5 / TXCAN0 / TXCAN4 / SCK0 — Port M I/O Pin 5
PM5 is a general purpose input or output pin. It can be configured as the transmit pin TXCAN of the
Motorola Scalable Controller Area Network controllers 0 or 4 (CAN0 or CAN4). It can be configured as
the serial clock pin SCK of the Serial Peripheral Interface 0 (SPI0).
2.3.37 PM4 / RXCAN0 / RXCAN4/ MOSI0 — Port M I/O Pin 4
PM4 is a general purpose input or output pin. It can be configured as the receive pin RXCAN of the
Motorola Scalable Controller Area Network controllers 0 or 4 ( CAN0 or CAN4). It can be configured as
the master output (during master mode) or slave input pin (during slave mode) MOSI
Peripheral Interface 0 (SPI0).
for the Serial
2.3.38 PM3 / TXCAN1 / TXCAN0 / SS0 — Port M I/O Pin 3
PM3 is a general purpose input or output pin. It can be configured as the transmit pin TXCAN of the
Motorola Scalable Controller Area Network controllers 1 or 0 (CAN1 or CAN0). It can be configured as
the slave select pin
SS of the Serial Peripheral Interface 0 (SPI0).
2.3.39 PM2 / RXCAN1 / RXCAN0 / MISO0 — Port M I/O Pin 2
PM2 is a general purpose input or output pin. It can be configured as the receive pin RXCAN of the
Motorola Scalable Controller Area Network controllers 1 or 0 (CAN1 or CAN0). It can be configured as
the master input (during master mode) or slave output pin (during slave mode) MISO
Peripheral Interface 0 (SPI0).
for the Serial
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2.3.40 PM1 / TXCAN0 / TXB — Port M I/O Pin 1
PM1 is a general purpose input or output pin. It can be configured as the transmit pin TXCAN of the
Motorola Scalable Controller Area Network controller 0 (CAN0). It can be configured as the transmit pin
TXB of the BDLC.
2.3.41 PM0 / RXCAN0 / RXB — Port M I/O Pin 0
PM0 is a general purpose input or output pin. It can be configured as the receive pin RXCAN of the
Motorola Scalable Controller Area Network controller 0 (CAN0). It can be configured as the receive pin
RXB of the BDLC.
2.3.42 PP7 / KWP7 / PWM7 / SCK2 — Port P I/O Pin 7
PP7 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 7 output. It
can be configured as serial clock pin SCK of the Serial Peripheral Interface 2 (SPI2).
2.3.43 PP6 / KWP6 / PWM6 / SS2 — Port P I/O Pin 6
PP6 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 6 output. It
can be configured as slave select pin
SS of the Serial Peripheral Interface 2 (SPI2).
2.3.44 PP5 / KWP5 / PWM5 / MOSI2 — Port P I/O Pin 5
PP5 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 5 output. It
can be configured as master output (during master mode) or slave input pin (during slave mode) MOSI of
the Serial Peripheral Interface 2 (SPI2).
2.3.45 PP4 / KWP4 / PWM4 / MISO2 — Port P I/O Pin 4
PP4 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 4 output. It
can be configured as master input (during master mode) or slave output (during slave mode) pin MISO of
the Serial Peripheral Interface 2 (SPI2).
2.3.46 PP3 / KWP3 / PWM3 / SS1 — Port P I/O Pin 3
PP3 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 3 output. It
can be configured as slave select pin
SS of the Serial Peripheral Interface 1 (SPI1).
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2.3.47 PP2 / KWP2 / PWM2 / SCK1 — Port P I/O Pin 2
PP2 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 2 output. It
can be configured as serial clock pin SCK of the Serial Peripheral Interface 1 (SPI1).
2.3.48 PP1 / KWP1 / PWM1 / MOSI1 — Port P I/O Pin 1
PP1 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 1 output. It
can be configured as master output (during master mode) or slave input pin (during slave mode) MOSI of
the Serial Peripheral Interface 1 (SPI1).
2.3.49 PP0 / KWP0 / PWM0 / MISO1 — Port P I/O Pin 0
PP0 isageneral purpose input or outputpin.Itcan be configured to generateaninterrupt causing the MCU
to exit STOP or WAIT mode. It can be configured as Pulse Width Modulator (PWM) channel 0 output. It
can be configured as master input (during master mode) or slave output (during slave mode) pin MISO of
the Serial Peripheral Interface 1 (SPI1).
2.3.50 PS7 / SS0 — Port S I/O Pin 7
PS6 is a general purpose input or output pin. It can be configured as the slave select pin SS of the Serial
Peripheral Interface 0 (SPI0).
2.3.51 PS6 / SCK0 — Port S I/O Pin 6
PS6 is a general purpose input or output pin. It can be configured as the serial clock pin SCK of the Serial
Peripheral Interface 0 (SPI0).
2.3.52 PS5 / MOSI0 — Port S I/O Pin 5
PS5 is a general purpose input or output pin. It can be configured as master output (during master mode)
or slave input pin (during slave mode) MOSI of the Serial Peripheral Interface 0 (SPI0).
2.3.53 PS4 / MISO0 — Port S I/O Pin 4
PS4 is a general purpose input or output pin. It can be configured as master input (during master mode) or
slave output pin (during slave mode) MOSI of the Serial Peripheral Interface 0 (SPI0).
