Mitsubishi Q2ACPU, Q3ACPU, Q4ACPU, Q2ACPUS1 User Manual

SAFETY PRECAUTIONS

(Read these precautions before using this product.)

Before using this product, please read this manual and the relevant manuals carefully and pay full attention to safety to handle the product correctly.

In this manual, the safety precautions are classified into two levels: " WARNING" and " CAUTION".

WARNING

CAUTION

Under some circumstances, failure to observe the precautions given under " CAUTION" may lead to

serious consequences. Make sure that the end users read this manual and then keep the manual in a safe place for future reference.

Indicates that incorrect handling may cause hazardous conditions, resulting in death or severe injury.

Indicates that incorrect handling may cause hazardous conditions, resulting in minor or moderate injury or property damage.

[DESIGN PRECAUTIONS]

WARNING

Create a safety circuit outside the PLC to ensure the whole system will operate safely even if an external power failure or a PLC failure occurs. Otherwise, incorrect output or malfunction may cause an accident. (1) For an emergency stop circuit, protection circuit and interlock circuit that is designed for

incompatible actions such as forward/reverse rotation or for damage prevention such as the upper/lower limit setting in positioning, any of them must be created outside the PLC.

(2) When the PLC detects the following error conditions, it stops the operation and turn off all the

outputs.

• The overcurrent protection device or overvoltage protection device of the power supply module is activated.

• The PLC CPU detects an error such as a watchdog timer error by the self-diagnostics function.

In the case of an error of a part such as an I/O control part that cannot be detected by the PLC CPU, all the outputs may turn on. In order to make all machines operate safely in such a case, set up a fail-safe circuit or a specific mechanism outside the PLC. For fail-safe circuit example, refer to "LOADING AND INSTALLATION" of this manual.

(3) Depending on the failure of the output module's relay or transistor, the output status may remain

ON or OFF incorrectly. For output signals that may lead to a serious accident, create an external monitoring circuit.

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[DESIGN PRECAUTIONS]

WARNING

If load current more than the rating or overcurrent due to a short circuit in the load has flowed in the output module for a long time, it may cause a fire and smoke. Provide an external safety device such as a fuse.

Design a circuit so that the external power will be supplied after power-up of the PLC. Activating the external power supply prior to the PLC may result in an accident due to incorrect output or malfunction.

For the operation status of each station at a communication error in data link, refer to the respective data link manual. Otherwise, incorrect output or malfunction may cause an accident.

When controlling a running PLC (data modification) by connecting a peripheral device to the CPU module or a PC to a special function module, create an interlock circuit on sequence programs so that the whole system functions safely all the time. Also, before performing any other controls (e.g. program modification, operating status change (status control)), read the manual carefully and ensure the safety. In these controls, especially the one from an external device to a PLC in a remote location, some PLC side problem may not be resolved immediately due to failure of data communications. To prevent this, create an interlock circuit on sequence programs and establish corrective procedures for communication failure between the external device and the PLC CPU.

When setting up the system, do not allow any empty slot on the base unit. If any slot is left empty, be sure to use a blank cover (AG60) or a dummy module (AG62) for it. When using the extension base unit, A52B, A55B or A58B, attach the included dustproof cover to the module in slot 0. Otherwise, internal parts of the module may be flied in the short circuit test or when an overcurrent or overvoltage is accidentally applied to the external I/O section.

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[DESIGN PRECAUTIONS]

CAUTION

Do not install the control lines or communication cables together with the main circuit or power lines, or bring them close to each other. Keep a distance of 100mm (3.94inch) or more between them. Failure to do so may cause malfunctions due to noise.

If having read register R outside the allowable range with the MOV instruction, the file register data will be FFFF file register when designing sequence programs. For instruction details, refer to the programming manual.

When an output module is used to control the lamp load, heater, solenoid valve, etc., a large current (ten times larger than the normal one) may flow at the time that the output status changes from OFF to ON. Take some preventive measures such as replacing the module with the one of a suitable current rating.

Time from when the CPU module is powered on or is reset to when it enters in RUN status depends on the system configuration, parameter settings, and program size. Design the program so that the entire system will always operate safely, regardless of the time.

H. Using this as it is may cause malfunctions. Pay attention not to use any out-of-range

[INSTALLATION PRECAUTIONS]

CAUTION

Use the PLC under the environment specified in the user's manual. Otherwise, it may cause electric shocks, fires, malfunctions, product deterioration or damage.

Insert the module fixing projection into the fixing hole in the base unit to mount the module. Incorrect mounting may cause malfunctions, a failure or a drop of the module. In an environment of frequent vibrations, secure the module with the screw. Tighten the screw within the specified torque range. If the screw is too loose, it may cause a drop of the module, a short circuit or malfunctions. Tightening the screw excessively may damage the screw and/or the module, resulting in a drop of the module, a short circuit or malfunctions.

Connect the extension cable to the connector of the base unit or module. Check for incomplete connection after installing it. Poor electrical contact may cause incorrect inputs and/or outputs.

Insert the memory card and fully press it to the memory card connector. Check for incomplete connection after installing it. Poor electrical contact may cause malfunctions.

Be sure to shut off all phases of the external power supply used by the system before mounting or removing the module. Failure to do so may damage the module.

Do not directly touch the conductive part or electronic components of the module. Doing so may cause malfunctions or a failure of the module.

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[WIRING PRECAUTIONS]

WARNING

Be sure to shut off all phases of the external power supply used by the system before wiring. Failure to do so may result in an electric shock or damage of the product.

Before energizing and operating the system after wiring, be sure to attach the terminal cover supplied with the product. Failure to do so may cause an electric shock.

CAUTION

Ground the FG and LG terminals correctly. Failure to do so may cause an electric shock or malfunctions.

Wire the module correctly after confirming the rated voltage and terminal layout. Connecting a power supply of a different voltage rating or incorrect wiring may cause a fire or failure.

Do not connect multiple power supply modules to one module in parallel. The power supply modules may be heated, resulting in a fire or failure.

Press, crimp or properly solder the connector for external connection with the specified tool. Incomplete connection may cause a short circuit, fire or malfunctions.

Tighten terminal screws within the specified torque range. If the screw is too loose, it may cause a short circuit, fire or malfunctions. If too tight, it may damage the screw and/or the module, resulting in a short circuit or malfunctions.

Carefully prevent foreign matter such as dust or wire chips from entering the module. Failure to do so may cause a fire, failure or malfunctions.

Install our PLC in a control panel for use. Wire the main power supply to the power supply module installed in a control panel through a distribution terminal block. Furthermore, the wiring and replacement of a power supply module have to be performed by a maintenance worker who acquainted with shock protection. (For the wiring methods, refer to Section 19.7.)

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[STARTUP AND MAINTENANCE PRECAUTIONS]

WARNING

Do not touch any terminal during power distribution. Doing so may cause an electric shock.

Correctly connect the battery connector. Do not charge, disassemble, heat, short-circuit, solder, or throw the battery into the fire. Incorrect battery handling may cause personal injuries or a fire due to exothermic heat, burst and/or ignition.

Be sure to shut off all phases of the external power supply used by the system before cleaning or retightening the terminal screws or module mounting screws. Failure to do so may result in an electric shock. If they are too loose, it may cause a short circuit or malfunctions. Tightening the screw excessively may damage the screw and/or the module, resulting in a drop of the module, a short circuit or malfunctions.

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[STARTUP AND MAINTENANCE PRECAUTIONS]

CAUTION

When performing online operations (especially, program modification, forced output or operating status change) by connecting a peripheral device to the running CPU module, read the manual carefully and ensure the safety. Incorrect operation will cause mechanical damage or accidents.

Do not disassemble or modify each of modules. Doing so may cause failure, malfunctions, personal injuries and/or a fire.

When using a wireless communication device such as a mobile phone, keep a distance of 25cm (9.84inch) or more from the PLC in all directions. Failure to do so may cause malfunctions.

Be sure to shut off all phases of the external power supply used by the system before mounting or removing the module. Failure to do so may result in failure or malfunctions of the module.

When replacing the fuse, use a fuse specified by the manufacturer. Using the one for the high-rated current or an electric wire may cause a fire.

Do not drop or apply any impact to the battery. Doing so may damage the battery, resulting in electrolyte spillage inside the battery. If any impact has been applied, discard the battery and never use it.

Before handling modules, touch a grounded metal object to discharge the static electricity from the human body. Failure to do so may cause failure or malfunctions of the module.

[DISPOSAL PRECAUTIONS]

CAUTION

When disposing of the product, treat it as an industrial waste. When disposing of batteries, separate them from other wastes according to the local regulations. (For details of the battery directive in EU member states, refer to Appendix 11.)

[TRANSPORTATION PRECAUTIONS]

CAUTION

When transporting lithium batteries, make sure to treat them based on the transportation regulations. (Refer to Appendix 10 for details of the relevant models.)

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CONDITIONS OF USE FOR THE PRODUCT

(1) Mitsubishi programmable controller ("the PRODUCT") shall be used in conditions;

i) where any problem, fault or failure occurring in the PRODUCT, if any, shall not lead to any major or serious accident; and ii) where the backup and fail-safe function are systematically or automatically provided outside of the PRODUCT for the case of any problem, fault or failure occurring in the PRODUCT.

(2) The PRODUCT has been designed and manufactured for the purpose of being used in general

industries. MITSUBISHI SHALL HAVE NO RESPONSIBILITY OR LIABILITY (INCLUDING, BUT NOT LIMITED TO ANY AND ALL RESPONSIBILITY OR LIABILITY BASED ON CONTRACT, WARRANTY, TORT, PRODUCT LIABILITY) FOR ANY INJURY OR DEATH TO PERSONS OR LOSS OR DAMAGE TO PROPERTY CAUSED BY the PRODUCT THAT ARE OPERATED OR USED IN APPLICATION NOT INTENDED OR EXCLUDED BY INSTRUCTIONS, PRECAUTIONS, OR WARNING CONTAINED IN MITSUBISHI'S USER, INSTRUCTION AND/OR SAFETY MANUALS, TECHNICAL BULLETINS AND GUIDELINES FOR the PRODUCT. ("Prohibited Application") Prohibited Applications include, but not limited to, the use of the PRODUCT in;

• Nuclear Power Plants and any other power plants operated by Power companies, and/or any other cases in which the public could be affected if any problem or fault occurs in the PRODUCT.

• Railway companies or Public service purposes, and/or any other cases in which establishment of a special quality assurance system is required by the Purchaser or End User.

• Aircraft or Aerospace, Medical applications, Train equipment, transport equipment such as Elevator and Escalator, Incineration and Fuel devices, Vehicles, Manned transportation, Equipment for Recreation and Amusement, and Safety devices, handling of Nuclear or Hazardous Materials or Chemicals, Mining and Drilling, and/or other applications where there is a significant risk of injury to the public or property.

Notwithstanding the above, restrictions Mitsubishi may in its sole discretion, authorize use of the PRODUCT in one or more of the Prohibited Applications, provided that the usage of the PRODUCT is limited only for the specific applications agreed to by Mitsubishi and provided further that no special quality assurance or fail-safe, redundant or other safety features which exceed the general specifications of the PRODUCTs are required. For details, please contact the Mitsubishi representative in your region.

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REVISIONS

*The manual number is given on the bottom left of the back cover.

Print Date *Manual Number Revision Jul., 1996 IB (NA) 66608-A First edition

Dec., 2003 IB (NA) 66608-B

Oct., 2006 IB (NA) 66608-C

Partial correction

SAFETY PRECAUTIONS, CONTENTS, Related Manuals, Section 1.1, 1.2, 2.1,

3.1.1, 3.1.2, 3.2, 3.3.1, 3.3.2, 3.3.3, Chapter 4, Section 5.1, 5.2, 5.3, 5.4, 6.1, 6.2,

6.3, 7.1, 8.1, 8.2, 8.2.1, 8.3, 8.4.1, 8.4.3, 8.5, 8.6, 8.7, 8.7.1, 8.7.2, 8.7.3, 8.8, 8.9,

8.10, 8.10.1, 8.10.2, 9.1, 9.2, 9.3, 9.3.1, 9.3.3, 9.4, 9.5, 9.6, 9.7, 9.8, 9.9, 9.9.1,

9.9.2, 10.1, 10.2, 10.3, 10.4, 10.5, 10.6, 10.6.1, 10.6.2, 10.6.3, 10.6.4, 10.6.5,

10.6.6, 10.7, 10.7.1, 10.8, 11.1, 11.2, 11.3, 11.4, 11.5, 11.6, 11.7, 12.1, 12.1.1,

12.1.2, 12.1.3, 12.1.4, 12.1.5, 12.1.6, 12.1.7, 12.2, 12.3, 12.4, Chapter 13, 14, Section 14.1, 14.2, 14.3, 15.1, 15.2, 15.3, 16.1.1, 16.1.2, 16.2, 16.3, Chapter 17, Section 17.1, 17.1.1, 17.2, 17.4, 17.5, 18.1, 18.2, 18.3, 18.4, 18.6, 18.7, 19.1,

19.4.1, 19.5, 19.6, 19.7, 19.7.1, 19.7.2, 19.8, 21.1, 21.2, 21.3, 21.3.1, 21.3.2,

21.4, 21.4.1, 21.4.2, 22.2.1, 22.2.2, 22.2.3, 22.2.4, 22.2.5, 22.2.6, 22.2.7, 22.2.8,

22.2.9, 22.2.10, 22.3, 22.3.1, 22.3.2, 22.5, 22.5.1, 22.5.2, Appendix 1.1, 1.4, 1.6,

2.3, 4.4.1, 4.2, 4.3, 4.6, 4.10, 4.11, 4.12, 5.1, 5.2, 6.2

Partial addition

Section 2.2, 2.2.1, 7.2, 8.2.2, 19.8, Chapter 20, Section 20.1, 20.1.1, 20.1.2,

20.1.3, 20.1.4, 20.1.5, 20.1.6, 20.2, 20.2.1, 20.2.2, 20.2.3, 20.2.4, 20.2.5, 20.2.6,

20.2.7, 22.4, Appendix 7, 8, 9, 9.1, 9.2, WARRANTY

Partial correction

SAFETY PRECAUTIONS, Section 3.1.1, 3.1.2, 3.2, 3.3.1, 3.3.2, Chapter 4, Section 5.3, 6.1, 7.1, 9.1, 9.3, 9.3.1, 9.9.2, 12.1.2, 12.1.5, 12.4, 14.1, 15.1, 15.2,

16.1.1, 16.1.3, 16.2, 16.3, 17.1, 17.1.1, 17.2, 17.5, 18.1, 18.2, 18.3, 19.1, 19.6,

19.7, Chapter 20, Section 20.1.3, 21.5, 21.6, 22.2.6, 22.2.7, 22.3.3, Appendix 2, 3, 5.2, 6.2, 9.2

Deletion

Section 14.2

Chapter change

Section 14.3 Section 14.2

May, 2007 IB(NA)66608-D

Dec., 2009 IB(NA)66608-E

Partial correction

Related Manuals, Section 19.7.1, 19.7.2, 20.1.3, 20.1.4, 20.2.7, 22.3, APPENDIX 2, APPENDIX3

Partial correction

SAFETY PRECAUTIONS, Section 3.3.1, Chapter 13, Section 15.1, 16.1.2,

16.1.3, 18.3, Chapter 20, 21.3.1, 21.3.2, 22.3, 22.3.1, 22.3.3, 22.3.4, 22.3.5,

22.3.6, 22.3.7, 22.3.8, 22.3.9, APPENDIX 2, APPENDIX 3

Addition

CONDITIONS OF USE FOR THE PRODUCT, APPENDIX 2, 3, 11, 11.1, 11.2

Japanese Manual Version SH-3532-L

This manual confers no industrial property rights or any rights of any other kind, nor dose it confer any patent licenses. Mitsubishi Electric Corporation cannot be held responsible for any problems involving industrial property rights which may occur as a result of using the contents noted in this manual.

1995 MITSUBISHI ELECTRIC CORPORATION

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*The manual number is given on the bottom left of the back cover.

Print Date *Manual Number Revision

Mar., 2010 IB(NA)66608-F

Partial correction

SAFETY PRECAUTIONS, Section 3.3.1, 19.1, 19.5, 19.7.1, 21.2, 21.3.2, 22.3.7, APPENDIX 2

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Introduction

Thank you for purchasing the Mitsubishi programmable logic controller MELSEC-QnA series. Before using your new PLC, please read this manual thoroughly to gain an understanding of its functions so that you can use it properly. Please forward a copy of this manual to the end user.

