Before servicing this chassis, it is important that the service person reads all SAFETY PRECAUTIONS and the
SAFETY NOTICE in this manual.
SPECIFICATIONS
Power Supply:120V AC, 60 Hz
Power Consumption:19W
Weight:6.7 lb.
External Dimensions:17"x 3-1/4"x12-1/4"
(W/H/D)
Signal System:Standard NTSC
Laser:Semiconductor laser,
wavelength 650 nm
Frequency Range:(Digital Audio)
Audio CD:4 Hz to 20 kHz
DVD Linear -
48 kHZ Sampling: 4 Hz to 22 kHz
96 kHZ Sampling: 4 Hz to 44 kHz
Signal-To-Noise Ratio: More than 112 dB (EIAJ)
Audio Dynamic Range: More than 106 dB (EIAJ)
Harmonic Distortion:Less than 0.001%
Wow and flutter:Below measurable level
(less than ± 0.001%
(W.PEAK)) (EIAJ)
Operating conditions:Temperature: 5 °C to 35°C
Operation status:Horizontal
Video output:1.0 V (p-p), 75Ω, negative
sync., pin jack x 1
S Video output:(Y) 1.0 V (p-p), 75Ω, nega-
tive sync., Mini DIN 4-pin x 1
(C) 0.286 V (p-p), 75Ω
Color Difference output: (Y) 1.0 V (p-p), 75Ω, nega-
tive sync., pin jack x 1
(Cr)/(Cb) 0.7 V (p-p), 75Ω, pin
jack x 2
5. PARTS LIST ................................................................................ 4-5
SECTION 1
General Descriptions
1. PREPARATION FOR SERVICING
The Pickup Head consists of a laser diode that is very susceptible to external static electricity.
Although it may operate properly after replacement, if subjected to electrostatic discharge during replacement, its
life may be shortened. When replacing the laser diode, LSI's and IC's, use a conductive mat, soldering iron with
ground wire, etc. to protect against damage from static electricity.
Ground conductive
wrist strap for body.
Soldering iron
with ground wire
or ceramic type
Conductive mat
1MΩ
The ground resistance
between the ground line
and the ground is less than 10Ω.
Send each LSI hard RST
command and initial command.
Pickup head is positioned at
transmission initial position.
Is tray closed?
Pin 5 of CN502,
TCLS=L
Y
2
NG
Disc presence/absence and
disc judgement
Is a disc present?
Y
DVD or CD initial setting.
N
Tray close operation
Pin 6 of IC601: LDMP = H/L
Pin 7 of IC601: LDMN = L
Tray stops.
Pin 6 of IC601: LDMP = H
Pin 7 of IC601: LDMN = L
N
Laser OFF
Display: INSERT DISC
Monitor screen: NO DISC
1
Is tray closed?
Pin 5 of CN502:
TCLS = L
Y
N
H
DVD single (single-layer)
DVD single
Initial setting.
DVD single
(single-layer)/DVD dual
(dual-layer)/CD?
DVD dual (dual-layer)
DVD dual
Initial setting.
To each disc playback process.
Fig. 1-3-1
1-6
CD
CD
Initial setting.
1
Pickup (P.U.) transmission initial
operation does not occur.
The pickup transmission initial operation is carried out to
determine the initial position by transmitting the pickup to the
innermost position once (start-limit switch (pin 4 of CN503)
develops "L".) and to the external direction at low speed
(start-limit switch develops "H", turning off the switch.).
Does pulse of
1.65V 1.65V develop at
pin 162 of IC502?
Y
Check feed gear.
N
Check BUS between IC502
and IC601 and oscillation.
Fig. 1-3-2
2-1
"No disc" misjudgement display of
N
disc presence.
Does lens move with
UP/DOWN full stroke in
focus direction?
Y
N
3
Does focus search
voltage of 1.65V 0.4V develop
at pin 1 of IC504 (E597)?
Y
Does search signal
output at both edges of focus coil?
(Pins 10 to 13 of CN501)
Y
Check pickup head
and wiring.
Is laser current normal?
Y
Does SBAD signal
develop more than 0.3V?
Y
Check peripheral
circuit of IC601.
N
N
Check IC502.
Check IC505.
Fig. 1-3-3
N
Check IC501.
Lens cleaning.
Replace pickup head.
1-7
2-2
3
Disc kind misjudgement
(Initial setting is NG.)
N
Are FE and SBAD
signals for each disc normal?
Check peripheral
circuit of IC601.
Check IC501.
Lens cleaning.
Replace pickup head.
Fig. 1-3-4
Check laser current.
lop 50 mA
Y
Check pins 14, 15
and 16 of IC501
serial bus.
Check peripheral
circuits of IC501,
Q501 and Q502.
Check laser current.
50 mA lop 90 mA
lop = Voltage between
E522 and E523/3.3Ω
Y
Check peripheral circuits
of IC501, Q501 and Q502.
lop 90 mA
Check wiring for
pickup head.
Replace pickup
mechanism.
Fig. 1-3-5
DVD single (single-layer) disc
detection waveform
FE signal
Pin150 (TP504) of IC502
SBAD signal
Pin152 (TP506) of IC502
V : 500 mV/div
H : 2 ms/div
Fig. 1-3-6Fig. 1-3-7Fig. 1-3-8
1.65V
DVD dual (dual-layer) disc
detection waveform
V : 500 mV/div
H : 2 ms/div
CD disc
detection waveform
V : 500 mV/div
H : 2 ms/div
1-8
(2) Picture appears (PLAY)
PLAY
4
2-1
N
N
Disc motor (D.M.) forced
accelleration (500 ms)
Focus search
Is forcus servo
CLV servo ON.
Tracking balance adjustment
Tracking servo ON.
Focus gain adjustment
Tracking gain adjustment
Y
Y
Y
Y
Y
ON?
Repeat three times.
N
N
N
:
Automatic adjustment is carried
out when a disc is replaced after
power ON.
5
4
6
Focus balance adjustment
RF gain adjustment
N
N
Does NG continue
more than 3 s.?
Y
Disc playback NG
Is address code
possible to read?
