Mitsubishi Electronics QnUCPU User Manual

SAFETY PRECAUTIONS

(Read these precautions before using this product.)

Before using this product, please read this manual and the relevant manuals carefully and pay full attention to safety to handle the product correctly.

In this manual, the safety precautions are classified into two levels: " WARNING" and " CAUTION".

WARNING

CAUTION

Under some circumstances, failure to observe the precautions given under " CAUTION" may lead to serious consequences.

Make sure that the end users read this manual and then keep the manual in a safe place for future reference.

Indicates that incorrect handling may cause hazardous conditions, resulting in death or severe injury.

Indicates that incorrect handling may cause hazardous conditions, resulting in minor or moderate injury or property damage.

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[Design Precautions]

WARNING

Configure safety circuits external to the programmable controller to ensure that the entire system operates safely even when a fault occurs in the external power supply or the programmable controller. Failure to do so may result in an accident due to an incorrect output or malfunction.

(1) Configure external safety circuits, such as an emergency stop circuit, protection circuit, and

protective interlock circuit for forward/reverse operation or upper/lower limit positioning.

(2) The programmable controller stops its operation upon detection of the following status, and the

output status of the system will be as shown below.

Status

Overcurrent or overvoltage protection of the power supply module is activated.

The CPU module detects an error such as a watchdog timer error by the self-diagnostic function.

All outputs are turned off.

All outputs are held or turned off according to the parameter setting.

Output

All outputs may turn on when an error occurs in the part, such as I/O control part, where the CPU module cannot detect any error. To ensure safety operation in such a case, provide a safety mechanism or a fail-safe circuit external to the programmable controller. For a fail-safe circuit example, refer to Chapter 10 LOADING AND INSTALLATION in the QCPU User's Manual (Hardware Design, Maintenance and Inspection).

(3) Outputs may remain on or off due to a failure of an output module relay or transistor. Configure

an external circuit for monitoring output signals that could cause a serious accident.

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[Design Precautions]

WARNING

In an output module, when a load current exceeding the rated current or an overcurrent caused by a load short-circuit flows for a long time, it may cause smoke and fire. To prevent this, configure an external safety circuit, such as a fuse.

Configure a circuit so that the programmable controller is turned on first and then the external power supply. If the external power supply is turned on first, an accident may occur due to an incorrect output or malfunction.

For the operating status of each station after a communication failure, refer to relevant manuals for the network. Incorrect output or malfunction due to a communication failure may result in an accident.

When changing data of the running programmable controller from a peripheral connected to the CPU module or from a personal computer connected to an intelligent function module, configure an interlock circuit in the sequence program to ensure that the entire system will always operate safely. For program modification and operating status change, read relevant manuals carefully and ensure the safety before operation. Especially, in the case of a control from an external device to a remote programmable controller, immediate action cannot be taken for a problem on the programmable controller due to a communication failure. To prevent this, configure an interlock circuit in the sequence program, and determine corrective actions to be taken between the external device and CPU module in case of a communication failure.

CAUTION

Do not install the control lines or communication cables together with the main circuit lines or power cables. Keep a distance of 100mm (3.94 inches) or more between them. Failure to do so may result in malfunction due to noise.

When a device such as a lamp, heater, or solenoid valve is controlled through an output module, a large current (approximately ten times greater than normal) may flow when the output is turned from off to on. Take measures such as replacing the module with one having a sufficient current rating.

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[Installation Precautions]

CAUTION

Use the programmable controller in an environment that meets the general specifications in the QCPU User's Manual (Hardware Design, Maintenance and Inspection). Failure to do so may result in electric shock, fire, malfunction, or damage to or deterioration of the product.

To mount the module, while pressing the module mounting lever located in the lower part of the module, fully insert the module fixing projection(s) into the hole(s) in the base unit and press the module until it snaps into place. Incorrect mounting may cause malfunction, failure or drop of the module. When using the programmable controller in an environment of frequent vibrations, fix the module with a screw. Tighten the screw within the specified torque range. Undertightening can cause drop of the screw, short circuit or malfunction. Overtightening can damage the screw and/or module, resulting in drop, short circuit, or malfunction.

When using an extension cable, connect it to the extension cable connector of the base unit securely.

Check the connection for looseness. Poor contact may cause incorrect input or output.

When using a memory card, fully insert it into the memory card slot. Check that it is inserted completely. Poor contact may cause malfunction.

Shut off the external power supply for the system in all phases before mounting or removing the module. Failure to do so may result in damage to the product. A module can be replaced online (while power is on) on any MELSECNET/H remote I/O station or in the system where a CPU module supporting the online module change function is used. Note that there are restrictions on the modules that can be replaced online, and each module has its predetermined replacement procedure. For details, refer to the relevant sections in the QCPU User's Manual (Hardware Design, Maintenance and Inspection) and in the manual for the corresponding module.

Do not directly touch any conductive part of the module. Doing so can cause malfunction or failure of the module.

When using a Motion CPU module and modules designed for motion control, check that the combinations of these modules are correct before applying power. The modules may be damaged if the combination is incorrect. For details, refer to the user's manual for the Motion CPU module.

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[Wiring Precautions]

WARNING

Shut off the external power supply for the system in all phases before wiring. Failure to do so may result in electric shock or damage to the product.

After wiring, attach the included terminal cover to the module before turning it on for operation. Failure to do so may result in electric shock.

CAUTION

Ground the FG and LG terminals to the protective ground conductor dedicated to the programmable controller. Failure to do so may result in electric shock or malfunction.

Use applicable solderless terminals and tighten them within the specified torque range. If any spade solderless terminal is used, it may be disconnected when the terminal screw comes loose, resulting in failure.

Check the rated voltage and terminal layout before wiring to the module, and connect the cables correctly. Connecting a power supply with a different voltage rating or incorrect wiring may cause a fire or failure.

Connectors for external connection must be crimped or pressed with the tool specified by the manufacturer, or must be correctly soldered. Incomplete connections could result in short circuit, fire, or malfunction.

