Mitsubishi q64rd, q64rd-g User Manual

• SAFETY PRECAUTIONS •

(Always read these instructions before using this equipment.)

Before using this product, please read this manual and the relevant manuals introduced in this manual carefully and pay full attention to safety to handle the product correctly. The instructions given in this manual are concerned with this product. For the safety instructions of the programmable controller system, please read the user's manual for the CPU module to use. In this manual, the safety instructions are ranked as "DANGER" and "CAUTION".

DANGER

CAUTION

Note that the !CAUTION level may lead to a serious consequence according to the circumstances. Always follow the instructions of both levels because they are important to personal safety.

Please store this manual in a safe place and make it accessible when required. Always forward it to the end user.

Indicates that incorrect handling may cause hazardous conditions, resulting in death or severe injury.

Indicates that incorrect handling may cause hazardous conditions, resulting in minor or moderate injuries and/or property damage.

[DESIGN PRECAUTION]

DANGER

• Do not write data into the "system area" of the buffer memory of intelligent function modules. Also, do not use any "prohibited to use" signals as an output signal to an intelligent function module from the CPU. Writing data into the "system area" or outputting a signal for "prohibited to use" may cause a programmable controller system malfunction.

CAUTION

• Do not bunch the control wires or communication cables with the main circuit or power wires, or install them close to each other. They should be installed 100mm(3.94inch) or more from each other. Not doing so could result in noise that may cause malfunction.

A - 1 A - 1

[INSTALLATION PRECAUTIONS]

CAUTION

• Use the programmable controller in an environment that meets the general specifications contained in the user's manual of the CPU module to use. Using this programmable controller in an environment outside the range of the general specifications may cause electric shock, fire, malfunction, and damage to or deterioration of the product.

• While pressing the installation lever located at the bottom of module, insert the module fixing tab into the fixing hole in the base unit until it stops. Then, securely mount the module with the fixing hole as a supporting point. Improper installation may result in malfunction, breakdown or the module coming loose and dropping. Securely fix the module with screws if it is subject to vibration during use.

• Tighten the screws within the range of specified torque. If the screws are loose, it may cause the module to fallout, short circuits, or malfunction. If the screws are tightened too much, it may cause damage to the screw and/or the module, resulting in fallout, short circuits or malfunction.

• Be sure to shut off all phases of the external power supply used by the system before mounting or removing the module. Not doing so may cause damage to the module. In the system where a CPU module supporting the online module change is used and on the MELSECNET/H remote I/O stations, modules can be replaced online (during energizing). However, there are some restrictions on replaceable modules and the replacement procedures are predetermined for each module. For details, refer to the chapter of the online module change in this manual.

• Do not directly touch the conductive area or electronic components of the module. Doing so may cause malfunction or failure in the module.

[WIRING PRECAUTIONS]

CAUTION

• Always ground the FG terminal for the programmable controller. There is a risk of electric shock or malfunction.

• When turning on the power and operating the module after wiring is completed, always attach the terminal cover that comes with the product. There is a risk of electric shock if the terminal cover is not attached.

• Tighten the terminal screws within the range of specified torque. If the terminal screws are loose, it may result in short circuits or malfunction. If the terminal screws are tightened too much, it may cause damage to the screw and/or the module, resulting in short circuits or malfunction.

• Be careful not to let foreign matter such as sawdust or wire chips get inside the module. They may cause fires, failure or malfunction.

• Use applicable solderless terminals and tighten them with the specified torque. If any solderless spade terminal is used, it may be disconnected when the terminal screw comes loose, resulting in failure.

• The top surface of the module is covered with protective film to prevent foreign objects such as cable offcuts from entering the module when wiring. Do not remove this film until the wiring is complete. Before operating the system, be sure to remove the film to provide adequate ventilation.

A - 2 A - 2

[STARTING AND MAINTENANCE PRECAUTIONS]

CAUTION

• Do not disassemble or modify the modules. Doing so could cause failure, malfunction injury or fire.

• Be sure to shut off all phases of the external power supply used by the system before mounting or removing the module. Not doing so may cause failure or malfunction of the module. In the system where a CPU module supporting the online module change is used and on the MELSECNET/H remote I/O stations, modules can be replaced online (during energizing). However, there are some restrictions on replaceable modules and the replacement procedures are predetermined for each module. For details, refer to the chapter of the online module change in this manual.

• Do not install/remove the module to/from the base unit, or the terminal block to/from the module more than 50 times after the first use of the product. (IEC 61131-2 compliant) Failure to do so may cause malfunction.

• Do not touch the connector while the power is on. Doing so may cause malfunction.

• Switch off all phases of the externally supplied power used in the system when cleaning the module or retightening the terminal or module fixing screws. Not doing so may cause failure or malfunction of the module. If the screws are loose, it may cause the module to fallout, short circuits, or malfunction. If the screws are tightened too much, it may cause damages to the screws and/or the module, resulting in the module falling out, short circuits or malfunction.

• Always make sure to touch the grounded metal to discharge the electricity charged in the body, etc., before touching the module. Failure to do so may cause a failure or malfunctions of the module.

[DISPOSAL PRECAUTIONS]

CAUTION

• When disposing of this product, treat it as industrial waste.

A - 3 A - 3

REVISIONS

The manual number is given on the bottom left of the back cover.

Print Date Manual Number Revision

Nov., 2000 SH (NA)-080142-A First printing

Jun., 2001 SH (NA)-080142-B

Addition

Section 2.1, 2.2

Correction Conformation to the EMC Directive and Low Voltage Instruction, About the Generic Terms and Abbreviations, Product Structure, Section 5.2,

5.2.1, 5.2.2, 5.3.3

Feb., 2002 SH (NA)-080142-C

Addition Section 1.2, Section 3.4.18, 3.4.19, Chapter 7, App 2,3

Partial addition SAFETY PRECAUTIONS, About the Generic Terms and Abbreviations, Section 2.1, Section 3.1, 3.2, 3.4.1, Section 4.3, 4.6, Section 5.2.1, 5.2.2, Section 8.1, 8.2.1

Correction Section 3.3.2, 3.4.10, 3.4.17, Section 4.2, 4.4.1, Section 5.3.2, 5.5, 5.6.1 Section 6.1.1, 6.2.2, Section 8.2.4,

Feb., 2003 SH (NA)-080142-D

Addition Section 5.6.3, 5.6.4

Correction SAFETY PRECAUTIONS, Section 1.2, Section 2.1, Section 3.1.1, 3.2,

3.3.1, 3.3.2, 3.4.1, 3.4.3, 3.4.4, 3.4.6, 3.4.7, 3.4.10 to 3.4.19, Section 4.5,

4.6, Section 5.1, 5.2.1, 5.2.2, 5.3.2, 5.4, 5.5, 5.6.1, 5.6.2, Section 6.1,

6.1.1, 6.1.2, 6.2, 6.2.1, 6.2.2, Section 7.3.1, 7.3.3 to 7.3.6, 7.4, Section 8.1, 8.2, 8.2.5, Appendix 2.1, Appendix 3.1 to 3.3

Sep., 2003 SH(NA)-080142-E Description for new model, Q64RD-G is added.