1 ABOUT THIS MANUAL 1 - 1 to 1 - 2

1.1 About this Manual..........................................................................................................................1 - 1

1.2 Abbreviations and Generic Terms Used in this Manual ................................................................1 - 2

2 OVERVIEW 2 - 1 to 2 - 8

2.1 Features ........................................................................................................................................2 - 1

2.2 Additional Functions of QnACPU ..................................................................................................2 - 5

2.2.1 Overview of added functions.................................................................................................2 - 7

3 SYSTEM CONFIGURATION 3 - 1 to 3 - 25

3.1 System Configuration ....................................................................................................................3 - 1

3.1.1 Equipment configuration in a stand-alone system ................................................................3 - 1

3.1.2 Configuration of peripheral devices capable of QnACPU .....................................................3 - 2

3.2 System Configuration Overview ....................................................................................................3 - 3

3.3 System Equipment ........................................................................................................................3 - 6

3.3.1 System equipment list ...........................................................................................................3 - 6

3.3.2 Precautions when configuring the system...........................................................................3 - 21

3.3.3 QnACPU memory block diagram ........................................................................................3 - 25

4 PERFORMANCE SPECIFICATIONS 4 - 1 to 4 - 3

5 I/O NUMBER ASSIGNMENT 5 - 1 to 5 - 14

5.1 I/O Numbers ..................................................................................................................................5 - 1

5.2 I/O Number Assignment Concept..................................................................................................5 - 2

5.3 I/O Assignment with GPP Function ...............................................................................................5 - 4

5.4 Example of I/O Number Assignment .............................................................................................5 - 9

6 DATA COMMUNICATIONS WITH SPECIAL FUNCTION MODULES 6 - 1 to 6 - 5

6.1 Reading/Writing Data from/to the QnACPU Using the FROM/TO Instruction ...............................6 - 2

6.2 Reading/Writing Data from/to the QnACPU Using Special Direct Devices ...................................6 - 3

6.3 Processing for Data Communication Requests from a Special Function Module .........................6 - 5

7 AUTO REFRESH FUNCTION 7 - 1 to 7 - 14

7.1 For MELSECNET/MINI-S3............................................................................................................7 - 1

7.2 Auto Refresh Setting of CC-Link ...................................................................................................7 - 8

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8 DEBUGGING FUNCTION 8 - 1 to 8 - 64

8.1 Function List ..................................................................................................................................8 - 1

8.2 Monitor Function............................................................................................................................8 - 2

8.2.1 Monitoring condition setting ..................................................................................................8 - 2

8.2.2 Monitor test of local device (function version B or later) .....................................................8 - 12

8.3 Write During RUN........................................................................................................................8 - 15

8.4 Execution Time Measurement.....................................................................................................8 - 19

8.4.1 Program monitor list ............................................................................................................8 - 19

8.4.2 Interrupt program monitor list ..............................................................................................8 - 22

8.4.3 Scan time measurement .....................................................................................................8 - 23

8.5 Sampling Trace Function ............................................................................................................8 - 25

8.6 Status Latch Function..................................................................................................................8 - 35

8.7 Step Operation ............................................................................................................................8 - 41

8.7.1 Step execution ....................................................................................................................8 - 42

8.7.2 Partial execution..................................................................................................................8 - 44

8.7.3 Skip function........................................................................................................................8 - 47

8.8 Program Trace Function..............................................................................................................8 - 48

8.9 Simulation Function .....................................................................................................................8 - 57

8.10 Debugging by Several People.....................................................................................................8 - 61

8.10.1 Simultaneous monitoring by several people .......................................................................8 - 62

8.10.2 Simultaneous execution of write during RUN by several people ........................................8 - 63

9 MAINTENANCE FUNCTION 9 - 1 to 9 - 21

9.1 Function List ..................................................................................................................................9 - 1

9.2 Watchdog Timer ............................................................................................................................9 - 2

9.3 Self-diagnostics Function ..............................................................................................................9 - 4

9.3.1 Interruption due to error detection.........................................................................................9 - 8

9.3.2 LED indication due to an error ..............................................................................................9 - 8

9.3.3 Resetting error ......................................................................................................................9 - 9

9.4 Error History ................................................................................................................................9 - 10

9.5 System Protect ............................................................................................................................9 - 11

9.6 Password Registration ................................................................................................................9 - 12

9.7 Online I/O Module Replacement .................................................................................................9 - 14

9.8 System Display............................................................................................................................9 - 16

9.9 LED Indications ...........................................................................................................................9 - 17

9.9.1 LED indication .....................................................................................................................9 - 17

9.9.2 Priority setting .....................................................................................................................9 - 19

10 OTHER FUNCTIONS 10 - 1 to 10 - 24

10.1 Function List ................................................................................................................................10 - 1

10.2 Constant Scan.............................................................................................................................10 - 2

10.3 Latch Function.............................................................................................................................10 - 5

10.4 Setting of the Output (Y) Status When Switching from STOP to RUN ........................................10 - 7

10.5 Clock Function.............................................................................................................................10 - 8

10.6 Remote Operation .....................................................................................................................10 - 13

10.6.1 Remote RUN/STOP ..........................................................................................................10 - 13

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10.6.2 Remote STEP-RUN ..........................................................................................................10 - 15

10.6.3 Remote PAUSE ................................................................................................................10 - 16

10.6.4 Remote RESET.................................................................................................................10 - 18

10.6.5 Remote latch clear ............................................................................................................10 - 19

10.6.6 Relationship between remote operation and CPU module RUN/STOP key switch ..........10 - 20

10.7 Terminal Operation....................................................................................................................10 - 21

10.7.1 Operation for message display .........................................................................................10 - 21

10.7.2 Key input operation ...........................................................................................................10 - 22

10.8 Reading Module Access Time Intervals ....................................................................................10 - 23

11 COMMENTS THAT CAN BE STORED IN QnACPU 11 - 1 to 11 - 8

11.1 Function List ................................................................................................................................11 - 1

11.2 PLC name ...................................................................................................................................11 - 2

11.3 Drive Title ....................................................................................................................................11 - 3

11.4 File Title.......................................................................................................................................11 - 4

11.5 Device Comment.........................................................................................................................11 - 5

11.6 Statements/Notes........................................................................................................................11 - 7

11.7 Initial Device Value Comment .....................................................................................................11 - 8

12 OVERVIEW OF PROCESSING PERFORMED BY THE QnACPU 12 - 1 to 12 - 28

12.1 Program Execution Types ...........................................................................................................12 - 1

12.1.1 Initial execution type programs ...........................................................................................12 - 4

12.1.2 Scan execution type program .............................................................................................12 - 7

12.1.3 Low-speed execution type program ....................................................................................12 - 9

12.1.4 Standby type program.......................................................................................................12 - 16

12.1.5 Initial processing ...............................................................................................................12 - 22

12.1.6 Refresh processing of I/O module.....................................................................................12 - 22

12.1.7 END processing ................................................................................................................12 - 23

12.2 Operation Processing of RUN, STOP, PAUSE, and STEP-RUN..............................................12 - 24

12.3 Operation Processing for Instantaneous Power Failure............................................................12 - 26

12.4 Data Clear Processing ..............................................................................................................12 - 27

13 PARAMETER LIST 13 - 1 to 13 - 10

14 SELECTING MEMORY CARD MODELS 14 - 1 to 14 - 4

14.1 Applications of Memory Cards ....................................................................................................14 - 2

14.2 Selecting Memory Card Capacity................................................................................................14 - 3

15 HARDWARE SPECIFICATIONS OF CPU MODULES 15 - 1 to 15 - 7

15.1 SPECIFICATIONS ......................................................................................................................15 - 1

15.2 Part Names .................................................................................................................................15 - 2

15.3 Relationship between Switch Operations and LEDs/LED Display ..............................................15 - 5

16 POWER SUPPLY MODULE 16 - 1 to 16 - 14

16.1 Specifications ..............................................................................................................................16 - 1

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16.1.1 Power supply module specifications ...................................................................................16 - 1

16.1.2 Power supply module selection...........................................................................................16 - 5

16.1.3 Fuse specifications..............................................................................................................16 - 7

16.2 Handling precautions...................................................................................................................16 - 8

16.3 Part Names ...............................................................................................................................16 - 10

17 BASE UNIT AND EXTENSION CABLE 17 - 1 to 17 - 11

17.1 Specifications of Base Units........................................................................................................17 - 1

17.1.1 Main base unit for high-speed access (A38HB/A38HBEU) ................................................17 - 3

17.2 Extension Cable Specifications ...................................................................................................17 - 4

17.3 Application Standards of Extension Base Units (A52B, A55B, A58B) ........................................17 - 5

17.4 Handling Precautions ..................................................................................................................17 - 7

17.5 Part Names .................................................................................................................................17 - 8

17.6 Setting of Extension Stage Numbers ........................................................................................17 - 11

18 MEMORY CARDS AND BATTERIES 18 - 1 to 18 - 9

18.1 Memory Card Specifications .......................................................................................................18 - 1

18.2 Handling Memory Cards..............................................................................................................18 - 3

18.3 Battery Specifications (CPU Module and Memory Card Batteries) .............................................18 - 4

18.4 Handling Precautions ..................................................................................................................18 - 5

18.5 Part Names of Memory Card.......................................................................................................18 - 6

18.6 Installing Batteries (CPU Module and Memory Card Batteries) ..................................................18 - 7

18.7 Installing/Removing a Memory Card ...........................................................................................18 - 8

19 LOADING AND INSTALLATION 19 - 1 to 19 - 24

19.1 Fail-Safe Circuit Concept ............................................................................................................19 - 1

19.2 Installation Environment ..............................................................................................................19 - 7

19.3 Calculation of Heat Generated by the PLC .................................................................................19 - 8

19.4 Installing the Base Units............................................................................................................19 - 10

19.4.1 Installation precautions .....................................................................................................19 - 10

19.4.2 Installation .........................................................................................................................19 - 11

19.5 Installation and Removal of Modules ........................................................................................19 - 12

19.6 Installation and Removal of the Dustproof Cover ......................................................................19 - 15

19.7 Wiring ........................................................................................................................................19 - 17

19.7.1 Wiring instructions .............................................................................................................19 - 17

19.7.2 Wiring to module terminals................................................................................................19 - 22

19.8 Precautions When Connecting Uninterruptible Power Supply Module (UPS)...........................19 - 24

20 EMC AND LOW VOLTAGE DIRECTIVES 20 - 1 to 20 - 14

20.1 Requirements for Compliance with EMC Directives....................................................................20 - 1

20.1.1 EMC standards ...................................................................................................................20 - 2

20.1.2 Installation inside the control panel .....................................................................................20 - 3

20.1.3 Cables .................................................................................................................................20 - 4

20.1.4 Power supply module..........................................................................................................20 - 9

20.1.5 Base unit .............................................................................................................................20 - 9

20.1.6 Ferrite core ........................................................................................................................20 - 10

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20.1.7 Noise filter (power supply line filter) ..................................................................................20 - 10

20.2 Requirements for Compliance with Low Voltage Directives......................................................20 - 11

20.2.1 Standard applied for MELSEC-QnA series PLC ...............................................................20 - 11

20.2.2 Precautions when using the QnA series PLC ...................................................................20 - 11

20.2.3 Power supply.....................................................................................................................20 - 12

20.2.4 Control panel .....................................................................................................................20 - 13

20.2.5 Module installation ............................................................................................................20 - 14

20.2.6 Grounding .........................................................................................................................20 - 14

20.2.7 External wiring...................................................................................................................20 - 14

21 MAINTENANCE AND INSPECTION 21 - 1 to 21 - 15

21.1 Daily Inspection ...........................................................................................................................21 - 1

21.2 Periodic Inspection ......................................................................................................................21 - 2

21.3 Battery Replacement...................................................................................................................21 - 4

21.3.1 Battery life ...........................................................................................................................21 - 6

21.3.2 Battery replacement procedure...........................................................................................21 - 8

21.4 Fuse Replacement ....................................................................................................................21 - 12

21.4.1 Replacement of the fuse for a power supply module ........................................................21 - 12

21.4.2 Replacement of the fuse for an output module .................................................................21 - 13

21.5 When Reoperating a PLC After Storing it with a Battery Unconnected.....................................21 - 14

21.6 When a PLC is Reoperated After Stored with the Battery Over the Battery Life.......................21 - 15

22 TROUBLESHOOTING 22 - 1 to 22 - 52

22.1 Fundamentals of Troubleshooting...............................................................................................22 - 1

22.2 Troubleshooting...........................................................................................................................22 - 2

22.2.1 Troubleshooting flowchart ...................................................................................................22 - 2

22.2.2 Flow for actions when the "POWER" LED is turned OFF ...................................................22 - 3

22.2.3 Flow for actions when the "RUN" LED is turned OFF .........................................................22 - 4

22.2.4 When the "RUN" LED is flashing ........................................................................................22 - 5

22.2.5 Flow for actions when the "ERROR LED" is turned ON/flashing ........................................22 - 6

22.2.6 When the "USER" LED is turned ON ..................................................................................22 - 7

22.2.7 When the "BAT.ARM" LED is turned ON ...........................................................................22 - 7

22.2.8 Flow for actions when the output module's output load does not turn ON ..........................22 - 8

22.2.9 Flow for actions when the program cannot be written.........................................................22 - 9

22.2.10 Flow for actions when booting from a memory card is not possible..................................22 - 11

22.2.11 Flow chart used when the CPU module is not started up .................................................22 - 13

22.3 Error Code List ..........................................................................................................................22 - 15

22.3.1 Error Codes.......................................................................................................................22 - 16

22.3.2 Procedure to read an error code .......................................................................................22 - 16

22.3.3 Error code list (1000 to 1999)............................................................................................22 - 17

22.3.4 Error code list (2000 to 2999)............................................................................................22 - 22

22.3.5 Error code list (3000 to 3999)............................................................................................22 - 28

22.3.6 Error code list (4000 to 4999)............................................................................................22 - 32

22.3.7 Error code list (5000 to 5999)............................................................................................22 - 41

22.3.8 Error code list (6000 to 6999)............................................................................................22 - 42

22.3.9 Error code list (7000 to 10000)..........................................................................................22 - 44

22.3.10 Canceling of Errors ...........................................................................................................22 - 45

A - 14

22.4 Resetting Errors ........................................................................................................................22 - 46

22.5 Fault Examples with I/O Modules..............................................................................................22 - 47

22.5.1 Faults with the input circuit and the corrective actions......................................................22 - 47

22.5.2 Faults in the output circuit .................................................................................................22 - 49

APPENDICES App - 1 to App - 163

APPENDIX 1 INSTRUCTION LIST................................................................................................. App - 1

Appendix 1.1 Sequence Instructions ......................................................................................... App - 1

Appendix 1.2 Basic Instructions................................................................................................. App - 5

Appendix 1.3 Application Instructions ...................................................................................... App - 17

Appendix 1.4 Data Link Instructions ........................................................................................ App - 38

Appendix 1.5 PID Control Instructions ..................................................................................... App - 41

Appendix 1.6 Special Function Module Instructions ................................................................ App - 42

APPENDIX 2 Special Relay List ................................................................................................... App - 48

APPENDIX 3 Special Register List ............................................................................................... App - 72

APPENDIX 4 PRECAUTIONS FOR UTILIZING THE EXISTING MELSEC-A SERIES PROGRAM FOR

QnACPU ............................................................................................................... App - 110

Appendix 4.1 Instructions....................................................................................................... App - 110

Appendix 4.2 Devices ............................................................................................................ App - 118

Appendix 4.3 Parameters ...................................................................................................... App - 120

Appendix 4.4 Timer and Interrupt Counter Operations .......................................................... App - 121

Appendix 4.5 Sequence Programs, Statements, Notes......................................................... App - 122

Appendix 4.6 Microcomputer programs ................................................................................. App - 124

Appendix 4.7 Comments........................................................................................................ App - 125

Appendix 4.8 Constant Scan Function, Error Check Function............................................... App - 126

Appendix 4.9 I/O control mode .............................................................................................. App - 127

Appendix 4.10 Data Link System............................................................................................. App - 128

Appendix 4.11 Index Register Processing ............................................................................... App - 129

Appendix 4.12 CHK Instruction, IX Instruction......................................................................... App - 130

Appendix 4.13 Accessing File Register R with Instructions ..................................................... App - 131

APPENDIX 5 ERROR CODES RETURNED TO THE REQUEST SOURCE IN GENERAL DATA

PROCESSING ...................................................................................................... App - 132

Appendix 5.1 Error Codes...................................................................................................... App - 132

Appendix 5.2 Error Contents of Error Codes Detected by the CPU Module (4000H to 4FFFH)

......................................................................................................................... App - 133

APPENDIX 6 EXTERNAL DIMENSIONS ................................................................................... App - 141

Appendix 6.1 CPU Module..................................................................................................... App - 141

Appendix 6.2 Power Supply Module ...................................................................................... App - 143

Appendix 6.3 Main Base Unit................................................................................................. App - 145

Appendix 6.4 Extension Base Unit......................................................................................... App - 147

APPENDIX 7 USE OF LOCAL DEVICE FOR SUBROUTINE/INTERRUPT PROGRAM STORAGE FILE

(FUNCTION VERSION B OR LATER) ................................................................. App - 149

APPENDIX 8 NETWORK RELAY FROM ETHERNET MODULE

(FUNCTION VERSION B OR LATER) ................................................................. App - 153

APPENDIX 9 QnACPU PROCESSING TIME............................................................................. App - 156

Appendix 9.1 Overview of QnACPU Scan Time .................................................................... App - 156

Appendix 9.2 Causes of Increasing Scan Time ..................................................................... App - 157

A - 15

APPENDIX 10 TRANSPORTATION PRECAUTIONS.................................................................. App - 160

Appendix 10.1 Relevant Models .............................................................................................. App - 160

Appendix 10.2 Transportation Guidelines................................................................................ App - 161

APPENDIX 11 Handling of Batteries and Devices with Built-in Batteries in EU Member States

.............................................................................................................................. App - 162

Appendix 11.1 Disposal precautions........................................................................................ App - 162

Appendix 11.2 Exportation precautions ................................................................................... App - 163

INDEX Index - 1 to Index - 6

A - 16

bout This Manual

Related Manuals

The following manuals are related to this product. Please order those you require.

Manual Name

QnACPU Programming Manual (Fundamentals)

Explains the programming procedures, device names and program types required for program creation. (Sold separately)

QCPU (Q mode)/QnACPU Programming Manual (Common Instructions)

Explains how to use the sequence instructions, basic instructions and application instructions. (Sold separately)

QnACPU Programming Manual (Special Function Module)

Explains the dedicated instructions used with special function modules.

(Sold separately)

QnACPU Programming Manual (AD57 Instructions)

Explains the dedicated instructions for controlling an AD57 (S1) type CRT controller module. (Sold separately)

QCPU (Q mode)/QnACPU Programming Manual (PID Control Instructions)

Explains the dedicated instructions to execute PID control. (Sold separately)

QCPU (Q mode)/QnACPU Programming module (SFC)

Explains MELSAP3 system configuration, performance specifications, functions, programming, debugging and error codes. (Sold separately)

Building Block Type I/O Module User's Manual

Explains the specifications of building block type I/O modules.

(Sold separately)

MELSECNET/10 Network System (for QnA/Q4AR) Reference Manual

Describes the general concept, specifications, and part names and settings, for MELSECNET/10. (Sold separately)

MELSECNET, MELSECNET/B Data Link System Reference Manual

Explains overviews, specifications, part names, and settings of MELSECNET (II) and MELSECNET/B. (Sold separately)

GX Developer Version 8 Operating Manual

Explains the methods of programming, print out, monitoring, and debugging of Developer. (Sold separately)

SW2IVD-GPPQ GPP Software package Operating Manual (Offline)

Explains offline functions such as the methods of programming, print out and file maintenance of SW2IVD-GPPQ.

(Included with product)

SW2IVD-GPPQ GPP Software package Operating Manual (Online)

Explains online functions such as methods of monitoring and debugging of SW2IVD-GPPQ. (Included with product)

Type SW2IVD-GPPQ GPP Software package Operating Manual (SFC)

Describes MELSAP-3 system components, performance specifications, functions, system start-up procedure, SFC program editing method, monitoring method, printout method and error messages.

(Included with product)

Manual No.

(Model Code)

IB-66614 (13JF46)

SH-080039

(13JF58)

SH-4013 (13JF56)

IB-66617 (13JF49)

SH-080040

(13JF59)

SH-080041

(13JF60)

IB-66140 (13J643)

IB-66690 (13JF78)

IB-66350 (13JF70)

SH-080373E

(13JU41)

IB-66774 (13J921)

IB-66775 (13J922)

IB-66776 (13J923)

A - 17

Manual Name

Type SW2IVD-GPPQ GPP Software package Operating Manual (Q6TEL)

Describes Q6TEL system configuration, operating methods, etc.