Tighten the terminal screw within the specified torque range. Undertightening can cause short circuit, fire, or malfunction. Overtightening can damage the screw and/or module, resulting in drop, short circuit, or malfunction.

Prevent foreign matter such as dust or wire chips from entering the module. Such foreign matter can cause a fire, failure, or malfunction.

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[Wiring Precautions]

WARNING

A protective film is attached to the top of the module to prevent foreign matter, such as wire chips, from entering the module during wiring. Do not remove the film during wiring. Remove it for heat dissipation before system operation.

Mitsubishi programmable controllers must be installed in control panels. Connect the main power supply to the power supply module in the control panel through a relay terminal block. Wiring and replacement of a power supply module must be performed by maintenance personnel who is familiar with protection against electric shock. (For wiring methods, refer to the QCPU User's Manual (Hardware Design, Maintenance and Inspection)).

[Startup and Maintenance Precautions]

WARNING

Do not touch any terminal while power is on. Doing so will cause electric shock.

Correctly connect the battery connector. Do not charge, disassemble, heat, short-circuit, solder, or throw the battery into the fire. Doing so will cause the battery to produce heat, explode, or ignite, resulting in injury and fire.

Shut off the external power supply for the system in all phases before cleaning the module or retightening the terminal screws or module fixing screws. Failure to do so may result in electric shock. Undertightening the terminal screws can cause short circuit or malfunction. Overtightening can damage the screw and/or module, resulting in drop, short circuit, or malfunction.

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[Startup and Maintenance Precautions]

CAUTION

Before performing online operations (especially, program modification, forced output, and operation status change) for the running CPU module from the peripheral connected, read relevant manuals carefully and ensure the safety. Improper operation may damage machines or cause accidents.

Do not disassemble or modify the modules. Doing so may cause failure, malfunction, injury, or a fire.

Use any radio communication device such as a cellular phone or PHS (Personal Handy-phone System) more than 25cm (9.85 inches) away in all directions from the programmable controller. Failure to do so may cause malfunction.

Shut off the external power supply for the system in all phases before mounting or removing the module. Failure to do so may cause the module to fail or malfunction. A module can be replaced online (while power is on) on any MELSECNET/H remote I/O station or in the system where a CPU module supporting the online module change function is used. Note that there are restrictions on the modules that can be replaced online, and each module has its predetermined replacement procedure. For details, refer to the relevant sections in the QCPU User's Manual (Hardware Design, Maintenance and Inspection) and in the manual for the corresponding module.

After the first use of the product, do not mount/remove the module to/from the base unit, and the terminal block to/from the module more than 50 times (IEC 61131-2 compliant) respectively. Exceeding the limit of 50 times may cause malfunction.

Do not drop or apply shock to the battery to be installed in the module. Doing so may damage the battery, causing the battery fluid to leak inside the battery. If the battery is dropped or any shock is applied to it, dispose of it without using.

Before handling the module, touch a grounded metal object to discharge the static electricity from the human body. Failure to do so may cause the module to fail or malfunction.

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[Disposal Precautions]

CAUTION

When disposing of this product, treat it as industrial waste. When disposing of batteries, separate them from other wastes according to the local regulations. (For details of the battery directive in EU member states, refer to the QCPU User's Manual (Hardware Design, Maintenance and Inspection).)

[Transportation Precautions]

CAUTION

When transporting lithium batteries, follow the transportation regulations. (For details of the regulated models, refer to the QCPU User's Manual (Hardware Design, Maintenance and Inspection).)

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CONDITIONS OF USE FOR THE PRODUCT

(1) Mitsubishi programmable controller ("the PRODUCT") shall be used in conditions;

i) where any problem, fault or failure occurring in the PRODUCT, if any, shall not lead to any major or serious accident; and ii) where the backup and fail-safe function are systematically or automatically provided outside of the PRODUCT for the case of any problem, fault or failure occurring in the PRODUCT.

(2) The PRODUCT has been designed and manufactured for the purpose of being used in general

industries. MITSUBISHI SHALL HAVE NO RESPONSIBILITY OR LIABILITY (INCLUDING, BUT NOT LIMITED TO ANY AND ALL RESPONSIBILITY OR LIABILITY BASED ON CONTRACT, WARRANTY, TORT, PRODUCT LIABILITY) FOR ANY INJURY OR DEATH TO PERSONS OR LOSS OR DAMAGE TO PROPERTY CAUSED BY the PRODUCT THAT ARE OPERATED OR USED IN APPLICATION NOT INTENDED OR EXCLUDED BY INSTRUCTIONS, PRECAUTIONS, OR WARNING CONTAINED IN MITSUBISHI'S USER, INSTRUCTION AND/OR SAFETY MANUALS, TECHNICAL BULLETINS AND GUIDELINES FOR the PRODUCT. ("Prohibited Application") Prohibited Applications include, but not limited to, the use of the PRODUCT in;

• Nuclear Power Plants and any other power plants operated by Power companies, and/or any other cases in which the public could be affected if any problem or fault occurs in the PRODUCT.

• Railway companies or Public service purposes, and/or any other cases in which establishment of a special quality assurance system is required by the Purchaser or End User.

• Aircraft or Aerospace, Medical applications, Train equipment, transport equipment such as Elevator and Escalator, Incineration and Fuel devices, Vehicles, Manned transportation, Equipment for Recreation and Amusement, and Safety devices, handling of Nuclear or Hazardous Materials or Chemicals, Mining and Drilling, and/or other applications where there is a significant risk of injury to the public or property.

Notwithstanding the above, restrictions Mitsubishi may in its sole discretion, authorize use of the PRODUCT in one or more of the Prohibited Applications, provided that the usage of the PRODUCT is limited only for the specific applications agreed to by Mitsubishi and provided further that no special quality assurance or fail-safe, redundant or other safety features which exceed the general specifications of the PRODUCTs are required. For details, please contact the Mitsubishi representative in your region.

