SEMICONDUCTOR TECHNICAL DATA
1
REV 6
Motorola, Inc. 1995
10/95
!
" !
High–Performance Silicon–Gate CMOS
The MC74HC125A and MC74HC126A are identical in pinout to the LS125
and LS126. The device inputs are compatible with standard CMOS outputs;
with pullup resistors, they are compatible with LSTTL outputs.
The HC125A and HC126A noninverting buffers are designed to be used
with 3–state memory address drivers, clock drivers, and other bus–oriented
systems. The devices have four separate output enables that are active–low
(HC125A) or active–high (HC126A).
• Output Drive Capability: 15 LSTTL Loads
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 2.0 to 6.0 V
• Low Input Current: 1.0 µA
• High Noise Immunity Characteristic of CMOS Devices
• In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
• Chip Complexity: 72 FETs or 18 Equivalent Gates
LOGIC DIAGRAM
HC125A
Active–Low Output Enables
HC126A
Active–High Output Enables
Y1
Y2
Y4
3
6
8
11
13
12
10
9
4
5
1
2
A1
OE1
A2
OE2
A3
OE3
A4
OE4
PIN 14 = V
CC
PIN 7 = GND
A1
OE1
A2
OE2
A3
OE3
A4
OE4
Y3
Y1
Y2
Y4
Y3
13
12
10
9
4
5
1
2 3
6
8
11
FUNCTION TABLE
PIN ASSIGNMENT
HC125A
Inputs Output
A OE Y
H L H
L L L
X H Z
HC126A
Inputs Output
A OE Y
H H H
L H L
X L Z
X = don’t care
Z = high impedance
11
12
13
14
8
9
105
4
3
2
1
7
6
OE3
Y4
A4
OE4
V
CC
Y3
A3
OE2
Y1
A1
OE1
GND
Y2
A2
D SUFFIX
SOIC PACKAGE
CASE 751A–03
N SUFFIX
PLASTIC PACKAGE
CASE 646–06
1
14
1
14
ORDERING INFORMATION
MC74HCXXXAN
MC74HCXXXAD
Plastic
SOIC
MC74HC125A MC74HC126A
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
2
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
DC Output Current, per Pin
DC Supply Current, VCC and GND Pins
Power Dissipation in Still Air Plastic DIP†
SOIC Package†
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage
(Referenced to GND)
Operating Temperature, All Package Types
Input Rise and Fall Time VCC = 2.0 V
(Figure 1) VCC = 4.5 V
VCC = 6.0 V
ns
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Minimum High–Level Input
Voltage
V
out
= VCC – 0.1 V
|I
out
| v 20 µA
Maximum Low–Level Input
Voltage
V
out
= 0.1 V
|I
out
| v 20 µA
Vin = V
IH
|I
out
| v 20 µA
Vin = V
IH
|I
out
| v 6.0 mA
|I
out
| v 7.8 mA
Vin = V
IL
|I
out
| v 20 µA
Vin = V
IL
|I
out
| v 6.0 mA
|I
out
| v 7.8 mA
Maximum Input Leakage Current
Maximum Three–State Leakage
Current
Output in High–Impedance State
Vin = VIL or V
IH
V
out
= VCC or GND
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
I
out
= 0 µA
µA
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
V
out
should be constrained to the
range GND v (Vin or V
out
) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
V
OH
V
OL
Minimum High–Level Output
Voltage
Maximum Low–Level Output
Voltage
V
V