Microsemi Corporation MX040-20 Datasheet

(typ.0.4)
2830 S. Fairview St. Santa Ana, CA 92704 PH: (714) 979-8220 FAX: (714) 966-5256
Features
Designed for applications with stringent profile restrictions
Passivated mesa structure for very low leakage currents
Epitaxial structure minimizes forward voltage drop
Hermetically sealed, extremely low profile ceramic seal package with
Very low package inductance and thermal resistance
Qualification estimated completion August 1998, includes temperature
Available in reverse voltage ranges from 50V to 300V
PRELIMINARY
flexible copper leads for surface mount soldering or welding
cycling 2,000 cycles at -197°C to +150°C (liquid-to-liquid)
MX040-20
200 Volts
10 Amps
2 µs
ELP (EXTRA LOW
PROFILE)
STANDARD
Maximum Ratings @ 25°C (unless otherwise specified)
DESCRIPTION SYMBOL MAX. UNIT
Peak Repetitive Reverse Voltage V Working Peak Reverse Voltage V DC Blocking Voltage V Average Rectified Forward Current, Tc 125°C Nonrepetitive Peak Surge Current, tp= 8.3 ms, half-sinewave I Junction Temperature Range T
Storage Temperature Range T Thermal Resistance, Junction to Case:
RRM
RWM
I
F(ave)
FSM
stg
θ
JC
R
j
RECTIFIER
200 Volts 200 Volts 200 Volts
10 Amps
100 Amps
-65 to +175
-65 to +175
1.0
°C °C
°C/W
Mechanical Outline
Datasheet# MSC0875
MX040-20
Electrical Parameters
PRELIMINARY
DESCRIPTION SYMBOL CONDITIONS MIN TYP. MAX UNIT
Reverse (Leakage) IR
Current IR
Forward Voltage VF1 IF= 0.1 A, Tc= 25°C 700 780 mV
pulse test, VF2 IF= 0.5 A, Tc= 25°C 750 830 mV
pw= 300 µs VF3 IF= 2 A, Tc= 25°C 825 900 mV
d/c 2% VF4 IF= 5 A, Tc= 25°C 875 950 mV
Junction Capacitance Cj1 VR= 10 Vdc tbd pF
Breakdown Voltage BVR IR= 100 µA, Tc= 25°C 220 250 n/a V Reverse Recovery Time trr IF= .5 A, IR= 1 A, IRR=
25
125
VF5 IF= 10 A, Tc= 25°C 930 1000 mV
Cj2 VR= 5 Vdc tbd pF
VR= rated VRWM Vdc, Tc= 25°C VR= rated VRWM Vdc, Tc= 125°C
.25 A
.05 1 µA
0.1 mA
1 2 µs
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