2.3.54 PS3 / TXD1 — Port S I/O Pin 3
PS3 is a general purpose input or output pin. It can be configured as the transmit pin TXD of Serial
Communication Interface 1 (SCI1).
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2.3.55 PS2 / RXD1 — Port S I/O Pin 2
PS2 is a general purpose input or output pin. It can be configured as the receive pin RXD of Serial
Communication Interface 1 (SCI1).
2.3.56 PS1 / TXD0 — Port S I/O Pin 1
PS1 is a general purpose input or output pin. It can be configured as the transmit pin TXD of Serial
Communication Interface 0 (SCI0).
2.3.57 PS0 / RXD0 — Port S I/O Pin 0
PS0 is a general purpose input or output pin. It can be configured as the receive pin RXD of Serial
Communication Interface 0 (SCI0).
2.3.58 PT[7:0] / IOC[7:0] — Port T I/O Pins [7:0]
PT7-PT0 are general purpose input or output pins. They can be configured as input capture or output
compare pins IOC7-IOC0 of the Enhanced Capture Timer (ECT).
2.4 Power Supply Pins
MC9S12DT256 power and ground pins are described below.
NOTE:All VSS pins must be connected together in the application.
2.4.1 VDDX,VSSX — Power & Ground Pins for I/O Drivers
External power and ground for I/O drivers. Because fast signal transitions place high, short-duration
current demandsonthepower supply, use bypass capacitors withhigh-frequencycharacteristics and place
them as close to the MCU as possible. Bypass requirements depend on how heavily the MCU pins are
loaded.
2.4.2 VDDR, VSSR — Power & Ground Pins for I/O Drivers & for Internal
Voltage Regulator
External power and ground for I/O drivers and input to the internal voltage regulator. Because fast signal
transitions place high, short-duration current demands on the power supply, use bypass capacitors with
high-frequency characteristics and place them as close to the MCU as possible. Bypass requirements
depend on how heavily the MCU pins are loaded.
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2.4.3 VDD1, VDD2, VSS1, VSS2 — Core Power Pins
Power is supplied to the MCU through VDD and VSS. Because fast signal transitions place high,
short-duration current demands on the power supply, use bypass capacitors with high-frequency
characteristics and place them as close to the MCU as possible. This 2.5V supply is derived from the
internal voltage regulator. There is no static load on those pins allowed. The internal voltage regulator is
turned off, if VREGEN is tied to ground.
NOTE:No load allowed except for bypass capacitors.
2.4.4 VDDA, VSSA — Power Supply Pins for ATD and VREG
VDDA, VSSA are the power supply and ground input pins for the voltage regulator and the analog to
digital converter. It also provides the reference for the internal voltage regulator. This allows the supply
voltage to the ATD and the reference voltage to be bypassed independently.
2.4.5 VRH, VRL — ATD Reference Voltage Input Pins
VRH and VRL are the reference voltage input pins for the analog to digital converter.
2.4.6 VDDPLL, VSSPLL — Power Supply Pins for PLL
Provides operating voltage and ground for the Oscillator and the Phased-Locked Loop. This allows the
supply voltage to the Oscillator and PLL to be bypassed independently.This 2.5V voltage is generated by
the internal voltage regulator.
NOTE:No load allowed except for bypass capacitors.
Table 2-2 MC9S12DP256 Power and Ground Connection Summary
Mnemonic
V
DD1, 2
V
SS1, 2
V
DDR
V
SSR
V
DDX
V
SSX
V
DDA
V
SSA
V
RL
V
RH
Pin Number
112-pin QFP
13, 652.5 V
14, 660V
415.0 V
400 V
1075.0 V
1060 V
835.0 VOperating voltage and ground for the analog-to-digital
860 V
850 V
845.0 V
Nominal
Voltage
Description
Internal power and ground generated by internal regulator
External power and ground, supply to pin drivers and internal
voltage regulator.
External power and ground, supply to pin drivers.
converters and the reference for the internal voltageregulator,
allows the supply voltage to the A/D to be bypassed
independently.
Reference voltages for the analog-to-digital converter.
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MC9S12DT256 Device User Guide — V03.07
Mnemonic
V
DDPLL
V
SSPLL
VREGEN975VInternal Voltage Regulator enable/disable
Pin Number
112-pin QFP
432.5 VProvides operating voltage and ground for the Phased-Locked
450 V
Nominal
Voltage
Description
Loop. This allows the supply voltage to the PLL to be
bypassed independently. Internal power and ground
generated by internal regulator.
2.4.7 VREGEN — On Chip Voltage Regulator Enable
Enables the internal 5V to 2.5V voltage regulator. If this pin is tied low, VDD1,2 and VDDPLL must be
supplied externally.
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Section 3 System Clock Description
3.1 Overview
The Clock and Reset Generator provides the internal clock signals for the core and all peripheral modules.
Figure 3-1 shows the clock connections from the CRG to all modules.
Consult the CRG Block User Guide for details on clock generation.
BDM
S12_CORE
core clock
Flash
RAM
EXTAL
XTAL
CRG
bus clock
oscillator clock
Figure 3-1 Clock Connections
EEPROM
ECT
ATD0, 1
PWM
SCI0, SCI1
SPI0, 1, 2
CAN0, 1, 2, 3, 4
IIC
BDLC
PIM
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Section 4 Modes of Operation
4.1 Overview
Eight possible modes determine the operating configuration of the MC9S12DT256. Each mode has an
associated default memory map and external bus configuration controlled by a further pin.
Three low power modes exist for the device.
