MITSUBISHI A2USHCPU-S1 User Guide

type A2USHCPU-S1 User,s Manual

Mitsubishi Programmable Logic Controller

SAFETY PRECAUTIONS

(Read these precautions before usi ng.)

When using Mitsubishi equipment, thoroughly read this manual and the associated manuals introduced in the manual. Also pay careful attention to safety and handle the module properly.

These and “CAUTION”.

Depending on circumstances, procedures indicated by results.

In any case, it is important to follow the directions for usage. Store this manual in a safe place so that you can take it out and read it whenever necessary. Always

forward it to the end user.

SAFETY PRECAUTIONS classify the safety precautions into two categories: “DANGER”

DANGER

CAUTION

Procedures which may lead to a dangerous condition and cause death or serious injury if not carried out properly.

Procedures which may lead to a danger ous condition a nd caus e super ficial to medium injury, or physical da mage only, if not carried out properly.

CAUTION

may also be linked to serious

[DESIGN PRECA UTION S]

DANGER

•

Install a safety circuit external to the PC that keeps the entire system safe even when there are problems with the external power supply or the PC main module. Otherwise, trouble could result from erroneous output or malfunction.

(1) Configure the following circuits outside the PC: emergency stop circuit, protection circuit,

interlocking circuit for opposite operations such as forward and reverse operations, and interlocking circuit for machine damage prevention such as upper/lower limit for positioning.

(2) When the PC detects the following problems, it will stop calculation and turn off all output.

•

The power supply module has an over current protection device and over voltage protection device.

•

The PC CPUs self-diagnostic functions, such as the watchdog timer error, detect problems.

In addition, all output will be turned on when there are problems that the PC CPU cannot detect, such as in the I/O controller. Build a failsafe circuit exterior to the PC that will make sure the equipment operates safely at such times.

Refer to the Section 8.1 in this manual for example failsafe circuits.

(3) Output could be left on or off when there is trouble in the output module’s relay or transistor.

So, build an external monitoring circuit that will monitor any single output that could cause serious trouble.

•

If current over the rating or over-current due to a load short-circuit flows for a long term, it may cause smoke or fire. Prepare an external safety circuit, such as a fuse.

•

Build a circuit that turns on the external power supply when the PC main module power supply is turned on. If the external power supply is turned on first, it could result in erroneous output or malfunction.

[DESIGN PRECA UTION S]

DANGER

Build a circuit that turns on the external power supply after the PLC main module power is turned

•

on. If the external power supply is turned on first, it could result in accidents due to erroneous outputs or a malfunction.

When there are communication faulty with the data link, the communication faulty stat ion will

•

enter the following condition. Build an interlock circuit into t he PLC program t hat w ill make sure the system operates safely by using the communication state information. Not doing so could result in erroneous output or malfunction. (1) For the data link data, the data prior t o the communicat ion error will be held. (2) The MELSECNET (II, /B, /10) remote I/O station will turn all output off. (3) The MELSECNET/MINI-S3 remote I/O station will hold the output or turn all output off

depending on the E.C. mode setting. Refer to manuals for corresponding data link system for how to detect the communication faulty station and the operation status when a communication error occurred.

When configuring a system, do not leave any slots vacant on the base. Should there be any

•

vacant slots, always use a blank cover (A1SG60) or dummy module (A1SG62). If the cover is not attached, the module's internal parts may be dispersed w hen a short-circuit test is performed or overcurrent/overvoltage is accidentally applied to the external I/O area.

CAUTION

Do not bunch the control wires or communication cable with the main circuit or power wires, or

•

install them close to each other. They should be installed 100mm (3.94 inch) or more from each other. Not doing so could result in noise that would cause malfunction.

When controlling items like lamp load, heater or solenoid valve using an out put module, large

•

current (approximately ten times greater than that present in normal circumstances) may flow when the output is turned OFF having sufficient rated current.

ON. Take measures such as replacing the module with one

[INSTALLATION PRECAUTIONS]

CAUTION

Use the PLC in the environment given in the general specification section of the manual.

•

Using the PLC outside the range of the general specifications may result in electric shock, fire, or malfunction or may damage or degrade the product.

Before mounting the module, securely insert the projection at the bottom of the module into the

•

fixing hole on the base module. (The AnS series module must be tightened to the base module at the specified tightening torque.) An improperly mounted module may result in malfunct ion, failur e, or falling. Excessive screw tightening may cause falling due to the breakage of the screw or module, short-circuit, or malfunction.

[INSTALLATION PRECAUTIONS]

CAUTION

Tighten the screw within the range of specified torque.

•

If the screws are loose, it may result in fallout, short circuits, or malfunctions. Tightening the screws too far may cause damage to the screw and/or the module, resulting in fallout, short circuits, or malfunction.

When installing extension cables, be sure that the base unit and the module connectors are

•

installed correctly. After installation, check them for looseness. Poor connections could result in erroneous input and erroneous output.

Correctly connect the memory card installation connector to the memory card. After installation,

•

make sure that the connection is not loose. A poor connection could result in malfunction.

Do not directly touch the module’s conductive parts or electronic components.

•

Doing so could cause malfunction or failure in the module.

[WIRING PRECAUTIONS]

DANGER

Completely turn off the external pow er supply when inst alling or w iring. Not completely tu rning

•

off all power supply could result in electric shock or damage to the product.

When turning on the power or operating the module after installation or wiring work, be sure that

•

the module’s terminal covers are correctly attached. Not attaching t he terminal covers could result in electric shock.

CAUTION

Be sure to ground the FG terminals and LG terminals with a special PLC ground of Type 3 or

•

above. Not doing so could result in electric shock or malfunction.

When wiring in the PLC, check the rated voltage and terminal layout of the wiring, and make

•

sure the wiring is done correctly. Connecting a power supply that differs from the rated voltage or wiring it incorrectly may cause fire or breakdown.

Do not connect multiple power supply modules in parallel.

•

Doing so could cause overheating, fire, or damage to the power supply module.

Tighten the terminal screws with the specified torque.

•

If the terminal screws are loose, it could result in short circuits, fire, or malfunction. Tightening the screws too far may cause damage to the screw and/or the module, resulting in fallout, short circuits, or malfunction.

Take care so that foreign matter such as chips and wiring scraps do not enter the module as it

•

could result in fire, trouble or a malfunction.

External connections shall be crimped or pressure welded with the specified tools, or correctly

•

soldered. For information regarding the crimping and pressure welding tools, refer to the I/O module’s user manual. Imperfect connections could result in short circuit, fires, or malfunction.

[STARTING A ND MAINTENANCE PRECAUTIONS]

DANGER

Do not touch the terminals while power is on. Doing so could cause shock or malfunction.

•

Correctly connect the battery. Also, do not change, disassemble, heat , place in fire, short circuit,

•

or solder the battery. Mishandling of the battery can cause overheating or cracks which could result in injury and fires.

Make sure to switch all phases of the external power supply off before cleaning or re-tightening

•

screws. If you do not switch off the ext ernal pow er supply , it will cause electr ic shock. If the screws are loose, it may result in fallout, short circuit, or malfunction. Tightening the screws too far may cause damages to the screws and/or the module, resulting in fallout, short circuits, or malfunction.

CAUTION

Carefully read manuals and confirm that it is safe enough before performing on-line operations

•

which require to connect peripheral devices to an operating CPU module. (especially w hen modifying a program, performing forced output, or modifying the operation status.) Misoperation may damage the module or cause accidents.

Do not disassemble or rebuild the module.

•

It may cause accidents, malfunction, injury, or fire.

When using a cellular phone, keep it 25 cm or more away from the PLC.

•

Otherwise, malfunction may result.

Make sure to switch all phases of the external power supply off before mounting or removing the

•

module. If you do not switch off the exter nal power supply, it w ill cause failure or malfunction of the module.

[DISPOSAL PRECAUTIONS]

Disposing of this product, treat it as industrial wast e.

•

CAUTION

Revisions

* The manual number is noted at the lower left of the back cover.

Print Date *Manual Number Revision

Jun. 1997 IB(NA)-66789-A First printing Jun. 2002

IB(NA)-66789-B

Equivalent to the Japanese version C Correction SAFETY PRECAUTIONS, Chapter 1, Section 1.2, Section 2.1, 2.2.1, 2.2.2,

2.2.3, 2.3, Chapter 3, Section 4.1.4, 4.2.2, 4.2.5, Section 5.1, 5.2, Section

6.1.2, 6.1.3, Section 7.1.1, 7.1.5, Section 8.1, Chapter 9, Section 10.3.2, Appendix 2.1, 2.2, Appendix 4.2

This manual does not imply guarantee or implementation right for industrial ownership or implementation of other rights. Mitsubishi Electric Corporation is not responsible for industrial ownership problems caused by use of the contents of this manual.

 1997 Mitsubishi Electric Corporation

Introduction

Thank you for choosing a Mitsubishi MELSEC-A Series General Purpose Programmable Controller. Before using your new PC, please read this manual thoroughly to gain an understanding of its functions so you can use it properly. Please forward a copy of this manual to the end user.

About This Manual

1. OVERVIEW 1- 1 to 1- 3

1.1 Features............................................................................................................................................................ 1- 2

1.2 Comparison of Performance and Specifications with A2USCPU(S1)...............................................................1- 3

2. SYSTEM CONFIGURATION 2- 1 to 2- 19

2.1 Overall Configuration ........................................................................................................................................ 2- 1

2.2 Precautions When Configuration the System ................................................................................................... 2- 3

2.2.1 Hardware ............................................................................................................................................... 2- 3

2.2.2 Software package.................................................................................................................................. 2- 5

2.2.3 Precautions when using GPP function software packages and A8PU peripheral devices

which are not compatible with AnU........................................................................................................ 2- 7

2.3 System Equipment............................................................................................................................................ 2- 8

2.4 System Configuration Overview........................................................................................................................2-18

3. GENERAL SPECIFICATION 3- 1

4. CPU MODULE 4-1 to 4- 28

4.1 Performance Specification................................................................................................................................ 4- 1

4.1.1 Overview of operation processing..........................................................................................................4- 3

4.1.2 Operation processing of RUN, STOP, PAUSE, and STEP RUN...........................................................4- 5

4.1.3 Operation processing upon momentary power failure........................................................................... 4- 7

4.1.4 Self-diagnosis........................................................................................................................................4- 8

4.1.5 Device list ..............................................................................................................................................4-10

4.2 Parameter Setting Ranges................................................................................................................................4-11

4.2.1 List of parameter setting range..............................................................................................................4-11

4.2.2 Memory capacity setting (for main program, file register, comment, etc.).............................................4-13

4.2.3 Setting ranges of timer and counter.......................................................................................................4-15

4.2.4 I/O devices.............................................................................................................................................4-17

4.2.5 I/O allocation of special function modules .............................................................................................4-17

4.2.6 MELSECNET/MINI-S3 automatic refresh..............................................................................................4-18

4.3 Function List......................................................................................................................................................4-22

4.4 Precautions When Handling the Module...........................................................................................................4-24

4.5 Name and Setting of Each Part.........................................................................................................................4-25

4.5.1 The name of each part of the A2USHCPU-S1.......................................................................................4-25

4.5.2 Settings for memory protection switch...................................................................................................4-27

4.5.3 Latch clear operation.............................................................................................................................4-28

5. POWER SUPPLY MODULE 5- 1 to 5- 7

5.1 Specifications.................................................................................................................................................... 5- 1

5.1.1 Selecting a power supply module.......................................................................................................... 5- 4

5.2 Name and Setting of Each Part......................................................................................................................... 5- 5

6. BASE UNIT AND EXTENSION CABLE 6- 1 to 6- 7

6.1 Specification...................................................................................................................................................... 6- 1

6.1.1 Base unit specifications.........................................................................................................................6- 1

6.1.2 Extension cable specifications............................................................................................................... 6- 1

6.1.3 Usage standards of extension base units

(A1S52B, A1S55B, A1S58B, A52B, A55B, A58B)...............................................................................6- 2

6.2 Name and Setting of Each Part......................................................................................................................... 6- 6

7. MEMORY CASSETTE AND BATTERY 7- 1 to 7- 5

7.1 Memory Cassette.............................................................................................................................................. 7- 1

7.1.1 Specifications......................................................................................................................................... 7- 1

7.1.2 Precautions when handling the memory cassette.................................................................................7- 1

7.1.3 Installation and removal of memory cassette ........................................................................................ 7- 2

7.1.4 Procedure for writing sequence program to A2SMCA-14KP.................................................................7- 3

7.1.5 Memory protection setting of A2SNMCA-30KE.....................................................................................7- 4

7.2 Battery............................................................................................................................................................... 7- 5

7.2.1 Specifications......................................................................................................................................... 7- 5

7.2.2 Precautions when handling.................................................................................................................... 7- 5

7.2.3 Battery installation ................................................................................................................................. 7- 5

8. LOADING AND INSTALLATION 8- 1 to 8- 17

8.1 Concept of Failsafe Circuit................................................................................................................................ 8- 1

8.2 Installation Environment.................................................................................................................................... 8- 5

8.3 Calculation Method of Heat Amount Generated by the PC............................................................................... 8- 5

8.4 Installation of Base Unit.................................................................................................................................... 8- 7

8.4.1 Precautions when installing PC.............................................................................................................8- 7

8.4.2 Installation.............................................................................................................................................. 8- 8

8.5 Installation and Removal of the Modules.......................................................................................................... 8- 9

8.6 Installation and Removal of the Dustproof Cover..............................................................................................8-12

8.7 Wiring................................................................................................................................................................8-13

8.7.1 Precautions when wiring........................................................................................................................8-13

8.7.2 Wiring to the module terminals..............................................................................................................8-16

8.8 Precautions When Unfailure Power System (UPS) is Connected ....................................................................8-17

9. EMC DIRECTIVE AND LOW-VOLTAGE INSTRUCTION 9- 1 to 9- 11

9.1 Requirements for Compliance to EMC Directive (89/336/EEC)........................................................................ 9- 1

9.1.1 EMC standards...................................................................................................................................... 9- 1

9.1.2 Installation inside the control cabinet..................................................................................................... 9- 2

9.1.3 Cables.................................................................................................................................................... 9- 3

9.1.4 Power supply module............................................................................................................................. 9- 6

9.1.5 Ferrite core ............................................................................................................................................ 9- 7

9.1.6 Noise filter (power supply line filter)....................................................................................................... 9- 7

9.2 Requirement to Conform to the Low-Voltage Instruction.................................................................................. 9- 8

9.2.1 Standard applied for AnS series............................................................................................................ 9- 8

9.2.2 Precautions when using the AnS series................................................................................................9- 9

9.2.3 Power supply ......................................................................................................................................... 9- 9

9.2.4 Control box.............................................................................................................................................9-10

9.2.5 Module installation.................................................................................................................................9-10

9.2.6 Grounding..............................................................................................................................................9-11

9.2.7 External wiring .......................................................................................................................................9-11

10. MAINTENANCE AND INSPECTION 10- 1 to 10- 5

10.1 Routine Inspection............................................................................................................................................10-2

10.2 Periodic Inspection............................................................................................................................................10-3

10.3 Battery Replacement.........................................................................................................................................10-4

10.3.1 Service life of the battery .......................................................................................................................10-4

10.3.2 Battery replacement procedure .............................................................................................................10-5

11. TROUBLESHOOTING 11- 1 to 11- 20

11.1 Fundamentals of Troubleshooting ....................................................................................................................11- 1

11.2 Troubleshooting................................................................................................................................................11- 2

11.2.1 Troubleshooting flowchart......................................................................................................................11- 2

11.2.2 Flowchart for actions when the "POWER" LED is turned OFF..............................................................11- 3

11.2.3 Flowchart for actions when the "RUN" LED is turned OFF....................................................................11- 4

11.2.4 Flowchart for actions when the "RUN" LED is flashing..........................................................................11- 5

11.2.5 Flowchart for actions when the "ERROR" LED is turned ON.................................................................11- 6

11.2.6 Flowchart for actions when the "ERROR" LED is flashing.....................................................................11- 7

11.2.7 Flowchart for actions when the output module's output load does not turn ON.....................................11- 8

11.2.8 Flowchart for actions when the program cannot be written ...................................................................11- 9

11.3 Error Code List..................................................................................................................................................11-10

11.3.1 Procedure to read an error code............................................................................................................11-10

11.3.2 Error code list.........................................................................................................................................11-10

11.4 Possible Troubles with I/O Modules..................................................................................................................11-18

11.4.1 Troubles with the input circuit and the countermeasures ......................................................................11-18

11.4.2 Possible troubles in the output circuit ....................................................................................................11-20

APPENDIX A- 1 to A- 31

Appendix 1 Instruction List....................................................................................................................................... A- 1

Appendix 2 Lists of Special Relays and Special Registers...................................................................................... A- 8

Appendix 2.1 List of special relays.................................................................................................................A- 8

Appendix 2.2 List of special registers.............................................................................................................A-13

Appendix 3 Peripheral Devices................................................................................................................................A-19

Appendix 4 Precautions When the Existing Sequence Programs Are Diverted for the A2USHCPU-S1.................A-20

Appendix 4.1 Instructions with different specifications...................................................................................A-20

Appendix 4.2 Special relays and special registers with different specifications.............................................A-21

Appendix 4.3 Parameter setting.....................................................................................................................A-21

Appendix 4.4 I/O control method....................................................................................................................A-22

Appendix 4.5 Microcomputer program ...........................................................................................................A-23

Appendix 4.6 Processing of the index register...............................................................................................A-23

Appendix 5 External Dimension Diagrams...............................................................................................................A-24

Appendix 5.1 A2USHCPU-S1 module ...........................................................................................................A-24

Appendix 5.2 A1S61PN, A1S62PN and A1S63P power supply modules......................................................A-24

Appendix 5.3 Basic Base Unit........................................................................................................................A-25

Appendix 5.3.1 A1S32B basic base unit................................................................................................A-25

Appendix 5.3.2 A1S33B basic base unit................................................................................................A-25

Appendix 5.3.3 A1S35B basic base unit................................................................................................A-26

Appendix 5.3.4 A1S38B basic base unit................................................................................................A-26

Appendix 5.4 Extension Base unit..................................................................................................................A-27

Appendix 5.4.1 A1S65B extension base unit.........................................................................................A-27

Appendix 5.4.2 A1S68B extension base unit.........................................................................................A-27

Appendix 5.4.3 A1S52B extension base unit.........................................................................................A-28

Appendix 5.4.4 A1S55B extension base unit.........................................................................................A-28

Appendix 5.4.5 A1S58B extension base unit.........................................................................................A-29

Appendix 5.5 Memory Cassette .....................................................................................................................A-29

Appendix 5.5.1 A2SMCA- memory cassette.....................................................................................A-29

Appendix 5.5.2 A2SNMCA-30KE memory cassette...............................................................................A-30

Appendix 5.6 A2SWA-28P Memory Write Adapter........................................................................................A-30

Appendix 6 Precautions When Writing Data on a ROM Using PECKER..................................................................A-31

About This Manual

The following table lists manuals regarding this product.

Related Manuals

Manual Name

ACPU Programming Manual (Fundamentals) Describes programming methods necessary for creating programs, device names, parameters,

program types, memory area configuration, and so on. (Sold separately)

ACPU Programming Manual (Common Instructions) Describes how to use the sequence instruction, basic instructions, applied instructions and

microcomputer programs. (Sold separately)

AnACPU/AnUCPU/QCPU-A (A mode) Programming Manual (Dedicated Instructions) Describes instructions that have been expanded for A2USHCPU-S1. (Sold separately) AnACPU/AnUCPU Programming Manual (AD57 Instructions) Describes dedicated instructions for A2USHCPU-S1 to control the AD57(S1)/AD58 controller

module. (Sold separately) AnACPU/AnUCPU Programming Manual (PID Instructions) Describes dedicated instructions for A2USHCPU-S1 to perform the PID control. (Sold separately) AnS Module type I/O User's Manual Describes the specification of the compact building block type I/O module. (Sold separately)

Manual No.

(Model Code)

IB-66249 (13J740)

IB-66250 (13J741)

IB-66251 (13J742)

IB-66257 (13J743)

IB-66258 (13J744)

IB-66541 (13JE81)

1. OVERVIEW MELSEC-A

1. OVERVIEW

This User's Manual describes the performance, functions, and handling method of the A2USHCPU-S1 general purpose PC (abbreviated as A2USHCPU-S1 hereafter), as well as the specifications and handling of the memory cassette, power supply module and the base module.

The A2USHCPU-S1 has higher performance compared with the conventional A2USCPU, with faster instruction processing speed, increased program size, and so on. Utilize these enhanced capabilities to operate the A2USHCPU-S1 in the most efficient way.

The instructions used in the sequence programs of the A2USHCPU-S1 are as follows:

•

Sequence instructions........................25 instructions

•

Basic and application instructions ......243 instructions

•

Dedicated instructions........................204 instructions

Refer to Appendix-1 for the complete list of instructions.

The programming modules and software packages have to be compatible with the upgraded A2UCPU, A2UCPU-S1, A3UCPU, and A4UCPU (abbreviated as AnUCPU hereafter). When the conventional programming modules and software packages are used, the usable range varies depending on the model of the CPU (PC model name). --- Refer to Section 2.2.3.

Refer to the list of components in Section 2.3 for various modules which can be used with the A2USHCPU-S1. Refer to Section 2.2.1 for the special function modules which have limited range of usable devices.

1-1

1. OVERVIEW MELSEC-A

1.1 Features

The A2USHCPU-S1 has the following features when compared with A2USCPU(S1) and A1SCPU:

(1) The program size was greatly increased in the A2USHCPU-S1 to a maximum of 30k steps,

compared with 14k steps of the A2USCPU(S1).

(2) The operation speed (sequence instructions) was substantially improved.

The processing speed of the A2USHCPU-S1 has been improved to 0.09µs/step, compared with

0.2µs/step for the A2USCPU.

(3) The A2USHCPU-S1 has 256k bytes of built-in RAM memory.

The built-in RAM memory has a capacity of 256k bytes with battery backup. In addition, an optional memory cassette (EPROM, EEPROM) can be attached.

(4) MELSECNET/10-compatible for fast and large-capacity networking

The MELSECNET/10 network system can be constructed by installing a network module (A1SJ71LP21, A1SJ71BR11) to the extension base module and setting the network parameters. It is also compatible with the MELSECNET II system.

(5) The A2USHCPU-S1 has more points for the I/O devices, link devices, and data registers than

those of the A1SCPU.

•

I/O device (X/Y)......8192 points (X/Y0 to 1FFF)

•

Link relay (B) ..........8192 points (B0 to B1FFF)

•

Link register (W).....8192 points (W0 to W1FFF)

•

Data register (D)..... 8192 points (D0 to 8191)

(6) The A2USHCPU-S1 can execute the batch processing of the data communication requests.

•

All of the data communication requests from the A1SJ71UC24-R2, A1SD51S, peripheral devices, and others, can be processed by single END processing. (Normally, one END processing processes one communication request.)

•

The batch processing of the data communication requests can be activated by selecting "YES" on the "END Batch Processing Setup" in the supplementary function setup of the parameter, or by turning ON the M9029 from the sequence program.

