MITSUBISHI CM300DY-34A User Manual

CM300DY-34A
MITSUBISHI IGBT MODULES
CM300DY-34A
HIGH POWER SWITCHING USE
¡IC ...................................................................300A
¡V
¡Insulated Type ¡2-elements in a pack
APPLICATION
General purpose inverters & Servo controls, etc
OUTLINE DRAWING & CIRCUIT DIAGRAM Dimensions in mm
110
80
62±0.25
3-M6 NUTS
93±0.25
25 25
141414
G2G1 E2E1
30
C1E2C2E1
21.5
6 15 6
4-φ6.5 MOUNTING HOLES
(20.5)
11
SCREWING DEPTH
4
+1.0
29
–0.5
LABEL
18718718
TAB #110. t=0.5
8.521.2
C2E1
E2
CIRCUIT DIAGRAM
E2 G2G1 E1
C1
Jun. 2007
ABSOLUTE MAXIMUM RATINGS (Tj = 25°C, unless otherwise specified)
Symbol Parameter
V
CES
VGES IC ICM IE ( IEM ( PC ( Tj Tstg Viso
Collector-emitter voltage Gate-emitter voltage
Collector current
Note 1
)
Emitter current
Note 1
)
Maximum collector dissipation
Note 3
)
Junction temperature Storage temperature Isolation voltage
Torque strength
Weight
G-E Short C-E Short DC, T
C = 108°C
Pulse (Note 2) Operation (Note 2) Pulse (Note 2)
C = 25°C
*1
T
Main terminal to base plate, AC 1 min. Main terminal M6 Mounting holes M6 Typical value
Conditions UnitRatings
*1
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)
Symbol
ICES
V
GE(th)
IGES
VCE(sat)
Cies Coes Cres QG td(on) tr td(off) tf trr ( Qrr ( VEC( Rth(j-c)Q
th(j-c)R
R
th(c-f)
R RG
1 : Tc, Tf measured point is just under the chips.
*
2 : Typical value is measured by using Shin-Etsu Chemical Co.,Ltd “G-746”.
*
Note 1. I
Collector cutoff current Gate-emitter threshold voltage Gate leakage current Collector to emitter saturation voltage Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Turn-on delay time Turn-on rise time Turn-off delay time Turn-off fall time Reverse recovery time
Note 1
)
Reverse recovery charge
Note 1
)
Emitter-collector voltage
Note 1
)
Thermal resistance
Contact thermal resistance
External gate resistance
E, IEM, VEC, trr & Qrr represent characteristics of the anti-parallel, emitter to collector free-wheel diode (FWDi).
2. Pulse width and repetition rate should be such that the device junction temperature (T
3. Junction temperature (T
4. Pulse width and repetition rate should be such as to cause negligible temperature rise.
Parameter
VCE = VCES, VGE = 0V
I
C = 30mA, VCE = 10V
±V T
j = 25°C
T
j = 125°C
CE = 10V
V V
GE = 0V
CC = 1000V, IC = 300A, VGE = 15V
V
V
CC = 1000V, IC = 300A
V
GE1 = VGE2 = 15V
R
G = 1.6Ω, Inductive load switching operation
I
E = 300A
E = 300A, VGE = 0V
I IGBT part (1/2 module) FWDi part (1/2 module) Case to fin, Thermal compound applied (1/2 module)
j) should not increase beyond 150°C.
GE = VGES, VCE = 0V
Test conditions
I
C = 300A, VGE = 15V
*1
*1
j) does not exceed Tjmax rating.
MITSUBISHI IGBT MODULES
CM300DY-34A
HIGH POWER SWITCHING USE
1700
±20
(Note 2)
*1,*2
Min. Max.
5.5 8.5
— — — — — — — — — — — — — — — — —
1.6
300 600 300 600
2900 –40 ~ +150 –40 ~ +125
3500
3.5 ~ 4.5
3.5 ~ 4.5 580
Limits
Typ.
7.0 V
2.2
2.45 — — —
2000
— — — — — 30 — — —
0.02 —
2.0
2.8 — 74
8.4
1.6 —
600 200 850 350 450
3.0
0.043
0.072
— 16
V V
A
A
W
°C °C
V
N • m
g
Unit
mA
1
µA
V
nF
nC
ns
µC
V
°C/W
Jun. 2007
2
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