Addition Section 3.1.2, 3.4.2, 3.4.5, 3.4.7, 3.4.12, 3.4.13, 3.4.23, 7.4.2, 8.2.5,

8.2.6, Appendix 1.3

Correction About the Generic Terms and Abbreviations, Product Lineup, Chapter 1, Section 1.1, 2.1, 2.2, 3.1.1, 3.1.3, 3.2, 3.2.1, 3.3.1, 3.3.2, 3.4.1, 3.4.4,

3.4.15 to 3.4.17, 3.4.21, 3.4.25, 4.3, 4.4.2, 4.5, 4.6, 5.1, 5.2.1, 5.6.1,

5.6.2, 5.6.4, 6.1, Chapter 7, Section 7.3.4, 7.3.6, 7.4.1, 8.1, 8.2.10, Appendix 1.1, 1.2, 3.2, 3.3, 4

May, 2004 SH(NA)-080142-F

Correction Section 2.2, 3.4.16, 7.1, 7.3.1 to 7.3.6

Oct., 2004 SH (NA)-080142-G

Correction SAFETY PRECAUTIONS, Section 2.1, Section 3.1.1, 3.3, 3.4.1, 3.4.1, Section 4.1, Section 6.2, 6.2.1

A - 4 A - 4

Print Date

Manual Number Revision

Sep., 2005 SH (NA)-080142-H

Feb., 2006 SH(NA)-080142-I

Oct., 2006 SH(NA)-080142-J

Oct., 2007 SH(NA)-080142-K

Jan., 2008 SH(NA)-080142-L

May, 2008 SH(NA)-080142-M

Addition Section 3.4.22, 3.4.23, Appendix 2.2, Appendix 2.2.1, Appendix 2.2.2

Correction Conformation to the EMC Directive and Low Voltage Instruction,

Section 1.2, Section 2.1, 2.2, Section 3.1.1, 3.1.2, 3.2, 3.3.1, 3.3.2, 3.4.1,

3.4.2, 3.4.5, 3.4.6, 3.4.7, 3.4.10, 3.4.14, 3.4.20, 3.4.21, Section 5.1,

5.2.2, 5.6.1, 6.1.1, 6.2.1, Section 7.3.1, 7.3.3, 7.3.4, 8.1, 8.2.10, Appendix 2.1

Addition Appendix 3.1

Correction SAFETY PRECAUTIONS, Section 1.2, Section 2.2, Section 3.2, 3.4.13, Section 7.3.3, 7.3.5, Appendix 3, INDEX

Section number changed Appendix 3.1 Appendix 3.2, Appendix 3.2 Appendix 3.3, Appendix 3.3

Appendix 3.4

Correction Section 4.5

Correction Section 1.1, Section 1.2, Section 3.1.1, Section 3.2, Section 3.2.2, Section 3.2.3, Section 3.3.2, Section 3.4.2, Section 3.4.19, Section 3.4.22, Section 4.3, Section 6.2.1, Section 8.1, Appendix3.1, Appendix3.2, Appendix3.3 Correction SAFETY PRECAUTIONS, CONTENTS, About the Generic Terms and Abbreviations, Section 2.2, Section 2.3, Section 4.1, Section 5.2.2 Correction SAFETY PRECAUTIONS, Compliance with the EMC and Low Voltage Directives, About the Generic Terms and Abbreviations, Section 2.1, Section 2.3, Section 3.4.19, Section 4.1, Section 5.2.1, Section 5.2.2, Section 5.3.1 to 5.3.3, Section 7.1

Japanese Manual Version SH-080133-M

This manual confers no industrial property rights or any rights of any other kind, nor does it confer any patent licenses. Mitsubishi Electric Corporation cannot be held responsible for any problems involving industrial property rights which may occur as a result of using the contents noted in this manual.

A - 5 A - 5

INTRODUCTION

Thank you for purchasing the MELSEC-Q series programmable controller. Before using the equipment, please read this manual carefully to develop full familiarity with the functions and performance of the Q series programmable controller you have purchased, so as to ensure correct use. Please forward a copy of this manual to the end user.

SAFETY PRECAUTIONS..................................................................................................................................A- 1

REVISIONS........................................................................................................................................................A- 4

INTRODUCTION ...............................................................................................................................................A- 6

Compliance with the EMC and Low Voltage Directives ...................................................................................A-10

About the Generic Terms and Abbreviations....................................................................................................A-10

Product Lineup ...................................................................................................................................................A-10

1 OVERVIEW 1- 1 to 1- 4

1.1 Features ................................................................................................................................................... 1- 2

1.2 Added/Changed Functions ...................................................................................................................... 1- 4

2 SYSTEM CONFIGURATION 2- 1 to 2- 7

2.1 Applicable Systems.................................................................................................................................. 2- 1

2.2 About Use of the Q64RD/Q64RD-G with the Q12PRH/Q25PRHCPU.................................................. 2- 5

2.3 How to Check the Function Version, Product Information and Software Version ................................. 2- 6

3 SPECIFICATIONS 3- 1 to 3-39

3.1 Performance Specifications ..................................................................................................................... 3- 1

3.1.1 Specifications of Q64RD................................................................................................................... 3- 1

3.1.2 Specifications of Q64RD-G............................................................................................................... 3- 2

3.1.3 Specifications of RTD connection..................................................................................................... 3- 4

3.2 Function List .............................................................................................................................................3- 5

3.2.1 Temperature conversion system ......................................................................................................3- 6

3.2.2 Conversion setting for disconnection detection function ................................................................. 3- 9

3.3 I/O Signals Transferred to/from CPU ...................................................................................................... 3-10

3.3.1 I/O signal list ...................................................................................................................................... 3-10

3.3.2 I/O signal details ................................................................................................................................ 3-11

3.4 Buffer Memory.......................................................................................................................................... 3-16

3.4.1 Buffer memory assignment (Q64RD) ............................................................................................... 3-16

3.4.2 Buffer memory assignment (Q64RD-G) ........................................................................................... 3-20

3.4.3 Conversion enable/disable setting (Un\G0) ..................................................................................... 3-23

3.4.4 CH

3.4.5 Averaging processing specification (Un\G9) .................................................................................... 3-24

3.4.6 Conversion completion flag (Un\10) .................................................................................................3-25

3.4.7 CH

3.4.8 Error code (Un\G19).......................................................................................................................... 3-26

3.4.9 Setting range (Q64RD) (Un\G20) ..................................................................................................... 3-26

