Mitsubishi Electric Corporation Semiconductor Group CM300DY-24H Datasheet

MITSUBISHI IGBT MODULES
CM300DY-24H
HIGH POWER SWITCHING USE
INSULA TED TYPE
A B
M
P - DIA. (4 TYP.)
C2E1
C F
S - M6 THD. (3 TYP)
E
C2E1
Outline Drawing and Circuit Diagram
Dimensions Inches Millimeters
A 4.33 110.0 B 3.661±0.01 93.0±0.25 C 3.15 80.0 D 2.441±0.01 62.0±0.25 E 1.18 Max. 30.0 Max. F 1.18 30.0 G 0.98 25.0 H 0.85 21.5
J 0.83 21.2
N
K
J
E2 C1
G
G
K
E2 C1
Dimensions Inches Millimeters
C2E2
E1C1
H
N
K
K 0.71 18.0 L 0.59 15.0 M 0.55 14.0 N 0.28 7.0 P 0.26 Dia. Dia. 6.5 Q 0.33 8.5 R 0.24 6.0 S M6 Metric M6
TAB#110 t=0.5 Q
R
L
D
R
Description:
Mitsubishi IGBT Modules are de­signed for use in switching appli­cations. Each module consists of two IGBTs in a half-bridge configu­ration with each transistor having a reverse-connected super-fast re-
N
covery free-wheel diode. All com­ponents and interconnects are iso­lated from the heat sinking base­plate, offering simplified system assembly and thermal manage­ment.
Features:
u Low Drive Power u Low V
CE(sat)
u Discrete Super-Fast Recovery
Free-Wheel Diode
u High Frequency Operation u Isolated Baseplate for Easy
E1C1 E2 C2
Heat Sinking
Applications:
u AC Motor Control u Motion/Servo Control u UPS u Welding Power Supplies
Ordering Information:
Example: Select the complete part module number you desire from the table below -i.e. CM300DY­24H is a 1200V (V
), 300 Am-
CES
pere Dual IGBT Module.
Type Current Rating V
Amperes Volts (x 50)
CM 300 24
CES
Sep.1998
MITSUBISHI IGBT MODULES
CM300DY-24H
HIGH POWER SWITCHING USE
INSULA TED TYPE
Absolute Maximum Ratings, Tj = 25 °C unless otherwise specified
Ratings Symbol CM300DY-24H Units Junction T emperature T Storage T emperature T Collector-Emitter Voltage (G-E SHORT) V Gate-Emitter Voltage (C-E SHORT) V Collector Current (TC = 25°C) I Peak Collector Current I Emitter Current** (TC = 25°C) I Peak Emitter Current** I Maximum Collector Dissipation (TC = 25°C, Tj 150°C) P
j
stg CES GES
C
CM
E
EM
c
Mounting Torque, M6 Main Terminal 1.96 ~ 2.94 N · m Mounting Torque, M6 Mounting 1.96 ~ 2.94 N · m Weight 500 Grams Isolation Voltage (Main Terminal to Baseplate, AC 1 min.) V
*Pulse width and repetition rate should be such that the device junction temperature (Tj) does not exceed T **Represents characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
j(max)
iso
rating.
–40 to 150 °C –40 to 125 °C
1200 Volts
±20 Volts 300 Amperes
600* Amperes
300 Amperes
600* Amperes
2100 Watts
2500 Vrms
Static Electrical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Ty p. Max. Units Collector-Cutoff Current I Gate Leakage Current I Gate-Emitter Threshold Voltage V Collector-Emitter Saturation Voltage V
CES GES
GE(th)
CE(sat)
VCE = V VGE = V
, VGE = 0V 1.0 mA
CES
, VCE = 0V 0.5 µA
GES
IC = 30mA, VCE = 10V 4.5 6.0 7.5 Volts
IC = 300A, VGE = 15V 2.5 3.4** Volts
IC = 300A, VGE = 15V, Tj = 150°C 2.25 Volts Total Gate Charge Q Emitter-Collector Voltage V
** Pulse width and repetition rate should be such that device junction temperature rise is negligible.
G
EC
VCC = 600V, IC = 300A, VGE = 15V 1500 nC
IE = 300A, VGE = 0V 3.5 Volts
Dynamic Electrical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Ty p. Max. Units Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C Resistive Turn-on Delay T ime t Load Rise Time t Switching Turn-off Delay T ime t Times Fall Time t Diode Reverse Recovery Time t Diode Reverse Recovery Charge Q
ies oes res
d(on)
r
d(off)
f
rr
rr
VGE = 0V, VCE = 10V 21 nF
VCC = 600V, IC = 300A, 500 ns
V
= V
GE1
= 15V , RG = 1.0 350 ns
GE2
IE = 300A, diE/dt = –600A/µs 250 ns IE = 300A, diE/dt = –600A/µs 2.23 µC
60 nF
12 nF – 250 ns
350 ns
Thermal and Mechanical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Ty p. Max. Units Thermal Resistance, Junction to Case R Thermal Resistance, Junction to Case R Contact Thermal Resistance R
th(j-c) th(j-c) th(c-f)
Per Module, Thermal Grease Applied 0.035 °C/W
Per IGBT 0.06 °C/W
Per FWDi 0.12 °C/W
Sep.1998
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