•

Delay of the data transfer to each module will be prevented by using the batch processing of the data communication requests.

(M9029: When OFF, only one request is processed by one scan.)

(7) The A2USHCPU-S1 can execute the dedicated instructions for the AnA/AnUCPU.

Dedicated instructions for AnA/AnUCPU, AD57 instructions, and PID control instructions can be executed.

1-2

1. OVERVIEW MELSEC-A

1.2 Comparison of Performance and Specifications with

A2USCPU(S1)

The differences in performance and specifications between A2USHCPU-S1 and A2USCPU(S1) are as follows. Performance and specifications which are not listed here are the same between A2USHCPUS1 and A2USCPU(S1).

CPU Model

Item

I/O Control method Refresh method Refresh method Processing speed (Sequence instruction) (µs/step) 0.09 0.2

Sequence instructions

Number of instructions

Constant scan (ms) 10 to 190 10 to 190 Main program capacity A maximum of 30k steps A maximum of 14k steps

Memory capacity and memory cassette model

Number of I/O device points (points ) 8192 8192 Number of I/O points (points) 1024

Internal relay [M, L, S] (points) 8192 8192 Link relay [B] (points) 8192 8192 Link register [W] (point s ) 8192 8192 Data register [D] (points) 8192 8192 File register [R] (points 8192 8192 Annunciator [F] (points) 2048 2048 Timer [T] (points) 2048 2048 Counter [C] (points) 1024 1024

Number of device points

Index register [V, Z] (points) 14 14 Comment (points) MAX 4032 MAX 4032 Expanded comment (points) MAX 3968 MAX 3968 Watchdog timer set t ing Fixed to 200(ms) Fixed to 200(ms)

Data link

Basic and application instructions 243 243 Dedicated instructions 204 204

Memory capacity (built-in RAM)

EPROM-type memory cassette

PROM-type

memory cassette

*1 When A2USCPU-S1 is used.

A2USHCPU-S1 A2USCPU(S1)

25 25

256k bytes

A2SMCA-14KP A2SMCA-14KP

A2SNMCA-30KE A2SNMCA-30KE

MELSECNET/10 MELSECNET/10

MELSECNET(II) MELSECNET(II)

MELSECNET/B MELSECNET/B

64k bytes

(256k bytes)*1

512

(1024)*1

1-3

2. SYSTEM CONFIGURATION MELSEC-A

2. SYSTEM CONFIGURATION

The possible system configuration with A2USHCPU-S1, the precautions when the system is configured, and system components are described.

2.1 Overall Configuration

The system configurations of the A2USHCPU-S1 stand-alone system and the peripheral devices are as follows:

(To peripheral devices)

Battery (A6BAT)

ROM casette A2SMCA-14KP with EPROM A2SMCA-14KE A2SNMCA-30KE

PROM

with E

A2USHCPU-S1

Basic base (A1S3 B)

Extension cable (A1SC B)

Extension base (A1S5 B) : without power supply module (A1S6 B) : with a power supply module

Power supply module (A1S6 P)

Input module (A1SX )

Output module (A1SY )

Connection cable (A1SCO5NB)

[For building-block type]

Extension base (A5 B) : without power supply module (A6 B) : with a power supply module

Input module (AX )

Power supply module (A6 P)

2-1

Special function module

Output module (AY )

Special function module

Fuse

2. SYSTEM CONFIGURATION MELSEC-A

(To A2USHCPU-S1 )

AC30R4 AC300R4 cable

AC30R4-PUS cable

AC20R4-A8PU cable

A6PHP Plasma Hand-held Graphic Programmer

A6GPP Intelligent GPP

A7PUS programming module

A8PU/A8UPU programming module

AC03R2 cable

AC30R2 cable

EPROM write adapter (A2SWA-28P)

A6WU P-ROM writer module

Printer (A7NPR-S1, K6PR-K, general-purpose printer)

ROM cassette (A2SMCA-14KP)

EPROM write adapter (A2SWA-28P)

ROM cassette (A2SMCA-14KP)

RS-232C RS-422 converter

AC30R4-PUS cable

IBM PC/AT or 100% compatible

A6DU-B data access module

(When a DOS/V personal computer is used, refer to the system configuration section of the SW IVD-GPPA, GX Developer Operation Manual.)

2-2

2. SYSTEM CONFIGURATION MELSEC-A

2.2 Precautions When Configuring the System

The hardware and software packages which can be used for the A2USHCPU-S1 are described.

2.2.1 Hardware

(1) I/O module

All the building-block-type I/O modules for A extension base module of A5

B/A6 B.

(2) Special function module

(a) Special function modules for A N and A A can be used by installing them in the

extension base module of A5

B/A6 B.

(b) The special function modules of the following models have a limitation in the number of

installable modules.

AJ71C22-S1 AD51H-S3 *2 AJ71C23-S3 AJ71UC24 AJ71E71-S3 *2 AJ61BT11 (Only when in the intelligent mode.) A985GOT (Only when the bus connection is used.) A975GOT (Only when the bus connection is used.) A970GOT (Only when the bus connection is used.) A960GOT (Only when the bus connection is used.) A956WGOT (Only when the bus connection is used.) A956GOT (Only when the bus connection is used.) A951GOT A1SJ71UC24-R2(PRF/R4) A1SJ71E71-B2-S3(-B5-S3) A1SD51S A1SD21-S1 A1SJ61BT11(Only when in the intelligent mode.) AI61(S1) A1SI61 AJ71AP21 (S3) *2 AJ71AR21 *2 AJ71AT21B *2 A1SJ71AP21 (S3) *2 A1SJ71AR21 *2 A1SJ71AT21B *2 AJ71LP21 AJ71BR11 AJ71LR21 A1SJ71BR11 A1SJ71LP21 A1SJ71LR21 AJ71PT32-S3 (Only when in the extension mode.) AJ71T32-S3 (Only when in the extension mode.) A1SJ71PT32-S3 (Only when in the extension mode.) A1SJ71T32-S3 (Only when in the extension mode.)

*1: Accessible within the device range of A3HCPU. *2: Accessible within the device range of A3ACPU. Refer to the user's manual of the corresponding special f unction module for the acc essible device ranges.

N and A A can be used by installing them to the

A maximum of 6 modules in total can be installed.

Only one module can be installed.

A maximum of 2 modules in total can be installed.

A maximum of 4 modules in total can be installed.

A maximum of 10 modules in total can be installed.

2-3

2. SYSTEM CONFIGURATION MELSEC-A

)

use the A2USHCPU-S1 software of version "A" or later, and the AJ7ILP21/BR11, A1SJ71LP21/BR11-type network software of version "J" or later.

<Example> For AJ71LP21/BR11:

Software version Hardware version

Front side of the module

REMARK

The special function modules which cannot be used by the A2USHCPU-S1 are as follows:

AJ71C23

•

AJ71C24 (modules dated before February 1987) • AD51 (modules dated before March 1987)

•

AD57-S2

•

Confirm the manufactured date on the rating plate.

(3) Peripheral devices

(a) Use an A6WU P-ROM writer of the hardware version "E" or later.

<Example> If manufactured date is March 1987:

A6WU

DATE H 703

H 703

Software version Hardware version Month Year (The last digit of the year. Indicates A3HCPU-compatible.

(b) The A6WU P-ROM writer module cannot be installed as an add-on to be directly attached to

the A2USHCPU-S1.

add-on.

Other models (A8PU, A8UPU) use only the hand-held method with a cable.

(4) Writing on the ROM for EPROM memory cassettes

An optional A2SWA-28P memory write adapter is required to write on a ROM for the A2SMCA14KP EPROM memory cassette using the A6GPP, A6WU, or ROM writer. (The conventional A6WA-28P cannot be used.)

(5) Writing while running when operated by E

When "write while running " to the E

PROM is executed, the program transfer in progress status is

PROM (with A2SNMCA-30KE installed)

displayed on the peripheral device, then the processing for the sequence program is stopped for approximately two seconds until the transfer finishes to complete the "write while running ".

Because the program processing stops for two seconds, stop the CPU while writing instead of executing the "write while running " if it affects the operation of the controlled device. When "A3A" or "A3H" is specified as the PC's model to startup the GPP function software package which is not AnU-compatible, the "write while running" cannot be executed to the

PROM. If "write while running" to the E2PROM is executed, the changed circuit block and any PLF instruction included in the steps after the instruction will not operate normally. If the execution condition for the PLF instruction is turned off upon completion of writing, the PLF instruction is executed.

2-4

2. SYSTEM CONFIGURATION MELSEC-A

(6) Writing while in operation by the E2PROM (with A2SNMCA-30KE installed)

(a) When writing a program to the E

PROM after the GPP function software package is started up with the PC's model specified as "A3A" or "A3H", cancel the memory protection of both the A2USHCPU-S1 main module and the memory cassette for the E2PROM (A2SNMCA30KE) before execution.

(b) The writing of the program cannot be executed from the computer link module or from a

peripheral device connected to other stations on the MELSECNET.

Perform writing of the program from a peripheral device connected to the RS-422 of the A2USHCPU-S1.

2.2.2 Software package

(1) GPP function software packages and model name setting at the startup

The table below shows the GPP function software packages allowing you to create an A2USHCPU-S1 program and PLC model settings at startup. When creating an A2USHCPU-S1 program, if "A2USH-S1" is not available as a PLC model, set "A3U". If "A3U" is not available, set "A3A". If both "A3U" and "A3A" are not available, set "A3H" .

Peripheral

Device

A6PHP

A6GPP

IBM PC/AT

NOTE

1. As the PC's model for the GPP function software package (SW IVD-GPPA; is older than

3) is set to "A3U", attention should be paid to the following:

1) When a LED or LEDC instruction is written, it is not usable but no error will be issued.

2) When a CHG instruction is written, it is not usable, and the error code 13 and detailed error code 134 will be detected.

3) When a subprogram is set, it is not usable, and the error code 11 and detailed error code 111 will be detected.

2. When the MELSECNET(II), MELSECNET/10 parameters are used up to the maximum of 16k bytes, program capacity will be limited to 22k steps. The A2USHCPU-S1 uses the same memory area for the sequence program as that for the parameters of MELSECNET(II) and MELSECNET/10. Therefore, the remainder in the max. 30k steps after subtracting the memory area used by the MELSECNET(II) and MELSECNET/10 parameters can be used for the sequence program.

POINT

(1) Old software packages other than SW3-GPPA, SW3GP-GPPA, and SW4GP-GPPA cannot

be used as the software package for system startup for A6GPP/A6PHP.

(2) When a MELSECNET/10 network system is configured with the A2USHCPU-S1, use an

AnU/A2USH-S1-compatible GPP function software package (which contains "A3U" / "A2USH-S1" in the PC's model name). The network function cannot be set with GPP function software packages not compatible with AnU (no "A3U" / "A2USH-S1" in the PC's model name).

Software package for system

SW3GP-GPPA A3H Write on the ROM is not allowed. SW4GP-GPPA A3A SW SW3-GPPA SW3GP-GPPA SW4GP-GPPA A3A SW SW IVD-GPPA; is 0 to 3 A3U SW IVD-GPPA; is 4 or later GX Developer

startup

GP-GPPAU A3U

PC CPU model

setting

A3H Write on the ROM is not allowed.

A2USH-S1

Remarks

2-5

2. SYSTEM CONFIGURATION MELSEC-A

(2) Utility package

(a) None of the following utility packages for A6GPP/A6PHP can be used:

•

-AD57P

•

SW -UTLP-FN0

•

REMARK

The characters generators and canvas, which are necessary for AD57(S1), are created on the peripheral device using the SW

-UTLP-FN1 *

SW SW -UTLP-PID SW

-SIMA

-UTLP-FD1

SW SW -SAPA

-AD57P.

POINT

(1) Packages which access the A2USHCPU-S1 by specifying a device in the utility package can

specify only in the device range for A3ACPU or A3HCPU equivalent. (Refer to Section

2.2.3.)

(2) Use an AnU-compatible utility package to use the device range for the A2USHCPU-S1.

(Example: SW1IVD-SAP2, etc.)

The packages marked with * can execute the same functions using the dedicated instructions. Refer to AnACPU/AnUCPU Programming Manual (Dedicated Instruction) for details.

2-6

2. SYSTEM CONFIGURATION MELSEC-A

2.2.3 Precautions when using GPP funct ion software packages and A8PU peripheral devices which are not compatibl e with AnU

When the A2USHCPU-S1 is started up using a GPP function software package not compatible with AnU, A2USH-S1 (the PC model name is "A3A" or "A3H") or from an A8PU peripheral device (including A7PUS), the usable device range is limited as follows:

(1) Usable device range

System FD peripher al

Item

Instruction (sequence/basic/ application/dedicated)

Program capacity A maximum of 30k steps can be used for t he m ain program . I/O device points (X/Y)

M, L, S relay M/L/S0 to 8191 can be used.

Link relay (B)

Timer (T) T0 to T2047 can be used.

Counter (C) C0 to C1023 can be used.

Data register (D)

Link register (W)

Annunciator (F) F0 to F2047 can be used.

Index register (V, Z) V, V1 to V6, Z, and Z1 to Z6 can be used. Expanded comment A maximum of 3968 points Unusable

Latch (power failure compensation) range

I/O assignment

device

Number of I/O occupied points and the module model can be registered.

(1) The device range other than listed above is the same as that of A2USHCPU-S1. (2) Refer to the operation manual of each peripheral device for available functions.

AnACPU-compatible m odule A3HCPU-compatible module

Modules whose PC mode l for

system FD startup is "A3A"

X/Y0 to 7FF can be used.

(X/Y800 to 1FFF cannot be used.)

B0 to BFFF can be used

(B1000 to B1FFF cannot be used.)

D0 to D6143 can be used.

(D6144 to D8191 cannot be used.)

W0 to WFFF can be us e d .

(W1000 to W 1FFF cannot be used.)

The device range shown above can be latched. The device range shown above can be latched.

A8PU

All instructions can be used.

Modules whose PC mode l for

system FD startup is "A3H"

X/Y0 to 7FF can be used.

(X/Y800 to 1FFF cannot be used.)

M/L/S0 to 2047 can be used.

(M/L/S2048 to 8191 cannot be used.)

B0 to B3FF can be used.

(B400 to B1FFF cannot be used.)

T0 to T255 can be used.

(T256 to T2047 cannot be used.)

C0 to C255 can be used.

(C256 to C1023 cannot be used.)

D0 to D1023 can be used.

(D1024 to D8191 cannot be used.)

W0 to W 3FF can be used.

(W400 to W 1FFF cannot be used.)

F0 to F255 can be used.

(F256 to F2047 cannot be used.)

V and Z can be used.

to V6 and Z1 to Z6 cannot be used.)

Number of I/O occupied points

can be registered.

A7PUS

2-7

2. SYSTEM CONFIGURATION MELSEC-A

2.3 System Equipment

Various components of each module and peripheral device which can be used by the A2USHCPU-S1 are listed.

(1) Modules dedicated to A1S

Item Model Description

CPU module A2USHCPU-S1

A1S61PN 5VDC, 5A

Power supply module

Input module

Output module

A1S62PN 5VDC, 3A/24VDC, 0.6A

A1S63P 5VDC, 5A 24VDC input A1SX10 16-point 100 to 120 VAC input module 16 [16 input points] 0.05

A1SX10EU 16-point 100 to 120 VAC input module 16 [16 input points] 0.05 A1SX20 16-point 200 to 240 VAC input module 16 [16 input points] 0.05 A1SX20EU 16-point 200 to 240 VAC input module 16 [16 input points] 0.05

A1SX30 A1SX40 16-point 12/24VDC input module 16 [16 input points] 0.05

A1SX40-S1 16-point 24VDC input module 16 [16 input points] 0.05 A1SX40-S2 16-point 24VDC input module 16 [16 input points] 0.05 A1SX41 32-point 12/24VDC input module 32 [32 input points] 0.08 A1SX41-S1 32-point 24VDC input module 32 [32 input points] 0.12 A1SX41-S2 32-point 24VDC input module 32 [32 input points] 0.08 A1SX42 64-point 12/24VDC input module 64 [64 input points] 0.09 A1SX42-S1 64-point 24VDC input module 64 [64 input points] 0.16 A1SX42-S2 64-point 24VDC input module 64 [64 input points] 0.09 A1SX71 32-point 5/12/24VDC input module 32 [32 input points] 0.075

A1SX80

A1SX80-S1

A1SX80-S2

A1SX81

A1SX81-S2

A1SX82-S1 A1SY10 16-point relay contact output module (2A) 16 [16 output points] 0.12 0.09

A1SY10EU 16-point relay contact output module (2A) 16 [16 output points] 0.12 0.09 A1SY14EU 12-point relay contact output module (2A) 16 [16 output points] 0.12 0.10

A1SY18A

A1SY18AEU

A1SY22 16-point Triac output module (0.6A) 16 [16 output points] 0.27 A1SY28EU 8-point Triac output module (0.6A) 16 [16 output points] 0.27

1024 real I/O points, 256k bytes memory capacity

16-point 12/24VDC, 12/24VAC input module

16-point 12/24VDC sink/source input module

16-point 24VDC sink/source input module

32-point 12/24VDC sink/source input module

32-point 24VDC sink/source input module

64-point 24VDC sink/source input module

8-point relay contact output module (2A) for independent contacts

100/200VAC input

Number of occupied

points (points)

[I/O alloc a t ion module

type]

0.32 



16 [16 input points] 0.05

32 [32 input points] 0.08

64 [64 input points] 0.16

16 [16 output points] 0.24 0.075

Current

consumption

5VDC

(A)



24VDC

(220VAC)

(A)



0.002



Remark

Built-in RAM memory

Installed in the power supply slot of the basic base module and expansion base module.

2-8

2. SYSTEM CONFIGURATION MELSEC-A

Number of occupied

Item Model Description

A1SY28A

A1SY40

A1SY41

A1SY42

A1SY50

A1SY60

Output module

I/O hybrid module

Dynamic input module

Dynamic output module

Blank cover A1SG60 Dust-proof cover for unused slot 16 [Empty]

Dummy module A1SG62

Pulse catch module

Analog timer module

Interrupt module A1SI61

A1SY60E

A1SY68A

A1SY71

A1SY80

A1SY81

A1SY82

A1SH42

A1SH42-S1

A1SX48Y18

A1SX48Y58

A1S42X

A1S42Y

A1SP60

A1ST60

8-point Triac output module (1A) All points independent

16-point 12/24VDC transistor output module(0.1A) sink type

32-point 12/24VDC transistor output module(0.1A) sink type

64-point 12/24VDC transistor output module(0.1A) sink type

16-point 12/24VDC transistor output module(0.5A) sink type

16-point 24VDC transistor output module(2A) sink type

16-point 5/12/24VDC transistor output module(2A) source type

8-point 5/12/24/48VDC transistor output module (2A) sink/source type All points independent

32-point 5/12VDC transistor output module(0.016A) sink type

16-point 12/24VDC transistor output module(0.8A) source type

32-point 12/24VDC transistor output module(0.1A) source type

64-point 12/24VDC transistor output module(0.1A) source type

32-point 12/24VDC input module 32-point 12/24VDC transistor output module(0.1A) sink type

32-point 24VDC input module 32-point 24VDC transistor output module(0.1A) sink type

8-point 24VDC input module 8-point relay contact output module (2A)

8-point 24VDC input module 8-point 12/24VDC transistor output module (0.5A)

16/32/48/64 points 12/24VDC dynamic input module

16/32/48/64 points 12/24VDC dynamic output module

16-point, 32-point, 48-point, or 64-point selectable module

16-point input module for short ON-time pulse input (pulse with a minimum of 0.5ms)

8-point analog timer module whose timer setting value can be changed f or different volumes (0.1 to 1.0s, 1 to 10s, 10 to 60s, 60 to 600s)

Interrupt module for specifying the interrupt program (16-point interrupt input)

points (points)

[I/O alloc a t ion module

type]

16 [16 output points] 0.13

16 [16 output points] 0.27 0.008

32 [32 output points] 0.50 0.016

64 [64 output points] 0.93 0.008

16 [16 output points] 0.12 0.06

16 [16 output points] 0.12 0.015

16 [16 output points] 0.20 0.01

16 [16 output points] 0.11

32 [32 output points] 0.40 0.15

16 [16 output points] 0.12 0.02

32 [32 output points] 0.50 0.016

64 [64 output points] 0.93 0.008

32 [32 output points] 0.50 0.008

16 [16 output points] 0.085 0.045

16 [16 output points] 0.06 0.06

Specified number of

points [Input

specified number of points]

Specified number of

points [Output

specified number of points]

Specified number of

points [Input

specified number of points]

16 [16 output points] 0.055

32 [32 special points] 0.057

Current

consumption

5VDC

0.08

0.10 0.008

(A)



24VDC

(A)



Remark

2-9

2. SYSTEM CONFIGURATION MELSEC-A

Item Model Description

32-bit signed binary 50kBPS, 1 channel 24-bit signed binary, 2 channels 100kPPS, DC input Transistor output (sink type) 24-bit signed binary, 2 channels 200kPPS, difference input Transistor output (sink type) 24-bit signed binary, 2 channels 200kPPS, difference input Transistor output (sink type) 24-bit signed binary, 2 channels 100kPPS, DC input Transistor output (source type) 4 to 20mA/0 to 10V 4 analog channels 4 to 20mA/0 to 10V 8 analog channels For Pt100 (3-wire type) connection 2 channels of temperature input For Pt100 (4-wire type) connection 2 channels of temperature input

4 to 20mA/0 to 10V 2 analog output channels

-10 to 10V input Analog output, 8 channels 4 to 20mA input Analog output, 8 channels Analog input, 2 channels, simple loop

control is allowed. Analog output, 1 channel

Analog input, 4 channels, simple loop control is allowed. Analog output, 2 channels

Thermocouple input - transistor input, 4 channels

Thermocouple input - transistor input, 4 channels With disconnection det ec t ion f unction

Platinum resistance temperature sens or input - transistor input, 4 channels

Platinum resistance temperature sens or input - transistor input, 4 channels With disconnection det ec t ion f unction

Thermocouple input - transistor output (overheat cooling), 2 channels

Thermocouple input - transistor output (overheat cooling), 2 channels With disconnection det ec t ion f unction Platinum resistance temperature sens or input - transistor output (heat cooling), 2 channels

High-speed counter module

A/D converter module

Temperature/ digital converter module

D/A converter module

Analog I/O module

Temperature regulating module

A1SD61

A1SD62

A1SD62D

A1SD62D-S1

A1SD62E

A1S64AD

A1S68AD

A1S62RD3N

A1S62RD4N A1S68TD Thermocouple input, 8 channels 32 [32 special points] 0.32 A1S62DA

A1S68DAV

A1S68DAI

A1S63ADA

A1S66ADA

A1S64TCTT-S1

A1S64TCTTBWS1

A1S64TCRT-S1

A1S64TCRTBWS1

A1S62TCTT-S2

A1S62TCTTBWS2

A1S62TCRT-S2

Number of occupied

points (points)

[I/O alloc a t ion module

type]

32 [32 special points] 0.35

32 [32 special points] 0.1

32 [32 special points] 0.25

32 [32 special points] 0.27

32 [32 special points] 0.1

32 [32 special points] 0.4

32 [32 special points] 0.49

32 [32 special points] 0.39

32 [32 special points] 0.8

32 [32 special points] 0.65

32 [32 special points] 0.85

32 [32 special points] 0.8

32 [32 special points] 0.21 0.16

32 [32 special points] 0.33

32 [32 special points] 0.42

32 [32 special points] 0.33

32 [32 special points] 0.42

32 [32 special points] 0.19

32 [32 special points] 0.28

32 [32 special points] 0.19

2-10

Current

consumption

5VDC

24VDC

(A)



Remark

2. SYSTEM CONFIGURATION MELSEC-A

Item Model Description

Platinum resistance temperature sens or

Temperature regulating module

Computer link module

Ethernet interface module

Intelligent communication module

Positioning module

A1S62TCRTBWS2

A1SJ71UC24-R2

A1SJ71UC24PRF

A1SJ71UC24-R4

A1SJ71E71N-B2 10 Base 2 (for Cheapernet) 32 [32 special points] 0.64

A1SJ71E71N-B5T 10 Base 5 (for Ethernet), 10 Base T 32 [32 special points] 0.42

A1SD51S

A1SD70

A1SD71-S2

A1SD71-S7

A1SD75P1-S3

A1SD75P2-S3

A1SD75P3-S3

A1SD75M1

A1SD75M2

A1SD75M3

input - transistor output (heat cooling), 2 channels

With disconnection det ec t ion f unction Computer link function RS-232C, 1 channel Computer link function, printer function RS-232C, 1 channel Computer link function, multidrop link function RS-422/RS-485, 1 channel

BASIC (interpreter/compiler) RS-232C, 2 channels RS-422/485, 1 channel Analog voltage output (0 to ±10V) for 1-

axis positioning control, speed control, and speed-positioning control.

