MOTOROLA CMOS LOGIC DATA
45
MC14013B
!
The MC14013B dual type D flip–flop is constructed with MOS P–channel
and N–channel enhancement mode devices in a single monolithic structure.
Each flip–flop has independent Data, (D), Direct Set, (S), Direct Reset, (R),
and Clock (C) inputs and complementary outputs (Q and Q
). These devices
may be used as shift register elements or as type T flip–flops for counter and
toggle applications.
• Static Operation
• Diode Protection on All Inputs
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
• Logic Edge–Clocked Flip–Flop Design
Logic state is retained indefinitely with clock level either high or low;
information is transferred to the output only on the positive–going edge
of the clock pulse
• Capable of Driving Two Low–power TTL Loads or One Low–power
Schottky TTL Load Over the Rated Temperature Range
• Pin–for–Pin Replacement for CD4013B
MAXIMUM RATINGS* (Voltages Referenced to V
SS
)
Input or Output Voltage (DC or Transient)
Input or Output Current (DC or Transient),
per Pin
Power Dissipation, per Package†
Lead Temperature (8–Second Soldering)
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
†Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
TRUTH TABLE
Inputs Outputs
Clock†Data Reset Set Q Q
0 0 0 0 1
1 0 0 1 0
X 0 0 Q Q
X X 1 0 0 1
X X 0 1 1 0
X X 1 1 1 1
X = Don’t Care
† = Level Change
No
Change
SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 1995
REV 3
1/94
L SUFFIX
CERAMIC
CASE 632
ORDERING INFORMATION
MC14XXXBCP Plastic
MC14XXXBCL Ceramic
MC14XXXBD SOIC
TA = – 55° to 125°C for all packages.
P SUFFIX
PLASTIC
CASE 646
D SUFFIX
SOIC
CASE 751A
BLOCK DIAGRAM
10
11
9
8
4
3
5
6
12
13
2
1
S
S
R
R
D
C
D
C
Q
Q
Q
Q
VDD = PIN 14
VSS = PIN 7
MOTOROLA CMOS LOGIC DATAMC14013B
46
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V
SS
)
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
“1” Level
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc) Source
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
– 4.2
– 0.88
– 2.25
– 8.8
(VOL = 0.4 Vdc) Sink
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Input Capacitance
(Vin = 0)
Quiescent Current
(Per Package)
Total Supply Current**†
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
IT = (0.75 µA/kHz) f + I
DD
IT = (1.5 µA/kHz) f + I
DD
IT = (2.3 µA/kHz) f + I
DD
µAdc
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
**The formulas given are for the typical characteristics only at 25_C.
†To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.002.
This device contains protection circuitry to guard against damage
due to high static voltages or electric fields. However, precautions must
be taken to avoid applications of any voltage higher than maximum rated
voltages to this high-impedance circuit. For proper operation, Vin and
V
out
should be constrained to the range VSS ≤ (Vin or V
out
) ≤ VDD.
Unused inputs must always be tied to an appropriate logic voltage
level (e.g., either VSS or VDD). Unused outputs must be left open.
11
12
13
14
8
9
105
4
3
2
1
7
6
R
B
C
B
Q
B
Q
B
V
DD
S
B
D
B
R
A
C
A
Q
A
Q
A
V
SS
S
A
D
A
PIN ASSIGNMENT