GENERAL DATA — 1-3 WATT DO-41 SURMETIC 30
Motorola TVS/Zener Device Data
6-44
1–3 Watt DO-41 Surmetic 30 Data Sheet
t, TIME (SECONDS)
0.0001 0.0002 0.0005 0.001 0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 2 5 10
0.3
0.5
0.7
1
2
3
5
7
10
20
30
D =0.5
0.2
0.1
0.05
0.01
D = 0
DUTY CYCLE, D =t1/t
2
θ
JL
(t, D) TRANSIENT THERMAL RESISTANCE
JUNCTION-TO-LEAD ( C/W)
°
P
PK
t
1
NOTE: BELOW 0.1 SECOND, THERMAL
RESPONSE CURVE IS APPLICABLE
TO ANY LEAD LENGTH (L).
SINGLE PULSE ∆TJL =
θ
JL
(t)P
PK
REPETITIVE PULSES
∆
TJL =
θ
JL
(t,D)P
PK
t
2
0.02
10
20
30
50
100
200
300
500
1K
0.1 0.2 0.3 0.5 1 2 3 5 10 20 30 50 100
PW, PULSE WIDTH (ms)
P , PEAK SURGE POWER (WATTS)
PK
1 2 5 10 20 50 100 200 400 1000
0.0003
0.0005
0.001
0.002
0.005
0.01
0.02
0.05
0.1
0.2
0.5
1
2
3
TA = 125°C
TA = 125°C
NOMINAL VZ (VOLTS)
AS SPECIFIED IN ELEC. CHAR. TABLE
Figure 2. Typical Thermal Response L, Lead Length = 3/8 Inch
Figure 3. Maximum Surge Power Figure 4. Typical Reverse Leakage
I
R
, REVERSE LEAKAGE (
µ
Adc) @ V
R
RECTANGULAR
NONREPETITIVE
WAVEFORM
TJ= 25
°
C PRIOR
TO INITIAL PULSE
APPLICATION NOTE
Since the actual voltage available from a given zener diode
is temperature dependent, it is necessary to determine junction temperature under any set of operating conditions in order
to calculate its value. The following procedure is recommended:
Lead Temperature, TL, should be determined from:
TL = θLA PD + T
A
θLA is the lead-to-ambient thermal resistance (°C/W) and
PD is the power dissipation. The value for θLA will vary and
depends on the device mounting method. θLA is generally
30–40°C/W for the various clips and tie points in common
use and for printed circuit board wiring.
The temperature of the lead can also be measured using a
thermocouple placed on the lead as close as possible to the tie
point. The thermal mass connected to the tie point is normally
large enough so that it will not significantly respond to heat
surges generated in the diode as a result of pulsed operation
once steady-state conditions are achieved. Using the measured value of TL, the junction temperature may be determined by:
TJ = TL + ∆T
JL
∆TJL is the increase in junction temperature above the lead
temperature and may be found from Figure 2 for a train of
power pulses (L = 3/8 inch) or from Figure 10 for dc power.
∆TJL = θJL P
D
For worst-case design, using expected limits of IZ, limits of
PD and the extremes of TJ (∆TJ) may be estimated. Changes
in voltage, VZ, can then be found from:
∆V = θVZ ∆T
J
θVZ, the zener voltage temperature coefficient, is found from
Figures 5 and 6.
Under high power-pulse operation, the zener voltage will
vary with time and may also be affected significantly by the
zener resistance. For best regulation, keep current excursions
as low as possible.
Data of Figure 2 should not be used to compute surge capability. Surge limitations are given in Figure 3. They are lower
than would be expected by considering only junction temperature, as current crowding effects cause temperatures to be extremely high in small spots resulting in device degradation
should the limits of Figure 3 be exceeded.