Y
Search Picture appears.
Fig. 1-3-9
1-9
4
Disc motor (D.M.) does not rotate.
Do signals output to
pins 4 to 9 of CN501?
Y
Check IC501.
Does pin 117 of IC502
(TP511) PLCK oscillate around
10 MHz ?
Check peripheral circuits
of IC510 and IC503.
Check disc motor and wiring.
5
Focus servo is NG.
N
N
Are FE, SBAD,
FSON signals normal?
Y
Check peripheral circuit of IC601.
Check wiring for
pickup head.
Lens cleaning.
Replace pickup
mechanism.
Y
Fig. 1-3-10
N
Check peripheral
circuit of IC503.
Focus servo ON
signal waveform
Focus search Focus servo on
Fig. 1-3-12
FE signal
Pin 150 (TP504)
of IC502
0.3V
1.65V
0.3V
SBAD signal
Pin 152 (TP506)
of IC502
Fig. 1-3-11
1-10
6
Tracking servo is NG.
Signal waveform at
tracking servo ON (CD)
N
Check IC501.
Fig. 1-3-13
TE signal
Pin 151 (TP503) of IC502
1.65V
RFRP signal
Pin 153 (TP501) of IC502
Is TE signal normal?
Y
Check peripheral
circuit of IC601.
Signal waveform at
tracking servo ON (DVD)
ON searchTracking servo on
Fig. 1-3-14
Search ON (SRCH)
Pin 38 (TP508) of IC502
Fig. 1-3-15
1-11
7
Disc playback is NG (DVD).
Is PLL locked?
(Refer to waveforms.)
Y
Check signal process
system following to IC503.
N
Check peripheral circuits of
IC502 and IC601.
N
Check peripheral circuits
of IC501and IC502.
Fig. 1-3-16
Does pulse of
L = 1.65V and H = 3.3V
develop at pin 131 and
L = 0V and H = 1.65V
develop at pin 132
of IC502?
Y
Does RF output
higher than 1.5 V(p-p)
develop at pin 45 (TP515)
of IC501 ?
Y
Pin 57 of IC501 = 2.4V
Pin 58 of IC501 = 3.0V
Y
N
Check peripheral circuits
of IC502 and IC601.
N
Check IC501.
Lens cleaning.
Pickup mechanism
replacement
DVD RF signal
CD RF signal
Fig. 1-3-17
DVD RF signal
Pin 45 (TP515) of IC501
V : 500 mV/div
H : 50 ns/div
CD RF signal
Pin 45 (TP515) of IC501
PLL works as a servo loop to generate a clock signal for reading
RF signal binary data. With the PLL locked, the eye pattern is
identified clearly when triggered with the read clock PLCK.
Electronic parts are susceptible to static electricity and may easily damaged, so do not forget to take a proper ground-
ing treatment as required.
Many screws are used inside the unit. To prevent missing, dropping, etc. of the screws, always use a magnetized
screwdriver in servicing. Several kinds of screws are used and some of them need special cautions. That is, take care
of the tapping screws securing molded parts and fine pitch screws used to secure metal parts. If they are used improp-
erly, the screw holes will be easily damaged and the parts can not be fixed.
1. REPLACEMENT OF MECHANICAL PARTS
1-1. Cabinet Replacement
1-1-1. Top Cover
1. Remove five screws (1) and remove the top cover (2).
Screw (1)
Top cover (2)
Screws (1)
Screw (1)
1-1-2. Clamper Stay
<Removal>
1. Remove two screws (1).
2. Release two claws and remove the clamper stay (2).
Screws (1)
Clamper stay (2)
Clamper
stay (2)
Claw
A
Clamper stay (2)
Claw
Fig. 2-1-1
2-1
Spring
Claws
Fig. 2-1-2
<Mounting >
1. The spring for tray side pressure is inserted into the
portion “A”. (Refer to Fig. 2-1-2.)
2. By referring to Fig. 2-1-3, insert the spring normally
and mount the clamper stay.
This part should be touch
to the left side of the tray.
NG
1-1-3. Tray Panel
<Tray Ejection>
1. Slide the slider (2) of the mechanism chassis assem-
bly (1) with a screwdriver, etc. in the arrow direction,
so that the tray (3) is ejected.
Note:
• Take care not to damage the pickup and other parts.
OK
Mechanism
chassis assembly
Press down by finger
unitil fix the clamper assembly
NG
Spring
Tray
Screw
driver
Mechanism
chassis assembly (1)
Slider (2)
Tray (3)
Front panel
Fig. 2-1-4
No floating
OK
Fig. 2-1-3
Floating NG
NG
<Tray Panel Removal>
1. Eject the tray (3).
2. Twist the tray panel (4) a little in the arrow A
direction with the tray (3) hold by hand to release
two claws and lift up the tray panel (4) in the arrow B
direction, then the tray panel (4) is removed.
(Refer to Fig. 2-1-5.)
3. When mounting the tray panel (4), insert the tray
panel (4) along the grooves of the both sides of the
tray (3) until clicking.
2-2
B
Tray (3)
• After inserting the tray (3), confirm that the mark of
the gear (4) matches with that of the rack gear on the
tray (first tooth of the gear). (Refer to Fig. B.)
Figure A
Gear (4)
Triangle mark
Tray panel (4)
Tray (3)
A
Claws
Tray panel (4)
Fig. 2-1-5
1-1-4. Front Panel and Tray
1. Remove the flexible cable (1).
2. Release four claws and remove the front panel (2).
3. Pull out the tray (3) to this side.
The first tooth of the gear of
this side on the tray rack gear.
Rack gear
Position of the line
Pickup mechanism
assembly
Gear (4)
Slider
Tray (3)
Gear (4)
Claw
Tray (3)
Claws
Front panel (2)
Flexible cable (1)
Claw
Fig. 2-1-6
Note:
• Insert the tray (3) with the front side of the pickup
mechanism assembly descended. (The slider positions to the left side.)
• The gears are required to match their phases each
other. After setting the gear (4) as shown in the figure
“A”, insert the tray (3). When inserting a tray (3),
push the rack gear side shown by the arrow.
