Microsemi Corporation LX7001MY, LX7001ILP, LX7001IDM, LX7001CLP, LX7001CDM Datasheet

LX7001
0
TRANSIENT IMMUNE UNDERVOLTAGE SENSING CIRCUIT
T HE I NFINITE P OWER OF I NNOVATION
DESCRIPTION
The LX7001 is an improved undervoltage sensing circuit specifi­cally designed for use as a reset controller in microprocessor-based systems. Today's complex miniaturized systems present difficult challanges to the system designer such as overcom­ing spurious noise problems. The LX7001 is optimized for systems that must be tolerant of high-speed power supply glitches caused by high-speed logic transitions and similar switching phenomena. The LX7001 offers a unique stage that couples glitch immunity with a micropower, ultra­stable band-gap reference for preci­sion sensing of undervoltage condi­tions. It offers the designer an
NOTE: For current data & package dimensions, visit our web site: http://www.linfinity.com.
economical, space-efficient solution for low supply voltage detection when used in combination with a single pull-up resistor. Adding one capacitor offers the functionality of a programmable delay time after power returns. Additionally, the LX7001 offers excellent temperature stability. A high-quality trimmed voltage reference and bias circuit permit very accurate and repeatable undervoltage sensing. The remaining blocks consist of a comparator with hyster­esis, high current clamping diode and open collector output stage capable of sinking up to 60mA. The LX7001's RESET output is specified to be fully functional at VIN=1V.
PRODUCT HIGHLIGHT
INPUT TRANSIENT IMMUNITY
100
P RODUCTION DATA SHEET
KEY FEATURES
Fully Characterized, Transient Immune Input Stage
(See Product Highlight)
Monitors 5V Supplies (V
Outputs Fully Defined At VCC=1V
Ultra-Low Supply Current
(500µA Max. Over Temp)
! Temperature Compensated ICC For Extremely
Stable Current Consumption
! µP Reset Function Programmable With 1
External Resistor And Capacitor
! Comparator Hysteresis Prevents Output
Oscillation
! Electrically Compatible With Motorola
MC34064
! Pin-to-Pin Compatible With Motorola
MC34064/MC34164
APPLICATIONS
■■
All Microprocessor Or Microcontroller
■■
Designs Using 5V Supplies
■■
Simple 5V Undervoltage Detection
■■
=4.6V Typ.)
TRIP
10
1
) Noise Pulse Width - (µs)
n
(t
0.1 100
IMMUNE
(en) Noise Pulse Amplitude - (mV)
(°C)
T
A
0 to 70 LX7001CDM LX7001CLP
-40 to 85 LX7001IDM LX7001ILP
ACTIVE
100
PACKAGE ORDER INFORMATION
Plastic SOIC
DM
8-pin
Note: All surface-mount packages are available in Tape & Reel.
Append the letter "T" to part number. (i.e. LX7001CDMT)
Plastic TO-92
LP
3-pin
Ceramic Dip
Y
8-pin
Copyright © 1999 Rev. 1.2 6/99
L INF INITY MICROELECTRONICS INC.
11861 WESTERN AVENUE, GARDEN GROVE, CA. 92841, 714-898-8121, FAX: 714-893-2570
1
LX7001
PRODUCT DATABOOK 1996/1997
TRANSIENT IMMUNE UNDERVOLTAGE SENSING CIRCUIT
P RODUCTION DATA SHEET
ABSOLUTE MAXIMUM RATINGS (Note 1)
Input Supply Voltage (VIN) ............................................................................... -1V to 12V
RESET Output Voltage (V Output Sink Current (I
Clamp Diode Forward Current (IF), Pin 1 to pin 2............................................... 100mA
) .......................................................................... -1V to 12V
OUT
) ............................................................ Internally Limited (mA)
OL
Operating Junction Temperature
Ceramic (Y - Package).......................................................................................... 150°C
Plastic (DM, LP - Packages) .................................................................................. 150°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature (Soldering, 10 seconds) ............................................................. 300°C
Note 1. Values beyond which damage may occur. All voltages are specified with respect to
ground, and all currents are positive into the specified terminal.
THERMAL DATA
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
LP PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
Y PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
Junction Temperature Calculation: TJ = TA + (PD x θJA). The θJA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow
θθ
θ
θθ
JA
θθ
θ
θθ
JA
θθ
θ
θθ
JA
165°C/W
156°C/W
130°C/W
PACKAGE PIN OUTS
1 8
RESET
N.C.
GROUND
RESET
V
N.C.
GROUND
2 7
V
IN
3 6 4 5
Y PACKAGE
(Top View)
IN
DM PACKAGE
(Top View)
LP PACKAGE
(Top View)
18 27 36 45
N.C. N.C. N.C. N.C.
N.C. N.C. N.C. N.C.
3. GROUND
2. V
IN
1. RESET
2
Copyright © 1999
Rev. 1.2 6/99
PRODUCT DATABOOK 1996/1997
TRANSIENT IMMUNE UNDERVOLTAGE SENSING CIRCUIT
P RODUCTION DATA SHEET
RECOMMENDED OPERATING CONDITIONS (Note 2)
LX7001
Parameter
Input Supply Voltage V RESET Output Voltage V Clamp Diode Forward Current I Operating Ambient Temperature Range:
LX7001C LX7001I LX7001M
Note 2. Range over which the device is functional.
Symbol
IN
OUT
F
Recommended Operating Conditions
Min. Typ. Max.
110V
10 V
50mA
070°C
-25 85 °C
-55 125 °C
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, these specifications apply over the operating ambient temperatures of 0°C ≤ TA 70°C for the LX7001C,
-40°C ≤ TA 85°C for the LX7001I, and -55°C TA 125°C for the LX7001M. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.)
Parameter
Symbol
Test Conditions Units
LX7001C/7001I/7001M
Min. Typ. Max.
Comparator Section
Threshold Voltage
High State Output V Low State Output V Hysteresis V
VIN Increasing — 4V to 5V
T+
VIN Decreasing — 5V to 4V
T­H
4.5 4.62 4.7 V
4.5 4.60 4.7 V
0.01 0.02 0.05 V
RESET Output Section
Output Sink Saturation Voltage VIN = 4.0V, IOL = 8.0mA
V
Output Sink Current I Output Off-State Leakage I
Clamp Diode Forward Voltage VFPin 1 to pin 2, IF = 10mA
OL OHVOUT
= 4.0V, IOL = 2.0mA
OLVIN
VIN = 1.0V, IOL = 0.1mA V
= 4.0V
OUT
= 5.0V
V
= 10V
OUT
0.06 1.0 V
0.25 0.4 V
0.3 0.1 V
10 40 60 mA
0.01 0.5 µA
0.02 2.0 µA
0.6 0.82 1.2 V
Total Device
Supply Current I
CC
VIN = 5.0V
345 500 µA
Units
Copyright © 1999 Rev. 1.2 6/99
3
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