(Included with product)

Manual No.

(Model Code)

IB-66777 (13J924)

A - 18

ser Precautions

Precautions when using QnACPU

When using a CPU module, format the memory using a peripheral device. For details of memory format, refer to the following manuals.

• GX Developer Operating Manual

• SW IVD-GPPQ Software package Operating Manual (Online)

recautions for Battery

(1) The operation after removal of a battery

After removing a battery of the CPU module, format the memory using a peripheral device to start next operation. (Refer to Section 21.5)

(2) The operation after excess of a battery life

After removing a battery of the CPU module due to its excess life, format the memory using a peripheral device to start next operation. (Refer to Section 21.6)

A - 19

ABOUT THIS MANUAL

1 ABOUT THIS MANUAL

1.1 About this Manual

This manual serves to explain the specifications and functions of the Q2ACPU(S1), Q3ACPU, and Q4ACPU (abbreviated as QnACPU hereafter), the specifications of other modules, and the maintenance required for smooth system operation, to users of MELSEC-QnA series programmable controllers.

It is divided into the following three main parts:

(1) Sections 2 and 3 These sections give the general description and system

(2) Sections 4 to 15 These sections give the specifications and functions of

configuration for the QnACPU. Read them to learn the features of QnACPU, and the modules that can be used and points to note when configuring a system.

QnACPU. They describe each QnACPU function to enable you to use the QnACPU effectively.

(3) Sections 16 to 18 These sections describe the specifications and handling of units/

modules other than the CPU module (power supply module, base units, etc.). Read them to learn how to handle the power supply module, base units, memory cards, etc.

(4) Sections 19 to 20 These sections describe the loading and installation, EMC and

low voltage directives.

(5) Sections 21 to 22 These sections describe all aspects of maintenance, from

installing the QnACPU to daily inspections and troubleshooting. Read them to learn how to install the QnACPU so as to ensure smooth operation, and how to carry out daily inspections and corrective action in the event of trouble.

REMARK

This manual does not cover MELSECNET(II) data link systems, MELSECNET/B data link systems, MELSECNET/10 networks, or the SFC function. For details on each function, refer to the following manuals.

• MELSECNET(II), MELSECNET/B Data Link MELSECNET, MELSECNET/B Data Link System Reference Manual

• MELSECNET/10 Network MELSECNET/10 Network System Manual for QnA/Q4AR

• SFC Function QCPU (Q Mode)/QnACPU Programming Manual (SFC)

1 - 1

ABOUT THIS MANUAL

1.2 Abbreviations and Generic Terms Used in this Manual

The following abbreviations and generic terms are used in this manual.

(1) QnACPU................................... Abbreviation for Q2ACPU, Q2ACPU-S1,

(2) Network module......................... Abbreviation of AJ71QLP21(G), AJ71QLP21S,

(3) Ethernet module......................... Abbreviation of AJ71QE71N-B2 and

(4) Serial communication module.... Abbreviation of AJ71QC24 (N), AJ71QC24 (N)-

Q3ACPU, and Q4ACPU type CPU modules.

AJ71QLR21, AJ72QLP25 (G), AJ71QBR11, AJ72QBR15 and AJ72QLR25 type MELSECNET/10 network modules.

AJ71QE71N-B5T type Ethernet interface modules.

R2 type serial communication module.

(5) CC-Link..................................... Abbreviation of Control & Communication Link

(6) GPP function.............................

(7) Personal computer..................... IBM's PC/AT or completely compatible

(8) Peripheral device capable .........

of GPP functions

(9) Q6PU......................................... Abbreviation for Q6PU programming unit.

(10) Peripheral device........................ Generic term for a device that is connected to a

(11) Built-in RAM............................... A RAM incorporated in the QnA CPU that stores

(12) Memory card..............................

(13) ACPU......................................... Generic term for a MELSEC-A series

Abbreviations for the SW IVD-GPPQ type GPP function software package, GX Developer.

computers.

Generic term for a peripheral device capable of running the GPP function software, for example an IBM PC/AT.

QnACPU and can be used to operate it, for example a IBM-PC/AT-compatible personal computer or Q6PU.

sequence programs and other data.

Abbreviation for Q1MEM- type memory card

programmable controller

1 - 2

OVERVIEW

2 OVERVIEW

2.1 Features

QnACPU has the following features.

(1) Large memory capacity

(a) Q4ACPU has a program capacity of 124k steps, which means that 124k steps

can be used for a single program (Q2ACPU: 28k steps, Q2ACPU-S1: 60k steps, Q3ACPU: 92k steps).

(b) The device memory capacity is 32k words and the user can change the number

of points as required. For example, the default number of points for internal relays (M) is 8k points, but this can be expanded up to 32k points.

Memory cards are used to store programs, comments, statements, and file registers. (Programs can be stored in the CPU module itself, so a memory card is not essential to run a CPU module.)

(2) High-speed processing

(a) Higher operation processing speeds have been achieved for basic instructions

and application instructions.

A4UCPU Q4ACPU Basic instruction Application instruction

(b) The access time for expansion data memory (file registers: R) has been

conformed with the internal devices of the QnACPU (data registers: D, and link registers: W).

QnA (serial communication modules) have been realised processing speed-up by six times compared to AnUCPU. (The processing speed of the existing special function modules for ACPU use is about the same as that when using AnUCPU.)

(d) A high-speed access base unit (A38HB/A38HBEU) is available to speed up the

processing time for accessing special function modules such as network modules and serial communication modules that handle large quantities of data. Simply by mounting the special function module on the high-speed access base unit, the access processing speed is increased when the QnACPU accesses the special function module.

0.15 s 0.075 s

0.90 s 0.225 s

2 - 1

2. OVERVIEW

(3) Selection of program execution type that is appropriate for the control has been

realised. There are four program execution types to be selected as follows. (a) Initial execution type

This program type is executed once only when the QnACPU is set to RUN.

(b) Scan execution type

This program type is run continually while the QnACPU is in the RUN status. This is equivalent to a conventional program that runs from step 0 to END instruction. It is possible to create subroutine programs and interrupt programs for this type of program.

This is a program type which is executed only during the surplus constant scan time (process to preset the program execution time for constant scan time) or during the set execution time of the low-speed execution program.

(d) Stand-by type

This type of program consists entirely of a subroutine program or interrupt program.

(4) The SFC language MELSAP3 has been supplied.

With enhancement of step attributes and SFC control instructions, MELSAP3 makes SFC programming even easier.

(5) A software development environment that improves program productivity has been

realized. (a) In order to enable the design of structured programs, a file format has been

adopted for programs. What would conventionally have been a single continuous program can now be handled in a structured way as a number of files. This allows for design work to be shared by several designers, and allows management of programs in accordance with functions, processes, or designers, etc.

2 - 2

2. OVERVIEW

(b) The user can standardize and simplify programs by creating and using macro

instructions corresponding to functions.

1) Word device bit operations are possible.

2) Differential contacts can be used.

3) Buffer memories of special function modules can be accessed directly from a program as devices.

4) The link data of network modules can be accessed directly from a program as devices.

(d) Ease of operation for GPP function program editing has been improved.

1) Up to four programs, data, etc., can be edited simultaneously. Programs and data can be cut and pasted between edited objects.

2) Ladder editing is possible while the ladder is displayed with comments.

3) Familiar operations can be performed with pull-down menus and dialog boxes.

(e) The debugging function at start-up has been perfected.

1) Ladder modification while performing monitoring is possible.

2) Coil ON/OFF causes can be searched for.

3) The timing for monitoring can be set using a step number or device status, allowing debugging to be conducted under the optimum conditions.

4) Devices for which index qualifications have been set can be monitored.

(f) The GPP function document creation function has been strengthened.

1) Since comments can now comprise 32 characters, they can be more detailed than before.

2) Comments can now be set for all devices.

3) The statements and notes appended to programs can now be managed as an integral part of the program, which makes program modifications and utilization easier.

4) Printout data can be saved in a file.

2 - 3

2. OVERVIEW

(g) A powerful array of support software packages is available for program creation.

1) Data conversion package Comment data, device data, etc., which is created with spreadsheet software and text editors available on the market, can be converted to files for GPP function use. Conversely, files created for GPP function use can be converted to data for spreadsheets or text editors.

2) Macro/library package The basic programs for accessing special function modules, and standard programs for error detection, alarm processing, etc., have been brought together as a package of macro and library data.

3) Ladder sequence linking package This package is used to link multiple programs to make a single program. This has an automatic allocation function that ensures that devices from each program without duplicating in the created program.

4) CAD interface program This package is used to handle sequence ladders, instruction lists, comment data and SFC diagrams as CAD data and communicate these data to CAD systems.

2 - 4

OVERVIEW

2.2 Additional Functions of QnACPU

New functions and instructions for special function module are added to the QnACPU. [Additional functions]

Variety of local devices.................................................. Refer to Section 2.2.1 (1).

Monitor test of local device.................................. Refer to Section 8.2.2.

Use of local device at the subroutine/interrupt

program storage destination................................. Refer to Appendix 7.

Auto refresh setting of CC-Link...................................... Refer to Section 2.2.1 (2),

MELSECNET/10 relay communication from the

Ethernet module (Network relay).................................... Refer to Section 2.2.1 (3),

Addition of AJ71QC24N-compatible commands ............Section 2.2.1 (4)

Section 7.2.

Appendix 8.

[Added instructions for special function module] The following instructions have been added for function version "B'' of the QnACPU:

AJ61QBT11 control instructions...................................... 13

AD75 control instructions................................................ 19

AJ71D -R4 control instructions.....................................

AJ71QE71 control instructions........................................ 10

Additional function/special function module instructions can be used for the QnACPU described function version B in the date column of the rating plate. Check that function version B is described on the QnACPU rating plate before using the additional function/special function module instructions. If your QnACPU does not have indication of function version B, skip this item and the description of additional functions.

When using additional function/special function module instructions of the QnACPU, it is necessary to match the GPP function model and the function version/version of the applicable special function module. (Refer to Table 2.1.)

2 - 5

2. OVERVIEW

Table 2.1 List of combination between QnACPU and function version/version of special function module

SW0IVD-

Module/package Name QnACPU

Function version

Condition

Version –

Local device monitor test

Local device switching of subroutine/interrupt program

Auto refresh function of CC-Link – – – –

AJ61QBT11 control instructions – – – –

MELSECNET/10 relay communication from Ethernet

AJ71QE71 control instructions – – – –

AD75 control instructions – – – –

ID interface module instructions – – – –

9707B and

later

GPPQ

SW1IVD-

GPPQ

––

restriction

SW2IVD-

GPPQ

restriction

– –––––

AJ71QE71

(B2), (B5)

9707B and

later

–

–––––

AD75P-S3

––

restriction

––––

AJ71

ID -R4

BC and later –

AJ61QBT11

9707B and

later

AJ71QC24

(N)(R2)

restriction

–

Compatibility with AJ71QC24N commands

REMARK

–––––

1) Marks , –, and in Table 2.1 indicate as follows:

Essential for use of function and instruction

– :

Irrelevant to function and instruction

Required in the case of access to the QnACPU in other stations from the peripheral device via Ethernet

Not available on peripheral devices.

2) GX Developer complies with functions of function version B.

2 - 6

OVERVIEW

2.2.1 Overview of added functions

This section shows an overview of the added functions.

(1) Variety of local device

(a) The device set as the local device at "Device" in Parameter can be monitored

and tested with a peripheral device. This function allows checking and debug of the local device in the program monitored with a peripheral device.

(b) The local device of the file where the subroutine program/interrupt program is

stored has made it possible to be used during execution of the subroutine program/interrupt program. For this function, even if an operation using the local device of the subroutine program is carried out, the original local device cannot be overwritten. In addition, even if an operation using the local device of the interrupt program, the local device which is executed before starting up the interrupt program cannot be overwritten.

monitor test of the local device:

• Personal computer GX Developer, SW2IVD-GPPQ type GPP function software package

(2) Auto refresh setting of CC-Link

(a) When setting auto refresh of the CC-Link on the peripheral function, cyclic

communication with other stations connected to the CC-Link can be automatically performed according to the set auto refresh data.

• Remote I/O station (Communication in ON/OFF data)

• Remote device station (Communication in ON/OFF data and Word data)

• Intelligent device station (Communication in ON/OFF data and Word data)

• Local station/master station (Communication in ON/OFF data and Word data)

The auto refresh setting of the CC-Link allows communication with other stations using the FROM/TO instruction without communicating with the master station of the CC-Link.

(b) Auto refresh is available for up to 8 CC-Link modules for each unit of QnACPU.

Communication for 9th CC-Link module and more can be performed with the CC-Link module using the FROM/TO instruction.

refresh setting of the CC-Link:

• Personal computer: GX Developer, SW2IVD-GPPQ type GPP function software package

It is necessary to upgrade the master station local station module of CC-Link to function version B or later.

2 - 7

2. OVERVIEW

(3) Netwotk relay from Ethernet module

(a) In the network system with mixture of Ethernet and MELSECNET/10, data can

be communicated with the QnACPU of other stations via multiple Ethernets or MELSECNET/10 modules.

(b) For the network relay from the Ethernet module, the function version of the

Ethernet module should be upgraded to "B" or later.

(4) AJ71QC24N-compatible commands are possible.

(a) The following AJ71QC24N commands are available:

• Multiple blocks batch read: Command "0406"

• Multiple blocks batch write: Command "1406"

(b) Multiple blocks batch read/batch write is available with AJ71QC24N (-R2, R4).

Multiple blocks batch read/batch write is not available with AJ71QC24 (-R2, R4). For commands of multiple blocks batch read/batch write, refer to the following manual:

• Corresponding Additional Explanation for AJ71QC24N (-R2/R4)

2 - 8

SYSTEM CONFIGURATION

3 SYSTEM CONFIGURATION

This section describes the system configurations that can be used for a system centered on a QnACPU, cautions on configuring the system, and the system equipment.

3.1 System Configuration

The following shows the configuration of equipment and peripheral device when a QnACPU is used in a stand-alone system.

3.1.1 Equipment configuration in a stand-alone system

POINT

*1 Up to two memory cards can be installed, if required.

SRAM and E CPU module.

*2 When using an A5 B extension base unit, pay particular attention to the

power supply capacity of the main base unit. In the case of I/O modules and the special function module with a high internal current consumption,

mounting on an A6 B extension base unit is recommended. (Refer to Section 16.1 and Section 17.3 for details.)

PROM memory cards allow file read/write when mounted on the

3 - 1

SYSTEM CONFIGURATION

3.1.2 Configuration of peripheral devices capable of QnACPU

(To RS-422 interface)

QnACPU

AC30R4-PUS cable

AC20R4-A8PU cable

RS-422 cable

Q6PU

programming unit

RS-422 RS-232C convertor

IBM-PC/AT-compatible

software package used:

RS-232C cable

AJ71QC24 serial

communication module

(Mounted to the base unit)

(To RS-422 interface/RS-232C)

(To option board slot)

Option board

RS-232C cable

Dedicated cable

IBM-PC/AT-compatible

software package used:

IC memory card

reader/writer

*1 For details on the IC memory card reader/writer setting, refer to Operating Manual for the

peripheral device capable of GPP functions.

*2 For connection to RS-422 interface, use the RS-422 RS-232C converter. *3 When connecting the serial communication module and the peripheral devices capable of

GPP function, see User's Manual of the serial communication modules.

REMARK

1. For details on the system configuration for each peripheral device, refer to the Operating Manual for each.

2. QnACPU can connect a peripheral device capable of ACPU only when accessing an ACPU in another station via a MELSECNET/10 or MELSECNET data link. (However, QnACPU cannot be accessed. ) In this case, set SW2 of system setting switch 2 on the CPU module ON.

3 - 2

SYSTEM CONFIGURATION

3.2 System Configuration Overview

(a) Q2ACPU system

System configuration

Maximum number of extension stages

Maximum number of I/O modules

Maximum number of I/O points

Main base unit model name

Extension base unit model name

Extension cable model name

Precautions

I/O number assignment

* An example when the 16-point module is installed to each slot is shown.

3rd extension stage

32 modules

512 points

A32B, A32B-S1, A35B, A38B, A38HB, A38HBEU

A62B, A65B, A68B, A52B, A55B, A58B

AC06B, AC12B, AC30B

(1) It is not possible to connect an extension base unit to an A32B main base unit. For an extension base, use A32B-S1. (2) When using the extension base unit A52B, A55B, A58B, 5VDC is supplied from the power supply module of the main

base unit. Before use, refer to Section 17.3 and examine if it can be used. (3) The overall distance of the extension cable must be 6.6m (21.65ft.) or shorter. (4) When using the extension cable, do not tie it with the main circuit cables, which has high voltage, large current, or install

them close to each other.

(1) I/O numbers are allocated in accordance with the order of the numbers set for the extension base stages, regardless of

the order in which the extension cables are connected. (2) Assign I/O numbers as if both main base unit and extension base unit have 8 slots each.

Consequently, allocations of 16 points per slot are made for the parts of the system configuration drawing indicated with

dotted lines. (3) 16 points are assigned to an empty slot. (4) Extension stage numbers do not need to be sequential, but any extension stage omitted from the system will occupy 8

(slots) 16 I/O points. (5) With regard to items (2) to (4) above, the I/O allocations can be changed by setting I/O allocations in the

parameters.(Refer to Section 5.3)

3 - 3

3. SYSTEM CONFIGURATION

(b) Q2ACPU-S1 system

Extension cable

1st extension

stage

2nd extension

stage

System configuration

3rd extension

stage

4th extension

stage

Main base unit (A38B)

14F

1B0

1BF

230

23F

3F 4F

(21)(22)

150140

160

16F

15F

1C0

1D0

1DF

1CF

250

240

25F

24F

to to to to to to to to

Power supply

module

A58B extension base unit

to to to to to to to to

A55B extension base unit

130

120

100

110

to to to to to to to to

11F10F

13F

12F

A68B extension base unit

180

1A0

190

to to to to to to to to

1AF

18F

19F

Power supply

module

220

210

200

to to to to to to to to

22F

21F

20F

Power supply

module

(23)

170

17F

1E0

1EF

260

26F

60 70

1F0

1FF

270

27F

Slot No.

* An example when the 16-point module is installed to each slot is shown.