4.2 Chip Configuration Summary
The operatingmode out of resetisdetermined by the statesof the MODC, MODB,andMODA pins during
reset (Table4-1).TheMODC,MODB, and MODA bits intheMODE register show the currentoperating
modeandprovide limited modeswitchingduring operation. Thestates of theMODC,MODB, and MODA
pinsarelatched into thesebitson the risingedge of theresetsignal. The ROMCTLsignalallows the setting
of the ROMON bit in the MISC register thus controlling whether the internal Flash is visible in the
memory map. ROMON = 1 mean the Flash is visible in the memory map. The state of the ROMCTL pin
is latched into the ROMON bit in the MISC register on the rising edge of the reset signal.
Table 4-1 Mode Selection
BKGD =
MODC
000X1
001
010X0
011
100X1
101
110X1
111
PE6 =
MODB
PE5 =
MODA
PK7 =
ROMCTL
01
10
01
10
00
11
00
11
ROMON
Bit
Special Single Chip, BDM allowed and ACTIVE. BDM is
allowed in all other modes but a serial command is
required to make BDM active.
Emulation Expanded Narrow, BDM allowed
Special Test (Expanded Wide), BDM allowed
Emulation Expanded Wide, BDM allowed
Normal Single Chip, BDM allowed
Normal Expanded Narrow, BDM allowed
Peripheral; BDM allowed but bus operations would cause
bus conflicts (must not be used)
Normal Expanded Wide, BDM allowed
For further explanation on the modes refer to the Core User Guide.
Mode Description
Table 4-2 Clock Selection Based on PE7
PE7 = XCLKSDescription
1
Colpitts Oscillator selected
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Table 4-2 Clock Selection Based on PE7
PE7 = XCLKSDescription
0
Pierce Oscillator/external clock selected
Table 4-3 Voltage Regulator VREGEN
VREGENDescription
1
0
Internal Voltage Regulator enabled
Internal Voltage Regulator disabled, VDD1,2 and
VDDPLL must be supplied externally with 2.5V
4.3 Security
The device will make available a security feature preventing the unauthorized read and write of the
memory contents. This feature allows:
•Protection of the contents of FLASH,
•Protection of the contents of EEPROM,
•Operation in single-chip mode,
•Operation from external memory with internal FLASH and EEPROM disabled.
The user must be reminded that part of the security must lie with the user’s code. An extreme example
would be user’s code that dumps the contents of theinternal program. This code would defeat the purpose
of security. At the same time theuser may also wish to put a back door inthe user’s program. An example
of this is the user downloads a key through the SCI which allows access to a programming routine that
updates parameters stored in EEPROM.
4.3.1 Securing the Microcontroller
Once the user has programmed the FLASH and EEPROM (if desired), the part can be secured by
programming the security bits located in the FLASH module. These non-volatile bits will keep the part
secured through resetting the part and through powering down the part.
The security byte resides in a portion of the Flash array.
Check the Flash Block User Guide for more details on the security configuration.
4.3.2 Operation of the Secured Microcontroller
4.3.2.1 Normal Single Chip Mode
This will bethemostcommon usage of the secured part. Everything will appear thesameasif the part was
not secured with the exception of BDM operation. The BDM operation will be blocked.
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MC9S12DT256 Device User Guide — V03.07
4.3.2.2 Executing from External Memory
The user may wish to execute from external space with a secured microcontroller. This is accomplished
by resetting directly into expanded mode. The internal FLASH and EEPROM will be disabled. BDM
operations will be blocked.
4.3.3 Unsecuring the Microcontroller
In order to unsecure the microcontroller, the internal FLASH and EEPROM must be erased. This can be
done through an external program in expanded mode.
Once the user has erased the FLASH and EEPROM, the part can be reset into special single chip mode.
This invokes a program that verifies the erasure of the internal FLASH and EEPROM. Once this program
completes,theuser can eraseandprogram the FLASHsecurity bits totheunsecured state. Thisisgenerally
done through the BDM, but the user could also change to expanded mode (by writing the mode bits
through the BDM) and jumping to an external program (again through BDM commands). Note that if the
part goes through a reset before the security bits are reprogrammed to the unsecure state, the part will be
secured again.
4.4 Low Power Modes
The microcontroller features three main low power modes. Consult the respective Block User Guide for
information on the module behavior in Stop, Pseudo Stop, and Wait Mode. An important source of
information about the clock system is the Clock and Reset Generator User Guide (CRG).
4.4.1 Stop
Executing the CPU STOP instruction stops all clocks andthe oscillator thus putting the chip in fully static
mode. Wake up from this mode can be done via reset or external interrupts.
4.4.2 Pseudo Stop
This mode is entered by executing the CPU STOP instruction. In this mode the oscillator is still running
and the Real Time Interrupt (RTI) or Watchdog (COP) sub module can stay active. Other peripherals are
turned off. This mode consumes more current than the full STOP mode, but the wake up time from this
mode is significantly shorter.
4.4.3 Wait
This mode is entered by executing the CPU WAI instruction. In this mode the CPU will not execute
instructions.Theinternal CPU signals(addressand databus) willbe fully static.Allperipherals stay active.
For further power consumption the peripherals can individually turn off their local clocks.
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MC9S12DT256 Device User Guide — V03.07
4.4.4 Run
Although this is not a low power mode, unused peripheral modules should not be enabled in order to save
power.
