SEMICONDUCTOR TECHNICAL DATA
1
REV 7
Motorola, Inc. 1997
3/97
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High–Performance Silicon–Gate CMOS
The MC54/74HC595A is identical in pinout to the LS595. The device
inputs are compatible with standard CMOS outputs; with pullup resistors,
they are compatible with LSTTL outputs.
The HC595A consists of an 8–bit shift register and an 8–bit D–type latch
with three–state parallel outputs. The shift register accepts serial data and
provides a serial output. The shift register also provides parallel data to the
8–bit latch. The shift register and latch have independent clock inputs. This
device also has an asynchronous reset for the shift register.
The HC595A directly interfaces with the Motorola SPI serial data port on
CMOS MPUs and MCUs.
• Output Drive Capability: 15 LSTTL Loads
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 2.0 to 6.0 V
• Low Input Current: 1.0 µA
• High Noise Immunity Characteristic of CMOS Devices
• In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
• Chip Complexity: 328 FETs or 82 Equivalent Gates
• Improvements over HC595
— Improved Propagation Delays
— 50% Lower Quiescent Power
— Improved Input Noise and Latchup Immunity
LOGIC DIAGRAM
SERIAL
DATA
INPUT
14
11
10
12
13
SHIFT
CLOCK
RESET
LATCH
CLOCK
OUTPUT
ENABLE
SHIFT
REGISTER
LATCH
15
1
2
3
4
5
6
7
9
Q
A
Q
B
Q
C
Q
D
Q
E
Q
F
Q
G
Q
H
SQ
H
A
VCC = PIN 16
GND = PIN 8
PARALLEL
DATA
OUTPUTS
SERIAL
DATA
OUTPUT
PIN ASSIGNMENT
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
LATCH CLOCK
OUTPUT ENABLE
A
Q
A
V
CC
SQ
H
RESET
SHIFT CLOCK
Q
E
Q
D
Q
C
Q
B
GND
Q
H
Q
G
Q
F
D SUFFIX
SOIC PACKAGE
CASE 751B–05
N SUFFIX
PLASTIC PACKAGE
CASE 648–08
ORDERING INFORMATION
MC54HCXXXAJ
MC74HCXXXAN
MC74HCXXXAD
MC74HCXXXADT
Ceramic
Plastic
SOIC
TSSOP
1
16
1
16
1
16
DT SUFFIX
TSSOP PACKAGE
CASE 948F–01
J SUFFIX
CERAMIC PACKAGE
CASE 620–10
1
16
MC54/74HC595A
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
2
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
DC Output Current, per Pin
DC Supply Current, VCC and GND Pins
Power Dissipation in Still Air,Plastic or Ceramic DIP†
SOIC Package†
TSSOP Package†
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP, SOIC or TSSOP Package)
(Ceramic DIP)
_
C
*Maximum Ratings are those values beyond which damage to the device may occur .
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
Ceramic DIP: – 10 mW/_C from 100_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: – 6.1 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage
(Referenced to GND)
Operating Temperature, All Package Types
Input Rise and Fall Time VCC = 2.0 V
(Figure 1) VCC = 4.5 V
VCC = 6.0 V
ns
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Minimum High–Level Input
Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
Maximum Low–Level Input
Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
Minimum High–Level Output
Voltage, QA – Q
H
Vin = VIH or V
IL
|I
out
| v 20 µA
Vin = VIH or VIL|I
out
| v 2.4 mA
|I
out
| v 6.0 mA
|I
out
| v 7.8 mA
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
V
out
should be constrained to the
range GND v (Vin or V
out
) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
MC54/74HC595A
High–Speed CMOS Logic Data
DL129 — Rev 6
3 MOTOROLA
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Maximum Low–Level Output
Voltage, QA – Q
H
Vin = VIH or V
IL
|I
out
| v 20 µA
Vin = VIH or VIL|I
out
| v 2.4 mA
|I
out
| v 6.0 mA
|I
out
| v 7.8 mA
Minimum High–Level Output
Voltage, SQ
H
Vin = VIH or V
IL
II
out
I v 20 µA
Vin = VIH or VIL|I
out
| v 2.4 mA
II
outI v
4.0 mA
II
out
Iv 5.2 mA
Maximum Low–Level Output
Voltage, SQ
H
Vin = VIH or V
IL
II
out
I v 20 µA
Vin = VIH or VIL|I
out
| v 2.4 mA
II
outI v
4.0 mA
II
out
Iv 5.2 mA
Maximum Input Leakage Current
Maximum Three–State Leakage
Current, QA – Q
H
Output in High–Impedance State
Vin = VIL or V
IH
V
out
= VCC or GND
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
l
out
= 0 µA
µA
NOTE:Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
AC ELECTRICAL CHARACTERISTICS (C
L
= 50 pF, Input tr = tf = 6.0 ns)
Maximum Clock Frequency (50% Duty Cycle)
(Figures 1 and 7)
Maximum Propagation Delay, Shift Clock to SQ
H
(Figures 1 and 7)
Maximum Propagation Delay, Reset to SQ
H
(Figures 2 and 7)
Maximum Propagation Delay, Latch Clock to QA – Q
H
(Figures 3 and 7)
Maximum Propagation Delay, Output Enable to QA – Q
H
(Figures 4 and 8)
Maximum Propagation Delay, Output Enable to QA – Q
H
(Figures 4 and 8)