Mitsubishi Electric Corporation Semiconductor Group FK10SM-12 Datasheet

MITSUBISHI Nch POWER MOSFET
FK10SM-12
HIGH-SPEED SWITCHING USE
FK10SM-12
DSS ................................................................................600V
¡V ¡r
DS (ON) (MAX) ..............................................................1.18
¡I
D ......................................................................................... 10A
OUTLINE DRAWING Dimensions in mm
4.5
1.5
4.4
0.6 2.8
2
1.0
5.45
q
15.9MAX.
r
φ 3.2
qwe
5.45
4
wr
e
5.0
2
4
q GATE w DRAIN e SOURCE r DRAIN
20.0
19.5MIN.
TO-3P
APPLICATION
Servo motor drive, Robot, UPS, Inverter Fluorecent lamp, etc.
MAXIMUM RATINGS (Tc = 25°C)
Parameter ConditionsSymbol Ratings Unit VDSS VGSS ID IDM IS ISM PD Tch Tstg
Drain-source voltage Gate-source voltage Drain current Drain current (Pulsed) Source current Source current (Pulsed) Maximum power dissipation Channel temperature Storage temperature Weight
VGS = 0V VDS = 0V
Typical value
600 ±30
10 30 10 30
150 –55 ~ +150 –55 ~ +150
4.8
V V A A A A
W
°C °C
g
Feb.1999
ELECTRICAL CHARACTERISTICS (Tch = 25°C)
Symbol UnitParameter Test conditions
V
(BR) DSS
V
(BR) GSS
IGSS IDSS VGS (th) rDS (ON) VDS (ON) yfs Ciss Coss Crss td (on) tr td (off) tf VSD Rth (ch-c) trr
Drain-source breakdown voltage Gate-source breakdown voltage Gate-source leakage current Drain-source leakage current Gate-source threshold voltage Drain-source on-state resistance Drain-source on-state voltage Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Source-drain voltage Thermal resistance Reverse recovery time
ID = 1mA, VGS = 0V IG = ±100µA, VDS = 0V VGS = ±25V , VDS = 0V VDS = 600V, VGS = 0V ID = 1mA, VDS = 10V ID = 5A, VGS = 10V ID = 5A, VGS = 10V ID = 5A, VDS = 10V
VDS = 25V, VGS = 0V, f = 1MHz
VDD = 200V, ID = 5A, VGS = 10V, RGEN = RGS = 50
IS = 5A, VGS = 0V Channel to case IS = 10A, dis/dt = –100A/µs
MITSUBISHI Nch POWER MOSFET
FK10SM-12
HIGH-SPEED SWITCHING USE
Limits
Min. Typ. Max.
600 ±30
— —
2 — —
4.5 — — — — — — — — — —
— — — —
3
0.90
4.50
7.0
1500
170
25 25 35
130
45
1.5 — —
— —
±10
1.18
5.90 — — — — — — — —
2.0
0.83
150
V V
µA
mA
1
V
4
V
S pF pF pF
ns ns ns ns
V
°C/W
ns
PERFORMANCE CURVES
POWER DISSIPATION DERATING CURVE
200
(W)
160
D
120
80
40
POWER DISSIPATION P
0
CASE TEMPERATURE T
C
(°C)
MAXIMUM SAFE OPERATING AREA
5 3
2
1
10
(A)
D
7 5
3 2
0
10
7 5
3
TC = 25°C
2
DRAIN CURRENT I
200150100500
10
–1
7 5
0
10
Single Pulse
23 5710
1
23 5710223 5710
DRAIN-SOURCE VOLTAGE V
DS
tw=10µs
100µs
1ms
10ms
DC
3
(V)
Feb.1999
MITSUBISHI Nch POWER MOSFET
FK10SM-12
HIGH-SPEED SWITCHING USE
OUTPUT CHARACTERISTICS
(TYPICAL)
V
GS
= 20V
10V
TC = 25°C Pulse Test
(A)
D
20
16
PD= 150W
12
8
4
DRAIN CURRENT I
0
0 1020304050
DRAIN-SOURCE VOLTAGE VDS (V)
ON-STATE VOLTAGE VS.
GATE-SOURCE VOLTAGE
(TYPICAL)
40
TC = 25°C Pulse Test
32
(V)
6V
5V
4V
ID = 20A
OUTPUT CHARACTERISTICS
(TYPICAL)
V
GS
= 20V
(A)
D
10
8
TC = 25°C Pulse Test
6
4
2
DRAIN CURRENT I
0
0 4 8 12 16 20
DRAIN-SOURCE VOLTAGE VDS (V)
ON-STATE RESISTANCE VS.
DRAIN CURRENT
(TYPICAL)
2.0 TC = 25°C Pulse Test
1.6
()
V
GS
= 10V
10V
6V
PD = 150W
20V
5V
4V
24
DS (ON)
16
VOLTAGE V
8
DRAIN-SOURCE ON-STATE
0
0 4 8 12 16 20
GATE-SOURCE VOLTAGE V
TRANSFER CHARACTERISTICS
(TYPICAL)
40
32
(A)
D
24
16
8
DRAIN CURRENT I
10A
GS
(V)
TC = 25°C VDS=50V Pulse Test
5A
1.2
DS (ON)
0.8
0.4
RESISTANCE r
DRAIN-SOURCE ON-STATE
0
–1
5710023 5710123 5710
2310
DRAIN CURRENT I
FORWARD TRANSFER ADMITTANCE
VS.DRAIN CURRENT
(TYPICAL)
1
10
V
DS
= 10V
7
Pulse Test
5
(S)
3
fs
2
0
10
7 5
3
ADMITTANCE y
FORWARD TRANSFER
2
D
(A)
TC = 25°C
125°C
2
75°C
0
0 4 8 12 16 20
GATE-SOURCE VOLTAGE V
GS
(V)
–1
10
10–123 5710
DRAIN CURRENT I
0
23 5710
D
(A)
1
Feb.1999
DRAIN-SOURCE VOLTAGE
5
3 2
3
10
7 5
3 2
2
10
CAPACITANCE
7 5
Ciss, Coss, Crss (pF)
3
Tch = 25°C
2
f = 1MHz
GS
= 0V
V
1
10
23 5710
DRAIN-SOURCE VOLTAGE V
CAPACITANCE VS.
