CM300DY-34A
MITSUBISHI IGBT MODULES
CM300DY-34A
HIGH POWER SWITCHING USE
¡IC ...................................................................300A
¡V
CES ......................................................... 1700V
¡Insulated Type
¡2-elements in a pack
APPLICATION
General purpose inverters & Servo controls, etc
OUTLINE DRAWING & CIRCUIT DIAGRAM Dimensions in mm
110
80
62±0.25
3-M6 NUTS
93±0.25
25 25
141414
G2G1 E2E1
30
C1E2C2E1
21.5
6 15 6
4-φ6.5 MOUNTING HOLES
(20.5)
11
SCREWING DEPTH
4
+1.0
29
–0.5
LABEL
18718718
TAB #110. t=0.5
8.521.2
C2E1
E2
CIRCUIT DIAGRAM
E2 G2G1 E1
C1
Jun. 2007
ABSOLUTE MAXIMUM RATINGS (Tj = 25°C, unless otherwise specified)
Symbol Parameter
V
CES
VGES
IC
ICM
IE (
IEM (
PC (
Tj
Tstg
Viso
Collector-emitter voltage
Gate-emitter voltage
Collector current
Note 1
)
Emitter current
Note 1
)
Maximum collector dissipation
Note 3
)
Junction temperature
Storage temperature
Isolation voltage
—
Torque strength
—
Weight
—
G-E Short
C-E Short
DC, T
C = 108°C
Pulse (Note 2)
Operation (Note 2)
Pulse (Note 2)
C = 25°C
*1
T
Main terminal to base plate, AC 1 min.
Main terminal M6
Mounting holes M6
Typical value
Conditions UnitRatings
*1
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)
Symbol
ICES
V
GE(th)
IGES
VCE(sat)
Cies
Coes
Cres
QG
td(on)
tr
td(off)
tf
trr (
Qrr (
VEC(
Rth(j-c)Q
th(j-c)R
R
th(c-f)
R
RG
1 : Tc, Tf measured point is just under the chips.
*
2 : Typical value is measured by using Shin-Etsu Chemical Co.,Ltd “G-746”.
*
Note 1. I
Collector cutoff current
Gate-emitter threshold
voltage
Gate leakage current
Collector to emitter saturation
voltage
Input capacitance
Output capacitance
Reverse transfer capacitance
Total gate charge
Turn-on delay time
Turn-on rise time
Turn-off delay time
Turn-off fall time
Reverse recovery time
Note 1
)
Reverse recovery charge
Note 1
)
Emitter-collector voltage
Note 1
)
Thermal resistance
Contact thermal resistance
External gate resistance
E, IEM, VEC, trr & Qrr represent characteristics of the anti-parallel, emitter to collector free-wheel diode (FWDi).
2. Pulse width and repetition rate should be such that the device junction temperature (T
3. Junction temperature (T
4. Pulse width and repetition rate should be such as to cause negligible temperature rise.
Parameter
VCE = VCES, VGE = 0V
I
C = 30mA, VCE = 10V
±V
T
j = 25°C
T
j = 125°C
CE = 10V
V
V
GE = 0V
CC = 1000V, IC = 300A, VGE = 15V
V
V
CC = 1000V, IC = 300A
V
GE1 = VGE2 = 15V
R
G = 1.6Ω, Inductive load switching operation
I
E = 300A
E = 300A, VGE = 0V
I
IGBT part (1/2 module)
FWDi part (1/2 module)
Case to fin, Thermal compound applied (1/2 module)
j) should not increase beyond 150°C.
GE = VGES, VCE = 0V
Test conditions
I
C = 300A, VGE = 15V
*1
*1
j) does not exceed Tjmax rating.
MITSUBISHI IGBT MODULES
CM300DY-34A
HIGH POWER SWITCHING USE
1700
±20
(Note 2)
*1,*2
Min. Max.
—
5.5 8.5
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
1.6
300
600
300
600
2900
–40 ~ +150
–40 ~ +125
3500
3.5 ~ 4.5
3.5 ~ 4.5
580
Limits
Typ.
—
7.0 V
—
2.2
2.45
—
—
—
2000
—
—
—
—
—
30
—
—
—
0.02
—
2.0
2.8
—
74
8.4
1.6
—
600
200
850
350
450
—
3.0
0.043
0.072
—
16
V
V
A
A
W
°C
°C
V
N • m
g
Unit
mA
1
µA
V
nF
nC
ns
µC
V
°C/W
Ω
Jun. 2007
2