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MC9S12DT256 Device User Guide — V03.07
Section 5 Resets and Interrupts
5.1 Overview
Consult the Exception Processing section of the HCS12 Core User Guide for information on resets and
interrupts.
5.2 Vectors
5.2.1 Vector Table
Table 5-1 lists interrupt sources and vectors in default order of priority.
When a reset occurs, MCU registers and control bits are changed to known start-up states. Refer to the
respective module Block User Guides for register reset states.
5.3.1 I/O pins
Refer to the HCS12 Core User Guides for mode dependent pin configuration of port A, B, E and K out of
reset.
Refer to the PIM Block User Guide for reset configurations of all peripheral module ports.
NOTE:For devices assembled in 80-pin QFP packages all non-bonded out pins should be
configured as outputs after reset in order to avoid current drawn from floating
inputs. Refer to Table 2-1 for affected pins.
5.3.2 Memory
Refer to Table 1-1 for locations of the memories depending on the operating mode after reset.
The RAM array is not automatically initialized out of reset.
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MC9S12DT256 Device User Guide — V03.07
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MC9S12DT256 Device User Guide — V03.07
Section 6 HCS12 Core Block Description
6.1 CPU12 Block Description
Consult the CPU12 Reference Manual for information on the CPU.
When the CPU12 Reference Manual refers to cycles this is equivalent to Bus Clock Periods.
6.2 HCS12 Module Mapping Control (MMC) Block Description
Consult the MMC Block User Guide for information on the Module Mapping Control Block.
6.2.1 Device specific information
•INITEE
–Reset state: $01
–Bits EE11-EE15 are writeable once in Normal and Emulation Mode
•PPAGE
–Reset state : $00
–Register is writeable anytime in all modes
6.3 HCS12 Multiplexed External Bus Interface (MEBI) Block
Description
Consult the MEBI Block Guide for information on Multiplexed External Bus Interface.
6.3.1 Device specific information
•PUCR
–Reset State : $90
6.4 HCS12 Interrupt (INT) Block description
Consult the INT Block guide for information on HCS12 Interrupt block.
Consult the ECT_16B8C Block User Guide for information about the Enhanced Capture Timer module
When the ECT_16B8C Block Guide refers to freeze mode this is equivalent to active BDM mode.
Section 9 Analog to Digital Converter (ATD) Block
Description
There are two Analog to Digital Converters (ATD1 and ATD0) implemented on the MC9S12DT256.
Consult the ATD_10B8C Block User Guide for information about each Analog to Digital Converter
module.When the ATD_10B8C Block Guidereferstofreezemode this is equivalent to active BDM mode.
Section 10 Inter-IC Bus (IIC) Block Description
Consult the IIC Block User Guide for information about the Inter-IC Bus module.
Section 11 Serial Communications Interface (SCI) Block
Description
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MC9S12DT256 Device User Guide — V03.07
There are two Serial Communications Interfaces (SCI1 and SCI0) implemented on the MC9S12DT256
device. Consult the SCI Block User Guide for information about each Serial Communications Interface
module.
Section 12 Serial Peripheral Interface (SPI) Block
Description
There are three Serial Peripheral Interfaces(SPI2, SPI1 and SPI0) implemented on MC9S12DT256.
Consult the SPI Block User Guide for information about each Serial Peripheral Interface module.
Section 13 J1850 (BDLC) Block Description
Consult the BDLC Block User Guide for information about the J1850 module.
Consult the PWM_8B8C Block User Guide for information about the Pulse Width Modulator module.
When the PWM _8B8CBlock Guide refers to freeze mode this is equivalent to active BDM mode
Section 15 Flash EEPROM 256K Block Description
The "S12 LRAE" is a generic Load RAM and Execute (LRAE) program which will be programmed into
the flash memory of this device during manufacture. This LRAE program will provide greater
programming flexibility to the end users by allowing the device to be programmed directly using CAN or
SCI after it is assembled on the PCB. Use of the LRAE program is at the discretion of the end user and, if
not required, it must simply be erased prior to flash programming. For more details of the S12 LRAE and
its implementation, please see the S12 LREA Application Note (AN2546/D).
It isplanned that most HC9S12devicesmanufactured after Q1 of2004 will be shippedwiththe S12 LRAE
programmed in theFlash.Exact details of the changeover (i.e. blank toprogrammed)for each product will
be communicated in advance via GPCN and will be traceable by the customer via datecode marking on
the device.
Please contact Motorola SPS Sales if you have any additional questions.
Consult the FTS256K Block User Guide for information about the flash module.
Section 16 EEPROM 4K Block Description
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MC9S12DT256 Device User Guide — V03.07
Consult the EETS4K Block User Guide for information about the EEPROM module.
Section 17 RAM Block Description
This module supports single-cycle misaligned word accesses.
Section 18 MSCAN Block Description
There are three MSCAN modules (CAN4, CAN1 and CAN0) implemented on the MC9S12DT256.
Consult the MSCAN Block User Guide for information about the Motorola Scalable CAN Module.
Section 19 Port Integration Module (PIM) Block Description
Consult the PIM_9DP256 Block User Guide for information about the Port Integration Module.
Section 20 Voltage Regulator (VREG) Block Description
Consult the VREG Block User Guide for information about the dual output linear voltage regulator.
The PCB must be carefully laid out to ensure proper operation of the voltage regulator as well as of the
MCU itself. The following rules must be observed:
•Every supply pair must be decoupled by a ceramic capacitor connected as near as possible to the
corresponding pins (C1 – C6).