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REVISIONS

*The manual number is given on the bottom left of the back cover.

Print date Manual number Revision

Dec., 2008 SH(NA)-080807ENG-A Mar., 2009 SH(NA)-080807ENG-B Revision because of function addition to Built-in Ethernet port QCPU (first five

Jul., 2009 SH(NA)-080807ENG-C Revision because of function addition to the Universal model QCPU (first five

Nov., 2009 SH(NA)-080807ENG-D Partial correction

First edition

digits of the serial number is "11012" or later) Partial correction SAFETY PRECAUTIONS, INTRODUCTION, MANUALS, MANUAL PAGE ORGANIZATION, GENERIC TERMS AND ABBREVIATIONS, Section 1.3, 1.6,

2.2.2, 2.2.3, 2.3, 2.3.3, 2.3.4, 2.4, CHAPTER 3, Section 3.3, CHAPTER 4, Section 4.1.2, 4.2.2, 4.2.3, 5.1.1, 5.1.3, 5.1.6, 5.1.7, 5.1.8, 5.1.10, 6.1, 6.3, 6.4, 6.5,

6.6.1, 6.6.5, 6.11.1, 6.11.3, 6.11.4, 6.12.1, 6.13.3, 6.14, 6.15, 6.15.1, 6.15.2,

6.16, 6.17, 6.18, 6.20, 6.28, 6.30, 7.1.2, 8.2, 8.3, 9.2, 9.2.5, 9.2.11, 9.7.4, 9.11,

9.14.2, 11.5, Appendix 1, Appendix 2, Appendix 3.1, Appendix 3.3.2, Appendix 4 Addition Appendix 3.4.2

digits of the serial number is "11043" or later) Partial correction Section 5.1.1, 5.1.5, 5.3.3, 6.1, 6.18, 6.21.2, 6.28, 8.1, 9.2.10, 9.6.1, 10.1.3, 12.2, Appendix 1, Appendix 2, Appendix 3.1.2, Appendix 3.2 Addition Section 6.31, 6.32

SAFETY PRECAUTIONS, Section 4.2.2, 9.6.1, 9.7.4, Appendix 3.1.1, Appendix 3.1.2 Addition CONDITIONS OF USE FOR THE PRODUCT

Japanese manual version SH-080802-D

This manual confers no industrial property rights or any rights of any other kind, nor does it confer any patent licenses. Mitsubishi Electric Corporation cannot be held responsible for any problems involving industrial property rights which may occur as a result of using the contents noted in this manual.

2008 MITSUBISHI ELECTRIC CORPORATION

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INTRODUCTION

This manual describes the memory maps, functions, programs, I/O number assignment, and devices of the Universal model QCPU.

Before using this product, please read this manual and the relevant manuals carefully and develop familiarity with the functions and performance of the Q series programmable controller to handle the product correctly.

Relevant CPU module

CPU module Model

Q00UJCPU, Q00UCPU, Q01UCPU, Q02UCPU, Q03UD(E)CPU,

Universal model QCPU

Remark

This manual does not describe the specifications of the power supply modules, base units, extension cables, memory cards, and batteries. For details, refer to the following.

QCPU User's Manual (Hardware Design, Maintenance and Inspection)

Q04UD(E)HCPU, Q06UD(E)HCPU, Q10UD(E)HCPU, Q13UD(E)HCPU, Q20UD(E)HCPU, Q26UD(E)HCPU

For multiple CPU systems, refer to the following.

QCPU User's Manual (Multiple CPU System)

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CONTENTS

SAFETY PRECAUTIONS......................................................................................................................A - 1

CONDITIONS OF USE FOR THE PRODUCT ......................................................................................A - 9

REVISIONS ...........................................................................................................................................A - 10

INTRODUCTION ...................................................................................................................................A - 11

MANUALS .............................................................................................................................................A - 18

MANUAL PAGE ORGANIZATION .........................................................................................................A - 20

GENERIC TERMS AND ABBREVIATIONS ..........................................................................................A - 21

CHAPTER1 OVERVIEW 1-1 to 1-14

1.1 Processing Order in the CPU Module....................................................................................1 - 1

1.2 Storing and Executing Programs ...........................................................................................1 - 2

1.3 Structured Programming........................................................................................................1 - 3

1.4 Devices and Instructions Useful for Programming.................................................................1 - 6

1.5 Features.................................................................................................................................1 - 11

1.6 Checking Serial Number and Function Version .....................................................................1 - 13

CHAPTER2 SEQUENCE PROGRAMS 2-1 to 2-43

2.1 Sequence Program Overview................................................................................................2 - 1

2.2 Sequence Program Configuration..........................................................................................2 - 3

2.2.1 Main routine program........................................................................................................2 - 4

2.2.2 Subroutine program ..........................................................................................................2 - 5

2.2.3 Interrupt program ..............................................................................................................2 - 6

2.3 Settings When Program is Divided ........................................................................................2 - 13

2.3.1 Initial execution type program ...........................................................................................2 - 17

2.3.2 Scan execution type program ...........................................................................................2 - 20

2.3.3 Stand-by type program......................................................................................................2 - 21

2.3.4 Fixed scan execution type program ..................................................................................2 - 26

2.3.5 Changing the program execution type ..............................................................................2 - 30

2.4 Data Used in Sequence Programs ........................................................................................2 - 32

2.4.1 BIN (Binary Code) .............................................................................................................2 - 35

2.4.2 HEX (Hexadecimal)...........................................................................................................2 - 37

2.4.3 BCD (Binary-coded Decimal) ............................................................................................2 - 38

2.4.4 Real number (Floating-point data).....................................................................................2 - 39

2.4.5 Character string data.........................................................................................................2 - 43

CHAPTER3 CPU MODULE OPERATION 3-1 to 3-14

3.1 Initial Processing....................................................................................................................3 - 1

3.2 I/O Refresh (Refresh Processing with Input/Output Modules)...............................................3 - 2

3.3 Program Operation ................................................................................................................3 - 2

