MITSUBISHI CM75DY-34A User Manual

CM75DY-34A
MITSUBISHI IGBT MODULES
CM75DY-34A
HIGH POWER SWITCHING USE
¡IC ..................................................................... 75A
¡V
¡Insulated Type ¡2-elements in a pack
APPLICATION
General purpose inverters & Servo controls, etc
OUTLINE DRAWING & CIRCUIT DIAGRAM Dimensions in mm
94
232317
17
2-φ6.5 MOUNTING HOLES
C2E1
13
48
12 12 12
16 7 16 7 16
–0.5
+1
29
E2
80
LABEL
±0.25
C1
E2 G2
E1G1
4184
3-M5 NUTS
TAB #110. t=0.5
21.2 7.5
C2E1
20
(14)
12.5
(SCREWING DEPTH)
E2
CIRCUIT DIAGRAM
4
E2 G2G1 E1
C1
Jun. 2007
ABSOLUTE MAXIMUM RATINGS (Tj = 25°C, unless otherwise specified)
Symbol Parameter
V
CES
VGES IC ICM IE ( IEM ( PC ( Tj Tstg Viso
Collector-emitter voltage Gate-emitter voltage
Collector current
Note 1
)
Emitter current
Note 1
)
Maximum collector dissipation
Note 3
)
Junction temperature Storage temperature Isolation voltage
Torque strength
Weight
G-E Short C-E Short DC, T
C = 111°C
Pulse (Note 2) Operation (Note 2) Pulse (Note 2)
C = 25°C
*1
T
Main terminal to base plate, AC 1 min. Main terminal M5 Mounting holes M6 Typical value
Conditions UnitRatings
*1
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)
Symbol
ICES
V
GE(th)
IGES
VCE(sat)
Cies Coes Cres QG td(on) tr td(off) tf trr ( Qrr ( VEC( Rth(j-c)Q
th(j-c)R
R
th(c-f)
R RG
1 : Tc, Tf measured point is just under the chips.
*
2 : Typical value is measured by using Shin-Etsu Chemical Co.,Ltd “G-746”.
*
Note 1. I
Collector cutoff current Gate-emitter threshold voltage Gate leakage current Collector to emitter saturation voltage Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Turn-on delay time Turn-on rise time Turn-off delay time Turn-off fall time Reverse recovery time
Note 1
)
Reverse recovery charge
Note 1
)
Emitter-collector voltage
Note 1
)
Thermal resistance
Contact thermal resistance
External gate resistance
E, IEM, VEC, trr & Qrr represent characteristics of the anti-parallel, emitter to collector free-wheel diode (FWDi).
2. Pulse width and repetition rate should be such that the device junction temperature (T
3. Junction temperature (T
4. Pulse width and repetition rate should be such as to cause negligible temperature rise.
Parameter
VCE = VCES, VGE = 0V
I
C = 7.5mA, VCE = 10V
±V T
j = 25°C
T
j = 125°C
CE = 10V
V V
GE = 0V
CC = 1000V, IC = 75A, VGE = 15V
V
V
CC = 1000V, IC = 75A
V
GE1 = VGE2 = 15V
R
G = 6.4Ω, Inductive load switching operation
I
E = 75A
E = 75A, VGE = 0V
I IGBT part (1/2 module) FWDi part (1/2 module) Case to fin, Thermal compound applied (1/2 module)
j) should not increase beyond 150°C.
GE = VGES, VCE = 0V
Test conditions
I
C = 75A, VGE = 15V
*1
*1
j) does not exceed Tjmax rating.
MITSUBISHI IGBT MODULES
CM75DY-34A
HIGH POWER SWITCHING USE
1700
±20
(Note 2)
*1,*2
Min. Max.
5.5 8.5
— — — — — — — — — — — — — — — — —
6.4
75
150
75 150 780
–40 ~ +150 –40 ~ +125
3500
2.5 ~ 3.5
3.5 ~ 4.5 310
Limits
Typ.
1
7.0 V
2.2
2.45 — — —
500
— — — — —
7.5 — — —
0.022 —
2.0
2.8 —
18.5
2.1
0.4 —
200 150 550 350 300
3.0
0.16
0.29
— 64
V V
A
A
W
°C °C
V
N • m
g
Unit
mA
µA
V
nF
nC
ns
µC
V
°C/W
Jun. 2007
2
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