Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 8
1 Publication Order Number:
MC74HC595A/D
MC74HC595A
8-Bit Serial-Input/Serial or
Parallel-Output Shift
Register with Latched
3-State Outputs
High–Performance Silicon–Gate CMOS
The MC74HC595A consists of an 8–bit shift register and an 8–bit
D–type latch with three–state parallel outputs. The shift register
accepts serial data and provides a serial output. The shift register also
provides parallel data to the 8–bit latch. The shift register and latch
have independent clock inputs. This device also has an asynchronous
reset for the shift register.
The HC595A directly interfaces with the SPI serial data port on
CMOS MPUs and MCUs.
• Output Drive Capability: 15 LSTTL Loads
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 2.0 to 6.0 V
• Low Input Current: 1.0 µA
• High Noise Immunity Characteristic of CMOS Devices
• In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
• Chip Complexity: 328 FETs or 82 Equivalent Gates
• Improvements over HC595
— Improved Propagation Delays
— 50% Lower Quiescent Power
— Improved Input Noise and Latchup Immunity
LOGIC DIAGRAM
SERIAL
DATA
INPUT
14
11
10
12
13
SHIFT
CLOCK
RESET
LATCH
CLOCK
OUTPUT
ENABLE
SHIFT
REGISTER
LATCH
15
1
2
3
4
5
6
7
9
Q
A
Q
B
Q
C
Q
D
Q
E
Q
F
Q
G
Q
H
SQ
H
A
VCC = PIN 16
GND = PIN 8
PARALLEL
DATA
OUTPUTS
SERIAL
DATA
OUTPUT
SO–16
D SUFFIX
CASE 751B
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TSSOP–16
DT SUFFIX
CASE 948F
1
16
PDIP–16
N SUFFIX
CASE 648
1
16
1
16
MARKING
DIAGRAMS
1
16
MC74HC595AN
AWLYYWW
1
16
HC595A
AWLYWW
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
HC
595A
ALYW
1
16
Device Package Shipping
ORDERING INFORMATION
MC74HC595AN PDIP–16 2000 / Box
MC74HC595AD SOIC–16
48 / Rail
MC74HC595ADR2 SOIC–16 2500 / Reel
MC74HC595ADT TSSOP–16 96 / Rail
MC74HC595ADTR2 TSSOP–16
2500 / Reel
PIN ASSIGNMENT
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
LATCH CLOCK
OUTPUT ENABLE
A
Q
A
V
CC
SQ
H
RESET
SHIFT CLOCK
Q
E
Q
D
Q
C
Q
B
GND
Q
H
Q
G
Q
F
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DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
DC Output Current, per Pin
DC Supply Current, VCC and GND Pins
Power Dissipation in Still Air, Plastic DIP†
SOIC Package†
TSSOP Package†
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP, SOIC or TSSOP Package)
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: – 6.1 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage
(Referenced to GND)
Operating Temperature, All Package Types
Input Rise and Fall Time VCC = 2.0 V
(Figure 1) VCC = 4.5 V
VCC = 6.0 V
ns
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Minimum High–Level Input
Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
Maximum Low–Level Input
Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
Minimum High–Level Output
Voltage, QA – Q
H
Vin = VIH or V
IL
|I
out
| v 20 µA
Vin = VIH or VIL|I
out
| v 2.4 mA
|I
out
| v 6.0 mA
|I
out
| v 7.8 mA
Maximum Low–Level Output
Voltage, QA – Q
H
Vin = VIH or V
IL
|I
out
| v 20 µA
Vin = VIH or VIL|I
out
| v 2.4 mA
|I
out
| v 6.0 mA
|I
out
| v 7.8 mA
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
V
out
should be constrained to the
range GND v (Vin or V
out
) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
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DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Minimum High–Level Output
Voltage, SQ
H
Vin = VIH or V
IL
II
out
I v 20 µA
Vin = VIH or VIL|I
out
| v 2.4 mA
II
outI v
4.0 mA
II
out
Iv 5.2 mA
Maximum Low–Level Output
Voltage, SQ
H
Vin = VIH or V
IL
II
out
I v 20 µA
Vin = VIH or VIL|I
out
| v 2.4 mA
II
outI v
4.0 mA
II
out
Iv 5.2 mA
Maximum Input Leakage
Current
Maximum Three–State
Leakage
Current, QA – Q
H
Output in High–Impedance State
Vin = VIL or V
IH
V
out
= VCC or GND
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
l
out
= 0 µA
µA
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book
(DL129/D).
AC ELECTRICAL CHARACTERISTICS (C
L
= 50 pF, Input tr = tf = 6.0 ns)
Maximum Clock Frequency (50% Duty Cycle)
(Figures 1 and 7)
Maximum Propagation Delay, Shift Clock to SQ
H
(Figures 1 and 7)
Maximum Propagation Delay, Reset to SQ
H
(Figures 2 and 7)
Maximum Propagation Delay, Latch Clock to QA – Q
H
(Figures 3 and 7)
Maximum Propagation Delay, Output Enable to QA – Q
H
(Figures 4 and 8)
Maximum Propagation Delay, Output Enable to QA – Q
H
(Figures 4 and 8)
Maximum Output Transition Time, QA – Q
H
(Figures 3 and 7)
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AC ELECTRICAL CHARACTERISTICS (C
L
= 50 pF, Input tr = tf = 6.0 ns)
Maximum Output Transition Time, SQ
H
(Figures 1 and 7)
Maximum Input Capacitance
Maximum Three–State Output Capacitance (Output in
High–Impedance State), QA – Q
H
pF
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ON
Semiconductor High–Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V
C
PD
Power Dissipation Capacitance (Per Package)*
300
pF
*Used to determine the no–load dynamic power consumption: PD = CPD V
CC
2
f + ICC VCC. For load considerations, see Chapter 2 of the
ON Semiconductor High–Speed CMOS Data Book (DL129/D).
TIMING REQUIREMENTS (Input t
r
= tf = 6.0 ns)
Minimum Setup Time, Serial Data Input A to Shift Clock
(Figure 5)
Minimum Setup Time, Shift Clock to Latch Clock
(Figure 6)
Minimum Hold Time, Shift Clock to Serial Data Input A
(Figure 5)
Minimum Recovery Time, Reset Inactive to Shift Clock
(Figure 2)
Minimum Pulse Width, Reset
(Figure 2)
Minimum Pulse Width, Shift Clock
(Figure 1)
Minimum Pulse Width, Latch Clock
(Figure 6)
Maximum Input Rise and Fall Times
(Figure 1)