3.4 END Processing.....................................................................................................................3 - 2

3.5 Operation Processing in the RUN,STOP, or PAUSE Status ..................................................3 - 3

3.6 Operation Processing during Momentary Power Failure.......................................................3 - 5

3.7 Data Clear Processing...........................................................................................................3 - 6

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3.8 I/O Processing and Response Delay.....................................................................................3 - 8

3.8.1 Refresh mode....................................................................................................................3 - 9

3.8.2 Direct mode.......................................................................................................................3 - 12

CHAPTER4 ASSIGNMENT OF BASE UNIT AND I/O NUMBER 4-1 to 4-17

4.1 Base Unit Assignment............................................................................................................ 4 - 1

4.1.1 Base mode........................................................................................................................4 - 1

4.1.2 Base unit assignment setting ............................................................................................4 - 2

4.2 I/O Number Assignment.........................................................................................................4 - 4

4.2.1 Concept of I/O number assignment ..................................................................................4 - 5

4.2.2 Setting I/O numbers ..........................................................................................................4 - 8

4.2.3 I/O number setting example ..............................................................................................4 - 13

4.2.4 Checking I/O numbers ......................................................................................................4 - 17

CHAPTER5 MEMORIES AND FILES USED FOR CPU MODULE 5-1 to 5-38

5.1 Memories Used for CPU Module ...........................................................................................5 - 1

5.1.1 Memory composition and storable data ............................................................................5 - 1

5.1.2 Program memory ..............................................................................................................5 - 5

5.1.3 Program cache memory....................................................................................................5 - 8

5.1.4 Standard ROM ..................................................................................................................5 - 11

5.1.5 Standard RAM...................................................................................................................5 - 12

5.1.6 Memory card .....................................................................................................................5 - 14

5.1.7 Writing to the Flash card by GX Developer .......................................................................5 - 18

5.1.8 Operating the program in the memory card (boot operation) ............................................5 - 23

5.1.9 Details of written files ........................................................................................................5 - 27

5.1.10 Specifying valid parameters (parameter-valid drive setting)..............................................5 - 28

5.2 Program File Structure...........................................................................................................5 - 30

5.3 File Operations by GX Developer and Handling Precautions................................................5 - 32

5.3.1 File operations...................................................................................................................5 - 32

5.3.2 Precautions for handling files ............................................................................................5 - 33

5.3.3 File size.............................................................................................................................5 - 34

5.3.4 Units of file sizes ...............................................................................................................5 - 36

CHAPTER6 FUNCTIONS 6-1 to 6-165

6.1 Function List...........................................................................................................................6 - 1

6.2 Constant Scan ....................................................................................................................... 6 - 4

6.3 Latch Function .......................................................................................................................6 - 7

6.4 Output Mode at Operating Status Change (STOP to RUN)...................................................6 - 10

6.5 Clock Function .......................................................................................................................6 - 13

6.6 Remote Operation.................................................................................................................. 6 - 18

6.6.1 Remote RUN/STOP..........................................................................................................6 - 18

6.6.2 Remote PAUSE.................................................................................................................6 - 21

6.6.3 Remote RESET.................................................................................................................6 - 23

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6.6.4 Remote latch clear ............................................................................................................6 - 25

6.6.5 Relationship between remote operation and RUN/STOP status of the CPU module .......6 - 26

6.7 Q Series-compatible Module Input Response Time Selection (I/O Response Time) ............6 - 27

6.8 Error Time Output Mode Setting ............................................................................................6 - 29

6.9 H/W Error Time PLC Operation Mode Setting.......................................................................6 - 30

6.10 Intelligent Function Module Switch Setting ............................................................................6 - 31

6.11 Monitor Function ....................................................................................................................6 - 33

6.11.1 Monitor condition setting ...................................................................................................6 - 34

6.11.2 Local device monitor/test ..................................................................................................6 - 40

6.11.3 External input/output forced on/off ....................................................................................6 - 43

6.11.4 Executional conditioned device test ..................................................................................6 - 48

6.12 Writing Programs While CPU Module is in RUN Status.........................................................6 - 58

6.12.1 Online change (ladder mode)............................................................................................6 - 58

6.12.2 Online change (files) .........................................................................................................6 - 61

6.12.3 Precautions for online change...........................................................................................6 - 63

6.13 Execution Time Measurement ...............................................................................................6 - 69

6.13.1 Program monitor list ..........................................................................................................6 - 69

6.13.2 Interrupt program monitor list............................................................................................6 - 72

6.13.3 Scan time measurement ...................................................................................................6 - 73

6.14 Sampling Trace Function.......................................................................................................6 - 77

6.15 Debug Function from Multiple GX Developers....................................................................... 6 - 91

6.15.1 Simultaneous monitoring from multiple GX Developers function ......................................6 - 91

6.15.2 Online change function from multiple GX Developers ......................................................6 - 93

6.16 Watchdog Timer (WDT) .........................................................................................................6 - 95

6.17 Self-diagnostic Function.........................................................................................................6 - 97

6.17.1 LEDs indicating errors.......................................................................................................6 - 104

6.17.2 Error clear .........................................................................................................................6 - 104

6.18 Error History...........................................................................................................................6 - 105

6.19 System Protection..................................................................................................................6 - 106

6.19.1 Password registration........................................................................................................6 - 106

6.19.2 Remote password .............................................................................................................6 - 108

6.20 System Display of CPU Module with GX Developer..............................................................6 - 113

6.21 LED Indication........................................................................................................................ 6 - 116

6.21.1 Methods for turning off the LEDs.......................................................................................6 - 116

6.21.2 LED indication priority .......................................................................................................6 - 117

6.22 Interrupt from Intelligent Function Module .............................................................................6 - 119

6.23 Serial Communication Function .............................................................................................6 - 120

6.24 Service Processing ................................................................................................................6 - 128

6.24.1 Service processing setting ................................................................................................6 - 128