•Central point of the ground star should be the VSSR pin.
•Use low ohmic low inductance connections between VSS1, VSS2 and VSSR.
•VSSPLL must be directly connected to VSSR.
•Keep traces of VSSPLL, EXTAL and XTAL as short as possible and occupied board area for C7,
C8, C11 and Q1 as small as possible.
•Do not place other signals or supplies underneath area occupied by C7, C8, C10 and Q1 and the
connection area to the MCU.
•Central power input should be fed in at the VDDA/VSSA pins.
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MC9S12DT256 Device User Guide — V03.07
Figure 20-1 Recommended PCB Layout for 112LQFP Colpitts Oscillator
C1
VDD1
VSS1
VDDX
C6
VSSX
VREGEN
VSSA
C3
VDDA
VSS2
C2
VDD2
84
VSSR
VDDR
C4
C9
R1
C5
C10
C11
VSSPLL
VDDPLL
C8
C7
Q1
MC9S12DT256 Device User Guide — V03.07
Figure 20-2 Recommended PCB Layout for 80QFP Colpitts Oscillator
VDDX
C6
VSSX
VREGEN
VSSA
C3
VDDA
C1
VDD1
VSS1
VSSR
VDDR
C4
C9
R1
C5
C10
C8
C11
VSSPLL
VDDPLL
VSS2
C2
VDD2
C7
Q1
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MC9S12DT256 Device User Guide — V03.07
Figure 20-3 Recommended PCB Layout for 112LQFP Pierce Oscillator
C1
VDD1
VSS1
VDDX
C6
VSSX
VREGEN
VSSA
C3
VDDA
VSS2
C2
VDD2
VSSR
VDDR
VDDPLL
C4
C9
R1
C5
C10
C8
R2
Q1
R3
VSSPLL
C7
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MC9S12DT256 Device User Guide — V03.07
Figure 20-4 Recommended PCB Layout for 80QFP Pierce Oscillator
VDDX
C6
VSSX
VDD1
C1
VSS1
VREGEN
VSSA
C3
VDDA
VSS2
C2
VDD2
VSSR
VDDR
C4
C9
R1
C5
C10
R2
Q1
C8
VSSPLL
VDDPLL
VSSPLL
R3
C7
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MC9S12DT256 Device User Guide — V03.07
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MC9S12DT256 Device User Guide — V03.07
Appendix A Electrical Characteristics
A.1 General
NOTE:The electrical characteristics given in this section are preliminary and should be
used as a guide only. Values cannot be guaranteed by Motorola and are subject to
change without notice.
This supplement containsthemost accurate electrical information for the MC9S12DT256 microcontroller
availableatthe time ofpublication. The informationshould be consideredPRELIMINARYand issubject
to change.
This introduction is intended to give an overview on several common topics like power supply, current
injection etc.
A.1.1 Parameter Classification
The electrical parameters shown in this supplement are guaranteed by various methods. To give the
customer a better understanding the following classification is used and the parameters are tagged
accordingly in the tables where appropriate.
NOTE:This classification is shown in the column labeled “C” in the parameter tables
where appropriate.
P:
Those parameters are guaranteed during production testing on each individual device.
C:
Those parameters are achieved by the design characterization by measuring a statistically relevant
sample size across process variations.
T:
Those parameters are achieved by design characterization on a small sample size from typical devices
under typical conditions unless otherwise noted. All values shown in the typical column are within
this category.
D:
Those parameters are derived mainly from simulations.
A.1.2 Power Supply
The MC9S12DT256 utilizes several pins to supply power to the I/O ports, A/D converter, oscillator and
PLL as well as the digital core.
The VDDA, VSSA pairsuppliestheA/D converter and the resistor ladder of the internal voltage regulator.
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MC9S12DT256 Device User Guide — V03.07
The VDDX, VSSX, VDDR and VSSR pairs supply the I/O pins, VDDR supplies also the internal voltage
regulator.
VDD1, VSS1, VDD2 and VSS2 are the supply pins for the digital logic, VDDPLL, VSSPLL supply the
oscillator and the PLL.
VSS1 and VSS2 are internally connected by metal.
VDDA, VDDX, VDDR as well as VSSA, VSSX, VSSR are connected by anti-parallel diodes for ESD
protection.
NOTE:In the following context VDD5 is used for either VDDA, VDDR and VDDX; VSS5
is used for either VSSA, VSSR and VSSX unless otherwise noted.
IDD5 denotes the sum of the currents flowing into the VDDA, VDDX and VDDR
pins.
VDD is used for VDD1, VDD2 and VDDPLL, VSS is used for VSS1, VSS2 and
VSSPLL.
IDD is used for the sum of the currents flowing into VDD1 and VDD2.
A.1.3 Pins
There are four groups of functional pins.
A.1.3.1 5V I/O pins
Those I/O pins have a nominal level of 5V. This class of pins is comprised of all port I/O pins, the analog
inputs, BKGD and the RESET pins.The internal structure of all those pins is identical, however some of
the functionality may be disabled. E.g. for the analog inputs the output drivers, pull-up and pull-down
resistors are disabled permanently.
A.1.3.2 Analog Reference
This group is made up by the VRH and VRL pins.
A.1.3.3 Oscillator
The pins XFC, EXTAL, XTAL dedicated to the oscillator have a nominal 2.5V level. They are supplied
by VDDPLL.
