Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 9
1 Publication Order Number:
MC74HC125A/D
MC74HC125A,
MC74HC126A
Quad 3-State Noninverting
Buffers
High–Performance Silicon–Gate CMOS
The MC74HC125A and MC74HC126A are identical in pinout to
the LS125 and LS126. The device inputs are compatible with standard
CMOS outputs; with pullup resistors, they are compatible with
LSTTL outputs.
The HC125A and HC126A noninverting buffers are designed to be
used with 3–state memory address drivers, clock drivers, and other
bus–oriented systems. The devices have four separate output enables
that are active–low (HC125A) or active–high (HC126A).
• Output Drive Capability: 15 LSTTL Loads
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 2.0 to 6.0 V
• Low Input Current: 1.0 µA
• High Noise Immunity Characteristic of CMOS Devices
• In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
• Chip Complexity: 72 FETs or 18 Equivalent Gates
LOGIC DIAGRAM
HC125A
Active–Low Output Enables
HC126A
Active–High Output Enables
Y1
Y2
Y4
3
6
8
11
13
12
10
9
4
5
1
2
A1
OE1
A2
OE2
A3
OE3
A4
OE4
PIN 14 = V
CC
PIN 7 = GND
A1
OE1
A2
OE2
A3
OE3
A4
OE4
Y3
Y1
Y2
Y4
Y3
13
12
10
9
4
5
1
23
6
8
11
FUNCTION TABLE
HC125A
Inputs Output
AOE Y
HL H
LL L
XH Z
HC126A
Inputs Output
AOE Y
HH H
LH L
XL Z
Device Package Shipping
ORDERING INFORMATION
MC74HC12xAN PDIP–14 2000 / Box
MC74HC12xAD SOIC–14
http://onsemi.com
55 / Rail
MC74HC12xADR2 SOIC–14 2500 / Reel
MARKING
DIAGRAMS
A = Assembly Location
WL or L = Wafer Lot
YY or Y = Year
WW or W = Work Week
MC74HC12xADT TSSOP–14 96 / Rail
MC74HC12xADTR2 TSSOP–14
2500 / Reel
TSSOP–14
DT SUFFIX
CASE 948G
HC
12xA
ALYW
1
14
1
14
PDIP–14
N SUFFIX
CASE 646
MC74HC12xAN
AWLYYWW
SOIC–14
D SUFFIX
CASE 751A
1
14
HC12xA
AWLYWW
PIN ASSIGNMENT
11
12
13
14
8
9
105
4
3
2
1
7
6
OE3
Y4
A4
OE4
V
CC
Y3
A3
OE2
Y1
A1
OE1
GND
Y2
A2
MC74HC125A, MC74HC126A
http://onsemi.com
2
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
DC Output Current, per Pin
DC Supply Current, VCC and GND Pins
Power Dissipation in Still Air Plastic DIP†
SOIC Package†
TSSOP Package†
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP, SOIC or TSSOP Package)
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: – 6.1 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage
(Referenced to GND)
Operating Temperature, All Package Types
Input Rise and Fall Time VCC = 2.0 V
(Figure 1) VCC = 4.5 V
VCC = 6.0 V
ns
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Minimum High–Level Input
Voltage
V
out
= VCC – 0.1 V
|I
out
| v 20 µA
Maximum Low–Level Input
Voltage
V
out
= 0.1 V
|I
out
| v 20 µA
Minimum High–Level Output
Voltage
Vin = V
IH
|I
out
| v 20 µA
Vin = V
IH
|I
out
| v 3.6 mA
|I
out
| v 6.0 mA
|I
out
| v 7.8 mA
Maximum Low–Level Output
Voltage
Vin = V
IL
|I
out
| v 20 µA
Vin = V
IL
|I
out
| v 3.6 mA
|I
out
| v 6.0 mA
|I
out
| v 7.8 mA
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
V
out
should be constrained to the
range GND v (Vin or V
out
) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
MC74HC125A, MC74HC126A
http://onsemi.com
3
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Maximum Input Leakage
Current
Maximum Three–State
Leakage Current
Output in High–Impedance State
Vin = VIL or V
IH
V
out
= VCC or GND
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
I
out
= 0 µA
µA
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book
(DL129/D).
AC ELECTRICAL CHARACTERISTICS (C
L
= 50 pF, Input tr = tf = 6.0 ns)
Maximum Propagation Delay, Input A to Output Y
(Figures 1 and 3)
Maximum Propagation Delay, Output Enable to Y
(Figures 2 and 4)
Maximum Propagation Delay, Output Enable to Y
(Figures 2 and 4)
Maximum Output Transition Time, Any Output
(Figures 1 and 3)
Maximum Input Capacitance
Maximum Three–State Output Capacitance
(Output in High–Impedance State)
pF
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ON
Semiconductor High–Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V
C
PD
Power Dissipation Capacitance (Per Buffer)*
30
pF
*Used to determine the no–load dynamic power consumption: PD = CPD V
CC
2
f + ICC VCC. For load considerations, see Chapter 2 of the
ON Semiconductor High–Speed CMOS Data Book (DL129/D).