MICROCHIP PIC18F2455, PIC18F2550, PIC18F4455, PIC18F4550 DATA SHEET

PIC18F2455/2550/4455/4550
Data Sheet
28/40/44-Pin, High-Performance,
Enhanced Flash, USB Microcontrollers
with nanoWatt Technology
© 2006 Microchip Technology Inc. Preliminary DS39632C
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WAR­RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron, dsPIC, K
EELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, Real ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and Zena are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their respective companies.
© 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
®
8-bit MCUs, KEEL
®
OQ
code hopping
DS39632C-page ii Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550
28/40/44-Pin, High-Performance, Enhanced Flash,
USB Microcontrollers with nanoWatt Technology

Universal Serial Bus Features:

• USB V2.0 Compliant
• Low Speed (1.5 Mb/s) and Full Speed (12 Mb/s)
• Supports Control, Interrupt, Isochronous and Bulk
Transfers
• Supports up to 32 Endpoints (16 bidirectional)
• 1-Kbyte Dual Access RAM for USB
• On-Chip USB Transceiver with On-Chip Voltage
Regulator
• Interface for Off-Chip USB Transceiver
• Streaming Parallel Port (SPP) for USB streaming
transfers (40/44-pin devices only)

Power-Managed Modes:

• Run: CPU on, peripherals on
• Idle: CPU off, peripherals on
• Sleep: CPU off, peripherals off
• Idle mode currents down to 5.8 μA typical
• Sleep mode currents down to 0.1 μA typical
• Timer1 Oscillator: 1.1 μA typical, 32 kHz, 2V
• Watchdog Timer: 2.1 μA typical
• Two-Speed Oscillator Start-up

Flexible Oscillator Structure:

• Four Crystal modes, including High Precision PLL
for USB
• Two External Clock modes, up to 48 MHz
• Internal Oscillator Block:
- 8 user-selectable frequencies, from 31 kHz to 8 MHz
- User-tunable to compensate for frequency drift
• Secondary Oscillator using Timer1 @ 32 kHz
• Dual Oscillator options allow microcontroller and USB module to run at different clock speeds
• Fail-Safe Clock Monitor:
- Allows for safe shutdown if any clock stops

Peripheral Highlights:

• High-Current Sink/Source: 25 mA/25 mA
• Three External Interrupts
• Four Timer modules (Timer0 to Timer3)
• Up to 2 Capture/Compare/PWM (CCP) modules:
2
C™
CY/16)
CY)
- Capture is 16-bit, max. resolution 5.2 ns (T
- Compare is 16-bit, max. resolution 83.3 ns (T
- PWM output: PWM resolution is 1 to 10-bit
• Enhanced Capture/Compare/PWM (ECCP) module:
- Multiple output modes
- Selectable polarity
- Programmable dead time
- Auto-shutdown and auto-restart
• Enhanced USART module:
- LIN bus support
• Master Synchronous Serial Port (MSSP) module supporting 3-wire SPI (all 4 modes) and I Master and Slave modes
• 10-bit, up to 13-channel Analog-to-Digital Converter module (A/D) with Programmable Acquisition Time
• Dual Analog Comparators with Input Multiplexing

Special Microcontroller Features:

• C Compiler Optimized Architecture with optional Extended Instruction Set
• 100,000 Erase/Write Cycle Enhanced Flash Program Memory typical
• 1,000,000 Erase/Write Cycle Data EEPROM Memory typical
• Flash/Data EEPROM Retention: > 40 years
• Self-Programmable under Software Control
• Priority Levels for Interrupts
• 8 x 8 Single-Cycle Hardware Multiplier
• Extended Watchdog Timer (WDT):
- Programmable period from 41 ms to 131s
• Programmable Code Protection
• Single-Supply 5V In-Circuit Serial Programming™ (ICSP™) via two pins
• In-Circuit Debug (ICD) via two pins
• Optional dedicated ICD/ICSP port (44-pin devices only)
• Wide Operating Voltage Range (2.0V to 5.5V)
SPI
MSSP
Master
I
2
C™
EAUSART
Timers
8/16-Bit
Comparators
Program Memory Data Memory
Device
PIC18F2455 24K 12288 2048 256 24 10 2/0 No Y Y 1 2 1/3
PIC18F2550 32K 16384 2048 256 24 10 2/0 No Y Y 1 2 1/3
PIC18F4455 24K 12288 2048 256 35 13 1/1 Yes Y Y 1 2 1/3
PIC18F4550 32K 16384 2048 256 35 13 1/1 Yes Y Y 1 2 1/3
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 1
Flash
(bytes)
# Single-Word
Instructions
SRAM
(bytes)
EEPROM
(bytes)
I/O
10-Bit
A/D (ch)
CCP/ECCP
(PWM)
SPP
PIC18F2455/2550/4455/4550

Pin Diagrams

28-Pin PDIP, SOIC
RA5/AN4/SS
40-Pin PDIP
MCLR/VPP/RE3
RA0/AN0
RA2/AN2/V
RA4/T0CKI/C1OUT/RCV
RC0/T1OSO/T13CKI
RC1/T1OSI/CCP2
RA1/AN1
REF-/CVREF
RA3/AN3/VREF+
/HLVDIN/C2OUT
OSC1/CLKI
OSC2/CLKO/RA6
(1)
/UOE
RC2/CCP1
V
V
USB
1 2 3 4 5 6 7
SS
8 9 10 11 12 13 14
PIC18F2455
PIC18F2550
28 27 26 25 24 23 22 21 20 19 18 17 16 15
RB7/KBI3/PGD RB6/KBI2/PGC RB5/KBI1/PGM RB4/AN11/KBI0 RB3/AN9/CCP2 RB2/AN8/INT2/VMO RB1/AN10/INT1/SCK/SCL RB0/AN12/INT0/FLT0/SDI/SDA V
DD
VSS RC7/RX/DT/SDO RC6/TX/CK RC5/D+/VP RC4/D-/VM
(1)
/VPO
MCLR/VPP/RE3
RA0/AN0
RA2/AN2/V
RA4/T0CKI/C1OUT/RCV
RA5/AN4/SS
RC0/T1OSO/T13CKI
RC1/T1OSI/CCP2
Note 1: RB3 is the alternate pin for CCP2 multiplexing.
RA1/AN1
REF-/CVREF
RA3/AN3/VREF+
/HLVDIN/C2OUT RE0/AN5/CK1SPP RE1/AN6/CK2SPP
RE2/AN7/OESPP
OSC2/CLKO/RA6
RC2/CCP1/P1A
V VSS
OSC1/CLKI
(1)
/UOE
V
USB
RD0/SPP0 RD1/SPP1
DD
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
PIC18F4455
PIC18F4550
40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21
RB7/KBI3/PGD RB6/KBI2/PGC RB5/KBI1/PGM RB4/AN11/KBI0/CSSPP RB3/AN9/CCP2 RB2/AN8/INT2/VMO RB1/AN10/INT1/SCK/SCL RB0/AN12/INT0/FLT0/SDI/SDA V
DD
VSS RD7/SPP7/P1D RD6/SPP6/P1C RD5/SPP5/P1B RD4/SPP4 RC7/RX/DT/SDO RC6/TX/CK RC5/D+/VP RC4/D-/VM RD3/SPP3 RD2/SPP2
(1)
/VPO
DS39632C-page 2 Preliminary © 2006 Microchip Technology Inc.

Pin Diagrams (Continued)

44-Pin TQFP
PIC18F2455/2550/4455/4550
/UOE
(1)
(2)
RC7/RX/DT/SDO
RD4/SPP4
RD5/SPP5/P1B
RD6/SPP6/P1C
RD7/SPP7/P1D
RB0/AN12/INT0/FLT0/SDI/SDA
RB1/AN10/INT1/SCK/SCL
RB2/AN8/INT2/VMO
RB3/AN9/CCP2
(1)
V
VDD
/VPO
44-Pin QFN
RC6/TX/CK
RC5/D+/VP
RC4/D-/VM
RD3/SPP3
4443424140
1 2 3 4 5
PIC18F4455
SS
6 7 8 9 10 11
121314
(2)
(2)
/ICPGC
(2)
(2)
NC/ICCK
PIC18F4550
15
/ICPGD
RB5/KBI1/PGM
NC/ICDT
RB4/AN11/KBI0/CSSPP
RD2/SPP2
RD1/SPP1
RD0/SPP0
39
38
16
17
1819202122
/VPP/RE3
RB7/KBI3/PGD
RB6/KBI2/PGC
MCLR
USB
V
37
RA0/AN0
RC2/CCP1/P1A
363435
RA1/AN1
RC1/T1OSI/CCP2
NC/ICPORTS
(2)
33 32 31 30 29 28 27 26 25 24 23
REF-/CVREF
RA3/AN3/VREF+
RA2/AN2/V
NC/ICRST RC0/T1OSO/T13CKI OSC2/CLKO/RA6 OSC1/CLKI V
SS
VDD RE2/AN7/OESPP RE1/AN6/CK2SPP RE0/AN5/CK1SPP RA5/AN4/SS RA4/T0CKI/C1OUT/RCV
/UOE
(1)
(2)
/ICVPP
/HLVDIN/C2OUT
RC6/TX/CK
RC5/D+/VP
RC4/D-/VM
RD3/SPP3
RC7/RX/DT/SDO
RD4/SPP4
RD5/SPP5/P1B RD6/SPP6/P1C RD7/SPP7/P1D
RB0/AN12/INT0/FLT0/SDI/SDA
RB1/AN10/INT1/SCK/SCL
RB2/AN8/INT2/VMO
Note 1: RB3 is the alternate pin for CCP2 multiplexing.
2: Special ICPORTS features available in select circumstances. See Section 25.9 “Special ICPORT Features (Designated
Packages Only)” for more information.
V VDD VDD
SS
1 2 3 4 5 6 7 8 9 10 11
(1)
4443424140
121314
PIC18F4455 PIC18F4550
15
NC
/VPO
RB5/KBI1/PGM
RB3/AN9/CCP2
RB4/AN11/KBI0/CSSPP
RD2/SPP2
RD1/SPP1
RD0/SPP0
39
38
1819202122
16
17
/VPP/RE3
RB7/KBI3/PGD
RB6/KBI2/PGC
MCLR
USB
V
37
RA0/AN0
RC2/CCP1/P1A
363435
RA1/AN1
RC1/T1OSI/CCP2
RC0/T1OSO/T13CKI
33 32 31 30 29 28 27 26 25 24 23
REF+
REF-/CVREF
RA3/AN3/V
RA2/AN2/V
OSC2/CLKO/RA6 OSC1/CLKI
SS
V VSS VDD VDD RE2/AN7/OESPP RE1/AN6/CK2SPP RE0/AN5/CK1SPP RA5/AN4/SS/HLVDIN/C2OUT RA4/T0CKI/C1OUT/RCV
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 3
PIC18F2455/2550/4455/4550

Table of Contents

1.0 Device Overview .......................................................................................................................................................................... 7
2.0 Oscillator Configurations ............................................................................................................................................................ 23
3.0 Power-Managed Modes ............................................................................................................................................................. 35
4.0 Reset .......................................................................................................................................................................................... 43
5.0 Memory Organization ................................................................................................................................................................. 57
6.0 Flash Program Memory.............................................................................................................................................................. 79
7.0 Data EEPROM Memory ............................................................................................................................................................. 89
8.0 8 x 8 Hardware Multiplier............................................................................................................................................................ 95
9.0 Interrupts .................................................................................................................................................................................... 97
10.0 I/O Ports ................................................................................................................................................................................... 111
11.0 Timer0 Module ......................................................................................................................................................................... 125
12.0 Timer1 Module ......................................................................................................................................................................... 129
13.0 Timer2 Module ......................................................................................................................................................................... 135
14.0 Timer3 Module ......................................................................................................................................................................... 137
15.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 141
16.0 Enhanced Capture/Compare/PWM (ECCP) Module ................................................................................................................ 149
17.0 Universal Serial Bus (USB) ...................................................................................................................................................... 163
18.0 Streaming Parallel Port ............................................................................................................................................................ 187
19.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 193
20.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 237
21.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 259
22.0 Comparator Module.................................................................................................................................................................. 269
23.0 Comparator Voltage Reference Module ................................................................................................................................... 275
24.0 High/Low-Voltage Detect (HLVD) ............................................................................................................................................. 279
25.0 Special Features of the CPU.................................................................................................................................................... 285
26.0 Instruction Set Summary .......................................................................................................................................................... 307
27.0 Development Support............................................................................................................................................................... 357
28.0 Electrical Characteristics .......................................................................................................................................................... 361
29.0 DC and AC Characteristics Graphs and Tables ....................................................................................................................... 399
30.0 Packaging Information.............................................................................................................................................................. 401
Appendix A: Revision History............................................................................................................................................................. 409
Appendix B: Device Differences......................................................................................................................................................... 409
Appendix C: Conversion Considerations ........................................................................................................................................... 410
Appendix D: Migration From Baseline to Enhanced Devices............................................................................................................. 410
Appendix E: Migration From Mid-Range to Enhanced Devices ......................................................................................................... 411
Appendix F: Migration From High-End to Enhanced Devices............................................................................................................ 411
Index .................................................................................................................................................................................................. 413
The Microchip Web Site..................................................................................................................................................................... 425
Customer Change Notification Service .............................................................................................................................................. 425
Customer Support .............................................................................................................................................................................. 425
Reader Response .............................................................................................................................................................................. 426
PIC18F2455/2550/4455/4550 Product Identification System ............................................................................................................ 427
DS39632C-page 4 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback.

Most Current Data Sheet

To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).

Errata

An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
using.

Customer Notification System

Register on our web site at www.microchip.com to receive the most current information on all of our products.
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 5
PIC18F2455/2550/4455/4550
NOTES:
DS39632C-page 6 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550

1.0 DEVICE OVERVIEW

This document contains device-specific information for the following devices:
• PIC18F2455 • PIC18LF2455
• PIC18F2550 • PIC18LF2550
• PIC18F4455 • PIC18LF4455
• PIC18F4550 • PIC18LF4550
This family of devices offers the advantages of all PIC18 microcontrollers – namely, high computational performance at an economical price – with the addition of high endurance, Enhanced Flash program mem­ory. In addition to these features, the PIC18F2455/2550/4455/4550 family introduces design enhancements that make these microcontrollers a log­ical choice for many high-performance, power sensitive applications.

1.1 New Core Features

1.1.1 nanoWatt TECHNOLOGY

All of the devices in the PIC18F2455/2550/4455/4550 family incorporate a range of features that can signifi­cantly reduce power consumption during operation. Key items include:
Alternate Run Modes: By clocking the controller from the Timer1 source or the internal oscillator block, power consumption during code execution can be reduced by as much as 90%.
Multiple Idle Modes: The controller can also run with its CPU core disabled but the peripherals still active. In these states, power consumption can be reduced even further, to as little as 4% of normal operation requirements.
On-the-Fly Mode Switching: The power-managed modes are invoked by user code during operation, allowing the user to incorporate power-saving ideas into their application’s software design.
Low Consumption in Key Modules: The power requirements for both Timer1 and the Watchdog Timer are minimized. See Section 28.0 “Electrical Characteristics” for values.

1.1.3 MULTIPLE OSCILLATOR OPTIONS AND FEATURES

All of the devices in the PIC18F2455/2550/4455/4550 family offer twelve different oscillator options, allowing users a wide range of choices in developing application hardware. These include:
• Four Crystal modes using crystals or ceramic
resonators.
• Four External Clock modes, offering the option of
using two pins (oscillator input and a divide-by-4 clock output) or one pin (oscillator input, with the second pin reassigned as general I/O).
• An internal oscillator block which provides an
8 MHz clock (±2% accuracy) and an INTRC source (approximately 31 kHz, stable over temperature and V 6 user-selectable clock frequencies, between 125 kHz to 4 MHz, for a total of 8 clock frequencies. This option frees an oscillator pin for use as an additional general purpose I/O.
• A Phase Lock Loop (PLL) frequency multiplier,
available to both the High-Speed Crystal and External Oscillator modes, which allows a wide range of clock speeds from 4 MHz to 48 MHz.
• Asynchronous dual clock operation, allowing the
USB module to run from a high-frequency oscillator while the rest of the microcontroller is clocked from an internal low-power oscillator.
Besides its availability as a clock source, the internal oscillator block provides a stable reference source that gives the family additional features for robust operation:
Fail-Safe Clock Monitor: This option constantly
monitors the main clock source against a reference signal provided by the internal oscillator. If a clock failure occurs, the controller is switched to the internal oscillator block, allowing for continued low-speed operation or a safe application shutdown.
Two-Speed Start-up: This option allows the
internal oscillator to serve as the clock source from Power-on Reset, or wake-up from Sleep mode, until the primary clock source is available.
DD), as well as a range of

1.1.2 UNIVERSAL SERIAL BUS (USB)

Devices in the PIC18F2455/2550/4455/4550 family incorporate a fully featured Universal Serial Bus communications module that is compliant with the USB Specification Revision 2.0. The module supports both low-speed and full-speed communication for all sup­ported data transfer types. It also incorporates its own on-chip transceiver and 3.3V regulator and supports the use of external transceivers and voltage regulators.
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 7
PIC18F2455/2550/4455/4550

1.2 Other Special Features

Memory Endurance: The Enhanced Flash cells for both program memory and data EEPROM are rated to last for many thousands of erase/write cycles – up to 100,000 for program memory and 1,000,000 for EEPROM. Data retention without refresh is conservatively estimated to be greater than 40 years.
Self-Programmability: These devices can write to their own program memory spaces under internal software control. By using a bootloader routine, located in the protected Boot Block at the top of program memory, it becomes possible to create an application that can update itself in the field.
Extended Instruction Set: The PIC18F2455/2550/4455/4550 family introduces an optional extension to the PIC18 instruction set, which adds 8 new instructions and an Indexed Literal Offset Addressing mode. This extension, enabled as a device configuration option, has been specifically designed to optimize re-entrant application code originally developed in high-level languages such as C.
Enhanced CCP Module: In PWM mode, this module provides 1, 2 or 4 modulated outputs for controlling half-bridge and full-bridge drivers. Other features include auto-shutdown for disabling PWM outputs on interrupt or other select conditions and auto-restart to reactivate outputs once the condition has cleared.
Enhanced Addressable USART: This serial communication module is capable of standard RS-232 operation and provides support for the LIN bus protocol. Other enhancements include Automatic Baud Rate Detection and a 16-bit Baud Rate Generator for improved resolution. When the microcontroller is using the internal oscillator block, the EUSART provides stable operation for applications that talk to the outside world without using an external crystal (or its accompanying power requirement).
10-Bit A/D Converter: This module incorporates programmable acquisition time, allowing for a channel to be selected and a conversion to be initiated, without waiting for a sampling period and thus, reducing code overhead.
• Dedicated ICD/ICSP Port: These devices introduce the use of debugger and programming pins that are not multiplexed with other micro­controller features. Offered as an option in select packages, this feature allows users to develop I/O intensive applications while retaining the ability to program and debug in the circuit.

1.3 Details on Individual Family Members

Devices in the PIC18F2455/2550/4455/4550 family are available in 28-pin and 40/44-pin packages. Block diagrams for the two groups are shown in Figure 1-1 and Figure 1-2.
The devices are differentiated from each other in six ways:
1. Flash program memory (24 Kbytes for
PIC18FX455 devices, 32 Kbytes for PIC18FX550).
2. A/D channels (10 for 28-pin devices, 13 for
40/44-pin devices).
3. I/O ports (3 bidirectional ports and 1 input only
port on 28-pin devices, 5 bidirectional ports on 40/44-pin devices).
4. CCP and Enhanced CCP implementation
(28-pin devices have two standard CCP modules, 40/44-pin devices have one standard CCP module and one ECCP module).
5. Streaming Parallel Port (present only on
40/44-pin devices).
All other features for devices in this family are identical. These are summarized in Table 1-1.
The pinouts for all devices are listed in Table 1-2 and Table 1-3.
Like all Microchip PIC18 devices, members of the PIC18F2455/2550/4455/4550 family are available as both standard and low-voltage devices. Standard devices with Enhanced Flash memory, designated with an “F” in the part number (such as PIC18F2550), accommodate an operating V Low-voltage parts, designated by “LF” (such as PIC18LF2550), function over an extended V of 2.0V to 5.5V.
DD range of 4.2V to 5.5V.
DD range
DS39632C-page 8 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550

TABLE 1-1: DEVICE FEATURES

Features PIC18F2455 PIC18F2550 PIC18F4455 PIC18F4550
Operating Frequency DC – 48 MHz DC – 48 MHz DC – 48 MHz DC – 48 MHz
Program Memory (Bytes) 24576 32768 24576 32768
Program Memory (Instructions) 12288 16384 12288 16384
Data Memory (Bytes) 2048 2048 2048 2048
Data EEPROM Memory (Bytes) 256 256 256 256
Interrupt Sources 19 19 20 20
I/O Ports Ports A, B, C, (E) Ports A, B, C, (E) Ports A, B, C, D, E Ports A, B, C, D, E
Timers 4 4 4 4
Capture/Compare/PWM Modules 2 2 1 1
Enhanced Capture/ Compare/PWM Modules
Serial Communications MSSP,
Enhanced USART
Universal Serial Bus (USB) Module
Streaming Parallel Port (SPP) No No Yes Yes
10-Bit Analog-to-Digital Module 10 Input Channels 10 Input Channels 13 Input Channels 13 Input Channels
Comparators 2 2 2 2
Resets (and Delays) POR, BOR,
RESET Instruction,
Stack Underflow
MCLR
Programmable Low-Voltage Detect
Programmable Brown-out Reset Yes Yes Yes Yes
Instruction Set 75 Instructions;
83 with Extended
Packages 28-pin PDIP
0011
MSSP,
Enhanced USART
1111
POR, BOR,
RESET Instruction,
Stack Full,
(PWRT, OST),
(optional),
WDT
Yes Yes Yes Yes
Instruction Set
enabled
28-pin SOIC
Stack Full,
Stack Underflow
(PWRT, OST),
(optional),
MCLR
WDT
75 Instructions;
83 with Extended
Instruction Set
enabled
28-pin PDIP 28-pin SOIC
MSSP,
Enhanced USART
POR, BOR,
RESET Instruction,
Stack Full,
Stack Underflow
(PWRT, OST),
(optional),
MCLR
WDT
75 Instructions;
83 with Extended
Instruction Set
enabled
40-pin PDIP
44-pin QFN
44-pin TQFP
MSSP,
Enhanced USART
POR, BOR,
RESET Instruction,
Stack Full,
Stack Underflow
(PWRT, OST),
(optional),
MCLR
WDT
75 Instructions;
83 with Extended
Instruction Set
enabled
40-pin PDIP
44-pin QFN
44-pin TQFP
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 9
PIC18F2455/2550/4455/4550