5th extension

stage

6th extension

stage

7th extension

stage

A65B extension base unit

2A0

2AF

320

32F

3A0

3AF

(45)(46)

2D0

2B0

2C0

2DF

2BF

2CF

330

350

340

33F

35F

34F

3C0

3D0

3B0

3BF

3DF

3CF

280

290

to to to to to to to to

29F

28F

Power supply

module

300

310

to to to to to to to to

31F

30F

Power supply

module

380

390

to to to to to to to to

39F

38F

Power supply

module

(

2E0

2EF

(((

360

36F

3E0

3EF

(47)

(

2F0

2FF

370

37F

3F0

3FF

Maximum number of extension stages

Maximum number of I/O modules

Maximum number of I/O points

Main base unit model name

Extension base unit model name

Extension cable model name

Precautions

I/O number assignment

7th extension stage

64 modules

1024 points

A32B, A32B-S1, A35B, A38B, A38HB, A38HBEU

A62B, A65B, A68B, A52B, A55B, A58B

AC06B, AC12B, AC30B

(1) It is not possible to connect an extension base unit to an A32B main base unit. For an extension base, use A32B-S1. (2) When using extension base units A52B, A55B, A58B, 5VDC is supplied from the power supply module of the main base.

Before use, refer to Section 17.3 and examine if it can be used. (3) The overall distance of the extension cable must be 6.6m (21.65ft.) or shorter. (4) When using the extension cable, do not tie it with the main circuit cables, which has high voltage, large current, or install

them close to each other.

(1) I/O numbers are allocated in accordance with the order of the numbers set for the extension base stages, regardless of

the order in which the extension cables are connected. (2) Assign I/O numbers as if both main base unit and extension base unit have 8 slots each.

Consequently, allocations of 16 points per slot are made for the parts of the system configuration drawing indicated with

dotted lines. (3) 16 points are assigned to an empty slot. (4) Extension stage numbers do not need to be sequential, but any extension stage omitted from the system will occupy 8

(slots) 16 I/O points. (5) With regard to items (2) to (4) above, the I/O allocations can be changed by setting I/O allocations in the

parameters.(Refer to Section 5.3)

3 - 4

3. SYSTEM CONFIGURATION

Extension cable

1st extension

stage

2nd extension

stage

System configuration

3rd extension

stage

4th extension

stage

Main base unit (A38B)

to to to to to to to to

Power supply

module

A58B extension base unit

to to to to to to to to

A55B extension base unit

130

120

100

110

to to to to to to to to

11F10F

13F

12F

A68B extension base unit

180

1A0

190

to to to to to to to to

1AF

18F

19F

Power supply

module

220

210

200

to to to to to to to to

22F

21F

20F

Power supply

module

3F 4F

(21)(22)

160

150140

14F

16F

15F

1B0

1C0

1D0

1BF

1DF

1CF

250

230

240

23F

25F

24F

(23)

170

17F

1E0

1EF

260

26F

60 70

1F0

1FF

270

27F

Slot No.

* An example when the 16-point module is installed to each slot is shown.

5th extension

stage

6th extension

stage

7th extension

stage

A65B extension base unit

2A0

2AF

320

32F

3A0

3AF

(45)(46)

2B0

2C0

2D0

2BF

2CF

2DF

330

350

340

33F

35F

34F

3C0

3D0

3B0

3BF

3DF

3CF

280

290

to to to to to to to to

29F

28F

Power supply

module

300

310

to to to to to to to to

31F

30F

Power supply

module

380

390

to to to to to to to to

39F

38F

Power supply

module

(

2E0

2EF

(((

360

36F

3E0

3EF

(47)

2F0

2FF

370

37F

3F0

3FF

(

Maximum number of extension stages

Maximum number of I/O modules

Maximum number of I/O points

Main base unit model name

Extension base unit model name

Extension cable model name

Precautions

I/O number assignment

7th extension stage

64 modules

Q3A 2048 points/Q4A 4096 points

A32B, A35B, A38B, A38HB, A38HBEU

A62B, A65B, A68B, A52B, A55B, A58B

AC06B, AC12B, AC30B

(1) It is not possible to connect an extension base unit to an A32B main base unit. For an extension base, use A32B-S1. (2) When extension base unit A52B, A55B, A58B is used, 5VDC power supply is supplied from the power supply module of

the main base. Before use, refer to Section 17.3 and examine if it can be used. (3) The overall distance of the extension cable must be 6.6m (21.65ft.) or shorter. (4) When using the extension cable, do not tie it with the main circuit cables, which has high voltage, large current, or install

them close to each other.

(1) I/O numbers are allocated in accordance with the order of the numbers set for the extension base stages, regardless of

the order in which the extension cables are connected. (2) Assign I/O numbers as if both main base unit and extension base unit have 8 slots each.

Consequently, allocations of 16 points per slot are made for the parts of the system configuration drawing indicated with

dotted lines. (3) 16 points are assigned to an empty slot. (4) Extension stage numbers do not need to be sequential, but any extension stage omitted from the system will occupy 8

(slots) 16 I/O points. (5) With regard to items (2) to (4) above, the I/O assignment can be changed by setting I/O assignments in the

parameters.(Refer to Section 5.3)

3 - 5

SYSTEM CONFIGURATION

3.3 System Equipment

3.3.1 System equipment list

The following shows the system equipment (modules and peripheral devices) that can be used in a QnACPU system.

(1) For QnA module

Product Name Model Name Description

Number of I/O points: 512, built-in RAM: 28k steps

Number of I/O points: 1024, built-in RAM: 60k steps

Number of I/O points: 2048, built-in RAM: 92k steps

Number of I/O points: 4096, built-in RAM: 124k steps

SRAM, 32k bytes, E

PROM, 32k bytes

CPU module

Memory card

Q2ACPU

Q2ACPU-S1

Q3ACPU

Q4ACPU

Q1MEM-64S SRAM, 64k bytes

Q1MEM-128S SRAM, 128k bytes

Q1MEM-256S SRAM, 256k bytes

Q1MEM-512S SRAM, 512k bytes

Q1MEM-1MS SRAM, 1M bytes

Q1MEM-2MS SRAM, 2M bytes

Q1MEM-64SE

Number of Occupied

Points (points) [I/O Allocation

Module Type]

–

–––

Current Consumption

5VDC(A) 24VDC(A)

0.4 –

0.9 –

Remark

Memory card procured separately. Including memory card current consumption.

For use with QnACPU only

Q1MEM-128SE

Q1MEM-256SE

Q1MEM-512SE

Q1MEM-1MSE

SRAM, 64k bytes, E2PROM, 64k bytes

SRAM, 128k bytes, E2PROM, 128k bytes

SRAM, 256k bytes, E2PROM, 256k bytes

SRAM, 512k bytes, E2PROM, 512k bytes

3 - 6

3. SYSTEM CONFIGURATION

Product Name Model Name Description

AX10 16-input 100VAC input module 16 (16 inputs) 0.055 –

AX11 32-input 100VAC input module 32 (32 inputs) 0.11 –

AX11EU 32-input 100VAC input module CE-compliant 32 (32 inputs) 0.15 –

AX20 16-input 200VAC input module 16 (16 inputs) 0.055 –

AX21 32-input 200VAC input module 32 (32 inputs) 0.11 –

AX21EU 32-point 200VAC input module CE-compliant 32 (32 inputs) 0.15 –

AX31 32-input 12/24VAC/DC input module 32 (32 inputs) 0.11 –

AX31-S1 32-input 24VDC input module 32 (32 inputs) 0.11 –

AX40 16-input 12/24VDC input module 16 (16 inputs) 0.055 –

AX41 32-point 12/24VDC input module 32 (32 inputs) 0.11 –

AX41-S1 32-point 12/24VDC input module 32 (32 inputs) 0.11 –

AX42 64-input 12/24VDC input module 64 (64 inputs) 0.12 –

AX50 16-input 48VDC sink input module 16 (16 inputs) 0.055 –

Number of Occupied

Points (points) [I/O Allocation

Module Type]

Current Consumption

Remark

5VDC(A) 24VDC(A)

Input module

AX50-S1 16-input 48VDC sink/source input module 16 (16 inputs) 0.055 –

AX60

AX60-S1

AX70 16-input input module for sensor 16 (16 inputs) 0.055 –

AX71 32-input input module for sensor 32 (32 inputs) 0.11 –

AX80 16-input 12/24VDC source input module 16 (16 inputs) 0.055 –

AX80E 16-input 12/24VDC source input module 16 (16 inputs) 0.055 –

AX81 32-input 12/24VDC source input module 32 (32 inputs) 0.11 –

AX81-S1 32-input 12/24VDC source input module 32 (32 inputs) 0.105 –

AX81-S2 32-input 48/60VDC source input module 32 (32 inputs) 0.11 –

AX81-S3 32-input 12/24VDC source input module 32 (32 inputs) 0.11 –

AX81B 32-input 24VDC sink/source input module 64 (64 inputs) 0.125 –

AX82 64-point 12/24VDC source input module 64 (64 inputs) 0.12 –

16-input 100/110/125VDC sink input module

16-input 100/110/125VDC sink/source input module

16 (16 inputs) 0.055 –

3 - 7

3. SYSTEM CONFIGURATION

Product Name Model Name Description

AY10 16-output relay contact output module (2A) 16 (16 outputs) 0.115 0.15

AY1 0A

AY11

AY11 A

AY11 AE U

AY11 E

AY11 EE U

AY13 32-point relay contact output module (2A) 32 (32 outputs) 0.23 0.29

AY13E 32-point relay contact output module 32 (32 outputs) 0.23 0.29

AY1 3E U

Output module

AY1 5E U

AY2 2

AY2 3

AY4 0

AY4 0A

AY4 1

AY4 2

16-output relay contact output module, for independent contact output

16-output relay contact output module, with surge suppressor

16-output relay contact output module, for independent contact output, with surge suppressor

16-output relay contact output module (fused)

32-output relay contact output module (fused)

24-point relay contact output module (2A) CE-compliant

16-point triac output module (2A, fused)

32-point triac output module (0.6A, fused)

16-output 12/24VDC transistor output module (0.1A)

16-point 12/24VDC transistor output module, for independent contact output (0.3A)

32-output 12/24VDC transistor output module (0.1A)

64-output 12/24VDC transistor output module (0.1A)

Number of Occupied

Points (points) [I/O Allocation

Module Type]

16 (16 outputs) 0.115 0.15

32 (32 outputs) 0.23 0.29

32 (32 outputs) 0.15 0.22

16 (16 outputs) 0.305 –

32 (32 outputs) 0.59 –

16 (16 outputs) 0.115 0.016

16 (16 outputs) 0.19 –

32 (32 outputs) 0.23 0.04

64 (64 outputs) 0.29 0.08

Current Consumption

5VDC(A) 24VDC(A)

Remark

The short protection and overheat protection functions of the AY4 0 P, AY 4 1 P, AY6 0E P, AY8 0E P, AY81EP, and AY82EP are described below:

Short protection

function

Function that protects the transistors from overcurrents occurring, for example, due to short circuits in external wiring.

Overheat

protection

function

Function that protects the transistors from damage due to external temperature rise attributable to external causes.

AY4 2- S1

AY4 2- S3

AY4 2- S4

64-output 12/24VDC transistor output module (0.1A)

64-output 12/24 VDC transistor output module (fused)

64-output 12/24VDC transistor output module, zener diode with built-in photocoupler

3 - 8

64 (64 outputs) 0.29 0.08

64 (64 outputs) 0.50 –

3. SYSTEM CONFIGURATION

Product Name Model Name Description

16-point 12/24VDC transistor output module (0.5A, fused)

32-output 12/24VDC transistor output module (0.5A)

32-point 12/24VDC transistor output module (0.3A, fused)

16-output 12/24/48VDC transistor output module (2A, fused)

16-output 12/24/48VDC transistor output module (2A)

16-output 12/24 VDC transistor output module

(2A), with short protection function and overheat protection function

16-output, CMOS (5/12VDC) output module (16mA)

32-output, CMOS (5/12VDC) output module (16mA)

64-output, CMOS (5/12VDC) output module (16mA)

16-output 12/24/48VDC transistor output module (0.5A, fused)

32-output 12/24VDC transistor output module (0.5A)

Output module

AY5 0

AY5 1

AY5 1- S1

AY6 0

AY6 0S

AY60EP

AY7 0

AY7 1

AY7 2

AY8 0

AY8 1

Number of Occupied

Points (points) [I/O Allocation

Module Type]

16 (16 outputs) 0.115 0.13

32 (32 outputs) 0.23 0.10

32 (32 outputs) 0.31 0.02

16 (16 outputs) 0.115 0.13

16 (16 outputs) 0.075 0.006

16 (16 outputs) 0.115 0.22

16 (16 outputs) 0.10

32 (32 outputs) 0.20

64 (64 outputs) 0.30

16 (16 outputs) 0.115 0.12

32 (32 outputs) 0.23 0.10

Current Consumption

5VDC(A) 24VDC(A)

12VDC

0.11

12VDC

0.20

12VDC

0.60

Remark

*1: Indicates a source load module. Other modules are sink load modules.

The short protection and overheat protection functions of the AY4 0 P, AY 4 1 P, AY6 0E P, AY8 0E P, AY81EP, and AY82EP are described below:

Short protection

function

Function that protects the transistors from overcurrents occurring, for example, due to short circuits in external wiring.

Dynamic input/ output combination module

Input/output combination module

64-output 12/24VDC transistor output module

AY82EP

A42XY 64 inputs, 64 outputs, dynamic scanning mode 64 (64 outputs) 0.11 0.235

AH42

(0.1A), with short protection function and overheat protection function

32 inputs, 32 outputs, 12/24VDC transistor output module (0.1A)

64 (64 outputs) 0.29 0.10

64 (64 outputs) 0.245 0.04

3 - 9

Overheat protection

function

Function that protects the transistors from damage due to external temperature rise attributable to external causes.

Performs I/O processing in 8point units independently of the CPU module, while scanning.

The first half 32 points are inputs and the second half 32 points are outputs.

3. SYSTEM CONFIGURATION

Product Name Model Name Description

1-axis positioning control, speed control

1-axis positioning module

Positioning module

Special function module

AD70

AD70D-S2 1-axis, digital output, for MR-SB(K)/SD 32 (special 32 points) 0.8 –

AD72

AD75P1-S3

AD75P2-S3 0.7

AD75P3-S3

AD75M1

AD75M2

AD75M3

and speed-positioning control, analog voltage output for speed-positioning control (0 to 10V)

For positioning control analog voltage output for speed-positioning control (0 to 10V) 2-axis (independent control, simultaneous 2axis control, linear interpolation control).

For positioning control, pulse output P1: 1 axis P2: 2 axes (Independent, simultaneous 2

axes, linear interpolation, circular interpolation)

P3: 3 axes (Independent, simultaneous 3

axes, linear interpolation 2 axes, circular interpolation 2 axes)

Digital output for positioning control, for MR-HB/MR-JB/ MR-J2-B P1: 1 axis P2: 2 axes (Independent, simultaneous 2

axes, linear interpolation, circular interpolation)

P3: 3 axes (Independent, simultaneous 3

axes, linear interpolation 2 axes, circular interpolation 2 axes)

Number of Occupied

Points (points) [I/O Allocation

Module Type]

32 (special 32 points) 0.3 –

First half: empty 16 points Second half:

special 32 points

32 (special 32 points)

32 (special 32 points) 0.7 –

Current Consumption

5VDC(A) 24VDC(A)

0.9 –

0.7

–

Remark

* When differential driver is connected: 0.78

Positioning detection module

Ultrasonic linear scale module

Absolute detection method.

A61LS

A62LS-S5

A63LS 32 (special 32 points) 0.9 –

A64BTL

Resolution: One resolver revolution = 4096 divisions. Response speed: within 6ms

Absolute detection method, multiple rotation type, linear type

Resolution: 4096 divisions 32 rotations to

409.6 divisions 320 rotations

Response speed: 2ms, 8 channels

Absolute detection method, multiple rotation type

Resolution: 4096 divisions 32 rotations to

409.6 divisions 320 rotations

Response speed: 2ms, 8 channels

Measuring range: 0.000 to 3,550,000 mm Resolution: 0.025mm, 4 channels

First half:

special 32 points

Second half:

empty 16 points

First half: empty 16 points Second half:

special 32 points

32 (special 32 points) 1.05 –

0.8 –

1.5 –

The resolution depends on the connected resolver.

When setting module is connected: 5VDC current consumption:

1.35A

3 - 10

3. SYSTEM CONFIGURATION

Product Name Model Name Description

24-bit binary, 1/2 phase input,

High-speed counter module

A/D converter module

Special function module

AD61

AD61S1

A68AD

A68AD-S2

A68ADN

A616AD

A60MX

A60MXR

A60MXRN

A616TD

reversible counter, 50kPPS, 2 channels

24-bit binary, 1/2 phase input, reversible counter, 1 phase 10kPPS, 2 phases 7kPPS, 2 channels

4 to 20mA/0 to 10V, Analog input, 8 channels

0 to 20mA/0 to 10V, Analog input, 8 channels

4 to 20mA/0 to 10V, Analog input, 16 channels Expansion to maximum of 121 channels possible by using A60MX(R)

Multiplex module (IC relay) Analog input, 16 channels

Multiplex module (mercury relay) Analog input, 16 channels

Multiplex module (photo MOS relay) Analog input, 16 channels

For temperature detection by thermocouple (when connected to A60MXT).

0 to 10V/0 to 20mA (when connected to A60MX(R))

Number of Occupied

Points (points) [I/O Allocation

Module Type]

32 (special 32 points) 0.3 –

32 (special 32 points) 0.9 –

32 (special 32 points) 0.4 –

32 (special 32 points) 1.0 –

16 (empty 16 points) 0.65 –

16 (empty 16 points) 0.5 –

16 (empty 16 points) 0.35 –

32 (special 32 points) 1.0 –

Current Consumption

5VDC(A) 24VDC(A)

Remark

Used in combination with A616AD or A616TD.

Temperature digital converter module

A60MXT

A60MXTN

A68RD3

A68RD4

Multiplex module (mercury relay) Temperature input: 15 channels. Temperature detection by thermocouple when used in combination with A616TD.

Multiplex module (photo MOS relay) Temperature input: 15 channels. Temperature detection by thermocouple when used in combination with A616TD.

-180 to 600 temperature input module (For 3-wire type platinum resistor)

-180 to 600 temperature input module (For 4-wire type platinum resistor)

First half: empty 16 points

Second half: empty 16 points

First half: empty 16 points

Second half: empty 16 points

32 (special 32 points)

0.8 –

Used in combination with A616TD.