6.25 Initial Device Value.................................................................................................................6 - 135

6.26 Battery Life-prolonging Function............................................................................................6 - 139

6.27 Memory Check Function ........................................................................................................6 - 140

6.28 Latch Data Backup to Standard ROM Function .....................................................................6 - 141

6.29 Writing/Reading Device Data to/from Standard ROM ............................................................6 - 146

6.30 CPU Module Change Function with Memory Card................................................................6 - 147

6.30.1 Backup function to memory card.......................................................................................6 - 149

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6.30.2 Backup data restoration function.......................................................................................6 - 157

6.31 Module model name read ......................................................................................................6 - 161

6.32 Module error collection...........................................................................................................6 - 162

CHAPTER7 COMMUNICATIONS WITH INTELLIGENT FUNCTION

MODULE 7-1 to 7-9

7.1 Communications between CPU Module and Intelligent Function Module .............................7 - 1

7.1.1 Initial setting and auto refresh setting by GX Configurator................................................7 - 2

7.1.2 Initial setting by initial device value ...................................................................................7 - 5

7.1.3 Communications with the FROM and TO instructions ......................................................7 - 5

7.1.4 Communications using the intelligent function module device..........................................7 - 6

7.1.5 Communications using the intelligent function module dedicated instruction ...................7 - 8

CHAPTER8 PARAMETERS 8-1 to 8-26

8.1 PLC Parameters .................................................................................................................... 8 - 2

8.2 Network Parameters ..............................................................................................................8 - 21

8.3 Remote Password.................................................................................................................. 8 - 26

CHAPTER9 DEVICES 9-1 to 9-94

9.1 Device List .............................................................................................................................9 - 1

9.2 Internal User Device ..............................................................................................................9 - 3

9.2.1 Input (X) ............................................................................................................................9 - 6

9.2.2 Output (Y)..........................................................................................................................9 - 8

9.2.3 Internal relay (M)...............................................................................................................9 - 9

9.2.4 Latch relay (L) ...................................................................................................................9 - 10

9.2.5 Annunciator (F) .................................................................................................................9 - 11

9.2.6 Edge relay (V) ...................................................................................................................9 - 15

9.2.7 Link relay (B).....................................................................................................................9 - 16

9.2.8 Link special relay (SB) ......................................................................................................9 - 18

9.2.9 Step relay (S) ....................................................................................................................9 - 19

9.2.10 Timer (T)............................................................................................................................9 - 20

9.2.11 Counter (C) .......................................................................................................................9 - 27

9.2.12 Data register (D)................................................................................................................9 - 31

9.2.13 Link register (W)................................................................................................................9 - 32

9.2.14 Link special register (SW) .................................................................................................9 - 34

9.3 Internal System Devices ........................................................................................................9 - 35

9.3.1 Function devices (FX, FY, FD) ..........................................................................................9 - 35

9.3.2 Special relay (SM) .............................................................................................................9 - 38

9.3.3 Special register (SD) .........................................................................................................9 - 39

9.4 Link Direct Device (J\)............................................................................................................ 9 - 40

9.5 Module Access Devices......................................................................................................... 9 - 43

9.5.1 Intelligent function module device (U\G) ...........................................................................9 - 43

9.5.2 Cyclic transmission area device (U3En\G)........................................................................9 - 45

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9.6 Index Register (Z)/Standard Device Resister (Z) ...................................................................9 - 46

9.6.1 Index register (Z) ...............................................................................................................9 - 46

9.6.2 Standard device register (Z)..............................................................................................9 - 48

9.6.3 Switching from the scan execution type program to the interrupt/fixed scan execution

type program

9.7 File Register (R).....................................................................................................................9 - 53

9.7.1 File register data storage location.....................................................................................9 - 54

9.7.2 File register size................................................................................................................9 - 54

9.7.3 Differences in available accesses by storage memory .....................................................9 - 55

9.7.4 Registration procedure for the file register ........................................................................9 - 56

9.7.5 Specification methods of the file register...........................................................................9 - 61

9.7.6 Precautions for using the file register................................................................................9 - 62

9.8 Extended Data Register (D) and Extended Link Register (W)...............................................9 - 64

9.9 Nesting (N)............................................................................................................................ 9 - 70

9.10 Pointer (P)..............................................................................................................................9 - 71

9.10.1 Local pointer..................................................................................................................... 9 - 72

9.10.2 Common pointer................................................................................................................9 - 74

9.11 Interrupt Pointer(I)..................................................................................................................9 - 76

9.11.1 List of interrupt pointer numbers and interrupt factors ......................................................9 - 77

9.12 Other Devices ........................................................................................................................9 - 78

9.12.1 SFC block device (BL) ......................................................................................................9 - 78

9.12.2 Network No. specification device (J) .................................................................................9 - 78

9.12.3 I/O No. specification device (U).........................................................................................9 - 79

9.12.4 Macro instruction argument device (VD)...........................................................................9 - 80

9.13 Constants...............................................................................................................................9 - 81

9.13.1 Decimal constant (K).........................................................................................................9 - 81

9.13.2 Hexadecimal constant (H) .................................................................................................9 - 81

9.13.3 Real number (E)................................................................................................................9 - 82

9.13.4 Character string (" ")..........................................................................................................9 - 83

9.14 Convenient Usage of Devices................................................................................................9 - 84

9.14.1 Global device ....................................................................................................................9 - 84

9.14.2 Local device ......................................................................................................................9 - 85

....................................................................................................9 - 49

CHAPTER10 CPU MODULE PROCESSING TIME 10-1 to 10-18

10.1 Scan Time..............................................................................................................................10 - 1

10.1.1 Scan time structure ...........................................................................................................10 - 1

10.1.2 Time required for each processing included in scan time .................................................10 - 2

10.1.3 Factors that increase the scan time ..................................................................................10 - 11

CHAPTER11 PROCEDURES FOR WRITING PROGRAM TO CPU

MODULE 11-1 to 11-10

11.1 Items to be Considered for Creating Programs .....................................................................11 - 1