FIGURE 1-1: PIC18F2455/2550 (28-PIN) BLOCK DIAGRAM

Table Pointer<21>
inc/dec logic
21
Address Latch
Program Memory
(24/32 Kbytes)
Data Latch
Instruction Bus <16>
(2)
OSC1
(2)
OSC2
T1OSI
T1OSO
(1)
MCLR
VDD,
SS
V
USB
V
20
8
Table Latch
ROM Latch
Instruction
Internal
Oscillator
Block
INTRC
Oscillator
8 MHz
Oscillator
Single-Supply Programming
In-Circuit
Debugger
USB Voltage
PCLATH
PCLATU
PCH PCL
PCU
Program Counter
31 Level Stack
STKPTR
IR
Decode &
Control
Start-up Timer
Clock Monitor
Regulator
Data Bus<8>
8
8
State Machine Control Signals
Power-up
Time r
Oscillator
Power-on
Reset
Watchdog
Time r
Brown-out
Reset
Fail-Safe
Data Latch
Data Memory
(2 Kbytes)
Address Latch
12
Data Address<12>
44
12
FSR0 FSR1 FSR2
logic
8 x 8 Multiply
W
8
ALU<8>
Access
Bank
PRODLPRODH
8
8
12
8
BSR
3
BITOP
Band Gap
Reference
8
inc/dec
Address
Decode
PORTA
RA0/AN0 RA1/AN1 RA2/AN2/VREF-/CVREF RA3/AN3/VREF+ RA4/T0CKI/C1OUT/RCV RA5/AN4/SS/HLVDIN/C2OUT OSC2/CLKO/RA6
PORTB
RB0/AN12/INT0/FLT0/SDI/SDA RB1/AN10/INT1/SCK/SCL RB2/AN8/INT2/VMO RB3/AN9/CCP2 RB4/AN11/KBI0 RB5/KBI1/PGM RB6/KBI2/PGC RB7/KBI3/PGD
PORTC
8
8
8
PORTE
RC0/T1OSO/T13CKI RC1/T1OSI/CCP2 RC2/CCP1 RC4/D-/VM RC5/D+/VP RC6/TX/CK RC7/RX/DT/SDO
MCLR/VPP/RE3
(3)
/VPO
(3)
(1)
/UOE
BOR
HLVD
Comparator
Note 1: RE3 is multiplexed with MCLR and is only available when the MCLR Resets are disabled.
2: OSC1/CLKI and OSC2/CLKO are only available in select oscillator modes and when these pins are not being used as digital I/O. Refer
to Section 2.0 “Oscillator Configurations” for additional information.
3: RB3 is the alternate pin for CCP2 multiplexing.
Data
EEPROM
CCP1
CCP2
MSSP
Timer2Timer1 Timer3Timer0
EUSART
ADC
10-Bit
USB
DS39632C-page 10 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550

FIGURE 1-2: PIC18F4455/4550 (40/44-PIN) BLOCK DIAGRAM

Table Pointer<21>
inc/dec logic
21
Address Latch
Program Memory
(24/32 Kbytes)
Data Latch
20
8
PCLATH
PCLATU
PCU
Program Counter
31 Level Stack
STKPTR
Table Latch
Data Bus<8>
8
PCH PCL
8
Data Latch
Data Memory
(2 Kbytes)
Address Latch
12
Data Address<12>
12
44
BSR
FSR0 FSR1 FSR2
inc/dec
logic
Access
Bank
12
PORTA
PORTB
RA0/AN0 RA1/AN1 RA2/AN2/VREF-/CVREF RA3/AN3/VREF+ RA4/T0CKI/C1OUT/RCV RA5/AN4/SS/HLVDIN/C2OUT OSC2/CLKO/RA6
RB0/AN12/INT0/FLT0/SDI/SDA RB1/AN10/INT1/SCK/SCL RB2/AN8/INT2/VMO RB3/AN9/CCP2
(4)
/VPO RB4/AN11/KBI0/CSSPP RB5/KBI1/PGM RB6/KBI2/PGC RB7/KBI3/PGD
Instruction Bus <16>
VDD, VSS
(2)
OSC1
(2)
OSC2
T1OSI
T1OSO
(3)
ICPGC
(3)
ICPGD
(3)
ICPORTS
(3)
ICRST
(1)
MCLR
USB
V
ROM Latch
IR
Instruction
Decode &
Internal
Oscillator
Block
INTRC
Oscillator
8 MHz
Oscillator
Single-Supply Programming
In-Circuit
Debugger
Control
USB Voltage
Regulator
State Machine Control Signals
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
Brown-out
Reset
Fail-Safe
Clock Monitor
3
BITOP
8
Band Gap Reference
Address Decode
8 x 8 Multiply
W
8
ALU<8>
PORTC
RC0/T1OSO/T13CKI RC1/T1OSI/CCP2
(4)
/UOE RC2/CCP1/P1A RC4/D-/VM RC5/D+/VP
8
RC6/TX/CK RC7/RX/DT/SDO
PRODLPRODH
PORTD
8
RD0/SPP0:RD4/SPP4
8
8
RD5/SPP5/P1B RD6/SPP6/P1C RD7/SPP7/P1D
8
8
PORTE
RE0/AN5/CK1SPP RE1/AN6/CK2SPP RE2/AN7/OESPP MCLR/VPP/RE3
(1)
BOR
HLVD
Comparator
Note 1: RE3 is multiplexed with MCLR
2: OSC1/CLKI and OSC2/CLKO are only available in select oscillator modes and when these pins are not being used as digital I/O. Refer
Data
EEPROM
ECCP1
CCP2
MSSP
Timer2Timer1 Timer3Timer0
EUSART
10-Bit
and is only available when the MCLR Resets are disabled.
to Section 2.0 “Oscillator Configurations” for additional information.
ADC
USB
3: These pins are only available on 44-pin TQFP packages under certain conditions. Refer to Section 25.9 “Special ICPORT Features
(Designated Packages Only)” for additional information.
4: RB3 is the alternate pin for CCP2 multiplexing.
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 11
PIC18F2455/2550/4455/4550
TABLE 1-2: PIC18F2455/2550 PINOUT I/O DESCRIPTIONS
Pin
Pin Name
MCLR
/VPP/RE3
MCLR
VPP RE3
OSC1/CLKI
OSC1 CLKI
OSC2/CLKO/RA6
OSC2
CLKO
RA6
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set.
Number
PDIP, SOIC
10
Pin
Buffer
Type
1
9
Type
I
ST
P
I
ST
IIAnalog
Analog
O
O
I/O
TTL
Master Clear (input) or programming voltage (input).
Master Clear (Reset) input. This pin is an active-low Reset to the device. Programming voltage input. Digital input.
Oscillator crystal or external clock input.
Oscillator crystal input or external clock source input. External clock source input. Always associated with pin function OSC1. (See OSC2/CLKO pin.)
Oscillator crystal or clock output.
Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. In select modes, OSC2 pin outputs CLKO which has 1/4 the frequency of OSC1 and denotes the instruction cycle rate. General purpose I/O pin.
Description
DS39632C-page 12 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550
TABLE 1-2: PIC18F2455/2550 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin
Pin Name
RA0/AN0
RA0 AN0
RA1/AN1
RA1 AN1
RA2/AN2/V
RA2 AN2 V CV
RA3/AN3/V
RA3 AN3 V
RA4/T0CKI/C1OUT/RCV
RA4 T0CKI C1OUT RCV
RA5/AN4/SS HLVDIN/C2OUT
RA5 AN4 SS HLVDIN C2OUT
RA6 See the OSC2/CLKO/RA6 pin.
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
REF-/CVREF
REF-
REF
REF+
REF+
/
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
2: Default assignment for CCP2 when CCP2MX Configuration bit is set.
Number
PDIP,
SOIC
Pin
Buffer
Type
2
3
4
5
6
7
Type
I/OITTL
Analog
I/OITTL
Analog
I/O
I/O
I/O
I/O
TTL
I
Analog
I
Analog
O
Analog
TTL
I
Analog
I
Analog
ST
I
ST
O
I
I I I
O
TTL
TTL
Analog
TTL
Analog
PORTA is a bidirectional I/O port.
Digital I/O. Analog input 0.
Digital I/O. Analog input 1.
Digital I/O. Analog input 2. A/D reference voltage (low) input. Analog comparator reference output.
Digital I/O. Analog input 3. A/D reference voltage (high) input.
Digital I/O. Timer0 external clock input. Comparator 1 output. External USB transceiver RCV input.
Digital I/O. Analog input 4. SPI slave select input. High/Low-Voltage Detect input. Comparator 2 output.
Description
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 13
PIC18F2455/2550/4455/4550
TABLE 1-2: PIC18F2455/2550 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin
Pin Name
RB0/AN12/INT0/FLT0/ SDI/SDA
RB0 AN12 INT0 FLT0 SDI SDA
RB1/AN10/INT1/SCK/ SCL
RB1 AN10 INT1 SCK SCL
RB2/AN8/INT2/VMO
RB2 AN8 INT2 VMO
RB3/AN9/CCP2/VPO
RB3 AN9
(1)
CCP2 VPO
RB4/AN11/KBI0
RB4 AN11 KBI0
RB5/KBI1/PGM
RB5 KBI1 PGM
RB6/KBI2/PGC
RB6 KBI2 PGC
RB7/KBI3/PGD
RB7 KBI3 PGD
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set.
Number
PDIP, SOIC
21
22
23
24
25
26
27
28
Pin
Type
I/O
I I I I
I/O
I/O
I
I I/O I/O
I/O
I
I
O
I/O
I I/O
O
I/O
I
I
I/O
I I/O
I/O
I I/O
I/O
I I/O
Buffer
Type
TTL
Analog
ST ST ST ST
TTL
Analog
ST ST ST
TTL
Analog
ST
TTL
Analog
ST
TTL
Analog
TTL
TTL TTL
ST
TTL TTL
ST
TTL TTL
ST
Description
PORTB is a bidirectional I/O port. PORTB can be software programmed for internal weak pull-ups on all inputs.
Digital I/O. Analog input 12. External interrupt 0. PWM Fault input (CCP1 module). SPI data in.
2
C™ data I/O.
I
Digital I/O. Analog input 10. External interrupt 1. Synchronous serial clock input/output for SPI mode. Synchronous serial clock input/output for I
Digital I/O. Analog input 8. External interrupt 2. External USB transceiver VMO output.
Digital I/O. Analog input 9. Capture 2 input/Compare 2 output/PWM 2 output. External USB transceiver VPO output.
Digital I/O. Analog input 11. Interrupt-on-change pin.
Digital I/O. Interrupt-on-change pin. Low-Voltage ICSP™ Programming enable pin.
Digital I/O. Interrupt-on-change pin. In-Circuit Debugger and ICSP programming clock pin.
Digital I/O. Interrupt-on-change pin. In-Circuit Debugger and ICSP programming data pin.
2
C mode.
DS39632C-page 14 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550
TABLE 1-2: PIC18F2455/2550 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin
Pin Name
RC0/T1OSO/T13CKI
RC0 T1OSO T13CKI
RC1/T1OSI/CCP2/UOE
RC1 T1OSI
(2)
CCP2 UOE
RC2/CCP1
RC2 CCP1
RC4/D-/VM
RC4 D­VM
RC5/D+/VP
RC5 D+ VP
RC6/TX/CK
RC6 TX CK
RC7/RX/DT/SDO
RC7 RX DT SDO
RE3 See MCLR
VUSB 14 O Internal USB 3.3V voltage regulator.
SS 8, 19 P Ground reference for logic and I/O pins.
V
DD 20 P Positive supply for logic and I/O pins.
V
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set.
Number
PDIP,
SOIC
11
12
13
15
16
17
18
Pin
Type
I/O
O
I
I/O
I
I/O
I/O I/O
I
I/O
I
I
I/O
O
I/O
O
I/O
I/O
I
I/O
O
Buffer
Type
ST
ST
ST
CMOS
ST
ST ST
TTL
TTL
TTL
TTL
ST
ST
ST ST ST
Description
PORTC is a bidirectional I/O port.
Digital I/O. Timer1 oscillator output. Timer1/Timer3 external clock input.
Digital I/O. Timer1 oscillator input. Capture 2 input/Compare 2 output/PWM 2 output. External USB transceiver OE
Digital I/O. Capture 1 input/Compare 1 output/PWM 1 output.
Digital input. USB differential minus line (input/output). External USB transceiver VM input.
Digital input. USB differential plus line (input/output). External USB transceiver VP input.
Digital I/O. EUSART asynchronous transmit. EUSART synchronous clock (see RX/DT).
Digital I/O. EUSART asynchronous receive. EUSART synchronous data (see TX/CK). SPI data out.
/VPP/RE3 pin.
output.
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 15
PIC18F2455/2550/4455/4550
TABLE 1-3: PIC18F4455/4550 PINOUT I/O DESCRIPTIONS
Pin Name
Pin Number
PDIP QFN TQFP
Pin
Typ e
Buffer
Type
Description
/VPP/RE3
MCLR
MCLR
VPP RE3
OSC1/CLKI
OSC1 CLKI
OSC2/CLKO/RA6
OSC2
CLKO
RA6
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set. 3: These pins are No Connect unless the ICPRT Configuration bit is set. For NC/ICPORTS, the pin is No
Connect unless ICPRT is set and the DEBUG
11818
13 32 30
14 33 31
I
ST
P
I
ST
IIAnalog
Analog
O
O
I/O
TTL
Configuration bit is cleared.
Master Clear (input) or programming voltage (input).
Master Clear (Reset) input. This pin is an active-low Reset to the device. Programming voltage input. Digital input.
Oscillator crystal or external clock input.
Oscillator crystal input or external clock source input. External clock source input. Always associated with pin function OSC1. (See OSC2/CLKO pin.)
Oscillator crystal or clock output.
Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. In RC mode, OSC2 pin outputs CLKO which has 1/4 the frequency of OSC1 and denotes the instruction cycle rate. General purpose I/O pin.
DS39632C-page 16 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550
TABLE 1-3: PIC18F4455/4550 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
RA0/AN0
RA0 AN0
RA1/AN1
RA1 AN1
RA2/AN2/V
REF
CV
RA3/AN3/V
RA4/T0CKI/C1OUT/ RCV
RA5/AN4/SS HLVDIN/C2OUT
RA6 See the OSC2/CLKO/RA6 pin.
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
REF-/
RA2 AN2
REF-
V CV
REF
REF+
RA3 AN3
REF+
V
RA4 T0CKI C1OUT RCV
/
RA5 AN4 SS HLVDIN C2OUT
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
2: Default assignment for CCP2 when CCP2MX Configuration bit is set. 3: These pins are No Connect unless the ICPRT Configuration bit is set. For NC/ICPORTS, the pin is No
Connect unless ICPRT is set and the DEBUG
Pin Number
PDIP QFN TQFP
21919
32020
42121
52222
62323
72424
Pin
Buffer
Typ e
Type
I/OITTL
Analog
I/OITTL
Analog
I/O
I
Analog
I
Analog
O
Analog
I/O
I
Analog
I
Analog
I/O
I
O
I
I/O
I
Analog I I
Analog
O
PORTA is a bidirectional I/O port.
Digital I/O. Analog input 0.
Digital I/O. Analog input 1.
TTL
TTL
ST ST
TTL
TTL
TTL
Configuration bit is cleared.
Digital I/O. Analog input 2. A/D reference voltage (low) input. Analog comparator reference output.
Digital I/O. Analog input 3. A/D reference voltage (high) input.
Digital I/O. Timer0 external clock input. Comparator 1 output. External USB transceiver RCV input.
Digital I/O. Analog input 4. SPI slave select input. High/Low-Voltage Detect input. Comparator 2 output.
Description
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 17
PIC18F2455/2550/4455/4550
TABLE 1-3: PIC18F4455/4550 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
RB0/AN12/INT0/ FLT0/SDI/SDA
RB0 AN12 INT0 FLT0 SDI SDA
RB1/AN10/INT1/SCK/ SCL
RB1 AN10 INT1 SCK SCL
RB2/AN8/INT2/VMO
RB2 AN8 INT2 VMO
RB3/AN9/CCP2/VPO
RB3 AN9
(1)
CCP2 VPO
RB4/AN11/KBI0/CSSPP
RB4 AN11 KBI0 CSSPP
RB5/KBI1/PGM
RB5 KBI1 PGM
RB6/KBI2/PGC
RB6 KBI2 PGC
RB7/KBI3/PGD
RB7 KBI3 PGD
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set. 3: These pins are No Connect unless the ICPRT Configuration bit is set. For NC/ICPORTS, the pin is No
Connect unless ICPRT is set and the DEBUG
Pin Number
PDIP QFN TQFP
33 9 8
34 10 9
35 11 10
36 12 11
37 14 14
38 15 15
39 16 16
40 17 17
Pin
Typ e
I/O
I I I I
I/O
I/O
I
I I/O I/O
I/O
I
I
O
I/O
I I/O
O
I/O
I
I
O
I/O
I I/O
I/O
I I/O
I/O
I I/O
Buffer
Type
PORTB is a bidirectional I/O port. PORTB can be software programmed for internal weak pull-ups on all inputs.
TTL
Analog
ST ST ST ST
TTL
Analog
ST ST ST
TTL
Analog
ST
TTL
Analog
ST
TTL
Analog
TTL
TTL TTL
ST
TTL TTL
ST
TTL TTL
ST
Configuration bit is cleared.
Digital I/O. Analog input 12. External interrupt 0. Enhanced PWM Fault input (ECCP1 module). SPI data in.
2
C™ data I/O.
I
Digital I/O. Analog input 10. External interrupt 1. Synchronous serial clock input/output for SPI mode. Synchronous serial clock input/output for I
Digital I/O. Analog input 8. External interrupt 2. External USB transceiver VMO output.
Digital I/O. Analog input 9. Capture 2 input/Compare 2 output/PWM 2 output. External USB transceiver VPO output.
Digital I/O. Analog input 11. Interrupt-on-change pin. SPP chip select control output.
Digital I/O. Interrupt-on-change pin. Low-Voltage ICSP™ Programming enable pin.
Digital I/O. Interrupt-on-change pin. In-Circuit Debugger and ICSP programming clock pin.
Digital I/O. Interrupt-on-change pin. In-Circuit Debugger and ICSP programming data pin.
Description
2
C mode.
DS39632C-page 18 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550
TABLE 1-3: PIC18F4455/4550 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
RC0/T1OSO/T13CKI
RC0 T1OSO T13CKI
RC1/T1OSI/CCP2/ UOE
RC1 T1OSI
(2)
CCP2 UOE
RC2/CCP1/P1A
RC2 CCP1 P1A
RC4/D-/VM
RC4 D­VM
RC5/D+/VP
RC5 D+ VP
RC6/TX/CK
RC6 TX CK
RC7/RX/DT/SDO
RC7 RX DT SDO
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set. 3: These pins are No Connect unless the ICPRT Configuration bit is set. For NC/ICPORTS, the pin is No
Connect unless ICPRT is set and the DEBUG
Pin Number
PDIP QFN TQFP
15 34 32
16 35 35
17 36 36
23 42 42
24 43 43
25 44 44
26 1 1
Pin
Typ e
I/O
O
I
I/O
I
I/O
O
I/O I/O
O
I
I/O
I
I
I/O
I
I/O
O
I/O
I/O
I
I/O
O
Buffer
Type
PORTC is a bidirectional I/O port.
ST
ST
ST
CMOS
ST
ST ST
TTL
TTL
TTL
TTL
TTL
ST
ST
ST ST ST
Configuration bit is cleared.
Digital I/O. Timer1 oscillator output. Timer1/Timer3 external clock input.
Digital I/O. Timer1 oscillator input. Capture 2 input/Compare 2 output/PWM 2 output. External USB transceiver OE output.
Digital I/O. Capture 1 input/Compare 1 output/PWM 1 output. Enhanced CCP1 PWM output, channel A.
Digital input. USB differential minus line (input/output). External USB transceiver VM input.
Digital input. USB differential plus line (input/output). External USB transceiver VP input.
Digital I/O. EUSART asynchronous transmit. EUSART synchronous clock (see RX/DT).
Digital I/O. EUSART asynchronous receive. EUSART synchronous data (see TX/CK). SPI data out.
Description
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 19
PIC18F2455/2550/4455/4550
TABLE 1-3: PIC18F4455/4550 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
RD0/SPP0
RD0 SPP0
RD1/SPP1
RD1 SPP1
RD2/SPP2
RD2 SPP2
RD3/SPP3
RD3 SPP3
RD4/SPP4
RD4 SPP4
RD5/SPP5/P1B
RD5 SPP5 P1B
RD6/SPP6/P1C
RD6 SPP6 P1C
RD7/SPP7/P1D
RD7 SPP7 P1D
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set. 3: These pins are No Connect unless the ICPRT Configuration bit is set. For NC/ICPORTS, the pin is No
Connect unless ICPRT is set and the DEBUG
Pin Number
PDIP QFN TQFP
19 38 38
20 39 39
21 40 40
22 41 41
27 2 2
28 3 3
29 4 4
30 5 5
Pin
Buffer
Typ e
Type
I/O I/OSTTTL
I/O I/OSTTTL
I/O I/OSTTTL
I/O I/OSTTTL
I/O I/OSTTTL
I/O I/O
O
I/O I/O
O
I/O I/O
O
Description
PORTD is a bidirectional I/O port or a Streaming Parallel Port (SPP). These pins have TTL input buffers when the SPP module is enabled.
Digital I/O. Streaming Parallel Port data.
Digital I/O. Streaming Parallel Port data.
Digital I/O. Streaming Parallel Port data.
Digital I/O. Streaming Parallel Port data.
Digital I/O. Streaming Parallel Port data.
ST
TTL
ST
TTL
ST
TTL
Configuration bit is cleared.
Digital I/O. Streaming Parallel Port data. Enhanced CCP1 PWM output, channel B.
Digital I/O. Streaming Parallel Port data. Enhanced CCP1 PWM output, channel C.
Digital I/O. Streaming Parallel Port data. Enhanced CCP1 PWM output, channel D.
DS39632C-page 20 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550
TABLE 1-3: PIC18F4455/4550 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
RE0/AN5/CK1SPP
RE0 AN5 CK1SPP
RE1/AN6/CK2SPP
RE1 AN6 CK2SPP
RE2/AN7/OESPP
RE2 AN7 OESPP
RE3 See MCLR
VSS 12, 31 6, 30, 316, 29 P Ground reference for logic and I/O pins.
V
DD 11, 32 7, 8,
V
USB 18 37 37 O Internal USB 3.3V voltage regulator output.
NC/ICCK/ICPGC
ICCK ICPGC
NC/ICDT/ICPGD
ICDT ICPGD
NC/ICRST/ICVPP
ICRST ICVPP
NC/ICPORTS
ICPORTS
NC 13 No Connect.
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set. 3: These pins are No Connect unless the ICPRT Configuration bit is set. For NC/ICPORTS, the pin is No
(3)
(3)
(3)
(3)
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
Connect unless ICPRT is set and the DEBUG
Pin Number
PDIP QFN TQFP
82525
92626
10 27 27
7, 28 P Positive supply for logic and I/O pins.
28, 29
——12
——13
——33
34 P No Connect or 28-pin device emulation.
Pin
Buffer
Typ e
I/O
I
Analog
O
I/O
I
Analog
O
I/O
I
Analog
O
I/O I/OSTST
I/O I/OSTST
I
P
Type
PORTE is a bidirectional I/O port.
ST
ST
ST
— —
Configuration bit is cleared.
Digital I/O. Analog input 5. SPP clock 1 output.
Digital I/O. Analog input 6. SPP clock 2 output.
Digital I/O. Analog input 7. SPP output enable output.
/VPP/RE3 pin.
No Connect or dedicated ICD/ICSP™ port clock.
In-Circuit Debugger clock. ICSP programming clock.
No Connect or dedicated ICD/ICSP port clock.
In-Circuit Debugger data. ICSP programming data.
No Connect or dedicated ICD/ICSP port Reset.
Master Clear (Reset) input. Programming voltage input.
Enable 28-pin device emulation when connected
SS.
to V
Description
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 21
PIC18F2455/2550/4455/4550
NOTES:
DS39632C-page 22 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550

2.0 OSCILLATOR CONFIGURATIONS

2.1 Overview

Devices in the PIC18F2455/2550/4455/4550 family incorporate a different oscillator and microcontroller clock system than previous PIC18F devices. The addi­tion of the USB module, with its unique requirements for a stable clock source, make it necessary to provide a separate clock source that is compliant with both USB low-speed and full-speed specifications.
To accommodate these requirements, PIC18F2455/ 2550/4455/4550 devices include a new clock branch to provide a 48 MHz clock for full-speed USB operation. Since it is driven from the primary clock source, an additional system of prescalers and postscalers has been added to accommodate a wide range of oscillator frequencies. An overview of the oscillator structure is shown in Figure 2-1.
Other oscillator features used in PIC18 enhanced microcontrollers, such as the internal oscillator block and clock switching, remain the same. They are discussed later in this chapter.