0.64 –

0.94 –

0.75 –

3 - 11

3. SYSTEM CONFIGURATION

Product Name Model Name Description

A68DAV

0 to 10V, analog output, 8 channels.

A68DAI-S1 0 to 20mA, analog output, 8 channels. 32 (special 32 points) 0.15 0.4

4 to 20mA/0 to 10V Analog output 12 bits, 2 channels

4 to 20mA/0 to 10V Analog output, 2 channels

D/A converter

A62DA

A62DA-S1

module

4 to 20mA. Resolution: 1/4000 Analog output, 16 channels

0 to 10 V/0 to 5 V. Resolution: 1/4000 Analog output, 16 channels

32k byte-memory battery backup Can be connected to printer conforming to Centronics standards

Special function module

Memory card, Centronics interface module

A616DAI

A616DAV

AD59

AD59-S1

Number of Occupied

Current Consumption Points (points) [I/O Allocation

Module Type]

5VDC(A) 24VDC(A)

32 (special 32 points) 0.15 0.5

32 (special 32 points) 0.6 0.35

32 (special 32 points) 0.3 –

32 (special 32 points) 0.38 –

0.3

32 (special 32 points)

–

0.32

Remark

15VDC (A68P)

+0.53A

-0.125A

required.

15VDC (A68P)

+0.2A

-0.17A

required.

0.35A when connected to AD59MEF.

Voice output module

Network module

Messages can be recorded and played back on a maximum of 60 channels.

A11VC

The following recording times can be selected for each channel: 1 second, 2 seconds,

16 (special 16 points) 0.6 0.38

4 seconds, 8 seconds. The total recording time is 64 seconds

AJ71QLP21

For MELSECNET/10 optical loop networks (compatible with SI cable)

32 (special 32 points) 0.65 –

AJ71QLP21G

AJ71QLP21S

AJ71QBR11 For MELSECNET/10 coaxial bus networks

For MELSECNET/10 optical loop network (compatible with GI cable)

For MELSECNET/10 optical loop networks. Network backup by external power supply

32 (special 32 points) 0.65 0.2

0.8

32 (special 32 points)

AJ71QLR21 For MELSECNET/10 coaxial loop network 1.14

AJ72QLP25

For MELSECNET/10 optical loop network remote I/O stations (compatible with SI cable)

–0.8–

AJ72QLP25G

AJ72QBR15

For MELSECNET/10 optical loop network remote I/O station (compatible with GI cable)

For MELSECNET/10 coaxial bus network remote I/O stations

0.9

–

AJ72QLR25

For MELSECNET/10 coaxial loop network remote I/O station

1.3

–

• For Use with QnACPU Only

• Maximum 4 modules can be used for one CPU module. (Refer to Section 3.3.2 )

3 - 12

3. SYSTEM CONFIGURATION

Product Name Model Name Description

For MELSECNET II optical data links

For MELSECNET II optical data link (compatible with GI cable)

For MELSECNET II coaxial data links 32 (special 32 points) 0.9 –

For MELSECNET/B data links 32 (special 32 points) 0.72 –

For MESLECNET optical data link remote I/O station

For MESLECNET optical data link remote I/O station (compatible with GI cable)

For MESLECNET coaxial data link remote I/O station

For MELSECNET/B data link remote I/O stations

Data link module

AJ71AP21

AJ71AP21-S3

AJ71AR21

AJ71AT21B

AJ72P25

AJ72P25-S3

AJ72R25

AJ72T25B

Link module that communicates data

AJ71QC24N

with a computer. Transmission speed: 300bps to 19.2kbps RS-232, RS-422/485: one channel each

Number of Occupied

Current Consumption Points (points) [I/O Allocation

Module Type]

5VDC(A) 24VDC(A)

32 (special 32 points) 0.5 –

–0.23–

–2.6–

–0.3–

32 (special 32 points) 0.3 –

Remark

Maximum 2 modules can be used for one CPU module. (Refer to Section 3.3.2 )

Serial communications module

Ethernet interface module

Link module that communicates data AJ71QC24 N-R2

with a computer.

Transmission speed: 300bps to 19.2kbps

RS-232C: 2 channels

Link module that communicates data AJ71QC24 N-R4

with a computer.

Transmission speed: 300bps to 19.2kbps

RS-422: 2 channels

AJ71QE71-B2

10BASE2 specification Transmission speed:

10Mbps

AJ71QE71N-B510BASE5 specification Transmission speed:

10 Mbps

AJ71QE71N3-T10BASE-T specification Transmission speed:

10Mbps

AJ71E71N-B2

AJ71E71N-B5

AJ71E71N3-T

10BASE2 specification, Transmission speed:

10 Mbps

10BASE5 specification, Transmission speed:

10Mbps

10BASE-T specification Transmission speed:

10Mbps

32 (special 32 points) 0.2 –

32 (special 32 points) 0.38 –

0.56

0.40

0.53

32 (special 32 points)

0.67

0.55

0.69

–

• For use with QnACPU only

• Maximum 4 modules can be used for one CPU module. (Refer to Section 3.3.2 )

3 - 13

3. SYSTEM CONFIGURATION

Product Name Model Name Description

Link module that communicates data with a

Computer link module

Intelligent communication module

Host controller high-speed link module

Multidrop data link module

AJ71UC24

AD51H-S3

AJ71C23-S3

AJ71C22-S1

A0J2C25

computer.

Transmission speed: 300bps to 19.2kbps RS-232C, RS-422: one channel each, compatible with RS485

AD51H-BASIC, maximum of 8 tasks executes data communication with a PLC or a computer, and monitoring control status. Data communication with a computer can be executed by any format. RS-232C: 2 channels, RS-422, Parallel: one channel each

Link module that sends/receives data at high speed to/from a computer.

Transmission speed: 500kbps RS-422: one channel each

Sends and receives bit data to maximum 8 slave stations to which it is connected in a multidrop system. Used for the master station of a multidrop link. Transmission speed: 38.4kbps RS-422: one channel each

Used for a remote I/O station of a multidrop link.

Number of Occupied

Points (points) [I/O Allocation

Module Type]

32 (special 32 points) 0.3 –

First half: empty 16 points

Second half: special 32 points

32 (special 32 points) 1.5 –

32 (special 32 points) 1.4 –

–––

Current Consumption

5VDC(A) 24VDC(A)

1.0 –

Remark

Maximum 6 modules can be used for one CPU module.

CC-Link system master/local module

MELSECNET/ MINI-S3 data link module

B/NET interface module

Interrupt module

Used for a local station in a multidrop link.

A0J2C214(S1)

AJ61QBT11

AJ71PT32-S3

AJ71T32-S3

AJ71B62-S3

AI61

AI61-S1 Product for changing time to turn ON/OFF A61

In A0J2CPU and A0J2HCPU systems, A0J2C214 can also be used as the master station in computer links and multidrop data links

For CC-Link system master and local stations When used as the master station, the module controls maximum 64 remote I/O stations. When a local station is used, the module occupies 1 or 4 station(s).

For MELSECNET/MINI-S3 master stations (max. 64 stations). Performs remote I/O and remote terminal control of a total of 512 I/O points.

Used for B/NET transmission terminal control. Up to 63 stations can be controlled per module.

Used to designate execution of interrupt programs (16 interrupt inputs).

64 points 0.3 –

32 (special 32 points) 0.45 –

I/O dedicated mode 32 (special 32 points)

0.34 – Expanded mode 48 (special 48 points)

32 (special 32 points) 0.17 –

32 (special 32 points) 0.14 –

For use with QnACPU only

Only one module can be used per CPU.

3 - 14

3. SYSTEM CONFIGURATION

Product Name Model Name Description

Device Net interface module

PROFIBUS-DP interface module

PROFIBUSFMS interface module

MODBUS serial communication module

PLC easier monitoring module

Dummy module AG62

AJ71DN91

AJ71PB92D 32 (special 32 points) 0.54 –

AJ71PB96F

AJ71UC24-R2

AS91 PLC easier monitoring module 16 (16 outputs) 0.08 –

Device Net master module Total I/O points: 4096 points

PROFIBUS-DP master module Sendable data Regula r service: 32 byt es

Extension service: 244 bytes

PROFIBUS-FMS master/client/server module Total I/O points: 241241 points

MODBUS serial communication module Transmission speed: 300bps to 19200bps

Module allows selection of 16, 32, 48, or 64 points.

Number of Occupied

Points (points)

[I/O Assignment

Module Type]

32 (special 32 points) 0.24 –

32 (special 32 points) 0.54 –

32 (special 32 points) 1.4 –

Setting range [Input

Set number of points

Current Consumption

5VDC(A) 24VDC(A)

0.07 –

]

Remark

With simulation switch 16 points

Blank cover AG60 Dust-proof cover for unused slot 16 (empty 16 points) – – CE-compliant

*2 This module can access devices within the device range of the AnACPU (cannot access file

3 - 15

3. SYSTEM CONFIGURATION

Product Name Model Name Description

Large-size graphic operation terminal

A985GOT

A975GOT

A970GOT

A960GOT

A956GOT

256 colors, TFT color, 800 600 dots, high intensity

Large-size graphic operation terminal 256 colors, TFT color, 640 480 dots, high intensity/256 colors, TFT color, 640 480 dots, wide viewing angle

Large-size graphic operation terminal 16 colors, TFT color, 640 480 dots, high intensity/16 colors, TFT color, 640 480 dots, wide viewing angle/8 colors, STN color, 640 480 dots/2 colors, STN monochrome, 640 480 dots

Large-size graphic operation terminal 2 colors, EL, 640 400 dots

Medium-size graphic operation terminal 8 colors, STN color, 320 240 dots/ STN monochrome, 320 240 dots/ 256 colors, TFT color, 320 240 dots, high intensity

Number of Occupied

Points (points)

[I/O Assignment

Module Type]

32 (special 32 points)

Current Consumption

5VDC(A) 24VDC(A)

0.22

–

Remark

*When bus connected

Graphic operation terminal

A956WGOT

A953GOT

A951GOT

A950GOT

GT1565-VTBA

GT1575-VTBA

Medium-size graphic operation terminal 256 colors, TFT color, 320 240 dots, high intensity

Medium-size graphic operation terminal 8 colors, STN color, 320 240 dots/ STN monochrome, 320 240 dots/ 256 colors, TFT color, 320 240 dots, high intensity With handheld type

Medium-size graphic operation terminal 8 colors, STN color, 320 240 dots/ STN monochrome, 320 240 dots/ 256 colors, TFT color, 320 240 dots, high intensity

Medium-size graphic operation terminal 8 colors, STN color, 320 240 dots/ STN monochrome, 320 240 dots/ 256 colors, TFT color, 320 240 dots, high intensity With handheld type

Large-size graphic operation terminal

8.4" 256 colors, TFT color, 640 480 dots (When installing a multi color display board, 65536 colors can be displayed.)

Large-size graphic operation terminal

10.4" 256 colors, TFT color, 640 480 dots (When installing a multi color display board, 65536 colors can be displayed.)

–––

32 (special 32 points)

–––

32 (special 32 points)

0.22

0.12 –

–

For RS-232C connected only

*When bus connected

Dedicated to RS-422 connection

*When bus connected

3 - 16

3. SYSTEM CONFIGURATION

Product Name Model Name Description

Power supply module

Power supply slot mouting position

I/O slot mounting position

A61P A61PN

A61PEU CE-compliant

A62P

A62PEU CE-compliant

A63P

A66P

A68P

A38HB 8 I/O modules can be installed.

100/200VAC input Output: 5VDC 8A

100/200VAC input Output: 5VDC 5A, 24VDC 0.8A

24VDC input Output: 5VDC 8A

100/200VAC input Output: 24VDC 1.2A

100/200VAC input Output: +15VDC 1.2A, -15VDC 0.7A

Number of Occupied

Points (points)

[I/O Assignment

Module Type]

16 (empty 16 points)

First half:

empty 16 points

Second half: empty 16 points

Current Consumption

Remark

5VDC(A) 24VDC(A)

––

Power supply for AD70, A616DAV, A616DAI

For high-speed access (dedicated to QnACPU)

Main base unit

Base unit

Extension base unit

Extension cable

A38HBEU 8 I/O modules can be installed.

A38B 8 I/O modules can be installed.

A35B 5 I/O modules can be installed.

A32B 2 I/O modules can be installed.

A32B-S1 2 I/O modules can be installed.

A68B 8 I/O modules can be installed.

A65B 5 I/O modules can be installed.

A62B 2 I/O modules can be installed.

A58B 8 I/O modules can be installed.

A55B 5 I/O modules can be installed.

A52B 2 I/O modules can be installed.

AC06B

AC30B

600mm (23.62inch) long

1200mm (47.24inch) long

3000mm (118.11inch) long

Cables for connections between base units

For high-speed access (dedicated to QnACPU)

–––

–––AC12B

CE-compliant

No connector for extension.

With connector for extension.

The power supply module is required.

A61P, A61PN, A62P, A63P, andA65P cannot be mounted.

3 - 17

3. SYSTEM CONFIGURATION

Number of Occupied

Product Name Model Name Description

Simulation switch

Battery A6BAT Built-in RAM memory backup – – –

For AY11E, AY1 3E

For AY22 HP-70K Plug type, 7A

For AY23 HP-32 Plug type, 3.2A

For AY5 0, AY8 0

Fuse

For AY60 MP-32 Plug type, 3.2A

For AY6 0E

A6SW16 16-point simulation switch

A6SW32 32-point simulation switch

MF51NM8 FGMA250V 8A

MP-20 Plug type, 2A

MP-50 Plug type, 5A

Cartridge type, 8A

Points (points)

[I/O Assignment

Module Type]

–––

Current Consumption

5VDC(A) 24VDC(A)

Remark

Installed in an input module.

Mounting to QnACPU module

For power supply

For A63P

GTH 4 FGTA250V 4A SM250V 4A

SM6.3A FGTA250V 6A

Cartridge type, 4A

Cartridge type, 6.3A

3 - 18

3. SYSTEM CONFIGURATION

Product Name Model Name Description Applicable Model

Connector/terminal block converter module

Cable for connector/ terminal block converter module

A6TBXY36

A6TBXY54

A6TBX70 For sink-type input module (3-wire type) AX42(S1), AH42

A6TBX36-E For source-type input module (standard type) AX82

A6TBY36-E For source-type output module (standard type) AY82EP

A6TBX54-E For source-type input module (2-wire type) AX82

A6TBY54-E For source-type output module (2-wire type) AY82EP

A6TBX70-E For source type input modules (3-wire type) AX82

AC05TB For 0.5m (1.64ft.) sink module

AC10TB For 1m (3.28ft.) sink module

AC20TB For 2m (6.56ft.) sink module

AC30TB For 3m (9.84ft.) sink module

AC50TB For 5m (16.40ft.) sink module

AC80TB

AC100TB

For sink-type input module and sink-type output module (standard type)

AX42(S1), AY42(S1/S3/S4), AH42

For sink-type input module and sink-type output module. (2-wire type)

A6TBXY36 A6TBXY54 A6TBX70

For 8m (314.96inch) sink module (Common current: 0.5A or less)

For 10m (393.7inch) sink module (Common current: 0.5A or less)

Relay terminal module

Cable for connecting relay terminal module

AC05TB-E For 0.5m (1.64ft.) source module

AC10TB-E For 1m (3.28ft.) source module

AC20TB-E For 2m (6.56ft.) source module

AC30TB-E For 3m (9.84ft.) source module

AC50TB-E For 5m (16.40ft.) source module

A6TE216SRN

AC06TE 0.6 m (1.97ft.) long

AC10TE 1m (3.28ft.) long

AC30TE 3m (9.84ft.) long

AC50TE 5m (16.40ft.) long

AC100TE 10m (32.80ft.) long

For sink-type output module

A6TBX36-E A6TBY36-E A6TBX54-E A6TBY54-E A6TBX70-E

AY42, AY42-S1, AY42-S3, AY42-S4, AH42

A6TE2-16SRN

3 - 19

3. SYSTEM CONFIGURATION

REMARK

Toa Electric Industrial CO., LTD. provides I/O cables with connectors, which can connect to 40-pin connector (AX42, AY42, etc.) or 37-pin D-sub connector (AX82, AY82) of I/O modules.

Contact:

(2) Peripheral device

Product Name Model Name Remark

TOA ELECTRIC INDUSTRIAL CO., LTD.

Programming unit Q6PU

AC30R4-PUS

RS-422 cable

AC20R4-A8PU

Connected to the CPU module by an RS-422 cable (AC30R4-PUS, AC20R4-A8PU); for program writing and reading. (5VDC 0.4A)

Cable for connection between CPU module and Q6PU 3m (9.84ft.) long

Cable for connection between CPU module and Q6PU 2m (6.56ft.) long

3 - 20

SYSTEM CONFIGURATION

3.3.2 Precautions when configuring the system

The following shows the hardware and software packages which can be used for QnACPU.

(1) Hardware

(a) The number of modules that can be mounted is restricted depending on the

module type.

Applicable Module Dedicated to QnACPU For ACPU Remark

I/O module

Special function module No restrictions No restrictions –

Intelligent special function module

Interrupt module

Link module

Ethernet module

Total 4 for network, Ethernet use

– No restrictions –

No restrictions Total 6 modules

– Only 1 module –

Total 2 for data link use

Including GOT-A900 Series (Only when the bus connection is used.), and GOT1000 Series (Only when the bus connection is used.)

Total 4 for network, Ethernet and data link use

REMARK

The modules described above are categorized as follows.

1) I/O module............................... Standard input modules and output modules

2) Special function module.......... Special function modules that perform processing

in accordance with FROM/TO instructions from the QnACPU (for example: A68AD, A62DA, etc.)

3) Intelligent special function......

module

Special function modules that can process not only by executing FROM/TO instruction of QnACPU but also by accessing QnACPU from special function module (Example: AJ71UC24, AJ71QC24N, etc.)

4) Interrupt module...................... Modules that issue interrupts to the QnACPU

(AI61)

5) Link module............................. Special function modules for MELSECNET II, /B

data links and MELSECNET/10 networks. (Example: AJ71AP21, AJ71QLP21, etc.)

6) Ethernet module...................... Dedicated Ethernet interface modules for

QnACPU (AJ71QE71, AJ71QE71-B5)

3 - 21

3. SYSTEM CONFIGURATION

(b) The following shows special function modules that cannot be used with

QnACPU:

• AJ71C23 (Host controller high-speed link module)

• AD57-S2 (A6MD controller module)

• AJ71C24 (Computer link module): Manufactured through February 1987.

• AD51 (Intelligent communication module): Manufactured thorugh March 1987.