Marking
Figure B
Fig. 2-1-7
1-1-5. Rear Panel
1. Remove three screws (1) and remove the rear panel (2).
Screw (1)
Rear panel (2)
Fig. 2-1-8
2-3
Tape (3)
Connector (2)
Screws (4)
Screws (5)
Flexible cables (1)
OutputPC board (6)
Twist more than 9 times.
1-2. PC Board Replacement
1-2-1. Main PC Board
Note:
• Before removing the main PC board (4), be sure to
short-circuit the laser diode output land.
After replacing, open the land as it was after inserting
the flexible cables (1).
1. Remove the top cover. (Refer to item 1-1-1.)
2. Remove six flexible cables (1) and remove one
connector (3).
3. Remove four screws (2).
4. Release two claws and remove the main PC board (4).
Note:
• When mounting, be sure to twist the wire for the
connector (3) several times.
Pickup head
1-2-2. Output PC Board
1. Remove the rear panel. (Refer to item 1-1-4
2. Peel off the tape (1).
3. Remove the connector (2).
4. Disconnect two flexible cables (3).
5 Remove the wire part of the connector (5) from the
binding band (4).
6. Remove three screws (6) and remove the output PC
board (7).
Note:
• When mounting, keep the wire part of the connector
(5) with the banding band (4).
Output PC board (7)
Tape (1)
Binding band (4)
Screws (6)
Laser diode
output land
Flexible
cables (1)
Main PC board (4)
Claws
Connector (2)
Screws (2)
Connector (3)
Flexible
cables (1)
Flexible cables (3)
Connector (5)
Fig. 2-1-10
Twist more than 7 times.
Fig. 2-1-9
2-4
1-2-3. Power PC board
1. Peel off the tape (1).
2. Remove the connectors (2) and (3).
3. Release the wire part of the connector with the
binding band (4) tightened.
4. Remove three screws (5).
5. Remove two screws (6).
6. Release two claws and remove the power supply PC
board (7).
Power PC board (7)
1-2-4. Front PC Board
1. Remove the front panel. (Refer to item 1-1-4.)
2. Remove four screws (1) and remove the front display
PC board (2)
3. Remove two screws (3) and remove the power switch
PC board (4).
Power SW
PC board (4)
Screws (3)
Front display
PC board (2)
Screws (1)
Screws (5)
Claws
Connector (2)
Tape (1)
Screws (6)
Connector (3)
Fig. 2-1-12
Binding band (4)
Fig. 2-1-11
2-5
1-3. Mechanism Parts
1-3-1. Mechanism Chassis Assembly
Note:
• When removing the mechanism chassis assembly (3),
be sure to short-circuit the laser diode output land
before removing the connector and the flexible
cables.
After replacing, open the land as it was after inserting
the connector and flexible cables.
1. Remove the tray. (Refer to items 1-1-3 and 1-1-4.)
2. Remove three flexible cables (1).
3. Remove four screws (2) and remove the mechanism
chassis assembly (3).
1-3-2. Loading Belt
1. Remove the gear (1) by releasing the claw.
2. Remove the gear (2).
3. Remove the gear (3) and the loading belt (4).
4. Replace the loading belt (4) with a new one.
5. When mounting, perform the reverse order of the
removal.
Note:
• When mounting the loading belt (4), twisting and
attaching of a grease, etc. are not allowed.
Gear (1)
Gear (2)
Mechanism
chassis assembly (3)
Screws (2)
Pickup head
Laser diode
output land
Flexible cables (1)
Loading belt (4)
Gear (3)
Claw
Mechanism
chassis assembly
Fig. 2-1-14
Fig. 2-1-13
2-6
1-3-3. Loading Motor
1. Remove the loading belt. (Refer to item 1-3-2.)
2. Remove two screws (1) and two claws. Then remove
the loading motor (2) (with the loading motor PC
board (3) attached).
3. Desolder the terminal section of the loading motor (2)
and remove the loading motor PC board (3).
4. Replace the loading motor (2) with a new one.
5. When mounting, perform the reverse order of the
removal.
Note:
• When replacing the loading motor, meet the polarity
phase of the terminals. (Mount the motor with the
label positioned as shown in Fig. 2-1-15.)
1-3-4. Sub Chassis (with a pickup mechanism)
1. Turn the mechanism chassis assembly (1) upside down.
2. Remove one screw (2) and release the boss “A” from the
claw. Then remove the sub chassis (3) (with the pickup
mechanism) by sliding in the arrow direction.
3. When mounting, perform the reverse order of the
removal.
Note:
• When mounting the sub chassis (3) (with the pickup
mechanism), first, insert the boss “C” along the
groove of the cam slider up/down cam (4) and next,
the boss “B” and “A”.
• The boss “A” and “B” may be used with washers.
(One or two washers are used to prevent from the slust
rattling. In some cases, no washer is used.)
When the washer(s) is used, be sure to assemble as it
was without losing.
Mechanism
chassis assembly
Claw
Loading motor (2)
Desolder
Fig. 2-1-15
Screws (1)
Claw
Motor label
side
Loading motor
PC board (3)
Screw (2)
Claw
Sub chassis (3)
(with the pickup mechanism attached)
Boss A
Washers
Boss A
Boss C
Boss B
Groove
Groove
Cam slider
up/down cam (4)
Mechanism chassis
assembly (1)
2-7
Claw
Boss B
Groove
Fig. 2-1-16
1-3-5. Pickup Mechanism Assembly
<Removal>
1. Remove four screws (1) and four washers (2) and
then remove the pickup mechanism assembly (3).
<Mounting>
1. Replace the pickup mechanism assembly (3) with a
new one.
2. When mounting, perform the reverse order of the
removal.
Screw (1)
Washers (2)
Damper
(Black)
Damper
(Blue)
Damper
(Black)
1-3-6. Gear B Assembly, Gear A and Rack Gear
Assembly
<Removal>
1. Remove one screw (5) and remove the gear B assem-
bly (1).