3.4.10 Setting range 1 (Q64RD-G) (Un\G20)............................................................................................ 3-27

3.4.11 Setting range 2 (Q64RD-G) (Un\G21)............................................................................................ 3-27

3.4.12 Warning output enable/disable setting (Un\G47)........................................................................... 3-28

time/count/moving average/time constant setting (Un\G1 to 4) ............................................ 3-23

measured temperature value (16bit) (Un\11 to 14)................................................................ 3-25

A - 6 A - 6

3.4.13 Warning output flag (Un\G48)......................................................................................................... 3-28

3.4.14 Disconnection detection flag (Un\G49)........................................................................................... 3-29

3.4.15 CH

3.4.16 CH

3.4.17 CH

3.4.18 CH

3.4.19 CH

3.4.20 CH

3.4.21 Extended averaging processing specification (Un\G134) ............................................................. 3-35

3.4.22 Conversion setting for disconnection detection (Un\G148) ........................................................... 3-36

3.4.23 CH

3.4.24 Mode switching setting (Un\G158 to 159) ...................................................................................... 3-37

3.4.25 Factory default offset/gain value/user range settings offset/gain value/user range settings offset/gain

4 SETUP AND PROCEDURES BEFORE OPERATION 4- 1 to 4-13

scaling value (Un\G50 to 53) ................................................................................................3-30

measured temperature value (32 bit) (Un\G54 to 61) ......................................................... 3-31

scaling range upper/lower limit values (Un\G62 to 77)........................................................ 3-31

scaling width upper/lower limit values (Un\G78 to 85)......................................................... 3-31

warning output upper/lower limit values (Un\86 to 101) ...................................................... 3-32

offset/gain temperature set value (Un\G118 to 133) ........................................................... 3-34

Conversion setting value for disconnection detection (Un\G150 to 157)............................ 3-36

resistance value (Un\G160 to 255) ................................................................................................3-37

4.1 Handling Precautions ............................................................................................................................... 4- 1

4.2 Setup and Procedures before Operation ................................................................................................ 4- 2

4.3 Part Names and Settings ......................................................................................................................... 4- 3

4.4 Wiring........................................................................................................................................................ 4- 4

4.4.1 Wiring instructions ............................................................................................................................. 4- 4

4.4.2 External wiring ................................................................................................................................... 4- 5

4.5 Switch Setting for Intelligent Function Module ........................................................................................ 4- 7

4.6 Offset/Gain Setting................................................................................................................................... 4- 9

5 UTILITY PACKAGE (GX Configurator-TI) 5- 1 to 5-23

5.1 Utility Package Functions ........................................................................................................................ 5- 1

5.2 Installing and Uninstalling the Utility Package ........................................................................................ 5- 3

5.2.1 Handling precautions ........................................................................................................................ 5- 3

5.2.2 Operating environment...................................................................................................................... 5- 5

5.3 Utility Package Operation ........................................................................................................................ 5- 7

5.3.1 Common utility package operations ................................................................................................. 5- 7

5.3.2 Operation overview ........................................................................................................................... 5- 9

5.3.3 Starting the Intelligent function module utility ................................................................................... 5-11

5.4 Initial Setting ............................................................................................................................................. 5-13

5.5 Auto Refresh Settings .............................................................................................................................. 5-14

5.6 Monitoring/Test......................................................................................................................................... 5-16

5.6.1 Monitor/test screen............................................................................................................................ 5-16

5.6.2 Offset/gain setting operation (Function version C or later) .............................................................. 5-19

5.6.3 Offset/gain setting operation (Function version B)........................................................................... 5-20

5.6.4 OMC (Online Module Change) refresh data ....................................................................................5-21

6 PROGRAMMING 6- 1 to 6- 9

6.1 Programs Used in Normal System Configuration ................................................................................... 6- 1

6.1.1 Program example used when utility package is used ...................................................................... 6- 2

6.1.2 Program example used when utility package is not used................................................................ 6- 3

A - 7 A - 7

6.2 Programs Used on Remote I/O Network ................................................................................................ 6- 4

6.2.1 Program example used when utility package is used ...................................................................... 6- 5

6.2.2 Program example used when utility package is not used................................................................ 6- 7

7 ONLINE MODULE CHANGE 7- 1 to 7-37

7.1 Online Module Change Conditions.......................................................................................................... 7- 2

7.2 Online Module Change Operations ......................................................................................................... 7- 3

7.3 Online Module Change Procedure .......................................................................................................... 7- 4

7.3.1 When factory default is used and initial setting was made with GX Configurator-TI ...................... 7- 4

7.3.2 When factory default is used and initial setting was made with sequence program ...................... 7- 9

7.3.3 When user range setting is used and initial setting was made with GX Configurator-TI

(other system is available).............................................................................................................. 7-14

7.3.4 When user range setting is used and initial setting was made with GX Configurator-TI

(other system is unavailable).......................................................................................................... 7-19

7.3.5 When user range setting is used and initial setting was made with sequence program

(other system is available).............................................................................................................. 7-24

7.3.6 When user range setting is used and initial setting was made with sequence program

(other system is unavailable).......................................................................................................... 7-29

7.4 Range Reference Table........................................................................................................................... 7-35

7.4.1 Range reference table (Q64RD)....................................................................................................... 7-35

7.4.2 Range reference table (Q64RD-G) .................................................................................................. 7-36

7.5 Precautions for Online Module Change .................................................................................................. 7-37

8 TROUBLESHOOTING 8- 1 to 8- 6

8.1 Error Code List ......................................................................................................................................... 8- 1

8.2 Troubleshooting ....................................................................................................................................... 8- 3

8.2.1 RUN LED is extinguished .................................................................................................................8- 3

8.2.2 RUN LED flickers .............................................................................................................................. 8- 3

8.2.3 ERROR/ERR. LED flickers ............................................................................................................... 8- 3

8.2.4 ERROR/ERR. LED is lit .................................................................................................................... 8- 3

8.2.5 ALM LED flickers............................................................................................................................... 8- 3

8.2.6 ALM LED is lit .................................................................................................................................... 8- 3

8.2.7 Disconnection detection signal (XC) has turned on .........................................................................8- 4

8.2.8 Temperature conversion value cannot be read ...............................................................................8- 4

8.2.9 Temperature conversion value is abnormal ..................................................................................... 8- 4

8.2.10 Checking the Q64RD/Q64RD-G status using GX Developer system monitor .............................8- 5

APPENDIX App.- 1 to App.-20

Appendix 1 Reference Resistance Values of RTD ..................................................................................App.- 1

Appendix 1.1 New JIS/IEC type (Pt100)...............................................................................................App.- 1

Appendix 1.2 Old JIS type (JPt100)......................................................................................................App.- 1

Appendix 1.3 Ni100Ω type ....................................................................................................................App.- 1

