Mitsubishi Electric Corporation Semiconductor Group BCR16HM Datasheet

MITSUBISHI SEMICONDUCTOR TRIAC
BCR16HM
MEDIUM POWER USE
INSULATED TYPE, GLASS PASSIVATION TYPE
BCR16HM
•IT (RMS) ......................................................................16A
DRM ..............................................................400V/600V
•V
FGT !, IRGT !, IRGT # ...........................................30mA
•V
iso........................................................................ 2200V
• UL Recognized: File No. E80276
OUTLINE DRAWING
2
5.0 MIN
23.0MAX
1
φ2.0(T1,T2)
T1 TERMINAL INDICATION
TRADEMARK
3-φ1.3
TYPE NAME
VOLTAGE CLASS
39.2 MAX
20.2 MAX
20.1 MAX
21.6 MAX
30.0±0.2
7.0
8.25
6.35
7.95
1.5
BCR16HM (C TYPE)
1
7.0
2 3
φ1.55(G)
6.35
9.75
LOT No.
Tb TEST POINT
Dimensions
2
1
T
1
TERMINAL
2
TERMINAL
T
TERMINAL
GATE
GATE
TERMINAL
INDICATION
2.6
in mm
2-φ4.2
3
3
22.5 MAX
11 MAX
APPLICATION
Contactless AC switches, light dimmer, on/off and speed control of small induction motors, on/off control of copier lamps, microwave ovens
MAXIMUM RATINGS
Symbol
DRM
V VDSM
Symbol
T (RMS)
I
ITSM
2
t
I
PGM PG (AV) VGM IGM Tj Tstg
V
iso
1. Gate open.
Parameter
Repetitive peak off-state voltage Non-repetitive peak off-state voltage
Parameter
RMS on-state current
Surge on-state current
2
t
for fusing
I
Peak gate power dissipation Average gate power dissipation Peak gate voltage Peak gate current Junction temperature Storage temperature
Mounting torque
Weight Isolation voltage
1
8
1
Commercial frequency, sine full wave, 360° conduction, T
b=82°C
60Hz sinewave 1 full cycle, peak value, non-repetitive Value corresponding to 1 cycle of half wave 60Hz, surge on-state
current
Screw M4
a=25°C, AC 1 minute, T2 · T1 · G terminal to base
T
400 500
Voltage class
600 720
Conditions
12
Ratings
16
170
121
5
0.5 10
2 –40 ~ +125 –40 ~ +125
15
1.47 26
2200
Unit
V V
Unit
A
A
2
A
W W
V A
°C °C
kg·cm
N·m
g V
s
Feb.1999
ELECTRICAL CHARACTERISTICS
SUPPLY VOLTAGE TIME
TIME
TIME
MAIN CURRENT
MAIN VOLTAGE
(di/dt)c
V
D
(dv/dt)c
Symbol
DRM
I VTM VFGT ! VRGT ! VRGT # IFGT ! IRGT ! IRGT # VGD Rth (j-b)
(dv/dt)c
2.Measurement using the gate trigger characteristics measurement circuit.3.The critical-rate of rise of the off-state commutating voltage is shown in the table below.4.The contact thermal resistance R
Repetitive peak off-state current On-state voltage
Gate trigger voltage
Gate trigger current
Gate non-trigger voltage Thermal resistance
Critical-rate of rise of off-state commutating voltage
Parameter
2
2
th (b-f) in case of greasing is 0.5°C/W.
!
@
#
!
@
#
j=125°C, VDRM applied
T T
b=25°C, ITM=25A, Instantaneous measurement
T
j=25°C, VD=6V, RL=6, RG=330
j=25°C, VD=6V, RL=6, RG=330
T
j=125°C, VD=1/2VDRM
T Junction to base
Test conditions
4
MITSUBISHI SEMICONDUCTOR TRIAC
BCR16HM
MEDIUM POWER USE
INSULATED TYPE, GLASS PASSIVATION TYPE
Min.
— — — — — — — —
0.2 —
3
Limits
Typ.
— — — — — — — — — —
Max.
3.0
1.6
1.5
1.5
1.5
2.0
Unit
mA
V V V V
30
mA
30
mA
30
mA
V
°C/W
V/µs
Voltage
class
8
12
V
DRM
(V)
400
600
(dv/dt) c
Symbol
R
L
R
L
PERFORMANCE CURVES
MAXIMUM ON-STATE CHARACTERISTICS
3
10
7 5
3 2
2
10
7 5
3 2
1
10
7 5
ON-STATE CURRENT (A)
3 2
0
10
Min.
10
10
Unit
V/µs
Tb = 25°C
Test conditions
1. Junction temperature T
j=125°C
2. Rate of decay of on-state commutat­ing current (di/dt)
c=–8A/ms
3. Peak off-state voltage V
D=400V
RATED SURGE ON-STATE CURRENT
200 180 160 140 120 100
80 60 40 20
SURGE ON-STATE CURRENT (A)
4.42.40.80.4 1.2 1.6 2.0 2.8 3.2 3.6 4.0
0
10023 5710
Commutating voltage and current waveforms
44
(inductive load)
1
23 5710
2
ON-STATE VOLTAGE (V)
CONDUCTION TIME
(CYCLES AT 60Hz)
Feb.1999
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