For positioning control, speed control, and speed-positioning control. Pulse train output, 2-axis (independent, 2-axis simultaneous, linear interpolation

For positioning control, setting for manual pulse output speed can be changed. Pulse train output, 2-axis (independent, 2-axis simultaneous, linear interpolation)

For positioning control, pulse output, 1axis

For positioning control, pulse output, 2axis (independent, 2-axis simultaneous, linear interpolation, circular interpolation)

For positioning control, pulse output, 3axis (independent, 3-axis simultaneous, 2-axis linear interpolation, 2-axis circular interpolation)

For positioning control, digital output, for MR-H-B/MR-J-B/MR-J2-B, 1-axis SSCNET

For positioning control, digital output, for MR-H-B/MR-J-B/MR-J2-B, 2-axis SSCNET (independent, 2-axis simultaneous, linear interpolation, circular interpolation)

For positioning control, digital output, for MR-H-B/MR-J-B/MR-J2-B, 3-axis SSCNET (independent, 3-axis simultaneous, 2axis linear interpolation, 2-axis circular interpolation)

Number of occupied

points (points)

[I/O alloc a t ion module

type]

32 [32 special points] 0.28

32 [32 special points] 0.1

32 [32 special points] 0.4

48 [First half: 16 empty

points]

[Second half: 32 special

points]

32 [32 special points] 0.7

Current

consumption

5VDC

24VDC

(A)

0.3

0.8

(A)



Remark

Only AnACPUequivalent device range accessibleFil e register and program read/write disabled.

When differential driver is connected : 0.78

2-11

2. SYSTEM CONFIGURATION MELSEC-A

Item Model Description

ID interface module

MELSECNET(II) data link module

MELSECNET/B data link module

B/NET data link module

MELSECNET/10 data link module

CC-Link system master module

MELSECNET /MINI-S3 master module

MELSECNET-I/O LINK master module

S-LINK interface module

JEMANET (JPCN-

1) interface module DeviceNet

interface module

A1SD35ID1

A1SD35ID2

A1SJ71AP21

A1SJ71AP21-S3

A1SJ71AR21

A1SJ71AT21B

A1SJ72T25B

A1SJ71B62-S3

A1SJ71LP21

A1SJ71BR11

A1SJ71LR21

A1SJ61BT11

A1SJ71PT32-S3

A1SJ71T32-S3

A1SJ51T64

A1SJ71SL92N A1SJ71J92-S3 JEMANET (JPCN-1) master module 32 [32 special points] 0.40

A1SJ72J95 JEMANET (JPCN-1) slave module 32 [32 special points] 0.40 A1SJ71DN91

One reader/writer module can be connected.

ID interface module Two reader/writer modules can be connected.

For the master and local stations of MELSECNET(II) data link system (for the optical fiber cable)

For the master and local stations of MELSECNET(II) data link system (for the GI-type optical fiber cable)

For the master and local stations of MELSECNET(II) data link system (for the coaxial cable)

For the master and local stations of MELSECNET/B data link system

For the remote I/O station of MELSECNET/B data link system

Master module for B/NET

For the control, master, and normal stations of the MELSECNET/10 data link module system (For the dual loop SItype optical fiber cable)

For the control, master, and normal stations of the MELSECNET/10 data link module system (For the single bus coaxial cable)

(For the coaxial cable dual loop) For the master and local stations of the

CC-Link data link system(For the twisted pair shield cable only.)

For MELSECNET/MINI-S3 master stations (max. 64 stations). Performs remote I/O and remote terminal control of a total of 512 I/O points.

MELSECNET/MINI-S3 master station Performs remote I/O and remote terminal control of a maximum 64 stations and a total of 512 I/O points.(For the twisted pair cable only.)

MELSECNET-I/O LINK master station. Controls I/O LINK remote I/O module of a maximum of 64 stations and a total of 128 I/O points.

Master module for S-LINK I/O total 128 points

Master module for DeviceNet I/O total 4096 points

Number of occupied

points (points)

[I/O alloc a t ion module

Expanded mode 48 [48

type]

32 [32 special points] 0.25 0.17

32 [32 special points] 0.25 0.33

32 [32 special points] 0.33

32 [32 special points] 0.8

32 [32 special points] 0.66

0.3 



32 [32 special points] 0.08

32 [32 special points] 0.65

32 [32 special points] 0.80

32 [32 special points] 1.14

32 [32 special points] 0.40

I/O dedicated mode 32

[32 special points]

special points]

I/O dedicated mode 32

[32 special points]

special points]

64 [64 output points] 0.115 0.09

32 [32 special points] 0.20

32 [32 special points] 0.24

Current

consumption

5VDC

0.35

0.30

24VDC

(A)



Remark

Access is allowed within the device range of the A3ACPU.

Accessible only within MELSECNET (II) range

2-12

2. SYSTEM CONFIGURATION MELSEC-A

Item Model Description

PROFIBUS-DP slave module

AS-I interface module

Modem interface module

Paging interface module

Position detection module

PC easier monitoring module

Memory card interface module

Simulation module A6SIM-X64Y64

Graphic operation terminal

A1SJPB93D

A1SJ71AS92

A1SJ71CMO-S3 Modem interface module 32 [32 special points] 0.26

A1SD21-S1 Paging interface module 32 [32 special points] 0.14

A1S62LS Absolute position detection module 32 [32 special points] 0.55

A1SS91 PC easier monitoring module 32 [32 special points] 0.08

A1SD59J-S2 Memory card interface module 32 [32 special points] 0.05

A985GOT

A975GOT

A970GOT

A960GOT

A956GOT

A956WGOT

A953GOT

A951GOT

A950GOT

Slave module for PROFIBUS-DP I/O data total 192 words Master module for AS-I I/O total 496 points

An I/O simulation unit used connected to the base module. Debugging can be executed without connecting the I/O module to the base module. Use an expansion cable of the AnS series between the basic base module of the AnS series and the A6SIMX64Y64.

Large-size graphic operation terminal 256 colors, TFT color, 800 × 600 dots,

high intensity Large-size graphic operation terminal 256 colors, TFT color, 640 × 480 dots,

high intensity Large-size graphic operation terminal 16 colors, TFT color, 640 × 480 dots,

high intensity/16 colors, TFT color, 640

480 dots, wide viewing angle/8 colors,

STN color, 640 × 480 dots/2 colors, STN monochrome, 640 × 480 dots

Large-size graphic operation terminal 2 colors, EL, 640 × 400 dots Medium-size graphic operation terminal 8 colors, STN color, 320 × 240 dots/STN

monochrome, 320 × 240 dots/256 colors, TFT color, 320 × 240 dots

Medium-size graphic operation terminal 256 colors, TFT color, 480 × 234 dots Medium-size graphic operation terminal 8 colors, STN color, 320 × 240 dots/STN

monochrome, 320 × 240 dots/256 colors, TFT color, 320 × 240 dots

Medium-size graphic operation terminal 8 colors, STN color, 320 × 240 dots/STN

monochrome, 320 × 240 dots/256 colors, TFT color, 320 × 240 dots

Medium-size graphic operation terminal 8 colors, STN color, 320 × 240 dots/STN

monochrome, 320 × 240 dots/256 colors, TFT color, 320 × 240 dots

Number of occupied

points (points)

[I/O alloc a t ion module

32 [32 special points] 0.22

32 [32 special points]

32 [32 special points] 0.22

type]

32 [32 special points] 0.36

32 [32 special points] 0.15

64 [64 input points]

64 [64 output points]



Current

consumption

5VDC

(A)

TYP. 0.3 (when all

points “ON”.)

0.22



24VDC

(A)



Remark

When bus connected

For RS-232C connected only

When bus connected

For RS-422 connected only

2-13

2. SYSTEM CONFIGURATION MELSEC-A

Item Model Description

A1S32B 2 I/O module can be installed.

Basic base unit

Extension base unit

Extension cable

A1S33B 3 I/O module can be installed. A1S35B 5 I/O module can be installed. A1S38B 8 I/O module can be installed. A1S52B 2 I/O module can be installed. A1S55B 5 I/O module can be installed.

A1S58B 8 I/O module can be installed.

A1S65B 5 I/O module can be installed. A1S68B 8 I/O module can be installed.

A1SC01B 55mm (2.17 in.) long flat cable A1SC03B 330mm (13 in.) long

A1SC07B 700mm (27.56 in.) long A1SC12B 1200mm (47.24 in.) long A1SC30B 3000mm (118.11 in.) long A1SC60B 6000mm (236.22 in.)long A1SC05NB 450mm (17.72 in.)long A1SC07NB 700mm (27.56 in.) long A1SC30NB 3000mm (118.11 in.) long A1SC50NB 5000mm (196.86 in.) long

Number of occupied

points (points)

[I/O alloc a t ion module

type]



Current

consumption

5VDC

(A)



24VDC

(A)



Remark

Extension connector on the right and left side each.

The power supply module cannot be installed. (Power is supplied from the basic base module.)

The power supply module is required.

For extension towards right.

Connection cable for the extension base module.

Cable for the

N, A A

A extension base module.

2-14

2. SYSTEM CONFIGURATION MELSEC-A

Item Model Contents Applicable models

Memory cassette

EPROM

Memory write adapter A2SWA-28P Battery A6BAT IC-RAM memory backup Installed in the A2USHCPU-S1 main module

Connector/terminal block converter unit

Cable for the connector/terminal block converter unit

Relay terminal unit A6TE2-16SRN For the sink-type output m odule A1SY41, A1SY42, A1SH42(S1)

Cable for connecting the relay terminal unit

Terminal block cover for the A1S I/O module and the special module

Insulation displacement terminal block adapter

Terminal block adapter

40-pin connector

37-pin D-sub connector

A2SMCA-14KP With a 14k-step EPROM (direct connection) A2SWA-28P is required

PROM

A2SNMCA30KE

A6TBXY36

A6TBXY54

With a 30k-step E

PROM (direct

connection) Adapter for the memory cassette

attachment connector/28-pin EPROM

For the sink-type input module and sinktype output module. (standard type)

For the sink-type input module and sinktype output module. (2-wire type)

Direct writing to and reading from a peripheral device is feasible.

Used for the ROM writing of A2SMCA-I4KP

A1SX41(S1/S2), A1SX42(S1/S2), A1SY41, A1SY42, A1SY82, A1SH42(S1)

A6TBX70 For the sink-type input module. (3-wire type) A1SX41(S1/S2), A1SX42(S1/S2), A1SH42(S1) A6TBX36-E

A6TBY36-E

A6TBX54-E

A6TBY54-E

A6TBX70-E

For the source-type input module. (standard type)

For the source-type output module. (standard type)

For the source-type input module. (2-wire type)

For the source-type output module. (2-wire type)

For the source-type input module. (3-wire type)

A1SX81(S2), A1SX71, A1SX82-S1

A1SY81, A1SY82

A1SX81(S2), A1SX71, A1SX82-S1

A1SY81, A1SY82

A1SX81(S2), A1SX71, A1SX82-S1

AC05TB 0.5m (1.64 ft.) for the source module AC10TB 1m (3.28 ft.) for the source module AC20TB 2m (6.56 ft.) for the source module AC30TB 3m (9.84 ft.) for the source module AC50TB 5m (16.40 ft.) for the source module

A6TBXY36 A6TBXY54

A6TBX70 AC80TB 8m for the sink module AC100TB 10m for the sink module AC05TB-E 0.5m (1.64 ft.) for the source module AC10TB-E 1m (3.28 ft.) for the source module AC20TB-E 2m (6.56 ft.) for the source module AC30TB-E 3m (9.84 ft.) for the source module AC50TB-E 5m (16.40 ft.) for the source module

A6TBX36-E

A6TBY36-E

A6TBX54-E

A6TBY54-E

A6TBX70-E

AC06TE 0.5m (1.64 ft.) long AC10TE 1m (3.28 ft.) long AC30TE 3m (9.84 ft.) long

A6TE2-16SRN AC50TE 5m (16.40 ft.) long AC100TE 10m (32.81 ft.) long

Slim-type terminal block cover for t he A1S

A1STEC-S

I/O module and the special module

All terminal block connector type modules

(terminal block type).

A1S-TA32

A1S-TA32-3

A1S-TA32-7

A1S-TB32

Insulation displacement terminal block adapter for 32 points 0.5mm

Insulation displacement terminal block adapter for 32 points 0.3mm

Insulation displacement terminal block adapter for 32 points 0.75mm

(AWG20)

(AWG22)

(AWG18)

For 32 points, conversion into Europe type terminal block

A1SX41(S1/S2), A1SX71, A1SY41, A1SY71

A1SX41(S1/S2), A1SX71, A1SY41, A1SY71 A6CON1 Soldering type, straight out

A6CON2 Solderless type, straight out A6CON3 Press-fit type, flat cable

Sink type (40p FCN)

A6CON4 Soldering type, straight/diagonal out A6CON1E Soldering type, straight out A6CON2E Solderless type, straight out

Source type (37p D-sub) A6CON3E Press-fit type, flat cable

2-15

2. SYSTEM CONFIGURATION MELSEC-A

(2) Peripheral devices

Item Model Remark

A6PHP main module

•

Plasma hand-held graphic programmer

Intelligent GPP A6GPP-SET

Composite video cable

RS-422 cable

User floppy disk SW0-GPPU 2DD-type Cleaning floppy disk SW0-FDC For A6GPP/A6PHP Floppy disk for cleaning the floppy disk drive.

Optional keyboard for A6PHP

Optional keyboard for A6GPP

Printer

RS232C cable AC30R2

Printer paper

Inked ribbon for K6PR(K)

Inked ribbon for A7NPR-S1

Programming module

A6PHP-SET

AC10MD AC30R4 3m (9.84 ft.) long

AC300R4 30m (98.43 ft.) long

A6KB-SET-H

A6KB-SET

K6PR-K A7NPR-S1

K6PR-Y K7PR-Y

K6PR-R Replacement inked ribbon for K6PR-K.

A7NPR-R Replacement inked ribbon for A7NPR-S1.

A7PUS A8PU

A8UPU

•

Connection cable for between A6GPP/A6PHP and printer (K6PR-K, A7NPR-S1, and a general-purpose printer with RS-232C interface)

3m (9.84 ft.) long Printer paper for K6PR(S1) and K6PR-K. 9-inch paper. 2000 sheets per

unit. Printer paper for A7PR and A7NPR. 11-inch paper. 2000 sheets per unit.

Read/write of the program is performed by connecting to the CPU main module with a RS-422 cable (AC30R4-PUS). (5VDC 0.4A)

Read/write of the program is performed by connecting to the CPU main module with a RS-422 cable (AC30R4-PUS, AC20R4-A8PU). (5VDC 0.4A)

GP-GPPA....... GPP function startup floppy disk for the A series.

GP-GPPK....... GPP function startup floppy disk for the K series.

SW0-GPPU ............... User floppy disk (2DD).

AC30R4..................... 3m (9.84 ft.)-long RS-422 cable.

A6GPP main module

GP-GPPA....... GPP function startup floppy disk for the A series.

SW SW

GP-GPPK....... GPP function startup floppy disk for the K series.

SW0-GPPU ............... User floppy disk (2DD).

AC30R4..................... 3m (9.84 ft.)-long RS-422 cable.

Connection cable for the monitor display of the A6GPP screen. 1m (3.28 ft.)long

Connection cable for between the CPU main module and A6GPP/A6PHP

Floppy disk for storing user programs (3.5-inch, preformatted)

A6KB keyboard

AC03R4H .....0.3m (0.98 ft.)-long connection cable between A6KB and

A6PHP.

A6KB-C ........Key sheet for the GPP mode of A6KB.

A6KB keyboard

AC03R4L...... 0.3m (0.98 ft.)-long connection cable between A6KB and

A6GPP. A6KB-C Key sheet for the GPP mode of A6KB.

For printing out program circuit diagrams and various lists.

2-16

2. SYSTEM CONFIGURATION MELSEC-A

Item Model Remark

Connection cable for between the CPU main module and A7PUS, A8PU,

AC30R4-PUS

RS-422 cable

AC20R4-A8PU

P-ROM write module A6WU

Data access module A6DU-B

Modem interface module

RS-422 cable

A6TEL

AC30R4 AC300R4

AC03WU

A8UPU. 3m (9.84 ft.) long Connection cable for between the CPU main module and A8PU, A8UPU. 2m (6.56 ft.) long

Used to write the program in the CPU/A6PHP main module to a ROM, or

•

to read out the program in the ROM for the CPU main module. Connect to the CPU/A6PHP with an AC30R4/AC03WU cable.

•

Used for monitoring the CPU devices, changing the s et t ing values/

•

current values, and displaying the operation st at us . (5VDC 0.23A) Connect to the CPU with an AC30R4-PUS cable.

•

An interface module which connects the PC CPU and the modem. Using

•

a telephone line, the communication is perform ed bet ween a remote peripheral device and the CPU. (5VDC 0.2A)

Connect to the CPU with an AC30R4-PUS cable.

•

Connection cable for between the CPU main module and A6WU. 3m/30m (9.84 ft./98.43 ft.) long.

Connection cable for between the A6PHP main module and A6WU. 0.3m (0.98 ft.) long.

2-17

2. SYSTEM CONFIGURATION MELSEC-A

2.4 System Configuration Overview

There are four system configuration types as follows:

Stand-alone system

(1) --

Network system

(2) --

Computer link system

(3)

Composite system

(4)

The details of the system configuration, number of I/O points, I/O number assignment, etc., of a stand-alone system are listed on the following page.

............. A system with a basic base module only, or with a basic base

system and an extension base module connected with the expansion cable.

.................... A system for controlling multiple PCs and remote I/O modules.

.......... A system for data exchange between the A2USHCPU-S1 and the

computer (personal computer, etc.) by using an A1SJ71UC24 computer link module.

............... A system which has a combination of a network system and a

computer link system.

2-18

2. SYSTEM CONFIGURATION MELSEC-A

A2USHCPU-S1 system

System configuration

[When the A1S dedicated extension bas e is us ed] An example when a 64-point module is installed to each

slot is shown.

Basic base

Slot number

100

140

180

17F

1C0

1BF

1FF

13F

[When the AcN or AcA extension base is used] An example when a 64-point module is installed to each

slot is shown.

Basic base

Slot number

100

140

180

17F

1C0

1BF

1FF

13F

UNIT

1 2 3 4 5 6 7

Extension cable

200

23F

Slot number

240

280

27F

2BF

2C0

2FF

Extension cable

Slot number

200

240

23F

27F

280

2BF

2C0

300

340

380

2FF

33F

37F

3C0

3BF

3FF

1st extension

1 2 3 4 5 6 7

Extension base (A N, A A)

Maximum number of extension

Maximum number of I/O modules

Maximum number of I/O points

Basic base unit model

Extension base unit model

Extension cable model

Extension base (For A1S only)

1 extension unit 1 extension unit

A1S32B, A1S33B, A1S35B, A1S38B

A1S65B, A1S68B, A1S52B, A1S55B, A1S58B A62B, A65B, A68B, A52B, A55B, A58B

A1SC03B, A1SC07B, A1SC12B, A1SC30B, A1SC01B (right-side installation), A1SC60B

16 modules

1024 points

A1SC05NB. A1SC07NB A1SC30NB, A1SC50NB

Notes (1) Only one extension base module can be used. (The second extension module cannot be used.)

(2) When the extension base A1S52B, A1S55B, A1S58B, A55B or A58B is used, the 5VDC power is supplied from the

power supply module of the basic base module. Before use, refer to Sect ion 6. 1. 3 and examine if it c an be us ed. (3) Limit the length of extension cable to 6m or short er. (4) If an extension cable is used, do not tie it with the main circuit cables, which has high voltage, large current, or

install them close to each other.

Assignment of the I/O numbers

(When I/O is not assigned)

(1) Assign I/O numbers to the basic base unit first, then to the extension base unit. (2) Assign I/O numbers as if both basic bas e unit and extension base unit have 8 slots each. When the

A1S32B/A1S33B/A1S35B for 2/3/5 slots are used as the basic base unit, add 6/5/3 slots (96 points/48 points) and

assign the extension base unit I/O numbers. (3) 16 points are assigned to an empty slot. (4) When an extension base unit for A

N or A A is used, be sure to set to a single extension level. If it is set to

the number of skipped unit, 16 points/slot are assigned to all of "skipped unit x 8 slots", and thus it does not work. (5) Items (2) to (4) can be changed by the I/O ass ignm ent . Refer t o t he ACPU Programm ing M anual (Fundament als )

for details.

300

340

380

37F

3C0

3BF

3FF

33F

2-19

3. GENERAL SPECIFICATION MELSEC-A

3. GENERAL SPECIFICATION

The general specification common to various modules is shown.

Table 3.1 General specification

Item Specification

Operation ambient temperature

Storage ambient temperature

Operation ambient humidity

Storage ambient humidity

When there is intermitt ent vibration

Frequency Acceleration Amplitude Sweep count 10 to 57Hz

Conforms to the JIS

Vibration durability

Shock durability Conforms to the JIS B 3502 and IEC 61131-2 (147 m/s2 ), 3 times each in 3 directions) Operation

ambiance Operation height *3 2000m(6562 ft.) or less Installation area On the control panel Over-voltage

category *1 Pollution level *2 2 or less

B 3502 and IEC

61131-2

57 to 150Hz 9.8m/s2

When there is continuous vibration

Frequency Acceleration Amplitude 10 to 57Hz

57 to 150Hz 4.9m/s

10 to 90%RH, no condensation

*1 Indicates the locat i on the device is connected, f rom the public cable network to the devi ce structure wiring

area

Category II applies to the devices to which the power is supplied from a fixed equipment. Surge withstand voltage for devices with up to 300V of rated voltage is 2500V.

