CM75DY-34A
MITSUBISHI IGBT MODULES
CM75DY-34A
HIGH POWER SWITCHING USE
¡IC ..................................................................... 75A
¡V
CES ......................................................... 1700V
¡Insulated Type
¡2-elements in a pack
APPLICATION
General purpose inverters & Servo controls, etc
OUTLINE DRAWING & CIRCUIT DIAGRAM Dimensions in mm
94
232317
17
2-φ6.5 MOUNTING HOLES
C2E1
13
48
12 12 12
16 7 16 7 16
–0.5
+1
29
E2
80
LABEL
±0.25
C1
E2 G2
E1G1
4184
3-M5 NUTS
TAB #110. t=0.5
21.2 7.5
C2E1
20
(14)
12.5
(SCREWING DEPTH)
E2
CIRCUIT DIAGRAM
4
E2 G2G1 E1
C1
Jun. 2007
ABSOLUTE MAXIMUM RATINGS (Tj = 25°C, unless otherwise specified)
Symbol Parameter
V
CES
VGES
IC
ICM
IE (
IEM (
PC (
Tj
Tstg
Viso
Collector-emitter voltage
Gate-emitter voltage
Collector current
Note 1
)
Emitter current
Note 1
)
Maximum collector dissipation
Note 3
)
Junction temperature
Storage temperature
Isolation voltage
—
Torque strength
—
Weight
—
G-E Short
C-E Short
DC, T
C = 111°C
Pulse (Note 2)
Operation (Note 2)
Pulse (Note 2)
C = 25°C
*1
T
Main terminal to base plate, AC 1 min.
Main terminal M5
Mounting holes M6
Typical value
Conditions UnitRatings
*1
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)
Symbol
ICES
V
GE(th)
IGES
VCE(sat)
Cies
Coes
Cres
QG
td(on)
tr
td(off)
tf
trr (
Qrr (
VEC(
Rth(j-c)Q
th(j-c)R
R
th(c-f)
R
RG
1 : Tc, Tf measured point is just under the chips.
*
2 : Typical value is measured by using Shin-Etsu Chemical Co.,Ltd “G-746”.
*
Note 1. I
Collector cutoff current
Gate-emitter threshold
voltage
Gate leakage current
Collector to emitter saturation
voltage
Input capacitance
Output capacitance
Reverse transfer capacitance
Total gate charge
Turn-on delay time
Turn-on rise time
Turn-off delay time
Turn-off fall time
Reverse recovery time
Note 1
)
Reverse recovery charge
Note 1
)
Emitter-collector voltage
Note 1
)
Thermal resistance
Contact thermal resistance
External gate resistance
E, IEM, VEC, trr & Qrr represent characteristics of the anti-parallel, emitter to collector free-wheel diode (FWDi).
2. Pulse width and repetition rate should be such that the device junction temperature (T
3. Junction temperature (T
4. Pulse width and repetition rate should be such as to cause negligible temperature rise.
Parameter
VCE = VCES, VGE = 0V
I
C = 7.5mA, VCE = 10V
±V
T
j = 25°C
T
j = 125°C
CE = 10V
V
V
GE = 0V
CC = 1000V, IC = 75A, VGE = 15V
V
V
CC = 1000V, IC = 75A
V
GE1 = VGE2 = 15V
R
G = 6.4Ω, Inductive load switching operation
I
E = 75A
E = 75A, VGE = 0V
I
IGBT part (1/2 module)
FWDi part (1/2 module)
Case to fin, Thermal compound applied (1/2 module)
j) should not increase beyond 150°C.
GE = VGES, VCE = 0V
Test conditions
I
C = 75A, VGE = 15V
*1
*1
j) does not exceed Tjmax rating.
MITSUBISHI IGBT MODULES
CM75DY-34A
HIGH POWER SWITCHING USE
1700
±20
(Note 2)
*1,*2
Min. Max.
—
5.5 8.5
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
6.4
75
150
75
150
780
–40 ~ +150
–40 ~ +125
3500
2.5 ~ 3.5
3.5 ~ 4.5
310
Limits
Typ.
—
1
7.0 V
—
2.2
2.45
—
—
—
500
—
—
—
—
—
7.5
—
—
—
0.022
—
2.0
2.8
—
18.5
2.1
0.4
—
200
150
550
350
300
—
3.0
0.16
0.29
—
64
V
V
A
A
W
°C
°C
V
N • m
g
Unit
mA
µA
V
nF
nC
ns
µC
V
°C/W
Ω
Jun. 2007
2