2.1.1 OSCILLATOR CONTROL

The operation of the oscillator in PIC18F2455/2550/ 4455/4550 devices is controlled through two Configu­ration registers and two control registers. Configuration registers, CONFIG1L and CONFIG1H, select the oscillator mode and USB prescaler/postscaler options. As Configuration bits, these are set when the device is programmed and left in that configuration until the device is reprogrammed.
The OSCCON register (Register 2-2) selects the Active Clock mode; it is primarily used in controlling clock switching in power-managed modes. Its use is discussed in Section 2.4.1 “Oscillator Control Register”.
The OSCTUNE register (Register 2-1) is used to trim the INTRC frequency source, as well as select the low-frequency clock source that drives several special features. Its use is described in Section 2.2.5.2
“OSCTUNE Register”.

2.2 Oscillator Types

PIC18F2455/2550/4455/4550 devices can be operated in twelve distinct oscillator modes. In contrast with pre­vious PIC18 enhanced microcontrollers, four of these modes involve the use of two oscillator types at once. Users can program the FOSC3:FOSC0 Configuration bits to select one of these modes:
1. XT Crystal/Resonator
2. XTPLL Crystal/Resonator with PLL enabled
3. HS High-Speed Crystal/Resonator
4. HSPLL High-Speed Crystal/Resonator with PLL enabled
5. EC External Clock with F
6. ECIO External Clock with I/O on RA6
7. ECPLL External Clock with PLL enabled and F
OSC/4 output on RA6
8. ECPIO External Clock with PLL enabled, I/O on RA6
9. INTHS Internal Oscillator used as microcontroller clock source, HS Oscillator used as USB clock source
10. INTXT Internal Oscillator used as microcontroller clock source, XT Oscillator used as USB clock source
11. INTIO Internal Oscillator used as microcontroller clock source, EC Oscillator used as USB clock source, digital I/O on RA6
12. INTCKO Internal Oscillator used as microcontroller clock source, EC Oscillator used as USB clock source,
OSC/4 output on RA6
F
OSC/4 output
2.2.1 OSCILLATOR MODES AND
USB OPERATION
Because of the unique requirements of the USB module, a different approach to clock operation is necessary. In previous PICmicro clocks were driven by a single oscillator source; the usual sources were primary, secondary or the internal oscillator. With PIC18F2455/2550/4455/4550 devices, the primary oscillator becomes part of the USB module and cannot be associated to any other clock source. Thus, the USB module must be clocked from the primary clock source; however, the microcontroller core and other peripherals can be separately clocked from the secondary or internal oscillators as before.
Because of the timing requirements imposed by USB, an internal clock of either 6 MHz or 48 MHz is required while the USB module is enabled. Fortunately, the microcontroller and other peripherals are not required to run at this clock speed when using the primary oscillator. There are numerous options to achieve the USB module clock requirement and still provide flexibil­ity for clocking the rest of the device from the primary oscillator source. These are detailed in Section 2.3 “Oscillator Settings for USB”.
®
devices, all core and peripheral
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 23
PIC18F2455/2550/4455/4550
FIGURE 2-1: PIC18F2455/2550/4455/4550 CLOCK DIAGRAM
PIC18F2455/2550/4455/4550
OSC2
OSC1
T1OSO
T1OSI
Primary Oscillator
Sleep
XT, HS, EC, ECIO
Secondary Oscillator
T1OSCEN Enable Oscillator
OSCCON<6:4>
Internal
Oscillator
Block
8 MHz Source
INTRC
Source
31 kHz (INTRC)
8 MHz
(INTOSC)
PLLDIV
÷ 12
111
÷ 10
110
÷ 6
101
100
011
010
001
000
1 0
8 MHz
4 MHz
2 MHz
1 MHz
500 kHz
250 kHz
125 kHz
31 kHz
MUX
HSPLL, ECPLL,
XTPLL, ECPIO
(4 MHz Input Only)
96 MHz
PLL
CPUDIV
÷ 6
11
÷ 4
10
÷ 3
01
÷ 2
PLL Postscaler
OSCCON<6:4>
111
110
101
100
011
010
001
000
OSCTUNE<7>
00
MUX
÷ 2
FOSC3:FOSC0
Internal Oscillator
÷ 5 ÷ 4 ÷ 3
PLL Prescaler
÷ 2 ÷ 1
CPUDIV
÷ 4
11
÷ 3
10
÷ 2
01
÷ 1
00
Oscillator Postscaler
INTOSC Postscaler
USB Clock Source
USBDIV
0 1
÷ 4
1 0
Primary Clock
T1OSC
FOSC3:FOSC0
Clock Source Option for other Modules
MUX
Clock
Control
FSEN
1
0
IDLEN
Peripherals
OSCCON<1:0>
USB
Peripheral
CPU
WDT, PWRT, FSCM and Two-Speed Start-up
DS39632C-page 24 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550

2.2.2 CRYSTAL OSCILLATOR/CERAMIC RESONATORS

In HS, HSPLL, XT and XTPLL Oscillator modes, a crystal or ceramic resonator is connected to the OSC1 and OSC2 pins to establish oscillation. Figure 2-2 shows the pin connections.
The oscillator design requires the use of a parallel cut crystal.
Note: Use of a series cut crystal may give a fre-
quency out of the crystal manufacturer’s specifications.
FIGURE 2-2: CRYSTAL/CERAMIC
RESONATOR OPERATION (XT, HS OR HSPLL CONFIGURATION)
(1)
C1
(1)
C2
Note 1: See Table 2-1 and Table 2-2 for initial values of
2: A series resistor (R
3: R
OSC1
XTAL
(2)
RS
OSC2
C1 and C2.
strip cut crystals.
F varies with the oscillator mode chosen.
(3)
RF
Sleep
PIC18FXXXX
S) may be required for AT
To
Internal Logic
TABLE 2-1: CAPACITOR SELECTION FOR
CERAMIC RESONATORS
Typical Capacitor Values Used:
Mode Freq OSC1 OSC2
XT 4.0 MHz 33 pF 33 pF
HS 8.0 MHz
16.0 MHz
Capacitor values are for design guidance only.
These capacitors were tested with the resonators listed below for basic start-up and operation. These values are not optimized.
Different capacitor values may be required to produce acceptable oscillator operation. The user should test the performance of the oscillator over the expected
DD and temperature range for the application.
V
See the notes following Table 2-2 for additional information.
Resonators Used:
16.0 MHz
4.0 MHz
8.0 MHz
27 pF 22 pF
27 pF 22 pF
TABLE 2-2: CAPACITOR SELECTION FOR
CRYSTAL OSCILLATOR
Osc Type
Crystal
Freq
XT 4 MHz 27 pF 27 pF
HS 4 MHz 27 pF 27 pF
8 MHz 22 pF 22 pF
20 MHz 15 pF 15 pF
Capacitor values are for design guidance only.
These capacitors were tested with the crystals listed below for basic start-up and operation. These values
are not optimized.
Different capacitor values may be required to produce acceptable oscillator operation. The user should test the performance of the oscillator over the expected
DD and temperature range for the application.
V
See the notes following this table for additional information.
Crystals Used:
Note 1: Higher capacitance increases the stability
of oscillator but also increases the start-up time.
2: When operating below 3V V
using certain ceramic resonators at any voltage, it may be necessary to use the HS mode or switch to a crystal oscillator.
3: Since each resonator/crystal has its own
characteristics, the user should consult the resonator/crystal manufacturer for appropriate values of external components.
4: Rs may be required to avoid overdriving
crystals with low drive level specification.
5: Always verify oscillator performance over
DD and temperature range that is
the V expected for the application.
An internal postscaler allows users to select a clock frequency other than that of the crystal or resonator. Frequency division is determined by the CPUDIV Configuration bits. Users may select a clock frequency of the oscillator frequency, or 1/2, 1/3 or 1/4 of the frequency.
An external clock may also be used when the micro­controller is in HS Oscillator mode. In this case, the OSC2/CLKO pin is left open (Figure 2-3).
Typical Capacitor Values
Test ed:
C1 C2
4 MHz
8 MHz
20 MHz
DD, or when
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 25
PIC18F2455/2550/4455/4550
FIGURE 2-3: EXTERNAL CLOCK INPUT
OPERATION (HS OSC CONFIGURATION)
Clock from Ext. System
Open
OSC1
OSC2
PIC18FXXXX
(HS Mode)

2.2.3 EXTERNAL CLOCK INPUT

The EC, ECIO, ECPLL and ECPIO Oscillator modes require an external clock source to be connected to the OSC1 pin. There is no oscillator start-up time required after a Power-on Reset or after an exit from Sleep mode.
In the EC and ECPLL Oscillator modes, the oscillator frequency divided by 4 is available on the OSC2 pin. This signal may be used for test purposes or to synchronize other logic. Figure 2-4 shows the pin connections for the EC Oscillator mode.
FIGURE 2-4: EXTERNAL CLOCK
INPUT OPERATION (EC AND ECPLL CONFIGURATION)

2.2.4 PLL FREQUENCY MULTIPLIER

PIC18F2455/2550/4255/4550 devices include a Phase Locked Loop (PLL) circuit. This is provided specifically for USB applications with lower speed oscillators and can also be used as a microcontroller clock source.
The PLL is enabled in HSPLL, XTPLL, ECPLL and ECPIO Oscillator modes. It is designed to produce a fixed 96 MHz reference clock from a fixed 4 MHz input. The output can then be divided and used for both the USB and the microcontroller core clock. Because the PLL has a fixed frequency input and output, there are eight prescaling options to match the oscillator input frequency to the PLL.
There is also a separate postscaler option for deriving the microcontroller clock from the PLL. This allows the USB peripheral and microcontroller to use the same oscillator input and still operate at different clock speeds. In contrast to the postscaler for XT, HS and EC modes, the available options are 1/2, 1/3, 1/4 and 1/6 of the PLL output.
The HSPLL, ECPLL and ECPIO modes make use of the HS mode oscillator for frequencies up to 48 MHz. The prescaler divides the oscillator input by up to 12 to produce the 4 MHz drive for the PLL. The XTPLL mode can only use an input frequency of 4 MHz which drives the PLL directly.
Clock from Ext. System
OSC/4
F
OSC1/CLKI
PIC18FXXXX
OSC2/CLKO
The ECIO and ECPIO Oscillator modes function like the EC and ECPLL modes, except that the OSC2 pin becomes an additional general purpose I/O pin. The I/O pin becomes bit 6 of PORTA (RA6). Figure 2-5 shows the pin connections for the ECIO Oscillator mode.
FIGURE 2-5: EXTERNAL CLOCK
INPUT OPERATION (ECIO AND ECPIO CONFIGURATION)
Clock from Ext. System
RA6
The internal postscaler for reducing clock frequency in XT and HS modes is also available in EC and ECIO modes.
OSC1/CLKI
PIC18FXXXX
I/O (OSC2)
FIGURE 2-6: PLL BLOCK DIAGRAM
(HS MODE)
HS/EC/ECIO/XT Oscillator Enable
(from CONFIG1H Register)
OSC2
Oscillator
OSC1
and
Prescaler
PLL Enable
Phase
Comparator
IN
F
FOUT
÷24
Loop Filter
VCO
SYSCLK
MUX
DS39632C-page 26 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550

2.2.5 INTERNAL OSCILLATOR BLOCK

The PIC18F2455/2550/4455/4550 devices include an internal oscillator block which generates two different clock signals; either can be used as the microcontroller’s clock source. If the USB peripheral is not used, the internal oscillator may eliminate the need for external oscillator circuits on the OSC1 and/or OSC2 pins.
The main output (INTOSC) is an 8 MHz clock source which can be used to directly drive the device clock. It also drives the INTOSC postscaler which can provide a range of clock frequencies from 31 kHz to 4 MHz. The INTOSC output is enabled when a clock frequency from 125 kHz to 8 MHz is selected.
The other clock source is the internal RC oscillator (INTRC) which provides a nominal 31 kHz output. INTRC is enabled if it is selected as the device clock source; it is also enabled automatically when any of the following are enabled:
• Power-up Timer
• Fail-Safe Clock Monitor
• Watchdog Timer
• Two-Speed Start-up
These features are discussed in greater detail in Section 25.0 “Special Features of the CPU”.
The clock source frequency (INTOSC direct, INTRC direct or INTOSC postscaler) is selected by configuring the IRCF bits of the OSCCON register (page 32).
2.2.5.1 Internal Oscillator Modes
When the internal oscillator is used as the micro­controller clock source, one of the other oscillator modes (External Clock or External Crystal/Resonator) must be used as the USB clock source. The choice of the USB clock source is determined by the particular internal oscillator mode.
There are four distinct modes available:
1. INTHS mode: The USB clock is provided by the
oscillator in HS mode.
2. INTXT mode: The USB clock is provided by the
oscillator in XT mode.
3. INTCKO mode: The USB clock is provided by an
external clock input on OSC1/CLKI; the OSC2/ CLKO pin outputs F
4. INTIO mode: The USB clock is provided by an
external clock input on OSC1/CLKI; the OSC2/ CLKO pin functions as a digital I/O (RA6).
Of these four modes, only INTIO mode frees up an additional pin (OSC2/CLKO/RA6) for port I/O use.
OSC/4.
2.2.5.2 OSCTUNE Register
The internal oscillator’s output has been calibrated at the factory but can be adjusted in the user’s applica­tion. This is done by writing to the OSCTUNE register (Register 2-1). The tuning sensitivity is constant throughout the tuning range.
When the OSCTUNE register is modified, the INTOSC and INTRC frequencies will begin shifting to the new frequency. The INTRC clock will reach the new frequency within 8 clock cycles (approximately, 8*32μs = 256 μs). The INTOSC clock will stabilize within 1 ms. Code execution continues during this shift. There is no indication that the shift has occurred.
The OSCTUNE register also contains the INTSRC bit. The INTSRC bit allows users to select which internal oscillator provides the clock source when the 31 kHz frequency option is selected. This is covered in greater detail in Section 2.4.1 “Oscillator Control Register”.
2.2.5.3 Internal Oscillator Output Frequency and Drift
The internal oscillator block is calibrated at the factory to produce an INTOSC output frequency of 8.0 MHz. However, this frequency may drift as VDD or tempera­ture changes, which can affect the controller operation in a variety of ways.
The low-frequency INTRC oscillator operates indepen­dently of the INTOSC source. Any changes in INTOSC across voltage and temperature are not necessarily reflected by changes in INTRC and vice versa.
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 27
PIC18F2455/2550/4455/4550
REGISTER 2-1: OSCTUNE: OSCILLATOR TUNING REGISTER
R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
INTSRC TUN4 TUN3 TUN2 TUN1 TUN0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 INTSRC: Internal Oscillator Low-Frequency Source Select bit
1 = 31.25 kHz device clock derived from 8 MHz INTOSC source (divide-by-256 enabled) 0 = 31 kHz device clock derived directly from INTRC internal oscillator
bit 6-5 Unimplemented: Read as ‘0’
bit 4-0 TUN4:TUN0: Frequency Tuning bits
01111 = Maximum frequency
00001 00000 = Center frequency. Oscillator module is running at the calibrated frequency. 11111
10000 = Minimum frequency
2.2.5.4 Compensating for INTOSC Drift
It is possible to adjust the INTOSC frequency by modifying the value in the OSCTUNE register. This has no effect on the INTRC clock source frequency.
Tuning the INTOSC source requires knowing when to make the adjustment, in which direction it should be made and in some cases, how large a change is needed. When using the EUSART, for example, an adjustment may be required when it begins to generate framing errors or receives data with errors while in Asynchronous mode. Framing errors indicate that the device clock frequency is too high; to adjust for this, decrement the value in OSCTUNE to reduce the clock frequency. On the other hand, errors in data may sug­gest that the clock speed is too low; to compensate, increment OSCTUNE to increase the clock frequency.
It is also possible to verify device clock speed against a reference clock. Two timers may be used: one timer is clocked by the peripheral clock, while the other is clocked by a fixed reference source, such as the Timer1 oscillator. Both timers are cleared but the timer clocked by the reference generates interrupts. When
an interrupt occurs, the internally clocked timer is read and both timers are cleared. If the internally clocked timer value is greater than expected, then the internal oscillator block is running too fast. To adjust for this, decrement the OSCTUNE register.
Finally, a CCP module can use free-running Timer1 (or Timer3), clocked by the internal oscillator block and an external event with a known period (i.e., AC power frequency). The time of the first event is captured in the CCPRxH:CCPRxL registers and is recorded for use later. When the second event causes a capture, the time of the first event is subtracted from the time of the second event. Since the period of the external event is known, the time difference between events can be calculated.
If the measured time is much greater than the calcu­lated time, the internal oscillator block is running too fast; to compensate, decrement the OSCTUNE register. If the measured time is much less than the calculated time, the internal oscillator block is running too slow; to compensate, increment the OSCTUNE register.
DS39632C-page 28 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550

2.3 Oscillator Settings for USB

active and the controller clock source is one of the primary oscillator modes (XT, HS or EC, with or without
When the PIC18F4550 is used for USB connectivity, it must have either a 6 MHz or 48 MHz clock for USB operation, depending on whether Low-Speed or Full-Speed mode is being used. This may require some forethought in selecting an oscillator frequency and programming the device.
The full range of possible oscillator configurations compatible with USB operation is shown in Table 2-3.