Appendix 2 Function Upgrade for the Q64RD .........................................................................................App.- 2

Appendix 2.1 A Comparison of Function of the Q64RD ......................................................................App.- 2

A - 8 A - 8

Appendix 2.2 When the Q64RD has Product Information which First 5 Digits are 07071 or

Earlier ..............................................................................................................................App.- 3

Appendix 2.2.1 CH

Appendix 2.2.2 Averaging processing specification (Un\G9)...........................................................App.- 4

Appendix 2.3 When the Q64RD-G has Product Information which First 5 Digits are 07071 or

Earlier ..............................................................................................................................App.- 5

Appendix 3 Dedicated Instruction.............................................................................................................App.- 6

Appendix 3.1 Dedicated Instruction List and Available Device............................................................App.- 6

Appendix 3.2 G(P).OFFGAN ................................................................................................................App.- 7

Appendix 3.3 G(P).OGLOAD ................................................................................................................App.- 9

Appendix 3.4 G(P).OGSTOR................................................................................................................App.-14

Appendix 4 External Dimension Diagram ................................................................................................App.-20

INDEX Index- 1 to Index- 2

time/count averaging setting (Un\G1 to 4) ....................................................App.- 4

A - 9 A - 9

Compliance with the EMC and Low Voltage Directives

(1) For programmable controller system

To configure a system meeting the requirements of the EMC and Low Voltage Directives when incorporating the Mitsubishi programmable controller (EMC and Low Voltage Directives compliant) into other machinery or equipment, refer to Chapter 9 "EMC AND LOW VOLTAGE DIRECTIVES" of the QCPU User's Manual (Hardware Design, Maintenance and Inspection). The CE mark, indicating compliance with the EMC and Low Voltage Directives, is printed on the rating plate of the programmable controller.

(2) For the product

No additional measures are necessary for the compliance of this product with the EMC and Low Voltage Directives.

About the Generic Terms and Abbreviations

Unless otherwise specified, this manual uses the following general terms and abbreviations.

Abbreviation/general terms Description

Q64RD Q64RD platinum RTD input module

Q64RD-G Q64RD-G channel isolated RTD input module

Personal computer IBM PC/AT® or compatible computer with DOS/V.

Generic product name for the SWnD5C-GPPW-E, SWnD5C-GPPW-EA, SWnD5C-

GX Developer

GX Configurator-TI

QCPU (Q mode)

Process CPU Generic term for Q02PHCPU, Q06PHCPU, Q12PHCPU and Q25PHCPU.

RTD

Windows Vista®

Windows® XP

GPPW-EV and SWnD5C-GPPW-EVA. ("n" is 4 or greater.) "-A" and "-V" denote volume license product and upgraded product respectively. Generic term for temperature input module setting and monitor tool GX Configurator-TI (SW1D5C-QTIU-E) Generic term for, Q00JCPU, Q00CPU, Q01CPU, Q02CPU, Q02HCPU, Q06HCPU, Q12HCPU, Q25HCPU, Q02PHCPU, Q06PHCPU, Q12PHCPU, Q25PHCPU, Q12PRHCPU, Q25PRHCPU, Q02UCPU, Q03UDCPU, Q04UDHCPU, Q06UDHCPU, Q13UDHCPU, Q26UDHCPU, Q03UDECPU, Q04UDEHCPU, Q06UDEHCPU, Q13UDEHCPU and Q26UDEHCPU.

Abbreviation for Resistance Temperature Detector. Platinum or nickel temperaturemeasuring resistor. Generic term for the following: Microsoft Microsoft® Windows Vista® Home Premium Operating System, Microsoft Microsoft Microsoft® Windows Vista® Enterprise Operating System Generic term for the following: Microsoft® Windows® XP Professional Operating System, Microsoft

Product Lineup

The lineup for this product is given in the table below.

Windows Vista® Home Basic Operating System,

Windows Vista® Business Operating System,

Windows Vista® Ultimate Operating System,

Windows® XP Home Edition Operating System

Model code Product Quantity

Q64RD Q64RD platinum RTD input module 1

Q64RD-G Q64RD-G channel isolated RTD input module 1

SW1D5C-QTIU-E GX Configurator-TI Version 1 (Single license product) (CD-ROM) 1

SW1D5C-QTIU-EA GX Configurator-TI Version 1 (Volume license product) (CD-ROM) 1

A - 10 A - 10

1 OVERVIEW

MELSEC-Q

1 OVERVIEW

This user's manual provides the specifications, handling instructions, programming procedures and other information of the Q64RD platinum RTD (Resistance Temperature Detector) input module and the Q64RD-G channel isolated RTD input module (hereinafter referred to as the Q64RD and Q64RD-G), which are designed to use together with the MELSEC-Q series CPU module (hereinafter referred to as the CPU).

The Q64RD is a module for connection of 3-wire or 4-wire type platinum RTDs (2-wire application is available if terminals are short-circuited.) and converts temperature data [

] input from Pt100 or JPt100 platinum RTD (hereinafter referred to as PT100 or

JPt100) to:

• 16-bit signed binary data (stored as a value rounded off to 1 decimal place

• 32-bit signed binary data (stored as a value rounded off to 3 decimal places

10)

1000)

and scaling values (ratios (%)).

The Q64RD-G is a module for connection of 3-wire or 4-wire type RTDs (2-wire application is available if terminals are short-circuited.) and converts temperature data [

] input from Pt100, JPt100 or nickel RTD Ni100 (hereinafter referred to as

Ni100

• 16-bit signed binary data (stored as a value rounded off to 1 decimal place

• 32-bit signed binary data (stored as a value rounded off to 3 decimal places

) to:

10)

1000)

and scaling values (ratios (%)).

Programmable controller

CPU

Q64RD/Q64RD-G

TO instruction

FROM instruction

Initial setting

Measured temperature

value, scaling value reading

(Buffer memory)

Set data

Measured temperature value

Scaling value

Measured temperature value

Scaling value

Channel 1

Temperature measurement

Channel 4

RTD

*: Refer to Section 3.4.15 for details of the scaling values.

1 - 1 1 - 1

1 OVERVIEW

1.1 Features

MELSEC-Q

(1) Channel isolation (Q64RD-G)

The Q64RD-G is a channel-isolated module.

(2) Four-channel temperature measurement by one module

The Q64RD and Q64RD-G are capable of measuring temperatures of 4 channels per module. Detected temperature values can be converted into scaling values (ratios (%)).

(3) Conversion enable/disable setting

You can make a conversion enable/disable setting for each channel. Disabling unused channels for conversion reduces sampling time. It also prevents unnecessary disconnection detection on unused channels.

(4) Standard-compliant RTD is usable

(a) Platinum RTD compliant with JIS (Japanese Industrial Standards) is usable

(Q64RD) Two types of JIS-compliant platinum RTDs (Pt100 and JPt100) can be used. The types can be selected for each channel on GX Developer.

