MOTOROLA 17510 Technical data
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Advance Information
1.2 A 15 V H-Bridge Motor Driver IC
The 17510 is a monolithic H-Bridge designed to be used in portable
electronic applications such as digital and SLR cameras to control small DC
motors.
The 17510 can operate efficiently with supply voltages as low as 2.0 V to
as high as 15 V. Its low R
can provide continuous motor drive currents of 1.2 A and handle peak currents
up to 3.8 A. It is easily interfaced to low-cost MCUs via parallel 5.0 V
compatible logic. The device can be pulse width modulated (PWM-ed) at up to
200 kHz.
This device contains an integrated charge pump and level shifter (for gate
drive voltages), integrated shoot-through current protection (cross-conduction
suppression logic and timing), and undervoltage detection and shutdown
circuitry.
The 17510 has four operating modes: Forward, Reverse, Brake, and
Tri-Stated (High Impedance).
Features
• 2.0 V to 15 V Continuous Operation
• Output Current 1.2 A (DC), 3.8 A (Peak)
• 450 mΩ R
• 5.0 V TTL-/ CMOS-Compatible Inputs
• PWM Frequencies up to 200 kHz
• Undervoltage Shutdown
• Cross-Conduction Suppression
• Pb-Free Packaging Designated by Suffix Code EJ
H-Bridge MOSFETs
DS(ON)
H-Bridge output MOSFETs (0.45 Ω typical)
DS(ON)
Simplified Application Diagram
17510 Simplified Application Diagram
5.0 V 15 V
V
DD
C1L
C1H
C2L
C2H
C
RES
17510
VM
GOUT
OUT1
Document order number: MPC17510
Rev 1.0, 03/2004
17510
1.2 A 15 V H-BRIDGE MOTOR
DRIVER IC
MTB SUFFIX
EJ (Pb-FREE) SUFFIX
CASE 948K-01
24-LEAD TSSOP
ORDERING INFORMATION
Device
MPC17510EJ/R2 -30°C to 65°C 24 TSSOPW
Temperature
Range (T
A
Package
)
EN
MCU
This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Motorola, Inc. 2004
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GIN
IN1
IN2
MOTOR
OUT2
GND
Freescale Semiconductor, Inc.
C2H C2L C1LC1H GOUT
C
RES
V
DD
IN1
IN2
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EN
GIN
LGND
cale Semiconductor,
Charge Pump
Low-
Voltage
Detector
Level
Shifter
Predriver
Control
Logic
No Connect
Figure 1. 17510 Simplified Internal Block Diagram
H-Bridge
VM
OUT1
OUT2
PGND
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17510 MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
2
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OUT1
LGND
C
RES
NC
OUT1
PGND
NC
VM
IN1
IN2
C1H
C1L
TERMINAL FUNCTION DESCRIPTION
Terminal
1, 5 OUT1 Output 1 Driver output 1 terminals.
2 LGND Logic Ground Logic ground.
3 C
4, 7,
20, 22
17, 18 OUT2 Output 2 Driver output 2 terminals.
6, 19 PGND Power Ground Power ground.
8, 21 VM Motor Drive Power Supply Motor power supply voltage input terminals.
9 IN1 Input Control 1 Control signal input 1 terminal.
10 IN2 Input Control 2 Control signal input 2 terminal.
11 C1H Charge Pump 1H Charge pump bucket capacitor 1 (positive pole).
12 C1L Charge Pump 1L Charge pump bucket capacitor 1 (negative pole).
13 C2L Charge Pump 2L Charge pump bucket capacitor 2 (negative pole).
14 C2H Charge Pump 2H Charge pump bucket capacitor 2 (positive pole).
15 GOUT Gate Driver Output Output gate driver signal to external MOSFET switch.
16 EN Enable Control Enable control signal input terminal.
23 V
24
Terminal
Name
RES
NC No Connect No connection to these terminals.
DD
GIN
Formal Name Definition
Charge Pump Output
Capacitor Connection
Logic Supply Control circuit power supply terminal.
Gate Driver Input LOW = True control signal for GOUT terminal.
1
2
3
4
5
6
7
8
9
10
11
12
Charge pump reservoir capacitor terminal.
24
23
22
21
20
19
18
17
16
15
14
13
GIN
V
DD
NC
VM
NC
PGND
OUT2
OUT2
EN
GOUT
C2H
C2L
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 17510
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MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted. Exceeding the ratings may cause a malfunction or permanent
damage to the device.
Rating Symbol Value Unit
Motor Supply Voltage
Charge Pump Output Voltage (Note 1)
Logic Supply Voltage
Signal Input Voltage (EN, IN1, IN2, GIN)
Driver Output Current
Continuous
Peak (Note 2)
ESD Voltage
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Human Body Model (Note 3)
Machine Model (Note 4)
Storage Temperature
Operating Junction Temperature
Operating Ambient Temperature
Power Dissipation (Note 5)
Thermal Resistance
Soldering Temperature (Note 6)
Notes
1. When supplied externally, connect via 3.0 kΩ resistor.
= 25°C, 10 ms pulse at 200 ms interval.
2. T
A
3. ESD1 testing is performed in accordance with the Human Body Model (C
4. ESD2 testing is performed in accordance with the Machine Model (C
= 25°C, R
5. T
A
6. Soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause
malfunction or permanent damage to the device.
= 120°C/W, 37 mm x 50 mm Cu area (1.6 mm FR-4 PCB).
JA
θ
T
ZAP
= 200 pF, R
ZAP
V
M
V
C
RES
V
DD
V
IN
I
O
I
OPK
V
ESD1
V
ESD2
T
STG
T
J
T
A
P
D
R
JA
θ
SOLDER
= 100 pF, R
ZAP
ZAP
= 0 Ω).
-0.5 to 16 V
-0.5 to 13 V
-0.5 to 6.0 V
-0.5 to VDD+0.5 V
1.2
3.8
±1900
±130
-65 to 150 °C
-30 to 150 °C
-30 to 65 °C
1.0 W
120 °C/W
260 °C
= 1500 Ω).
cale Semiconductor,
A
V
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17510 MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
4
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