*2 This is an index which indicates the degree of conductive object generation in the envi ronment where the

device is used. Pollution level 2 is when only non-conductive pollution occurs. A temporary conductivity caused by condensation m ust be expected occasionally.

*3 Do not use or store the PC in the environment where the pressure is higher than the at mospheric pressure

at sea level. Otherwise, m al function may result. To use the PC in high-pressure environment , contact your nearest Mitsubishi represent at i ve.

0 to 55°C

-20 to 75°C



No corrosive gas

II or less

0.075mm

(0.003 in.)



0.035mm

(0.001 in.)



10 times each in X,

Y, and Z directions

(80 minutes)

3-1

4. CPU MODULE MELSEC-A

4. CPU MODULE

4.1 Performance Specification

Performance specifications of A2USHCPU-S1 module are shown below.

Performance specifications

Item

Control method Repeated operation of stored program I/O control method Refresh method

Program language Processing speed

(sequence instructions) (µs/step)

Sequence

instructions Number of instructions (type)

Constant scan (ms) (Program startup with a constant time interval)

Memory capacity 256k bytes (built-in RAM)

Program capacity (steps)

I/O device points 8192 (X/Y0 to 1FFF)

I/O points 1024 (X/Y0 to 3FF)

Internal relay [M] (points) 7144 (M0 to M999, M 2048 t o M8191) Latch relay [L] (points) 1048 (L1000 to L2047) Step relay [S] (points) 0 (None for the initial s t at e) Link relay [B] (points) 8192 (B0 to B1FFF)

Timer [T] (points)

Device points

Counter [C] (points)

Data register [D] (points) 8192 (D0 to D8191) Link register [W] (point s) 8192 (W0 to W 1FFF) Annunciator [F] (points) 2048 (F0 to F2047) Device for failure detection File register [R] (points) 8192 (R0 to R8191) Points set by parameters

Basic and

application

instructions

Dedicated

instruction

Main sequence program

Sub sequence program

Relay Symbol Language, Logic Symbolic Language, MELSAP-II (SFC)

100ms timer (T0 to T199)........................Setting time: 0.1 to 3276.7s

•

10ms timer (T200 to T255) .....................Setting time: 0.01 to 327.67s

•

100ms retentive timer (none for initial).....Setting time: 0.1 to 3276.7s

•

Expansion timer (T256 to T2047).............Time set by word device (D, W,

•

Normal counter (C0 to C255)...................Setting range : 1 to 32767 times

•

Interrupt counter (none for initial).............C224 to C255 possible

•

Expansion counter (C256 to C1023)........Count value set by word device

•

Dedicated language for sequence control

10 to 190 (setup possible with 10ms units)

2048 (Default 256 points)

1024 (Default: 256 points)

Model

A2USHCPU-S1

0.09

233

204

Maximum 30k step

None

Total 8192 shared by M, L, S

depending on setting

(D,W,R)

Remark

Partial direct input and output possible by instruction

Setup to special register D9020

A2SMCA-14KP/14KE A2SNMCA-30KE (64k bytes) installation possible

Set by parameters

Number of points which can be used in a program

Number of points accessible from I/O module

The range can be changed by parameters.

The range and number of points for use set by parameters (Refer to Section 4.2.1)

4-1

4. CPU MODULE MELSEC-A

Performance specifications (Continued)

Item

Accumulator [A] (points) 2(A0, A1) Index register [V, Z]

(points) Pointer [P] (points) 256 (P0 to P255) Interrupt pointe r [I] ( p o i n ts) 32 (I0 to I31) Special relay [M] (points) 256 (M9000 to M9255)

Device points

Special register [D]

(points) Comment (points) Maxim um 4032 (Set with the unit of 64 points ) Expanded comment (points) Maximum 3968 (Set with the unit of 64 points) Switch output mode from

STOP to RUN Self-diagnosis function

Operation mode upon error Select stop or continue

RUN time startup method

Latch (power failure compensation) range

Remote RUN/PAUS E contacts Possible to setup one contact point for each of RUN/PA US E from X0 to X1FFF. Set by pa r a meters Title for printing registration YES (128 characters) Set by parameters Keyword registration YES Set by parameters I/O allocation Possible to register occupied I/O points and m odule m odel nam es . Step operation Possible to execute or stop sequence program operations . Refer to Section 4.3.

Interrupt processing Data link MELSECNET/10, MELSECNET(II)/B

Clock function

Allowable period of momentary power failure

5VDC internal power consumption (A)

Weight (kg(lb)) 0.46 (1.01) External dimensions

(mm(inch))

Select either re-output the operation status bef ore s t opping (def ault ) or out put

Operation watching time monitor (watchdog timer fixed to 200ms)

Error detection in the memory, CPU, I/O, battery, etc.

(upon power supply on/power restoration after power failure, automatic restart

by turning the "RUN" switch of the CPU t o O N.)

(Possible to setup latch ranges for L, B, T, C, D, W)

Possible to operate an interrupt program by the interrupt module or c ons t ant

Year, month, day, hour, minute, second, day of the week

Precision -3.2 to +5.1s (TYP. +1.6s)/d at 0°C

-1.2 to +5.3s (TYP +2.2s)/d at 25°C

-8.2 to +3.5s (TYP -1.6s)/d at 55°C

14(V, V

after execution of operation.

(automatic detection of the leap year)

130 (5.12) × 54.5 (2.15) × 93.6 (3.69)

NOTE

When conventional system S/W packages and peripheral devices are used, be careful as the usable ranges of devices are limited.

Details are provided in Section 2.2.3.

Model

A2USHCPU-S1

to V6, Z, Z1 to Z6)

256 (D9000 to D9255)

Initialization start

L1000 to L2047 (default)

period interrupt signal.

By power supply module Refer to Section 5.1.

0.32

Set by parameters

Set by parameters Refer to Section 4.1.4 for

details. Set by parameters

(refer to Section 4.2.1.)

Range set by parameters

Remark

4-2

4. CPU MODULE MELSEC-A

4.1.1 Overview of operation processing

An overview of processing subsequent to starting power supply for A2USHCPU-S1 to execution of the sequence program is explained. A2USHCPU-S1's processing may be categorized roughly into the following four kinds:

(1) Initial processing

This is a preprocess to execute sequence operations, and is performed only once upon power-on or reset.

(a) Resets the I/O module and initialize it. (b) Initializes the range of data memory for which latch is not set up (sets the bit device to OFF

and the word device to 0).

the position of installation on the extension base module.

(d) Executes the check items for power-on and reset among the PC CPU's self-diagnosis items

(Refer to 4.1.4).

(e) For the control station of the MELSECNET/10 or the master station of MELSECNET (II)/B,

sets the network/link parameter information to the network/data-link module, and commences the network communication/data link.

(2) Refresh processing of I/O module

Executes the refresh processing of I/O module. (Refer to the ACPU Programming Manual (Fundamentals).)

(3) Operation processing of a sequence program

Executes a sequence program from step 0 to the END instruction written in the PC CPU.

(4) END processing

This is a post-process to finish one cycle of operation processing of the sequence program and to return the execution of the sequence program to the step 0.

(a) Performs self-diagnosis checks, such as fuse blown, I/O module verification, and low

battery. (Refer to Section 4.1.4.)

(b) Updates the current value of the timer, sets the contact ON/OFF, updates the current value

of the counter and sets the contact to ON. (Refer to the ACPU Programming Manual (Fundamentals).)

read or write request from a computer link module. (A1SJ71UC24-R2, AJ71C24(S3), AD51(S3), etc.)

(d) Performs the refresh processing when there is a refresh request from the network module or

link module.

(e) When the trace point setting of sampling trace is by each scan (after the execution of END

instruction), stores the condition of the device for which it is setup into the sampling trace area.

4-3

4. CPU MODULE MELSEC-A

Power-on

Initial processing

• Initialization of I/O module

• Initialization of data memory

• I/O address allocation of I/O module

• Self-diagnosis

• Set link parameter

Refresh processing of I/O module (only when the I/O control is set up for the refresh processing)

Operation processing of the sequence program

Step 0

Until the execution of END (FEN D) instruction

END processing

• Self-diagnosis

• Updating current value of the timer and counter, and setting the contacts ON/OFF

• Communication with computer link module

• Link refresh processing

• Sampling trace processing

• MELSECNET/MINI-S3 automatic refresh processing

Figure 4.1 A2USHCPU-S1 operation processing

4-4

4. CPU MODULE MELSEC-A

4.1.2 Operation processing of RUN, STOP, PAUSE, and STEP RUN

The PC CPU has four kinds of operation states: RUN state, STOP state, PAUSE state, and step operation (STEP RUN) state. Operation processing of PC CPU in each operation state is explained.

(1) RUN state operation processing

(a) The repetition of sequence program operation in the order from step 0 → END (FEND)

instruction → step 0 is called the RUN state.

(b) When entering the RUN state, the output state escaped by STOP is output depending on

the output mode setting of parameter upon STOP → RUN.

usually one to three seconds, yet it may vary depending on the system configuration.

(2) STOP state operation processing

(a) The termination of operation of the sequence program by the use of RUN/STOP key switch

or the remote STOP is called the STOP state. (Refer to Section 4.3.)

(b) When entering the STOP state, it escapes the output state and sets all output points to OFF.

Data memories except for output (Y) are retained.

(3) PAUSE state operation processing

(a) The termination of operation of sequence program while retaining output and data memories

is called the PAUSE state. (Refer to Section 4.3.)

(4) Step operation (STEP RUN) operation processing

(a) Step operation is an operation mode wherein operation processing of a sequence program

can be paused/resumed by each instruction from peripheral device(s). (Refer to Section

4.3.)

(b) Since an operation processing is paused while retaining the output and data memories,

condition of the execution can be confirmed.

4-5

4. CPU MODULE MELSEC-A

(5) Operation processing of PC CPU when RUN/STOP key switch is operated

PC CPU operation

processing

RUN/STOP key switch operation

RUN → STOP

STOP → RUN Starts.

Operation processing of

the sequence progra m

Executes up to the END instruction, then stops.

External output

OS escapes the output state, and sets all the output points to OFF.

Determined by the output mode of the parameter upon STOP → RUN.

Maintains the condition immediately prior to entering the STOP state.

Starts operations from the condition immediately prior to entering the STOP state.

Data memories

(Y, M, L, S, T, C, D)

POINTS

Whether in the RUN, STOP or PAUSE state, PC CPU is performing the following:

Refresh processing of I/O module

•

Data communication with computer link module

•

Link refresh processing.

•

Thus, even in the STOP or PAUSE state, monitoring or testing I/O with peripheral devices, reading or writing from a computer link module, and communication with other stations by MELSECNET are possible.

Remark

4-6

4. CPU MODULE MELSEC-A

4.1.3 Operation processing upon momentary power failure

The PC CPU detects a momentary power failure when input power voltage supplied to the power supply module becomes lower than the specified range. When the PC CPU detects a momentary power failure, following operation processing is performed.

(1) When a momentary power failure shorter than allowable period of momentary power failure

occurred:

(a) When a momentary power failure occurred, operation processing is interrupted while the

output state is retained. (b) When the momentary power failure is reset, operation processing will be continued. (c) When a momentary power failure occurred and the operation was interrupted, measurement

of the watchdog timer (WDT) continues. For instance, when the scan time is 190ms and a

momentary power failure of 15ms occurs, it causes the watchdog timer error (200ms).

Momentary power failure occurred Power supply restoration

END END END0

A2USHCPU-S1 interrupts the operation.

Operation processing upon momentary power failure

(2) When a momentary power failure longer than the allowable period of momentary power

failure occurred:

The PC CPU performs the initial start. The operation processing is the same as power-on or reset operation with the reset switch.

4-7

4. CPU MODULE MELSEC-A

4.1.4 Self-diagnosis

Self-diagnosis is a function with which A2USHCPU-S1 diagnoses itself for the presence of any abnormalities.

(1) Upon turning on the power supply to PC or when an abnormality occurred while the PC is running,

the A2USHCPU-S1's self-diagnosis processing prevents malfunctions of the PC and performs preventive maintenance by detecting the abnormality, displaying an error display, halting the operation of A2USHCPU-S1, and so on.

(2) A2USHCPU-S1 stores the error occurred last to a special register D9008 as an error code, and

stores further detailed error code to a special register D9091.

(3) Even with the power-off, the latest error information and 15 errors in the past are stored by battery

back-up. With the AnUCPU-supporting system FD, contents of up to 16 errors can be confirmed from the peripheral devices. Display example with SW

Displays the current error message.

Displays the current error number. As the error generation condition, a maximum

of 16 latest errors are displayed with the time of their occurrences. The display is erased by pressing the key.

Displays the time and date of the occurrences of errors. (year, month, day, minutes, seconds)

Displays the error number.

(4) When the self-diagnosis detects an error, the module will be in one of the two modes below:

•

Mode wherein operation of the PC is stopped

•

Mode wherein operation of the PC continues In addition, there are errors with which the operation can be selected to stop or to continue by the parameter setting.

(a) When a stop-operation mode error is detected by the self-diagnosis, the operation is

stopped at the time of detection of the error, and sets the all outputs(Y) to OFF.

(b) When a continue-operation mode error is detected, the only part of the program with the

error is not executed while the all other part is executed. Also, in case of I/O module verification error, the operation is continued using the I/O address prior to the error.

When an error is detected, error generation and error contents are stored in the special relay (M) and special register (D), so that in case of the continue-operation mode, the program can use the information to prevent any malfunctions of the PC or devices.

Error descriptions detected by the self-diagnosis are shown in the next page.

REMARK

1) As to the LED display message, the order of priority of the LED display can be changed if CPU is in the operation mode. (An error code is stored in the special register).

2) When the special relay M9084 is ON, checking on blown fuse, I/O verification and the battery are not performed (an error code is not stored in the special register).

3) The "Error display of peripheral device" in the table of self-diagnostic functions are messages displayed by the PC diagnosis of peripheral devices.

PC A2A-FF-FC C:TEMP MAIN F11:MENU F12:HELP <TEST>

<ERROR STATUS> <CURRENT STATUS> <ERROR MESSAGE> 70:BATTERY ERROR <ERRORSTATUS> <Y.M.D.H.M.S.>

01.01.12 17:05:14

01.01.14 05:16:45

01.01.15 00:11:34

01.01.15 11:06:33

01.01.15 21:39:12

01.01.18 08:58:22

01.01.18 09:28:22

Page Up Page Down Esc:CLOSE

<ERROR MESSAGE> 9: AC DOWN 9: AC DOWN 9: AC DOWN 9: AC DOWN 9: AC DOWN 9: AC DOWN 70: BATTERY DOWN

<DATA>

00000

IVD-GPPA is shown below:

RESULT

00000

<NO.2>

<NO.1>

00000

Esc:Close

Displays the number of current error steps.

Detailed error number

Displays number of error details information.

Displays error message.

4-8

4. CPU MODULE MELSEC-A

Self-diagnostic functions

Diagnosis item Diagnosis timing CPU status

Instruction code check Upon execution of each instruction INSTRCT. CODE ERR. 10

Upon power-on and reset

•

Parameter setting check

No END instruction

Unable to execute instruction

Memory error

Format (CHK i n str u cti o n) check

Unable to execute instruction

RAM check Operation circuit check • Upon power-on and reset OPE. CIRCUIT ERR. 21

Watchdog error supervision

CPU error

END instruction not executed

Main CPU chec k Always

Upon switching from (STOP, PAUSE) to

•

(RUN, STEP-RUN) When M9056 or M9057 is ON

•

Upon switching from (STOP, PAUSE) to

•

(RUN, STEP-RUN) CJ SCJ JMP CALL(P)

•

FOR to NEXT CHG

Upon execution of each instruction

Upon switching from (STOP, PAUSE) to

•

(RUN, STEP-RUN)

Upon switching from (STOP, PAUSE) to (RUN, STEP-RUN)

When interruption occurred

•

Upon switching from (STOP, PAUSE) to

•

(RUN, STEP-RUN) Upon power-on and reset

•

When M9084 is ON during STOP

•

Upon execution of END instruction WDT ERROR 22

•

Upon execution of END instruction END NOT EXECUTE 24

•

Stop Flickering

Status of

"RUN" LED

Error display of

peripheral devices

PARAMETER ERROR 11

MISSING END INS. 12

CAN’T EXECUTE (P) 13

CHK FORMAT ERR. 1 4

CAN’T EXECUTE (I) 15

RAM ERROR 20

MAIN CPU DOWN 26

Error code

(D9008)

I/O module verification *1 (Default: stop)

I/O error

Fuse blown *1 (Default: operate)

Control bus check Upon execut ion of FROM, TO inst ruc t ion CONTROL-BUS ERR. 40 Special function module

error

Link module error

I/O interrupt error W hen int errupt ion oc c ur I/O INT. ERROR 43 Special function module

allocation error Special function module

error

Special function module error

*1 (Default: stop)

Link parameter error

Low battery

Battery

Upon execution of END instruction (However, not checked when M9084 or

M9094 is ON.)

Upon execution of END instruction (However, not checked when M9084 or

M9094 is ON.)

Upon execution of FROM, TO instruction SP. UNIT DOWN 41

Upon power-on and reset

•

Upon switching from (STOP, PAUSE) to

•

(RUN, STEP-RUN)

Upon power-on and reset

•

Upon switching from (STOP, PAUSE) to

•

(RUN, STEP-RUN)

Upon execution of FROM, TO instructions

Upon power-on and reset

•

Upon switching from (STOP, PAUSE) to

•

(RUN, STEP-RUN)

Always (However, not checked when M9084 is ON.)

Stop

Operate ON FUSE BREAK OFF. 32

Stop Flickering

Stop Flickering SP. UNIT ERROR 46

Stop

Operate ON

Operate Flickering BATTERY ERROR 70

Flickering

UNIT VERIFY ERR. 31

LINK UNIT ERROR 42

SP. UNIT LAY. ERR. 44

LINK PARA. ERROR 47

Operation check error *1 (Default: operate)

Upon execution of each instruction

Stop

Operate ON

Flickering

OPERATION ERROR *2 [<CHK> ERROR

*1: Can be changed by the parameter set tings of a peripheral device. *2: Displayed as a three-digit trouble code only for errors with the "CHK" in struction.

4-9

]

4. CPU MODULE MELSEC-A

4.1.5 Device list

Usage range of A2USHCPU-S1 devices is shown below.

Device list

Device

Range of usage (points)

A2USHCPU-S1

Description of device

X Input

0 to 3FF (1024 points)

Y Output

X Input

Y Output

Special relay M9000 to 9255 (256 points)

Internal relay

L Latch relay

S Step relay

B Link relay B0 t o B1FFF (8192 points)

F Annunciator F0 to F2047 (2048 points)

100ms timer

W Link register W0 to W 1FFF (8192 points) R File register R0 to R8191 (8192 points) For expanding the data register. User memory area is us ed f or t his .

A Accumulator A0, A1 (2 points) Z

N Nesting N0 to N7 (8 levels) Indicates nesting structure of master control.

P Pointer P0 to P255 (256 points) Indicates destination of branch inst ruc t ions (CJ, SCJ, CALL, J M P).

I Interrupt pointer I0 to I31 (32 points)

K Decimal constant

H Hexadecimal constant

10ms timer

100ms retentive timer

Counter

Interrupt counter

Data register D0 to D8191 (8192 points) Memory used to store data ins ide PC.

Special register D9000 to D9255 (256 points) Data memory set up in adv ance for a specialized use.

Index register V, V

0 to 1FFF (8192 points)

M/L/S 0 to 8191 (8192 points)

8192 points as a total of M, L, S

T0 to T2047 (2048 points)

(Register for storing setting value(s) is

required for T256 and later.)

C0 to C1023 (1024 points)

(Interrupt counter C224 to C255 fixed.

required for C256 and later.)

to V6, Z, Z1 to Z6 (14 points)

K-32768 to 32767 (16-bit instruction) K-2147483648 to 2147483647 (32-bit instruction)

H0 to FFFF (16-bit i n struction) H0 to FFFFFFFF (32-bit i n struction)

X, Y

Used to supply PC commands and data from peripheral devices such as push buttons, select switches, limit s witches and digital s witches.

Used to output control results of a program t o external devices such as solenoids, magnetic switches, signal lights and digit al dis play device.

Possible to use in a program after the I/O point s us age range per

•

each A2USHCPU-S1 (described above) to a maximum of 8192 points (external output is not allowed).

Objective is to allocate for automatic I/O refresh of

•

MELSECNET/MINI, for remote I/O of MELSECNET/10, for remote I/O of MELSECNET(B), or for CC-Link.

An auxiliary relay used inside a PC set in advance for a specialized use.

An auxiliary relay inside a PC which cannot output directly to external devices.

An auxiliary relay inside a PC which cannot output directly to external devices. Has the power failure compensation function.

Used in the same manner as the internal relay (M). Used as a relays to indicate the stage number of process stepping program, etc.

An internal relay for data link and cannot output to external dev ic es . The range not setup by link parameters can be used as the internal relay.

For fault detection. A fault detection program is c reat ed in advance, and if it becomes ON during RUN, the number is s t ored in a s pec ial register D.

Up-timing-timer. There are three kinds: 100ms tim er, 10m s timer and 100ms retentive timer.

There are two kinds: up-timing counter used in PC programs and interrupt counter which counts number of interrupts.

Data register used to store a operation result of basic and application instructions.

Used for qualification of devices (X, Y, M, L, B, F, T, C, D, W, R, K, H, P)

When an interruption factor is generat ed, it indic at es t he des t inat ion of the interrupt program corresponding to the interrupt ion f ac t or.

Used to set timer/counter, pointer num ber, int errupt point er num ber, bit device digits, and values for basic and application instructions.

Used to set values for basic and applic at ion ins t ruc t ions .

4-10

4. CPU MODULE MELSEC-A

4.2 Parameter Setting Ranges

A list of parameter setting ranges is provided below. User memory allocation contents, I/O device allocation method and automatic refresh procedure for MELSECNET/MINI-S3 are also explained.

4.2.1 List of parameter setting range

Parameters are used for allocating the user memory area inside the memory cassette, setting various functions and device ranges. A parameter is usually stored in the first 3k bytes of the user memory area.

Among the parameters, the network parameter for MELSECNET/10 is allocated and stored after the main sequence program area. (Refer to Section 4.2.2 for details). As shown in the list below, a default value is given to each parameter. Even though a default value can be used, parameter value can be changed to a value suitable for a particular application within a setting range by a peripheral device.

Setting Setting range

Item

Main sequence program capacity 6k steps 1 to 30k st eps (1k s t eps = in 2k -byte unit s ) File register Expansion file register

Comment capacity

Expansion comment capacity Status latch

Sampling trace

Link relay (B) B0 to B1FFF (unit: 1 point)

Latch range setting (power failure compensation)

Link range setting for MELSECNET/10

Timer settings

Counter setting

Timer (T)

Counter (C) Data register (D) D0 to D8191 (unit: 1 point)

Link register (W) Number of link stations I/O (X/Y) X/Y0 to X/Y1FFF (uni t: 16 points)

Link relay (B) B0 to B1FFF (unit:16 point s) Link register (W)

Settings for

internal relay (M)

latch relay (L) step relay (S)

T0 to T255

T256 to T2047

Interrupt counter setting Points used

Default value

0 to 8k points (1k points = in 2k-byte units)



1 block = 16k bytes



0 to 4032 points (64 point unit = in 1k byte units)



0 to 3968 points (64 point unit = in 1k byte units)



Latch:

•

L1000 to L2047 only.