2.3.1 LOW-SPEED OPERATION

The USB clock for Low-Speed mode is derived from the primary oscillator chain and not directly from the PLL. It is divided by 4 to produce the actual 6 MHz clock. Because of this, the microcontroller can only use a clock frequency of 24 MHz when the USB module is
the PLL).
This restriction does not apply if the microcontroller clock source is the secondary oscillator or internal oscillator block.
2.3.2 RUNNING DIFFERENT USB AND
MICROCONTROLLER CLOCKS
The USB module, in either mode, can run asynchro­nously with respect to the microcontroller core and other peripherals. This means that applications can use the primary oscillator for the USB clock while the micro­controller runs from a separate clock source at a lower speed. If it is necessary to run the entire application from only one clock source, full-speed operation provides a greater selection of microcontroller clock frequencies.
TABLE 2-3: OSCILLATOR CONFIGURATION OPTIONS FOR USB OPERATION
Input Oscillator
Frequency
48 MHz N/A
48 MHz ÷12 (111) EC, ECIO None (00)48MHz
40 MHz ÷10 (110) EC, ECIO None (00)40MHz
24 MHz ÷6 (101) HS, EC, ECIO None (00) 24 MHz
Legend: All clock frequencies, except 24 MHz, are exclusively associated with full-speed USB operation (USB clock of 48 MHz).
Bold is used to highlight clock selections that are compatible with low-speed USB operation (system clock of 24 MHz,
USB clock of 6 MHz).
Note 1: Only valid when the USBDIV Configuration bit is cleared.
PLL Division
(PLLDIV2:PLLDIV0)
(1)
Clock Mode
(FOSC3:FOSC0)
EC, ECIO None (00)48MHz
ECPLL, ECPIO ÷2 (00)48MHz
ECPLL, ECPIO ÷2 (00)48MHz
HSPLL, ECPLL, ECPIO ÷2 (00)48MHz
MCU Clock Division (CPUDIV1:CPUDIV0)
÷2 (01) 24 MHz ÷3 (10)16MHz ÷4 (11)12MHz
÷2 (01) 24 MHz ÷3 (10)16MHz ÷4 (11)12MHz
÷3 (01)32MHz ÷4 (10) 24 MHz ÷6 (11)16MHz
÷2 (01)20MHz ÷3 (10) 13.33 MHz ÷4 (11)10MHz
÷3 (01)32MHz ÷4 (10) 24 MHz ÷6 (11)16MHz
01)12MHz
÷2 ( ÷3 (10)8MHz ÷4 (11)6MHz
÷3 (01)32MHz ÷4 (10) 24 MHz ÷6 (11)16MHz
Microcontroller
Clock Frequency
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 29
PIC18F2455/2550/4455/4550
TABLE 2-3: OSCILLATOR CONFIGURATION OPTIONS FOR USB OPERATION (CONTINUED)
Input Oscillator
Frequency
20 MHz ÷5 (100) HS, EC, ECIO None (00)20MHz
16 MHz ÷4 (011) HS, EC, ECIO None (00)16MHz
12 MHz ÷3 (010) HS, EC, ECIO None (00)12MHz
8MHz ÷2 (001) HS, EC, ECIO None (00)8MHz
4MHz ÷1 (000) XT, HS, EC, ECIO None (00)4MHz
Legend: All clock frequencies, except 24 MHz, are exclusively associated with full-speed USB operation (USB clock of 48 MHz).
Bold is used to highlight clock selections that are compatible with low-speed USB operation (system clock of 24 MHz,
USB clock of 6 MHz).
Note 1: Only valid when the USBDIV Configuration bit is cleared.
PLL Division
(PLLDIV2:PLLDIV0)
Clock Mode
(FOSC3:FOSC0)
HSPLL, ECPLL, ECPIO ÷2 (00)48MHz
HSPLL, ECPLL, ECPIO ÷2 (00)48MHz
HSPLL, ECPLL, ECPIO ÷2 (00)48MHz
HSPLL, ECPLL, ECPIO ÷2 (00)48MHz
HSPLL, ECPLL, XTPLL,
ECPIO
MCU Clock Division
(CPUDIV1:CPUDIV0)
÷2 (01)10MHz ÷3 (10)6.67MHz ÷4 (11)5MHz
÷3 (01)32MHz ÷4 (10) 24 MHz ÷6 (11)16MHz
÷2 (01)8MHz ÷3 (10)5.33MHz ÷4 (11)4MHz
÷3 (01)32MHz ÷4 (10) 24 MHz ÷6 (11)16MHz
÷2 (01)6MHz ÷3 (10)4MHz ÷4 (11)3MHz
3 (01)32MHz
÷ ÷4 (10) 24 MHz ÷6 (11)16MHz
÷2 (01)4MHz ÷3 (10)2.67MHz ÷4 (11)2MHz
÷3 (01)32MHz ÷4 (10) 24 MHz ÷6 (11)16MHz
÷2 (01)2MHz ÷3 (10)1.33MHz ÷4 (11)1MHz ÷2 (00)48MHz ÷3 (01)32MHz ÷4 (10) 24 MHz ÷6 (11)16MHz
Microcontroller
Clock Frequency
DS39632C-page 30 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550

2.4 Clock Sources and Oscillator Switching

Like previous PIC18 enhanced devices, the PIC18F2455/2550/4455/4550 family includes a feature that allows the device clock source to be switched from the main oscillator to an alternate low-frequency clock source. PIC18F2455/2550/4455/4550 devices offer two alternate clock sources. When an alternate clock source is enabled, the various power-managed operating modes are available.
Essentially, there are three clock sources for these devices:
• Primary oscillators
• Secondary oscillators
• Internal oscillator block
The primary oscillators include the External Crystal and Resonator modes, the External Clock modes and the internal oscillator block. The particular mode is defined by the FOSC3:FOSC0 Configuration bits. The details of these modes are covered earlier in this chapter.
The secondary oscillators are those external sources not connected to the OSC1 or OSC2 pins. These sources may continue to operate even after the controller is placed in a power-managed mode.
PIC18F2455/2550/4455/4550 devices offer the Timer1 oscillator as a secondary oscillator. This oscillator, in all power-managed modes, is often the time base for functions such as a Real-Time Clock. Most often, a
32.768 kHz watch crystal is connected between the
RC0/T1OSO/T13CKI and RC1/T1OSI/UOE the XT and HS oscillator mode circuits, loading capacitors are also connected from each pin to ground. The Timer1 oscillator is discussed in greater detail in Section 12.3 “Timer1 Oscillator”.
In addition to being a primary clock source, the internal oscillator block is available as a power-managed mode clock source. The INTRC source is also used as the clock source for several special features, such as the WDT and Fail-Safe Clock Monitor.

2.4.1 OSCILLATOR CONTROL REGISTER

The OSCCON register (Register 2-2) controls several aspects of the device clock’s operation, both in full power operation and in power-managed modes.
The System Clock Select bits, SCS1:SCS0, select the clock source. The available clock sources are the primary clock (defined by the FOSC3:FOSC0 Configu­ration bits), the secondary clock (Timer1 oscillator) and the internal oscillator block. The clock source changes immediately after one or more of the bits is written to, following a brief clock transition interval. The SCS bits are cleared on all forms of Reset.
pins. Like
The Internal Oscillator Frequency Select bits, IRCF2:IRCF0, select the frequency output of the internal oscillator block to drive the device clock. The choices are the INTRC source, the INTOSC source (8 MHz) or one of the frequencies derived from the INTOSC postscaler (31 kHz to 4 MHz). If the internal oscillator block is supplying the device clock, changing the states of these bits will have an immediate change on the internal oscil­lator’s output. On device Resets, the default output frequency of the internal oscillator block is set at 1 MHz.
When an output frequency of 31 kHz is selected (IRCF2:IRCF0 = 000), users may choose which inter­nal oscillator acts as the source. This is done with the INTSRC bit in the OSCTUNE register (OSCTUNE<7>). Setting this bit selects INTOSC as a 31.25 kHz clock source by enabling the divide-by-256 output of the INTOSC postscaler. Clearing INTSRC selects INTRC (nominally 31 kHz) as the clock source.
This option allows users to select the tunable and more precise INTOSC as a clock source, while maintaining power savings with a very low clock speed. Regardless of the setting of INTSRC, INTRC always remains the clock source for features such as the Watchdog Timer and the Fail-Safe Clock Monitor.
The OSTS, IOFS and T1RUN bits indicate which clock source is currently providing the device clock. The OSTS bit indicates that the Oscillator Start-up Timer has timed out and the primary clock is providing the device clock in primary clock modes. The IOFS bit indicates when the internal oscillator block has stabilized and is providing the device clock in RC Clock modes. The T1RUN bit (T1CON<6>) indicates when the Timer1 oscillator is providing the device clock in secondary clock modes. In power-managed modes, only one of these three bits will be set at any time. If none of these bits are set, the INTRC is providing the clock or the internal oscillator block has just started and is not yet stable.
The IDLEN bit determines if the device goes into Sleep mode, or one of the Idle modes, when the SLEEP instruction is executed.
The use of the flag and control bits in the OSCCON register is discussed in more detail in Section 3.0
“Power-Managed Modes”.
Note 1: The Timer1 oscillator must be enabled to
select the secondary clock source. The Timer1 oscillator is enabled by setting the T1OSCEN bit in the Timer1 Control regis­ter (T1CON<3>). If the Timer1 oscillator is not enabled, then any attempt to select a secondary clock source will be ignored.
2: It is recommended that the Timer1
oscillator be operating and stable prior to switching to it as the clock source; other­wise, a very long delay may occur while the Timer1 oscillator starts.
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 31
PIC18F2455/2550/4455/4550

2.4.2 OSCILLATOR TRANSITIONS

PIC18F2455/2550/4455/4550 devices contain circuitry to prevent clock “glitches” when switching between clock sources. A short pause in the device clock occurs during the clock switch. The length of this pause is the
sum of two cycles of the old clock source and three to four cycles of the new clock source. This formula assumes that the new clock source is stable.
Clock transitions are discussed in greater detail in
Section 3.1.2 “Entering Power-Managed Modes”.
REGISTER 2-2: OSCCON: OSCILLATOR CONTROL REGISTER
(1)
(1)
R-0 R/W-0 R/W-0
(2)
R/W-0 R/W-1 R/W-0 R/W-0 R
IDLEN IRCF2 IRCF1 IRCF0 OSTS IOFS SCS1 SCS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 IDLEN: Idle Enable bit
1 = Device enters Idle mode on SLEEP instruction 0 = Device enters Sleep mode on SLEEP instruction
bit 6-4 IRCF2:IRCF0: Internal Oscillator Frequency Select bits
111 = 8 MHz (INTOSC drives clock directly) 110 = 4 MHz 101 = 2 MHz 100 = 1 MHz 011 = 500 kHz 010 = 250 kHz 001 = 125 kHz 000 = 31 kHz (from either INTOSC/256 or INTRC directly)
bit 3 OSTS: Oscillator Start-up Time-out Status bit
1 = Oscillator Start-up Timer time-out has expired; primary oscillator is running 0 = Oscillator Start-up Timer time-out is running; primary oscillator is not ready
bit 2 IOFS: INTOSC Frequency Stable bit
1 = INTOSC frequency is stable 0 = INTOSC frequency is not stable
bit 1-0 SCS1:SCS0: System Clock Select bits
1x = Internal oscillator 01 = Timer1 oscillator 00 = Primary oscillator
(3)
Note 1: Depends on the state of the IESO Configuration bit.
2: Source selected by the INTSRC bit (OSCTUNE<7>), see text. 3: Default output frequency of INTOSC on Reset.
DS39632C-page 32 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550

2.5 Effects of Power-Managed Modes on the Various Clock Sources

When PRI_IDLE mode is selected, the designated primary oscillator continues to run without interruption. For all other power-managed modes, the oscillator using the OSC1 pin is disabled. Unless the USB module is enabled, the OSC1 pin (and OSC2 pin if used by the oscillator) will stop oscillating.
In secondary clock modes (SEC_RUN and SEC_IDLE), the Timer1 oscillator is operating and providing the device clock. The Timer1 oscillator may also run in all power-managed modes if required to clock Timer1 or Timer3.
In internal oscillator modes (RC_RUN and RC_IDLE), the internal oscillator block provides the device clock source. The 31 kHz INTRC output can be used directly to provide the clock and may be enabled to support various special features regardless of the power-managed mode (see Section 25.2 “Watchdog Timer (WDT)”, Section 25.3 “Two-Speed Start-up” and Section 25.4 “Fail-Safe Clock Monitor” for more information on WDT, Fail-Safe Clock Monitor and Two-Speed Start-up). The INTOSC output at 8 MHz may be used directly to clock the device or may be divided down by the postscaler. The INTOSC output is disabled if the clock is provided directly from the INTRC output.
Regardless of the Run or Idle mode selected, the USB clock source will continue to operate. If the device is operating from a crystal or resonator-based oscillator, that oscillator will continue to clock the USB module. The core and all other modules will switch to the new clock source.
If the Sleep mode is selected, all clock sources are stopped. Since all the transistor switching currents have been stopped, Sleep mode achieves the lowest current consumption of the device (only leakage currents).
Sleep mode should never be invoked while the USB module is operating and connected. The only exception is when the device has been issued a “Suspend”
command over the USB. Once the module has sus­pended operation and shifted to a low-power state, the microcontroller may be safely put into Sleep mode.
Enabling any on-chip feature that will operate during Sleep will increase the current consumed during Sleep. The INTRC is required to support WDT operation. The Timer1 oscillator may be operating to support a Real-Time Clock. Other features may be operating that do not require a device clock source (i.e., MSSP slave, PSP, INTn pins and others). Peripherals that may add significant current consumption are listed in
Section 28.2 “DC Characteristics: Power-Down and Supply Current”.

2.6 Power-up Delays

Power-up delays are controlled by two timers so that no external Reset circuitry is required for most applications. The delays ensure that the device is kept in Reset until the device power supply is stable under normal circum­stances and the primary clock is operating and stable. For additional information on power-up delays, see Section 4.5 “Device Reset Timers”.
The first timer is the Power-up Timer (PWRT), which provides a fixed delay on power-up (parameter 33, Table 28-12). It is enabled by clearing (= 0) the PWRTEN
The second timer is the Oscillator Start-up Timer (OST), intended to keep the chip in Reset until the crystal oscillator is stable (XT and HS modes). The OST does this by counting 1024 oscillator cycles before allowing the oscillator to clock the device.
When the HSPLL Oscillator mode is selected, the device is kept in Reset for an additional 2 ms following the HS mode OST delay, so the PLL can lock to the incoming clock frequency.
There is a delay of interval, T Table 28-12), following POR, while the controller becomes ready to execute instructions. This delay runs concurrently with any other delays. This may be the only delay that occurs when any of the EC or internal oscillator modes are used as the primary clock source.
Configuration bit.
CSD (parameter 38,

TABLE 2-4: OSC1 AND OSC2 PIN STATES IN SLEEP MODE

Oscillator Mode OSC1 Pin OSC2 Pin
INTCKO Floating, pulled by external clock At logic low (clock/4 output)
INTIO Floating, pulled by external clock Configured as PORTA, bit 6
ECIO, ECPIO Floating, pulled by external clock Configured as PORTA, bit 6
EC Floating, pulled by external clock At logic low (clock/4 output)
XT and HS Feedback inverter disabled at quiescent
voltage level
Note: See Table 4-2 in Section 4.0 “Reset” for time-outs due to Sleep and MCLR
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 33
Feedback inverter disabled at quiescent voltage level
Reset.
PIC18F2455/2550/4455/4550
NOTES:
DS39632C-page 34 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550

3.0 POWER-MANAGED MODES

PIC18F2455/2550/4455/4550 devices offer a total of seven operating modes for more efficient power management. These modes provide a variety of options for selective power conservation in applications where resources may be limited (i.e., battery-powered devices).
There are three categories of power-managed modes:
• Run modes
• Idle modes
• Sleep mode
These categories define which portions of the device are clocked and sometimes, what speed. The Run and Idle modes may use any of the three available clock sources (primary, secondary or internal oscillator block); the Sleep mode does not use a clock source.
The power-managed modes include several power-saving features offered on previous PICmicro devices. One is the clock switching feature, offered in other PIC18 devices, allowing the controller to use the Timer1 oscillator in place of the primary oscillator. Also included is the Sleep mode, offered by all PICmicro devices, where all device clocks are stopped.

3.1 Selecting Power-Managed Modes

Selecting a power-managed mode requires two decisions: if the CPU is to be clocked or not and the selection of a clock source. The IDLEN bit (OSCCON<7>) controls CPU clocking, while the SCS1:SCS0 bits (OSCCON<1:0>) select the clock source. The individual modes, bit settings, clock sources and affected modules are summarized in Table 3-1.

3.1.1 CLOCK SOURCES

The SCS1:SCS0 bits allow the selection of one of three clock sources for power-managed modes. They are:
• The primary clock, as defined by the FOSC3:FOSC0 Configuration bits
• The secondary clock (the Timer1 oscillator)
• The internal oscillator block (for RC modes)
3.1.2 ENTERING POWER-MANAGED
MODES
Switching from one power-managed mode to another begins by loading the OSCCON register. The SCS1:SCS0 bits select the clock source and determine which Run or Idle mode is to be used. Changing these bits causes an immediate switch to the new clock source, assuming that it is running. The switch may also be subject to clock transition delays. These are
®
discussed in Section 3.1.3 “Clock Transitions and Status Indicators” and subsequent sections.
Entry to the power-managed Idle or Sleep modes is triggered by the execution of a SLEEP instruction. The actual mode that results depends on the status of the IDLEN bit.
Depending on the current mode and the mode being switched to, a change to a power-managed mode does not always require setting all of these bits. Many transitions may be done by changing the oscillator select bits, or changing the IDLEN bit, prior to issuing a SLEEP instruction. If the IDLEN bit is already configured correctly, it may only be necessary to perform a SLEEP instruction to switch to the desired mode.
TABLE 3-1: POWER-MANAGED MODES
Mode
Sleep 0 N/A Off Off None – all clocks are disabled
PRI_RUN N/A 00 Clocked Clocked Primary – all oscillator modes.
SEC_RUN N/A 01 Clocked Clocked Secondary – Timer1 oscillator
RC_RUN N/A 1x Clocked Clocked Internal oscillator block
PRI_IDLE 100Off Clocked Primary – all oscillator modes
SEC_IDLE 101Off Clocked Secondary – Timer1 oscillator
RC_IDLE 11xOff Clocked Internal oscillator block
Note 1: IDLEN reflects its value when the SLEEP instruction is executed.
2: Includes INTOSC and INTOSC postscaler, as well as the INTRC source.
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 35
OSCCON Bits Module Clocking
(1)
IDLEN
SCS1:SCS0 CPU Peripherals
Available Clock and Oscillator Source
This is the normal full power execution mode.
(2)
(2)
PIC18F2455/2550/4455/4550

3.1.3 CLOCK TRANSITIONS AND STATUS INDICATORS

The length of the transition between clock sources is the sum of two cycles of the old clock source and three to four cycles of the new clock source. This formula assumes that the new clock source is stable.
Three bits indicate the current clock source and its status. They are:
• OSTS (OSCCON<3>)
• IOFS (OSCCON<2>)
• T1RUN (T1CON<6>)
In general, only one of these bits will be set while in a given power-managed mode. When the OSTS bit is set, the primary clock is providing the device clock. When the IOFS bit is set, the INTOSC output is provid­ing a stable 8 MHz clock source to a divider that actually drives the device clock. When the T1RUN bit is set, the Timer1 oscillator is providing the clock. If none of these bits are set, then either the INTRC clock source is clocking the device, or the INTOSC source is not yet stable.
If the internal oscillator block is configured as the primary clock source by the FOSC3:FOSC0 Con­figuration bits, then both the OSTS and IOFS bits may be set when in PRI_RUN or PRI_IDLE modes. This indicates that the primary clock (INTOSC output) is generating a stable 8 MHz output. Entering another RC power-managed mode at the same frequency would clear the OSTS bit.
Note 1: Caution should be used when modifying a
single IRCF bit. If V possible to select a higher clock speed than is supported by the low VDD. Improper device operation may result if the VDD/FOSC specifications are violated.
2: Executing a SLEEP instruction does not
necessarily place the device into Sleep mode. It acts as the trigger to place the controller into either the Sleep mode, or one of the Idle modes, depending on the setting of the IDLEN bit.
DD is less than 3V, it is

3.1.4 MULTIPLE SLEEP COMMANDS

The power-managed mode that is invoked with the SLEEP instruction is determined by the setting of the IDLEN bit at the time the instruction is executed. If another SLEEP instruction is executed, the device will enter the power-managed mode specified by IDLEN at that time. If IDLEN has changed, the device will enter the new power-managed mode specified by the new setting.

3.2 Run Modes

In the Run modes, clocks to both the core and peripherals are active. The difference between these modes is the clock source.

3.2.1 PRI_RUN MODE

The PRI_RUN mode is the normal, full power execution mode of the microcontroller. This is also the default mode upon a device Reset unless Two-Speed Start-up is enabled (see Section 25.3 “Two-Speed Start-up” for details). In this mode, the OSTS bit is set. The IOFS bit may be set if the internal oscillator block is the primary clock source (see Section 2.4.1 “Oscillator Control Register”).

3.2.2 SEC_RUN MODE

The SEC_RUN mode is the compatible mode to the “clock switching” feature offered in other PIC18 devices. In this mode, the CPU and peripherals are clocked from the Timer1 oscillator. This gives users the option of lower power consumption while still using a high accuracy clock source.
SEC_RUN mode is entered by setting the SCS1:SCS0 bits to ‘01’. The device clock source is switched to the Timer1 oscillator (see Figure 3-1), the primary oscillator is shut down, the T1RUN bit (T1CON<6>) is set and the OSTS bit is cleared.
Note: The Timer1 oscillator should already be
running prior to entering SEC_RUN mode. If the T1OSCEN bit is not set when the SCS1:SCS0 bits are set to ‘01’, entry to SEC_RUN mode will not occur. If the Timer1 oscillator is enabled but not yet running, device clocks will be delayed until the oscillator has started. In such situations, initial oscillator operation is far from stable and unpredictable operation may result.
On transitions from SEC_RUN mode to PRI_RUN, the peripherals and CPU continue to be clocked from the Timer1 oscillator while the primary clock is started. When the primary clock becomes ready, a clock switch back to the primary clock occurs (see Figure 3-2). When the clock switch is complete, the T1RUN bit is cleared, the OSTS bit is set and the primary clock is providing the clock. The IDLEN and SCS bits are not affected by the wake-up; the Timer1 oscillator continues to run.
DS39632C-page 36 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550
FIGURE 3-1: TRANSITION TIMING FOR ENTRY TO SEC_RUN MODE
Q4Q3Q2
Q1
Q1
Q4Q3Q2 Q1 Q3Q2
T1OSI
OSC1
CPU
Clock
Peripheral
Clock
Program
Counter
Note 1: Clock transition typically occurs within 2-4 T
123
Clock Transition
OSC.
n-1
n
(1)
PC + 2PC
PC + 4
FIGURE 3-2: TRANSITION TIMING FROM SEC_RUN MODE TO PRI_RUN MODE (HSPLL)
T1OSI
OSC1
PLL Clock
Output
CPU Clock
Peripheral
Clock
Program
Counter
Q1 Q3 Q4
(1)
TOST
PC
Q3 Q4 Q1
Q2 Q2 Q3
(1)
TPLL
12 n-1n
(2)
Clock
Transition
PC + 2
Q1
Q2
PC + 4
SCS1:SCS0 bits Changed
Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.
2: Clock transition typically occurs within 2-4 T
OSTS bit Set

3.2.3 RC_RUN MODE

In RC_RUN mode, the CPU and peripherals are clocked from the internal oscillator block using the INTOSC multiplexer; the primary clock is shut down. When using the INTRC source, this mode provides the best power conservation of all the Run modes while still executing code. It works well for user applications which are not highly timing sensitive or do not require high-speed clocks at all times.
If the primary clock source is the internal oscillator block (either INTRC or INTOSC), there are no distin­guishable differences between the PRI_RUN and RC_RUN modes during execution. However, a clock switch delay will occur during entry to and exit from RC_RUN mode. Therefore, if the primary clock source is the internal oscillator block, the use of RC_RUN mode is not recommended.
OSC.
This mode is entered by setting SCS1 to ‘1’. Although it is ignored, it is recommended that SCS0 also be cleared; this is to maintain software compatibility with future devices. When the clock source is switched to the INTOSC multiplexer (see Figure 3-3), the primary oscillator is shut down and the OSTS bit is cleared. The IRCF bits may be modified at any time to immediately change the clock speed.
Note: Caution should be used when modifying a
single IRCF bit. If V
DD is less than 3V, it is
possible to select a higher clock speed than is supported by the low V
DD.
Improper device operation may result if
DD/FOSC specifications are violated.
the V
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 37
PIC18F2455/2550/4455/4550
If the IRCF bits and the INTSRC bit are all clear, the INTOSC output is not enabled and the IOFS bit will remain clear; there will be no indication of the current clock source. The INTRC source is providing the device clocks.
If the IRCF bits are changed from all clear (thus, enabling the INTOSC output), or if INTSRC is set, the IOFS bit becomes set after the INTOSC output becomes stable. Clocks to the device continue while the INTOSC source stabilizes after an interval of
IOBST.
T
On transitions from RC_RUN mode to PRI_RUN mode, the device continues to be clocked from the INTOSC multiplexer while the primary clock is started. When the primary clock becomes ready, a clock switch to the primary clock occurs (see Figure 3-4). When the clock switch is complete, the IOFS bit is cleared, the OSTS bit is set and the primary clock is providing the device clock. The IDLEN and SCS bits are not affected by the switch. The INTRC source will continue to run if either the WDT or the Fail-Safe Clock Monitor is enabled.
If the IRCF bits were previously at a non-zero value or if INTSRC was set before setting SCS1 and the INTOSC source was already stable, the IOFS bit will remain set.
FIGURE 3-3: TRANSITION TIMING TO RC_RUN MODE
Q4Q3Q2
Q1
123 n-1n
Clock Transition
(1)
PC + 2PC
INTRC
OSC1
CPU
Clock
Peripheral
Clock
Program
Counter
Q1
Q4Q3Q2 Q1 Q3Q2
PC + 4
Note 1: Clock transition typically occurs within 2-4 T
OSC.
FIGURE 3-4: TRANSITION TIMING FROM RC_RUN MODE TO PRI_RUN MODE
Q2
Q3 Q4
Q1
Q1
INTOSC
Multiplexer
OSC1
PLL Clock
Output
CPU Clock
Peripheral
Clock
Program
Counter
SCS1:SCS0 bits Changed
Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.
2: Clock transition typically occurs within 2-4 T
TOST
(1)
PC
Q2
Q3
TPLL
OSTS bit Set
Q4
(1)
12 n-1n
(2)
Clock
Transition
PC + 2
OSC.
Q1
PC + 4
Q2
Q3
DS39632C-page 38 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550

3.3 Sleep Mode

The power-managed Sleep mode in the PIC18F2455/2550/4455/4550 devices is identical to the legacy Sleep mode offered in all other PICmicro devices. It is entered by clearing the IDLEN bit (the default state on device Reset) and executing the SLEEP instruction. This shuts down the selected oscillator (Figure 3-5). All clock source status bits are cleared.
Entering the Sleep mode from any other mode does not require a clock switch. This is because no clocks are needed once the controller has entered Sleep. If the WDT is selected, the INTRC source will continue to operate. If the Timer1 oscillator is enabled, it will also continue to run.
When a wake event occurs in Sleep mode (by interrupt, Reset or WDT time-out), the device will not be clocked until the clock source selected by the SCS1:SCS0 bits becomes ready (see Figure 3-6), or it will be clocked from the internal oscillator block if either the Two-Speed Start-up or the Fail-Safe Clock Monitor are enabled (see Section 25.0 “Special Features of the CPU”). In either case, the OSTS bit is set when the primary clock is providing the device clocks. The IDLEN and SCS bits are not affected by the wake-up.

