MITSUBISHI MGFS48B212 User Manual

< L/S band internally matched power GaAs FET >
MGFS48B2122
2.11 – 2.17 GHz BAND / 60W
DESCRIPTION
OUTLINE
2.0±0.15
3.2±0.8
FEATURES
Push-pull configuration High output power Pout=60W (TYP.) @f=2.17GHz
8.0±0.2
17.4 ±0.3
High power gain GLP=12.0dB (TYP.) @f=2.17GHz High power added efficiency P.A.E.=48% (TYP.) @f=2.17GHz
3.2±0.8
APPLICATION
2.11-2.17GHz band power amplifier for W-CDMA Base Station
QUALITY
IG
GF-47
RECOMMENDED BIAS CONDITIONS
VDS=12V ID=2.0A RG=25ohm for each gate
Absolute maximum ratings (Ta=25C)
Symbol Parameter Ratings Unit
VGDO VGSO Gate to source breakdown voltage -10 V PT *1 Total power dissipation 125 W Tch Cannel temperature 175 C Tstg Storage temperature -65 to +175 C
*1 : Tc=25C
Electrical characteristics
Symbol Parameter Test conditions Limits Unit
GLP Linear Power Gain VDS=12V,ID(RF off)=2.0A,f=2.17GHz
Pout Output Power 47 48 - dBm
ID Drain current - 11 15 A P.A.E. Power added efficiency
Rth(ch-c) *2
*2 :Channel-case
Gate to drain
Thermal resistance delta Vf method - 1 1.2
breakdown voltage -20 V
(Ta=25C)
Pin=22dBm VDS=12V,ID(RF off)=2.0A,f=2.17GHz Pin=39dBm
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable , but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury , fire or property damage. Remember to give due consideration to safety when making your circuit designs , with appropriate measure such as (I) placement of substitutive , auxiliary circuits , (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap.
3.6±0.4
1.9
unit : mm
Keep Safety first in your circuit designs!
Min. Typ. Max.
11 12 - dB
- 48 - %
1
3
20.4 ±0.2
6.0
24.0±0.3
16.2
1
2.0 ± 0.1 5
3
1
2
3
gate
sourc e
drain
C/W
2
0.1
2.4±0.2
Publication Date : Apr., 2011
1
< L/S band internally matched power GaAs FET >
MGFS48B2122
2.11 – 2.17 GHz BAND / 60W
Keep safety first in your circuit designs!
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor product s better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap.
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Notes regarding these materials
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Publication Date : Apr., 2011
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