Mitsubishi MGF0911A Datasheet

MITSUBISHI SEMICONDUCTOR GaAs FET
Nov. ´97
Test conditions
ηadd
ABSOLUTE MAXIMUM RATINGS (Ta=25˚C)
MGF0911A
L, S BAND POWER GaAs FET
DESCRIPTION
FEATURES
• Class A operation
• High output power P1dB=41dBm(TYP) @2.3GHz
• High power gain GLP=11dB(TYP) @2.3GHz
• High power added efficiency
ηadd=40%(TYP) @2.3GHz,P1dB
• Hermetically sealed metal-ceramic package with ceramic lid
APPLICATION
UHF band power amplifiers
QUALITY GRADE
• IG
RECOMMENDED BIAS CONDITIONS
• VDS=10V
• ID=2.6A
• Rg=50
• Refer to Bias Procedure
OUTLINE DRAWING
GF-21
17.5
14.3
9.4
10.0
Unit:millimeters
1
1.0
2-R1.25
22
3
1
GATE
2
SOURCE(FLANGE)
3
DRAIN
Symbol Parameter Ratings
VGDO VGSO ID IGR IGF PT Tch Tstg
*1:TC=25˚C
Gate to drain voltage Gate to source voltage
Drain current Reverse gate current Forward gate current Total power dissipation *1 Channel temperature Storage temperature
-65 to +175
ELECTRICAL CHARACTERISTICS (Ta=25˚C)
Symbol
IDSS gm
VGS(off) P1dB GLP
Rth(ch-c)
*1:Channel to case *2:Pin=25dBm
Saturated drain current 10 Transconductance
Gate to source cut-off voltage Output power at 1dB gain
compression Linear power gain *2
Power added efficiency at P1dB Thermal resistance *1
Parameter
VDS=3V,VGS=0V VDS=3V,ID=2.6A
VDS=3V,ID=20mA
VDS=10V,ID 2.6A,f=2.3GHz
Vf method
-15
-15 10 A 30 63
37.5 175
Unit
V V
mA mA
W ˚C ˚C
40 10
Limits
Typ MaxMin
– –
-2
– –
3.0 –
41 11
40
-5
4.0
Unit
A
– –
S V
dBm
dB
%
˚C/W
Nov. ´97
TYPICAL CHARACTERISTICS
MITSUBISHI SEMICONDUCTOR GaAs FET
MGF0911A
L, S BAND POWER GaAs FET
12
VDS=3V Ta=25˚C
8
4
0
-3
-2 0
-1 6
GATE TO SOURCE VOLTAGE VGS(V)
PO & ηadd vs. Pin
(f=2.3GHz)
ID vs. VGS
45
40
35
VDS=10V ID=2.6A
PO
Gp=11 10 9 dB
ID vs. VDS
12
VGS=-0.5V/Step Ta=25˚C
VGS=0V
8
4
0
0
2 5
1 3 4
DRAIN TO SOURCE VOLTAGE VDS(V)
GLP,P1dB, ID and ηadd vs. VDS
(f=2.3GHz)
ID=2.6A
13 12 11 10 41
39
GLP
P1dB
30
ηadd
25
0
20 30
25
35
INPUT POWER Pin(dBm)
50 40 30 20 10 0
37
40
20
6
ηadd
8
10
VDS(V)
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