Motorola MC10H121L, MC10H121P Datasheet

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SEMICONDUCTOR TECHNICAL DATA

  

The MC10H121 is a basic logic building block providing the simultaneous
OR–AND/OR–AND–Invert function, useful in data control and digital
multiplexing applications. This MECL 10H part is a functional/pinout duplication
of the standard MECL 10K family part, with 100% improvement in propagation
delay, and no increase in power– supply current.

• Propagation Delay, 1.0 ns Typical

• Power Dissipation 100 mW/Gate Typical (same as MECL 10K)

• Improved Noise Margin 150 mV (Over Operating Voltage and

Temperature Range)

• Voltage Compensated

• MECL 10K–Compatible

MAXIMUM RATINGS

Characteristic Symbol Rating Unit

Power Supply (VCC = 0) V
Input Voltage (VCC = 0) V
Output Current— Continuous

— Surge
Operating Temperature Range T
Storage Temperature Range— Plastic

— Ceramic

T

I

EE

I

out

A

stg

ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)

0° 25° 75°

Characteristic Symbol Min Max Min Max Min Max Unit

Power Supply Current I
Input Current High

Pins 3, 4, 5, 6, 7, 9

11, 12, 13, 14, 15

Pin 10
Input Current Low I
High Output Voltage V
Low Output Voltage V
High Input Voltage V
Low Input Voltage V

I

E

inH

inL

OH

OL

IH

— 29 — 26 — 29 mA

——500

610——

0.5 — 0.5 — 0.3 — µA
–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc
–1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc
–1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc
–1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc

IL

AC PARAMETERS

Propagation Delay

Pin 10 Only

Exclude Pin 10
Rise Time t
Fall Time t

NOTE:

Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit
board and transverse air flow greater than 500 Iinear fpm is maintained. Outputs are terminated through
a 50–ohm resistor to –2.0 volts.

t

pd

0.45

0.55

r
f

1.8

0.45

1.95

0.5 1.7 0.5 1.8 0.5 1.9 ns

0.5 1.7 0.5 1.8 0.5 1.9 ns

0.6

–8.0 to 0 Vdc
0 to V

EE

50

100

0 to +75 °C

–55 to +150
–55 to +165

295
360——

1.8

0.55

2.0

0.7

Vdc

mA

°C
°C

295
360

2.2

2.4

µA

ns



CERAMIC PACKAGE

PLASTIC PACKAGE

LOGIC DIAGRAM

4
5
6
7
9

10

11
12
13
14
15

V

A

OUT

A

OUT

A1
A1
A1
A2

CC1

V

EE

V

= PIN 1

CC1

V

= PIN 16

CC2

VEE = PIN 8

DIP

PIN ASSIGNMENT

1
2
3

IN
IN
IN
IN

4
5
6
7
8

L SUFFIX

CASE 620–10

P SUFFIX

CASE 648–08

FN SUFFIX

PLCC

CASE 775–02

16
15
14
13
12
11
10

V
A4
A4
A4
A3
A3
A2IN, A3
A2I

9

2
3

CC2

IN
IN
IN
IN
IN

IN

N

3/93

 Motorola, Inc. 1996

2–226

Pin assignment is for Dual–in–Line Package.

For PLCC pin assignment, see the Pin Conversion

T ables on page 6–11 of the Motorola MECL Data

Book (DL122/D).

REV 5

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 775–02

ISSUE C

MC10H121

–L–

20 1

Z

C

G

G1

0.010 (0.250) N

S

T

–N–

L–M

S

Y BRK

–M–

W

V

A

0.007 (0.180) N

0.007 (0.180) N

R

E

0.004 (0.100)

J

PLANE

SEATING

–T–

VIEW S

S

0.007 (0.180) N

B

0.007 (0.180) N

U

M

S

L–M

T

M

S

S

L–M

T

S

D

Z

D

X

0.010 (0.250) N

G1

S

S

L–M

T

S

VIEW D–D

M

M

S

L–M

T

L–M

T

S

S

S

0.007 (0.180) N

H

M

S

L–M

T

S

K1

K

0.007 (0.180) N

F

M

S

L–M

T

S

VIEW S

DL122 — Rev 6

NOTES:

1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DA TUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).

2–227 MOTOROLAMECL Data

DIM MIN MAX MIN MAX

A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21

W 0.042 0.048 1.07 1.21

X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50
Z 2 10 2 10

____

G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––

MILLIMETERSINCHES