None for others.

•



M0 to M999 M2048 to M8191 L1000 to L2047 None for S

T0 to T199 (100ms) T200 to T255(10ms)



256 points

(C0 to C255)

A2USHCPU-S1

(Block setting for from No.1 to No.8, f r om No.10 t o t he end of unus ed area in the memory)

[Automatically setup in the unused area in the mem ory based on t he f ile register setting.]

[When comment c apac it y is s et up, 1k byte is added t o t he memory area.]

No parameter setting

Performed by setting up expansion file registers to st ore device and result in each of status latch and sampling t rac e m odes . Refer to ACPU Programming Manual (Fundamentals).

T0 to T255 (unit: 1 point)

T256 to T2047 (unit: 1 point)

C0 to C255 (unit: 1 point)

C256 to C1023 (unit: 1 point)

W0 to W1FFF (unit: 1 point)

Optical link: maximum 64 stations

Coaxial link: maximum 32 stations

W0 to W1FFF (unit: 1 point)

M/L/S 0 to 8191

(where M, L, S are continuous numbers)

256 points by 100ms, 10ms, and retentive timers (in 8 point units)

•

Timers are continuously numbered.

•

1792 points by 100ms, 10ms, and retentive timers (in 16 point units)

•

Timers are continuously numbered.

•

Devices set: D, R, W (Setting required if 257 points or more.)

•

Sets whether to use interrupt counter (C224 to C225) or not.

•

0 to 1024 points (in 16 point units)

•

Devices set: D, R, W (Setting required if 257 points or more.)

•

4-11

4. CPU MODULE MELSEC-A

Setting Setting range

Item

I/O number allocation

Remote RUN/PAUS E contact se tting

Fuse blown Continue I/O verification error Stop

Operation modes when error occurred

STOP → RUN display mode

Print title registration Keyword registration

Link range settings for MELSECNET II

Link range settings for MELSECNET/MINI, MELSECNET/MINI-S3

Operation error Continue Special function

module check error END batch processing No Yes/No

Number of link stations I/O (X/Y) X/Y0 to 3FF (in 16 point units) Link relay (B) Link register (W)

Default value



Stop

Re-output

operation status

prior to the stop



A2USHCPU-S1

0 to 64 points (in 16 point units)

•

.........Input module/output module/special function module/empty slot

Module model name registration is possible.

•

X0 to X1FFF

•

RUN/PAUSE ....... 1 poin t ( S e tti n g o f P A USE contact only is not allowed.)

•

Stop/Continue

Output before STOP/after operation

128 characters

•

Up to 6 characters in hexadecimal (0 to 9, A to F)

•

0 to 64 station(s)

•

B0 to BFFF (in 16 p oi n t units)

•

W0 to WFFF (in 1 point units)

•

Number of supported modules : 0 t o 8

Head I/O number 0 to 1FF0

Model name registration : MINI, MINI-S3 Transmission/reception data : X, M, L, B, T, C, D, W, R, none (16 point units for bit dev ic es ) Number of retries : 0 to 32 times FROM/TO response setting : Link priority; CPU priority Data clear setting at faulty station : Retain/ Clear Faulty station detection : M, L, B, T, C, D, W, R, none (16 point units for bit dev ic es ) Error number : T, C, D, W, R Number of total remote stations : 0 to 64 station(s) Sending state setting during

communication error : Test m es s age, OFF data, ret ain (sending data)

(in 10

units)

4-12

4. CPU MODULE MELSEC-A

4.2.2 Memory capacity setting (for main program, file register, comment, etc.)

A2USHCPU-S1 has 256k bytes of user memory (RAM) as a standard. Parameters, T/C set value main program, MELSECNET/10 network parameters, expansion comment, file register, and comment data are stored in the user memory.

(1) Calculation of memory capacity

Determine the data types to be stored and the memory capacity with parameters before using the user memory.

Calculate the memory capacity according to Table 4.1.

Table 4.1 Parameter setting and memory capacity

Item Setting unit M emory capacity

Parameter, T/C set value

Sequence

Main program

MELSECNET/10 network parameter

Expansion comment 64 points

File register 1k point (File register points) × 2k bytes

Comment 64 points

program Microcomputer

program

4k bytes (fixed)



1k step

2k bytes



Main sequence program capacity

Main microcomputer program capacity

(Network module)

(Extension comment points)

(Comment points)

2k bytes

k bytes

4k bytes

k byte

*(1) The capacity for network parameters of MELSECNET/10 changes depending on the contents

set. The area for the network parameters shall be secured in 2k byte units based on the total of capacity for each setting. The memory capacity of each network parameter is as follows:

Change

into a ROM

Yes

Remark

The parameter and T/C set value occupy 4k bytes.

The microcomputer program area is dedicated to SFC.

One network module occupies up to a maximum of 4k bytes.

If the expansion comment capacity is set, the system occupies 1k byte.

If the comment capacity is s et , t he system occupies 1k byte.

Item Memory capacity (bytes)

Internal data 30 Routing parameter 390 Transfer parameter between data links 246 Common parameter 2164/module *1 Refresh parameter 92/module Station specific parameter 1490/module

*1 It i s 2722 bytes in case of a

remote master s tation.

The network parameter capacity for MELSECNET/10 is determined from the total of the memory capacities calculated from above.

Total of the capacity Capacity for network parameter setting

30 to 2048 bytes 2k byt es 2049 to 4096 bytes 4k bytes 4097 to 6144 bytes 6k bytes 6145 to 8192 bytes 8k bytes

8193 to 10240 bytes 10k bytes 10241 to 12288 bytes 12k bytes 12289 to 14336 bytes 14k bytes 14337 to 16384 bytes 16k bytes

(2) If the MELSECNET(II) data link system is configured using a GPP function software package

for the A2USH CPU, two-kilo bytes (for kilo steps) are occupied as a link parameter area.

4-13

4. CPU MODULE MELSEC-A

(2) Storing order in the user memory

Each data set by the parameters are stored in the order shown below:

(a) When the main program is made into EPROM

By making the main program into EPROM, the expansion file register can be enlarged.

ROM memory capacity

(maximum 64k bytes)

1 to 30k steps (2 to 60k bytes)

Memory area of the

built-in RAM

256k bytes

(b) Making the main program to E

Even when the main program is made into E area (area*1 in figure below) as during RAM operation, so the expansion file register cannot be enlarged.

ROM memory capacity

(maximum 64k bytes)

1 to 30k steps (2 to 60k bytes)

Memory area of the

built-in RAM

256k bytes

* When MELSECNET(II) data link system is constructed using the GPP function

software package which is compatible to AnU, 2k bytes (equivalent to 1k step) are occupied for link parameter area.

(a) During RAM operation

3k bytes

1k byte

network parameters

Expansion comment

Expansion file register

(a) During RAM operation

3k bytes

1k byte

Sequence program

network parameters Expansion comment

Expansion file register

Unusable

Parameter

T/C set value

Sequence program

MELSECNET/10

File register

Comment

PROM

Unusable

Parameter

T/C set value

MELSECNET/10

File register

Comment

Change into a ROM

PROM, the system uses the same built-in RAM

Change

into a ROM

(b) During EPROM operation

Parameter

T/C set value

Sequence program

MELSECNET/10

network parameters

Not used

Expansion comment

Expansion file register

File register

Comment

Expansion file register

(b) During E2PROM operation

Parameter

T/C set value

Sequence program MELSECNET/10

network parameters

Not used

*1 Unusable

(Reserved for

system use).

Expansion comment

Expansion file register

File register

Comment

Expansion file register

144k bytes

4-14

4. CPU MODULE MELSEC-A

POINT

Note that the sequence program can use only up to 22k steps when the maximum 16k bytes are used for the MELSECNET/10 network parameters.

The memory area for the sequence program for A2USHCPU-S1 is the same as that for MELSECNET/10. Therefore, the remainder of subtracting the memory area used by MELSECNET/10 network parameters from the maximum 30k steps can be used for the memory area for the sequence program.

4.2.3 Setting ranges of timer and counter

(1) Timer setting range

(a) Default values of the timer setting ranges are as follows:

Timer points : 256 points 100ms timer : T0 to T199 10ms timer : T200 to T255 Retentive timer : none

(b) When timer-use points are set to 257 or more, the default values will be as follows:

100ms timer : T0 to T199 10ms timer : T200 to T255 100ms timer : T256 to T2047

and T256 to T2047 in 16 point units. By setting the timer points actually to be used, the timer processing time subsequent to the END instruction can be shortened.

(d) Timer setting values are as follows:

T0 to T255 : constant or word device (D) T256 to T2047 : word device (D, W, R) (Allocate a storage device for the set value by setting parameters.)

(2) Counter setting range

(a) Default values of counter setting ranges are as follows:

Counter points : 256 points Normal counter : C0 to C255 Interrupt counter : none

(b) When the counter-use points are set to 256 points or more, the default values will become

as follows: Normal counter : C0 to C255 Normal counter : C256 to C1024

C255, and any counters outside the range cannot be set up. Set up is made with parameters in C224 to C255 in one point unit for the interrupt counter. Any counter in the range C224 to C255 which is not set up as an interrupt counter can be used as a normal counter.

4-15

4. CPU MODULE MELSEC-A

The interrupt counters in C224 to C255 are allocated to the interrupt pointers I0 toI31 as shown below, and count the occurrences of interrupts in I0 to I31.

Interrupt

pointer

I0 C224 I8 C232 I16 C240 I24 C248 I1 C225 I9 C233 I17 C241 I25 C249 I2 C226 I10 C234 I18 C242 I26 C250 I3 C227 I11 C235 I19 C243 I27 C251 I4 C228 I12 C236 I20 C244 I28 C252 I5 C229 I13 C237 I21 C245 I29 C253 I6 C230 I14 C238 I22 C246 I30 C254 I7 C231 I15 C239 I23 C247 I31 C255

Interrupt

counter

Interrupt

pointer

Interrupt

counter

Interrupt

pointer

Interrupt

counter

Interrupt

pointer

(d) Counter-use points can be set arbitrarily in 16 point units using continuous numbers. By

setting the counter which points to the number actually used, the counter processing time subsequent to the END instruction can be shortened.

(e) The counter set values are as follows:

C0 to C255 : constant or word device (D) C256 to C1023 : word device (D, W, R) (Allocate a storage device for the set value by setting parameters.)

POINT

When timer-use points are set to 257 points or more or counter-use points are set to 256 points or more, the set value storage devices (D, W, R), specified at the time of timer/counter use point setup, are automatically set in continuous numbers.

When timer-use points are set to 512 points and set value storage device is set to D1000, D equivalent to 256 points (D1000 to D1255) in T256 to T511 become the devices, with continuous numbers, for the set values

Interrupt

counter

4-16

4. CPU MODULE MELSEC-A

4.2.4 I/O devices

A2USHCPU-S1 has 8192 I/O device points (X/Y0 to 1FFF) each for input (X) and output (Y). There are actual I/O devices and remote I/O devices in this I/O range.

(1) Actual I/O device

This is the device range where an I/O module or special function module can be installed to the basic base module/extension base module and controlled. A2USHCPU-S1: 1024 points (X/Y0 to 3FF)

(2) Remote I/O device

The remote I/O devices, following the actual I/O devices, can be used for the following objectives:

(a) Allocate to a remote I/O station in the MELSECNET(II) data link system. (b) Allocate to a remote I/O station in the MELSECNET/10 network system. (c) Allocate to the reception data storage device or transmission data storage device in the

MELSECNET/MINI-S3's automatic refresh setting.

(d) Use as the substitute to an internal relay.

4.2.5 I/O allocation of special function modules

By registering the model name of the following special function modules upon the I/O allocation from a peripheral device, dedicated commands for special function modules can be used.

Model name of spec ial function

module

AD61 AD61 AD61-S1 AD61S1 AD59 AD59 AD59-S1 AD59S1 AJ71C24 AJ71C24 AJ71C24-S3 AJ71C24S3 AJ71C24-S6 AJ71C24S6 AJ71C24-S8 AJ71C24S8 AJ71UC24 AJ71UC24 AJ71C21 AJ71C21 AJ71C21-S1 AJ71C21S1 AJ71PT32-S3 PT32S3 AD57 AD57 AD57-S1 AD57S1 AD58 AD58 A1SJ71UC24-R2 A1SJ71UC24-R4 A1SJ71UC24-PRF A1SJ71PT32-S3 A1SPT32S3

Model name of the m odule to be set

A1SJ71UC24

POINTS

If a FROM or TO instruction is executed to the special function module frequently with short scanning intervals, the special function module may not be processed normally.

When you execute a FROM or TO instruction to the special function module, adjust the processing time and conversion time using the timer, constant scan and other measures of the special function module.

4-17

4. CPU MODULE MELSEC-A

4.2.6 MELSECNET/MINI-S3 automatic refresh

By setting link information, I/O storage device, etc. of MELSECNET/MINI-S3 to parameters, the module automatically communicates with the buffer memory area for the batch refresh send/received data of A1SJ71PT32-S3/AJ71PT32-S3 master module (abbreviated as the master module hereafter).

Sequence programs can be created using the I/O devices as they are allocated to send/received by the automatic refresh setting. (The FROM/TO instructions are not required.)

POINTS

(1) Since up to 8 master modules can be set for automatic refresh by the parameter, automatic

refresh is possible for up to 8 modules. If 9 or more modules are desired, use the FROM/TO instruction in the sequence program from the 9th module.

(2) Since automatic refresh is not possible with send/received data for separate refresh I/O

module and for remote terminal modules No.1 to No.14, use the FROM/TO instruction for them. However, the remote terminal modules shown below are subject of automatic refresh in a limited area:

•

AJ35PTF-R2 RS-232C interface module

•

AJ35PT-OPB-M1-S3 mount-type tool box

•

AJ35PT-OPB-P1-S3 portable type tool box

(3) For the master modules set up for automatic refresh, CPU automatically turns ON the link

communication start signal Y(n+18) or Y(n+28), so it is not necessary to turn it on from the sequence program.

(4) Automatic refresh of I/O data is performed by batch after the CPU executes the END

instruction. (Automatic refresh processing is performed when the CPU is in the RUN/PAUSE/STEP RUN state).

(5) The master module may perform the processing while link communication start signal

Y(n+28) is OFF depending on the remote terminal module connected. For instance, if the AJ35PTF-R2 RS-232C interface module is used without protocol, it is necessary to write parameters to the parameter area (buffer memory address 860 to 929) while the link communication start signal is OFF. The link communication start signal becomes ON after CPU enters the RUN state and one scan is performed, so write the parameters during the first 1 scan.

Link communication start signal

Y(n+28)

M9038

1 scan

CPU RUN

4-18

4. CPU MODULE MELSEC-A

(1) Parameter setting items, setting ranges and contents of automatic refresh, as well as the buffer

memory address of the master module which is used for exchanging data with A2USHCPU-S1 are shown below. Set the parameters for the number of A1SJ71PT32-S3/AJ71PT32-S3 master modules used.

I/O signal

from the

master

module



110 to 141



10 to 41



1 Number of retries 0 to 32 times



Y(n + 1A)

Y(n + 1B)



memory address of the master

module

Buffer

Item Setting range Description

Number of master



modules

Head I/ O No. I/O points of CPU



Model classification of



MINI/MINI-S3

Total number of remote I/O stations

Received data storage device

Send data storage device

FROM/TO response



specification

Data clear specification for



communication faulty station

100

to 103 195 107 196

209

Error station detection

Error No. T, C, D, W , R

Line error check setting (Line error)

1 to 8 module(s)

MINI or MINI-S3

•

0 to 64 station(s)

•

M, L, B, T, C, D, W, R,

•

none(Bit device: multiples of 16)

•

M, L, B, T, C, D, W, R,

•

none(Bit device: multiples of 16)

Link priority, CPU priority

Priority selection of access to the master module buffer memory

Retain, clear (received data)

M, L, B, T, C, D, W, R, none

(Bit device: multiples of 16)

Test message sending

•

OFF data sending

•

Transmit data immediately

•

before line error

*1 "n" is determined by the installation location of t he master module. *2 When the total number of remote I/O st at i on i s odd, add 1 to the station number to obtain storage devices

occupied.

4-19

Sets the total number of master m odules t o be us ed.

•

Sets the head I/O number where the master module is

•

installed.

MINI.....................In I/O mode (occupies 32 points)

•

MINI-S3...............In expansion mode (occupies 48 points)

•

Set only when MINI is set.

•

In MINI-S3, the number of master m odule's init ial ROMs

•

becomes valid, so the set t ing is not nec es s ary .(When it is set, the setting is ignored).

Sets the devices to st ore rec eived/send data for batch

•

refresh. Specify the head number of a device.

•

Occupies as the automatic refresh area from the head of the

•

device for the number of stations (8 points/station x 64 station = 512 points: bit device) *2 Use of X/Y remote I/O range is recommended for devices.

•

Sets the number of retries upon a communic at ion error.

•

Error is not output if communication is res t ored within the

•

number of retries set.

(1) Link priority ....... Link access by MINI-S3 has the priority.

During the link access, FROM/TO is caused to wait.

Possible to read out the received data ref res hed at t he

•

same timing. Maximum (0.3ms+0.2ms x number of separat e ref res h

•

stations) of FROM/TO instruction wait time may be generated.

(2) CPU priority....... Access by FROM/TO instruction of CPU

Even during the link access, it interrupts

Depending on the timing, received data in the midst of

•

I/O refresh may be read. No wait time for FROM/TO instruction.

•

Retain ..................Retains the received data for batch and

•

Clear....................Sets all points to OFF

•

Sets the head device to store t he f ault y st at ion det ec tion

•

data.

MINI........occupies 4 words; MINI-S3: occupies 5 words.

•

Sets the head device to store t he error c ode on t he

•

occurrence of an error.

MINI........occupies 1 word; MINI-S3.....occupies (1+

•

number of remote terminal modules) words

Sets data sending method for verification of error location on

•

the occurrence of a line error.

has the priority.

and accesses.

separate refresh.

4. CPU MODULE MELSEC-A

(2) Setting of send/received data storage device is explained using the sy stem example shown below.

<Example> When device X/Y400 and later are used as remote I/O stations:

AX41C Station 1 (number of stations occupied: 4 stations)

MELSECNET/MINI

AJ35TB1-16D Station 5 (number of stations occupied: 2 stations)

X0 to X1F

A1S61P

Y20 to Y3F

A2USH

CPU-S1

A1S

X41

A1S

Y41

A1SJ71PT32-S3 master module

• Head I/O number

• Model classification (MINI/MINI-S3)

• Total nu mber of remote I/O stations

: 40 : MINI : 11 stations

AJ35TJ-8R Station 11 (number of stations occupied: 1 station)

AX40Y50C Station 7 (number of stations occupied: 4 stations)

Sample parameter setting of the GPP function software package for the above system configuration is shown below:

Number of modules [1] (0-8)

I/O No. 0040 Model MINI Number of stations 11 Received X0400 Send Y0400 Retries 5 Response CPU Data clear Clear Detection Error number Error Retain

The storage devices for send/received data for the present system example are as follows:

(a) Storage device for received data

Address

110 111 112 113 114 115

b15

Master module

Station 2 Station 4 Station 6 Station 8

Station 10

b8 b7

Input area

Station 1 Station 3

Station 5 Station 7

Station 9 Station 11

X40F X41F X42F X43F

X44F

X45F

A2USHCPU-S1

X408

X418

X428

X438

X448 X458

Used by the system

X407 X417 X427 X437 X447

X457

X400 X410

X420

X430

X440

to to

X450

1) Set the device number (X400) for b0 of the station 1 as a received data storage device.

2) The received data storage device occupies from X400 to X45F. For the present system example, the total number of stations is odd, so it is occupied for one extra station.

3) The device numbers of input modules connected are as follows:

Stations 1 to 4 AX41C → X400 to X41F Stations 5 to 6 AJ35TB-16D → X420 to X42F Stations 7 to 8 AX40Y50C → X430 to X43F

With respect to X440 to X45F, they are simultaneously refreshed, and set to OFF at any time. Do not use X440 to X45F in the sequence program.

4-20

4. CPU MODULE MELSEC-A

(b) Send data storage device

Master module

Address

b15 b8 b7 b0 10 11 12 13 14 15

Station 2 Station 4 Station 6 Station 8

Station 10

Output area

Station 1 Station 3 Station 5 Station 7 Station 9 Station 11

Y40F Y41F Y42F Y43F Y44F Y45F

1) Set the device number (Y400) for b0 of the station 1 as a send data storage device.

2) The send data storage device occupies from Y400 to Y45F. For the present system example, the total number of the stations is odd, so it occupies for one extra station.

3) The device numbers of output modules connected are as follows:

Stations 9 to 10 AX40Y50C → Y400 to Y44F Station 11 AJ35TJ-8R → Y450 to Y457

With respect to Y400 to Y43F and Y458 to Y44F, they are simultaneously refreshed, but are not output.

POINTS

(1) Set the send and received data storage devices so that device numbers do not overlap.

When the received data storage device is set to B0 in the system configuration example, it occupies B0 to B5F as the device range. Set the send data storage device to B60 or later. When the send data storage device is set to B60, the device range will be B60 to BBF.

(2) If a bit device is specified as the send/received data storage device, the device number set

must be a multiple of 16.

<Example> X0, X10 ........ X100, .......

M0, M16, ...... M256, .......

B0, B10, ....... B100, .......

(3) Device range used is (8 points) x (Number of stations).

When the number of stations is an odd number, extra 8 points are necessary.

A2USHCPU-S1

Y408

Y418

Y428

Y438

Y448

Y458

Used by the system

Y407 Y417 Y427 Y437 Y447 Y457

Y400 Y410

Y420

Y430

Y440

Y450

4-21

4. CPU MODULE MELSEC-A

4.3 Function List

Various functions of A2USHCPU-S1 are explained below.

Function (application) Description Outline of setting and operati on

Makes the processing time for a s ingle s c an in the

Constant scan

Program execution at constant intervals

Simplified positioning

Latch (power failure compensation)

Continuous control by data retention on power failure

Automatic refresh of MELSECNET/MINI-S3

Simplification of sequence program

Remote RUN/STOP

When performing RUN/STOP control from outside the PC

PAUSE

When stopping operation of

•

CPU while retaining the output (Y)

When performing

•

RUN/PAUSE cont r o l from outside the PC

Status latch

Carries out operation check and failure factor check on each device when debugging or a failure condition is met.

Sampling trace

Performs chronological checking on the behavior status of devices s et up when debugging or an abnormal behavior is detected.

•

sequence program constant. Set the processing time within the range of 10ms to 190ms

•

in 10ms units. On power supply failure of 20ms or longer/CPU reset/power

•

supply off, data contents of the devices for which latches have been set up in advance are retained.

