MOTOROLA CMOS LOGIC DATA
65
MC14016B
The MC14016B quad bilateral switch is constructed with MOS P–channel
and N–channel enhancement mode devices in a single monolithic structure.
Each M C14016B c onsists o f four independent switches c apable of
controlling either digital or analog signals. The quad bilateral switch is used
in s ignal g ating, c hopper, modulator, demodulator and CMOS l ogic
implementation.
• Diode Protection on All Inputs
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
• Linearized Transfer Characteristics
• Low Noise — 12 nV/√Cycle
, f ≥ 1.0 kHz typical
• Pin–for–Pin Replacements for CD4016B, CD4066B (Note improved
transfer characteristic design causes more parasitic coupling
capacitance than CD4016)
• For Lower RON, Use The HC4016 High–Speed CMOS Device or The
MC14066B
• This Device Has Inputs and Outputs Which Do Not Have ESD
Protection. Antistatic Precautions Must Be Taken.
MAXIMUM RATINGS* (Voltages Referenced to V
SS
)
Input or Output Voltage (DC or Transient)
Input Current (DC or Transient),
per Control Pin
Power Dissipation, per Package†
Lead Temperature (8–Second Soldering)
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
†Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
This device contains protection circuitry to guard against damage
due to high static voltages or electric fields. However, precautions must
be taken to avoid applications of any voltage higher than maximum rated
voltages to this high-impedance circuit. For proper operation, Vin and
V
out
should be constrained to the range VSS ≤ (Vin or V
out
) ≤ VDD.
Unused inputs must always be tied to an appropriate logic voltage
level (e.g., either VSS or VDD). Unused outputs must be left open.
SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 1995
REV 3
1/94
L SUFFIX
CERAMIC
CASE 632
ORDERING INFORMATION
MC14XXXBCP Plastic
MC14XXXBCL Ceramic
MC14XXXBD SOIC
TA = – 55° to 125°C for all packages.
P SUFFIX
PLASTIC
CASE 646
D SUFFIX
SOIC
CASE 751A
BLOCK DIAGRAM
CONTROL 1
IN 1
CONTROL 2
IN 2
CONTROL 3
IN 3
CONTROL 4
IN 4
OUT 1
OUT 2
OUT 3
OUT 4
13
1
5
4
6
8
12
11
2
3
9
10
VDD = PIN 14
VSS = PIN 7
Control Switch
0 = V
SS
Off
1 = V
DD
On
LOGIC DIAGRAM
(1/4 OF DEVICE SHOWN)
CONTROL
OUT
IN
LOGIC DIAGRAM RESTRICTIONS
VSS
≤
Vin ≤ V
DD
VSS
≤
V
out
≤ V
DD
MOTOROLA CMOS LOGIC DATAMC14016B
66
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V
SS
)
Input Capacitance
Control
Switch Input
Switch Output
Feed Through
Quiescent Current
(Per Package)
“ON” Resistance
(VC = VDD, RL = 10 kΩ)
(Vin = + 5.0 Vdc)
(Vin = – 5.0 Vdc) VSS = – 5.0 Vdc
(Vin = ± 0.25 Vdc)
(Vin = + 7.5 Vdc)
(Vin = – 7.5 Vdc) VSS = – 7.5 Vdc
(Vin = ± 0.25 Vdc)
(Vin = + 10 Vdc)
(Vin = + 0.25 Vdc) VSS = 0 Vdc
(Vin = + 5.6 Vdc)
(Vin = + 15 Vdc)
(Vin = + 0.25 Vdc) VSS = 0 Vdc
(Vin = + 9.3 Vdc)
∆ “ON” Resistance
Between any 2 circuits in a common
package
(VC = VDD)
(Vin = ± 5.0 Vdc, VSS = – 5.0 Vdc)
(Vin = ± 7.5 Vdc, VSS = – 7.5 Vdc)
Input/Output Leakage Current
(VC = VSS)
(Vin = + 7.5, V
out
= – 7.5 Vdc)
(Vin = – 7.5, V
out
= + 7.5 Vdc)
µAdc
NOTE: All unused inputs must be returned to VDD or VSS as appropriate for the circuit application.
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
**For voltage drops across the switch (∆V
switch
) > 600 mV ( > 300 mV at high temperature), excessive VDD current may be drawn; i.e., the
current out of the switch may contain both VDD and switch input components. The reliability of the device will be unaffected unless the Maximum
Ratings are exceeded. (See first page of this data sheet.) Reference Figure 14.
Input Voltage
Control Input
1
MOTOROLA CMOS LOGIC DATA
67
MC14016B
ELECTRICAL CHARACTERISTICS* (C
L
= 50 pF, TA = 25_C)
t
PHZ
,
t
PLZ
,
t
PZH
,
t
PZL
Crosstalk, Control to Output (VSS = 0 Vdc)
(VC = VDD, Rin = 10 kΩ, R
out
= 10 kΩ,
f = 1.0 kHz)
Crosstalk between any two switches (VSS = 0 Vdc)
(RL = 1.0 kΩ, f = 1.0 MHz,
crosstalk+20log
10
V
out1
V
out2
)
Noise Voltage (VSS = 0 Vdc)
(VC = VDD, f = 100 Hz)
Second Harmonic Distortion (VSS = – 5.0 Vdc)
(Vin = 1.77 Vdc, RMS Centered @ 0.0 Vdc,
RL = 10 kΩ, f = 1.0 kHz)
Insertion Loss (VC = VDD, Vin = 1.77 Vdc,
VSS = – 5.0 Vdc, RMS centered = 0.0 Vdc, f = 1.0 MHz)
I
loss
+
20log
10
V
out
V
in
)
(RL = 1.0 kΩ)
(RL = 10 kΩ)
(RL = 100 kΩ)
(RL = 1.0 MΩ)
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
Bandwidth (– 3.0 dB)
(VC = VDD, Vin = 1.77 Vdc, VSS = – 5.0 Vdc,
RMS centered @ 0.0 Vdc)
(RL = 1.0 kΩ)
(RL = 10 kΩ)
(RL = 100 kΩ)
(RL = 1.0 MΩ)
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
OFF Channel Feedthrough Attenuation
(VSS = – 5.0 Vdc)
V
out
V
in
+
–50dB)
(RL = 1.0 kΩ)
(RL = 10 kΩ)
(RL = 100 kΩ)
(RL = 1.0 MΩ)
(VC = VSS, 20 log
10
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
kHz
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
PIN ASSIGNMENT
11
12
13
14
8
9
105
4
3
2
1
7
6
OUT 4
IN 4
CONTROL 4
CONTROL 1
V
DD
IN 3
OUT 3
IN 2
OUT 2
OUT 1
IN 1
V
SS
CONTROL 3
CONTROL 2
Propagation Delay Time (VSS = 0 Vdc)
Vin to V
out
(VC = VDD, RL = 10 kΩ)
Control to Output
(Vin