11.2 Hardware Check ....................................................................................................................11 - 3

11.3 Procedure for Writing One Program ......................................................................................11 - 5

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11.4 Procedure for Writing Multiple Programs...............................................................................11 - 7

11.5 Procedure for Boot Operation................................................................................................11 - 10

CHAPTER12 SPECIAL RELAY LIST AND SPECIAL REGISTER LIST 12-1 to 12-78

12.1 SPECIAL RELAY LIST...........................................................................................................12 - 1

12.2 SPECIAL REGISTER LIST....................................................................................................12 - 27

APPENDICES App-1 to App-72

Appendix 1 List of Parameter Numbers.........................................................................................App- 1

Appendix 2 Functions Added or Changed by Version Upgrade.....................................................App- 6

Appendix 3 Method of Replacing Basic Model QCPU or High Performance Model QCPU

with Universal Model QCPU

Appendix 3.1 Replacement Precautions ........................................................................... App- 8

Appendix 3.1.1 Replacing Basic model QCPU with Universal model QCPU ....................... App- 8

Appendix 3.1.2 Replacing High Performance model QCPU with Universal model QCPU ......App- 12

Appendix 3.2 Applicable devices and software .................................................................. App- 19

Appendix 3.3 Instructions ..............................................................................................App- 23

Appendix 3.3.1 Instructions not supported in the Universal model QCPU and replacing

methods

Appendix 3.3.2 Replacing programs using multiple CPU transmission dedicated

instructions

Appendix 3.3.3 Program replacement examples ...........................................................App- 26

Appendix 3.4 Functions.................................................................................................App- 40

Appendix 3.4.1 Floating-point operation instructions ......................................................App- 40

Appendix 3.4.2 Error check processing for floating-point data comparison instructions .........App- 48

Appendix 3.4.3 Range check processing for index-modified devices ................................. App- 52

Appendix 3.4.4 Device latch function ..........................................................................App- 55

Appendix 3.4.5 File usability setting............................................................................App- 57

Appendix 3.4.6 Parameter-valid drive and boot file setting .............................................. App- 60

Appendix 3.4.7 External input/output forced on/off function ............................................. App- 63

Appendix 3.5 Special Relay and Special Register............................................................... App- 67

Appendix 3.5.1 Special relay list ................................................................................App- 67

Appendix 3.5.2 Special register list............................................................................. App- 70

Appendix 4 Device Point Assignment Sheet..................................................................................App- 72

...............................................................................App- 8

..........................................................................................App- 23

......................................................................................App- 25

INDEX Index-1 to Index-4

A - 17

MANUALS

To understand the main specifications, functions, and usage of the CPU module, refer to the basic manuals. Read other manuals as well when using a different type of CPU module and its functions. Order each manual as needed, referring to the following list.

:Basic manual, :Other CPU module manuals

Manual name

< Manual number (model code) >

User's manual

QCPU User's Manual (Hardware Design, Maintenance and Inspection)

< SH-080483ENG (13JR73) >

QnUCPU User's Manual (Function Explanation, Program Fundamentals)

< SH-080807ENG (13JZ27) >

QCPU User's Manual (Multiple CPU System)

< SH-080485ENG (13JR75) >

QnUCPU User's Manual (Communication via Built-in Ethernet Port)

< SH-080811ENG (13JZ29) >

Programming manual

QCPU Programming Manual (Common Instructions)

< SH-080809ENG (13JW10) >

QCPU (Q Mode)/QnACPU Programming Manual (SFC)

< SH-080041 (13JF60) >

QCPU (Q Mode) Programming Manual (MELSAP-L)

< SH-080076 (13JF61) >

QCPU (Q Mode) Programming Manual (Structured Text)

< SH-080366E (13JF68) >

QCPU (Q Mode) / QnACPU Programming Manual (PID Control Instructions)

< SH-080040 (13JF59) >

Specifications of the hardware (CPU modules, power supply modules, base units, extension cables, and memory cards), system maintenance and inspection, troubleshooting, and error codes

Functions, methods, and devices for programming

Information on multiple CPU system configuration (system configuration, I/O numbers, communication between CPU modules, and communication with the input/output modules and intelligent function modules)

Functions for the communication via built-in Ethernet port of the CPU module

How to use sequence instructions, basic instructions, and application instructions

System configuration, performance specifications, functions, programming, debugging, and error codes for SFC (MELSAP3) programs

Programming methods, specifications, and functions for SFC (MELSAP-L) programs

Programming methods using structured languages

Dedicated instructions for PID control

Description Manual type

A - 18

Other relevant manuals

Manual name Description

CC-Link IE Controller Network Reference Manual

< SH-080668ENG (13JV16) >

Q Corresponding MELSECNET/H Network System Reference Manual (PLC to PLC network)

< SH-080049 (13JF92) >

Q Corresponding MELSECNET/H Network System Reference Manual (Remote I/O network)

< SH-080124 (13JF96) >

Q Corresponding Ethernet Interface Module User's Manual (Basic)

< SH-080009 (13JL88) >

Q Corresponding Ethernet Interface Module User's Manual (Application)

< SH-080010 (13JL89) >

CC-Link System Master/Local Module User's Manual

< SH-080394E (13JR64) >

Q Corresponding Serial Communication Module User's Manual (Basic)

< SH-080006 (13JL86) >

Q Corresponding Serial Communication Module User's Manual (Application)

< SH-080007 (13JL87) >

Q Corresponding MELSEC Communication Protocol Reference Manual

< SH-080008 (13JF89) >

GX Developer Version 8 Operating Manual

< SH-080373E (13JU41) >

Specifications, procedures and settings before system operation, parameter setting, programming, and troubleshooting of the CC-Link IE controller network module

Specifications, procedures and settings before system operation, parameter setting, programming, and troubleshooting of a MELSECNET/H network system (PLC to PLC network)