Latch-enabled devices: L, B, T, C, D, W

•

Latched data are stored in the CPU and backed up by the

•

batteries of the memory cassette. Performs I/O automatic refres h c om m unic at ion with

•

send/received data area for the batch refresh of AJ71PT32S3/A1SJ71PT32-S3 up to a maximum of 8 modules.

Automatic refresh is executed in a batch af t er END

•

processing. The FROM/TO instruction for I/O in the sequence program

•

becomes unnecessary. Programming is poss ible with I/O devices which are allocated directly.

When PC CPU is in RUN (the key s witch is s e t t o RUN),

•

performs the PC's STOP/ RUN from outsid e the PC (external input, peripheral devices, comput er) with a remote control.

Stops the operation processing of PC CPU while retaining

•

the ON/OFF of all the outputs (Y). When the operation is stopped by STOP, all the out put s

(Y) are set to OFF. When PC CPU is in RUN (the key s witch is s e t t o RUN),

•

performs the PC's PAUSE/ RUN from outsi d e the PC (external input, peripheral devices) with a remote control.

With respect to devices to which status latches are set up,

•

when status latch conditions are met, data content s of the devices are stored in the extension file regis t er f or s t at us latch area in the memory cassette. (Stored data are cleared by the latch clear operation).

The criteria for satisfied condition can be selec t ed f rom

•

when the SLT instruction is executed by the sequence program or when the device value matches the set condition.

With respect to a device to which the sampling trace is set

•

up, the operating condition of the devic e is s am pled f or t he number of times specified per scan or per period, and t he results are stored in the expansion file register for s am pling trace (the data stored are cleared by the latch clear operation).

Sampling trace is performed by the STRA instruction in the

•

sequence program.

Write to the special regis t er D9020 by the

•

sequence program

Latch device and latch range are specif ied

•

by setting of peripheral device parameters.

Performed by setting the automatic refres h

•

parameter of a peripheral device. (Refer to Section 4.2.6.)

When performed with the external input (X),

•

parameter is set with a peripheral device. When performed by a peripheral device,

•

perform in the PC test mode. When performed via a c om put er link

•

module, perform using dedicated commands.

Performed by a peripheral device in the PC

•

test mode. When performed with the external input (X),

•

perform parameter setting with a peripheral device, set the special relay M9040 t o ON with the sequence program, then perform.

Using a peripheral device, set the dev ic e t o

•

which the status latch is performed and the extension file register where the data will be stored.

Using a peripheral device, monitor the

•

status latch data.

Using a peripheral device, set up the device

•

to perform sampling trace, trace point , and the expansion file register where number of times and the data will be stored.

Using a peripheral device, monitor the

•

result of sampling trace.

4-22

4. CPU MODULE MELSEC-A

Function (application) Description Outline of setting and operati on

Executes operations of the sequence program with one of

Step operation

Checks conditions of program execution and behavior during debugging, etc.

Clock

Program control by clock data/external display of clock data

Priority order of LED display

Changing priority order of display/canceling display

Self-diagnostic function

Detection of abnormal CPU behavior

Preventive maintenance

•

the conditions (1) to (5) given below, then stops. (1) Executes by each instruction. (2) Executes by each circuit block. (3) Executes by the step intervals and the num ber of loops . (4) Executes by the number of loops and break point. (5) Executes when the device values concur.

Executes operation of the clock built into t he CPU module.

•

Clock data: year, month, day , hour, minute, s ec ond, day of

•

the week When the clock data read reques t (M 9028) is ON, the clock

•

data are read out and stored in D9025 to D9028 by the clock element after the END processing of t he sequence operation.

The clock element is backed up by the battery of the

•

memory cassette. Changes the display order of or cancels the ERROR LED

•

displays other than the error display by an operation stop and the default display items on the LED display device.

When an error that matches one of t he s elf -diagnos is it em s

•

is generated at the CPU power on or during RUN, it prevents malfunctions by st opping t he CPU operation and displaying the error.

Stores the error code corresponding to the self-diagnos is

•

item.

Chooses a stepping operation condition for

•

the peripheral device and executes.

Sets data for D9025 to D9028 by a

•

peripheral device, turns M9025 ON, then write to the clock element.

Writes to the cloc k elem ent by the

•

sequence program. (Dedicated instructions can be used.)

Writes data as to whether change

•

order/cancel display to D9038 or D9039 by the sequence program.

There is a self-diagnosis item with which an

•

operation can be continued or stopped by the setting of peripheral device parameters.

Reads out error code with a peripheral

•

device and performs troubleshooting. (Refer to Section 4.1.4.)

4-23

4. CPU MODULE MELSEC-A

4.4 Precautions When Handling the M odul e

Precautions when handling the CPU module, I/O module, and extension base module, from unpacking to installation, are described below.

•

CAUTION

Use the PC in the environment given in the general specifications of this manual. Using the PC outside the range of the general specifications may result in electric shock, fire or malfunctioning, or may damage or degrade the module.

•

Insert the tabs at the bottom of the module into the mounting holes in the base module before installing the module, and tighten the module fixed screws with the specified torque. Improper installation may result in malfunctioning, breakdowns or cause the module to fall out.

•

Tighten the screws with the specified torque. If the screws are loose, it may result in short circuits, malfunctioning or cause the module to fall out. If the screws are tightened too much, it may damage the screws and the module may result in short circuits, malfunctioning or cause the module to fall out.

•

Make sure the memory cassette is installed securely in its installation connector. After installation, confirm that it is securely tightened. Defective contact may cause malfunctioning.

•

Do not touch the conducted part of the module or electric parts. This may cause malfunctioning or breakdowns.

(1) The module case, memory cassette, terminal block connector and pin connector are made of

resin. Do not fall them or apply a strong shock to them. (2) Do not remove the printed board of each module from its case. Doing so may cause breakdown. (3) While wiring, be careful not to let foreign matter such as wire chips get inside the module. If it

does get in, remove it immediately. (4) Perform tightening of module installation screws and terminal screws on the CPU module, power

supply module, I/O module and special function module with the following torque:

Screw location Tightening torque r a nge

Module installation screws (M4 screw) 78 to 118N·cm Terminal screws for power supply module and I/O module (M3.5 screw) 59 to 88N·cm

4-24

4. CPU MODULE MELSEC-A

)

4.5 Name and Setting of Each Part

The name of each part of the A2USHCPU-S1 module and the switch settings necessary to use

the A2USHCPU-S1 are explained.

4.5.1 The name of each part of the A2USHCPU-S1

(6)

(1)

(2)

(3)

(9)

(8)

MELSEC A2USHCPU-S1

RUN

ERROR

L.CLR

STOP

RUN

RESETRESET

MITSUBISHI

9 8 7 6 5 4 3 2 1

(7)

(10)

(4)

No. Name Application

RUN/STOP: Execu tes/stops the operation of the sequence program.

•

RESET: Resets the hardware.

•

(1) RUN/S TO P k e y switch

Performs reset and initialization of operation when abnormality in operation occurs. LATCH CLEAR (L.CLR): Clears the data in the latch area (to OFF or 0) set by parameters. (With

•

LATCH CLEAR, data in area other than the latch area is also cleared.) For the operation method of the latch clear, refer t o Sec t ion 4. 5. 3.

4-25

4. CPU MODULE MELSEC-A

NO. Name Application

ON: RUN/STOP key switch is in the "RUN" position, and t he s equenc e program operation is

(2) "RUN" LED

(3) "ERROR" LED

(4) RS-422 connector

(5) Cover

(6) Module fixed screws (7) Battery

(8) DIP switches (9) Battery connector

(10)

Connector for memory cassette installation

•

OFF: The "RUN" L E D turns off in the following cas e s :

•

Flashing: The "RUN" LED flashes in t h e f o l l o wing c a s e s:

•

ON: An error has been detected by self-diagnosis.

•

OFF: Normal or when a failure is detected by CHK instruction.

•

Flashing: The annunciator (F) is t urned ON by the sequenc e program .

•

Connector to write/read, monitor and test the main program with peripheral device.

•

Cover it with a lid when no peripheral device is to be connected.

•

Protective cover f or print ed c irc uit board of A2USHCPU-S1, memory cass et t e, RS-422 connec t or,

•

battery, etc. Open the cover to perform the following operations:

•

Screws to fix the module to the base module.

•

For the retention of data for program, latch range devices and file registers (for installation and

•

removal of battery, refer to Section 7.2). The switch to set whether memory protection is enabled or not, when built-in RAM is used.

•

(Refer to Section 4.5.2 for details of the s et t ing. ) For the connection with the connector on the battery side.

•

Connector to install a memory cassette (A2SM CA-14KP/14KE, A2SNMCA-30KE).

•

(It automatically enters into ROM operation when a memory cassette is ins t alled. )

being executed. In case of an error which continues the operation of sequence program occ urs (ref er t o Section 10.3), the LED remains lit.

When RUN/STOP key switch is in the "STOP" pos it ion.

•

Remote STOP is being performed.

•

Remote PAUSE is being performed.

•

An error which causes operation of the sequence program to stop has been detec t ed

•

by self-diagnosis. The latch clear operation is being performed.

•

When an error which has been set to LED OFF in the priority order setting of the LED display is detected, the LED remains OFF.

Installation and removal of the m em ory cas s et t e

•

Setting DIP switches

•

Connecting the battery to the connector

•

Battery replacement

•

4-26

4. CPU MODULE MELSEC-A

4.5.2 Settings for memory protection switch

The memory protection switch is to protect the data in the RAM memory from overwritten by mis-

operation from peripherals. (When the memory cassette is installed and it is running with ROM or

PROM, the setting of memory protection switch is invalid.) It is used to prevent overwriting and deletion of a program after the program is created. Cancel the memory protection switch (OFF) to make corrections on the content of RAM memory. Upon factory shipment, the memory protection is set to OFF.

9 8 7 6 5 4 3 2 1

OFF

POINTS

(1) When the memory protection is used, refer to the address (step number) of each

memory area (sequence program, comment, sampling trace, status latch and file register) to set protection.

(2) When sampling trace or status latch is executed, do not apply the memory protection to

the data storage area. If the protection is applied, the execution results cannot be stored in the memory.

REMARK

When A2SMCA-14KE or A2SNMCA-30KE is used, memory protection is possible with the memory protection setting pins on the body of the A2SMCA-14KE or A2SNMCA-30KE. Refer to Section 7.1.4.

Range of memory protec t ion

(k bytes)

0 to 16 ON 1 16 to 32 ON 2 32 to 48 ON 3 48 to 64 ON 4 64 to 80 ON 5 80 to 96 ON 6

96 to 112 ON 7 112 to 144 ON 8 144 to 256 ON 9

Switch setting

A2USHCPU-S1

4-27

4. CPU MODULE MELSEC-A

4.5.3 Latch clear operation

When latch clear is performed with the RUN/STOP switch, follow the procedures below. If latch clear is performed, devices outside the latch range and error information by self-diagnosis of A2USHCPU-S1 (information on the newest error and the past 15 errors) are also cleared.

(1) Fl i p the RUN/STOP switch from the "STOP" position to "L.CLR" positi on for several times and

make the "RUN" LED to high-speed flicker (ON for about 0.2s, OFF for 0.2s). When the "RUN" LED flickers at high speed, the latch clear is ready for operation.

(2) While the "RUN" LED is flickering at high-speed, flip the RUN/STOP switch from the "STOP"

position to the "L.CLR" position again to complete latch clear and the "RUN" LED turns off. To cancel the latch clear operation midway, flip the RUN/STOP switch to the "RUN" position to set the A2USHCPU-S1 to RUN state, or flip it to the "RESET" posit ion to reset.

REMARK

The latch clear can also be performed by the operation of GPP function. For instance, latch clear by A6GPP can be performed by "Device memory all clear" of the PC mode test function. For the operation procedure, refer to the operating manual for GPP functions.

4-28

5. POWER SUPPLY MODULE MELSEC-A

5. POWER SUPPLY MODULE

5.1 Specifications

The specification of the power supply module are shown below.

Table 5.1 Power supply module specifications

Item

Base installation location

Performance specifications

A1S61PN A1S62PN A1S63P

Power supply module installation slot

Input power supply

Input frequency

Maximum input a ppa rent power

Inrush current

Output current

rating

Overcurrent

protection

Overvoltage

protection

Efficiency

Allowable per iod of momentary power

failure

Dielectric

withstand voltage

Insulation resistance

Noise durability

Operation display

Terminal screw size

Applicable wire size

Applicable crimp-style terminal

Applicable ti ght e ning torque

External dim e ns ions (mm (inch))

Weight (kg)

5VDC

24VDC

5VDC

24VDC

5VDC

24VDC

Primary-5VDC

Primary-24VDC

*1 Since a varistor is installed between AC and LG, do not apply a voltage of 400 volts or more between AC and LG.

+10%

100 to 240VAC

(85 to 264VAC)

50/60Hz±5%

105VA 41W

20A 8ms or less 81A 1ms or less

5A 3A 5A

0.6A



5.5A or above 3.3A or above 5.5A or above

0.66A or above



20ms or less 1ms or less

Between input: batch LG and output: batch FG, 2,830VAC

Between input: batch LG and output: batch FG 500VAC

By noise simulator with noise voltage of 1,500Vp-p, noise

•

width of 1µs, and noise frequency of 25 to 60Hz. Noise voltage IEC801-4, 2kV

•

rms/3 cycle (altitude 2,000m (6562 ft)

(5MΩ or above by insulation resistance test er)

LED display (ON for 5VDC output)

130 (5.12) × 55 (2.17) × 93.6 (3.69)

0.60 0.60 0.50

-15%

5.5 to 6.5V



65% or above

M3.5 × 7

0.75 to 2mm

RAV1.25-3.5, RAV2-3.5

59 to 88N·cm

5MΩ or above by insulation

By noise simula to r with noise

voltage of 500Vp-p, noise

width of 1µs, and noise

frequency of 25 to 60Hz.

+30%

24VDC

-35%

(15.6 to 31.2VDC)



500VAC



resistance tester

5-1

5. POWER SUPPLY MODULE MELSEC-A

POINT

*1: Overcurrent protection

If the current above the spec value flows in the 5VDC or 24VDC circuit, overcurrent protection device interrupts the circuit and stops the system operation. LED display of the power supply module is either OFF or ON dimly, due to the voltage drop.

When this device is once activated, remove factors of insufficient current capacity and shortcircuit before starting up the system. When the current restores to the normal value, the system performs the initial start.

*2: Overvoltage protection

When 5.5V to 6.5V of overvoltage is applied to the 5VDC circuit, overvoltage protection device interrupts the circuit and stops the system operation.

LED display of the power supply module turns OFF. To restart the system, turn OFF the input power supply, then back to ON. The system performs the initial start.

If the system does not start and LED display remains OFF, the power supply module needs to be replaced

*3: Allowable period of momentary power failure

This indicates allowable period of momentary power failure of PC CPU, and is determined by the power supply module used. Allowable period of momentary power failure for a system using A1S63P is the period it takes until the 24VDC falls below the specified voltage (15.6VDC) after cutting off the primary power supply of the stabilized power supply, which supplies the 24VDC power to A1S63P.

5-2

5. POWER SUPPLY MODULE MELSEC-A

MEMO

5-3

5. POWER SUPPLY MODULE MELSEC-A

5.1.1 Selecting a power supply module

Power supply module is selected based on to the total current consumption of the I/O module, special function module and peripheral devices to which power is supplied by the subject power supply module. When extension base module A1S52B, A1S55B, A1S58B, A52B, A55B or A58B is used, take into consideration that the power to the module is supplied by the power supply module of the basic base. For 5VDC current consumption of I/O modules, special function modules and peripheral devices, refer to Section 2.3.

Power supply module

CPU

I/O module A1SX10 , A 1S Y 1 0, etc.

Special function module A1SD61, A1SD71-S2, etc.

Peripheral device A8PU, A6WU, etc.

(1) Power supply module selection when extension base module A1S52B, A1S55B,

A1S58B, A52B A55B, or A58B is used

When extension base module A1S52B, A1S55B, A1S58B, A52B A55B, or A58B is used, 5VDC power is supplied from the power supply module of the basic base module via extension cable. Thus, when one of these modules is used, be careful with the following: (a) Select a 5VDC power supply module of the basic base module with sufficient capacity

to supply 5VDC current consumed by A1S52B, A1S55B, A1S58B, A52B A55B, or A58B.

Example

If 5VDC current consumption on the basic base module is 3A and 5VDC current consumption on the A1S55B is 1A, then, the power supply module installed to the basic base module must be

A1S61P(5VDC 5A).

(b) Since the power to A1S52B, A1S55B, A1S58B, A52B A55B, or A58B is supplied via

extension cable, a voltage drop occurs through the cable. It is necessary to select a power supply module and cable with proper length so that 4.75VDC or more is available at the receiving end. For the details of voltage drop, refer to Section 6.1.3, the operation standard of extension base module.

Peripheral device AD71TU

When making a selection, current

consumption of the peripheral devices connected to the special function module must be taken into account. For example, if AD71TU is connected to A1SD71-S2, the current consumption of the AD71TU must be considered also.

5-4

5. POWER SUPPLY MODULE MELSEC-A

5.2 Name and Setting of Each Part

Name of each part of different power supply modules is provided below.

MELSECA1S61PN

POWER

MITSUBISHI

INPUT 100-240VAC

)

105VA

50/60Hz

OUTPUT 5VDC 5A

(FG)

(LG)

INPUT

100Ð240VAC

A1S61PN

(1) A1S61PN

MELSECA1S62PN

POWER

MITSUBISHI

INPUT 100-240VAC

105VA

50/60Hz

OUTPUT 5VDC 3A 24VDC 0.6A

(2) A1S62PN

No. Name Application

1) "POWER" LED LED for the display of 5VDC power supply

24VDC, 24GDC terminal

For power supply to the module which requires 24VDC power at inside the output m odule (s upplied t o the module via external wiring).

3) FG terminal Ground terminals connected to shielding patterns on the printed circuit board.

4) LG terminal

For grounding the power supply filter. In case of A1S61P and A1S62P, it has a potential of half the input voltage.

+24V

24G

(FG)

(LG)

INPUT

100Ð240VAC

A1S62PN

5-5

5. POWER SUPPLY MODULE MELSEC-A

MELSECA1S63P

POWER

31.2V

MITSUBISHI

OUTPUT DC 5V 5A

LG +24V

INPUT 24G

INPUT DC15.6

(3) A1S63P

(Continued to the following page)

No. Name Application

Power supply input

5) terminals

Power supply input

6) terminals

Input terminal for power supply. Connect the 24VDC direct current power supply.

Input terminal for power supply. Connect the 100VAC to 200VAC alternating current power supply.

7) Terminal screw M3.5 × 7

8) Terminal cover A protective cover for the terminal block.

9) Module fixing screws Screws to fix the module to the base module.

(M4 screw; tightening torque range: 78 to 118N·cm)

POINT

(1) Do not wire to terminals not used by FG or LG on the terminal block (terminals for which no

name is provided on the terminal block cover).

(2) The protective ground terminal

above.

LG must be grounded with class D (class-3) grounding or

5-6

6. BASE UNIT AND EXTENSION CABLE MELSEC-A

6. BASE UNIT AND EXTENSION CABLE

6.1 Specification

Specifications of the base units (basic base unit and extension base unit) applicable to the system and of extension cables, and the usage standards of extension base unit are explained.

6.1.1 Base unit specifications

(1) Basic base unit specifications

Table 6.1 Basic base unit specifications

Model Item

I/O module installation range Extension connection capability Possible

Dimensions of the installation hole External dimensions (mm (inch)) 220 (8.66) × 130

Weight (kg) 0.52 0.65 0.75 0.97 Accessories Installation screws; M5 × 25, 4 pcs.

(2) Extension base unit specifications

Model Item

I/O module installation range 5 modules can be

Power supply module installation requirement Dimensions of the installation hole Dimensions of terminal screw Applicable wire size Applicable crimp-style terminal

External dimensions (mm (inch)) 315 (12.40) × 130

Weight (kg) 0.71 0.95 0.38 0.61 0.87 Accessories Installation screws; M5 × 25, 4 pcs. *1 Dustproof cover (for I/O module): 1 pc.

*1 For the installation of t he rustproof cover, refer to Sect i on 8.6.

A1S32B A1S33B A1S35B A1S38B

2 modules can be installed.

(5.12) × 28 (1.10)

3 modules can be installed.

6 bell-shaped holes (for M5 screws)

255 (10.03) × 130

(5.12) × 28 (1.10)

5 modules can be installed.

325 (12.80) × 130

(5.12) × 28 (1.10)

8 modules can be installed.

430 (16.92) × 130 (5.12) × 28 (1.10)

Table 6.2 Extension base unit specifications

A1S65B A1S68B A1S52B A1S55B A1S58B

8 modules can be installed.



420 (16.54) × 130 (5.12) × 28 (1.10)

installed.

Power supply module required Power supply module not required

 



(5.12) × 28 (1.10)

2 modules can be installed.

6 bell-shaped holes (for M5 screw)

0.75 t o 2m m2

135 (5.31) × 130

(5.12) × 28 (1.10)

(Applicable tightening torque: 118N·cm)

Attachment screws: M5 × 25, 4 pcs.

5 modules can be installed.

6 (FG terminal)

(V) 1.25-4 (V) 1.25-YS4(V)2-YS4A

260 (10.24) × 130 (5.12) × 28 (1.10)

8 modules can be installed.

365 (14.37) × 130 (5.12) × 28 (1.10)

POINT

For the usage of the base units which do not require power supply module A1S52B, A1S55B and A1S58B, refer to the power supply module selection in Sections 5.1.2 and 6.1.3.

6.1.2 Extension cable specifications

The specificat ions of the extension cables applicable to the A2USHCPU-S1 system are shown in Table 6. 3.

Table 6.3 Extension cable specifications

Item

Cable length (m (ft)) 0.055 (0.18) 0.33 (1.08) 0.7 (2.30) 1.2 (3.94) 3.0 (9.84) 6.0 (19.69) 0.45 (1.48) 0.7 (2.30) 3 (9.86) 5 (16.43) Resistance of 5VDC supply line (Ω(at 55

C))

Application Connection between the basic base and the extension base Weight (kg) 0.025 0.10 0.14 0.20 0.4 0.65 0.2 0.22 0.4 0.56

A1SC01B A1SC03B A1SC07B A1SC12B A1SC30B A1SC60B A1SC05NB A1SC07NB A1SC30NB A1SC50NB

0.02 0.021 0.036 0.055 0.121 0.182 0.037 0.045 0.12 0.18

When an extension cable is used, do not bunch it with the main circuit (high voltage, large current) line or place close to each other.

6-1

6. BASE UNIT AND EXTENSION CABLE MELSEC-A

6.1.3 Usage standards of extension base units (A1S52B, A1S55B, A1S58B, A52B, A55B, A58B)

When the A1S52B, A1S55B, A1S58B, A52B, A55B or A58B extension base unit is used, confirm that the receiving port voltage (voltage of the module installed to the last slot of the extension base unit) is 4.75V or higher.