2. Remove the gear A (2).
3. Remove one screw (3) and remove the rack gear
assembly (4).
Screw (3)
Gear B assembly (1)
Rack gear
assembly (4)
Gear A (2)
Screw (5)
Claw
Damper
(Blue)
Pickup mechanism
assembly (3)
Fig. 2-1-17
Note:
• The dampers’ color differs when used for the front
side and the rear.
• When mounting the pickup mechanism assembly (2)
with the screws (1), push the pickup mechanism
assembly (2) downward without being caught and
tighten the screws (1) after placing the washer with
the damper bent.
Screw (1)
Washer (2)
Pickup mechanism
assembly (3)
(W6.6P0.5D12)
Pickup mechanism
assembly
Fig. 2-1-19
<Mounting>
1. When mounting, perform the reverse order of the
removal.
2. Mount the gear B assembly (1) by pushing the pickup
head (5) to the disc motor side (arrow A direction)
and shifting the upper gear of the rack gear assembly
(4) in the arrow B direction. (Refer to Fig. 2-1-20.)
3. Fit the positioning holes on the upper gear and lower
gear of the gear B assembly (1) and mount on the
pickup mechanism assembly with the phase matched.
At this time, note that the phase of the gear B
assembly (1) and the gear A (2) shows the status in
the Fig. 2-1-21.
Damper
Fig. 2-1-18
2-8
Positioning holes
Gear B assembly (1)
Pickup Head (5)
A
B
Gear A (2)
Pickup mechanism
assembly
Rack gear assembly (4)
Fig. 2-1-20
Note:
• Mount the gear B assembly (1) and the gear A (2)
with their gear teeth placed more than one tooth at
least inside the shaded portion.
Innermost position
of pickup head
Within the position shown
by the shaded porition.
1-3-7. Feed Motor
<Removal>
1. Remove the gear B assembly (1) and the gear A (2).
(Refer to item 1-3-6.)
2. Remove two screws (1) and remove the feed motor (2)
(with the feed motor PC board (3) attached).
(Refer to Fig. 2-1-22.)
3. Desolder the terminals of the feed motor (2) and
remove the feed motor PC board (3).
<Mounting>
1. Tighten the feed motor (2) on the pickup mechanism
assembly with two screws (1).
2. Insert the feed motor PC board (3) with the position-
ing pin on the chassis matched and solder the
terminals.
3. Perform the reverse order of the removal.
Note:
• After mounting, put the lead wires through the notch
of the pickup mechanism assembly.
• When replacing the loading motor, meet the polarity
phase of the terminals. (Mount the motor with the
label positioned as shown in Fig. 2-1-22.)
Screws (1)
Rack gear assembly (4)
Gear A (2)
Fig. 2-1-21
Gear B assembly (1)
Pickup mechanism
assembly
Notch
Lead wires
Feed motor (2)
Motor label
side
Desolder
Feed motor
PC board (3)
Fig. 2-1-22
2-9
This page is not printed.
2-10
SECTION 3
SERVICING DIAGRAMS
1. STANDING PC BOARDS FOR SERVICING
EU02 Power supply PC board
EU04 Power SW PC board
EU05 Output PC board
EU03 Front display PC board
EU01 Main PC board
Fig. 3-1-1
3-1
2. CIRCUIT SYMBOLS AND SUPPLEMENTARY EXPLANATION
100k
Rated WattageTypeTolerance
100µ
Temperature
response
Rated
voltage
Tolerance
2-1. Precautions for Part Replacement
• In the schematic diagram, parts marked (ex.
F801) are critical part to meet the safety regulations,
so always use the parts bearing specified part codes
(SN) when replacing them.
2-2. Solid Resistor Indication
UnitNone...........Ω
K...........kΩ
M...........MΩ
ToleranceNone...........±5%
B........... ±0.1%
C........... ±0.25%
D...........±0.5%
F...........±1%
G...........±2%
K...........±10%
M...........±20%
Rated Wattage(1) Chip Parts
None ......... 1/16W
(2) Other Parts
None ......... 1/6W
Other than above, described in the Circuit Diagram.
TypeNone...........Carbon film
S...........Solid
R........... Oxide metal film
W...........Metal film
W...........Cement
FR...........Fusible
• Using the parts other than those specified shall violate
the regulations, and may cause troubles such as
operation failures, fire etc.
Eg. 1
FIg. 3-2-1
2-3. Capacitance Indication
Symbol
UnitNone...........F
Rated voltageNone...........50V
Tolerance(1) Ceramic, plastic, and film capacitors of which
Temperature characteristicNone...........SL
(Ceramic capacitor)For others, temperature characteristics are
Static electricity capacitySometimes described with abbreviated letters as
(Ceramic capacitor)shown in Eg. 3.
+
...........Electrolytic, Special electrolytic
NP
...........Non polarity electrolytic
...........Ceramic, plastic
M
...........Film
...........Trimmer
µ...........µF
p........... pF
For other than 50V and electrolytic capacitors,
described in the Circuit Diagram.
capacitance are more than 10 pF.
None...........±5% or more
B........... ±0.1%
C........... ±0.25%
D...........±0.5%
F...........±1%
G...........±2%
(2) Ceramic, plastic, and film capacitors of which
capacitance are 10 pF or less.
None...........more than ±5% pF
B........... ±0.1 pF
C........... ±0.25 pF
(3) Electrolytic, Trimmer
Tolerance is not described.
described. (For capacitors of 0.01 µF and
no indications are described as F.)
Eg. 2
Fig. 3-2-2
Eg. 3
104
4
pF (0.1µF)
10x10
Temperature characteristic
(or Temperature characteristic+
Static electricity capacity tolerance)
Fig. 3-2-3
3-2
2-4. Inductor Indication
10µ
TypeTolerance
UnitNone...........Η
µ...........µH
m...........mH
ToleranceNone...........±5%
B........... ±0.1%
C........... ±0.25%
D...........±0.5%
F...........±1%
G...........±2%
K...........±10%
M...........±20%
2-5. Waveform and Voltage Measurement
• The waveforms for CD/DVD and RF shown in the
circuit diagrams are obtained when a test disc is
played back.