(b) Platinum RTD compliant with JIS or Nickel RTD compliant with DIN is usable

(Q64RD-G) In addition to the above 2 types of JIS-compliant platinum RTDs, DINcompliant nickel RTDs can be used. The types of RTD can be selected for each channel on GX Developer.

(5) Connection of 3-wire or 4-wire RTD is available for each channel

For each channel, 3-wire or 4-wire RTD can be connected. By making the terminals short-circuited, 2-wire RTD can be used.

(6) Disconnection detection

The disconnection of a platinum RTD or cable can be detected on each channel.

(7) Optimal processing selection is available

Selectable options of Sampling processing, Time averaging processing and Count averaging processing, Moving average and Primary delay filter A desired conversion method can be selected for each channel.

(8) Optimal range selection is available

(a) Ranges of -20 to 120 , -180 to 600 and -200 to 850 can be selected

(Q64RD) When Pt100 or JPt100 is used, a desired range can be selected for each channel.

(b) Ranges of 0 to 200

can be selected (Q64RD-G)

180 When a platinum RTD, Pt100 or JPt100 is used, a range of 0 to 200 to 120 When a nickel RTD, Ni100 selected for each channel.

, -180 to 600 or -200 to 850 can be selected for each channel.

, -20 to 120 , -180 to 600 , -200 to 850 , -60 to

, -20

is used, a range of -60 to 180 can be

1 - 2 1 - 2

1 OVERVIEW

MELSEC-Q

(9) Error compensation by offset/gain value setting

Error compensation can be made by setting offset and gain values on each channel. As the offset and gain values, you can make selection from user settings and factory settings.

(10) Warning output

If the temperature detected is outside the preset measurement range, an warning can be output on each channel.

(11) Online Module Change

The module can be changed without the system being stopped. Also, by using the dedicated instructions (G(P).OGLOAD, G(P). OGSTOR) or writing to the buffer and turning on the corresponding Y signal, the offset/gain values can be re-set to the Q64RD/Q64RD-G replaced online and they can be transferred to the other Q64RD/Q64RD-G mounted in another slot. (Between the same models only)

(12) Easy setting by utility package

The utility package, GX Configurator-TI is available separately. This utility package is not necessarily to be used. However, using this makes the initial setting and auto refresh setting easy on screen, reduces sequence programs and enables easy setting and operation check.

1 - 3 1 - 3

1 OVERVIEW

MELSEC-Q

1.2 Added/Changed Functions

Functions added or changed for the Q64RD/Q64RD-G are shown below.

(1) Q64RD

Item Applicable module Function overview

Online module change

Mode switching that does not require CPU to be reset

Conversion setting for disconnection detection function

Moving average

Primary delay filter

Function version C or later

First 5 digits of product information are 07072 or later

First 5 digits of product information are 07072 or later First 5 digits of product information are 07072 or later

Functions added or changed for the Q64RD are shown below.

You can change the module without stopping the system. The CPU of function version C or later is required. Using the mode switching setting (buffer memory addresses 158, 159: Un\G158, Un\G159) and operating condition setting request (Y9), the module is switched between the normal mode and offset/gain setting mode without the CPU being reset. Using the dedicated instruction (G(P).OFFGAN), the module is switched between the normal mode and offset/gain setting mode without the CPU being reset. Using GX Configurator-TI, the module is switched between the normal mode and offset/gain setting mode without the CPU being reset. For values to be stored in the CH (buffer memory addresses 11 to 14, 54 to 61: Un\G11 to 14, Un\G54 to

61) in the case of disconnection detection, any of "Value immediately before disconnection", "Up scale (maximum value of measured temperature range + 5% of measured temperature range)", "Down scale (minimum value of measured temperature range – 5% of measured temperature range)" or "Given value" can be selected.

Digital output values sampled at specified number of times are averaged.

By a preset time constant, digital output values are smoothed.

measured temperature value

(2) Q64RD-G

Item Applicable version Function overview

Conversion setting for disconnection detection function

First 5 digits of product information are 07072 or later

1 - 4 1 - 4

The following is a function added for the Q64RD-G.

For values to be stored in the CH (buffer memory addresses 11 to 14, 54 to 61: Un\G11 to 14, Un\G54 to

measured temperature value

POINT

(1) Refer to Appendix 2.1 for the function comparison between function versions. (2) For differences between the Q64RD/Q64RD-G whose first 5 digits of product

information are 07071 or earlier and those of 07072 or later, refer to Appendix

2.2.

(3) Refer to Section 2.2 for how to check the function version and product information.

Reference

section

Chapter 7

Section

3.4.24

Appendix

3.2

Section

5.6.2

Section

3.2.2

Section

3.2.1

Section

3.2.1

Reference

section

Section

3.2.2

2 SYSTEM CONFIGURATION

MELSEC-Q

2 SYSTEM CONFIGURATION

This chapter explains the system configuration of the Q64RD/Q64RD-G.

2.1 Applicable Systems

CPU type CPU model

Programmable controller CPU

C Controller module

Applicable CPU module Base unit2

Basic model QCPU

High Performance model QCPU

Process CPU

Redundant CPU

Universal model QCPU

Safety CPU QS001CPU N/A

This section describes the applicable systems.

(1) Applicable modules and base units, and No. of modules

(a) When mounted with a CPU module

The table below shows the CPU modules and base units applicable to the Q64RD/Q64RD-G and quantities for each CPU model. Depending on the combination with other modules or the number of mounted modules, power supply capacity may be insufficient. Pay attention to the power supply capacity before mounting modules, and if the power supply capacity is insufficient, change the combination of the modules.

Q00JCPU Up to 16 Q00CPU Q01CPU Q02CPU Q02HCPU Q06HCPU Q12HCPU Q25HCPU Q02PHCPU Q06PHCPU Q12PHCPU Q25PHCPU Q12PRHCPU Q25PRHCPU Q02UCPU Up to 36 Q03UDCPU Q04UDHCPU Q06UDHCPU Q13UDHCPU Q26UDHCPU Q03UDECPU Q04UDEHCPU Q06UDEHCPU Q13UDEHCPU Q26UDEHCPU

Q06CCPU-V Q06CCPU-V-B

1 Limited within the range of I/O points for the CPU module.

2 Can be installed to any I/O slot of a base unit.

3 Use the Q64RD/Q64RD-G whose serial No. (first five digits) is 09012 or later.

No. of modules1

Up to 24

Up to 64

Up to 533

Up to 64

Main base unit

Extension base

unit

: Applicable : N/A

2 - 1 2 - 1

2 SYSTEM CONFIGURATION

Applicable network

QJ72LP25-25

QJ72LP25G

QJ72LP25GE

QJ72BR15

MELSEC-Q

(b) Mounting to a MELSECNET/H remote I/O station

The table below shows the network modules and base units applicable to the Q64RD/Q64RD-G and quantities for each network module model. Depending on the combination with other modules or the number of mounted modules, power supply capacity may be insufficient. Pay attention to the power supply capacity before mounting modules, and if the power supply capacity is insufficient, change the combination of the modules.