A.1.3.4 TEST
This pin is used for production testing only.
A.1.3.5 VREGEN
This pin is used to enable the on chip voltage regulator.
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A.1.4 Current Injection
MC9S12DT256 Device User Guide — V03.07
Power supply must maintain regulation within operating V
operating maximum current conditions. If positive injection current (V
or VDD range during instantaneous and
DD5
in
>V
) is greater than I
DD5
DD5
, the
injection current may flowoutofVDD5and could result in external power supply going out of regulation.
Ensure external VDD5 load will shunt current greater than maximum injection current. This will be the
greatest risk when the MCU is not consuming power; e.g. if no system clock is present, or if clock rate is
very low which would reduce overall power consumption.
A.1.5 Absolute Maximum Ratings
Absolute maximum ratings are stress ratings only. A functional operation under or outside those maxima
is not guaranteed. Stress beyond those limits may affect the reliability or cause permanent damage of the
device.
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (e.g., either V
Table A-1 Absolute Maximum Ratings
NumRatingSymbolMinMaxUnit
SS5
or V
DD5
1
).
1I/O, Regulator and Analog Supply Voltage
2
Digital Logic Supply Voltage
3
PLL Supply Voltage
4Voltage difference VDDX to VDDR and VDDA
5Voltage difference VSSX to VSSR and VSSA
6Digital I/O Input Voltage
7Analog Reference
8XFC, EXTAL, XTAL inputs
9TEST input
Instantaneous Maximum Current
10
Single pin limit for all digital I/O pins
Instantaneous Maximum Current
11
Single pin limit for XFC, EXTAL, XTAL
Instantaneous Maximum Current
12
Single pin limit for TEST
13Storage Temperature Range
NOTES:
1. Beyond absolute maximum ratings device might be damaged.
2
2
3
4
5
V
DD5
V
DD
V
DDPLL
∆
VDDX
∆
VSSX
V
V
RH,VRL
V
ILV
V
TEST
I
I
DL
I
DT
T
stg
-0.36.0V
-0.33.0V
-0.33.0V
-0.30.3V
-0.30.3V
IN
D
-0.36.0V
-0.36.0V
-0.33.0V
-0.310.0V
-25+25mA
-25+25mA
-0.250mA
– 65155°C
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MC9S12DT256 Device User Guide — V03.07
2. The device contains an internal voltage regulator to generatethe logic and PLL supply out of the I/O supply.
The absolute maximum ratings apply when the device is powered from an external source.
3. All digital I/O pins are internally clamped to V
4. Those pins are internally clamped to V
5. This pin is clamped low to V
SSR
SSPLL
, but not clamped high. This pin must be tied low in applications.
SSX
and V
and V
DDPLL
DDX
.
, V
SSR
and V
DDR
or V
SSA
and V
DDA
.
A.1.6 ESD Protection and Latch-up Immunity
All ESD testing is in conformity with CDF-AEC-Q100 Stress test qualification for Automotive Grade
Integrated Circuits. During the device qualification ESD stresses were performed for the Human Body
Model (HBM), the Machine Model (MM) and the Charge Device Model.
A device will be defined as afailure if after exposure to ESD pulses the device nolonger meets the device
specification. Complete DC parametric and functional testing is performed per the applicable device
specification at room temperature followed by hot temperature, unless specified otherwise in the device
specification.
Table A-2 ESD and Latch-up Test Conditions
ModelDescriptionSymbolValueUnit
Series ResistanceR11500Ohm
Storage CapacitanceC100pF
Human Body
Machine
Latch-up
Number of Pulse per pin
positive
negative
Series ResistanceR10Ohm
Storage CapacitanceC200pF
Number of Pulse per pin
positive
negative
Minimum input voltage limit-2.5V
Maximum input voltage limit7.5V
-
-
3
3
3
3
Table A-3 ESD and Latch-Up Protection Characteristics
Num CRatingSymbolMinMaxUnit
1C Human Body Model (HBM)
2C Machine Model (MM)
3C Charge Device Model (CDM)
Latch-up Current at TA = 125°C
4C
5C
positive
negative
Latch-up Current at T
positive
negative
= 27°C
A
V
V
V
HBM
MM
CDM
I
LAT
I
LAT
2000-V
200-V
500-V
+100
-100
+200
-200
-mA
-mA
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MC9S12DT256 Device User Guide — V03.07
A.1.7 Operating Conditions
This chapter describes the operating conditions of the device. Unless otherwise noted those conditions
apply to all the following data.
NOTE:Please refer to the temperature rating of the device (C, V, M) with regards to the
ambient temperature T
calculations refer to Section A.1.8 Power Dissipation and ThermalCharacteristics.
RatingSymbolMinTypMaxUnit
and the junction temperature TJ. For power dissipation
A
Table A-4 Operating Conditions
I/O, Regulator and Analog Supply Voltage
Digital Logic Supply Voltage
PLL Supply Voltage
Voltage Difference VDDX to VDDR and VDDA
Voltage Difference VSSX to VSSR and VSSA
Oscillator
Bus Frequency
MC9S12DT256C
Operating Ambient Temperature Range
MC9S12DT256V
Operating Ambient Temperature Range
MC9S12DT256M
Operating Ambient Temperature Range
NOTES:
1. The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The
absolute maximum ratings apply when this regulator is disabled and the device is powered from an external
source.
2. Please refer to Section A.1.8 Power Dissipation and Thermal Characteristics for more details about the relation between ambient temperature T
1
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Junction Temperature Range
1
and device junction temperature TJ.