• All voltage values except the waveforms are expressed
in DC and measured by a digital voltmeter.
Eg. 4
Type name
Fig. 3-2-4
Eg. 5
Fig. 3-2-5
3-3
2-6. When Replaced ROM ICs or Upgraded Firmware
1. When replaced the following ROM ICs, it is necessary
to write the data into the new ICs.
1) IC615 (firmware)
2) IC613 (Setup default data and other information)
2. When the firmware is upgraded, rewriting the new
firmware into IC615 may be requested for servicing.
DATA UPDATE KIT
(RS-232C Interface/cable)
RS-232C
cable
3. Connect a computer to the main PC board of the DVD
video player with using DATA UPDATE KIT (P/No.
79080074). (Fig. 3-2-6)
4. Writing operation
Refer to the instruction attached to the data floppy
disc.
Computer
(MS-DOS/PC-DOS)
Fig. 3-2-6
Note:
• The firmware and setup data floppy discs are not available as service parts.
8 bit, 4:2:2 Multiplexed Y/Cr/Cb pixel port
(P7-P0) or
16 bit Y/Cr/Cb pixel port (P15-P0).
P0 represents the LSB.
Ground
Power supply
8 bit, 4:2:2 Multiplexed Y/Cr/Cb pixel port
(P7-P0) or
16 bit Y/Cr/Cb pixel port (P15-P0).
P0 represents the LSB.
HSYNC (Modes 1 & 2) control signal.
Master Mode: control signal output
Slave Mode: control signal acceptance
Dual function field (Mode 1) and VSYNC
(mode 2) control signal.
Master Mode: control signal output
Slave Mode: control signal acceptance
Video blanking control signal. The pixel
inputs are ignored when this is logic level
"0". This signal is optional.
TTL address input. This signal set up the
LSB of the MPU address.
Ground pin
Power supply
Ground pin
This pin resets the on-chip timing generator
and sets the ADV7170 into default mode.
NTSC operation, timing slave mode 0, 8 bit
operation, 2 x composite & S VHS OUT.
MPU port serial interface clock input
MPU port serial data input/output
Compensation pin. Connect a 0.1µF
capacitor from COMP to VAA. For
optimum dynamic performance in low
power mode, the value of the COMP
capacitor can be varied as described in
low power mode section.
IC Name
Function
EE-PROM
Video Encorder
AV Decorder
SERVO & Data Processor
RF Signal processing IC
5-CH Motor Driver
DA Converter
Main Micro Processor
Track Buffer
Flash ROM
3D DNR
Function
Detail
Setup default, memorization of specification setting.
Built-in D/A converter. Encodes digital video signal to analog video
signal of NTSC/PAL system.
Decryption, MPEG-2 Decode, Audio Decode, Sub Picture Decode,
OSD.
Performs servo control of DVD or CD, and performs demodulation
and correction of RF signal.
Equalizes of playback RF signal and generates error detection signal
required for each servo operation.
5ch driver for motor driving.
Stereo audio DA converter with a dual PPL built-in.
When connecting HWID to VDD,
become data lines 15:12 of 16 bit host
data bus. When connecting HWID to
GND, the lines become CD-DSP serial
input port pins defined as below.
CD-DSP data error input
CD-DSP LR clock (frame) input
CD-DSP data input
CD-DSP bit clock input
When connecting HWID to VDD,
become data lines 11:8 of 16 bit host
data bus. When connecting HWID to
GND, the lines become sub code port
pins defined as below.
Sub code bit clock output
Sub code bit clock input
Sub code sync signal display input
Sub code frame sync input
8 I.s. host data bus. When connecting
HWID to GND, only the 8 I.s. signal is
defined as a host data signal. When
connecting HWID to VDD, 8 I.s. line is
used for of 16 bit data bus.
Host address input. Inputs address
signal that specifies physical address
inside MD36710X.
Host protocol, type A
(HTYPE=GND): HR/W#. Decides
direction of host access.
Host protocol, type B (HTYPE=VDD):
HWR#. Host writing input (active low).
Host chip select input. Active low.
Host protocol, type A (HTYPE=GND):
HDS#.
Data strobe input (active low).
Host protocol, type B (HTYPE=VDD):
HRD#.
Host writing input (active low).
Host ready output (active high). Use
this signal to transmit bit stream via
host bus. External pull-up resistor is
required.
Transmission of CodBurstLen byte
length is determined as 1 packet.
Check that the signal is active before
transmitting each packet. Possible to
write the bit stream serially up to
CodBurstLen byte to MD36710X.
Host acknowledge output (active low).
Protocol is type A, MD36710X asserts
this output and notify completion of
reading or writing cycle.
If this signal is not active, 3-state
condition occurs (External pull-up
resistor is required.).
If protocol is type B, the signal
functions as wait output signal. When
high speed host (microprocessor) is
used, this signal may not be used.
Interruption requirement (active low).
Deassert when host reads interruption
status resister of MD36710X. Also
deassert after host masks interruption in
the interrupt mask resister of
MD36710X or reseting.
If HIRQ# is not asserted, 3-state
condition occurs (External pull-up
resistor is required.)
Pin
No.
35
36
37
130
141
142
GPI/O signal (4 pins)
2
122
123
159
PLL signal (6 pins)
126
128
129
135
137
136
Name
HWID
HORD
HTYPE
STNDBY#
RESET#
IDLE
GPSI
GPAI/O [1:0]
GPSO
GCLK1
XO
GCLK
PLLCFG [1:0]
PLLCA
Function
Determines data bus width of host
interface. It can be changed only
during reset. Host interface of
MD36710X is set to 8 bit width at low
level (GND) and set to 16 bit width at
high level (VDD).
Determines byte order for data bus of
host interface in 16 bit width setting.
(HWID: VDD).
It can be changed only during reset.
Set MD36710X to obtain I/O signals of
m.s. byte in HD [15:8] at low level
(GND) and those in HD [7:0] at high
level.
If HWID is GND level, connect to
GND.
Determines protocol of host bus. It
can be changed only during reset.