Base unit2

module

1 Limited within the range of I/O points for the network module.

2 Can be installed to any I/O slot of a base unit.

No. of modules1

Up to 64

Main base unit of

remote I/O station

Extension base unit of

remote I/O station

: Applicable : N/A

Remark

The Basic model QCPU or C Controller module cannot create the MELSECNET/H remote I/O network.

(2) Support of the multiple CPU system

When using the Q64RD/Q64RD-G in a multiple CPU system, refer to the following manual first.

• QCPU User's Manual (Multiple CPU System)

(a) Compatible Q64RD/Q64RD-G

Use a Q64RD/Q64RD-G of function version B or higher if using the module in a multiple CPU system.

(b) Intelligent function module parameters

Write intelligent function module parameters to only the control CPU of the Q64RD/Q64RD-G.

(3) In the case of online module change

To make an online module change, use the module of function version C or later.

2 - 2 2 - 2

2 SYSTEM CONFIGURATION

(4) Software packages for Q64RD

Relation between the system containing the Q64RD and software package is shown in the following table. GX Developer is necessary when using the Q64RD.

Q00J/Q00/Q01CPU

Q12H/Q25HCPU

Q02PH/Q06PHCPU

Q12PH/Q25PHCPU

Q12PRH/Q25PRHCPU

Q02U/Q03UD/ Q04UDH/Q06UDHCPU

Software Version

GX Developer

Single CPU system Version 7 or later

Multiple CPU system Version 8 or later

Single CPU system Version 4 or later Q02/Q02H/Q06H/

Multiple CPU system Version 6 or later

Single CPU system

Multiple CPU system

Single CPU system

Multiple CPU system

Redundant CPU system

Single CPU system

Multiple CPU system

Version 8.68W or later

Version 7.10L or later

Version 8.45X or later Version 1.14Q or later

Version 8.48A or later

MELSEC-Q

GX Configurator-TI

Version 1.10L or later

Version 1.00A or later

Version 1.13P or later

1 2

Q13UDH/Q26UDHCPU

Q03UDE/Q04UDEH/ Q06UDEH/Q13UDEH/ Q26UDEHCPU

If installed in a MELSECNET/H remote I/O station

1 The product of Version 1.14Q or earlier is not compatible with "normal mode - offset/gain setting

mode switching" and "OMC refresh data". Use the product of Version 1.15R or later.

2 The product of Version 1.20W or earlier is not compatible with "Moving average", "Primary delay

filter" and "Conversion setting for disconnection detection function". Use the product of Version

1.21X or later.

Single CPU system

Multiple CPU system

Single CPU system

Multiple CPU system

Version 8.62Q or later

Version 8.68W or later

Version 6 or later Version 1.00A or later

Version 1.24AA or later

2 - 3 2 - 3

2 SYSTEM CONFIGURATION

(5) Software packages for Q64RD-G

Relation between the system containing the Q64RD-G and software package is shown in the following table. GX Developer is necessary when using the Q64RD-G.

Q00J/Q00/Q01CPU

Q12H/Q25HCPU

Q02PH/Q06PHCPU

Q12PH/Q25PHCPU

Q12PRH/Q25PRHCPU

Q02U/Q03UD/ Q04UDH/Q06UDHCPU

Software Version

GX Developer

Single CPU system Version 7 or later

Multiple CPU system Version 8 or later

Single CPU system Version 4 or later Q02/Q02H/Q06H/

Multiple CPU system Version 6 or later

Single CPU system

Multiple CPU system

Single CPU system

Multiple CPU system

Redundant CPU system

Single CPU system

Multiple CPU system

Version 8.68W or later

Version 7.10L or later

Version 8.45X or later Version 1.14Q or later

Version 8.48A or later

MELSEC-Q

GX Configurator-TI1

Version 1.17T or later

Q13UDH/Q26UDHCPU

Q03UDE/Q04UDEH/ Q06UDEH/Q13UDEH/ Q26UDEHCPU

If installed in a MELSECNET/H remote I/O station

1 The product of Version 1.20W or earlier is not compatible with "Conversion setting for

disconnection detection function". Use the product of Version 1.21X or later.

Single CPU system

Multiple CPU system

Single CPU system

Multiple CPU system

Version 8.62Q or later

Version 8.68W or later

Version 6 or later Version 1.17T or later

Version 1.24AA or later

POINT

(1) The Q64RD of function version A is not available.

The Q64RD-G of function version A and B is not available. The products of function version C include the functions of version A and B.

(2) Depending on the version of GX Configurator-TI, applicable system, CPU

module and functions of Q64RD/Q64RD-G varies.

2 - 4 2 - 4

2 SYSTEM CONFIGURATION

2.2 About Use of the Q64RD/Q64RD-G with the Q12PRH/Q25PRHCPU

Here, use of the Q64RD/Q64RD-G with the Q12PRH/Q25PRHCPU is explained

(1) Dedicated instruction

The dedicated instruction cannot be used.

(2) GX Configurator-TI

When using GX Developer to access the Q12PRH/Q25PRHCPU through the intelligent function module on the extension base unit, GX Configurator-TI cannot be used. Connect a personal computer to the Q12PRH/Q25PRHCPU with a communication path indicated below.

1 2

MELSEC-Q

Main base unit

Extension base unit

(GX Configurator-TI cannot be used.)

Direct connection to the CPU

Connection through an intelligent function module on the main base unit (Through Ethernet module, MELSECNET/H module, or CC-Link module)

2 - 5 2 - 5

2 SYSTEM CONFIGURATION

MELSEC-Q

2.3 How to Check the Function Version, Product Information and Software Version

This section describes how to check the function version and product information of the Q64RD/Q64RD-G and the GX Configuration-TI software version.

(1) Checking the function version and product information of the

Q64RD/Q64RD-G

(a) To check the version using the "SERIAL column of the rating plate" located

on the side of the module

(b) To check the function version and product information using the GX

Developer See Section 8.2.10 of this manual.

POINT

The serial No. on the rating plate may be different from the serial No. displayed on the product information screen of GX Developer.

• The serial No. on the rating plate indicates the management information of the product.

• The serial No. displayed on the product information screen of GX Developer indicates the function information of the product. The function information of the product is updated when a new function is added.

Function version

Relevant regulation standards

2 - 6 2 - 6

2 SYSTEM CONFIGURATION

(2) Checking the software version of GX Configurator- TI

The software version of GX Configurator- TI can be checked in GX Developer’s "Product information" screen.