3.4 Idle Modes

The Idle modes allow the controller’s CPU to be selectively shut down while the peripherals continue to operate. Selecting a particular Idle mode allows users to further manage power consumption.
If the IDLEN bit is set to ‘1’ when a SLEEP instruction is executed, the peripherals will be clocked from the clock source selected using the SCS1:SCS0 bits; however, the CPU will not be clocked. The clock source status bits are not affected. Setting IDLEN and executing a SLEEP instruction provides a quick method of switching from a given Run mode to its corresponding Idle mode.
If the WDT is selected, the INTRC source will continue to operate. If the Timer1 oscillator is enabled, it will also continue to run.
Since the CPU is not executing instructions, the only exits from any of the Idle modes are by interrupt, WDT time-out or a Reset. When a wake event occurs, CPU execution is delayed by an interval of T (parameter 38, Table 28-12) while it becomes ready to execute code. When the CPU begins executing code, it resumes with the same clock source for the current Idle mode. For example, when waking from RC_IDLE mode, the internal oscillator block will clock the CPU and peripherals (in other words, RC_RUN mode). The IDLEN and SCS bits are not affected by the wake-up.
While in any Idle mode or Sleep mode, a WDT time-out will result in a WDT wake-up to the Run mode currently specified by the SCS1:SCS0 bits.
CSD

FIGURE 3-5: TRANSITION TIMING FOR ENTRY TO SLEEP MODE

Q4Q3Q2
Q1Q1
OSC1
CPU
Clock
Peripheral
Clock
Sleep
Program
Counter
PC + 2PC

FIGURE 3-6: TRANSITION TIMING FOR WAKE FROM SLEEP (HSPLL)

OSC1
PLL Clock
Output
CPU Clock
Peripheral
Clock
Program
Counter
Note1: T
Q1 Q2 Q3 Q4 Q1 Q2
(1)
TOST
Wake Event
OST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.
(1)
TPLL
PC
OSTS bit Set
Q3 Q4 Q1 Q2
PC + 2
Q3 Q4
PC + 4
Q1 Q2 Q3 Q4
PC + 6
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 39
PIC18F2455/2550/4455/4550

3.4.1 PRI_IDLE MODE

This mode is unique among the three low-power Idle modes in that it does not disable the primary device clock. For timing sensitive applications, this allows for the fastest resumption of device operation, with its more accurate primary clock source, since the clock source does not have to “warm up” or transition from another oscillator.
PRI_IDLE mode is entered from PRI_RUN mode by setting the IDLEN bit and executing a SLEEP instruc­tion. If the device is in another Run mode, set IDLEN first, then clear the SCS bits and execute SLEEP. Although the CPU is disabled, the peripherals continue to be clocked from the primary clock source specified by the FOSC3:FOSC0 Configuration bits. The OSTS bit remains set (see Figure 3-7).
When a wake event occurs, the CPU is clocked from the primary clock source. A delay of interval T required between the wake event and when code execution starts. This is required to allow the CPU to become ready to execute instructions. After the wake-up, the OSTS bit remains set. The IDLEN and SCS bits are not affected by the wake-up (see Figure 3-8).
CSD is

3.4.2 SEC_IDLE MODE

In SEC_IDLE mode, the CPU is disabled but the peripherals continue to be clocked from the Timer1 oscillator. This mode is entered from SEC_RUN by set­ting the IDLEN bit and executing a SLEEP instruction. If the device is in another Run mode, set IDLEN first, then set SCS1:SCS0 to ‘01’ and execute SLEEP. When the clock source is switched to the Timer1 oscillator, the primary oscillator is shut down, the OSTS bit is cleared and the T1RUN bit is set.
When a wake event occurs, the peripherals continue to be clocked from the Timer1 oscillator. After an interval
CSD following the wake event, the CPU begins exe-
of T cuting code being clocked by the Timer1 oscillator. The IDLEN and SCS bits are not affected by the wake-up; the Timer1 oscillator continues to run (see Figure 3-8).
Note: The Timer1 oscillator should already be
running prior to entering SEC_IDLE mode. If the T1OSCEN bit is not set when the SLEEP instruction is executed, the SLEEP instruction will be ignored and entry to SEC_IDLE mode will not occur. If the Timer1 oscillator is enabled but not yet running, peripheral clocks will be delayed until the oscillator has started. In such situations, initial oscillator operation is far from stable and unpredictable operation may result.
FIGURE 3-7: TRANSITION TIMING FOR ENTRY TO IDLE MODE
Q1
OSC1
CPU Clock
Peripheral
Clock
Program
Counter
Q1
Q2
Q3
PC PC + 2
Q4
FIGURE 3-8: TRANSITION TIMING FOR WAKE FROM IDLE TO RUN MODE
OSC1
CPU Clock
Peripheral
Clock
Program
Counter
Q1 Q3 Q4
TCSD
PC
Q2
Wake Even t
DS39632C-page 40 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550

3.4.3 RC_IDLE MODE

In RC_IDLE mode, the CPU is disabled but the periph­erals continue to be clocked from the internal oscillator block using the INTOSC multiplexer. This mode allows for controllable power conservation during Idle periods.
From RC_RUN, this mode is entered by setting the IDLEN bit and executing a SLEEP instruction. If the device is in another Run mode, first set IDLEN, then set the SCS1 bit and execute SLEEP. Although its value is ignored, it is recommended that SCS0 also be cleared; this is to maintain software compatibility with future devices. The INTOSC multiplexer may be used to select a higher clock frequency by modifying the IRCF bits before executing the SLEEP instruction. When the clock source is switched to the INTOSC multiplexer, the primary oscillator is shut down and the OSTS bit is cleared.
If the IRCF bits are set to any non-zero value, or the INTSRC bit is set, the INTOSC output is enabled. The IOFS bit becomes set after the INTOSC output becomes stable, after an interval of T (parameter 39, Table 28-12). Clocks to the peripherals continue while the INTOSC source stabilizes. If the IRCF bits were previously at a non-zero value, or INTSRC was set before the SLEEP instruction was executed and the INTOSC source was already stable, the IOFS bit will remain set. If the IRCF bits and INTSRC are all clear, the INTOSC output will not be enabled, the IOFS bit will remain clear and there will be no indication of the current clock source.
When a wake event occurs, the peripherals continue to be clocked from the INTOSC multiplexer. After a delay
CSD following the wake event, the CPU begins
of T executing code being clocked by the INTOSC multi­plexer. The IDLEN and SCS bits are not affected by the wake-up. The INTRC source will continue to run if either the WDT or the Fail-Safe Clock Monitor is enabled.
IOBST

3.5 Exiting Idle and Sleep Modes

An exit from Sleep mode or any of the Idle modes is triggered by an interrupt, a Reset or a WDT time-out. This section discusses the triggers that cause exits from power-managed modes. The clocking subsystem actions are discussed in each of the power-managed modes (see Section 3.2 “Run Modes”, Section 3.3 “Sleep Mode” and Section 3.4 “Idle Modes”).

3.5.1 EXIT BY INTERRUPT

Any of the available interrupt sources can cause the device to exit from an Idle mode, or the Sleep mode, to a Run mode. To enable this functionality, an interrupt source must be enabled by setting its enable bit in one of the INTCON or PIE registers. The exit sequence is initiated when the corresponding interrupt flag bit is set.
On all exits from Idle or Sleep modes by interrupt, code execution branches to the interrupt vector if the GIE/GIEH bit (INTCON<7>) is set. Otherwise, code execution continues or resumes without branching (see Section 9.0 “Interrupts”).
A fixed delay of interval T is required when leaving Sleep and Idle modes. This delay is required for the CPU to prepare for execution. Instruction execution resumes on the first clock cycle following this delay.
CSD following the wake event

3.5.2 EXIT BY WDT TIME-OUT

A WDT time-out will cause different actions depending on which power-managed mode the device is in when the time-out occurs.
If the device is not executing code (all Idle modes and Sleep mode), the time-out will result in an exit from the power-managed mode (see Section 3.2 “Run Modes” and Section 3.3 “Sleep Mode”). If the device is executing code (all Run modes), the time-out will result in a WDT Reset (see Section 25.2 “Watchdog Timer (WDT)”).
The WDT timer and postscaler are cleared by execut­ing a SLEEP or CLRWDT instruction, the loss of a currently selected clock source (if the Fail-Safe Clock Monitor is enabled) and modifying the IRCF bits in the OSCCON register if the internal oscillator block is the device clock source.

3.5.3 EXIT BY RESET

Normally, the device is held in Reset by the Oscillator Start-up Timer (OST) until the primary clock becomes ready. At that time, the OSTS bit is set and the device begins executing code. If the internal oscillator block is the new clock source, the IOFS bit is set instead.
The exit delay time from Reset to the start of code execution depends on both the clock sources before and after the wake-up and the type of oscillator if the new clock source is the primary clock. Exit delays are summarized in Table 3-2.
Code execution can begin before the primary clock becomes ready. If either the Two-Speed Start-up (see Section 25.3 “Two-Speed Start-up”) or Fail-Safe Clock Monitor (see Section 25.4 “Fail-Safe Clock Monitor”) is enabled, the device may begin execution as soon as the Reset source has cleared. Execution is clocked by the INTOSC multiplexer driven by the internal oscillator block. Execution is clocked by the internal oscillator block until either the primary clock becomes ready or a power-managed mode is entered before the primary clock becomes ready; the primary clock is then shut down.
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 41
PIC18F2455/2550/4455/4550

3.5.4 EXIT WITHOUT AN OSCILLATOR START-UP DELAY

Certain exits from power-managed modes do not invoke the OST at all. There are two cases:
• PRI_IDLE mode, where the primary clock source
is not stopped; and
• the primary clock source is not any of the XT or
HS modes.
In these instances, the primary clock source either does not require an oscillator start-up delay, since it is already running (PRI_IDLE), or normally does not require an oscillator start-up delay (EC and any internal oscillator modes). However, a fixed delay of interval
CSD following the wake event is still required when
T leaving Sleep and Idle modes to allow the CPU to prepare for execution. Instruction execution resumes on the first clock cycle following this delay.
TABLE 3-2: EXIT DELAY ON WAKE-UP BY RESET FROM SLEEP MODE OR ANY IDLE MODE
(BY CLOCK SOURCES)
Microcontroller Clock Source
Before Wake-up After Wake-up
Primary Device Clock
(PRI_IDLE mode)
T1OSC or INTRC
INTOSC
None
(Sleep mode)
Note 1: In this instance, refers specifically to the 31 kHz INTRC clock source.
CSD (parameter 38, Table 28-12) is a required delay when waking from Sleep and all Idle modes and runs
2: T
concurrently with any other required delays (see Section 3.4 “Idle Modes”).
3: Includes both the INTOSC 8 MHz source and postscaler derived frequencies. 4: T
OST is the Oscillator Start-up Timer period (parameter 32, Table 28-12). t
(parameter F12, Table 28-9); it is also designated as T
5: Execution continues during T
(1)
(3)
Exit Delay
Clock Ready Status
Bit (OSCCON)
XT, HS
XTPLL, HSPLL
EC
INTOSC
(3)
XT, HS TOST
EC TCSD
INTOSC
(3)
XT, HS TOST
EC TCSD
INTOSC
(3)
XT, HS T
EC TCSD
INTOSC
IOBST (parameter 39, Table 28-12), the INTOSC stabilization period.
(3)
PLL.
None
(4)
(4)
rc
(2)
(5)
TIOBST
(4)
(4)
rc
(2)
None IOFS
(4)
OST
(4)
rc
(2)
(5)
TIOBST
is the PLL lock time-out
rc
OSTS
IOFS
OSTSXTPLL, HSPLL TOST + t
IOFS
OSTSXTPLL, HSPLL TOST + t
OSTSXTPLL, HSPLL TOST + t
IOFS
DS39632C-page 42 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550

4.0 RESET

A simplified block diagram of the on-chip Reset circuit is shown in Figure 4-1.
The PIC18F2455/2550/4455/4550 devices differentiate between various kinds of Reset:
a) Power-on Reset (POR) b) MCLR
Reset during normal operation c) MCLR Reset during power-managed modes d) Watchdog Timer (WDT) Reset (during
execution)
e) Programmable Brown-out Reset (BOR) f) RESET Instruction g) Stack Full Reset h) Stack Underflow Reset
This section discusses Resets generated by MCLR POR and BOR and covers the operation of the various start-up timers. Stack Reset events are covered in Section 5.1.2.4 “Stack Full and Underflow Resets”. WDT Resets are covered in Section 25.2 “Watchdog
,

4.1 RCON Register

Device Reset events are tracked through the RCON register (Register 4-1). The lower five bits of the regis­ter indicate that a specific Reset event has occurred. In most cases, these bits can only be cleared by the event and must be set by the application after the event. The state of these flag bits, taken together, can be read to indicate the type of Reset that just occurred. This is described in more detail in Section 4.6 “Reset State of Registers”.
The RCON register also has control bits for setting interrupt priority (IPEN) and software control of the BOR (SBOREN). Interrupt priority is discussed in
Section 9.0 “Interrupts”. BOR is covered in Section 4.4 “Brown-out Reset (BOR)”.
Timer (WDT)”.

FIGURE 4-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT

RESET
Instruction
Stack
Pointer
Stack Full/Underflow Reset
MCLR
VDD
OSC1
( )_IDLE
Sleep
WDT
Time-out
DD Rise
V
Detect
Brown-out
Reset
OST/PWRT
32 μs
(1)
INTRC
External Reset
MCLRE
POR Pulse
BOREN
OST
PWRT
1024 Cycles
10-Bit Ripple Counter
65.5 ms
11-Bit Ripple Counter
S
Chip_Reset
R
Q
Enable PWRT
Enable OST
(2)
Note 1: This is the INTRC source from the internal oscillator block and is separate from the RC oscillator of the CLKI pin.
2: See Table 4-2 for time-out situations.
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 43
PIC18F2455/2550/4455/4550
REGISTER 4-1: RCON: RESET CONTROL REGISTER
R/W-0 R/W-1
IPEN SBOREN
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 IPEN: Interrupt Priority Enable bit
1 = Enable priority levels on interrupts 0 = Disable priority levels on interrupts (PIC16CXXX Compatibility mode)
bit 6 SBOREN: BOR Software Enable bit
If BOREN1:BOREN0 = 01:
1 = BOR is enabled 0 = BOR is disabled
If BOREN1:BOREN0 = Bit is disabled and read as ‘0’.
bit 5 Unimplemented: Read as ‘0’
bit 4 RI
1 = The RESET instruction was not executed (set by firmware only) 0 = The RESET instruction was executed causing a device Reset (must be set in software after a
bit 3 TO
1 = Set by power-up, CLRWDT instruction or SLEEP instruction 0 = A WDT time-out occurred
bit 2 PD
1 = Set by power-up or by the CLRWDT instruction 0 = Set by execution of the SLEEP instruction
bit 1 POR
1 = A Power-on Reset has not occurred (set by firmware only) 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
bit 0 BOR
1 = A Brown-out Reset has not occurred (set by firmware only) 0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs)
(1)
: RESET Instruction Flag bit
Brown-out Reset occurs)
: Watchdog Time-out Flag bit
: Power-Down Detection Flag bit
: Power-on Reset Status bit
: Brown-out Reset Status bit
U-0 R/W-1 R-1 R-1 R/W-0
—RITO PD POR BOR
00, 10 or 11:
(2)
(1)
(2)
R/W-0
Note 1: If SBOREN is enabled, its Reset state is ‘1’; otherwise, it is ‘0’.
2: The actual Reset value of POR
register and Section 4.6 “Reset State of Registers” for additional information.
Note 1: It is recommended that the POR bit be set after a Power-on Reset has been detected so that subsequent
Power-on Resets may be detected.
2: Brown-out Reset is said to have occurred when BOR
1’ by software immediately after POR).
DS39632C-page 44 Preliminary © 2006 Microchip Technology Inc.
is determined by the type of device Reset. See the notes following this
is ‘0’ and POR is ‘1’ (assuming that POR was set to
PIC18F2455/2550/4455/4550

4.2 Master Clear Reset (MCLR)

The MCLR pin provides a method for triggering an external Reset of the device. A Reset is generated by holding the pin low. These devices have a noise filter in the MCLR
Reset path which detects and ignores small
pulses.
The MCLR
pin is not driven low by any internal Resets,
including the WDT.
In PIC18F2455/2550/4455/4550 devices, the MCLR input can be disabled with the MCLRE Configuration bit. When MCLR
is disabled, the pin becomes a digital
input. See Section 10.5 “PORTE, TRISE and LATE
Registers” for more information.

4.3 Power-on Reset (POR)

A Power-on Reset pulse is generated on-chip whenever V allows the device to start in the initialized state when VDD is adequate for operation.
To take advantage of the POR circuitry, tie the MCLR through a resistor (1 kΩ to 10 kΩ) to V eliminate external RC components usually needed to create a Power-on Reset delay. A minimum rise rate for
DD is specified (parameter D004, Section 28.1 “DC
V Characteristics”). For a slow rise time, see Figure 4-2.
When the device starts normal operation (i.e., exits the Reset condition), device operating parameters (volt­age, frequency, temperature, etc.) must be met to ensure operation. If these conditions are not met, the device must be held in Reset until the operating conditions are met.
POR events are captured by the POR The state of the bit is set to ‘0’ whenever a POR occurs; it does not change for any other Reset event. POR is not reset to ‘1’ by any hardware event. To capture multiple events, the user manually resets the bit to ‘1’ in software following any POR.
DD rises above a certain threshold. This
pin
DD. This will
bit (RCON<1>).
FIGURE 4-2: EXTERNAL POWER-ON
RESET CIRCUIT (FOR SLOW V
DD
VDD
Note 1: External Power-on Reset circuit is required
V
D
R
C
only if the V The diode D helps discharge the capacitor quickly when V
2: R < 40 kΩ is recommended to make sure that
the voltage drop across R does not violate the device’s electrical specification.
3: R1 1 kΩ will limit any current flowing into
MCLR of MCLR static Discharge (ESD) or Electrical Overstress (EOS).
DD power-up slope is too slow.
from external capacitor C, in the event
/VPP pin breakdown, due to Electro-
DD POW ER- U P)
R1
MCLR
PIC18FXXXX
DD powers down.
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 45
PIC18F2455/2550/4455/4550

4.4 Brown-out Reset (BOR)

PIC18F2455/2550/4455/4550 devices implement a BOR circuit that provides the user with a number of configuration and power-saving options. The BOR is controlled by the BORV1:BORV0 and BOREN1:BOREN0 Configuration bits. There are a total of four BOR configurations which are summarized in Table 4-1.
The BOR threshold is set by the BORV1:BORV0 bits. If BOR is enabled (any values of BOREN1:BOREN0 except ‘00’), any drop of V D005, Section 28.1 “DC Characteristics”) for greater than TBOR (parameter 35, Table 28-12) will reset the device. A Reset may or may not occur if V falls below VBOR for less than TBOR. The chip will remain in Brown-out Reset until V
If the Power-up Timer is enabled, it will be invoked after
DD rises above VBOR; it then will keep the chip in
V Reset for an additional time delay, T (parameter 33, Table 28-12). If VDD drops below VBOR while the Power-up Timer is running, the chip will go back into a Brown-out Reset and the Power-up Timer will be initialized. Once VDD rises above VBOR, the Power-up Timer will execute the additional time delay.
BOR and the Power-on Timer (PWRT) are independently configured. Enabling BOR Reset does not automatically enable the PWRT.