Sets MD36710X to type A at low level
and type B at High level.
Standby input (active low). All output
pins and bidirectional pins become
float state if asserting with RESET#
and MD36710X is cut electrically from
peripheral circuits. All internal
operation stop and power
consumption is confined to the
minimum.
Contents of SDRAM are not stored at
stanby.
Reset input (active low). Initializing
process of MD36710X starts at the
time deasserting is carried out from
assert state.
Idle, init or reset states display output
(active high).
General input controlled by DVP micro
code.
General bidirectional pin controlled by
ADP micro code. After resetting, this
pin is defined as an input pin. ADP
command specifies the setting.
General output conrolled by DVP
micro code.
Master clock input for audio. Must
be connected to GCLK for usual
operation.
Output to the crystal connected to
GCLK. If the crystal is not used for
GCLK, XO is not connected.
Clock for main processor or crystal
input.
PLL configuration input. It can be
changed only during reset. Both pins
must be connected to GND (digital)
for usual operation.
Capacitor connection pin for PLL.
Connect the other terminal of the
capacitor to PLLGND.
VCLKx2 signal is divided by 2. Used
as a qualifier of data and sync signal.
Video master/slave selection input. At
high level, video sync in MD36710X
enters master mode. (Video sync and
clock signals are developed.) After
low level, video sync enters slave
mode. (Video sync and clock signals
are entered.)
Only during reset, setting of terminal
can be changed.
Video enable input (active low). When
active, MD 36710X develops video
data. When deasserting, pixel output
becomes 3-state condition. (But sync
and clock signals are kept to be
active.)
Input is changeable at any time but
becomes effective at the next
VCLKx2.
Vertical sync bidirectional signal pin.
Polarity and length are programmable.
Horizontal sync bidirectional signal
pin. Polarity and length are
programmable.
Field identification bidirectional signal
pin. Polarity is programmable.
At 16 bit video mode (Video 8=0),
develop luminance signals. At 8 bit
mode (Video 8=1), develop luminance
and color difference signals
multiplexed in time sequence
according to the ITU-R656 standard
(in no relation to presence of SAV and
EAV sync code).
Composite blank output. Waveforms are
programmable other than polarity.
At 16 bit video mode (Video 8=0),
develop color difference signal. At 8
bit mode (Video 8=1), m.s. line 3 pin
(c [7:5]) is not used, I.s.5 pin (C [4:0])
is used as input from external OSD
device.
On-chip OSD palette selector. Selects
OSD Palette0 at low level and OSD
Plette1 at high level.
OSD pixel input. Used as an entry
signal to on-chip OSD palette.
Main video clock input or output.
Serial input of PCM stereo audio for
ADC
Serial output of PCM stereo audio for
DAC. After reset, develop signals of
low level. Only AOUT [0] supports 24
bit sample width.
S/PDIF transmitter output. Possible to
connected to DAC as the forth audio
output (AOUT [3]). After reset,
develop signal of low level.
LR clock output of AOUT [3..0] and
AIN. Becomes square waveform in
sampling frequency. Polarity of LR is
programmable.
Bit clock output of AOUT [3..0] and
AIN. At rising/falling edges
(programmable) AOUT is developed
and AIN is latched.
Pin
No.
132
DVD-DSP interface (13 pins)
143
144
146
147
148
149
151
|
154
156
|
158
SDRAM interface (35 pins)
38
39
42
|
47
49
|
52
54
55
56
57
59
60
61
62
64
|
67
69
|
72
74
|
79
82
TEST signal (3 pins)
83
127
139
Name
AMCLK
DVDERR
DVDSOS
DVDVALID
DVDSTRB
DVDREQ
DVDDAT [7:0]
RAMADD [11:0]
RAMCS0#
RAMCS1#
RAMRAS#
PCLK
RAMCAS#
RAMWE#
RAMDQM
RAMDAT [15:0]
TESTMODE
SCNENBL
ICEMODE
Audio master clock I/O. 384 fs, 256 fs,
192 fs and 128 fs of sampling
frequency can be selected
(programmable).
DVD-DSP error input (Polarity
programmable)
DVD-DSP data selector start input
(Polarity programmable)
DVD-DSP data effective input
(Polarity programmable)
DVD-DSP data bit strobe (clock)
input. Polarity programmable.
DVD-DSP data requirement output
(Polarity programmable)
DVD-DSP data input bus
SDRAM address bus output
SDRAM chip select (active low)
output. Lower bit for 2 Mbyte device.
SDRAM ship select (active low).
Upper bit for 2 Mbyte device.
Row selection of SDRAM (active low)
output
SDRAM clock output (same as
internal process clock).
Column selection of SDRAM (active
high) output
SDRAM write enable (active low)
output
SDRAM data masking (active high)
output
SDRAM bidirectional data bus
Test pin. Connects to VDD for normal.
Test pin. Connects to GND for normal.
Test pin. Connects to VDD for normal.
Function
3-28
Table 3-5-6 PCM1727Table 3-5-5 MD36710X (5/5)
Pin
No.
Name
Power signal (35 pins)
GND
1
40
41
53
68
80
81
93
108
120
121
125
131
145
160
VDD
8
28
33
48
58
63
73
86
78
113
133
140
150
155
PLLGND (GNDA)
134
PLLVDD (VDDA)
138
Function
Digital GND
Digital power supply (3.3V)
GND of internal PLL circuit
Power supply of internal PLL circuit
Pin
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Name
XT1
PGND
V
CP
MCKO
RSV
SCKO3
ML
MC
MD
RSTB
V
R
OUT
AGND
V
CA
V
L
OUT
CAP
ZERO
BCK
DATA
LRCK
SCKO2
SCKO1
V
DD
DGND
XT2
Function
PLL master clock input or crystal
connector terminal
PLL GND
PLL power supply
Master clock buffer output
Not connected. Use the pin with open.
PLL-2 generation system clock output.
Serial control data enable input.
Serial control data clock input.
Serial control data, data input.
External reset input, reset at L.