[Operating procedure]

GX Developer [Help] [Product information]

Software version

MELSEC-Q

(In the case of GX Developer Version 7)

2 - 7 2 - 7

3 SPECIFICATIONS

3.1 Performance Specifications

MELSEC-Q

The following are the performance specifications of the Q64RD/Q64RD-G.

3.1.1 Specifications of Q64RD

Item Specifications

Number of channels 4 channels

Output

Usable platinum RTD Pt100(JIS C1604-1997,IEC 751 1983), JPt100(JIS C1604-1981)

Measured temperature range

changing

Accuracy1

Resolution 0.025 Conversion speed 40ms/channel2 Number of analog input points 4 channels/module Temperature detecting output current 1mA E2PROM write count Max. 100,000 times

Isolation

Wire break detection Yes (Each channel independent)3

Number of occupied I/O points 16 points (I/O assignment: Intelligent 16 points)

Connection terminals 18-point terminal block

Applicable wire size 0.3 to 0.75mm2

Applicable crimping terminals 1.25-3 R1.25-3 (Sleeved crimping terminals are unusable)

Cables between Q64RD and platinum RTD

Internal current consumption (5VDC) 0.60A

Weight 0.17kg

Outline dimensions 98(H) 27.4(W) 90(D)mm

1: The selection ranges and accuracies have the following relationships.

Ambient Temperature

2: The conversion speed is a period from when a temperature is input and converted into a corresponding digital value until the value is

stored into the buffer memory. When two or more channels are used, the conversion speed is "40ms

3: For output in the case of disconnection detection, select any of "Value immediately before disconnection", "Up scale (maximum value

of measured temperature range + 5% of measured temperature range)", "Down scale (minimum value of measured temperature range – 5% of measured temperature range)" or "Given value". (Refer to Section 3.2.2.)

Temperature conversion value Scaling value 16-bit, signed binary

Pt100 -200 to 850

JPt100 -180 to 600

Pt100 -20 to 120 / -200 to 850 Range JPt100 -20 to 120 Ambient temperature 0 to 55 Ambient temperature 25

Specific isolated area

Selection Range

0 to 55 0.3 2.125 1.5

25 5 0.096 0.68 0.48

16-bit, signed binary data (-2000 to 8500: Value to the first decimal place

32-bit, signed binary data (-200000 to 850000: Value to the third decimal place

/ -180 to 600

0.25% (Accuracy relative to maximum value)

0.08% (Accuracy relative to maximum value)

Between platinum temperature-

measuring resistor input and

programmable controller power supply

Between platinum temperature-

measuring resistor input channels

Refer to Section 3.1.3.

Pt100 and JPt100 :

-20 to 120

number of conversion enabled channels".

Isolation

method

Photocouple

r isolation

No isolation -

-200 to 850

Dielectric withstand

1780VrmsAC/

(Altitude 2000m)

Pt100 :

voltage

3 cycles

JPt100 :

-180 to 600

10)

1000)

Isolation

resistance

10M

Ω or more

using 500VDC

isolation

resistance

tester

3 - 1 3 - 1

3 SPECIFICATIONS

MELSEC-Q

3.1.2 Specifications of Q64RD-G

Item Specifications

Number of channels 4 channels

16-bit, signed binary data

Output

Usable RTD

Measured

temperature

range

Range

changing

Accuracy1

(Accuracy

relative to

maximum

value of

selection

range)

Resolution 0.025

Conversion speed 40ms/channel4

Number of analog input points 4 channels/module

Temperature detecting output current 1mA E2PROM write count

Isolation

Wire break detection Yes (Each channel independent)5

Number of occupied I/O points

Connection terminals 18-point terminal block

Applicable wire size

Applicable crimping terminals 1.25-3 R1.25-3 (Sleeved crimping terminals are not usable.)

Cables between Q64RD-G and RTD Refer to Section 3.1.3.

Internal current consumption (5VDC) 0.62A

Weight 0.20kg

Outline dimensions 98(H) 27.4(W) 112(D)mm

Measured temperature value

Scaling value 16-bit, signed binary data

Pt100 -200 to 850

JPt100 -180 to 600

Ni100

Pt100 -20 to 120 /0 to -200 / -200 to 850

JPt100 -20 to 120 /0 to -200 / -180 to 600

Ni100

Reference accuracy2 Within 0.04%

Pt100/JPt100

Temperature

coefficient

(-20 to 120

Pt100/JPt100

(0 to 200

Pt100/JPt100

(-200 to 850

Pt100/JPt100

(-60 to 180

)

Specific isolated area

Between temperature-measuring

resistor input and programmable

controller power supply

Between temperature-measuring

resistor input channels

(-2000 to 8500: Value to the first decimal place

32-bit, signed binary data

(-200000 to 850000: Value to the third decimal place

Pt100 (JIS C1604-1997,IEC 751 1983), JPt100(JIS C1604-1981),

Ni100

(DIN43760 1987)

-60 to 180

70ppm/ ( 0.0070%/ )

65ppm/ ( 0.0065%/ )

50ppm/ ( 0.0050%/ )

70ppm/ ( 0.0070%/ )

Max. 100,000 times

Isolation

method

Photocoupler

isolation

Transformer

isolation

16 points (I/O assignment: Intelligent 16 points)

0.3 to 0.75mm

Dielectric

withstand voltage

1780VrmsAC/

3 cycles

(Altitude 2000m)

10)

1000)

Isolation

resistance

10M

or more

using 500VDC

isolation

resistance tester

3 - 2 3 - 2

3 SPECIFICATIONS

MELSEC-Q

1 The selection ranges and accuracies have the following relationships.

Selection Range

Ambient Temperature

0 to 55 0.300 1.615 1.140

Ambient Temperature

2 Accuracy in ambient temperature and wire resistance when the offset/gain setting is set.

3 Accuracy per 1-degree temperature change

Example) Accuracy for the case of changing from 25 to 30

0.04% (Reference accuracy) + 0.0070%/

4 The conversion speed is a period from when a temperature is input and converted into a corresponding digital value until the value is

stored into the buffer memory.

When two or more channels are used, the conversion speed is "40ms

5 For output in the case of disconnection detection, select any of "Value immediately before disconnection", "Up scale (maximum value

of measured temperature range + 5% of measured temperature range)", "Down scale (minimum value of measured temperature

range – 5% of measured temperature range)" or "Given value". (Refer to Section 3.2.2.)

25 5 0.090 0.553 0.390

Selection Range

0 to 55 0.470 0.450

25 5 0.145 0.135

Pt100 and JPt100:

-20 to 120

Pt100 and JPt100:

0 to 200

(Temperature coefficient) 5 (Temperature difference) = 0.075%

number of conversion enabled channels".