4.4.1 SOFTWARE ENABLED BOR

When BOREN1:BOREN0 = 01, the BOR can be enabled or disabled by the user in software. This is done with the control bit, SBOREN (RCON<6>). Setting SBOREN enables the BOR to function as previously described. Clearing SBOREN disables the BOR entirely. The SBOREN bit operates only in this mode; otherwise, it is read as ‘0’.
DD below VBOR (parameter
DD
DD rises above VBOR.
PWRT
Placing the BOR under software control gives the user the additional flexibility of tailoring the application to its environment without having to reprogram the device to change BOR configuration. It also allows the user to tailor device power consumption in software by elimi­nating the incremental current that the BOR consumes. While the BOR current is typically very small, it may have some impact in low-power applications.
Note: Even when BOR is under software control,
the BOR Reset voltage level is still set by the BORV1:BORV0 Configuration bits. It cannot be changed in software.

4.4.2 DETECTING BOR

When BOR is enabled, the BOR bit always resets to ‘0’ on any BOR or POR event. This makes it difficult to determine if a BOR event has occurred just by reading the state of BOR simultaneously check the state of both POR This assumes that the POR immediately after any POR event. IF BOR POR
is ‘1’, it can be reliably assumed that a BOR event
has occurred.
alone. A more reliable method is to
and BOR.
bit is reset to ‘1’ in software
is ‘0’ while

4.4.3 DISABLING BOR IN SLEEP MODE

When BOREN1:BOREN0 = 10, the BOR remains under hardware control and operates as previously described. Whenever the device enters Sleep mode, however, the BOR is automatically disabled. When the device returns to any other operating mode, BOR is automatically re-enabled.
This mode allows for applications to recover from brown-out situations, while actively executing code, when the device requires BOR protection the most. At the same time, it saves additional power in Sleep mode by eliminating the small incremental BOR current.
TABLE 4-1: BOR CONFIGURATIONS
BOR Configuration Status of
BOREN1 BOREN0
00Unavailable BOR disabled; must be enabled by reprogramming the Configuration bits.
01Available BOR enabled in software; operation controlled by SBOREN.
10Unavailable BOR enabled in hardware in Run and Idle modes, disabled during Sleep
11Unavailable BOR enabled in hardware; must be disabled by reprogramming the
DS39632C-page 46 Preliminary © 2006 Microchip Technology Inc.
SBOREN
(RCON<6>)
mode.
Configuration bits.
BOR Operation
PIC18F2455/2550/4455/4550

4.5 Device Reset Timers

PIC18F2455/2550/4455/4550 devices incorporate three separate on-chip timers that help regulate the Power-on Reset process. Their main function is to ensure that the device clock is stable before code is executed. These timers are:
• Power-up Timer (PWRT)
• Oscillator Start-up Timer (OST)
• PLL Lock Time-out

4.5.1 POWER-UP TIMER (PWRT)

The Power-up Timer (PWRT) of the PIC18F2455/2550/ 4455/4550 devices is an 11-bit counter which uses the INTRC source as the clock input. This yields an approximate time interval of 2048 x 32 μs=65.6ms. While the PWRT is counting, the device is held in Reset.
The power-up time delay depends on the INTRC clock and will vary from chip to chip due to temperature and process variation. See DC parameter 33 (Table 28-12) for details.
The PWRT is enabled by clearing the PWRTEN Configuration bit.
4.5.2 OSCILLATOR START-UP
TIMER (OST)
The Oscillator Start-up Timer (OST) provides a 1024 oscillator cycle (from OSC1 input) delay after the PWRT delay is over (parameter 33, Table 28-12). This ensures that the crystal oscillator or resonator has started and stabilized.
The OST time-out is invoked only for XT, HS and HSPLL modes and only on Power-on Reset or on exit from most power-managed modes.

4.5.3 PLL LOCK TIME-OUT

With the PLL enabled in its PLL mode, the time-out sequence following a Power-on Reset is slightly differ­ent from other oscillator modes. A separate timer is used to provide a fixed time-out that is sufficient for the PLL to lock to the main oscillator frequency. This PLL lock time-out (T
PLL) is typically 2 ms and follows the
oscillator start-up time-out.

4.5.4 TIME-OUT SEQUENCE

On power-up, the time-out sequence is as follows:
1. After the POR condition has cleared, PWRT time-out is invoked (if enabled).
2. Then, the OST is activated.
The total time-out will vary based on oscillator configu­ration and the status of the PWRT. Figure 4-3, Figure 4-4, Figure 4-5, Figure 4-6 and Figure 4-7 all depict time-out sequences on power-up, with the Power-up Timer enabled and the device operating in HS Oscillator mode. Figures 4-3 through 4-6 also apply to devices operating in XT mode. For devices in RC mode and with the PWRT disabled, on the other hand, there will be no time-out at all.
Since the time-outs occur from the POR pulse, if MCLR is kept low long enough, all time-outs will expire. Bring­ing MCLR (Figure 4-5). This is useful for testing purposes or to synchronize more than one PIC18FXXXX device operating in parallel.
high will begin execution immediately
TABLE 4-2: TIME-OUT IN VARIOUS SITUATIONS
(2)
(2)
and Brown-out
(2)
1024 TOSC + 2 ms
Exit from
Power-Managed Mode
(2)
1024 TOSC + 2 ms
(2)
——
2 ms
(2)
2 ms
(2)
——
Oscillator
Configuration
PWRTEN = 0 PWRTEN = 1
HS, XT 66 ms
HSPLL, XTPLL 66 ms
(1)
+ 1024 TOSC + 2 ms
EC, ECIO 66 ms
ECPLL, ECPIO 66 ms
INTIO, INTCKO 66 ms
INTHS, INTXT 66 ms
Power-up
(1)
+ 1024 TOSC 1024 TOSC 1024 TOSC
(1)
(1)
+ 2 ms
(1)
(1)
+ 1024 TOSC 1024 TOSC 1024 TOSC
Note 1: 66 ms (65.5 ms) is the nominal Power-up Timer (PWRT) delay.
2: 2 ms is the nominal time required for the PLL to lock.
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 47
PIC18F2455/2550/4455/4550
FIGURE 4-3: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD, VDD RISE < TPWRT)
VDD
MCLR
INTERNAL POR
TPWRT
PWRT TIME-OUT
OST TIME-OUT
INTERNAL RESET
TOST
FIGURE 4-4: TIME-OUT SEQUENCE ON POWER-UP (MCLR
VDD
MCLR
INTERNAL POR
PWRT TIME-OUT
OST TIME-OUT
INTERNAL RESET
TPWRT
NOT TIED TO VDD): CASE 1
TOST
FIGURE 4-5: TIME-OUT SEQUENCE ON POWER-UP (MCLR
VDD
MCLR
INTERNAL POR
TPWRT
PWRT TIME-OUT
OST TIME-OUT
INTERNAL RESET
DS39632C-page 48 Preliminary © 2006 Microchip Technology Inc.
NOT TIED TO VDD): CASE 2
TOST
PIC18F2455/2550/4455/4550
FIGURE 4-6: SLOW RISE TIME (MCLR TIED TO VDD, VDD RISE > TPWRT)
5V
VDD
MCLR
INTERNAL POR
0V
PWRT
T
1V
PWRT TIME-OUT
OST TIME-OUT
INTERNAL RESET
TOST
FIGURE 4-7: TIME-OUT SEQUENCE ON POR w/PLL ENABLED (MCLR
VDD
MCLR
INTERNAL POR
TPWRT
PWRT TIME-OUT
OST TIME-OUT
PLL TIME-OUT
TOST
TPLL
TIED TO VDD)
INTERNAL RESET
Note: TOST = 1024 clock cycles.
T
PLL 2 ms max. First three stages of the Power-up Timer.
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 49
PIC18F2455/2550/4455/4550

4.6 Reset State of Registers

Most registers are unaffected by a Reset. Their status is unknown on POR and unchanged by all other
Table 4-4 describes the Reset states for all of the Special Function Registers. These are categorized by Power-on and Brown-out Resets, Master Clear and WDT Resets and WDT wake-ups.
Resets. The other registers are forced to a “Reset state” depending on the type of Reset that occurred.
Most registers are not affected by a WDT wake-up, since this is viewed as the resumption of normal oper­ation. Status bits from the RCON register, RI POR
and BOR, are set or cleared differently in different
, TO, PD,
Reset situations as indicated in Table 4-3. These bits are used in software to determine the nature of the Reset.
TABLE 4-3: STATUS BITS, THEIR SIGNIFICANCE AND THE INITIALIZATION CONDITION
FOR RCON REGISTER
Condition
Program
Counter
SBOREN RI
Power-on Reset 0000h 1 11100 0 0
RESET Instruction 0000h u
Brown-out 0000h u
during Power-Managed
MCLR
0000h u
(2)
(2)
(2)
Run modes
MCLR
during Power-Managed
0000h u
(2)
Idle modes and Sleep mode
WDT Time-out during Full Power
0000h u
(2)
or Power-Managed Run modes
MCLR
during Full Power
0000h u
(2)
Execution
Stack Full Reset (STVREN = 1) 0000h u
Stack Underflow Reset
0000h u
(2)
(2)
(STVREN = 1)
Stack Underflow Error (not an
0000h u
(2)
actual Reset, STVREN = 0)
WDT Time-out during
PC + 2 u
(2)
Power-Managed Idle or Sleep modes
Interrupt Exit from
PC + 2
(1)
(2)
u
Power-Managed modes
Legend: u = unchanged Note 1: When the wake-up is due to an interrupt and the GIEH or GIEL bits are set, the PC is loaded with the
interrupt vector (008h or 0018h).
2: Reset state is ‘1’ for POR and unchanged for all other Resets when software BOR is enabled
(BOREN1:BOREN0 Configuration bits = 01 and SBOREN = 1); otherwise, the Reset state is ‘0’.
RCON Register STKPTR Register
TO PD POR BOR STKFUL STKUNF
0uuuu u u
111u0 u u
u1uuu u u
u10uu u u
u0uuu u u
uuuuu u u
uuuuu 1 u
uuuuu u 1
uuuuu u 1
u00uu u u
uu0uu u u
DS39632C-page 50 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550
TABLE 4-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS
MCLR
Resets,
Register Applicable Devices
Power-on Reset, Brown-out Reset
TOSU 2455 2550 4455 4550 ---0 0000 ---0 0000 ---0 uuuu
TOSH 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
TOSL 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
STKPTR 2455 2550 4455 4550 00-0 0000 uu-0 0000 uu-u uuuu
PCLATU 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
PCLATH 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
PCL 2455 2550 4455 4550 0000 0000 0000 0000 PC + 2
TBLPTRU 2455 2550 4455 4550 --00 0000 --00 0000 --uu uuuu
TBLPTRH 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
TBLPTRL 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
TABLAT 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
PRODH 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
PRODL 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
INTCON 2455 2550 4455 4550 0000 000x 0000 000u uuuu uuuu
INTCON2 2455 2550 4455 4550 1111 -1-1 1111 -1-1 uuuu -u-u
INTCON3 2455 2550 4455 4550 11-0 0-00 11-0 0-00 uu-u u-uu
INDF0 2455 2550 4455 4550 N/A N/A N/A
POSTINC0 2455 2550 4455 4550 N/A N/A N/A
POSTDEC0 2455 2550 4455 4550 N/A N/A N/A
PREINC0 2455 2550 4455 4550 N/A N/A N/A
PLUSW0 2455 2550 4455 4550 N/A N/A N/A
FSR0H 2455 2550 4455 4550 ---- 0000 ---- 0000 ---- uuuu
FSR0L 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
WREG 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
INDF1 2455 2550 4455 4550 N/A N/A N/A
POSTINC1 2455 2550 4455 4550 N/A N/A N/A
POSTDEC1 2455 2550 4455 4550 N/A N/A N/A
PREINC1 2455 2550 4455 4550 N/A N/A N/A
PLUSW1 2455 2550 4455 4550 N/A N/A N/A
FSR1H 2455 2550 4455 4550 ---- 0000 ---- 0000 ---- uuuu
FSR1L 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
BSR 2455 2550 4455 4550 ---- 0000 ---- 0000 ---- uuuu
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.
Shaded cells indicate conditions do not apply for the designated device.
Note 1: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are
updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack.
2: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt
vector (0008h or 0018h).
4: See Table 4-3 for Reset value for specific condition. 5: PORTA<6>, LATA<6> and TRISA<6> are enabled depending on the oscillator mode selected. When not
enabled as PORTA pins, they are disabled and read ‘0’.
WDT Reset,
RESET Instruction,
Stack Resets
Wake-up via WDT
or Interrupt
(1)
(1)
(1)
(1)
(3)
(2)
(2)
(2)
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 51
PIC18F2455/2550/4455/4550
TABLE 4-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)
Resets,
MCLR
Register Applicable Devices
INDF2 2455 2550 4455 4550 N/A N/A N/A
POSTINC2 2455 2550 4455 4550 N/A N/A N/A
POSTDEC2 2455 2550 4455 4550 N/A N/A N/A
PREINC2 2455 2550 4455 4550 N/A N/A N/A
PLUSW2 2455 2550 4455 4550 N/A N/A N/A
FSR2H 2455 2550 4455 4550 ---- 0000 ---- 0000 ---- uuuu
FSR2L 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
STATUS 2455 2550 4455 4550 ---x xxxx ---u uuuu ---u uuuu
TMR0H 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
TMR0L 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
T0CON 2455 2550 4455 4550 1111 1111 1111 1111 uuuu uuuu
OSCCON 2455 2550 4455 4550 0100 q000 0100 00q0 uuuu uuqu
HLVDCON 2455 2550 4455 4550 0-00 0101 0-00 0101 u-uu uuuu
WDTCON 2455 2550 4455 4550 ---- ---0 ---- ---0 ---- ---u
(4)
RCON
TMR1H 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
TMR1L 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
T1CON 2455 2550 4455 4550 0000 0000 u0uu uuuu uuuu uuuu
TMR2 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
PR2 2455 2550 4455 4550 1111 1111 1111 1111 1111 1111
T2CON 2455 2550 4455 4550 -000 0000 -000 0000 -uuu uuuu
SSPBUF 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
SSPADD 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
SSPSTAT 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
SSPCON1 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
SSPCON2 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
ADRESH 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
ADRESL 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
ADCON0 2455 2550 4455 4550 --00 0000 --00 0000 --uu uuuu
ADCON1 2455 2550 4455 4550 --00 0qqq --00 0qqq --uu uuuu
ADCON2 2455 2550 4455 4550 0-00 0000 0-00 0000 u-uu uuuu
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.
Note 1: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are
2: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt
4: See Table 4-3 for Reset value for specific condition. 5: PORTA<6>, LATA<6> and TRISA<6> are enabled depending on the oscillator mode selected. When not
2455 2550 4455 4550 0q-1 11q0 0q-q qquu uq-u qquu
Shaded cells indicate conditions do not apply for the designated device.
updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack.
vector (0008h or 0018h).
enabled as PORTA pins, they are disabled and read ‘0’.
Power-on Reset,
Brown-out Reset
WDT Reset,
RESET Instruction,
Stack Resets
Wake-up via WDT
or Interrupt
DS39632C-page 52 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550
TABLE 4-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)
Resets,
MCLR
Register Applicable Devices
CCPR1H 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
CCPR1L 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
CCP1CON 2455 2550
2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
CCPR2H 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
CCPR2L 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
CCP2CON 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
BAUDCON 2455 2550 4455 4550 0100 0-00 0100 0-00 uuuu u-uu
ECCP1DEL 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
ECCP1AS 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
CVRCON 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
CMCON 2455 2550 4455 4550 0000 0111 0000 0111 uuuu uuuu
TMR3H 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
TMR3L 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
T3CON 2455 2550 4455 4550 0000 0000 uuuu uuuu uuuu uuuu
SPBRGH 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
SPBRG 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
RCREG 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
TXREG 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
TXSTA 2455 2550 4455 4550 0000 0010 0000 0010 uuuu uuuu
RCSTA 2455 2550 4455 4550 0000 000x 0000 000x uuuu uuuu
EEADR 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
EEDATA 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
EECON2 2455 2550 4455 4550 0000 0000 0000 0000 0000 0000
EECON1 2455 2550 4455 4550 xx-0 x000 uu-0 u000 uu-0 u000
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.
Shaded cells indicate conditions do not apply for the designated device.
Note 1: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are
updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack.
2: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt
vector (0008h or 0018h).
4: See Table 4-3 for Reset value for specific condition. 5: PORTA<6>, LATA<6> and TRISA<6> are enabled depending on the oscillator mode selected. When not
enabled as PORTA pins, they are disabled and read ‘0’.
4455 4550 --00 0000 --00 0000 --uu uuuu
Power-on Reset, Brown-out Reset
WDT Reset,
RESET Instruction,
Stack Resets
Wake-up via WDT
or Interrupt
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 53
PIC18F2455/2550/4455/4550
TABLE 4-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)
Resets,
MCLR
Register Applicable Devices
Power-on Reset,
Brown-out Reset
IPR2 2455 2550 4455 4550 1111 1111 1111 1111 uuuu uuuu
PIR2 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
PIE2 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
IPR1 2455 2550 4455 4550 1111 1111 1111 1111 uuuu uuuu
2455 2550 4455 4550 -111 1111 -111 1111 -uuu uuuu
PIR1
2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
2455 2550 4455 4550 -000 0000 -000 0000 -uuu uuuu
PIE1 2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
2455 2550
4455 4550 -000 0000 -000 0000 -uuu uuuu
OSCTUNE 2455 2550 4455 4550 0--0 0000 0--0 0000 u--u uuuu
TRISE 2455 2550 4455 4550 ---- -111 ---- -111 ---- -uuu
TRISD
2455 2550 4455 4550 1111 1111 1111 1111 uuuu uuuu
TRISC 2455 2550 4455 4550 11-- -111 11-- -111 uu-- -uuu
TRISB 2455 2550 4455 4550 1111 1111 1111 1111 uuuu uuuu
TRISA
(5)
2455 2550 4455 4550 -111 1111
(5)
LATE 2455 2550 4455 4550 ---- -xxx ---- -uuu ---- -uuu
LATD 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
LATC 2455 2550 4455 4550 xx-- -xxx uu-- -uuu uu-- -uuu
LATB 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
LATA
(5)
2455 2550 4455 4550 -xxx xxxx
(5)
PORTE 2455 2550 4455 4550 0--- x000 0--- x000 u--- uuuu
PORTD 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
PORTC 2455 2550 4455 4550 xxxx -xxx uuuu -uuu uuuu -uuu
PORTB 2455 2550 4455 4550 xxxx xxxx uuuu uuuu uuuu uuuu
PORTA
(5)
2455 2550 4455 4550 -x0x 0000
(5)
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.
Shaded cells indicate conditions do not apply for the designated device.
Note 1: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are
updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack.
2: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt
vector (0008h or 0018h).
4: See Table 4-3 for Reset value for specific condition. 5: PORTA<6>, LATA<6> and TRISA<6> are enabled depending on the oscillator mode selected. When not
enabled as PORTA pins, they are disabled and read ‘0’.
WDT Reset,
RESET Instruction,
Stack Resets
-111 1111
-uuu uuuu
-u0u 0000
(5)
(5)
(5)
Wake-up via WDT
or Interrupt
(2)
(2)
-uuu uuuu
-uuu uuuu
-uuu uuuu
(5)
(5)
(5)
DS39632C-page 54 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550
TABLE 4-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)
Resets,
MCLR
Register Applicable Devices
UEP15 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP14 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP13 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP12 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP11 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP10 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP9 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP8 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP7 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP6 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP5 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP4 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP3 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP2 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP1 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UEP0 2455 2550 4455 4550 ---0 0000 ---0 0000 ---u uuuu
UCFG 2455 2550 4455 4550 00-0 0000 00-0 0000 uu-u uuuu
UADDR 2455 2550 4455 4550 -000 0000 -000 0000 -uuu uuuu
UCON 2455 2550 4455 4550 -0x0 000- -0x0 000- -uuu uuu-
USTAT 2455 2550 4455 4550 -xxx xxx- -xxx xxx- -uuu uuu-
UEIE 2455 2550 4455 4550 0--0 0000 0--0 0000 u--u uuuu
UEIR 2455 2550 4455 4550 0--0 0000 0--0 0000 u--u uuuu
UIE 2455 2550 4455 4550 -000 0000 -000 0000 -uuu uuuu
UIR 2455 2550 4455 4550 -000 0000 -000 0000 -uuu uuuu
UFRMH 2455 2550 4455 4550 ---- -xxx ---- -xxx ---- -uuu
UFRML 2455 2550 4455 4550 xxxx xxxx xxxx xxxx uuuu uuuu
SPPCON
SPPEPS 2455 2550 4455 4550 00-0 0000 00-0 0000 uu-u uuuu
SPPCFG
SPPDATA
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.
Note 1: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are
2: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt
4: See Table 4-3 for Reset value for specific condition. 5: PORTA<6>, LATA<6> and TRISA<6> are enabled depending on the oscillator mode selected. When not
2455 2550 4455 4550 ---- --00 ---- --00 ---- --uu
2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
2455 2550 4455 4550 0000 0000 0000 0000 uuuu uuuu
Shaded cells indicate conditions do not apply for the designated device.
updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack.
vector (0008h or 0018h).
enabled as PORTA pins, they are disabled and read ‘0’.
Power-on Reset, Brown-out Reset
WDT Reset,
RESET Instruction,
Stack Resets
Wake-up via WDT
or Interrupt
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 55
PIC18F2455/2550/4455/4550
NOTES:
DS39632C-page 56 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550

5.0 MEMORY ORGANIZATION

There are three types of memory in PIC18 enhanced microcontroller devices:
• Program Memory
• Data RAM
• Data EEPROM
As Harvard architecture devices, the data and program memories use separate busses; this allows for con­current access of the two memory spaces. The data EEPROM, for practical purposes, can be regarded as a peripheral device, since it is addressed and accessed through a set of control registers.
Additional detailed information on the operation of the Flash program memory is provided in Section 6.0 “Flash Program Memory”. Data EEPROM is discussed separately in Section 7.0 “Data EEPROM
Memory”.

5.1 Program Memory Organization

PIC18 microcontrollers implement a 21-bit program counter which is capable of addressing a 2-Mbyte program memory space. Accessing a location between the upper boundary of the physically implemented memory and the 2-Mbyte address will return all ‘0’s (a NOP instruction).
The PIC18F2455 and PIC18F4455 each have 24 Kbytes of Flash memory and can store up to 12,288 single-word instructions. The PIC18F2550 and PIC18F4550 each have 32 Kbytes of Flash memory and can store up to 16,384 single-word instructions.
PIC18 devices have two interrupt vectors. The Reset vector address is at 0000h and the interrupt vector addresses are at 0008h and 0018h.
The program memory maps for PIC18FX455 and PIC18FX550 devices are shown in Figure 5-1.