(1)
(1)
(1)
(1)
Rch analog audio output
Analog GND
Analog power supply
Lch analog audio output
Internal analog bias
(connected with a bypass capacitor)
Infinity zero detection output.
PCM audio data, bit clock input.
PCM audio data, data input.
PCM audio data, LRCK input (fs)
(2)
(3)
(3)
(3)
PLL-1 generation system clock output
PLL-1 generation system clock output
Digital power supply
Digital GND
Crystal oscillator connection terminal,
connected to GND at external clock input.
Note:
(1) With internal pull-up. Schmitt trigger input.
(2) Open drain output.
(3) Schmitt trigger input.
Port 0: I/O port.
Data 0–7: data bus 0–7.
Function is selectable by setting of AM0/1
terminal.
It becomes high impedance at no external
memory access.
Port 1: I/O port.
Data 8–15: data bus 8–15.
Function is selectable by setting of AM0/1
terminal.
It becomes high impedance at no external
memory access.
Port 2: I/O port.
Data 16–23: data bus 16–23.
Function is selectable by setting of AM0/1
terminal.
It becomes high impedance at no external
memory access.
Port 3: I/O port.
Data 24–31: data bus 24–31.
Function is selectable by setting of AM0/1
terminal.
It becomes high impedance at no external
memory access.
Port 4: I/O port.
Address 0–7: address bus 0–7.
Function is selectable by setting of AM0/1
terminal.
Signal does not change at no external
memory access.
Port 5: I/O port.
Address 8–15: address bus 8–15.
Function is selectable by setting of AM0/1
terminal.
Signal does not change at no external
memory access.
Port 6: I/O port.
Address 16–23: address bus 16–23.
Function is selectable by setting of AM0/1
terminal.
Signal does not change at no external
memory access.
Port 70: output port. (Initializes to “1” output.)
Read: strobe signal reading external memory.
Function is selectable by setting of AM0/1
terminal.
Strobe signal is not developed at no
external memory access.
Port 71: output port. (Initializes to “1” output.)
Write: strobe signal writing D0–D7 of
external memory.
Strobe signal is not developed at no
external memory access.
Port 72: output port. (Initializes to “1” output.)
Write: strobe signal writing D8–D15 of
external memory.
Strobe signal is not developed at no
external memory access.
Port 73: output port. (Initializes to “1” output.)
Write: strobe signal writing D16–D23 of
external memory.
Strobe signal is not developed at no
external memory access.
Port 74: output port. (Initializes to “1” output.)
Write: strobe signal writing D24–D31 of
external memory.
Strobe signal is not developed at no
external memory access.
Pin
No.
70
69
67
66
65
64
63
62
49
60
59
58
57
56
Name
P75
BUSRQ
P76
BUSAK
P80
CS0
P81
CS1
RAS0
P82
CS2
P83
CS3
RAS1
P84
CS4
P85
CS5
P86
WAIT
PA 0
CAS0
LCAS0
PA 1
UCAS0
PA 2
OE0
PA 3
OE1
PA 4
WE0
Function
Port 75: I/O port.
Bus request: signal with memory interface
terminal requested to be high impedance.
The following pins become high
impedance, but no change is made when
used as a port.
A0 – A23, D0 – D31, RD, WRLL, WRLH,
WRHL, WRHH, CS0 – CS5, OE0 – OE1,
WE0–WE1, RAS group, CAS group
Port 75: output port. (Initializes to “1” output.)
Bus acknowledge: signal, that indicates
request of BUSRQ received.
Port 80: output port. (Initializes to “1” output.)
Chip select 0: “L” level is developed if
address is within the assigned address
range.
Port 81: output port. (Initializes to “1” output.)
Chip select 1: “L” level is developed if
address is within the assigned address
range.
Low address strobe 0: RAS strobe signal
for DRAM is developed if address is within
the assigned address range.
Port 82: output port. (Initializes to “0” output.)
Chip select 2: “L” level is developed if
address is within the assigned address
range.
Port 83: output port. (Initializes to “1” output.)
Chip select 3: “L” level is developed if
address is within the assigned address
range.
Low address strobe 1: RAS strobe signal
for DRAM is developed if address is within
the assigned address range.
Port 84: output port. (Initializes to “1” output.)
Chip select 4: “L” level is developed if
address is within the assigned address
range.
Port 85: output port. (Initializes to “1” output.)
Chip select 5: “L” level is developed if
address is within the assigned address
range.
Port 86: I/O port.
Wait: Bus wait request signal
Port A0: output port. (Initializes to “1” output.)
Column address strobe 0: CAS strobe
signal for DRAM is developed if address is
within the assigned address range.
Lower column address strobe 0: lower CAS
strobe signal for DRAM is developed if
address is within the assigned address
range.
Port A1: output port. (Initializes to “1” output.)
Upper column address strobe 0: upper CAS
strobe signal for DRAM is developed if
address is within the assigned address
range.
Port A2: output port. (Initializes to “1” output.)
Out enable 0: out enable signal for DRAM is
developed.
Port A3: output port. (Initializes to “1” output.)
Out enable 1: out enable signal for DRAM is
developed.
Port A4: output port. (Initializes to “1” output.)
Write enable 0: write enable signal for
DRAM is developed.
Port B0: output port. (Initializes to “1” output.)
Column address strobe 1: CAS strobe
signal for DRAM is developed if address is
within the assigned address range.
Lower column address strobe 1: lower CAS
strobe signal for DRAM is developed if
address is within the assigned address
range.
Lower-lower column address strobe 1:
lower-lower CAS strobe signal for DRAM is
developed if address is within the assigned
address range.
Port B1: output port. (Initializes to “1” output.)
Upper column address strobe 1: upper CAS
strobe signal for DRAM is developed if
address is within the assigned address
range.
Lower-upper column address strobe 1:
lower-upper CAS strobe signal for DRAM is
developed if address is within the assigned
address range.
Port B2: output port. (Initializes to “1” output.)
Upper-lower column address strobe 1:
upper lower CAS strobe signal for DRAM is
developed if address is within the assigned
address range.
Port B3: output port. (Initializes to “1” output.)