• A7GT-BUS (Bus connection interface module for A77GOT and A870GOT): Manufactured through January 1996.

Products manufactured in March 1987 or later, and products marked "H" (corresponding to A3H) can be used.

Products manufactured in April 1987 or later, and products marked "H"(corresponding to A3H ) can be used.

Products manufactured in February 1996 or later, and products marked "C" (corresponding to A3H ) can be used.

• AJ71LP21(G), AJ71BR11, AJ71LR21 (MELSECNET/10 network modules)

used is depending on models of special function modules.

Access range

Device range equivalent to the

Device

AD51(S3), AJ71C24-S3,

I/O device (X/Y) X/Y0 to X/Y7FF X/Y0 to X/Y7FF

Internal relays (M, L, S)

Link relay (B) B0 to B3FF B0 to BFFF B0 to BFFF

Timer (T) T0 to T255 T0 to T2047 T0 to T2047

Counter (C) C0 to C255 C0 to C1023 C0 to C1023

M0 to M2047 M0 to M8191 M0 to M8191

A3HCPU

AJ71P41

AD51H(S3), AD51FD-S3,

AJ71C23-S3, AJ71C24-S6/S8,

AJ71UC24, AJ71AP21(S3)

AJ71AR21

Device range equivalent to the AnACPU

AJ71E71(S3)

, AJ71AT21B

AJ71ME81

Q2A Q2A-S1 Q3A, Q4A

X/Y0 to X/Y1FF

AJ71E71N-B5T/B2/B5

, AJ71E71N(3)-T,

X/Y0 to

X/Y3FF

X/Y0 to X/Y7FF

Data register (D) D0 to D1023 D0 to D6143 D0 to D6143

Link register (W) W0 to W3FF W0 to WFFF W0 to WFFF

Annunciator (F) F0 to F255 F0 to F2047 F0 to F2047

*1 Reading/Writing of file registers, programs, etc. are not possible. *2 Only I/O devices (X/Y), link relay (B), and link register (W) are available. *3 Even when L or S is specified, the device becomes M.

(Example: Even when L10 is specified, the device becomes M10.)

3 - 22

3. SYSTEM CONFIGURATION

(d) When a QnACPU is mounted on a main base unit for A38HB/A38HBEU high-

speed access, the QnACPU can access special function modules, intelligent special function modules and link modules to write/read at greater speeds. QnACPU cannot input/output to the I/O module at greater speed.

(e) The following shows how to connect graphic operation terminal units to a

QnACPU.

Model Connection Method Accessible Device Range

Direct connection to CPU Computer link connection

GOT1000 series

GOT-A900 series

CC-Link connection MELSECNET/10 connection Bus connection

Direct connection to CPU Computer link connection CC-Link connection MELSECNET(II), /B, /10 connection Bus connection

Access is available for all device ranges of QnACPU. (Refer to the GT Works2/GT Designer2 Reference Manual for details.)

(f) The accessible range for an AJ71UC24 computer link module comprises the

CPU to which the AJ71UC24CPU is mounted (the host station) and the other stations in the network to which the host station is connected. It is not possible to access other stations in other networks by using the MELSECNET/10 network system routing function.

The access range for an AJ71QC24N serial communication module is the host station, other stations in the network connected to the host station, and other stations in other networks accessed through up to 7 relay stations by using the routing function.

(g) When accessing from intelligent communication module AD51H-S3 to other

station QnACPU on the network, only Format 1 control table can be used. Format 2 control table cannot be used. Access to other network is not allowed on Format 1 control table.

(h) In QnACPU, I/O assignment set with the parameter cannot be valid for

MELSECNET (II) and MELSECNET/B. When setting the I/O assignment for a remote I/O station, build the remote I/O network with MELSECNET/10.

3 - 23

3. SYSTEM CONFIGURATION

(2) Software package

The following shows the system start-up software packages to create programs for QnACPU.

Peripheral Device Capable of GPP Functions Software Package for System Start-up

Personal computer

GX Developer, SW IVD-GPPQ

Apart from the above, the following software packages can be used.

• CAD interface package

• Data conversion package

• Macro/library package

SW IVD-CADQ

SW IVD-CNVQ

SW IVD-MSDQ SW IVD-MSPQ

• Ladder sequence linking package

SW IVD-LNKQ

REMARK

The following shows the peripheral devices and software packages that cannot be used with QnACPU:

• A PU (Programming unit)

• A6WU (ROM writer unit)

• A6DU-B (Data access unit)

• A6TEL (Modem interface unit)

• A6GPP (Intelligent GPP)

• A6HGP (Hand-held graphic programmer)

• A6PHP (Plasma hand-held graphic programmer)

• System start-up software package for ACPU SW -GPPA, SW -SAP2

• Utility software package for ACPU SW -GPPATEL, SW -CADIF, SW -DRWA, SW -FUNP, SW -TSAP2

3 - 24

SYSTEM CONFIGURATION

3.3.3 QnACPU memory block diagram

The following block diagram shows the QnACPU memory configuration.

Built-in RAM : Memory that stores parameters, sequence programs, etc.

Error history storage memory

Device memory : Memory that stores device data

Memory card (RAM, ROM area)

PLC memory : Indicates all the memories of drives 0 through 4.

For file types stored in each memory, refer to "File Types & Storage Destinations of Files Managed by QnACPU" in the QnACPU Programming Manual (Fundamentals).

: Memory that stores error history data

: Memory that stores the files, comments, etc., for parameters,

sequence programs, sampling traces, etc.

3 - 25

PERFORMANCE SPECIFICATIONS

4 PERFORMANCE SPECIFICATIONS

This section shows the performance specifications of the QnACPU.

Max. 60k

steps

Model Name

0.15 s/ steps

0.45 s/ steps

Max. 92k

steps

0.075 s/ steps

0.225 s/ steps

Max. 124k

steps

Item

Control method Sequence program control method

I/O control mode Refresh mode

Programming language

Processing speed (Sequence instruction)

Constant scan (Function that makes the scan time constant)

Memory capacity Capacity of the installed memory card (Max. 2036k bytes)

Program capacity

Number of steps

Number of files 28 files 60 files 92 files 124 files

MOV

Q2ACPU Q2ACPU-S1 Q3ACPU Q4ACPU

Language dedicated to sequence control

Relay symbol language, logic symbolic language, MELSAP-3 (SFC)

0.2 s/steps

0.6 s/steps

5ms to 2000ms (Possible to set in 5ms units) Possible to set in the parameters

Max. 28k

steps

Remark

Direct input/output is allowed by

specifying direct input/output (DX ,

DY ).

Number of I/O device points 8192 points (X/Y0 to X/Y1FFF)

Number of I/O points

512 points

(X/Y0 to

X/Y1FF)

1024 points

(X/Y0 to X/Y3FF)

2048 points

(X/Y0 to X/Y7FF)

4096 points

(X/Y0 to X/YFFF)

The number of points usable in the program

The number of accessible points to actual I/O module

4 - 1

4. PERFORMANCE SPECIFICATIONS

Item

Internal relay [M] Default: 8192 points (M0 to M8191)

Latch relay [L] Default: 8192 points (L0 to L8191)

Link relay [B] Default: 8192 points (B0 to B1FFF)

Timer [T]

Retentive timer [ST]

Counter [C]

Data register [D] Default: 12288 points (D0 to D12287)

Q2ACPU Q2ACPU-S1 Q3ACPU Q4ACPU

Default: 2048 points (T0 to T2047)

(Low-speed timers and high-speed timers sharing)

Set low-speed timers/high-speed timers switching with instructions.

Set low-speed/high-speed measurement units by parameter.

(Low-speed timers: 10ms to 1000ms, 10ms units, Default: 100ms)

(High-speed timers: 1ms to 100ms, 1ms units, Default: 10ms)

Default: 0 point (ST0 to ST2047)

(Low-speed timers and high-speed timers sharing)

Set Low-speed timers/high-speed timers switching with instructions.

Set low-speed/high-speed measurement units by parameter.

(Low-speed timers: 10ms to 1000ms, 10ms units, Default: 100ms)

(High-speed timers: 1ms to 100 ms, 1ms units, default: 10 ms)

• Normal counters Default: 1024 points (C0 to C1023)

• Interrupt counters Max. 48 points (Default: 0 point, Can be set by the parameter.)

Model Name

Remark

Possible to set the number of points to be used by the parameter

Link register [W] Default: 8192 points (W0 to W1FFF)

Annunciator [F] Default: 2048 points (F0 to F2047)

Edge relay [V] Default: 2048 points (V0 to V2047)

Device points

File register [R]

Special link relay [SB] Default: 2048 points (SB0 to SB7FF)

Special link register [SW] Default: 2048 points (SW0 to SW7FF)

Step relay [S] 8192 points (S0 to S8191)

Index register [Z] 16 points (Z0 to Z15)

Pointer [P]

Interrupt pointer [I]

Special relay [SM] 2048 points (SM0 to SM2047)

Special register [SD] 2048 points (SD0 to SD2047)

Up to 1042432 points can be used by block switching.

The fixed-cycle interval for system interrupt pointers I28 to I31

is set by the parameter. (5ms to 1000ms, in 5ms units)

32768 points (R0 to R32767)

1042432 points (ZR0 to ZR1042431)

Block switching is not necessary.

4096 points (P0 to P4095),

Possible to set Ranges for pointers in files and

common pointers by the parameter.

48 points (I0 to I47)

The number of device points is fixed.

Function input [FX] 16 points (FX0 to FXF)

Function output [FY] 16 points (FY0 to FYF)

Function register [FD] 5 points (FD0 to FD4)

Link direct device

Dedicated to MELSECNET/10 Designation format: J \

Devices that access link devices directly.

4 - 2

4. PERFORMANCE SPECIFICATIONS

Item

Special function module direct device

Latch (power failure compensation) range

Remote RUN/PAUSE contact

Clock function

Allowable momentary power failure period

5VDC internal current consumption* 0.4A 0.4A 0.4A 0.9A

Weight 0.8kg 0.8kg 0.8kg 0.8kg

External dimensions 250mm (9.84inch) 79.5mm (3.13inch) 121mm (4.76inch)

Q2ACPU Q2ACPU-S1 Q3ACPU Q4ACPU

Devices that directly access the buffer memories

Designation format: U \G

(Latch ranges can be set for B, F, V, T, ST, C, D, W devices.)

Possible to setup one contact point for each of

Year, month, day, hour, minute, second, day of the week (automatic

Accuracy -2.3 to +4.4s (TYP. +1.8s)/d at 0

Accuracy -1.1 to +4.4s (TYP. +2.2s)/d at 25

Accuracy -9.6 to +2.7s (TYP. +2.4s)/d at 55

Depends on the power supply modules Refer to Section 16.1.

Model Name

of special function modules.

L0 to L8191 (Default)

RUN/PAUSE from X0 to X1FFF.

detection of the leap year)

Remark

Possible to set in the parameters

REMARK

* Indicates current consumption of the QnACPU with function version "B" (9707B).

The following shows the current consumption values of the QnACPU without the function version:

• Q2ACPU, Q2ACPU-S1, Q3ACPU : 0.3A

• Q4ACPU : 0.6A

4 - 3

I/O NUMBER ASSIGNMENT

5 I/O NUMBER ASSIGNMENT

This section explains the method for I/O number assignment using the QnACPU to enable data communications with a I/O modules and a special function module.

5.1 I/O Numbers

The I/O number is used in the sequence program to input data from a input module and to output data to an output module. The I/O number is expressed as three-digit hexadecimal numbers. The I/O numbers when all the I/O modules are occupied in 16 points are indicated below.

Concept of I/O numbers

REMARK

When programming with a peripheral device for GPP function, I/O numbers can be input in 2 digits.

I/O numbers Input with a peripheral device

X010 X10 Y020 Y20

5 - 1

I/O NUMBER ASSIGNMENT

5.2 I/O Number Assignment Concept

When the PLC power is ON or the CPU module is reset, the I/O assignment described below is performed. In the sequence program, designate the I/O numbers assigned in accordance with the following.

(1) I/O numbers are sequentially assigned from left to right, taking slot 0 (The slot to the

right of the CPU module) of the main base unit to be "0".

(2) The I/O modules and special function modules mounted to the main base unit occupy

the I/O numbers corresponding to the number of I/O points for each module.

(3) 16 points are assigned to the empty slots where no I/O module or special function

module is mounted.

(4) If an extension base unit is connected, its assignment starts from the number

immediately after the number assigned to a main base unit. The order of assignment for extension base units is not the order in which the extension base units are connected, but the order of the stage numbers set for the extension base units. It is possible to connect extension base units as follows: main base unit 2nd extension base stage 1st extension stage.

(5) If any extension stage number is skipped, I/O points are assigned with assuming that

"all the skipped stage 8 slots" occupy 16 points.

5 - 2

5. I/O NUMBER ASSIGNMENT

(6) I/O numbers are assigned assuming that every base unit has 8 slots.

If a 5-slot type base unit is used, an I/O number obtained by adding points equivalent to 3 slots (48 points) to the final I/O number of the 5-slot base unit is assigned to the next extension base unit.

Extension cable

Stage number setting

2nd extension

stage

UNIT

3rd extension

stage

UNIT

Main base unit

Power supply

Extension base unit

100

0123456

000F101F202F303F404F505F606F70

to to to to to to

module

CPU module

1) 2)

I/O No. assignment order

8 9 10 11 12 13 14 15

808F909FA0AFB0BFC0CFD0DFE0EFF0

to to to to to to to to

3) 4)

140

150

22 23

160

18 19 20 21

1716

120

110

130

170

8 slots are occupied

Equivalent of 8 slots occupied, allocated as 8 slots.

to to to to to to to to

12F

13F

14F

15F

16F

1D0

1DF

17F

Number obtained by adding equivalent of one extension stage (128 points) is allocated here.

1E0

1F0

1EF

1FF

11F

10F

5) 6)

Extension base unit

180

18F

26 27 28 29 30 31

2524

1A0

1B0

1AF

1BF

1C0

1CF

190

to to to to to to to to

19F

7) 8)

Number obtained by adding the points of slots 21 to 23 of the previous stage (48 points) is allocated here.

Example above shows a case where all slots are 16-point modules.

The three slots, from 21 to 23, are treated as empty slots.

I/O number assignment example without no extension base on the 1st extension stage

5 - 3

I/O NUMBER ASSIGNMENT

5.3 I/O Assignment with GPP Function

When using the QnACPU, I/O modules and a special function module can be controlled even if I/O assignment with GPP function is not performed. I/O assignment with GPP function are valid in the following cases.

(1) The purpose of I/O assignment with GPP function

(a) When using a base unit for 5 slots, set 0 point for 3 slots for efficient use of

number of I/O points.

(b) Reserve the points when changing a module to other than a 16-point module for

future system extension.

special function module that occupies other than 16 points has to be removed due to failure.

(d) The I/O assignment reduces the I/O number modification in a program since it

enables to match with the I/O numbers of the designed program and to change the I/O numbers assigned to each module on the base unit per slot.

(2) The concept of I/O assignment with GPP function

The following two methods are available for I/O assignment with GPP function.

1) Set the number of points for the empty slots on a main base and extension base. (Points occupied by empty slot)

2) Set the I/O assignment per slot of main base unit or extension base unit to each module type. (I/O assignment)

Parameter settings are used for both of these methods. If both 1) and 2) are set, the setting of 2) takes priority. (a) Setting points occupied by empty slot

Set the number of points for all slots that are empty on the base unit. In the systems in which this setting is not made in the parameters, 16 points are set for empty slots. Make this setting in "7. # of empty slots" on the "PC system" screen in the parameter mode.

5 - 4

5. I/O NUMBER ASSIGNMENT

The setting is made in units of 16 point within the range of 0 to 64. The default is 16 points. Example: When the points occupied by empty slot is set to 0 points

A35B

Power supply

module

A65B 9

Power supply

module

points

Y070

Y08F

(b) I/O assignment settings

Set the I/O assignment per slot of main base unit or extension base unit to each module type. Make this setting in the "I/O Allocation" screen in the parameter mode.

012345 67

Input

Output

CPU module

points

X000

X020

X01F

X02F

points

X030

X04F

points

Y050

Y05F

points

Y060

Y06F

Output

point

10 11 128

Empty

Output

Empty

Output

points

Y090

Y0AF

Y0BF

points

Y0C0

Y0EF

points

Y0F0Y0B0

Y10F

Three empty slots (48 points) of the A35B are allocated as 0 point.

point

Allocate a number consecutive to the last I/O number of the main base unit.

5 - 5

5. I/O NUMBER ASSIGNMENT

The setting details are as follows:

Item Setting Setting range Default value

Slot setting

Type Set the module type.

Points Set the number of points for the module.

Start XY Set the start number of XY devices of the module. 0 to 1FFF (in 16 point units)

Model name Set the model name of the module. Up to 16 characters

Base specification Set data for each base unit.

Extension cable Set the model name of the extension cable. Up to 16 characters

Set data for each slot. (Not necessary to set all data).

Free/input/output/special

0 to 64 points

(in 16 point units)

Up to 16 characters

The items without settings are handled as follows:

Type and Points : In accordance with the loaded module. Start XY : The number following the total points obtained by adding the

number of points of the modules already set. If there is any duplication, an error (SP.UNIT LAY ERROR) is detected.

No setting

No settingPower model name Set the model name of the power supply module.

POINT

The power supply module names set in the base specification is only used for the current capacity check in the PLC diagnostics mode and not used for a CPU module. Therefore, even if they are not set, any problem does not occur.

5 - 6

5. I/O NUMBER ASSIGNMENT

The CPU module performs the following processing when I/O assignment is set.

1) Any of the following assignment can be performed per slot of each base unit.

Assigned number of points

Empty slot Input module Output module

0–––

16 16 16 16

32 32 32 32

48 48 48 48

64 64 64 64

Special function

module

2) The slots for which I/O assignment has been performed with GPP function, the I/O assignment setting takes priority regardless of the loaded module.

• If a number of points fewer than the that of the loaded I/O module is set, the

actual number of points of the loaded I/O module is reduced. For example, if the loaded module is a 32-point input module but I/O assignment is set for a 16-point input module using GPP function, the latter 16 points for the input module cannot be used.

• If a number of points is greater than the that of the loaded I/O module is

set, the number of points in excess of the actual number of points is occupied with dummy points.

• If the slot where an I/O module is loaded is set as a empty slot, the I/O

module will be unusable.

3) The slots for which I/O assignment is not performed using GPP function are assigned with the number of points of the loaded module.