A
V
DD5
V
DD
V
DDPLL
∆
VDDX
∆
VSSX
f
osc
f
bus
T
J
2
T
A
T
J
2
T
A
T
J
2
T
A
4.555.25V
2.352.52.75V
2.352.52.75V
-0.100.1V
-0.100.1V
0.5-16MHz
0.5-25MHz
-40-100°C
-402785°C
-40-120°C
-4027105°C
-40-140°C
-4027125°C
A.1.8 Power Dissipation and Thermal Characteristics
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T
obtained from:
)in°C can be
J
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MC9S12DT256 Device User Guide — V03.07
T
T
T
P
Θ
The total power dissipation can be calculated from:
P
Two cases with internal voltage regulator enabled and disabled must be considered:
Junction Temperature, [°C]=
J
Ambient Temperature, [°C]=
A
Total Chip Power Dissipation, [W]=
D
JA
INT
1.Internal Voltage Regulator disabled
Package Thermal Resistance, [°C/W]=
Chip Internal Power Dissipation, [W]=
P
INT
I
⋅I
DDVDD
T
J
P
D
DDPLLVDDPLL
A
P
D
P
INT
⋅I
Θ
•()+=
JA
PIO+=
+V
DDA
⋅+=
DDA
2
I
P
IO
P
is the sum of all output currents on I/O ports associated with VDDX and VDDR.
IO
For R
respectively
2.Internal voltage regulator enabled
I
DDR
additionally contains the current flowing into the external loads with output high.
is valid:
DSON
R
DSON
V
R
DSON
P
INT
is the current shown in Table A-7 and not the overall current flowing into VDDR, which
DD5VOH
------------------------------------ for outputs driven high;=
I
DDRVDDR
P
IO
R
∑
i
V
OL
------------ for outputs driven low;=
I
OL
–
I
OH
⋅I
R
∑
i
DSON
DSON
⋅=
IO
i
⋅+=
DDAVDDA
2
I
⋅=
IO
i
PIO is the sum of all output currents on I/O ports associated with VDDX and VDDR.
1. The values for thermal resistance are achieved by package simulations
2. PC Board according to EIA/JEDEC Standard 51-2
3. PC Board according to EIA/JEDEC Standard 51-7
--54
--41
--51
--41
o
C/W
o
C/W
o
C/W
o
C/W
A.1.9 I/O Characteristics
This section describes the characteristics of all 5V I/O pins. All parameters are not alwaysapplicable, e.g.
not all pins feature pull up/down resistances.
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MC9S12DT256 Device User Guide — V03.07
Table A-6 5V I/O Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num CRatingSymbolMinTypMaxUnit
1P Input High Voltage
T Input High Voltage
2P Input Low Voltage
T Input Low Voltage
3C Input Hysteresis
V
V
V
V
V
HYS
IH
IH
IL
IL
0.65*V
DD5
--V
--VDD5 + 0.3V
--
0.35*V
DD5
VSS5 - 0.3--V
250mV
Input Leakage Current (pins in high impedance input
1
4P
5C
6P
7C
8P
9P
10C
11P
12C
mode)
Vin= V
DD5
or V
SS5
Output High Voltage (pins in output mode)
Partial Drive IOH= –2mA
Output High Voltage (pins in output mode)
Full Drive IOH = –10mA
Output Low Voltage (pins in output mode)
Partial Drive IOL = +2mA
Output Low Voltage (pins in output mode)
Full Drive IOL= +10mA
Internal Pull Up Device Current,
tested at V
Max.
IL
Internal Pull Up Device Current,
tested at V
IH
Min.
Internal Pull Down Device Current,
tested at V
IH
Min.
Internal Pull Down Device Current,
tested at V
Max.
IL
13D Input Capacitance
2
14T
Injection current
Single Pin limit
Total Device Limit. Sum of all injected currents
15P
16P
Port H, J, P Interrupt Input Pulse filtered
Port H, J, P Interrupt Input Pulse passed
3
3
I
in
V
OH
V
OH
V
OL
V
OL
I
PUL
I
PUH
I
PDH
I
PDL
C
I
ICS
I
ICP
t
PULSE
t
PULSE
–2.5-2.5µA
V
V
DD5
DD5
– 0.8
– 0.8
--V
--V
--0.8V
--0.8V
---130µA
-10--µA
--130µA
10--µA
in
-2.5
-25
6-pF
-2.5
25
3µs
10µs
NOTES:
1. Maximum leakage current occurs at maximum operating temperature. Current decreases by approximately one-half for
each 8 C to 12 C in the temperature range from 50 C to 125 C.
2. Refer to Section A.1.4 Current Injection, for more details
3. Parameter only applies in STOP or Pseudo STOP mode.
V
mA
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MC9S12DT256 Device User Guide — V03.07
A.1.10 Supply Currents
This section describes the current consumption characteristics of the device as well as the conditions for
the measurements.
A.1.10.1 Measurement Conditions
All measurements are without output loads. Unless otherwise noted the currents are measured in single
chip mode, internal voltage regulator enabled and at 25MHz bus frequency using a 4MHz oscillator in
Colpitts mode. Production testing is performed using a square wave signal at the EXTAL input.
A.1.10.2 Additional Remarks
In expanded modesthecurrents flowing in the system are highly dependentonthe load at the address, data
and control signals as well as on the duty cycle of those signals. No generally applicable numbers can be
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MC9S12DT256 Device User Guide — V03.07
given. A very good estimate is to take the single chip currents and add the currents due to the external
loads.