FIGURE 5-1: PROGRAM MEMORY MAP AND STACK FOR PIC18F2455/2550/4455/4550 DEVICES

PIC18FX455
PC<20:0>
CALL, RCALL, RETURN, RETFIE, RETLW, CALLW, ADDULNK, SUBULNK
Stack Level 1
Stack Level 31
Reset Vector
High Priority Interrupt Vector
Low Priority Interrupt Vector
21
0000h
0008h
0018h
CALL, RCALL, RETURN, RETFIE, RETLW, CALLW, ADDULNK, SUBULNK
PIC18FX550
PC<20:0>
21
Stack Level 1
Stack Level 31
Reset Vector
High Priority Interrupt Vector 0008h
Low Priority Interrupt Vector
0000h
0018h
On-Chip
Program Memory
5FFFh 6000h
Read ‘0’
1FFFFFh 200000h
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 57
User Memory Space
On-Chip
Program Memory
Read ‘0’
7FFFh
8000h
User Memory Space
1FFFFFh 200000h
PIC18F2455/2550/4455/4550

5.1.1 PROGRAM COUNTER

The Program Counter (PC) specifies the address of the instruction to fetch for execution. The PC is 21 bits wide and is contained in three separate 8-bit registers. The low byte, known as the PCL register, is both readable and writable. The high byte, or PCH register, contains the PC<15:8> bits; it is not directly readable or writable. Updates to the PCH register are performed through the PCLATH register. The upper byte is called PCU. This register contains the PC<20:16> bits; it is also not directly readable or writable. Updates to the PCU register are performed through the PCLATU register.
The contents of PCLATH and PCLATU are transferred to the program counter by any operation that writes PCL. Similarly, the upper two bytes of the program counter are transferred to PCLATH and PCLATU by an operation that reads PCL. This is useful for computed offsets to the PC (see Section 5.1.4.1 “Computed GOTO”).
The PC addresses bytes in the program memory. To prevent the PC from becoming misaligned with word instructions, the Least Significant bit of PCL is fixed to a value of ‘0’. The PC increments by 2 to address sequential instructions in the program memory.
The CALL, RCALL and GOTO program branch instructions write to the program counter directly. For these instructions, the contents of PCLATH and PCLATU are not transferred to the program counter.

5.1.2 RETURN ADDRESS STACK

The return address stack allows any combination of up to 31 program calls and interrupts to occur. The PC is pushed onto the stack when a CALL or RCALL instruc­tion is executed or an interrupt is Acknowledged. The PC value is pulled off the stack on a RETURN, RETLW or a RETFIE instruction. PCLATU and PCLATH are not affected by any of the RETURN or CALL instructions.
The stack operates as a 31-word by 21-bit RAM and a 5-bit Stack Pointer, STKPTR. The stack space is not part of either program or data space. The Stack Pointer is readable and writable and the address on the top of the stack is readable and writable through the Top-of-Stack Special Function Registers. Data can also be pushed to, or popped from the stack, using these registers.
A CALL type instruction causes a push onto the stack. The Stack Pointer is first incremented and the location pointed to by the Stack Pointer is written with the contents of the PC (already pointing to the instruction following the CALL). A RETURN type instruction causes a pop from the stack. The contents of the location pointed to by the STKPTR are transferred to the PC and then the Stack Pointer is decremented.
The Stack Pointer is initialized to ‘00000’ after all Resets. There is no RAM associated with the location corresponding to a Stack Pointer value of ‘00000’; this is only a Reset value. Status bits indicate if the stack is full, has overflowed or has underflowed.
5.1.2.1 Top-of-Stack Access
Only the top of the return address stack (TOS) is
readable and writable. A set of three registers,
TOSU:TOSH:TOSL, hold the contents of the stack loca­tion pointed to by the STKPTR register (Figure 5-2). This allows users to implement a software stack if necessary. After a CALL, RCALL or interrupt, the software can read the pushed value by reading the TOSU:TOSH:TOSL registers. These values can be placed on a user-defined software stack. At return time, the software can return these values to TOSU:TOSH:TOSL and do a return.
The user must disable the global interrupt enable bits while accessing the stack to prevent inadvertent stack corruption.
FIGURE 5-2: RETURN ADDRESS STACK AND ASSOCIATED REGISTERS
Return Address Stack<20:0>
11111
Top-of-Stack Registers Stack Pointer
TOSLTOSHTOSU
34h1Ah00h
To p- o f -S ta ck
DS39632C-page 58 Preliminary © 2006 Microchip Technology Inc.
001A34h 000D58h
11110 11101
STKPTR<4:0>
00010
00011 00010 00001 00000
PIC18F2455/2550/4455/4550
5.1.2.2 Return Stack Pointer (STKPTR)
The STKPTR register (Register 5-1) contains the Stack Pointer value, the STKFUL (Stack Full) status bit and the STKUNF (Stack Underflow) status bit. The value of the Stack Pointer can be 0 through 31. The Stack Pointer increments before values are pushed onto the stack and decrements after values are popped off the stack. On Reset, the Stack Pointer value will be zero. The user may read and write the Stack Pointer value. This feature can be used by a Real-Time Operating System (RTOS) for return stack maintenance.
After the PC is pushed onto the stack 31 times (without popping any values off the stack), the STKFUL bit is set. The STKFUL bit is cleared by software or by a POR.
The action that takes place when the stack becomes full depends on the state of the STVREN (Stack Overflow Reset Enable) Configuration bit. (Refer to Section 25.1 “Configuration Bits” for a description of the device Configuration bits.) If STVREN is set (default), the 31st push will push the (PC + 2) value onto the stack, set the STKFUL bit and reset the device. The STKFUL bit will remain set and the Stack Pointer will be set to zero.
If STVREN is cleared, the STKFUL bit will be set on the 31st push and the Stack Pointer will increment to 31. Any additional pushes will not overwrite the 31st push and the STKPTR will remain at 31.
When the stack has been popped enough times to unload the stack, the next pop will return a value of zero to the PC and sets the STKUNF bit, while the Stack Pointer remains at zero. The STKUNF bit will remain set until cleared by software or until a POR occurs.
Note: Returning a value of zero to the PC on an
underflow has the effect of vectoring the program to the Reset vector, where the stack conditions can be verified and appropriate actions can be taken. This is not the same as a Reset, as the contents of the SFRs are not affected.
5.1.2.3 PUSH and POP Instructions
Since the Top-of-Stack is readable and writable, the ability to push values onto the stack and pull values off the stack, without disturbing normal program execu­tion, is a desirable feature. The PIC18 instruction set includes two instructions, PUSH and POP, that permit the TOS to be manipulated under software control. TOSU, TOSH and TOSL can be modified to place data or a return address on the stack.
The PUSH instruction places the current PC value onto the stack. This increments the Stack Pointer and loads the current PC value onto the stack.
The POP instruction discards the current TOS by decre­menting the Stack Pointer. The previous value pushed onto the stack then becomes the TOS value.
REGISTER 5-1: STKPTR: STACK POINTER REGISTER
R/C-0 R/C-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
STKFUL
bit 7 bit 0
Legend: C = Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 STKFUL: Stack Full Flag bit
bit 6 STKUNF: Stack Underflow Flag bit
bit 5 Unimplemented: Read as ‘0’
bit 4-0 SP4:SP0: Stack Pointer Location bits
Note 1: Bit 7 and bit 6 are cleared by user software or by a POR.
(1)
STKUNF
1 = Stack became full or overflowed 0 = Stack has not become full or overflowed
1 = Stack underflow occurred 0 = Stack underflow did not occur
(1)
SP4 SP3 SP2 SP1 SP0
(1)
(1)
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 59
PIC18F2455/2550/4455/4550
5.1.2.4 Stack Full and Underflow Resets
Device Resets on stack overflow and stack underflow conditions are enabled by setting the STVREN bit in Configuration Register 4L. When STVREN is set, a full or underflow condition will set the appropriate STKFUL or STKUNF bit and then cause a device Reset. When STVREN is cleared, a full or underflow condition will set the appropriate STKFUL or STKUNF bit but not cause a device Reset. The STKFUL or STKUNF bits are cleared by user software or a Power-on Reset.

5.1.3 FAST REGISTER STACK

A Fast Register Stack is provided for the STATUS, WREG and BSR registers to provide a “fast return” option for interrupts. Each stack is only one level deep and is neither readable nor writable. It is loaded with the current value of the corresponding register when the processor vectors for an interrupt. All interrupt sources will push values into the stack registers. The values in the registers are then loaded back into their associated registers if the RETFIE, FAST instruction is used to return from the interrupt.
If both low and high priority interrupts are enabled, the stack registers cannot be used reliably to return from low priority interrupts. If a high priority interrupt occurs while servicing a low priority interrupt, the stack register values stored by the low priority interrupt will be overwritten. In these cases, users must save the key registers in software during a low priority interrupt.
If interrupt priority is not used, all interrupts may use the Fast Register Stack for returns from interrupt. If no interrupts are used, the Fast Register Stack can be used to restore the STATUS, WREG and BSR registers at the end of a subroutine call. To use the Fast Register Stack for a subroutine call, a CALL label, FAST instruction must be executed to save the STATUS, WREG and BSR registers to the Fast Register Stack. A RETURN, FAST instruction is then executed to restore these registers from the Fast Register Stack.
Example 5-1 shows a source code example that uses the Fast Register Stack during a subroutine call and return.
EXAMPLE 5-1: FAST REGISTER STACK
CODE EXAMPLE
CALL SUB1, FAST ;STATUS, WREG, BSR
;SAVED IN FAST REGISTER ;STACK
SUB1
RETURN, FAST ;RESTORE VALUES SAVED
;IN FAST REGISTER STACK

5.1.4 LOOK-UP TABLES IN PROGRAM MEMORY

There may be programming situations that require the creation of data structures, or look-up tables, in program memory. For PIC18 devices, look-up tables can be implemented in two ways:
• Computed GOTO
• Table Reads
5.1.4.1 Computed GOTO
A computed GOTO is accomplished by adding an offset to the program counter. An example is shown in Example 5-2.
A look-up table can be formed with an ADDWF PCL instruction and a group of RETLW nn instructions. The W register is loaded with an offset into the table before executing a call to that table. The first instruction of the called routine is the ADDWF PCL instruction. The next instruction executed will be one of the RETLW nn instructions that returns the value ‘nn’ to the calling function.
The offset value (in WREG) specifies the number of bytes that the program counter should advance and should be multiples of 2 (LSb = 0).
In this method, only one data byte may be stored in each instruction location and room on the return address stack is required.
EXAMPLE 5-2: COMPUTED GOTO USING
AN OFFSET VALUE
MOVF OFFSET, W
CALL TABLE ORG nn00h TABLE ADDWF PCL
RETLW nnh
RETLW nnh
RETLW nnh
.
.
.
5.1.4.2 Table Reads and Table Writes
A better method of storing data in program memory allows two bytes of data to be stored in each instruction location.
Look-up table data may be stored two bytes per program word by using table reads and writes. The Table Pointer (TBLPTR) register specifies the byte address and the Table Latch (TABLAT) register contains the data that is read from or written to program memory. Data is transferred to or from program memory one byte at a time.
Table read and table write operations are discussed further in Section 6.1 “Table Reads and Table Writes”.
DS39632C-page 60 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550

5.2 PIC18 Instruction Cycle

5.2.1 CLOCKING SCHEME

The microcontroller clock input, whether from an internal or external source, is internally divided by four to generate four non-overlapping quadrature clocks (Q1, Q2, Q3 and Q4). Internally, the program counter is incremented on every Q1; the instruction is fetched from the program memory and latched into the Instruc­tion Register (IR) during Q4. The instruction is decoded and executed during the following Q1 through Q4. The clocks and instruction execution flow are shown in Figure 5-3.
FIGURE 5-3: CLOCK/INSTRUCTION CYCLE
OSC1
Q1
Q2
Q3
Q4
PC
OSC2/CLKO
(RC mode)
Q2 Q3 Q4
Q1
PC PC + 2 PC + 4
Execute INST (PC – 2)
Fetch INST (PC)
Q2 Q3 Q4
Q1
Execute INST (PC)
Fetch INST (PC + 2)

5.2.2 INSTRUCTION FLOW/PIPELINING

An “Instruction Cycle” consists of four Q cycles: Q1 through Q4. The instruction fetch and execute are pipe­lined in such a manner that a fetch takes one instruction cycle, while the decode and execute takes another instruction cycle. However, due to the pipelining, each instruction effectively executes in one cycle. If an instruction causes the program counter to change (e.g., GOTO), then two cycles are required to complete the instruction (Example 5-3).
A fetch cycle begins with the Program Counter (PC) incrementing in Q1.
In the execution cycle, the fetched instruction is latched into the Instruction Register (IR) in cycle Q1. This instruction is then decoded and executed during the Q2, Q3 and Q4 cycles. Data memory is read during Q2 (operand read) and written during Q4 (destination write).
Q2 Q3 Q4
Q1
Internal Phase Clock
Execute INST (PC + 2)
Fetch INST (PC + 4)
EXAMPLE 5-3: INSTRUCTION PIPELINE FLOW
TCY0TCY1TCY2TCY3TCY4TCY5
1. MOVLW 55h
2. MOVWF PORTB
3. BRA SUB_1
4. BSF PORTA, BIT3 (Forced NOP)
5. Instruction @ address SUB_1
Note: All instructions are single cycle, except for any program branches. These take two cycles since the fetch
instruction is “flushed” from the pipeline while the new instruction is being fetched and then executed.
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 61
Fetch 1 Execute 1
Fetch 2 Execute 2
Fetch 3 Execute 3
Fetch 4 Flush (NOP)
Fetch SUB_1 Execute SUB_1
PIC18F2455/2550/4455/4550

5.2.3 INSTRUCTIONS IN PROGRAM MEMORY

The program memory is addressed in bytes. Instruc­tions are stored as two bytes or four bytes in program memory. The Least Significant Byte of an instruction word is always stored in a program memory location with an even address (LSb = 0). To maintain alignment with instruction boundaries, the PC increments in steps of 2 and the LSb will always read ‘0’ (see Section 5.1.1 “Program Counter”).
Figure 5-4 shows an example of how instruction words are stored in the program memory.
The CALL and GOTO instructions have the absolute
program memory address embedded into the instruc-
tion. Since instructions are always stored on word boundaries, the data contained in the instruction is a word address. The word address is written to PC<20:1>, which accesses the desired byte address in program memory. Instruction #2 in Figure 5-4 shows how the instruction, GOTO 0006h, is encoded in the program memory. Program branch instructions, which encode a relative address offset, operate in the same manner. The offset value stored in a branch instruction represents the number of single-word instructions that the PC will be offset by. Section 26.0 “Instruction Set Summary” provides further details of the instruction set.
FIGURE 5-4: INSTRUCTIONS IN PROGRAM MEMORY
LSB = 1 LSB = 0
F0h 00h 00000Ch
F4h 56h 000010h
Instruction 1: Instruction 2:
Instruction 3:
Program Memory Byte Locations
MOVLW 055h 0Fh 55h 000008h GOTO 0006h EFh 03h 00000Ah
MOVFF 123h, 456h C1h 23h 00000Eh
Word Address
000000h 000002h 000004h 000006h
000012h 000014h

5.2.4 TWO-WORD INSTRUCTIONS

The standard PIC18 instruction set has four two-word instructions: CALL, MOVFF, GOTO and LSFR. In all cases, the second word of the instructions always has ‘1111’ as its four Most Significant bits; the other 12 bits are literal data, usually a data memory address.
The use of ‘1111’ in the 4 MSbs of an instruction specifies a special form of NOP. If the instruction is executed in proper sequence, immediately after the first word, the data in the second word is accessed and
used by the instruction sequence. If the first word is skipped for some reason and the second word is executed by itself, a NOP is executed instead. This is necessary for cases when the two-word instruction is preceded by a conditional instruction that changes the PC. Example 5-4 shows how this works.
Note: See Section 5.5 “Program Memory and
the Extended Instruction Set” for
information on two-word instruction in the extended instruction set.
EXAMPLE 5-4: TWO-WORD INSTRUCTIONS
CASE 1:
Object Code Source Code
0110 0110 0000 0000 TSTFSZ REG1 ; is RAM location 0?
1100 0001 0010 0011 MOVFF REG1, REG2 ; No, skip this word
1111 0100 0101 0110 ; Execute this word as a NOP
0010 0100 0000 0000 ADDWF REG3 ; continue code
CASE 2:
Object Code Source Code
0110 0110 0000 0000 TSTFSZ REG1 ; is RAM location 0?
1100 0001 0010 0011 MOVFF REG1, REG2 ; Yes, execute this word
1111 0100 0101 0110 ; 2nd word of instruction
0010 0100 0000 0000 ADDWF REG3 ; continue code
DS39632C-page 62 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550

5.3 Data Memory Organization

Note: The operation of some aspects of data
memory are changed when the PIC18 extended instruction set is enabled. See
Section 5.6 “Data Memory and the Extended Instruction Set” for more
information.
The data memory in PIC18 devices is implemented as static RAM. Each register in the data memory has a 12-bit address, allowing up to 4096 bytes of data memory. The memory space is divided into as many as 16 banks that contain 256 bytes each. PIC18F2455/2550/4455/4550 devices implement eight complete banks, for a total of 2048 bytes. Figure 5-5 shows the data memory organization for the devices.
The data memory contains Special Function Registers (SFRs) and General Purpose Registers (GPRs). The SFRs are used for control and status of the controller and peripheral functions, while GPRs are used for data storage and scratchpad operations in the user’s application. Any read of an unimplemented location will read as ‘0’s.
The instruction set and architecture allow operations across all banks. The entire data memory may be accessed by Direct, Indirect or Indexed Addressing modes. Addressing modes are discussed later in this subsection.
To ensure that commonly used registers (SFRs and select GPRs) can be accessed in a single cycle, PIC18 devices implement an Access Bank. This is a 256-byte memory space that provides fast access to SFRs and the lower portion of GPR Bank 0 without using the BSR. Section 5.3.3 “Access Bank” provides a detailed description of the Access RAM.

5.3.1 USB RAM

Banks 4 through 7 of the data memory are actually mapped to special dual port RAM. When the USB module is disabled, the GPRs in these banks are used like any other GPR in the data memory space.
When the USB module is enabled, the memory in these banks is allocated as buffer RAM for USB operation. This area is shared between the microcontroller core and the USB Serial Interface Engine (SIE) and is used to transfer data directly between the two.
It is theoretically possible to use the areas of USB RAM that are not allocated as USB buffers for normal scratchpad memory or other variable storage. In prac­tice, the dynamic nature of buffer allocation makes this risky at best. Additionally, Bank 4 is used for USB buffer management when the module is enabled and should not be used for any other purposes during that time.
Additional information on USB RAM and buffer operation is provided in Section 17.0 “Universal Serial Bus (USB)”.

5.3.2 BANK SELECT REGISTER (BSR)

Large areas of data memory require an efficient addressing scheme to make rapid access to any address possible. Ideally, this means that an entire address does not need to be provided for each read or write operation. For PIC18 devices, this is accom­plished with a RAM banking scheme. This divides the memory space into 16 contiguous banks of 256 bytes. Depending on the instruction, each location can be addressed directly by its full 12-bit address, or an 8-bit low-order address and a 4-bit Bank Pointer.
Most instructions in the PIC18 instruction set make use of the Bank Pointer, known as the Bank Select Register (BSR). This SFR holds the 4 Most Significant bits of a location’s address; the instruction itself includes the eight Least Significant bits. Only the four lower bits of the BSR are implemented (BSR3:BSR0). The upper four bits are unused; they will always read ‘0’ and can­not be written to. The BSR can be loaded directly by using the MOVLB instruction.
The value of the BSR indicates the bank in data memory. The eight bits in the instruction show the loca­tion in the bank and can be thought of as an offset from the bank’s lower boundary. The relationship between the BSR’s value and the bank division in data memory is shown in Figure 5-6.
Since up to sixteen registers may share the same low-order address, the user must always be careful to ensure that the proper bank is selected before perform­ing a data read or write. For example, writing what should be program data to an 8-bit address of F9h, while the BSR is 0Fh, will end up resetting the program counter.
While any bank can be selected, only those banks that are actually implemented can be read or written to. Writes to unimplemented banks are ignored, while reads from unimplemented banks will return ‘0’s. Even so, the STATUS register will still be affected as if the operation was successful. The data memory map in Figure 5-5 indicates which banks are implemented.
In the core PIC18 instruction set, only the MOVFF instruction fully specifies the 12-bit address of the source and target registers. This instruction ignores the BSR completely when it executes. All other instructions include only the low-order address as an operand and must use either the BSR or the Access Bank to locate their target registers.
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 63
PIC18F2455/2550/4455/4550
FIGURE 5-5: DATA MEMORY MAP FOR PIC18F2455/2550/4455/4550 DEVICES
BSR<3:0>
= 0000
= 0001
= 0010
= 0011
= 0100
= 0101
= 0110
= 0111
Bank 0
Bank 1
Bank 2
Bank 3
Bank 4
Bank 5
Bank 6
Bank 7
Data Memory Map
00h
FFh
00h
FFh
00h
FFh
00h
FFh
00h
FFh
00h
FFh
00h
FFh
00h
FFh
00h
Access RAM
GPR
GPR
GPR
GPR
GPR
GPR
GPR
GPR
(1)
(1)
(1)
(1)
000h 05Fh 060h 0FFh 100h
1FFh 200h
2FFh 300h
3FFh 400h
4FFh 500h
5FFh 600h
6FFh 700h
7FFh 800h
When a = 0:
The BSR is ignored and the Access Bank is used.
The first 96 bytes are general purpose RAM (from Bank 0).
The remaining 160 bytes are Special Function Registers (from Bank 15).
When a = 1:
The BSR specifies the bank used by the instruction.
Access Bank
Access RAM Low
Access RAM High
(SFRs)
00h
5Fh
60h
FFh
= 1000
= 1110
= 1111
Note 1: These banks also serve as RAM buffer for USB operation. See Section 5.3.1 “USB RAM” for more
information.
DS39632C-page 64 Preliminary © 2006 Microchip Technology Inc.
Bank 8
to
Bank 14
Bank 15
FFh
00h
FFh
Unused
Read as 00h
Unused
SFR
EFFh F00h F5Fh
F60h FFFh
PIC18F2455/2550/4455/4550
FIGURE 5-6: USE OF THE BANK SELECT REGISTER (DIRECT ADDRESSING)
(1)
7
0000
Bank Select
Note 1: The Access RAM bit of the instruction can be used to force an override of the selected bank (BSR<3:0>) to
2: The MOVFF instruction embeds the entire 12-bit address in the instruction.
BSR
0
0011
(2)
E00h
F00h
FFFh
the registers of the Access Bank.
000h
100h
200h
300h
Data Memory
Bank 0
Bank 1
Bank 2
Bank 3
through
Bank 13
Bank 14
Bank 15
00h
FFh 00h
FFh 00h
FFh 00h
FFh 00h
FFh 00h
FFh
7
From Opcode
11111111
(2)
0

5.3.3 ACCESS BANK

While the use of the BSR, with an embedded 8-bit address, allows users to address the entire range of data memory, it also means that the user must always ensure that the correct bank is selected. Otherwise, data may be read from or written to the wrong location. This can be disastrous if a GPR is the intended target of an operation but an SFR is written to instead. Verifying and/or changing the BSR for each read or write to data memory can become very inefficient.
To streamline access for the most commonly used data memory locations, the data memory is configured with an Access Bank, which allows users to access a mapped block of memory without specifying a BSR. The Access Bank consists of the first 96 bytes of memory (00h-5Fh) in Bank 0 and the last 160 bytes of memory (60h-FFh) in Block 15. The lower half is known as the “Access RAM” and is composed of GPRs. The upper half is where the device’s SFRs are mapped. These two areas are mapped contiguously in the Access Bank and can be addressed in a linear fashion by an 8-bit address (Figure 5-5).
The Access Bank is used by core PIC18 instructions that include the Access RAM bit (the ‘a’ parameter in the instruction). When ‘a’ is equal to ‘1’, the instruction uses the BSR and the 8-bit address included in the opcode for the data memory address. When ‘a’ is ‘0’,
however, the instruction is forced to use the Access Bank address map; the current value of the BSR is ignored entirely.
Using this “forced” addressing allows the instruction to operate on a data address in a single cycle without updating the BSR first. For 8-bit addresses of 60h and above, this means that users can evaluate and operate on SFRs more efficiently. The Access RAM below 60h is a good place for data values that the user might need to access rapidly, such as immediate computational results or common program variables. Access RAM also allows for faster and more code efficient context saving and switching of variables.
The mapping of the Access Bank is slightly different when the extended instruction set is enabled (XINST Configuration bit = 1). This is discussed in more detail in Section 5.6.3 “Mapping the Access Bank in Indexed Literal Offset Mode”.