4) The slots for which I/O assignment is not performed using GPP function are assigned I/O numbers that are consecutive to those of modules for which I/O assignment has been performed.

(3) Precautions

(a) If there is a disparity between the I/O assignment made in the parameter settings

and the actually loaded I/O modules, the input and output is not normally performed.

Loaded module I/O assignment Result

Input Output No input

Output Input No output

Input/Output Special CPU module error

Special Input/Output CPU module error

5 - 7

5. I/O NUMBER ASSIGNMENT

(b) The I/O assignment of a slot to which a special function module is loaded has to

be the same setting with the module. Not doing so may cause an error.

1) A11VC........................................... Special: 16 points

2) AI61 ..............................................Special: 32 points

3) AG62.............................................Input: Set number of points

4) Modules that occupy 2 slots.......... Set "Empty, 16 points" and "Special, 32 points".

1) As for a master station, I/O assignment has to be performed for the master station and all remote I/O stations. I/O assignment of MELSECNET (II)/B to the remote I/O station is invalid.

2) As for a local station, perform I/O assignment only for the local station.

3) Assign the I/O for the I/O hybrid module (e.g. A42XY) as an output module.

(d) When the MELSECNET/10 network is established, assign the I/O only for the

host station (master station). Since the I/O assignment of MELSECNET/10 to the remote I/O station is irrelevant, the I/O assignment is not allowed. For I/O assignment of MELSECNET/10 to the remote I/O station, use the I/O assignment settings in the "Network parameter".

REMARK

As for the remote I/O station of MELSECNET (II)/B, I/O assignment settings in the "Network parameter" is irrelevant, therefore, the I/O assignment is not allowed.

5 - 8

I/O NUMBER ASSIGNMENT

5.4 Example of I/O Number Assignment

The following shows the example of I/O number assignment when I/O assignment is performed using GPP function.

(1) When changing the assignment for an empty slot from 16 points to 0 or 32 points

When the A35B is used, there are three empty slots. When setting the assignment for these to 0 points in order to increase the number of I/O points that can be used by the CPU module. When reserving 32 I/O points for a current empty slot to which a 32-point input module is loaded later, in order to prevent the I/O number assignment change. To achieve these operations, perform I/O assignment as follows. (a) Loading status and I/O numbers

5 - 9

5. I/O NUMBER ASSIGNMENT

(b) I/O numbers when I/O assignment is performed using GPP function

1) I/O Allocation example

The example of I/O assignment with GPP function

5 - 10

5. I/O NUMBER ASSIGNMENT

2) I/O numbers after performing I/O assignment using GPP functon

*1 Since 16 points is set, the latter 16 points of inputs cannot be used. *2 Since 32 points is set, the points from 40 to 4F is occupied with dummy points. *3 Since "Empty (S), 16 points" is set, the points cannot be used for outputs. *4 Since "Empty (S), 0 points" is set, the number of I/O points for the three slots are not lost. *5 Since "input (S), 32 points" is set, there are 32 input points. *6 Since 48 points are set, E0 to EF is occupied with dummy points.

5 - 11

5. I/O NUMBER ASSIGNMENT

(2) Replacing a 16-point input module with a 32-point input module

When replacing the 16-point input module with a 32-point input module without changing the all I/O number assignment in a system to which a 16-point input module is designed. To achieve this operation, perform I/O assignment as follows. (a) Loading status and I/O numbers before the replacement

A38B

01234567

Input

module

CPU module

Power supply

points16points

X00

X0F

Input

points

X10 X20 X30 Y40 Y50

X2F

X1F

X3F

Input

points

Y4F

Output

points

Y5F

Output

points

Y60

Y6F

Output

points

Y70

Y7F

Output

These I/O numbers are not to be changed.

This module is to be replaced by a 32-point module. The I/O numbers are to be changed to X80 to X9F.

(b) I/O numbers when I/O Allocation is performed using GPP function

1) I/O Allocation example

The example of I/O assignment with GPP function

5 - 12

5. I/O NUMBER ASSIGNMENT

2) I/O numbers after performing I/O assignment using GPP function and replacing the module

38B

01234567

Input

points

X2F

points

X3F

Input

module

CPU module

Power supply

points

X00

X0F

32 16

points

X80 X20 X30 Y40 Y50

X9F

points

Y4F

Output

points

Y5F

Y60

Y6F

Output

pointspoints

Y70

Y7F

POINT

When the I/O number set for "Start XY" in the "I/O Assign" is changed, also set the "Start XY" for the next module to avoid changing the I/O numbers of the module for which the change was made and the subsequent modules. In the example above, since "20" is set for the "Start XY" for the second slot, consecutive I/O numbers starting from X30 are set for slot 3 and later.

5 - 13

5. I/O NUMBER ASSIGNMENT

(3) When combining an input module and output module having non-consecutive I/O

numbers on a base unit

When controlling the machine (I/O numbers X0 to X3F, Y40 to Y7F) and machine

(I/O numbers X200 to X23F and Y240 to Y27F) with a single PLC, it is desired to

combine input modules and output modules on the base unit. To achieve this operation, perform I/O assignment as follows. (a) Loading status and I/O numbers to be set

(b) The example of I/O Allocation with GPP function

5 - 14

DATA COMMUNICATIONS WITH SPECIAL FUNCTION MODULES

6 DATA COMMUNICATIONS WITH SPECIAL FUNCTION MODULES

This chapter explains the methods for reading data from a special function module, and writing data to a special function module with the QnACPU. The special function module is a module that allows analog quantity, high-speed pulse, etc., which cannot be processed with I/O module alone, to be handled by the QnACPU. For example, analog quantity is converted to a digital value by an analog/digital converter module (which is a special function module) so that they can be used by the QnACPU. The special function module has buffer memory in which data input from external sources and data to be output to external destinations are stored. The folloiwng two methods are available for reading data from a special function module, and writing data to a special function module with the QnACPU.

1) Using the FROM/TO instruction

2) Using special direct devices

These methods are explained in the following sections.

6 - 1

6. DATA COMMUNICATIONS WITH SPECIAL FUNCTION MODULES

6.1 Reading/Writing Data from/to the QnACPU Using the FROM/TO Instruction

When the FROM/TO instruction is performed, data stored in the buffer memory of a special function module is read, or data is written to the buffer memory of a special function module.

Data communications with a special function module

When the FROM instruction is performed, the data read from the buffer memory is stored in the specified device. When the TO instruction is performed, the data in the specified device is written to the buffer memory.

REMARK

1) For details on the FROM/TO instructions, refer to the QCPU (Q mode)/ QnACPU Programming Manual (Common Instructions).

2) For details on the buffer memory of a special function module, refer to the manual of the special function module in use.

POINT

When executing the FROM/TO instruction for the special function module frequently in short scan time, it may cause the target special function module operation error. When executing the FROM/TO instruction, match the processing time and conversion time of the special function module using timer or constant scanning.

6 - 2

DATA COMMUNICATIONS WITH SPECIAL FUNCTION MODULES

6.2 Reading/Writing Data from/to the QnACPU Using Special Direct Devices

As the FROM/TO instruction, the special direct device reads data stored in the buffer memory of a special function module or writes data to the buffer memory of a special function module.

The special direct device represents the buffer memory in a special function module as the QnACPU device.

Example: U10\G10: U10

G10

Indicates the head I/O No.100 of the special function module. (Hexadecimal) Indicates the buffer memory address 10. (Decimal)

REMARK

For details on a special direct device, refer to the QnACPU Programming Manual (Fundamentals).

The special direct device differs from the FROM/TO instruction in that the CPU module can handle the buffer memory of a special function module as a direct device. This can reduce the total number of steps in the program. However, the instruction processing speed is the same with the FROM/TO instruction.

Example: Writing data to address 0 of the buffer memory in the special function

module loaded at X/Y0, and reading the data of address 1.

(a) Using the FROM/TO instruction (b) Using special direct device

6 - 3

6. DATA COMMUNICATIONS WITH SPECIAL FUNCTION MODULES

POINT

1. When reading data from the special function module frequently during the programming, store the special direct device to a data register after reading in an area of the program by using the FROM instruction rather than by using them at each instruction. This is because programming scan interval is added due to an access processing to the special function module for each instruction.

2. When executing the instruction using a special direct device for the special function module frequently in short scan time, it may cause the target special function module operation error. When performing the instruction using a special direct device, match the processing time and conversion time of the special function module using timer or constant scanning.

6 - 4

DATA COMMUNICATIONS WITH SPECIAL FUNCTION MODULES

6.3 Processing for Data Communication Requests from a Special Function Module

When a data communication request is received from a special function module such as a serial communication module, the QnACPU performs the processing for the data communication request at the END processing. The QnACPU can process all the data communication requests received in one scan with one END processing, according to the parameter settings. In this case, the data lag to each module is eliminated, but the END processing is extended by the data communications request processing. Data communications request batch processing is set in the "6. General Data Processing"on the "PC system" screen in the GPP function parameter mode. The setting range is 1 to 6 modules, and the processsing can be set per module.

6 - 5

AUTO REFRESH FUNCTION

7 AUTO REFRESH FUNCTION

7.1 For MELSECNET/MINI-S3

By setting link information, I/O storage device, etc. of the MELSECNET/MINI-S3 to the parameters, the module automatically communicates with the buffer memory area for the batch refresh send/received data of the type AJ71PT32-S3 MELSECNET/MINI-S3 master module (abbreviated as the MINI master module hereafter). The settings are made on the MELSECNET/MINI setting in the parameter mode of GPP function.

Sequence programs can be created using the I/O devices allocated to send/received by the MELSECNET/MINI-S3 setting. (The FROM/TO instructions are not required.)

7 - 1

7. AUTO REFRESH FUNCTION

POINT

(1) Since up to 8 master modules can be set for auto refresh by the parameter,

auto refresh is possible for up to 8 modules. When 9 or more modules are desired, use the FROM/TO instruction in the sequence program from the 9th module.

(2) Since auto refresh is not possible with send/received data for the separate

refresh I/O modules and for the remote terminal units No.1 to No.14, use them by the FROM/TO instructions. However, the remote terminal units shown below are subject of auto refresh in the limited area:

AJ35PTF-R2 RS-232C interface module AJ35PT-OPB-M1-S3 mount-type tool box AJ35PT-OPB-P1-S3 portable type tool box

(3) For the master modules set up for auto refresh, since the QnACPU

automatically turns ON the link communication start signal Y(n+18) or Y(n+28), it is not necessary to turn it on from the sequence program.

(4) Auto refresh of I/O data is performed by the batch after the QnACPU performs

the END instruction. (Auto refresh processing is performed when the CPU module is in the RUN/ PAUSE/STEP-RUN status.)

(5) The master module may perform the processing while the link communication

start signal Y(n+18) or Y(n+28) is OFF depending on the remote terminal units connected. For instance, if the AJ35PTF-R2 RS-232C interface unit is used without protocol, it is necessary to write parameters to the parameter area (buffer memory address 860 to 929) while the link communication start signal is OFF. Since the link communication start signal becomes ON after the CPU module enters the RUN status and one scan is performed, write the parameters during the first 1 scan.

Link communication start signal

Y(n+28)

SM402

OFF

1 scan

Set CPU module to RUN

(6) If the hardware error signal X(n+0)or X(n+20) or ROM error signal X(n+8)or

X(n+28) of a master module for which auto refresh has been set comes ON, the QnACPU does not perform auto refresh processing.

(7) When making the settings, ensure that there is no duplication between

receive data refresh devices and send data refresh devices.

7 - 2

7. AUTO REFRESH FUNCTION

(1) Parameter setting items, setting ranges and contents of auto refresh, as well as the

buffer memory address of the master module which is used for exchanging data with the QnACPU are shown below. Set the parameters for the number of the master modules used.

I/O signal

from a

master

module

––

– – Start I/O No.

––

–0

–

Buffer memory

address of a

master module

110

141

10 to 41

Number of master modules

Model classification of MINI/MINIS3

Total number of remote I/O stations

Storage device for received data

Send data storage device

Item Setting range Description Default value

0, 1 to 8 module(s)

Number of I/O points of CPU module

• MINI or MINI-S3

0 to 64 stations

•X

• M, L, B, T, ST, C, D, W, R, ZR, none

(Bit device: multiples of 16)

•Y

• M, L, B, T, ST, C, D, W, R, ZR, none

(Bit device: multiples of 16)

• Sets the total number of the master modules used. Set "0" if auto refresh is not to be used.

• Sets the head I/O number where the master module is installed.

•MINI In I/O mode (occupies 32 points)

• MINI-S3 In expansion mode (occupies 48 points)

• Set only when MINI is set.

• In MINI-S3, since the number of master module's initial ROMs becomes valid, the setting is not necessary .(When the setting is executed, ignore it).

• Sets the devices to store the received/send data for batch refresh.

• Specify the head number of the device.

• The total number of remote I/O stations, set starting from the first device number, is occupied as a auto refresh area. (8 points/station 64 stations = 512 points : Bit

device)

• Use of X/Y remote I/O range is recommended for devices.

Follow the settings made in the "I/O Assign" in the parameter

mode.

X1000 to X11FF

Y1000 to Y11FF

–1

Y(n+1A)

Y(n+1B)

–

Number of

retries

FROM/TO response specification

Data clear specification for communication faulty station

0 to 32 times

Link priority; CPU priority

Priority selection of access to the master module buffer memory

Retention, clear (received data)

• Sets the number of retries upon the communication errors occurrence.

• Error is not output when the communication is restored within the number of the retries set.

1) Link priority

• Link access by MINI-S3 has the priority. During the link access, FROM/TO is caused to wait.

• Possible to read out the received data refreshed at the same timing.

• The maximum wait time (0.3ms + 0.2ms number of separate refresh stations) for the FROM/TO instruction may be generated.

2) CPU priority

• The FROM/TO instructions from a CPU module are given access priority. Even during the link access, it interrupts and accesses.

• Depending on the timing, received data in the midst of I/O refresh may be read.

• No wait time for the FROM/TO instruction.

• Retention Retains the received data for batch and separate refresh.

• Clear Sets all points to OFF

5 times

CPU priority

Clear

7 - 3

7. AUTO REFRESH FUNCTION

I/O signal

from a

master

module

–

–4

––

Buffer memory

address of a

master module

100

to 103 195

107 196

to 203

Item Setting range Description Default value

Faulty station detection

Error No. T, ST, C, D, W, R, ZR

Line error check setting (Line error)

Operation at CPU STOP

M, L, B, T, ST, C, D, W, R, ZR, none (Bit device: multiples of 16)

• Test message sending (Test)

• OFF data sending (OFF)

• Immediate data transmission before line errors (Retention)

Stop/Continue

• Sets the head device to store the faulty stations detected data.

• MINI occupies 4 words; MINI-S3 occupies 5 words.

• Sets the head device to store the error code at the error occurrence.

• MINI occupies 1 word; MINI-S3 occupies (1 + Number of remote terminal modules) words.

• Sets data sending method for verification of faulty area when the line errors occur.

• Sets the operating status when the CPU module is in the STOP state.

No setting

*1 "n" is determined by the installation location of the master modules. *2 When the total number of remote I/O station is odd, add 1 to the station number to obtain the

occupied storage devices.

*3 When the master module number setting column is made blank in parameter setting, auto

refresh can be used without this setting. However, model name registration is required in the "I/O Assign". (MINI mode: AJ71PT32, MINI-S3 mode: AJ71PT32-S3)

*4 When the input (X) is specified in the received data storage device, use the I/O number later

than the number used for the module loaded on the main base unit and the extension base unit. When the I/O number usage range for the module loaded on the main base and the extension base is used for input/output of the received data storage device, the CPU module imports both the input ON/OFF data from the input module and the ON/OFF data from auto refresh of MELSECNET/MINI-S3. Therefore, input (X) of the CPU module is not operated as desired.

Retention

Stop

7 - 4

7. AUTO REFRESH FUNCTION

(2) Setting of the send/received data storage devices is explained using the system

example shown below. (Example) When the device X/Y400 and later are used as the remote I/O stations:

Sample parameter setting of the GPP function for the above system configuration is shown below:

7 - 5

7. AUTO REFRESH FUNCTION

The storage devices for the send/received data for the present system example are as follows:

(a) Storage device for received data

ddress

110 111 112 113 114 115

Master module

b15 b8 b7 b0

Station No.2 Station No.4 Station No.6

Station No.8

Station No.10

Station No. Station No.3 Station No.5 Station No.7

Station No.9 Station No.11

Input area

X40F X41F X42F X43F X44F X45F

CPU module

X408

X407

X418

X417 X427

X428

X437

X438

X447

X448

X457

X458

Used by the system

1) Set the device number (X400) for b0 of the station 1 as a received data storage device.

2) The received data storage device occupies from X400 to X45F. For the present system example, since the total number of stations is odd, it is occupied for one extra station.

3) The device numbers of input modules connected are as follows: Stations 1 to 4 Stations 5 and 6 Stations 7 and 8

AX41C AJ35TB-16D AX40Y50C

X400 to X41F X420 to X42F

X430 to X43F With respect to X440 to X45F, they are simultaneously refreshed, and set to OFF at any time. Do not use X440 to X45F in the sequence program.

X400 X410 X420 X430 X440 X450

7 - 6

7. AUTO REFRESH FUNCTION

(b) Send data storage device

1) Set the device number (Y400) for b0 of the station 1 as a send data storage device.

2) The send data storage device occupies from Y400 to Y45F. For the present system example, since the total number of stations is odd, it is occupied for one extra station.

3) The device numbers of output modules connected are as follows: Station 9 to 10 Station 11 With respect to Y400 to Y43F and Y458 to Y45F, they are simultaneously refreshed, but are not output.

AX40Y50C AJ35TJ-8R

Y440 to Y44F Y450 to Y457

POINT

(1) If the same device type is used for the send data storage devices and

received data storage devices, make sure that there is no duplication of device numbers. When the received data storage device is set to B0 in the system configuration example, it occupies B0 to B5F as the device range. Set the send data storage device to B60 or later. When the send data storage device is set to B60, the device range will be B60 to BBF.

(2) If a bit device is specified as the send/received data storage device, the

device number set must be a multiple of 16.

Example:

(3) Device range used is (8 points) (Number of stations).

When the number of stations is an odd number, extra 8 points are necessary.

(4) When specifying input (X) for the received data storage device, specify the

device number out of the actual input (X) range.

X0, X10, X100, M0, M16, M256, B0, B10, B100,

7 - 7

AUTO REFRESH FUNCTION

7.2 Auto Refresh Setting of CC-Link

Auto refresh of the CC-Link designates automatic communications between the QnACPU and the buffer memory for cyclic communication of CC-Link master stations/local stations. Data for communication varies depending on the remote station connected.