Specifications, procedures and settings before system operation, parameter setting, programming, and troubleshooting of a MELSECNET/H network system (remote I/O network)

Specifications, procedures for data communication with external devices, line connection (open/close), fixed buffer communication, random access buffer communication, and troubleshooting of the Ethernet module

E-mail function, programmable controller CPU status monitoring function, communication via MELSECNET/H or MELSECNET/10, communication using the data link instructions, and file transfer function (FTP server) of the Ethernet module

System configuration, performance specifications, functions, handling, wiring, and troubleshooting of the QJ61BT11N

Overview, system configuration, specifications, procedures before operation, basic data communication method with external devices, maintenance and inspection, and troubleshooting for using the serial communication module

Special functions (specifications, usage, and settings and data communication method with external devices of the serial communication module

Communication method using the MC protocol, which reads/writes data to/ from the CPU module via the serial communication module or Ethernet module

Operating methods of GX Developer, such as programming and printout

A - 19

MANUAL PAGE ORGANIZATION

The detailed explanation of "Note . " is provided under the corresponding "Note . " at the bottom of the page.

ReferenceNote (icon)

The section in this manual or another relevant manual that can be referred to is shown with .

Chapter

The chapter of the current page can be easily identified by this indication on the right side.

Note (detailed explanation)

The detailed note corresponding to each icon is described.

Section title

The section number and title of the current page can be easily identified.

* cining page components, and differs from an actual page.

Icons

Universal model QCPU

Universal

Icons indicate that specifications described on the page contain some precautions.

Description

In addition, this manual uses the following types of explanations.

In addition to description of the page, notes or functions that require special attention are described here.

Remark

The reference related to the page or useful information are described here.

A - 20

GENERIC TERMS AND ABBREVIATIONS

Unless otherwise specified, this manual uses the following generic terms and abbreviations. * indicates a part of the model or version. (Example): Q33B, Q35B, Q38B, Q312B

Generic term/abbreviation Description

Series Q series Abbreviation for Mitsubishi MELSEC-Q series programmable controller CPU module type CPU module Generic term for the Universal model QCPU

Universal model QCPU

Built-in Ethernet port QCPU

Motion CPU

PC CPU module

C Controller module

CPU module model

QnUD(H)CPU

Base unit type

Base unit

Main base unit Extension base unit Slim type main base unit Redundant power main base unit Redundant power extension base

unit Multiple CPU high speed main base

unit Base unit model

Q3 B Q3 SB Q3 RB

Q3 DB

Q5 B Q6 B

Q6 RB

Q3 B

Generic term for the Q00UJCPU, Q00UCPU, Q01UCPU, Q02UCPU, Q03UDCPU, Q04UDHCPU, Q06UDHCPU, Q10UDHCPU, Q13UDHCPU, Q20UDHCPU, Q26UDHCPU, Q03UDECPU, Q04UDEHCPU, Q06UDEHCPU, Q10UDEHCPU, Q13UDEHCPU, Q20UDEHCPU, and Q26UDEHCPU

Generic term for the Q03UDECPU, Q04UDEHCPU, Q06UDEHCPU, Q10UDEHCPU, Q13UDEHCPU, Q20UDEHCPU, and Q26UDEHCPU

Generic term for Mitsubishi motion controllers, Q172CPUN, Q173CPUN, Q172HCPU, Q173HCPU, Q172CPUN-T, Q173CPUN-T, Q172HCPU-T, Q173HCPU-T, Q172DCPU, and Q173DCPU

Generic term for MELSEC-Q series PC CPU module, PPC-CPU852(MS)-512, manufactured by CONTEC Co., Ltd.

Generic term for the Q06CCPU-V-H01, Q06CCPU-V, Q06CCPU-V-B, and Q12DCCPU-V C Controller modules

Generic term for the Q03UDCPU, Q04UDHCPU, Q06UDHCPU, Q10UDHCPU, Q13UDHCPU, Q20UDHCPU, and Q26UDHCPU

Generic term for the main base unit, extension base unit, slim type main base unit, redundant power main base unit, redundant power extension base unit, and multiple CPU high speed main base unit

Generic term for the Q3 B, Q3 SB, Q3 RB, and Q3 DB Generic term for the Q5 B, Q6 B, and Q6 RB Another name for the Q3 SB Another name for the Q3 RB

Another name for the Q6 RB

Another name for the Q3 DB

Generic term for the Q33B, Q35B, Q38B, and Q312B main base units Generic term for the Q32SB, Q33SB, and Q35SB slim type main base units Another name for the Q38RB main base unit for redundant power supply system Generic term for the Q38DB and Q312DB multiple CPU high speed main base

units Generic term for the Q52B and Q55B extension base units Generic term for the Q63B, Q65B, Q68B, and Q612B extension base units Another name for the Q68RB extension base unit for redundant power supply

system

A - 21

Generic term/abbreviation Description

Power supply module

Q series power supply module

Slim type power supply module Abbreviation for the Q61SP slim type power supply module

Redundant power supply module

Network MELSECNET/H Abbreviation for the MELSECNET/H network system Ethernet Abbreviation for the Ethernet network system CC-Link Abbreviation for the Control & Communication Link Memory card Memory card Generic term for the SRAM card, Flash card, and ATA card

SRAM card

Flash card Generic term for the Q2MEM-2MBF and Q2MEM-4MBF Flash cards

ATA car d

Others

Generic term for the Q series power supply module, slim type power supply module, and redundant power supply module

Generic term for the Q61P-A1, Q61P-A2, Q61P, Q61P-D, Q62P, Q63P, Q64P, and Q64PN power supply modules

Generic term for the Q63RP and Q64RP power supply modules for redundant power supply

Generic term for the Q2MEM-1MBS, Q2MEM-2MBS, Q3MEM-4MBS, and Q3MEM-8MBS SRAM cards

Generic term for the Q2MEM-8MBA, Q2MEM-16MBA, and Q2MEM-32MBA ATA cards

GX Developer

Extension cable

Battery

GOT

Product name for SW D5C-GPPW-E GPP function software package compatible with the Q series

Generic term for the QC05B, QC06B, QC12B, QC30B, QC50B, and QC100B extension cables

Generic term for the Q6BAT, Q7BAT, and Q8BAT CPU module batteries, Q2MEM-BAT SRAM card battery, and Q3MEM-BAT SRAM card battery

Generic term for Mitsubishi Graphic Operation Terminal, GOT-A*** series, GOT-F*** series, and GOT1000 series

A - 22

CHAPTER1 OVERVIEW

The CPU module performs sequence control by executing programs. This chapter describes the processing order in the CPU module, locations where the created programs are stored, and devices and instructions useful for programming.

