MC145500•MC145501•MC145502•MC145503•MC145505MOTOROLA
7
MODE CONTROL LOGIC (V
SS
to VDD = 4.75 V to 12.6 V, TA = – 40 to + 85°C)
Characteristic
Min Typ Max Unit
VLS Voltage for TTL Mode (TTL Logic Levels Referenced to VLS) V
SS
— VDD – 4.0 V
VLS Voltage for CMOS Mode (CMOS Logic Levels of VSS to VDD) VDD – 0.5 — V
DD
V
Mu/A Select Voltage
Mu–Law Mode
Sign Magnitude Mode
A–Law Mode
VDD – 0.5
VAG – 0.5
V
SS
—
—
—
V
DD
VAG + 0.5
VSS + 0.5
V
RSI Voltage for Reference Select Input (MC145501 and MC145502) 3.78 V Mode
2.5 V Mode
3.15 V Mode
VDD – 0.5
VAG – 0.5
V
SS
—
—
—
V
DD
VAG + 0.5
VSS + 0.5
V
V
ref
Voltage for Internal or External Reference (MC145502 Only)
Internal Reference Mode
External Reference Mode
V
SS
VAG + 0.5
—
—
VSS + 0.5
VDD – 1.0
V
Analog Test Mode Frequency, MS = CCI (MC145500, MC145501, MC145502 Only)
See Pin Description; Test Modes
— 128 — kHz
SWITCHING CHARACTERISTICS (V
SS
to VDD = 9.5 V to 12.6 V, TA = – 40 to + 85°C, CL = 150 pF, CMOS or TTL Mode)
Characteristic
Symbol Min Typ Max Unit
Output Rise Time TDD
Output Fall Time
t
TLH
t
THL
—
—
30
30
80
80
ns
Input Rise Time TDE, TDC, RCE, RDC, DC, MSI, CCI
Input Fall Time
t
TLH
t
THL
—
—
—
—
4
4
µs
Pulse Width TDE Low, TDC, RCE, RDC, DC, MSI, CCI t
w
100 — — ns
DCLK Pulse Frequency (MC145502/05 Only) TDC, RDC, DC f
CL
64 — 4096 kHz
CCI Clock Pulse Frequency (MSI = 8 kHz)
CCI is internally tied to TDC on the MC145500/01/03, therefore, the
transmit data clock must be one of these frequencies. This pin will accept
one of these discrete clock frequencies and will compensate to produce
internal sequencing.
f
CL1
f
CL2
f
CL3
f
CL4
f
CL5
—
—
—
—
—
128
1536
1544
2048
2560
—
—
—
—
—
kHz
Propagation Delay Time
TDE Rising to TDD Low Impedance TTL
CMOS
TDE Falling to TDD High Impedance TTL
CMOS
TDC Rising Edge to TDD Data, During TDE High TTL
CMOS
TDE Rising Edge to TDD Data, During TDC High TTL
CMOS
t
P1
t
P2
t
P3
t
P4
—
—
—
—
—
—
—
—
90
90
—
—
90
90
90
90
180
150
55
40
180
150
180
150
ns
TDC Falling Edge to TDE Rising Edge Setup Time t
su1
20 — — ns
TDE Rising Edge to TDC Falling Edge Setup Time t
su2
100 — — ns
TDE Falling Edge to TDC Rising Edge to Preserve the Next TDD Data t
su8
20 — — ns
RDC Falling Edge to RCE Rising Edge Setup Time t
su3
20 — — ns
RCE Rising Edge to RDC Falling Edge Setup Time t
su4
100 — — ns
RDD Valid to RDC Falling Edge Setup Time t
su5
60 — — ns
CCI Falling Edge to MSI Rising Edge Setup Time t
su6
20 — — ns
MSI Rising Edge to CCI Falling Edge Setup Time t
su7
100 — — ns
RDD Hold Time from RDC Falling Edge t
h
100 — — ns
TDE, TDC, RCE, RDC, RDD, DC, MSI, CCI Input Capacitance — — 10 pF
TDE,TDC, RCE, RDC, RDD, DC, MSI, CCI Input Current — ± 0.01 ± 10 µA
TDD Capacitance During High Impedance (TDE Low) — 12 15 pF
TDD Input Current During High Impedance (TDE Low) — ± 0.1 ± 10.0 µA