Motorola MC74HCT04AD, MC74HCT04ADT, MC74HCT04AN Datasheet

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SEMICONDUCTOR TECHNICAL DATA

1

REV 6

 Motorola, Inc. 1995

10/95

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With LSTTL–Compatible Inputs
High–Performance Silicon–Gate CMOS

The MC74HCT04A may be used as a level converter for interfacing

TTL or NMOS outputs to High–Speed CMOS inputs.

The HCT04A is identical in pinout to the LS04.

• Output Drive Capability: 10 LSTTL Loads

• TTL/NMOS–Compatible Input Levels

• Outputs Directly Interface to CMOS, NMOS and TTL

• Operating Voltage Range: 4.5 to 5.5V

• Low Input Current: 1µA

• In Compliance With the JEDEC Standard No. 7A Requirements

• Chip Complexity: 48 FETs or 12 Equivalent Gates

LOGIC DIAGRAM

Y1A1

A2

A3

A4

A5

A6

Y2

Y3

Y4

Y5

Y6

1

3

5

9

11

13

2

4

6

8

10

12

Y = A
Pin 14 = V

CC

Pin 7 = GND

Pinout: 14–Lead Packages (Top View)

1314 12 11 10 9 8

21 3 4 5 6 7

V

CC

A6 Y6 A5 Y5 A4 Y4

A1 Y1 A2 Y2 A3 Y3 GND

L

H

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FUNCTION TABLE

Inputs Outputs

A

H

L

Y

D SUFFIX

SOIC PACKAGE

CASE 751A–03

N SUFFIX

PLASTIC PACKAGE

CASE 646–06

ORDERING INFORMATION

MC74HCTXXAN
MC74HCTXXAD
MC74HCTXXADT

Plastic
SOIC
TSSOP

1

14

1

14

1

14

DT SUFFIX

TSSOP PACKAGE

CASE 948G–01

MC74HCT04A

MOTOROLA High–Speed CMOS Logic Data

DL129 — Rev 6

2

MAXIMUM RATINGS*

Symbol

Parameter

Value

Unit

V

CC

DC Supply Voltage (Referenced to GND)

– 0.5 to + 7.0

V

V

in

DC Input Voltage (Referenced to GND)

– 0.5 to VCC + 0.5

V

V

out

DC Output Voltage (Referenced to GND)

– 0.5 to VCC + 0.5

V

I

in

DC Input Current, per Pin

± 20

mA

I

out

DC Output Current, per Pin

± 25

mA

I

CC

DC Supply Current, VCC and GND Pins

± 50

mA

P

D

Power Dissipation in Still Air Plastic DIP†

SOIC Package†

TSSOP Package†

750
500
450

mW

T

stg

Storage Temperature Range

– 65 to + 150

_

C

T

L

Lead Temperature, 1 mm from Case for 10 Seconds

Plastic DIP, SOIC or TSSOP Package

260

_

C

*Maximum Ratings are those values beyond which damage to the device may occur.

Functional operation should be restricted to the Recommended Operating Conditions.

†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C

SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: – 6.1 mW/_C from 65_ to 125_C

For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

Max

Unit

V

CC

DC Supply Voltage (Referenced to GND)

4.5

5.5

V

Vin, V

out

DC Input Voltage, Output Voltage (Referenced to GND)

0

V

CC

V

T

A

Operating Temperature Range, All Package Types

– 55

+ 125

_

C

tr, t

f

Input Rise/Fall Time (Figure 1)

0

500

ns

This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance cir­cuit. For proper operation, Vin and
V

out

should be constrained to the

range GND v (Vin or V

out

) v VCC.

Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.