Microsemi LX1810 Technical data

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查询LX1810供应商

ThermalMax LX1810

INTEGRATED PRODUCTS

The LX1810 is a Full-Bridge
thermo-electric cooler (TEC) controller
specifically designed for high
performance opto-electronic products
where precise temperature control is
required. These products tune or
stabilize sensitive optical components
in applications that include frequency
tunable fiber optic lasers, EDFA
amplifiers, waveguides, and other
dense wavelength division multi­plexing (DWDM) components. Other
applications include microwave
transistors in new wireless base­stations.

The LX1810 uses highly efficient
(>90%) pulse width modulation
(PWM) technology, allowing the
controller to be conveniently mounted
near the TEC without adding heat

IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com

DESCRIPTION

to the system. The LX1810 operates on a
single voltage supply, greatly
simplifying supply requirements, with an
operating frequency that is high enough
to eliminate detrimental thermal stresses
to the TEC. The output ripple factor o
the system can be maintained well below
10% thus not effecting the performance
of delta T control.

Utilizing a full-bridge topology, the
LX1810 can be used for both heating
and cooling operations. The LX1810,
when used in conjunction with
temperature sense device, accurately
regulates TEC current levels allowing
tight control of temperature.

Fully integrated FET drivers in a 28­Pin SSOP allows the design of a fully
functional TEC controller while
minimizing board space.

VIN = 15V

PRODUCT HIGHLIGHT

ThermoElectric Cooler Drive Controller IC

KEY FEATURES

 Integrated Switching Full-Bridge

PWM Drive Architecture

 Single DC Supply Operation
 Very Low Output Noise
 Maximum Efficiency 90%
 High Output Integrated Drivers
 PSRR –70dB Typical
 Differential Input To Minimize

Noise

 External Oscillator

Synchronization

 28-Pin SSOP Package

APPLICATIONS/BENEFITS

 Peltier Effect (Thermoelectric

Coolers) Controllers

 High Efficiency H-Bridge Drive

Circuits

 RF Power Amplifier Electronic

Cooling

 CPU Electronic Cooling

WWW.Microsemi .COM

Copyright  2002
Rev. 1.0a, 10/21/2002

LX1810

R

T

Append the letter “T” to the part number. (i.e. LX1810-CDBT)

PACKAGE ORDER INFO

TA (°C)

0 to 70 LX1810-CDB

Note: Available in Tape & Reel.

DB

Plastic SSOP
28-Pin

TEC

Microsemi

11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: [phone]

Integrated Products

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ThermalMax LX1810

INTEGRATED PRODUCTS

Supply Voltage (PVDD, VDD)....................................................................... -0.3V to 15V

SLEEP, STATUS, FBK+, FBK-...........................................................-0.3V to V

IS- ..............................................................................................PV

RPWM, CPWM, MUTE...................................................................... -0.3V to V

INPUT +, INPUT -, INAMPOUT........................................................ -0.3V to V

EAIN, EAOUT, FAOUT ..................................................................... -0.3V to V

CLOCK.................................................................................................. -0.3V to C

Operating Junction Temperature Plastic (DB Package).............................................125

Storage Temperature Range....................................................................... -65

Lead Temperature (Soldering, 10 seconds)............................................................... 300

ABSOLUTE MAXIMUM RATINGS

ThermoElectric Cooler Drive Controller IC

PACKAGE PIN OUT

–2 to PV

DD

+0.3V

DD

to +0.3V

DD

+0.3V

REF

+0.3V

REF

+0.3V

REF

+0.3V

N

O

C to 150 OC

VREF

GND

NC

V25
RPWM
CPWM

INPUT +

INPUT-

INAM POUT

O

C

O

C

SHDN

STBY

STATUS

EAIN

EAOUT

14

28

15

CLOCK
IS­CP
VDD
PVDD
P+
N+
N­P­PGND
CN
FBK­FBK+
FAOUT

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Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal

.

Plastic SSOP 28-Pin

DB

THERMAL RESISTANCE-JUNCTION TO AMBIENT, θ

Junction Temperature Calculation: TJ = TA + (PD x θJA).
The θJA numbers are guidelines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.

THERMAL DATA

50°C/W

JA

Pin Name Description Pin Name Description

VREF

GND

NC

V25
RPWM
CPWM

INPUT+
INPUT -

INAMPOUT

SHDN

STBY

STATUS

EAIN

EAOUT

5V Reference
Low Current Ground
No Internal Connection

2.5V Reference
PWM Oscillator Timing Resistor
PWM Oscillator Timing Capacitor
Positive Differential Amplifier Input
Negative Differential Amplifier Input
Input Differential Amplifier Output
IC Shutdown Control Input (active low)
IC Standby Control Input (active high)
UVLO Indicator (Open Collector Output)
Inverting Input of Error Amplifier
Error Amplifier Output

FUNCTIONAL PIN DESCRIPTION

FAOUT

FBK+

FBK-

CN

PGND

P­N-

N+

P+

PVDD

VDD

CP
IS -

CLOCK

Feedback Amplifier Output
Feedback Amplifier Non-Inverting Input
Feedback Amplifier Inverting Input
Supply Decoupling for NFET Drivers
Output Driver High Current Ground
Drive for PFET on Negative Half of Bridge
Drive for NFET on Negative Half of Bridge
Drive for NFET on Positive Half of Bridge
Drive for PFET on Positive Half of Bridge
Output Driver Supply Voltage
Analog Supply Voltage
Supply Decoupling for PFET Drivers
Current Limit Sense Input
Input / Output Clock for Synch Operation

P

P

A

A

C

C

K

K

A

A

G

G

E

E

D

D

A

A

T

T

A

A

Copyright  2002
Rev. 1.0a, 10/21/2002

Microsemi

Integrated Products

11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: [phone]

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