MOTOROLA MC74HCT04ADT, MC74HCT04ADTR2, MC74HCT04ADR2, MC74HCT04AN, MC74HCT04AFL1 Datasheet

 Semiconductor Components Industries, LLC, 2000

March, 2000 – Rev. 7

1 Publication Order Number:

MC74HCT04A/D

MC74HCT04A

Hex Inverter

With LSTTL–Compatible Inputs
High–Performance Silicon–Gate CMOS

The MC74HCT04A may be used as a level converter for interfacing

TTL or NMOS outputs to High–Speed CMOS inputs.

The HCT04A is identical in pinout to the LS04.

• Output Drive Capability: 10 LSTTL Loads

• TTL/NMOS–Compatible Input Levels

• Outputs Directly Interface to CMOS, NMOS and TTL

• Operating Voltage Range: 4.5 to 5.5V

• Low Input Current: 1µA

• In Compliance With the JEDEC Standard No. 7A Requirements

• Chip Complexity: 48 FETs or 12 Equivalent Gates

LOGIC DIAGRAM

Y1A1

A2

A3

A4

A5

A6

Y2

Y3

Y4

Y5

Y6

1

3

5

9

11

13

2

4

6

8

10

12

Y = A
Pin 14 = V

CC

Pin 7 = GND

Pinout: 14–Lead Packages (Top View)

1314 12 11 10 9 8

21 34567

V

CC

A6 Y6 A5 Y5 A4 Y4

A1 Y1 A2 Y2 A3 Y3 GND

Device Package Shipping

ORDERING INFORMATION

MC74HCT04AN PDIP–14 2000 / Box
MC74HCT04AD SOIC–14

http://onsemi.com

55 / Rail

MC74HCT04ADR2 SOIC–14 2500 / Reel

MARKING

DIAGRAMS

A = Assembly Location
WL or L = Wafer Lot
YY or Y = Year
WW or W = Work Week

MC74HCT04ADT TSSOP–14 96 / Rail
MC74HCT04ADTR2 TSSOP–14

2500 / Reel

TSSOP–14
DT SUFFIX

CASE 948G

HCT

04A

ALYW

1

14

1

14

PDIP–14

N SUFFIX

CASE 646

MC74HCT04AN

AWLYYWW

SOIC–14

D SUFFIX

CASE 751A

1

14

HCT04A

AWLYWW

L
H

FUNCTION TABLE

Inputs Outputs

A

H

L

Y

MC74HCT04A

http://onsemi.com

2

MAXIMUM RATINGS*

Symbol

Parameter

Value

Unit

V

CC

DC Supply Voltage (Referenced to GND)

– 0.5 to + 7.0

V

V

in

DC Input Voltage (Referenced to GND)

– 0.5 to VCC + 0.5

V

V

out

DC Output Voltage (Referenced to GND)

– 0.5 to VCC + 0.5

V

I

in

DC Input Current, per Pin

± 20

mA

I

out

DC Output Current, per Pin

± 25

mA

I

CC

DC Supply Current, VCC and GND Pins

± 50

mA

ÎÎ

Î

P

D

ОООООООООООО

Î

Power Dissipation in Still Air Plastic DIP†

SOIC Package†

TSSOP Package†

ÎÎÎ

Î

750
500
450

Î

Î

mW

T

stg

Storage Temperature Range

– 65 to + 150

_

C

ÎÎ

Î

T

L

ОООООООООООО

Î

Lead Temperature, 1 mm from Case for 10 Seconds

Plastic DIP, SOIC or TSSOP Package

ÎÎÎ

Î

260

Î

Î

_

C

*Maximum Ratings are those values beyond which damage to the device may occur.

Functional operation should be restricted to the Recommended Operating Conditions.

†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C

SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: – 6.1 mW/_C from 65_ to 125_C

For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

ÎÎ

Max

Unit

V

CC

DC Supply Voltage (Referenced to GND)

4.5

ÎÎ

5.5

V

Vin, V

out

DC Input Voltage, Output Voltage (Referenced to GND)

0

ÎÎ

V

CC

V

T

A

Operating Temperature Range, All Package Types

– 55

ÎÎ

+ 125

_

C

tr, t

f

Input Rise/Fall Time (Figure 1)

0

ÎÎ

500

ns

This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance cir­cuit. For proper operation, Vin and
V

out

should be constrained to the

range GND v (Vin or V

out

) v VCC.

Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.

MC74HCT04A

http://onsemi.com

3

DC CHARACTERISTICS (Voltages Referenced to GND)

Guaranteed Limit

Symbol Parameter Condition

V

CC

V

–55 to 25°C ≤85°C ≤125°C Unit

V

IH

Minimum High–Level Input
Voltage

V

out

= 0.1V

|I

out

| ≤ 20µA

4.5

5.5

2.0

2.0

2.0

2.0

2.0

2.0

V

V

IL

Maximum Low–Level Input
Voltage

V

out

= VCC – 0.1V

|I

out

| ≤ 20µA

4.5

5.5

0.8

0.8

0.8

0.8

0.8

0.8

V

V

OH

Minimum High–Level Output
Voltage

Vin = V

IL

|I

out

| ≤ 20µA

4.5

5.5

4.4

5.4

4.4

5.4

4.4

5.4

V

Vin = V

IL

|I

out

| ≤ 4.0mA 4.5 3.98 3.84 3.70

V

OL

Maximum Low–Level Output
Voltage

Vin = V

IH

|I

out

| ≤ 20µA

4.5

5.5

0.1

0.1

0.1

0.1

0.1

0.1

V

Vin = V

IH

|I

out

| ≤ 4.0mA 4.5 0.26 0.33 0.40

I

in

Maximum Input Leakage
Current

Vin = VCC or GND 5.5 ±0.1 ±1.0 ±1.0 µA

I

CC

Maximum Quiescent Supply
Current (per Package)

Vin = VCC or GND
I

out

= 0µA

5.5 1 10 40 µA

∆I

CC

Additional Quiescent Supply

Vin = 2.4V , Any One Input

p

≥ –55°C 25 to 125°C

C

urren

t

V

in

=

V

CC

or

GND, Oth

er Inputs

I

out

= 0µA

5.5

2.9 2.4

mA

1. Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).

2. Total Supply Current = ICC + Σ∆ICC.

AC CHARACTERISTICS (V

CC

= 5.0V ±10%, CL = 50pF, Input tr = tf = 6ns)

Guaranteed Limit

Symbol Parameter –55 to 25°C ≤85°C ≤125°C Unit

t

PLH

,

t

PHL

Maximum Propagation Delay, Input A to Output Y
(Figures 1 and 2)

15
17

19
21

22
26

ns

t

TLH

,

t

THL

Maximum Output Transition Time, Any Output
(Figures 1 and 2)

15 19 22 ns

C

in

Maximum Input Capacitance 10 10 10 pF

NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ON

Semiconductor High–Speed CMOS Data Book (DL129/D).

Typical @ 25°C, VCC = 5.0 V

C

PD

Power Dissipation Capacitance (Per Inverter)*

22

pF

*Used to determine the no–load dynamic power consumption: PD = CPD V

CC

2

f + ICC VCC. For load considerations, see Chapter 2 of the

ON Semiconductor High–Speed CMOS Data Book (DL129/D).