Since the power supply module on the basic base unit supplies 5VDC to A1S52B, A1S55B, A1S58B, A52B, A55B and A58B extension base unit, a voltage drop occurs through base unit or extension base unit. If the specified voltage is not supplied at the receiving end, misinput and misoutput may result. When voltage at the receiving end is less than 4.75V, change the extension base unit to A1S65B, A1S68B, A62B, A65B or A68B with the power supply.

(1) Conditions for selection

Receiving voltage of the module installed to the final slot of A1S52B, A1S55B, A1S58B, A52B, A55B or A58B type extension base unit must be 4.75V or above.

The output voltage of the power supply module is set to 5.1V or above. Thus, it can be used if the voltage drop is 0.35V or less.

(2) Elements of voltage drop

Elements of voltage drop (a) to (c) are shown in figure below according to the connection method of the extension base unit and the type of extension base unit.

(a) A voltage drop at the basic base unit is shown. (b) A voltage drop at the extension base unit is shown.

A1S52B, A1S55B or A1S58B extension base unit is used.

A52B, A55B or A58B extension base unit is used.

Extension base unit is connected to the left

* The voltage drop at the basic base unit is

negligible.

* The voltage drop at the basic base unit is

negligible.

side of the basic base unit

(series installation).

A1S3

(c)

A1S5

A1S3

(b)

Extension base unit is connected to the right

* The voltage drop at the extension base unit is

negligible.

side of the basic base unit

(parallel installation).

A1S3

(a)

A1S3

(a)

(c)

A1S5

(b)

6-2

6. BASE UNIT AND EXTENSION CABLE MELSEC-A

(3) Voltage drop calculation method

A2USH

CPU-S1

CPU

, V0 to V7 : Voltage drop at each slot of the basic base unit

CPU

, I0 to I7 : Current consumption at each slot of the basic base unit

V8 to V15 : Voltage drop at each slot of extension base unit I8 to I15 : Current consumption at each slot of the extension base unit

(a) Calculation of voltage drops with the basic base unit (A1S32B, A1S33B, A1S35B,

A1S38B)

Resistance with the basic base unit is 0.007Ω per slot. Calculate a voltage drop at

each slot and obtain the total voltage drop.

1) Voltage drop at the CPU module: V

CPU

=0.007 × (I

CPU

+ I0 + I1 + I2 + I3 + I4 + I5 + I6 + I7 + I8 + I9 + I10 + I11 + I12 + I13 + I14 +

)

2) Voltage drop at slot 0: V0 V0=0.007 × (I0 + I1 + I2 + I3 + I4 + I5 + I6 + I7 + I8 + I9 + I10 + I11 + I12 + I13 + I14 + I15)

3) Voltage drop at slot 1: V

V1=0.007 × (I1 + I2 + I3 + I4 + I5 + I6 + I7 + I8 + I9 + I10 + I11 + I12 + I13 + I14 + I15)

4) Voltage drop at slot 2: V2

=0.007 × (I2 + I3 + I4 + I5 + I6 + I7 + I8 + I9 + I10 + I11 + I12 + I13 + I14 + I15)

5) Voltage drop at slot 3: V3 V3=0.007 × (I3 + I4 + I5 + I6 + I7 + I8 + I9 + I10 + I11 + I12 + I13 + I14 + I15)

6) Voltage drop at slot 4: V

V4=0.007 × (I4 + I5 + I6 + I7 + I8 + I9 + I10 + I11 + I12 + I13 + I14 + I15)

7) Voltage drop at slot 5: V

=0.007 × (I5 + I6 + I7 + I8 + I9 + I10 + I11 + I12 + I13 + I14 + I15)

8) Voltage drop at slot 6: V

=0.007 × (I6 + I7 + I8 + I9 + I10 + I11 + I12 + I13 + I14 + I15)

9) Voltage drop at slot 7: V

=0.007 × (I7 + I8 + I9 + I10 + I11 + I12 + I13 + I14 + I15)

10) Total voltage drop at the basic base unit : V

CPU

+ V0 + V1 + V2 + V3 + V4 + V5 + V6 + V7

CPU

6-3

6. BASE UNIT AND EXTENSION CABLE MELSEC-A

(b) Calculation of voltage drops of the extension base unit (A1S52B, A1S55B, A1S58B) Resistance with the extension base unit is 0.006 Ω per slot. Calculate a voltage drop

at each slot and obtain the total voltage drop.

Ω

A1SC30B..............0.121 Ω

A1SC60B..............0.182 Ω

A1SC05NB...........0.037 Ω

A1SC07NB...........0.045 Ω

1) Voltage drop at slot 8: V

=0.006 × (I8 + I9 + I10 + I11 + I12 + I13 + I14 + I15)

2) Voltage drop at slot 9: V9 V9=0.006 × (I9 + I10 + I11 + I12 + I13 + I14 + I15)

3) Voltage drop at slot 10: V V10=0.006 × (I10 + I11 + I12 + I13 + I14 + I15)

4) Voltage drop at slot 11: V11

=0.006 × (I11 + I12 + I13 + I14 + I15)

5) Voltage drop at slot 12: V12 V12=0.006 × (I12 + I13 + I14 + I15)

6) Voltage drop at slot 13: V V13=0.006 × (I13 + I14 + I15)

7) Voltage drop at slot 14: V14

=0.006 × (I14 + I15)

8) Voltage drop at slot 15: V15 V15=0.006 × I15

9) Total voltage drop of the extension base unit : Vz Vz=V

+ V9 + V10 + V11 + V12 + V13 + V14 + V15

[1] Total current consumption of the extension base unit: Iz Iz= I

+ I9 + I10 + I11 + I12 + I13 + I14 + I15 [2] Voltage drop of the extension cable: Vc Vc=(Resistance of the extension cable) x Iz

Resistance of extension cable

A1SC01B ...........0.02

A1SC03B ...........0.021

A1SC07B ...........0.036

A1SC12B ...........0.055

(d) Confirmation of voltage at the receiving end (5.1(V)-V

K-VZ-VC

) ≥ 4.75(V)

6-4

6. BASE UNIT AND EXTENSION CABLE MELSEC-A

(4) Calculation examples

A1S38B

A1S62P

A1SX40

A2USHCPU-S1

(a) Calculation of voltage drop of the basic base unit

= 0.007 × {0.32 + 0.05 × (9+8+7+6+5+4+3+2) + (0.27 × 8) × 9} = 0.15372

(b) Calculation of voltage drop of the extension base unit

= 0.006 × 0.27 × (8+7+6+5+4+3+2+1) = 0.05832

= 0.021 × (0.27 × 8) = 0.04536

(d) Confirmation of voltage at the receiving end

5.1 - 0.15372 - 0.05832 - 0.04536 = 4.8426(V) Above system can be used, since the voltage at the receiving end is more than 4.75V.

(5) Scheme to reduce the voltage drop

Following methods are effective in reducing the voltage drop: (a) Change the installation location of the module Install modules with a large current consumption subsequently starting from slot 0 of

the basic base unit.

Install modules with a small current consumption to the extension base unit. (b) Attachment of base units in series By attaching base units in series (connect the extension cable to the left side of the

basic base module), the voltage drop with the basic base unit can be made negligible.

However, if the extension cable used is long, the voltage drop through it may become

larger than that with the basic base unit, so calculate the voltage drop according to (3) above.

become. Use the shortest extension cable possible.

A1SX40

A1S03B (0.021 )

A1SX40

A1S58B

A1SY40

6-5

6. BASE UNIT AND EXTENSION CABLE MELSEC-A

6.2 Name and Setting of Each Part

Name of each part of the base unit is explained.

(1) Basic base u nit (A1S32B, A1S33B, A1S35B, A1S38B)

OUT

POWER

CPU

I/O

A1S38B

OUT

No. Name Application

1) Connector for extension cable

Connects the extension cable with the connector for exchanging signals with the extension base unit.

2) Base cover

A protective cover f or t he c onnec t or f or t he extens ion c able. When installing an extension, it is necessary to remove the area enclosed by the groove below the OUT sign on the base cover with a tool, such as a cutting nipper, etc.

3) Module connector Connectors for power supply module, CPU module, I/O module, and the special function module. To prevent the intrusion of dust, install the accessory connector cover or a blank cover (A1SG60)

to the connectors to which no module is installed.

4) Module fixing screw Screw to fix the module to the base. Screw size: M4 × 12

5) Base installation hole

A bell-shaped hole to mount the present base unit to a panel, s uc h as the control panel. (For M5 screw)

6) Hook for DIN rail Hook for DIN rail attachment.

A1S32B, A1S33B: .............1 pc.

A1S35B, A1S38B: .............2 pcs

IMPORTANT

Only one extension base unit can be connected to the basic base unit. If an extension base unit is connected to each of the two connectors of the basic base unit, misinput and misoutput may result.

6-6

6. BASE UNIT AND EXTENSION CABLE MELSEC-A

(2) Extension base unit

1S65B, A1S68B

I/O

1S52B, A1S55B, A1S58B

POWER

I/O

A1S68B

I/O

A1S58B

No. Name Application

1) Connector for extension cable

A connector for exchanging signals with the basic base unit. An extension cable is connected to it. Remove the accessory connec t or c over to connect an extension cable.

2) Base cov er A protective cover for the connector for the extension cable.

3) Module connector

Connectors for the power supply module, CPU module, I/O module, and the special func t ion module.

To prevent the intrusion of dust, install the accessory connector cover or a blank cover (A1SG60) to the connectors to which no module is installed.

4) Module fixing screw Screw to fix the module to the base. Screw size: M4 × 12

5) Base installation hole

A bell-shaped hole to mount the present base unit to a panel, s uc h as t he c ont rol panel. (f or M 5 screw)

6) Hook for DIN rail Hook for DIN rail attachment.

A1S52B, A1S55B: .......................1 pc.

A1S65B, A1S68B A1S58B: .........2 pcs

7) FG terminal Ground terminal connected to the shielding pattern on t he print ed c irc uit board.

6-7

7. MEMORY CASSETTE AND BATTERY MELSEC-A

7. MEMORY CASSETTE AND BATTERY

7.1 Memory Cassette

Specifications, precautions when handling, and procedures for installation and removal of the memory are described.

7.1.1 Specifications

Specifications of the memory are shown in Table 7.1.

Table 7.1 Specifications of the memory

Model Item

Memory specification EPROM E2PROM

Memory capacity

External dimensions

(mm (inch)) Weight (kg) 0.03

7.1.2 Precautions when handling the memory cassette

A2SMCA-14KP A2SNMCA-30KE

64k bytes

(Maximum 14k steps)

15 (0.59)× 68.6 (2.70) × 42 (1.65)

64k bytes

(Maximum 30k steps)

15 (0.59) × 69.6 (2.74)

40.5 (1.59)

Precautions when handling the memory cassette are as follows:

(1) The memory cassette and the pin connector are made of resin; do not fall them to the

ground or apply a strong shock to them.

(2) Do not remove the printed board of each memory cassette from the case. Doing so may

cause breakdowns.

(3) Be careful not to let foreign matter such as wire chips get inside the module. If it does get

inside the module, remove it immediately.

(4) When installing the memory cassette to the A2USHCPU-S1 main module, securely connect

it to the connector.

(5) Do not place memory cassettes on a metal with or with a possibility of leak, or on a wooden

material, plastic, vinyl, fiber, electric wire, paper, etc. that bears static electricity. (6) Do not touch the lead of the memory. This may damage the memory. (7) Do not touch the connector of the memory cassette for the CPU. This may result in false

contact.

IMPORTANT

(1) When the memory cassette is installed to or removed from the A2USHCPU-S1, the power

supply must be OFF. If it is installed or removed while the power supply is ON, the content of the memory of the memory cassette will be destroyed.

(2) The RAM memory built in the A2USHCPU-S1 (parameter, T/C set value, main program,

MELSECNET/10 network parameters) will not be overwritten by installing the EEP-ROM

memory cassette and turning ON the power to the A2USHCPU-S1. If an EP-ROM memory cassette is installed, the main program will not be overwritten. However, when contents of the RAM memory are important, make the backup of the data

using a peripheral device, then install the memory cassette. (3) The A1SMCA-

KE/ KP memory cassette cannot be installed to the A2USHCPU-S1.

7-1

7. MEMORY CASSETTE AND BATTERY MELSEC-A

7.1.3 Installation and removal of memory cassette

•

CAUTION

How to install and remove the memory cassette is described below.

(1) Installation of the memory cassette

Make sure the memory cassette is installed securely in its installation connector. After installation, confirm that it is securely tightened. Defective contact may cause malfunctioning.

Hook

2USHCPU-S1

Hook

A2USHCPU-S1

Hook

Hook catch

A2SMCA

-14KP

(a) Position the side of the memory cassette with the model name facing the operator, then turn it

so that the model name is displayed on the top. Insert it into the memory cassette installation port of the A2USHCPU-S1 until it makes a clicking sound (until the clip catches it).

(b) Confirm that the hooks provide on the top and bottom of the memory cassette are firmly

engaged with the hook catches. (If the memory cassette is not installed correctly, the front cover of the A2USHCPU-S1 module does not close.)

(2) Removal of the memory cassette

Projections for hook disengagement

A2USHCPU-S1

A2SMCA

-14KP

A2USHCPU-S1

A2SMCA

-14KP

(a) Pull the memory cassette while holding the projections for hook disengagement provided on

the top and bottom areas of the memory cassette by hand.

7-2

7. MEMORY CASSETTE AND BATTERY MELSEC-A

7.1.4 Procedure for writing sequence program t o A2SMCA-14KP

Writing a program to and erasing from A2SMCA-14KP can be accomplished by a ROM writer/eraser. If A2SMCA-14KP is installed to the ROM socket of A6GPP or A6WU, the memory write adapter (A2SWA-28P) is necessary. How to use the A2SWA-28P is explained below.

(1) To write a program to the A2SMCA-14KP, it is necessary to divide it into odd-number

addresses and even-number addresses. Set the address type to write using the ODD/EVEN selection pin of the A2SWA-28P.

(2) Connect the A2SMCA-14KP to the connector of A2SWA-28P. Be careful with the direction

of the connector.

(3) Connect the A2SWA-28P to which A2SMCA-14KP is connected to a ROM socket of A6GPP

or A6WU. At this juncture, pay attention not to mistake the connecting position. The pin near the notched corner of the A2SWA-28P is the pin No.1.

Notch

ROM socket

ODD/EVEN selection pin

A2SWA-28P

A2SMCA-14KP

7-3

7. MEMORY CASSETTE AND BATTERY MELSEC-A

7.1.5 Memory protection setting of A2SNMCA-30KE

When A2USHCPU-S1 with A2SNMCA-30KE installed is used, it is necessary to setup the memory protection on the body of A2SNMCA-30KE to prevent overwriting E

PROM memory contents due to misoperation from a peripheral device. 64k bytes of the user memory area is protected as a whole by setting the memory protection setting pin to ON.

To correct the ROM memory contents, cancel the memory protect (OFF). At the time of factory shipment, memory protection setting pin is set to OFF. For memory area allocation, refer to Section 4.2.2.

OFF

Jumper

Memory protection setting pin

M.PRO

Shows the memory protection canceled state.

A2SNMCA-30KE

7-4

7. MEMORY CASSETTE AND BATTERY MELSEC-A

7.2 Battery

Specification, precaution when handling and the installation procedure or the battery are described below.

7.2.1 Specifications

Specifications of the battery used for the power failure retention function are shown in Table 7.2.

Table 7.2 Battery specifications

Model Item

Nominal voltage 3.6VDC

Battery warranty period 5 years

Application For IC-RAM memory back up and power failure retention function

External dimensions (mm (inch))

7.2.2 Precautions when handling

Precautions when handling the battery are provided below.

(1) Do not short it. (2) Do not disassemble it. (3) Do not put it in a fire. (4) Do not heat it. (5) Do not solder to the electrodes.

7.2.3 Battery installation

A6BAT

16 (0.63) × 30 (1.18)

Battery connector is removed to prevent consumption of the battery during shipping and storage. Connect the lead connector of the battery to the battery connector on the A2USHCPU-S1 print board before using A2USHCPU-S1 for the following objectives:

•

To use the sequence program in the user program area in the A2USHCPU-S1.

•

To use the power failure retention function.

A2USHCPU-S1

Battery connector

A6BAT

7-5

8. LOADING AND INSTALLATION MELSEC-A

8. LOADING AND INSTALLATION

To increase the system reliability and fully utilize the functions, procedures and cautions concerning loading and installation are described below.

8.1 Concept of Failsafe Circuit

When turning the power supply of the PC ON or OFF, because of the delay and the difference in the startup time between the power supply in the PC main module and the external power supply for processing (especially DC), processing output may not operate normally for a moment.

For instance, when the PC power supply is turned on after a DC output module is turned on with the external power supply for processing, the DC output module may misoutput momentarily upon PC power-on. Therefore, it is necessary to construct a circuit whereby the power supply of the PC main module can be energized first.

In addition, it may cause an abnormal operation when there is an abnormality in the external power supply or a failure with the PC.

To prevent these abnormalities from causing abnormal behaviors of the system as a whole, and from the stand point of failsafe, the circuits which may cause mechanical failures or accidents (the emergency stop circuit, protection circuit, interlock circuits, etc.) should be constructed outside the PC. An example of system circuit design in accordance with the view point mentioned above is shown on the next page.

DANGER

•

Provide safety circuits in the outside of the PLC to ensure that the whole system

will operate safely if an external power supply fault or PLC failure occurs. Not doing so may cause accidents due to improper output or malfunction.

(1) Configure circuits, such as emergency stop circuits, protective circuits,

oppositely operating interlock circuits, e.g. forward rotation and reverse rotation, and machine damage prevention interlock circuits, e.g. upper and lower limits of positioning, in the outside of the PLC.

(2) If the PLC detects either of the following faulty states, it stops arithmetic

operation and turns off all outputs.

•

When the overcurrent or overvoltage protection device of the power supply module operates.

•

When a fault is detected by the self-diagnostic function of the PLC CPU such as a watchdog timer error.

At the occurrence of a fault in the I/O control section, etc. that cannot be detected by the PLC CPU, all outputs may turn on. Configure failsafe circuits or provide mechanisms in the outside of the PLC to ensure that the machine operation will be performed safely at such times.

(3) Depending on the failures of the output module relays, transistors, etc., the

outputs may remain on or off. Provide external monitoring circuits for the output signals that may lead to serious accidents.

•

If excessive current higher than the rating or caused by a load short circuit, etc.

keeps flowing in the output module for a long period of time, smoking or ignition may occur. Therefore, provide external safety circuits such as fuses.

8-1

8. LOADING AND INSTALLATION MELSEC-A

(1) Example of system circuit design

In case of AC/DCIn case of AC

Power supply

Startup switch

Stop switch

RA2

Output module

Transformer

Fuse

M9006

M9039

Program

RA1

CPU

M9084

Input module

RA1

Signal input for DC power supply establishment

Startup/stop circuit Startup possible with RA1 ON which is a RUN output of the PC.

Alarm output (lamp or buzzer)

Becomes ON with RUN by M9039

Power supply

Startup switch

Stop switch

Transformer

Fuse

M9006

M9039

M10

RA1

RA2

Transformer

M9084

MC1 N0 M10

Input module

Fuse

DC current

(+)

( )

Fuse

RA2

TM setting shall be time until the DC input signal is established.

A voltage relay is recommended.

Output module

MC2

MC1

MC2

RA2

Power supply to output devices becomes OFF on STOP Upon emergency stop, Upon stopping by hitting the limit

Interlock circuits Interlocking circuits are constructed outside for parts which may lead to conflicting operations, such as forward and reverse rotations, mechanical failure and accidents.

Startup procedure of power supply is as follows:

In case of AC

[1] Set CPU module to "RUN." [2] Turn the power "ON." [3] Set the start switch to "ON." [4] Set the m agnet ic c ont ac t or (M C) "ON" to start driving drive

output devices by a program.

Output module

MC2

MC1

RA1

MC1

MC2

Alarm output

(lamp or buzzer)

Becomes ON with

RUN by M9039

MCMC

Power supply to output devices becomes OFF on STOP Upon emergency stop, Upon stopping by hitting the limit

In case of AC/DC

[1] Set CPU module to "RUN." [2] Turn the power "ON." [3] Set RA2 to "ON" when DC power supply is established. [4] Set the timer (TM) to "ON" upon 100% establishment of DC power

supply. (Set value for TM shall be the period from RA2 turned "ON" to 100%

establishment of DC power supply. Use the set value of 0.5s. ) [5] Set the start switch to "ON." [6] Set the magnetic contactor (MC) "ON" to start driving drive output

devices by a program.

(When a voltage relay is used f or RA2, t he t im er in t he program (TM)

is not necessary.)

8-2

8. LOADING AND INSTALLATION MELSEC-A

(2) Failsafe measures against PC failure

Failures in the PC CPU and memory are detected by the self-diagnostic function, but the CPU may not be able to detect abnormalities in the I/O control area, etc. In such cases, there is a possibility of setting all points to ON or OFF, or a situation may develop where normal operations and safety of the controlled subject cannot be assured, depending on the condition of the failure.

Although as a manufacturer, every possible measure is implemented to assure the product quality, the failsafe circuit should be constructed outside by the user so that if the PC fails for some reason, it would not cause any mechanical damages or accidents. An example of failsafe circuit is shown below.

On-delay timer

Y00

Internal program

M9032

Y00

0.5s

CPU module Output module

Y00

Y01

Y0F

24V

External load

Off-delay timer

– +

T2T1

24VDC

*1 Since Y00 repeats ON/OFF with 0.5s intervals, use a contactless output module (transistor is

used in the above example).

*2 If an offdelay timer (especially miniature timer) is not available, construct the failsafe circuit

using an ondelay timer shown on the next page.

8-3

8. LOADING AND INSTALLATION MELSEC-A

When constructing a failsafe circuit using ondelay timers only

On-delay timer

Y00

Internal program

M9032

0.5s 0.5s

Y00

Y01

Y0F

24V

External load

– +

On-delay timer

24VDC

CPU module Output module

*1 Use a solid state relay for the M1 relay.

8-4

8. LOADING AND INSTALLATION MELSEC-A

8.2 Installation Environment

Avoid the following conditions for the installation location of A2USHCPU-S1 system: (1) Location where the ambient temperature exceeds the range of 0 to 55°C.

(2) Location where the ambient humidity exceeds the range of 10 to 90%RH. (3) Location where condensation occurs due to a sudden temperature change. (4) Location where corrosive gas or flammable gas exists. (5) Location where a lot of conductive powdery substance such as dust and iron filing, oil mist, salt, or

organic solvent exists. (6) Location exposed to direct sunlight. (7) Location where strong electric fields or magnetic fields form. (8) Location where vibration or impact is directly applied to the main module.

8.3 Calculation Method of Heat Amount Generated by the PC

It is necessary to keep the temperature of the panel which stores the PC to the operating ambient temperature of the PC, which is 55°C, or below. For radiation design of the panel, it is necessary to know the average power consumption (heat generation) of the devices and machinery stored inside. In this section, a method to obtain the av erage power consumption of the A2USHCPU-S1 system is explained. Calculate the temperature increase in the panel from the power consumption.

