Micromax X771 Service Manual
Particular
Remarks
Key Matrix For Flashing
NA
Chipset
SC6531E
Android Version
NA
Frequency
GSM:850/900/1800/1900
Network Mode
Dual SIM:GSM
ROM
32Mb
RAM
32Mb
Internal SD Card memory
NA
Expandable Memory
32 GB
Factory mode code
*#629#
Model X771 L3 Service Manual
2. CAUTIONS
1. Technical Specifications :
Please fill below information in Remarks, Below given remarks are for reference only
I. Flashing & Servicing must be undertaken by qualified personnel only.
II. Ensure all work is carried out at an anti-static workstation and that an anti-static wrist strap is worn.
III. Use only approved Tools & components as specified in the parts list.
J400 earphone connector
Failure caused by damage:
Earphone failure, FM failure
J100 antenna bonding pad
Failure caused by damage:
Weak BT signal
J800/J802 SIM1/SIM2 card
socket
Failure caused by damage:
Failure to identify GSM/
U600 charge IC
Failure caused by damage:
Failure to No indication during
charging
ANT1/ANT2 GSM PAD
Failure caused by
damage: GSM failure
U0101 GSM PA chip Failure caused
by damage:RF failure
U300 communication processor
Failure caused by damage:
Power-on failure
SPK speaker
Failure caused by
damage: No sound from
speaker
CAM pad
Failure caused by
damage:CAM failure
J602 Bat connector
Failure caused by
damage:
Power-on failure
LCD LCD pad
Failure caused by damage:
Display backlight failure
D700/D701/D702/D703/D704/D705
Keypad backlight
Failure caused by damage:
Keypad backlight failure
LED pad Failure caused
by damage: LED torch
failure
USB Connector Failure
caused by damage: No
port, no charging
Model X771 L3 Service Manual
IV. Ensure all components, modules, screws, and insulators are correctly re-fitted after servicing and
alignment
V. Ensure all cables and wires are repositioned correctly if Handset disassembled
VI. Electrostatic discharge can easily damage the sensitive components of electronic products. Therefore,
Service Centre must adhere the precautions which mentioned above.
Basic Structure of the Mobile Phone
PCBA Diagrams of A81 Mainboard
GOLD_MIC,MIC pad
Failure caused by
damage:
No sound when voice is
transmitted via local MIC;
Model X771 L3 Service Manual
3. L3 Level trouble shooting
Please add trouble shooting/ Repairing steps against below given symptoms
Images must paste against every suggested troubleshooting hint
1) Doesn’t Power On
Y200
U300
J602
Model X771 L3 Service Manual
Solution
A- There is no current when the Power Key is pressed; check J602 to see if there is false soldering,
pseudo soldering, if yes, Carry out Resoldering or replacement;
B- When the Power Key is pressed, and the current stays within 10~15mA, if yes, Upgrade the
software version;
C- There is current when the Power Key is pressed; the current changes to 0~5mA when the key is
loosened, if yes, The problem is caused by pseudo soldering or damage of 26M crustal(Y200);
carry out repair soldering or replacement of the crystal. Or, it is caused by pseudo soldering or
damage of CPU;
D- There is heavy current when the Power Key is pressed, if yes, Find the hot point, and replace the
corresponding material CPU(U300) are damaged in most cases.
2) Restart / Hang
Solution: Refer same to Power failure issue.
3) LCD
LCD
U300
Model X771 L3 Service Manual
Solution:
A- Exchange the front shell to judge if the LCD itself is abnormal, if yes, Replace the LCD;
B- Replace the CPU(U300)
4) Touchpad
NA
5) Proximity Sensor
NA
6) Accelerometer
NA
7) Keypad
Model X771 L3 Service Manual
Solution:
A- The common breakdown mainly does not work for the pressed key, the pressed key expiration. May defer to the
schematic diagram to examine whether by short circuit, abruption phenomenon. Or examined whether
underneath Dome has the foreign matter.
8) Charging
Solution:
A- Check if the charging IC U600 is abnormal, if yes, Carry out repair soldering or replacement;
B- Check if the resistors R601 are abnormal, if yes, Carry out repair soldering or replacement;
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