Motorola MC74HC85DT, MC74HC85N Datasheet


SEMICONDUCTOR TECHNICAL DATA
1
REV 6
Motorola, Inc. 1995
10/95
  
The MC74HC85 is identical in pinout and function to the LS85. This device is similar in function to the MM74C85 and L85, but has a different pinout. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs.
This 4–Bit Magnitude Comparator compares two 4–bit nibbles and gives a high voltage level on either the A > B
out
, A = B
out
, or A < B
out
output, leaving the other two at a low voltage level. This device also has A > Bin, A = Bin, and A < Bin inputs, eliminating the need for external gates when cascading.
Output Drive Capability: 10 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2 to 6 V
Low Input Current: 1 µA
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
Chip Complexity: 248 FETs or 62 Equivalent Gates
LOGIC DIAGRAM
5 6 7
10
A > B
out
A = B
out
A < B
out
A0
PIN 16 = V
CC
PIN 8 = GND
COMPARISON OUTPUTS
DATA
INPUTS
CASCADING
INPUTS
12 13 15
9 11
14 1
4 3 2
A1 A2 A3
B0 B1 B2 B3
A > B
in
A = B
in
A < B
in

PIN ASSIGNMENT
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
A1
A2
B2
A3
V
CC
B0
A0
B1
A
t
B
in
B3
A = B
in
A
u
B
in
A u B
out
A = B
out
A
t
B
out
GND
N SUFFIX
PLASTIC PACKAGE
CASE 648–08
ORDERING INFORMATION
MC74HCXXN MC74HCXXDT
Plastic TSSOP
1
16
1
16
DT SUFFIX
TSSOP PACKAGE
CASE 948F–01
MC74HC85
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
2
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
V
CC
DC Supply Voltage (Referenced to GND)
– 0.5 to + 7.0
V
V
in
DC Input Voltage (Referenced to GND)
– 1.5 to VCC + 1.5
V
V
out
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
I
in
DC Input Current, per Pin
± 20
mA
I
out
DC Output Current, per Pin
± 25
mA
I
CC
DC Supply Current, VCC and GND Pins
± 50
mA
P
D
Power Dissipation in Still Air Plastic DIP†
TSSOP Package†
750 450
mW
T
stg
Storage Temperature
– 65 to + 150
_
C
T
L
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or TSSOP)
260
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
TSSOP Package: – 6.1 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
V
CC
DC Supply Voltage (Referenced to GND)
2.0
6.0
V
Vin, V
out
DC Input Voltage, Output Voltage (Referenced to GND)
0
V
CC
V
T
A
Operating Temperature, All Package Types
– 55
+ 125
_
C
tr, t
f
Input Rise and Fall Time VCC = 2.0 V
(Figure 1) VCC = 4.5 V
VCC = 6.0 V
0 0 0
1000
500 400
ns
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol
Parameter
Test Conditions
V
CC V
– 55 to
25_C
v
85_Cv 125_C
Unit
V
IH
Minimum High–Level Input Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
2.0
4.5
6.0
1.5
3.15
4.2
1.5
3.15
4.2
1.5
3.15
4.2
V
V
IL
Maximum Low–Level Input Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
2.0
4.5
6.0
0.3
0.9
1.2
0.3
0.9
1.2
0.3
0.9
1.2
V
Vin = VIH or V
IL
|I
out
| v 20 µA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
Vin = VIH or VIL|I
out
| v 4.0 mA
|I
out
| v 5.2 mA
4.5
6.0
3.98
5.48
3.84
5.34
3.70
5.20
Vin = VIH or V
IL
|I
out
| v 20 µA
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
Vin = VIH or VIL|I
out
| v 4.0 mA
|I
out
| v 5.2 mA
4.5
6.0
0.26
0.26
0.33
0.33
0.40
0.40
I
in
Maximum Input Leakage Current
Vin = VCC or GND
6.0
± 0.1
± 1.0
± 1.0
µA
I
CC
Maximum Quiescent Supply Current (per Package)
Vin = VCC or GND I
out
= 0 µA
6.0
8
80
160
µA
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance cir­cuit. For proper operation, Vin and V
out
should be constrained to the
range GND v (Vin or V
out
) v VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
V
OH
V
OL
Minimum High–Level Output Voltage
Maximum Low–Level Output Voltage
V
V
MC74HC85
High–Speed CMOS Logic Data DL129 — Rev 6
3 MOTOROLA
AC ELECTRICAL CHARACTERISTICS (C
L
= 50 pF, Input tr = tf = 6 ns)
Guaranteed Limit
Symbol
Parameter
V
CC V
– 55 to
25_C
v
85_Cv 125_C
Unit
t
PLH
,
t
PHL
Maximum Propagation Delay, Inputs A or B to Outputs A> B or A < B
(Figures 1 and 2)
2.0
4.5
6.0
230
46 39
290
58 49
345
69 59
ns
t
PLH
,
t
PHL
Maximum Propagation Delay, Inputs A or B to Output A = B
(Figures 1 and 2)
2.0
4.5
6.0
200
40 34
250
50 43
300
60 51
ns
t
PLH
,
t
PHL
Maximum Propagation Delay, Inputs A < B or A = B to Output A > B
(Figures 1 and 2)
2.0
4.5
6.0
175
35 30
220
44 37
265
53 45
ns
t
PLH
,
t
PHL
Maximum Propagation Delay, Inputs A>B or A = B to Output A < B
(Figures 1 and 2)
2.0
4.5
6.0
175
35 30
220
44 37
265
53 45
ns
t
PLH
,
t
PHL
Maximum Propagation Delay, Input A = B to Output A = B
(Figures 1 and 2)
2.0
4.5
6.0
145
29 25
180
36 31
220
44 38
ns
t
TLH
,
t
THL
Maximum Output Transition Time, Any Output
(Figures 1 and 2)
2.0
4.5
6.0
75 15 13
95 19 16
110
22 19
ns
C
in
Maximum Input Capacitance
10
10
10
pF
NOTES:
1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
2. Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V
50
*Used to determine the no–load dynamic power consumption: PD = CPD V
CC
2
f + ICC VCC. For load considerations, see Chapter 2 of the
Motorola High–Speed CMOS Data Book (DL129/D).
Figure 1. Switching Waveforms
10%
10%
90%
50%
90%
50%
50%
t
r
t
f
INPUTS
OUTPUTS
t
PLH
t
PHL
t
PLH
t
PHL
t
THL
t
TLH
OUTPUTS
V
CC
GND
*Includes all probe and jig capacitance
CL*
TEST POINT
DEVICE UNDER
TEST
OUTPUT
Figure 2. Test Circuit
C
PD
Power Dissipation Capacitance (Per Package)*
pF
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