Calculation method of average power consumption The power consuming parts of the PC may be roughly classified into the blocks as shown below:

AC power supply

Power supply

module

External

24VDC

power

supply

CPU

module

24V

5VDC line

24VDC line

Output module

Relay

transistor

Output current

) V

OUT

drop

Output current

OUT

LOAD

)

Input

module

Input current

) E

AC E

Input

current

Special

function

module

Current

)

(1) Power consumption by power supply module

The power conversion efficiency of the power supply module is about 70%, and 30% is consumed

as heat generated, thus, 3/7 of the output power is the power consumption. Therefore, the

calculation formula is:

Wpw= {(I

3 7

× 5) + (I

24V

× 24)} (W)

I5V : Current consumption of 5VDC logic circuit of each module

24V

: Average current consumption of 24VDC power supply for internal consumption of the output

module (Current consumption equivalent to the points simultaneously ON)

.............. Not applicable to a system where 24VDC is supplied externally and a power

module which does not have a 24VDC output is used.

(2) Total power consumption of each module at 5VDC logic part

Power of the 5VDC output circuit of the power supply module is the power consumption of each

module.

5V=I5V

× 5 (W)

8-5

8. LOADING AND INSTALLATION MELSEC-A

(3) Total 24VDC average pow er consumption of the output module (power consumption

equivalent to the points simultaneously ON)

Average power of the 24VDC output circuit of the power supply module is the total power

consumption of each module.

24V=I24V

(4) Average power consumption of the output modules due to voltage drops at the output part

(power consumption equivalent to the points simultaneously ON)

OUT

Vdrop : Voltage drop of each output module (V)

(5) Average power consumption of the input modules at the input part (power consumption

equivalent to the points simultaneously ON)

: Input current (actual value in case of AC) (A)

E : Input voltage (voltage for actual usage) (V)

(6) Power consumption of the power supply part of the special function module is:

× 24 (W)

OUT

= I

× Vdrop × Output points × Simultaneous ON ratio (W)

: Output current (current actually used) (A)

= IIN × E × Input points × Simultaneous ON ratio (W)

= I5V × 5 × I

24V

× 24 + I

100V

× 100 (W)

The total of the power consumption calculated for each block as above is the power consumption

of the PC system as a whole.

24V

W= WPW + W5V + W

+ W

OUT

+ WIN + WS (W)

Calculate the amount of heat generation and temperature increase inside the panel from the total

power consumption (W).

Simplified calculation formula to obtain temperature increase inside panel is shown next:

T= [°C]

W : Power consumption of the PC system as a whole (the value obtained above)

A : Inside surface area of the panel [m

]

U : When inside temperature of the panel is kept constant by a fan, etc. ...............6

When the air inside the panel is not circulated..................................................4

POINT

When the temperature increase inside the panel exceeds the specified range, it is recommended to lower the temperature inside the panel by installing a heat exchanger to the panel.

If a conventional ventilation fan is used, it sucks dust along with the outside air, which may affect the PC, so care must be taken.

8-6

8. LOADING AND INSTALLATION MELSEC-A

8.4 Installation of Base Unit

Precautions concerning installation of the basic base unit and extension base unit are described next.

8.4.1 Precautions when installing PC

Precautions concerning the installation of PC to the panel, etc. are explained below.

(1) To improve the ventilation and to facilitate the exchange of the module, provide at least 30mm

(1.18in.) of distance between the top part of the module and any structure or part.

However, when A52B, A55B, A58B, A62B, A65B or A68B extension base module is used, provide

at least 80mm (3.15in.) of distance between the top of the module and any structural part.

(2) Do not install vertically or horizontally, because of concerns with ventilation.

(3) If there are any protrusions, dents or distortion on the installation surface of the base unit, an

excessive force is applied to the print board and causes problems, so, install to a flat surface.

(4) Avoid sharing the same panel with any source of vibration such as a large magnetic contactor or

no-fuse breaker, and install to a separate panel or away from such devices.

(5) Provide wiring ducts as necessary.

However, when the clearance of the top and bottom of the PC are smaller than those shown in

figure 8.1, pay attention to the following:

(a) When installing to the top of PC, to improve the ventilation, keep the height of the duct to

50mm (1.97in.) or below.

In addition, the distance from the top of the PC should be sufficient for tightening and loosening works for the installation screws on the top of the module.

The module cannot be replaced if the screws on the top of the module cannot be loosened or tightened.

(b) When installing to the bottom part of the PC, provide a sufficient space so that the

100/200VAC input line of the power module, input and output cables of I/O modules and 12/24VDC lines are not affected.

(6) If any device is installed in front of the PC (i.e. installed in the back of the door), position it to

secure at least 100mm (3.94in.) of distance to avoid the effects of noise emission and heat.

Also, keep at least 50mm (1.97in.) distance from the base unit to any device placed on right or left

or the module.

8-7

8. LOADING AND INSTALLATION MELSEC-A

8.4.2 Installation

Installation location of the basic base unit and the extension base unit is shown below.

Duct (maximum height: 50mm (1.97 inch))

Basic base Extension base

Figure 8.1 Parallel installation

Indicates the location of ceiling of the panel, wiring duct or other part.

Basic base (A1S3 B)

Extension base (A1S5 B, A1S6 B)

Indicates the location of ceiling of the panel, wiring duct or other part.

At least 30mm (1.18 inch)

Basic base (A1S3 B)

Extension base (A5 B, A6 B)

At least 30mm (1.18 inch)

At least 80mm (3.15 inch)

Panel, etc.

Contactor relay, etc.

At least 100mm (3.94 inch)

Figure 8.3 Distance between the

front face of the PC and other devices

Figure 8.2 Series installation

Figure 8.4 Vertical installation

(not allowed)

Figure 8.5 Horizontal installation

(not allowed)

8-8

8. LOADING AND INSTALLATION MELSEC-A

8.5 Installation and Removal of the Modules

How to install and remove the power supply module, CPU module, I/O module and special function module, etc. to/from the base unit are explained.

•

CAUTION

Install the module by firmly inserting the projection for fixing the module at the bottom of the module to the fixing hole of the base unit, then tighten the module fixed screw with the specified torque. If the module is not installed correctly or the screws are loose, malfunctions, failures and fall out may result.

•

Tighten the screws with the specified torque. If the screws are loose, it may cause short-circuit, malfunctions, or the module may fall out. If the screw is tightened too much, it may cause short-circuit, malfunctions or the module may fall out due to damaged screws or the module.

•

Before beginning any installation or wiring work, make sure all phases of the power supply have been obstructed from the outside. Failure to completely shut off the power-supply phases may cause breakdowns or malfunctions.

Base unit

Module installation screw

Module

8-9

8. LOADING AND INSTALLATION MELSEC-A

(1) Installation of the module

Installation procedure of the module is explained.

Insert the module fixing projection of the module into the module fixing hole.

Install the module to the base unit by pushing it in the direction of the arrow.

Confirm that the module is firmly inserted to the base unit, then fix it with the module fixed scr ew.

Complete

Base unit

Module fixing hole

Module

Projection for fixing the module

8-10

8. LOADING AND INSTALLATION MELSEC-A

(2) Removal of the module

Removal procedure of the module is explained.

Remove the module installation screw, then pull out the top of the module while using the bottom of the module as the fulcrum.

Base unit

While lifting the module upward, disengage the module fixing projection from the module fixing hole.

Complete

Module connector

Module

Module fixing hole

POINT

To remove the module, the module installation screw must be removed first, then disengage the projection for fixing the module from the module fixing hole. If the module is forcibly removed the projection for fixing the module will be damaged.

8-11

8. LOADING AND INSTALLATION MELSEC-A

8.6 Installation and Removal of the Dustproof Cover

When A1S52B, A1S55B or A1S58B is used, it is necessary to install the dustproof cover, which is supplied with base to the I/O module to be installed to the left end in order to prevent intrusion of foreign material into the I/O module. Intrusion of foreign materials into the I/O module may cause breakdowns. Procedures for installing and removing the dustproof cover are described below.

(1) Installation

I/O module

To insert the dustproof cover to the I/O module, insert the cover to the connector or terminal side first as shown in the figure, then push the cover to the I/O module side.

(2) Removal

Hole for removal

To remove the dustproof cover from the I/O module, insert the tip of a flat-tip screwdriver into the removal hole as shown in the figure, then move the screwdriver towards the rear of the module to separate the clip from the removal hole and remove the cover.

Dust-

roof cover

Dust-proof cover

I/O module

8-12

8. LOADING AND INSTALLATION MELSEC-A

8.7 Wiring

8.7.1 Precautions when w iring

•

DANGER

CAUTION

•

When turning on the power or operating the module after installation or wiring work, be sure the module's terminal covers are correctly attached. Failure to attach the terminal covers may result in electric shock.

•

The FG and LG terminals should always be grounded using the class-3 or higher grounding designed specially for PC. Failure to ground these terminals may cause electric shock or malfunctioning.

•

When wiring the PC, check the rated voltage and terminal layout of the wiring, and make sure the wiring is done correctly. Connecting a power supply that differs from the rated voltage or wiring it incorrectly may cause fire or breakdown.

•

Do not connect output from multiple power supply modules in parallel. This may heat up the power supply module and cause fire or breakdowns.

•

Tighten the terminal screws with the specified torque. If the terminal screws are loose, it may result in short circuits, fire or malfunctioning. If the terminal screws are tightened too much, it may damage the screws and the module may result in short circuits, malfunctioning or cause the module to fall out.

•

Be careful not to let foreign matter such as filings or wire chips get inside the unit. These can cause fire, breakdowns and malfunctioning.

•

Perform correct pressure-welding, crimp-contact or soldering for connectors for the outside using the specified tools. Refer to the User's Manual of the corresponding I/O module for tools required to perform pressure-welding and crimp-contact. Incorrect connection may cause short circuits, fire, or malfunctioning.

•

Do not bunch the control wires or communication cables with the main circuit or power wires, or install them close to each other. They should be installed 100 mm (3.94in.) or more from each other. Failure to do so may result in noise that would cause malfunctioning.

8-13

8. LOADING AND INSTALLATION MELSEC-A

Precautions when wiring power supply cable are described.

(1) Wiring power supply

(a) Separate the PC's power supply line from the lines for I/O devices and power devices as

shown below.

When there is much noise, connect an insulation transformer.

200VAC

Main power supply

PC power supply

I/O power supply

Main circuit device

(b) 100VAC, 200VAC and 24VDC wires should be twisted as dense as possible. Connect the

modules with a shortest distance.

Also, to reduce the voltage drop to the minimum, use thickest wires possible (maximum

2mm

(0.0031in.2)).

Insulation transformer

I/O devices

Main circuit device

lightening as shown below.

PC I/O devices

Surge absorber for lightening

POINT

(1) Separate the ground of the surge absorber for lightening (E1) from that of the PC (E2). (2) Select a surge absorber for lightening whose power supply voltage does not exceed the

maximum allowable circuit voltage even at the time of maximum power supply voltage elevation.

8-14

8. LOADING AND INSTALLATION MELSEC-A

(2) Wiring I/O devices

(a) The suitable wire size for the connection to the terminals on a terminal block is 0.75 to

1.25mm

is recommended. (b) Route the input wires separate from the output wires. (c) When it is impossible to separate the input/output wires from the main circuit wires and the

power line, use a batch-shield cable and ground them at the PC side. However, grounding them on the other side may be necessary in some cases.

(0.0012 to 0.0019in.2), but in view of ease of use, the wiring with wire size 0.75mm2

Input

Shield cable

Output

Shield sheath

(d) When duct wiring is performed, ground the duct securely. (e) Separate the 24VDC input and output lines from the 100VAC and 200VAC lines. (f) With a long distance wiring of 200m (656.2ft.) or longer, leak current due to line capacity may

cause troubles. Implement the countermeasures described in Section 10.4.

(3) Grounding

Perform grounding according to (a) to (c) below. (a) Employ independent grounding whenever possible. Grounding work shall be done with class

D (class 3) grounding. (Grounding resistance is 100Ω or less.)

(b) When independent grounding is not feasible, use shared grounding, shown as (2) in the

figure below.

Class 3

grounding

Other device

Class 3

grounding

Other

device

Other

device

(1) Independent grounding ····· Good (2) Independent grounding ····· O.K. (3) Independent grounding ····· Not allowed

(0.0031in.2) for grounding. Grounding point shall be as close to the PC as possible. Make the length of the ground wire short.

8-15

8. LOADING AND INSTALLATION MELSEC-A

8.7.2 Wiring to the module terminals

Examples of wiring power supply line and ground line to the basic base and the extension base are shown below.

Wiring example

Insulation transformer

Fuse

24VDC 24VDC

100/110VAC

Connect to the 24VDC terminal of the module which requires 24VDC in the I/O module.

Basic base unit (A1S38B)

A1S62PN

Extension base unit (A1S68B)

A1S62PN

CPU module

+24V 24G

LG INPUT

100 to 240VAC

I/O

Extension cable

100/110VAC

Ground line

Ground

LG INPUT

100 to 240VAC

POINT

(1) For 100/200VAC and 24VDC power supply line, use the thickest electrical wire possible

(maximum 2mm the crimp-style terminals, use crimp-style terminals with an insulation sleeve in order to avoid short-circuiting when screws are loosened.

(2) When LG and FG terminals are connected, it must be grounded. When it is not grounded

with LG and FG terminals connected, it will be susceptible to noises. Since the LG terminal has a potential of half the input voltage, touching the terminal may result in an electrical shock.

(0.0031in.2)). The lines must be twisted from the connecting terminals. For

8-16

8. LOADING AND INSTALLATION MELSEC-A

8.8 Precautions When Unfailure Power System (UPS) is Connected

When Unfailure Power System (abbreviated as UPS hereafter) is connected to the CPU system, care must be taken on the following matter:

Use an UPS of inverter power supply type at all time with 5% or less voltage distortion. Do not use a UPS of commercial power supply type.

8-17

9. EMC DIRECTIVE AND LOW-VOLTAGE INSTRUCTION MELSEC-A

9. EMC DIRECTIVE AND LOW-VOLTAGE

INSTRUCTION

9.1 Requirements for Compliance to EMC Directive (89/336/EEC)

The EMC Directive (89/336/EEC) will become mandatory within Europe from January 1st 1996. The EMC directive in essence defines the amount of electromagnetic output a product is allowed to produce and how susceptible that product is to electromagnetic interference. Any manufacturer or importer of electrical/electronic apparatus must before releasing or selling products within Europe after that date have either a CE mark attached to their goods. Testing to comply with the directive is done by use of agreed European standards which define limits for radiated and mains conducted electromagnetic emissions from equipment, levels of immunity to radiated emissions, ability for equipment to cope with transient voltage surges and electro-static discharges.

When installed in the specified manner this unit will be compliant with the relevant standards EN50081-2 and prEN50082-2 as applicable in the EMC directive. Failure to comply with these instructions could lead to impaired EMC performance of the equipment and as such Mitsubishi Electric Corporation can accept no liability for such actions.

9.1.1 EMC standards

When the PLC is installed following the directions given in this manual its EMC performance is compliant to the following standards and levels as required by the EMC directive.

Specifications Test Item Test Description Standard Values

EN50081-2 : 1995

EN55011

IEC801-2

prEN50082-2 : 1991 IEC801-3

IEC801-4

EN61000-4-2

EN61000-4-4

EN50082-2 : 1995 ENV50140

ENV50204

ENV50141

EN55011 Radiated noise

Conduction noise

Static electricity immunity *2

Radiated electromagnetic field *2

First transient burst noise

Static electricity immunity *2

First transient burst noise

Radiated electromagnetic field AM modulation *2

Radiated electromagnetic field Pulse modulation *2

Conduction noise

Measure the electric wave released by the product.

Measure the noise released by the product to the power line.

Immunity test by applying static electricity to the module enclosure.

Immunity test by radiating an electric field to the product.

Immunity test by applying burst noise to the power line and signal cable.

Immunity test by applying static electricity to the module enclosure.

Immunity test by applying burst noise to the power line and signal cable., 2 k V

Immunity test by radiating an electric field to the product.

Immunity test by inducting electromagnetic field to the power line signal cable.

30 M-230 M Hz QP : 30 dBµ V/m (30 m measurement) *1 230 M-1000 M Hz QP : 37 dBµ V/m (30 m measurement)

150 K-500k Hz QP: 79 dB, Mean : 66 dB *1 500 K-30M Hz QP : 73 dB, Mean: 60 dB

4 k V contact discharge 8 k V air discharge

10 V/m, 27-500 M Hz

2 k V

4 k V contact discharge 8 k V air discharge

2 k V

10 V/m, 80-1000 M Hz, 80 % AM modulation@1 k Hz

10 V/m, 900 M Hz, 200 Hz pulse modulation, 50 % duty

10 Vrms, 0.15-80 M Hz, 80 % modulation@1 k Hz

9-1

9. EMC DIRECTIVE AND LOW-VOLTAGE INSTRUCTION

(*1) QP: Quasi-peak value, Mean : Average value

(*2) The PLC is an open type device (device installed to another device) and must

be installed in a conductive control box. The tests for the corresponding items were performed while the PLC was installed to inside the control box.

9.1.2 Installation inside the cont rol cabi net

Since the PLC is an open type device (device incorporated into another device), it must be installed in the control cabinet. This has a good effect of not only for assuring safety but also for shielding noise emitted from the PLC, by means of the control cabinet.

(1) Control cabinet

(a) Use a conductive control cabinet. (b) When attaching the control cabinet's top plate or base plate, mask

painting and weld so that good surface contact can be made between the cabinet and plate.

MELSEC-A

on the installation bolts of the inner plate in the control cabinet so that contact between surfaces can be ensured over the widest possible area.

(d) Earth the control cabinet with a thick wire so that a low impedance

connection to ground can be ensured even at high frequencies. (22 mm wire or thicker is recommended.)

(e) Holes made in the control cabinet must be 10 cm (3.94 in.) diameter or

less. If the holes are 10 cm (3.94 in.) or larger, radio frequency noise may be emitted.

(2) Connection of power and earth wires

Earthing and power supply wires for the PLC system must be connected as described below.

(a) Provide an earthing point near the power supply module. Earth the power

supply's LG and FG terminals (LG : Line Ground, FG : Frame Ground) with the thickest and shortest wire possible. (The wire length must be 30 cm (11.18 in.) or shorter.) The LG and FG terminals function is to pass the noise generated in the PLC system to the ground, so an impedance that is as low as possible must be ensured. As the wires are used to relieve the noise, the wire itself carries a large noise content and thus short wiring means that the wire is prevented from acting as an antenna.

Note) A long conductor will become a highly efficient antenna at high frequency.

9-2

9. EMC DIRECTIVE AND LOW-VOLTAGE INSTRUCTION

(b) The earth wire led from the earthing point must be twisted with the power

supply wires. By twisting with the earthing wire, noise flowing from the power supply wires can be relieved to the earthing. However, if a filter is installed on the power supply wires, the wires and the earthing wire may not need to be twisted.

9.1.3 Cables

The cables led from the control cabinet contain a high frequency noise element and outside the control panel these cables act as antennae and radiate noise. The cables connected to input/output modules or special modules which leave the control panel must always be shielded cables. Mounting of a ferrite core on the cables is not required (excluding some models) but if a ferrite core is mounted, the noise radiated through the cable can be suppressed further. Use of a shielded cable is also effective for increasing the noise immunity level. The PLC system's input/output and special function module provide a noise immunity level of equivalent to that stated in IEC801-4 : 2 k V when a shielded cable is used. If a shielded cable is not used or if the shield earthing treatment is not suitable even when used (See Section 9.1.2.4), the noise immunity level is less than 2 k V.

Note) prEN50082-2 specifies the noise resistance level based on the signal wire

application. Signals involved in process control : 2 k V Signals not involved in process control : 1 k V

MELSEC-A

The meaning of "involved in process control" is not defined in prEN50082-2. However, when the purposes of the EMC Directive are considered, the signals that could cause personal injury or risks in the facility if a malfunction occurs should be defined as "signals involved in process control". Thus, it is assumed that a high noise immunity level is required.

9-3

MITSUBISHI A2USHCPU-S1 User Guide

Specifications and Main Features

Frequently Asked Questions

User Manual

SAFETY PRECAUTIONS

Revisions

Introduction

Table of Contents

About This Manual

1. OVERVIEW

1.1 Features

2. SYSTEM CONFIGURATION

2.1 Overall Configuration

2.2 Precautions When Configuring the System

2.2.1 Hardware

2.2.2 Software package

2.2.3 Precautions when using GPP funct ion software packages and A8PU peripheral devices which are not compatibl e with AnU

2.3 System Equipment

2.4 System Configuration Overview

3. GENERAL SPECIFICATION

4. CPU MODULE

4.1 Performance Specification

4.1.1 Overview of operation processing

4.1.2 Operation processing of RUN, STOP, PAUSE, and STEP RUN

4.1.3 Operation processing upon momentary power failure

4.1.4 Self-diagnosis

4.1.5 Device list

4.2 Parameter Setting Ranges

4.2.1 List of parameter setting range

4.2.2 Memory capacity setting (for main program, file register, comment, etc.)

4.2.3 Setting ranges of timer and counter

4.2.4 I/O devices

4.2.5 I/O allocation of special function modules

4.2.6 MELSECNET/MINI-S3 automatic refresh

4.3 Function List

4.4 Precautions When Handling the M odul e

4.5 Name and Setting of Each Part

4.5.1 The name of each part of the A2USHCPU-S1

4.5.2 Settings for memory protection switch

4.5.3 Latch clear operation

5. POWER SUPPLY MODULE MELSEC-A

5.1 Specifications

5.1.1 Selecting a power supply module

5.2 Name and Setting of Each Part

6. BASE UNIT AND EXTENSION CABLE MELSEC-A

6.1 Specification

6.1.1 Base unit specifications

6.1.2 Extension cable specifications

6.1.3 Usage standards of extension base units (A1S52B, A1S55B, A1S58B, A52B, A55B, A58B)

6.2 Name and Setting of Each Part

7. MEMORY CASSETTE AND BATTERY MELSEC-A

7.1 Memory Cassette

7.1.1 Specifications

7.1.2 Precautions when handling the memory cassette

7.1.3 Installation and removal of memory cassette

7.1.4 Procedure for writing sequence program t o A2SMCA-14KP

7.1.5 Memory protection setting of A2SNMCA-30KE

7.2 Battery

7.2.1 Specifications

7.2.2 Precautions when handling

7.2.3 Battery installation

8. LOADING AND INSTALLATION MELSEC-A

8.1 Concept of Failsafe Circuit

8.2 Installation Environment

8.3 Calculation Method of Heat Amount Generated by the PC

8.4 Installation of Base Unit

8.4.1 Precautions when installing PC

8.4.2 Installation

8.5 Installation and Removal of the Modules

8.6 Installation and Removal of the Dustproof Cover

8.7 Wiring

8.7.1 Precautions when w iring

8.7.2 Wiring to the module terminals

8.8 Precautions When Unfailure Power System (UPS) is Connected

9. EMC DIRECTIVE AND LOW-VOLTAGE INSTRUCTION MELSEC-A

9.1 Requirements for Compliance to EMC Directive (89/336/EEC)

9.1.1 EMC standards

9.1.2 Installation inside the cont rol cabi net

9.1.3 Cables