Microsemi Corporation LX5213CPWP, LX5213CN, LX5213CDP Datasheet
LIN DOC #:
LX5213
9-LINE LOW CAPACITANCE, µPOWER SCSI TERMINATOR
5213
THE INFINITE POWER OF INNOVATION
DESCRIPTION KEY FEATURES
The LX5213 is a nine-line active terminator
for the SCSI parallel bus. This SCSI standard
recommends active termination at both ends
of the SCSI bus.
During disconnect mode, the LX5213 requires a meager 60µA of supply current while
offering only 3.5pF of output capacitance.
To enter this low-power mode, the disconnect pin can be left open (floating) or driven
high, thereby disconnecting the terminating
resistors and placing the internal low dropout
regulator into low-power mode. In disconnect mode, each termination line presents
a high impedance to the SCSI bus with the
overall effect being to preserve high-signal
integrity and yield subsequent reliable, errorfree communications.
During normal operation, the LX5213 con-
IMPORTANT: For the most current data, consult LinFinity's web site: http://www.linfinity.com.
sumes only 600µA of current, which is the
lowest enabled supply current of any terminator available on the market today.
Linfinity's proprietary BiCMOS low dropout
regulator architecture enables this unique
and very efficient operating characteristic.
The LX5213 also offers a precisely trimmed
channel output current specified to a 5%
tolerance. The maximum value of the output
current is trimmed as closely as possible to
the SCSI standard maximum specification to
give the highest possible noise margin for
fast SCSI operation. And the LX5213 sinks
up to 150mA of current, making it compatible
with today's fast active negation drivers.
The LX5213 is a superior, pin-for-pin replacement for a variety of industry products
such as the UC5603 and UC5613
PRODUCT HIGHLIGHT
P RODUCTION DATA SHEET
■ 3.5pF OUTPUT CAPACITANCE DURING
DISCONNECT
■ 60µA SUPPLY CURRENT IN DISCON-
NECT MODE
■ 600µA SUPPLY CURRENT DURING
NORMAL OPERATION
■ 150mA SINK CURRENT FOR ACTIVE
NEGATION
■ LOGIC COMMAND DISCONNECTS ALL
TERMINATION LINES
■ CURRENT LIMIT AND THERMAL
PROTECTION
■ COMPATIBLE WITH SCSI 1, 2 AND 3
STANDARDS
■ CONSULT FACTORY FOR APPLICATION
TEST REPORT: 5213TR
.
RECEIVING WAVEFORM - 10MHZ DRIVING WAVEFORM - 10MHZ
Receiver
Driver
1 Meter, AWG 28
LX5213 LX5213
LX5268 LX5268
PACKAGE ORDER INFORMATION
TA (°C)
0 to 70 LX5213CN LX5213CPWP LX5213CDP
Plastic DIP
N
16-pin
Note: All surface-mount packages are available in Tape & Reel.
Append the letter "T" to part number. (i.e. LX5213CDPT)
Plastic TSSOP
PWP
24-pin, Power
Plastic SOIC
DP
16-pin, Power
Discussion On Applying
SCSI, Request Linfinity
Single-Ended SCSI Bus"
NOTE:
For An In-Depth
Application Note:
"Understanding The
Copyright © 1997
Rev. 1.9 7/97
L INFINITY MICROELECTRONICS INC.
11861 WESTERN AVENUE, GARDEN GROVE, CA. 92841, 714-898-8121, FAX: 714-893-2570
1
LX5213
PRODUCT DATABOOK 1996/1997
9-LINE LOW CAPACITANCE, µPOWER SCSI TERMINATOR
RODUCTION DATA SHEET
P
ABSOLUTE MAXIMUM RATINGS (Note 1)
TermPwr Voltage .................................................................................................+7V
Signal Line Voltage ................................................................................... 0V to +7V
Regulator Output Current ................................................................................... 0.4A
Operating Junction Temperature
Plastic (N, PWP, DP Packages).................................................................... 150°C
Storage Temperature Range .............................................................. -65°C to 150°C
Lead Temperature (Soldering, 10 seconds) .................................................... 300°C
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with
respect to Ground. Currents are positive into, negative out of the specified
terminal.
THERMAL DATA
N PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθ
θ
θθ
JA
65°C/W
PWP PACKAGE:
THERMAL RESISTANCE-JUNCTION TO LEADS,
θθ
θ
θθ
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
JL
θθ
θ
θθ
JA
27°C/W
60°C/W
DP PACKAGE:
THERMAL RESISTANCE-JUNCTION TO LEADS,
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
Junction Temperature Calculation: TJ = TA + (P
numbers are guidelines for the thermal performance of the device/pc-board
The θ
JA
system. All of the above assume no ambient airflow.
θ
D
θθ
θθ
JL
x θ
θθ
θ
θθ
JA
).
JA
20°C/W
45°C/W
POWER UP / POWER DOWN FUNCTION TABLE
Disconnect Outputs
L Enabled 600µA
H HI Z 60µA
Open HI Z 60µA
Quiescent
Current
PACKAGE PIN OUTS
T7
1 16
T8
215
T9
314
N.C.
413
GND
DISCONNECT
T7
T8
T9
N.C.
GND
HEATSINK/GND
HEATSINK/GND
HEATSINK/GND
HEATSINK/GND
DISCONNECT
T1
T2
HEATSINK/GND
GND
DISCONNECT
512
611
T1
710
T2
89
N PACKAGE
(Top View)
1 24
223
322
421
520
619
718
817
916
10 15
11 14
12 13
PWP PACKAGE
(Top View)
T7
T8
215
T9
314
413
512
611
T1
710
T2
89
DP PACKAGE
(Top View)
16
T6
T5
REG OUT
N.C.
N.C.
V
TERM
T4
T3
T6
T5
REG OUT
N.C.
HEATSINK/GND
HEATSINK/GND
HEATSINK/GND
HEATSINK/GND
N.C.
V
TERM
T4
T3
T6
T5
REG OUT
HEATSINK/GND
HEATSINK/GND
V
TERM
T4
T3
2
Copyright © 1997
Rev. 1.9 7/97
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