Table A-7 Supply Current Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num CRatingSymbolMinTypMaxUnit
1P
Run supply currents
Wait Supply current
2P
P
C
P
C
C
3
P
C
P
C
P
Pseudo Stop Current (RTI and COP enabled)
C
C
C
4
C
C
C
C
Stop Current
C
P
C
C
5
P
C
P
C
P
Single Chip, Internal regulator enabled
All modules enabled, PLL on
only RTI enabled
Pseudo Stop Current (RTI and COP disabled)
"C" Temp Option 100°C
"V" Temp Option 120°C
"M" Temp Option 140°C
2
"C" Temp Option 100°C
"V" Temp Option 120°C
"M" Temp Option 140°C
1, 2
-40°C
27°C
70°C
85°C
105°C
125°C
1, 2
-40°C
27°C
70°C
85°C
105°C
125°C
140°C
-40°C
27°C
70°C
85°C
105°C
125°C
I
DD5
I
DDW
1
65
40
5
mA
mA
370
400
500
450
I
DDPS
550
600
1600
µA
650
800
2100
850
1200
5000
570
600
I
DDPS
650
750
µA
850
1200
1500
12
25
100
100
I
DDS
130
160
1200
µA
200
350
1700
400
600
5000
NOTES:
1. PLL off
2. At those low power dissipation levels T
98
= TA can be assumed
J
MC9S12DT256 Device User Guide — V03.07
A.2 ATD Characteristics
This section describes the characteristics of the analog to digital converter.
A.2.1 ATD Operating Characteristics
The Table A-8 shows conditions under which the ATD operates.
The following constraints exist to obtain full-scale, full range results:
V
≤ VRL≤ VIN≤ VRH≤ V
SSA
beyond the power supply levels that it ties to. If the input level goes outside of this range it will effectively
be clipped.
Table A-8 ATD Operating Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num CRatingSymbolMinTypMaxUnit
Reference Potential
1D
2C
3D ATD Clock Frequency
4D
5D
6D
7PReference Supply current 2 ATD blocks on
8PReference Supply current 1 ATD block on
NOTES:
1. Full accuracy is not guaranteed when differential voltage is less than 4.50V
2. The minimumtime assumes a final sample periodof 2 ATD clocks cycles whilethe maximum time assumes a finalsample
Differential Reference Voltage
ATD 10-Bit Conversion Period
Conv, Time at 2.0MHz ATD Clock f
ATD 8-Bit Conversion Period
Conv, Time at 2.0MHz ATD Clock f
Recovery Time (V
period of 16 ATD clocks.
=5.0 Volts)
DDA
. This constraint exists since the sample buffer amplifier can not drive
DDA
Low
High
1
Clock Cycles
ATDCLK
Clock Cycles
ATDCLK
2
2
V
RL
V
RH
VRH-V
f
ATDCLK
N
CONV10
T
CONV10
N
CONV8
T
CONV8
t
REC
I
REF
I
REF
RL
V
V
DDA
SSA
/2
V
DDA
V
/2
DDA
4.505.005.25V
0.52.0MHz
14
7
12
6
28
14
26
13
20µs
0.750mA
0.375mA
V
V
Cycles
µs
Cycles
µs
A.2.2 Factors influencing accuracy
Three factors - source resistance, source capacitance and current injection - have an influence on the
accuracy of the ATD.
A.2.2.1 Source Resistance:
Due to the input pin leakage current as specified in Table A-6 in conjunction with the source resistance
there will be a voltage drop from the signal source to the ATD input. The maximum source resistance R
S
99
MC9S12DT256 Device User Guide — V03.07
specifies results in an error of less than 1/2 LSB (2.5mV) at the maximum leakage current. If device or
operatingconditionsare less thanworstcase or leakage-inducederror is acceptable,largervalues of source
resistance is allowed.
A.2.2.2 Source Capacitance
When sampling an additional internal capacitor is switched to the input. This can cause a voltage drop due
to charge sharing with the external and the pin capacitance. For a maximum sampling error of the input
voltage ≤ 1LSB, then the external filter capacitor, C
≥ 1024 * (C
f
INS
- C
INN
).
A.2.2.3 Current Injection
There are two cases to consider.
1.A current is injected into the channel being converted. The channel being stressed has conversion
values of$3FF($FF in 8-bit mode) for analoginputsgreater than V
unless the current is higher than specified as disruptive condition.
V
RL
and $000forvalues less than
RH
2.Current is injected into pins in the neighborhood of the channel being converted. A portion of this
current is picked up by the channel (coupling ratio K), This additional current impacts the accuracy
of the conversion depending on the source resistance.
The additional input voltage error on the converted channel can be calculated as V
I
INJ
, with I
being the sum of the currents injected into the two pins adjacent to the converted
INJ
=K*RS*
ERR
channel.
Table A-9 ATD Electrical Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num CRatingSymbolMinTypMaxUnit
1C Max input Source Resistance
Total Input Capacitance
2T
3C Disruptive Analog Input Current
4C Coupling Ratio positive current injection
5C Coupling Ratio negative current injection
Non Sampling
Sampling
R
S
C
INN
C
INS
I
NA
K
p
K
n
--1KΩ
10
22
-2.52.5mA
-4
10
-2
10
pF
A/A
A/A
100
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