Upper-upper column address strobe 1:
upper-upper CAS strobe signal for DRAM is
developed if address is within the assigned
address range.
Port B4: output port. (Initializes to “1” output.)
Write enable 1: write enable signal for
DRAM is developed.
Port C0: I/O port.
Timer output 1: 8 bit timer 0 or timer 1 is
developed.
Timer output 7: 16 bit timer 7 is developed.
Port C1: I/O port.
Timer output 3: 8 bit timer 2 or timer 3 is
developed.
Timer output B: 16 bit timer B is developed.
Port D0: I/O port.
Timer output 4: 16 bit timer 4 is developed.
Port D1: I/O port.
Timer input 4: 16 bit timer 4 is entered.
Interrupt request terminal 4: programmable
at rising/falling edges.
Port D2: I/O port.
Timer input 5: 16 bit timer 4 is entered.
Interrupt request terminal 5: Interrupt
request terminal at rising edge.
Port D4: I/O port
Timer output 6: 16 bit timer 6 is developed.
Port D5: I/O port.
Timer input 6: 16 bit timer 6 is entered.
Interrupt request terminal 6: programmable
at rising/falling edges.
Port D6: I/O port.
Timer input 7: 16 bit timer 6 is entered.
Interrupt request terminal 7: Interrupt
request terminal at rising edge.
Port E0: I/O port.
Timer output 8: 16 bit timer 8 is developed.
Port E1: I/O port.
Timer input 8: 16 bit timer 8 is entered.
Interrupt request terminal 8: programmable
at rising/falling edges.
Port E2: I/O port.
Timer input 9: 16 bit timer 8 is entered.
Interrupt request terminal 9: Interrupt
request terminal at rising edge.
Pin
No.
14
15
16
24
25
26
27
28
29
152
|
159
6
7
8
9
10
31
32
4
5
43
48
36
38
40
Name
PE4
TOA
PE5
TIA
INTA
PE6
TIB
INTB
PF0
TXD0
PF1
RXD0
PF2
CTS0
SCLK0
PF4
TXD1
PF5
RXD1
PF6
CTS1
SCLK1
AN0 – AN7
PH0
TC0
PH1
TC1
PH2
TC2
PH3
TC3
PH4
INT0
NMI
WDTOUT
AM0,1
TEST0,1
CLK
X1/X2
Function
Port E4: I/O port.
Timer output A: 16 bit timer A is developed.
Port E5: I/O port.
Timer input A: 16 bit timer A is entered.
Interrupt request terminal A: programmable
at rising/falling edges.
Port E6: I/O port.
Timer input B: 16 bit timer A is entered.
Interrupt request terminal B: Interrupt
request terminal at rising edge.
Port F0: I/O port.
Serial transfer data 0 (open drain output
capability)
Port F1: I/O port.
Serial reception data 0
Port F2: I/O port.
Serial transfer capability 0
Serial clock I/O 0
Port F4: I/O port.
Serial transfer data 1 (open drain output
capability)
Port F5: I/O port.
Serial reception data 1
Port F6: I/O port.
Serial transfer capability 1
Serial clock I/O 1
Analog input: input of 10 bit A/D converter.
Port H0: I/O port.
Terminal count 0: Strobe output signal is
developed at “H” level when count value of
micro DMA channel 0 is 0.
Port H1: I/O port.
Terminal count 1: Strobe output signal is
developed at “H” level when count value of
micro DMA channel 1 is 0.
Port H2: I/O port.
Terminal count 2: Strobe output signal is
developed at “H” level when count value of
micro DMA channel 2 is 0.
Port H3: I/O port
Terminal count 3: Strobe output signal is
developed at “H” level when count value of
micro DMA channel 3 is 0.
Port H4: I/O port (schmitt input)
Interrupt request terminal 0: programmable
at level/rising edge. (Schmitt input)
Nonmaskable interrupt request terminal:
interrupt request terminal at falling edge.
Available at rising edge by using a program.
Watchdog timer output terminal
Address mode: selects start-up external
data bus width after releasing reset.
AM1= “0” AM0= “0”:
starts with 8 bit external data bus
AM1= “0” AM0= “1”:
starts with 16 bit external data bus
AM1= “1” AM0= “0”:
starts with 32 bit external data bus
AM1= “1” AM0= “1”:
starts from internal ROM
Sub output circuit is provided depending on units. For more information, please refer to the circuits below.
EU52 SUB-OUTPUT
CW92
NP
47µ
10V-NP
CNW91
B88-PH-K-S
Lch +6dB
Lch OUT
Lch 0dB
Rch +6dB
Rch OUT
Rch 0dB
CTL
9V
8
7
6
5
4
3
2
1
EU05 OUTPUT (Old type)
DW91
1SS133
10 9
876
1
2345
NP
CW91
47µ
10V-NP
NCNC
SW91
EG2-9
3-47
Fig. 3-5-8
This page is not printed.
3-48
5-5. Motor System Circuit Diagram
PartLoca-
No.tion
CN1A3
H1D2
R1D4
R2D3
S1B5
3-49
3-50
Fig. 3-5-9
PartLoca-
No.tion
CN2F2
MM1E5
SW1F5
SW2G5
SW3G5
SECTION 4
PARTS LIST
SAFETY PRECAUTION
The parts identified by mark are critical for safety. Replace only with part number specified.
The mounting position of replacement is to be identical with originals.
The substitute replacement parts which do not have the same safety characteristics as specified in the parts list may create
shock, fire or other hazards.
NOTICE
The part number must be used when ordering parts in order to assist in processing, be sure to include the model number
and description.
Parts marked # are of chip type and mounted on original PC boards.
However, when they are placed for servicing works, use discrete parts listed on the parts list.
ABBREVIATIONS
1. Integrated Circuit (IC)
2. Capacitor (Cap)
• Capacitance Tolerance (for Nominal Capacitance more than 10pF)
Table 4-2-1
Symbol
Tolerance %B± 0.1C± 0.25D± 0.5
Symbol
Tolerance %
• Capacitance Tolerance (for Nominal Capacitance 10pF or less)