(TYPICAL)
0
23 5710
1
23 5710
Ciss
Coss
Crss
DS
2
(V)
23
MITSUBISHI Nch POWER MOSFET
HIGH-SPEED SWITCHING USE
SWITCHING CHARACTERISTICS
3
10
7 5
3 2
2
10
7 5
3
SWITCHING TIME (ns)
2
1
10
–1
23 5710
10
(TYPICAL)
t
t
DRAIN CURRENT ID (A)
d(off)
t
f
d(on)
t
r
FK10SM-12
Tch = 25°C VDD = 200V VGS = 10V R
GEN
= R
GS
= 50
0
23 5710
1
GATE-SOURCE VOLTAGE
VS.GATE CHARGE
(TYPICAL)
20
16
Tch = 25°C ID = 10A
V
DS
= 100V
(V)
GS
200V
12
400V
8
4
GATE-SOURCE VOLTAGE V
0
0 20406080100
g
GATE CHARGE Q
(nC)
ON-STATE RESISTANCE VS.
CHANNEL TEMPERATURE
(t°C)
(25°C)
DS (ON)
DS (ON)
10
1
7 5
VGS = 10V ID = 1/2I Pulse Test
(TYPICAL)
D
3 2
0
10
7 5
3 2
–1
10
0
50 100 150 200 250
DRAIN-SOURCE ON-STATE RESISTANCE r
DRAIN-SOURCE ON-STATE RESISTANCE r
CHANNEL TEMPERATURE Tch (°C)
SOURCE-DRAIN DIODE
FORWARD CHARACTERISTICS
(TYPICAL)
40
VGS = 0V Pulse Test
32
(A)
S
TC = 125°C
24
16
8
SOURCE CURRENT I
0
0 0.8 1.6 2.4 3.2 4.0
SOURCE-DRAIN VOLTAGE V
THRESHOLD VOLTAGE VS.
CHANNEL TEMPERATURE
(TYPICAL)
5.0 VDS = 10V
ID = 1mA
4.0
(V)
3.0
GS (th)
2.0
VOLTAGE V
1.0
GATE-SOURCE THRESHOLD
0
–50 0 50 100 150
CHANNEL TEMPERATURE Tch (°C)
25°C
75°C
SD
(V)
Feb.1999
MITSUBISHI Nch POWER MOSFET
FK10SM-12
HIGH-SPEED SWITCHING USE
BREAKDOWN VOLTAGE VS.
(t°C)
(25°C)
CHANNEL TEMPERATURE
(TYPICAL)
1.4
(BR) DSS
(BR) DSS
VGS = 0V ID = 1mA
1.2
1.0
0.8
0.6
0.4 –50 0 50 100 150
DRAIN-SOURCE BREAKDOWN VOLTAGE V
CHANNEL TEMPERATURE Tch (°C)
DRAIN-SOURCE BREAKDOWN VOLTAGE V
DIODE REVERSE VS.
SOURCE CURRENT d
is/dt
CHARACTERISTIC
(TYPICAL)
(ns)
rr
10
5
3
t
rr
2
2
IS = 10A
GS
= 0V
V
DD
= 250V
V
7 5
3 2
I
rr
1
10
7
REVERSE RECOVERY TIME t
5
1
23 5710
10
Tch = 25°C
ch
= 150°C
T
2
23 5710
SOURCE CURRENT CHARACTERISTIC
3
10
d
is/dt
7
(ns)
rr
GS
= 0V
V
5
DD
= 250V
V
3 2
t
rr
2
10
7 5
3 2
REVERSE RECOVERY TIME t
1
10
0
10
TRANSIENT THERMAL IMPEDANCE
(°C/W)
1
10
(A)
7
rr
(ch–c)
5
th
3 2
0
D=1
10
7
0.5
5 3
0.2
2
0.1
–1
10
7 5
3 2
–2
10
REVERSE RECOVERY CURRENT I
10
–4
23 57
0.05
0.02
0.01
Single Pulse
–3
23 57 23 57 23 57
10
10
10
5
3 2
1
7 5
3 2
0
7 5
3
DIODE REVERSE VS.
(TYPICAL)
= –100A/µs
I
rr
Tch = 25°C
ch
= 150°C
T
23 5710
1
23 5710
SOURCE CURRENT IS (A)
CHARACTERISTICS
10
–2
10
–1
10023 57
P
DM
tw
D=
T
tw
T
2
10 7
5
3 2
1
10 7
5
3 2
0
10
2
10123 57
(A)
rr
REVERSE RECOVERY CURRENT I
2
10
SOURCE CURRENT dis/dt (–A/µs)
TRANSIENT THERMAL IMPEDANCE Z
PULSE WIDTH t
w
(s)
Feb.1999
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