• Remote I/O station (Communication in ON/OFF data)

• Remote device station (Communication in ON/OFF data and Word data)

• Intelligent device station (Communication in ON/OFF data and Word data)

• Master station/local station (Communication in ON/OFF data and Word data)

The auto refresh setting of the CC-Link allows communication with other stations of CCLink using the FROM/TO instruction without communicating with the master station of the CC-Link.

7 - 8

7. AUTO REFRESH FUNCTION

(1) Settings for auto refresh

The Table 7.1 shows the setting items for auto refresh parameters of the QnACPU.

Table 7.1 List of auto refresh settings

Item Description Setting range

Number of modules The number of CC-Link modules is set. 1 to 8

Module head I/O number The head I/O number of a CC-Link module is set. 0000

• M: Master station

• L: Local station

• T: Stand-by station

X, M, L, B, T, ST, C, D,

W, R, ZR

X, M, L, B, T, ST, C, D,

W, R, ZR

M, L, B, T ,ST, C, D, W,

R, ZR

Module type

Receiving data batch refresh bit device (Input data)

Transmission data batch refresh bit device (Output data)

Receiving data batch refresh word device (Remote device: RWr)

The loaded CC-Link module type (Master station, local station, stand-by station) is set.

• The device that stores the batch refresh received data from the remote station is set.

• When the head device number is set, the points corresponding to the specified number of stations (Total number of stations) are obtained to refresh all areas. The output module area is also refreshed.

• The settings are made in units of 16 points.

• The device that stores the batch refresh send data to the remote station is set.

• When the head device number is set, the points corresponding to the specified number of stations (Total number of stations) are obtained to refresh all areas. The input module area is also refreshed.

• The settings are made in units of 16 points.

• The device that stores the batch refresh received data from the remote station is set.

• When the head device number is set, the points corresponding to the specified number of stations (Total number of stations) are obtained to refresh all areas. The I/O module area is also refreshed.

• The settings are made per point.

Setting station

MLT

H to 0FE0H

Transmission data batch refresh device (Remote device: RWw)

Receiving buffer specification for transient station

Transmission buffer specification for transient station

Batch refresh device for special relay

• The device that stores the batch refresh send data to the remote station is set.

• The settings are made per point.

• The receive buffer capacity for transient station is set. 80 to 4096

• The send buffer capacity for transient station is set. 80 to 4096

• The destination device for special relay is set.

M, L, B, T ,ST, C, D, W,

R, ZR

M, L, B, T ,ST, C, D, W,

R, ZR

* Only when the file register is set to "Use the designated file" with the "Parameter", R and ZR

can be used as the auto refresh devices. When "Use same file name as program" is set, R and ZR cannot be used.

REMARK

1) In "Setting station" in the table above, M refers to the master station, L to the

local station, and T to the stand-by station.

In the table above, means that the setting can be made and means that the setting is not required.

7 - 9

7. AUTO REFRESH FUNCTION

Table 7.1 List of auto refresh settings (Continued)

Item Description Setting range

Batch refresh device for special register

Auto update buffer specification

Total number of slave stations

Delay timer • The delay time of link scan is set.

Standby station specification • The use status of the stand-by master function is set.

Number of retries • The number of retries at the occurrence of a transient transmission error is set. 1 to 7

Number of automatic return stations

Operation specification for CPU stop

Scan mode setting • Synchronization/Non-synchronization is set to the CPU module scan.

• The destination device for special register is set.

• The buffer capacity for automatic update is set. 128 to 4096

• The last station number of the remote station connected to the master station is set.

• The number of automatic return stations is set to one link scan. 1 to 10

• When the CPU module has stopped, continuation/stop of the data link is set.

T, ST, C, D, W, R, ZR

1 to 64

1 to 100 (0 is invalid.)

• Not used

• Used

•Stop

• Continue

• Non-synchronization

• Synchronization

Setting station

MLT

Station type • The model for each remote station is set.

Number of occupied stations • The number of occupied stations for each remote station is set.

Specification of reserved station

Specification of invalid station

• Reservation for remote station is set.

• Validity/Invalidity for error detection of the remote station is set.

* Only when the file register is set to "Use the designated file" with the "Parameter",

R and ZR can be used as the auto refresh devices. When "Use same file name as program" is set, R and ZR cannot be used.

REMARK

1) In "Setting station" in the table above, M refers to the master station, L to the

local station, and T to the stand-by station.

In the table above, means that the setting can be made and means that the setting is not required.

• Remote I/O station

• Remote device station

• Intelligent device station

• 1 station

•2 stations

•3 stations

•4 stations

•Not reserved

• Reserved

•Invalid

• Valid

7 - 10

7. AUTO REFRESH FUNCTION

(2) Precautions

(a) Auto refresh of the CC-Link is available when the QnACPU and the CC-Link

module with function version "B" are used. When either of the QnACPU or the CC-Link module does not indicate function version "B," auto refresh of the CC-Link is not available.

(b) Auto refresh can be set to up to 8 CC-Link modules.

When 9 or more CC-Link modules are used, handle with the FROM/TO instruction of the sequence program for the 9th module or later.

MELSECNET/MINI-S3 are loaded and auto refresh is not set, the default parameter is set to the master station module for MELSECNET/MINI-S3.

(d) The COM instruction or the G(P). ZCOM instruction allows auto refresh to the

CC-Link module while performing the sequence program. However, auto refresh to the CC-Link module cannot be performed with the J(P).ZCOM instruction. Error code "4102" (The network number designated with the dedicated network instruction does not exist) appears.

(e) Refresh operation for the mixture of MELSECNET (/10, /II) and MELSECNET/

MINI-S3.

• Refresh is performed in the order of MELSECNET (/10, /II), CC-Link and MELSECNET/MINI-S3. Therefore, the input data specifying the same range is afterward overwritten with the executed data.

• The output data is output to the MELSECNET (/10, /II), CC-Link, and MELSECNET/MINI-S3.

(f) The operation of the QnACPU when the CC-Link module is in the online/offline

mode is shown in the table below:

Parameter settings

for auto refresh

Set

Not set

CC-Link module

status

Online

Offline

Online

Offline

Operation of the QnACPU

The communications with the remote station is performed with the specified parameter for auto refresh.

The QnACPU does not generate an error, but does not communicate with the remote station.

The communications with the remote station is performed by the FROM/TO instruction.

The QnACPU does not generate an error, but does not communicate with the remote station.

(g) Auto refresh setting to the CC-Link is performed using the following peripheral

devices.

• Personal computer: GX Developer, SW2IVD-GPPQ type GPP function software package

7 - 11

7. AUTO REFRESH FUNCTION

(3) Setting method

Auto refresh setting to the CC-Link is set with the following procedures. (a) When the "CC-Link" is selected in the "Parameter", the "CC-Link setting" screen

appears.

(b) Set the number of the CC-Link modules loaded on the main base unit and

extension base unit for the QnACPU and selct "Execute", then the screen of CCLink setting list appears.

Pressing the key registers the set data.

Esc

7 - 12

7. AUTO REFRESH FUNCTION

I/O number setting of the CC-Link module for the specified module number

CC-Link module type setting for the specified unit number

Device setting of QnACPU used

press the key (Detail). The "CC-Link setting" screen appears.

Select "4. Auxiliary setting...." and "5. Station information setting...." to set

detailed data.

Remote station

[CC-Link setting]

1. Module starting I/O No. [ ] Auxiliary setting....

2. Module type 1. (*) M. Master station 5. Station information

2. ( ) L. Local station

3 Batch refresh device

Remote input(RX) Device [ ] Remote output(RY) Device [ ] Remote register(RWr) Device [ ]

Remote register(RWw) Device [ ]

Special link relay(SB) Device [ ] Special link register(SW) Device [ ]

Execute(Y)

When pressing the Execute (Y) or the key , the screen returns to the

Label name:

setting....

Cancel(N)

Spase:Select Esc:Close

Esc

setting connected to CC-Link module (Refer to 1).)

Setting of each remote station (Refer to 2).)

screen of CC-Link setting list.

7 - 13

7. AUTO REFRESH FUNCTION

1) When selecting the "4. Auxiliary setting....", the "Auxiliary setting" screen

appears.

Set the number of stations specified in

2).

When pressing the key, the screen returns to the CC-Link setting

Esc

screen of (c).

2) When selecting the "5. Station information setting...", the "Station information

setting"screen appears.

When pressing the key, the screen returns to the CC-Link setting

Esc

screen of (c).

[

Station information setting

Station

Station type

No.

1 2 3 4 5 6 7 8 9 10 11 12

< I/O > < I/O > < I/O > < I/O > < I/O > < I/O > < I/O > < I/O > < I/O > < I/O > < I/O >

I/O

Number of

occupied

stations

< 1 > < 1 > < 1 > < 1 > < 1 > < 1 > < 1 > < 1 > < 1 > < 1 > < 1 > < 1 >

]

Reserved/ invalid station

< > < > < > < > < > < > < > < > < > < > < > < >

Label name:

Intelligent buffer specification (word)

Send Receive Auto

[ ] [ ] [ ] [ ] [ ] [ ] [ ] [ ] [ ] [ ] [ ] [ ]

Spase:Select Esc:Close

[ ] [ ] [ ] [ ] [ ] [ ] [ ] [ ] [ ] [ ] [ ] [ ]

7 - 14

DEBUGGING FUNCTION

8 DEBUGGING FUNCTION

8.1 Function List

QnACPU has a variety of convenient functions when debugging. The following shows the debugging functions.

Item Description Reference

Monitor function

Write during RUN

Execution time measurement

Program monitor list

Interrupt program monitor list

Scan time measurement

Sampling trace function

Status latch function

Step operation

Step execution Function that runs a program step by step Section 8.7.1

Function that reads CPU programs, device statuses from a peripheral device capable of GPP functions

Function that writes a program while the CPU module is running

Functions that displays the processing time of a program being execute

Functions that displays the processing time of a program being executed

Function that displays the number of executions of an interrupt program

Function that measures the execution time of section of a program

Function that continually collects the data of devices in accordance with a timing set at the CPU module

Function that collects the device data at the moment to designate

Functions that runs one step or one part of a program, runs a program with a part skipped

Section 8.2

Section 8.3

Section 8.4

Section 8.4.1

Section 8.4.2

Section 8.4.3

Section 8.5

Section 8.6

Section 8.7

Partial execution Function that executes a designated part of a program Section 8.7.2

Skip execution

Program trace function

Simulation function

Debugging by several people

Monitoring trace function

Function that executes a program with a designated part skipped

Function that collects the program execution status Section 8.8

Function that simulats execution in isolation from the I/O modules and special function modules

Function that simultaneously debuggs from several peripheral devices capable of GPP functions

Function that collects device data at a peripheral device capable of GPP functions in accordance with the designated timing

Section 8.7.3

Section 8.9

Section 8.10

For details on the operation for each function, refer to the GPP function Operating Manual.

*1 When executing this function, a memory card is required. *2 When executing part of this function, a memory card is required.

8 - 1

–

DEBUGGING FUNCTION

8.2 Monitor Function

This function reads CPU module programs and device statuses to a peripheral device capable of GPP functions.

Application

This function is used to set monitoring conditions for monitoring the operating statuses of the PLC in accordance with a precise timing. There are three "Monitoring Condition" as follows.

• Executing a monitoring at END processing.

• Setting the step number to be monitored and the step conducting status.

• Setting the device status.

This function is used to retain the monitoring screen by setting "Monitor stop condition setup" in accordance with a precise timing. When monitoring the CPU module marked Function version B using a peripheral device capable of GPP function, local device monitor test is executed by setting "local device monitor".

8.2.1 Monitoring condition setting

Function Description

(1) This function allows setting of the monitoring condition.

All operations are performed using Monitor/test menu in the ladder mode. The following shows an example of setting a monitor condition.

The following shows an explanation of the screen above: The monitoring condition can be select either "1. ( ) Monitor Always." or "2. ( ) Condition". (a) When "1. ( ) Monitor Always." is set

The collection timing for monitor data is every scan after END processing at the CPU module.

8 - 2

8. DEBUGGING FUNCTION

(b) When "2. ( ) Condition" is set

"1. [ ] Device" and "2. [ ] Step #" can be set.

1) When only "2. [ ] Step #" is set

The monitor data collection timing is the moment when a QnACPU shows designated status immediately before executing the designated step. The following shows the possible designations to execute.

When switching from OFF to ON:

When switching from ON to OFF:

All the time only during ON :< ON > All the time only during OFF :<OFF > All the time in any statuses :<Always>

:< >

8 - 3

8. DEBUGGING FUNCTION

REMARK

1) When Step # [ 0] is designated, the execution condition must be set as Always.

2) When "1. [ ] Device" only is specified (when "2. [ ] Step #" is not specified), the monitor data collection timing is every scan after END processing of the PLC CPU. When the data is changed in the same scan, it cannot be detected. (Including the low-speed program)

3) When only "1. [ ] Device" is set, either "1. ( ) Word Device" or "2. ( ) Bit Device" can be designated.

When "1. ( ) Word Device" is designated The collection timing of the monitor data is the scan END processing when the current value of the specified word device becomes the specified value. The following shows the method for designating the current value.

Decimal designation: [K ]

Hexadecimal designation: [H ]

Decimal number

Hexadecimal number

When "2. ( ) Bit Device" is designated The collection timing of the monitor data is the scan END processing when the execution status of the specified bit device becomes the specified status. The following shows the possible designations for execution status.

At leading edge :< > At trailing edge :< >

When "2. [ ] Step #" and "1. [ ] Device" are designated The monitor data collection timing is such that data is collected when the status immediately before execution of the designated step or the execution status (current value) of the designated bit device (word device) attains the designated status.

8 - 4

8. DEBUGGING FUNCTION

POINT

In the ladder block shown below, assuming that the detailed condition is set as

follows: "Step # [100] = < >, Word device [D1 ] = [K5 ]".

The monitor timing is shown below. However, the monitoring interval at a peripheral device capable of GPP functions depends on the processing speed of that peripheral device. Even if data changes occur faster than the monitor interval, data can be collected only once during the interval.

8 - 5

8. DEBUGGING FUNCTION

POINT

(1) Assume that "Step # [ 2] = <ON>" is designated as the detailed condition in

the case of the ladders shown below; In this case the monitor execution differs for the two ladders. For (a) it is "X0 and X1 both ON" and for (b) it is "X1 ON (regardless of ON/OFF status of X0)". If a step part way through an AND/OR block is designated for a monitor condition, the monitor data collection timing is such that data is collected when the status immediately before execution of the step designated from the LD instruction in the block becomes the designated status.

(2) If the ladder block head other than 0 step is specified to the step number as

detailed conditions, the monitor data is collected when the instruction execution status immediately before execution is the specified status. When "Step # [ 2] = <ON>" is specified in the ladder below, the monitor data is collected for OUT Y10 ON.

8 - 6

8. DEBUGGING FUNCTION

(2) A monitor stop condition can be set.

All operations are performed on the monitor/test screen window in the ladder mode. The following shows an example of the setting for a monitor stop condition.

The following shows an explanation of the screen above: Either "1. ( ) Without Monitor Stop" or "2. ( ) Condition" can be set for the monitor stop condition. (a) When "1. ( ) Without Monitor Stop" is set

Monitoring is stopped when key is pressed.

(b) When "2. ( ) Condition" is set

"1. [ ] Device" and "2. [ ] Calculation State" can be set.

1) When "2. [ ] Calculation State" is set The monitor stop timing is such that monitoring stops when the execution condition of the step designated for the monitor condition attains the designated status. The following shows the possible designations for execution status.

When switching from OFF to ON

When switching from ON to OFF

All the time only during ON

All the time only during OFF

All the time in any statuses

If "2. [ ] Calculation State" isn't set, the timing for monitor stop is such that monitoring is stopped after CPU module END processing.

:ON

:OFF

:Always

8 - 7

8. DEBUGGING FUNCTION

2) When "1. [ ] Device" is set Either "1. ( ) Word Device" or "2. ( ) Bit Device" can be set.

When "1. ( ) Word Device" is set The monitor stop timing is such that monitoring stops when the present

value of the designated word device attains the designated value. The following shows the method for designating the current value.

For decimal (word) designation

For hexadecimal (word) designation : [H ]

For decimal (double word) designation

For hexadecimal (double word)

: [K ]

Decimal number

Hexadecimal number

: [K L]

Decimal number

: [H L]

Hexadecimal number

Space

designation

For real number designation : [E ]

Real number

When "2. ( ) Bit Device" is designated The monitor stop timing is such that monitoring stops when the execution status of the designated bit device becomes the designated status.

The following shows the possible designations for execution status.

At leading edge :

At trailing edge :

(3) In the case of devices for which index qualifications have been made, the index

qualified value is monitored. The following shows an example of this type of monitoring.

8 - 8

Mitsubishi Q2ACPU, Q3ACPU, Q4ACPU, Q2ACPUS1 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

SAFETY PRECAUTIONS

CONDITIONS OF USE FOR THE PRODUCT

REVISIONS

Introduction

Table of Contents

Related Manuals

Precautions when using QnACPU

1 ABOUT THIS MANUAL

1.1 About this Manual

1.2 Abbreviations and Generic Terms Used in this Manual

2 OVERVIEW

2.1 Features

2.2 Additional Functions of QnACPU

2.2.1 Overview of added functions

3 SYSTEM CONFIGURATION

3.1 System Configuration

3.1.1 Equipment configuration in a stand-alone system

3.1.2 Configuration of peripheral devices capable of QnACPU

3.2 System Configuration Overview

3.3 System Equipment

3.3.1 System equipment list

3.3.2 Precautions when configuring the system

3.3.3 QnACPU memory block diagram

4 PERFORMANCE SPECIFICATIONS

5 I/O NUMBER ASSIGNMENT

5.1 I/O Numbers

5.2 I/O Number Assignment Concept

5.3 I/O Assignment with GPP Function

5.4 Example of I/O Number Assignment

6 DATA COMMUNICATIONS WITH SPECIAL FUNCTION MODULES

6.1 Reading/Writing Data from/to the QnACPU Using the FROM/TO Instruction

6.2 Reading/Writing Data from/to the QnACPU Using Special Direct Devices

6.3 Processing for Data Communication Requests from a Special Function Module

7 AUTO REFRESH FUNCTION

7.1 For MELSECNET/MINI-S3

7.2 Auto Refresh Setting of CC-Link

8 DEBUGGING FUNCTION

8.1 Function List

8.2 Monitor Function

8.2.1 Monitoring condition setting