SEMICONDUCTOR TECHNICAL DATA
1
REV 6
Motorola, Inc. 1995
10/95
High–Performance Silicon–Gate CMOS
The MC74HC151 is identical in pinout to the LS151. The device inputs are
compatible with standard CMOS outputs; with pullup resistors, they are
compatible with LSTTL outputs.
This device selects one of the eight binary Data Inputs, as determined by
the Address Inputs. The Strobe pin must be at a low level for the selected
data to appear at the outputs. If Strobe is high, the Y output is forced to a low
level and the Y
output is forced to a high level.
The HC151 is similar in function to the HC251 which has 3–state outputs.
• Output Drive Capability: 10 LSTTL Loads
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 2 to 6 V
• Low Input Current: 1 µA
• High Noise Immunity Characteristic of CMOS Devices
• In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
• Chip Complexity: 132 FETs or 33 Equivalent Gates
LOGIC DIAGRAM
D0
D1
D2
D3
D4
D5
D6
D7
A0
A1
A2
STROBE
Y
Y
DATA
OUTPUTS
DATA
INPUTS
ADDRESS
INPUTS
5
6
4
3
2
1
15
14
13
12
11
10
9
7
PIN 16 = V
CC
PIN 8 = GND
FUNCTION TABLE
PIN ASSIGNMENT
Inputs Outputs
A2 A1 A0 Strobe Y Y
X X X H L H
L L L L D0 D0
L L H L D1 D1
L H L L D2 D2
L H H L D3 D3
H L L L D4 D4
H L H L D5 D5
H H L L D6 D6
H H H L D7 D7
D0, D1, …, D7 = the level of the respective
D input.
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
D3
D0
D1
D2
STROBE
Y
Y
GND
D7
D6
D5
D4
V
CC
A1
A0
A2
D SUFFIX
SOIC PACKAGE
CASE 751B–05
N SUFFIX
PLASTIC PACKAGE
CASE 648–08
1
16
1
16
ORDERING INFORMATION
MC74HCXXXN
MC74HCXXXD
Plastic
SOIC
MC74HC151
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
2
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
DC Output Current, per Pin
DC Supply Current, VCC and GND Pins
Power Dissipation in Still Air Plastic DIP†
SOIC Package†
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
Input Rise and Fall Time VCC = 2.0 V
(Figure 1) VCC = 4.5 V
VCC = 6.0 V
ns
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Minimum High–Level Input
Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
Maximum Low–Level Input
Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
Vin = VIH or V
IL
|I
out
| v 20 µA
Vin = V
IH
|I
out
| v 4.0 mA
|I
out
| v 5.2 mA
Vin = VIH or V
IL
|I
out
| v 20 µA
Vin = VIH or VIL|I
out
| v 4.0 mA
|I
out
| v 5.2 mA
Maximum Input Leakage Current
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
I
out
= 0 µA
µA
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
V
out
should be constrained to the
range GND v (Vin or V
out
) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
V
OH
V
Minimum High–Level Output
Voltage
Maximum Low–Level Output
OL
Voltage
V
V