Pt100:

-200 to 850

Pt100:

-60 to 180

JPt100:

-180 to 600

3 - 3 3 - 3

3 SPECIFICATIONS

3.1.3 Specifications for RTD connection

This section explains the specifications for connection of the Q64RD/Q64RD-G and platinum temperature-measuring resistors.

(1) For 3-wire type

The wire resistance value should satisfy the condition of 1) + 2) 2 max. In addition, the difference of the wire resistance value between 1) and 2) should be 10

max.

Q64RD/Q64RD-G

MELSEC-Q

Wire

Pt100

SLD

(2) For 4-wire type

The wire resistance value should satisfy the condition of 1) + 2) 2 max.

Q64RD/Q64RD-G

Wire

Pt100

POINT

Wire resistance values may be an error factor in the temperature measurement. The error arisen between the Q64RD/Q64RD-G and the temperature-measuring resistor (between the wire resistance value 1) + 2) and measured temperature value) is Max. 0.007

/2 (Q64RD) or Max. 0.003 /2 (Q64RD-G). This error can be corrected by the offset/gain setting. When making offset/gain adjustment, set the wire resistance value actually used.

SLD

3 - 4 3 - 4

3 SPECIFICATIONS

MELSEC-Q

3.2 Function List

The following table lists the Q64RD/Q64RD-G functions.

Item Description Refer To

This function allows temperature data to be imported by connecting a

Temperature conversion

function

Temperature conversion

system

Conversion

enable/disable function

Range changing

function

Temperature-measuring

resistor selection

function

Disconnection detection

function

Conversion setting for disconnection detection function

Warning output function

Scaling function

Offset/gain setting

function

Online module change A module change is made without the system being stopped. Chapter 7

temperature-measuring resistor.

Temperature data are 16-bit signed binary (-2000 to 8500), 32-bit signed

binary (-200000 to 850000) and stored into buffer memory.

(1) Sampling processing

Values input by each channel are successively converted into temperature

values and output as measured temperature value.

(2) Averaging processing

(a) Time averaging

Temperature conversion is averaged by time on each channel and an

averaged value is stored.

(b) Count averaging

Temperature conversion is averaged by count on each channel and an

averaged value is stored.

Measured temperature values, which are taken at every sampling

interval for the specified number of times, are averaged.

(3) Primary delay filter

By a preset time constant, digital output values are smoothed.

This function specifies whether temperature conversion is enabled or disabled

on each channel.

Setting temperature conversion enable/disable reduces the processing time of

This function changes the measured temperature range. Section 4.5

This function sets the type of the temperature-measuring resistor per channel. Section 4.5

This function detects the disconnection of the connected temperature-

measuring resistor on each channel.

For values to be stored in the CH memory addresses 11 to 14, 54 to 61: Un\G11 to 14, Un\G54 to 61) in the case of disconnection detection, any of "Value immediately before disconnection", "Up scale (maximum value of measured temperature range + 5% of measured temperature range)", "Down scale (minimum value of measured temperature range – 5% of measured temperature range)" or "Given value" can be selected.

This function outputs a warning if a temperature falls outside the user-set

temperature range.

This function can convert a temperature conversion value into a preset range

ratio (%) and import it into buffer memory.

This function compensates for an error of a temperature conversion value. Section 3.4.20, 4.6

measured temperature value (buffer

Section 3.4.7,

3.4.16

Section 3.2.1

Section 3.4.3

Section 3.4.14

Section 3.2.2

Section 3.4.12,

3.4.13

Section 3.4.15,

3.4.17, 3.4.18

3 - 5 3 - 5

3 SPECIFICATIONS

3.2.1 Temperature conversion system

(1) Sampling processing

A temperature input value is converted into a temperature one by one and its measured temperature value is stored into buffer memory. Sampling processing time varies with the number of used channels (number of channels set to enable temperature conversion).

(Processing time) = (number of used channels)

[Example] Sampling time is 120ms when three channels, channels 1, 2 and 4, are enabled for conversion.

3 channels

(2) Averaging processing

(a) Time-specified averaging processing

When this option is specified for a channel, values input from the channel are converted into temperature values consecutively for the preset length of time. Then, the total amount of values after eliminating the maximum and minimum values is averaged to be stored into the buffer memory. Averaging processing requires at least 2 times of conversion processing excluding the maximum and the minimum values. The processing count within the preset time varies with the number of used channels (number of channels set to enable temperature conversion).

(Processing count) =

Setting range of preset time is 160 to 5000ms. When setting a value out of the setting range, an error (error code 20 occurs. [Example] The sampling count is 4.75 when four channels, channels 1, 2, 3 and 4, are enabled for conversion and the preset time is 760ms.

760ms ÷ (4 channels Since the fractional portion of an indivisible value is dropped, the sampling count is 4 times.

(b) Count-specified averaging processing

The time taken to store a count-averaged value into buffer memory varies with the number of used channels (number of channels set to enable temperature conversion).

(Processing time) = (preset count)

Setting range of preset count is 4 to 62500times. When setting a value out of the setting range, an error (error code 30 occurs.

[Example] An average value is output ever 320ms when two channels, channels 3 and 4, are enabled for conversion and the preset count is 4.

4 times

40ms = 120ms

(preset time)

(number of used channels)

40ms) = 4.75

(number of used channels) (40ms)

(2 channels 40ms) = 320ms

(40ms)

MELSEC-Q

(40ms)

)

3 - 6 3 - 6

3 SPECIFICATIONS

Since the calculation is done for each sampling period, the latest digital output value can be obtained. Setting range of moving average is 4 to 60times. When setting a value out of the setting range, an error (error code 31 occurs.

Moving average processing in the case of 4-time setting

MELSEC-Q

)

[ ]

Count set for averaging

4)3)

Temperature

Sampling cycle

Time [ms]

9)8)

12)

11)

10)

Buffer memory

1st storage

storage

3rd storage

Temperature conversion value

Data transition in buffer memory

1st storage 2nd storage 3rd storage

1) + 2) + 3) + 4)

2) + 3) + 4) + 5)

3) + 4) + 5) + 6)

3 - 7 3 - 7

+ 146 hidden pages

Mitsubishi q64rd, q64rd-g User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

• SAFETY PRECAUTIONS •

REVISIONS

INTRODUCTION

CONTENTS

Compliance with the EMC and Low Voltage Directives

About the Generic Terms and Abbreviations

Product Lineup

1 OVERVIEW

1.1 Features

1.2 Added/Changed Functions

2 SYSTEM CONFIGURATION

2.1 Applicable Systems

2.2 About Use of the Q64RD/Q64RD-G with the Q12PRH/Q25PRHCPU

2.3 How to Check the Function Version, Product Information and Software Version

3 SPECIFICATIONS

3.1 Performance Specifications

3.1.1 Specifications of Q64RD

3.1.2 Specifications of Q64RD-G

3.1.3 Specifications for RTD connection

3.2 Function List

3.2.1 Temperature conversion system