1.1 Processing Order in the CPU Module

The CPU module performs processing in the following order.

Power-on or reset

Initial processing

Refresh processing with

input/output modules

Program operation processing

Scan time

END processing

Figure 1.1 Processing order in the CPU module

(1) Initial processing ( Section 3.1)

The CPU module performs preprocessing required for program operations. The preprocessing is performed only once when the module is powered on or reset.

(2) Refresh processing with input and output modules ( Section 3.2)

The CPU module takes on/off data from the input module or intelligent function module and outputs on/off data to the output module or intelligent function module.

(3) Program operation processing ( Section 3.3)

The CPU module sequentially executes the program stored in the module from the step 0 to the END or FEND instruction.

1.1 Processing Order in the CPU Module

(4) END processing ( Section 3.4)

The CPU module performs refresh processing with network modules or communicates with external devices.

1 - 1

1.2 Storing and Executing Programs

This section describes where to store and how to execute the programs in the CPU module.

(1) Programming

Programs are created with GX Developer. For details of program configuration and execution conditions, refer to CHAPTER 2.

(2) Storing programs

Created programs and set parameters are stored in the following memories of the CPU module. ( Section 5.1)

• Program memory

• Standard ROM (parameters only)

• Memory card

(3) Executing programs

The CPU module executes the programs stored in the program memory.

CPU module

Program memory

Parameter

Program

Device comment

Initial device value

The CPU module executes the programs stored here.

Comments are stored separately from the program.

Figure 1.2 Executing programs

To execute the programs stored in a memory card, the programs need to be booted to the program memory ( Section 5.1.8) when the CPU module is powered off and then on or reset.

The CPU module executes the programs booted from a memory card to here.

Program memory

CPU moduleBoot

Parameter Program

Memory card

Device comment

Initial device value

Figure 1.3 Executing programs stored in a memory card

1 - 2

CHAPTER1 OVERVIEW

1.3 Structured Programming

The programs to be executed in the CPU module can be structured in the following two ways.

• In one program

• By dividing into multiple files

(1) Structuring in one program

Structured programming is available by creating one program as a collection of three program sections: main routine program ( Section 2.2.1), subroutine program ( Section 2.2.2), and interrupt program ( Section 2.2.3).

Main routine program

Subroutine program 1

CALL P1

FEND

Y10

RET

Subroutine program 2

Interrupt program

Figure 1.4 Structuring in one program

Y11

RET

Y12

IRET

END

1.3 Structured Programming

1 - 3

(2) Structuring by dividing into multiple files

A program is stored in a file. Changing the file name allows the CPU module to store multiple programs.

Multiple programs can be stored by changing the file name.

File name: PARAM

Parameter Program Program

GX Developer

Figure 1.5 Structuring by dividing into multiple files

Dividing into multiple files according to the processes or functions enables simultaneous programming by two or more designers. Managing the files separately eases reuse and utilization to other programs. Structured programming is efficient in this way because only the corresponding file needs to be modified or debugged in case of change in the specifications.

File name: ABC File name: ABC File name: DEF

Device comment

CPU module

(a) Dividing into multiple files according to the processes

Program memory/memory card

Program ACarrying in

Manufacturing Processing contents are divided according to the processes.

*1: The processing contents divided according to the processes can further be divided and managed according to the

functions.

*2: The execution order can be set in the Program tab of the PLC parameter dialog box. ( Section 2.3(2)).

Assembly

Carrying out

Figure 1.6 Dividing into multiple files according to the processes

Program B

Program C

Program D

Program A to D will be executed in the specified order. *2

1 - 4

CHAPTER1 OVERVIEW

(b) Dividing into multiple files according to the functions

Program memory/memory card

Initial processing

Main processing

Processing contents are divided according to the functions.

*1: The execution order and conditions can be set in the Program tab of the PLC parameter dialog box. ( Section 2.3(2)).

Communication

processing

Error processing

Figure 1.7 Dividing into multiple files according to the functions

Program A

Program B

Program C

Program D

The execution order and conditions for program A to D can be set. *1

1.3 Structured Programming

1 - 5

1.4 Devices and Instructions Useful for Programming

The CPU module is provided with devices and instructions useful for programming. This section describes the outline of these devices and instructions.

(1) Various ways of device specification

(a) Using each bit of a word device as a contact or coil

By specifying a bit of a word device, the bit can be used as a contact or coil.

SET D0.5

D0.5

SET Y10

Figure 1.8 Specifying a bit of a word device

A bit-specified word device (turns on (switches to 1) the 5th bit (b5) of D0.)

A bit-specified word device (turns on/off depending on the on/off (1/0) status of the 5th bit (b5) of D0.)

(b) Easy direct processing in units of one point

Use of the direct access input (DX ) and direct access output (DY ) enables easy direct processing (in units of one point) in the program. ( Section 3.8.2)

M0 DX10

Direct access input

DY100

On/off data is output to the output module when the instruction is executed.

On/off data is input from the input module when the instruction is executed.

1 - 6

Figure 1.9 Direct processing in units of one point

Pulse conversion processing for inputs is no longer required with the use of a differential contacts ( and

Y100

Differential contact

Y100

Figure 1.10 Use of a differential contact

On at the rising edge of X0

Y100

PLS

Y100

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