5.3.4 GENERAL PURPOSE REGISTER FILE

PIC18 devices may have banked memory in the GPR area. This is data RAM which is available for use by all instructions. GPRs start at the bottom of Bank 0 (address 000h) and grow upwards towards the bottom of the SFR area. GPRs are not initialized by a Power-on Reset and are unchanged on all other Resets.
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 65
PIC18F2455/2550/4455/4550

5.3.5 SPECIAL FUNCTION REGISTERS

The Special Function Registers (SFRs) are registers used by the CPU and peripheral modules for controlling the desired operation of the device. These registers are implemented as static RAM in the data memory space. SFRs start at the top of data memory and extend down­ward to occupy the top segment of Bank 15, from F60h to FFFh. A list of these registers is given in Table 5-1 and Table 5-2.
peripheral functions. The Reset and interrupt registers are described in their respective chapters, while the ALU’s STATUS register is described later in this section. Registers related to the operation of a peripheral feature are described in the chapter for that peripheral.
The SFRs are typically distributed among the peripherals whose functions they control. Unused SFR locations are unimplemented and read as ‘0’s.
The SFRs can be classified into two sets: those associated with the “core” device functionality (ALU, Resets and interrupts) and those related to the
TABLE 5-1: SPECIAL FUNCTION REGISTER MAP FOR PIC18F2455/2550/4455/4550 DEVICES
Address Name Address Name Address Name Address Name Address Name
FFFh TOSU FDFh INDF2
FFEh TOSH FDEh POSTINC2
FFDh TOSL FDDh POSTDEC2
FFCh STKPTR FDCh PREINC2
FFBh PCLATU FDBh PLUSW2
FFAh PCLATH FDAh FSR2H FBAh
FF9h PCL FD9h FSR2L FB9h
FF8h TBLPTRU FD8h STATUS FB8h BAUDCON F98h
FF7h TBLPTRH FD7h TMR0H FB7h ECCP1DEL F97h
FF6h TBLPTRL FD6h TMR0L FB6h ECCP1AS F96h TRISE
FF5h TABLAT FD5h T0CON FB5h CVRCON F95h TRISD
FF4h PRODH FD4h
FF3h PRODL FD3h OSCCON FB3h TMR3H F93h TRISB F73h UEP3
FF2h INTCON FD2h HLVDCON FB2h TMR3L F92h TRISA F72h UEP2
FF1h INTCON2 FD1h WDTCON FB1h T3CON F91h
FF0h INTCON3 FD0h RCON FB0h SPBRGH F90h
FEFh INDF0
(1)
FEEh POSTINC0
FEDh POSTDEC0
FECh PREINC0
FEBh PLUSW0
(1)
(1)
FCFh TMR1H FAFh SPBRG F8Fh
(1)
FCEh TMR1L FAEh RCREG F8Eh
(1)
FCDh T1CON FADh TXREG F8Dh LATE
FCCh TMR2 FACh TXSTA F8Ch LATD
FCBh PR2 FABh RCSTA F8Bh LATC F6Bh UEIE
FEAh FSR0H FCAh T2CON FAAh
FE9h FSR0L FC9h SSPBUF FA9h EEADR F89h LATA F69h UIE
FE8h WREG FC8h SSPADD FA8h EEDATA F88h
FE7h INDF1
FE6h POSTINC1
FE5h POSTDEC1
FE4h PREINC1
FE3h PLUSW1
(1)
(1)
(1)
FC7h SSPSTAT FA7h EECON2
(1)
FC6h SSPCON1 FA6h EECON1 F86h
(1)
FC5h SSPCON2 FA5h
FC4h ADRESH FA4h
FC3h ADRESL FA3h
FE2h FSR1H FC2h ADCON0 FA2h IPR2 F82h PORTC F62h SPPDATA
FE1h FSR1L FC1h ADCON1 FA1h PIR2 F81h PORTB F61h
FE0h BSR FC0h ADCON2 FA0h PIE2 F80h PORTA F60h
(1)
(1)
(1)
(2)
FBFh CCPR1H F9Fh IPR1 F7Fh UEP15
(1)
FBEh CCPR1L F9Eh PIR1 F7Eh UEP14
(1)
FBDh CCP1CON F9Dh PIE1 F7Dh UEP13
FBCh CCPR2H F9Ch
(2)
FBBh CCPR2L F9Bh OSCTUNE F7Bh UEP11
CCP2CON
(2)
F9Ah
F99h
(2)
(2)
(2)
(2)
(3)
(3)
FB4h CMCON F94h TRISC F74h UEP4
(2)
(2)
(2)
(2)
(3)
(3)
(2)
(1)
(2)
(2)
(2)
F8Ah LATB F6Ah UEIR
(2)
F87h
F85h
(2)
(2)
(2)
F84h PORTE F64h SPPEPS
F83h PORTD
(3)
F7Ch UEP12
F7Ah UEP10
F79h UEP9
F78h UEP8
F77h UEP7
F76h UEP6
F75h UEP5
F71h UEP1
F70h UEP0
F6Fh UCFG
F6Eh UADDR
F6Dh UCON
F6Ch USTAT
F68h UIR
F67h UFRMH
F66h UFRML
F65h SPPCON
F63h SPPCFG
(2)
(2)
(3)
(3)
(3)
(3)
Note 1: Not a physical register.
2: Unimplemented registers are read as ‘0’. 3: These registers are implemented only on 40/44-pin devices.
DS39632C-page 66 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550
TABLE 5-2: REGISTER FILE SUMMARY (PIC18F2455/2550/4455/4550)
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
TOSU
TOSH Top-of-Stack High Byte (TOS<15:8>) 0000 0000 51, 58
TOSL Top-of-Stack Low Byte (TOS<7:0>) 0000 0000 51, 58
STKPTR STKFUL STKUNF
PCLATU
PCLATH Holding Register for PC<15:8> 0000 0000 51, 58
PCL PC Low Byte (PC<7:0>) 0000 0000 51, 58
TBLPTRU
TBLPTRH Program Memory Table Pointer High Byte (TBLPTR<15:8>) 0000 0000 51, 82
TBLPTRL Program Memory Table Pointer Low Byte (TBLPTR<7:0>) 0000 0000 51, 82
TABLAT Program Memory Table Latch 0000 0000 51, 82
PRODH Product Register High Byte xxxx xxxx 51, 95
PRODL Product Register Low Byte xxxx xxxx 51, 95
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 51, 99
INTCON2 RBPU
INTCON3 INT2IP INT1IP
INDF0 Uses contents of FSR0 to address data memory – value of FSR0 not changed (not a physical register) N/A 51, 73
POSTINC0 Uses contents of FSR0 to address data memory – value of FSR0 post-incremented (not a physical register) N/A 51, 74
POSTDEC0 Uses contents of FSR0 to address data memory – value of FSR0 post-decremented (not a physical register) N/A 51, 74
PREINC0 Uses contents of FSR0 to address data memory – value of FSR0 pre-incremented (not a physical register) N/A 51, 74
PLUSW0 Uses contents of FSR0 to address data memory – value of FSR0 pre-incremented (not a physical register) –
FSR0H
FSR0L Indirect Data Memory Address Pointer 0 Low Byte xxxx xxxx 51, 73
WREG Working Register xxxx xxxx 51
INDF1 Uses contents of FSR1 to address data memory – value of FSR1 not changed (not a physical register) N/A 51, 73
POSTINC1 Uses contents of FSR1 to address data memory – value of FSR1 post-incremented (not a physical register) N/A 51, 74
POSTDEC1 Uses contents of FSR1 to address data memory – value of FSR1 post-decremented (not a physical register) N/A 51, 74
PREINC1 Uses contents of FSR1 to address data memory – value of FSR1 pre-incremented (not a physical register) N/A 51, 74
PLUSW1 Uses contents of FSR1 to address data memory – value of FSR1 pre-incremented (not a physical register) –
FSR1H
FSR1L Indirect Data Memory Address Pointer 1 Low Byte xxxx xxxx 51, 73
BSR
INDF2 Uses contents of FSR2 to address data memory – value of FSR2 not changed (not a physical register) N/A 52, 73
POSTINC2 Uses contents of FSR2 to address data memory – value of FSR2 post-incremented (not a physical register) N/A 52, 74
POSTDEC2 Uses contents of FSR2 to address data memory – value of FSR2 post-decremented (not a physical register) N/A 52, 74
PREINC2 Uses contents of FSR2 to address data memory – value of FSR2 pre-incremented (not a physical register) N/A 52, 74
PLUSW2 Uses contents of FSR2 to address data memory – value of FSR2 pre-incremented (not a physical register) –
FSR2H
FSR2L Indirect Data Memory Address Pointer 2 Low Byte xxxx xxxx 52, 73
STATUS
TMR0H Timer0 Register High Byte 0000 0000 52, 127
TMR0L Timer0 Register Low Byte xxxx xxxx 52, 127
T0CON TMR0ON T08BIT T0CS T0SE PSA T0PS2 T0PS1 T0PS0 1111 1111 52, 125
Legend: x = unknown, u = unchanged, - = unimplemented, q = value depends on condition. Shaded cells are unimplemented, read as ‘0’. Note 1: Bit 21 of the TBLPTRU allows access to the device Configuration bits.
2: The SBOREN bit is only available when BOREN<1:0> = 01; otherwise, the bit reads as ‘0’. 3: These registers and/or bits are not implemented on 28-pin devices and are read as ‘0’. Reset values are shown for 40/44-pin devices;
4: RA6 is configured as a port pin based on various primary oscillator modes. When the port pin is disabled, all of the associated bits read ‘0’. 5: RE3 is only available as a port pin when the MCLRE Configuration bit is clear; otherwise, the bit reads as ‘0’. 6: RC5 and RC4 are only available as port pins when the USB module is disabled (UCON<3> = 0). 7: I
Top-of-Stack Upper Byte (TOS<20:16>) ---0 0000 51, 58
SP4 SP3 SP2 SP1 SP0 00-0 0000 51, 59
Holding Register for PC<20:16> ---0 0000 51, 58
—bit 21
INTEDG0 INTEDG1 INTEDG2 —TMR0IP—RBIP1111 -1-1 51, 100
value of FSR0 offset by W
Indirect Data Memory Address Pointer 0 High Byte ---- 0000 51, 73
value of FSR1 offset by W
Indirect Data Memory Address Pointer 1 High Byte ---- 0000 51, 73
Bank Select Register ---- 0000 52, 63
value of FSR2 offset by W
Indirect Data Memory Address Pointer 2 High Byte ---- 0000 52, 73
—NOVZDCC---x xxxx 52, 71
individual unimplemented bits should be interpreted as ‘-’.
2
C Slave mode only.
(1)
Program Memory Table Pointer Upper Byte (TBLPTR<20:16>) --00 0000 51, 82
INT2IE INT1IE INT2IF INT1IF 11-0 0-00 51, 101
Val ue o n
POR, BOR
N/A 51, 74
N/A 51, 74
N/A 52, 74
Details
on page
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 67
PIC18F2455/2550/4455/4550
TABLE 5-2: REGISTER FILE SUMMARY (PIC18F2455/2550/4455/4550) (CONTINUED)
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Val ue o n
POR, BOR
OSCCON IDLEN IRCF2 IRCF1 IRCF0 OSTS IOFS SCS1 SCS0 0100 q000 52, 32
HLVDCON VDIRMAG
WDTCON
—SWDTEN--- ---0 52, 298
RCON IPEN SBOREN
IRVST HLVDEN HLVDL3 HLVDL2 HLVDL1 HLVDL0 0-00 0101 52, 279
(2)
—RITO PD POR BOR 0q-1 11q0 52, 44
TMR1H Timer1 Register High Byte xxxx xxxx 52, 133
TMR1L Timer1 Register Low Byte xxxx xxxx 52, 133
T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC
TMR1CS TMR1ON 0000 0000 52, 129
TMR2 Timer2 Register 0000 0000 52, 136
PR2 Timer2 Period Register 1111 1111 52, 136
T2CON
T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 52, 135
SSPBUF MSSP Receive Buffer/Transmit Register xxxx xxxx 52, 194,
SSPADD MSSP Address Register in I
SSPSTAT SMP CKE D/A
2
C™ Slave mode. MSSP Baud Rate Reload Register in I2C™ Master mode. 0000 0000 52, 202
PSR/WUA BF 0000 0000 52, 194,
SSPCON1 WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 52, 195,
SSPCON2 GCEN ACKSTAT ACKDT/
ADMSK5
(7)
ACKEN/
ADMSK4
(7)
RCEN/
ADMSK3
(7)
PEN/
ADMSK2
(7)
RSEN/
ADMSK1
SEN 0000 0000 52, 205
(7)
ADRESH A/D Result Register High Byte xxxx xxxx 52, 268
ADRESL A/D Result Register Low Byte xxxx xxxx 52, 268
ADCON0
ADCON1
ADCON2 ADFM
CHS3 CHS2 CHS1 CHS0 GO/DONE ADON --00 0000 52, 259
VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 --00 0qqq 52, 260
ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0 0-00 0000 52, 261
CCPR1H Capture/Compare/PWM Register 1 High Byte xxxx xxxx 53, 142
CCPR1L Capture/Compare/PWM Register 1 Low Byte xxxx xxxx 53, 142
CCP1CON P1M1
(3)
P1M0
(3)
DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0000 0000 53, 141,
CCPR2H Capture/Compare/PWM Register 2 High Byte xxxx xxxx 53, 142
CCPR2L Capture/Compare/PWM Register 2 Low Byte xxxx xxxx 53, 142
CCP2CON
BAUDCON ABDOVF RCIDL RXDTP TXCKP BRG16
ECCP1DEL PRSEN PDC6
ECCP1AS ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1
DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 --00 0000 53, 141
WUE ABDEN 0100 0-00 53, 240
(3)
PDC5
(3)
PDC4
(3)
PDC3
(3)
PDC2
(3)
PDC1
(3)
(3)
PDC0
PSSBD0
(3)
0000 0000 53, 158
(3)
0000 0000 53, 159
CVRCON CVREN CVROE CVRR CVRSS CVR3 CVR2 CVR1 CVR0 0000 0000 53, 275
CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 0000 0111 53, 269
TMR3H Timer3 Register High Byte xxxx xxxx 53, 139
TMR3L Timer3 Register Low Byte xxxx xxxx 53, 139
T3CON RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC
TMR3CS TMR3ON 0000 0000 53, 137
SPBRGH EUSART Baud Rate Generator Register High Byte 0000 0000 53, 241
SPBRG EUSART Baud Rate Generator Register Low Byte 0000 0000 53, 241
RCREG EUSART Receive Register 0000 0000 53, 250
TXREG EUSART Transmit Register 0000 0000 53, 247
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 53, 238
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 53, 239
Legend: x = unknown, u = unchanged, - = unimplemented, q = value depends on condition. Shaded cells are unimplemented, read as ‘0’. Note 1: Bit 21 of the TBLPTRU allows access to the device Configuration bits.
2: The SBOREN bit is only available when BOREN<1:0> = 01; otherwise, the bit reads as ‘0’. 3: These registers and/or bits are not implemented on 28-pin devices and are read as ‘0’. Reset values are shown for 40/44-pin devices;
individual unimplemented bits should be interpreted as ‘-’.
4: RA6 is configured as a port pin based on various primary oscillator modes. When the port pin is disabled, all of the associated bits read ‘0’. 5: RE3 is only available as a port pin when the MCLRE Configuration bit is clear; otherwise, the bit reads as ‘0’. 6: RC5 and RC4 are only available as port pins when the USB module is disabled (UCON<3> = 0).
2
7: I
C Slave mode only.
Details
on page
202
203
204
149
DS39632C-page 68 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550
TABLE 5-2: REGISTER FILE SUMMARY (PIC18F2455/2550/4455/4550) (CONTINUED)
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Val ue o n
POR, BOR
EEADR EEPROM Address Register 0000 0000 53, 89
EEDATA EEPROM Data Register 0000 0000 53, 89
EECON2 EEPROM Control Register 2 (not a physical register) 0000 0000 53, 80
EECON1 EEPGD CFGS
FREE WRERR WREN WR RD xx-0 x000 53, 81
IPR2 OSCFIP CMIP USBIP EEIP BCLIP HLVDIP TMR3IP CCP2IP 1111 1111 54, 107
PIR2 OSCFIF CMIF USBIF EEIF BCLIF HLVDIF TMR3IF CCP2IF 0000 0000 54, 103
PIE2 OSCFIE CMIE USBIE EEIE BCLIE HLVDIE TMR3IE CCP2IE 0000 0000 54, 105
IPR1 SPPIP
PIR1 SPPIF
PIE1 SPPIE
OSCTUNE INTSRC
(3)
TRISE
(3)
TRISD
TRISC TRISC7 TRISC6
(3)
ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 1111 1111 54, 106
(3)
ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 54, 102
(3)
ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 54, 104
TUN4 TUN3 TUN2 TUN1 TUN0 0--0 0000 54, 28
TRISE2 TRISE1 TRISE0 ---- -111 54, 124
TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 1111 1111 54, 122
TRISC2 TRISC1 TRISC0 11-- -111 54, 119
TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 1111 1111 54, 116
TRISA
LATE
LATD
(3)
(3)
TRISA6
LATE2 LATE1 LATE0 ---- -xxx 54, 124
LATD7 LATD6 LATD5 LATD4 LATD3 LATD2 LATD1 LATD0 xxxx xxxx 54, 122
LATC LATC7 LATC6
(4)
TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 -111 1111 54, 113
LATC 2 LATC 1 LAT C0 xx-- -xxx 54, 119
LATB LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 xxxx xxxx 54, 116
LATA
PORTE RDPU
(3)
PORTD
—LATA6
(3)
RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 xxxx xxxx 54, 122
PORTC RC7 RC6 RC5
(4)
LATA5 LATA4 LATA3 LATA2 LATA1 LATA0 -xxx xxxx 54, 113
—RE3
(6)
RC4
(6)
(5)
RC2 RC1 RC0 xxxx -xxx 54, 119
RE2
(3)
RE1
(3)
RE0
(3)
0--- x000 54, 123
PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx 54, 116
PORTA
UEP15
UEP14
UEP13
UEP12
UEP11
UEP10
UEP9
UEP8
UEP7
UEP6
UEP5
UEP4
UEP3
UEP2
UEP1
UEP0
—RA6
EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 55, 169
EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 55, 169
EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 55, 169
EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 55, 169
EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 55, 169
EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 55, 169
EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 55, 169
EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 55, 169
EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 55, 169
EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 55, 169
EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 55, 169
EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 55, 169
EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 55, 169
EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 55, 169
EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 55, 169
EPHSHK EPCONDIS EPOUTEN EPINEN EPSTALL ---0 0000 55, 169
(4)
RA5 RA4 RA3 RA2 RA1 RA0 -x0x 0000 54, 113
Legend: x = unknown, u = unchanged, - = unimplemented, q = value depends on condition. Shaded cells are unimplemented, read as ‘0’. Note 1: Bit 21 of the TBLPTRU allows access to the device Configuration bits.
2: The SBOREN bit is only available when BOREN<1:0> = 01; otherwise, the bit reads as ‘0’. 3: These registers and/or bits are not implemented on 28-pin devices and are read as ‘0’. Reset values are shown for 40/44-pin devices;
individual unimplemented bits should be interpreted as ‘-’.
4: RA6 is configured as a port pin based on various primary oscillator modes. When the port pin is disabled, all of the associated bits read ‘0’. 5: RE3 is only available as a port pin when the MCLRE Configuration bit is clear; otherwise, the bit reads as ‘0’. 6: RC5 and RC4 are only available as port pins when the USB module is disabled (UCON<3> = 0).
2
C Slave mode only.
7: I
Details
on page
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 69
PIC18F2455/2550/4455/4550
TABLE 5-2: REGISTER FILE SUMMARY (PIC18F2455/2550/4455/4550) (CONTINUED)
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
UCFG UTEYE UOEMON UPUEN UTRDIS FSEN PPB1 PPB0 00-0 0000 55, 166
UADDR
UCON
USTAT
UEIE BTSEE
UEIR BTSEF
UIE
UIR
UFRMH
UFRML FRM7 FRM6 FRM5 FRM4 FRM3 FRM2 FRM1 FRM0 xxxx xxxx 55, 170
(3)
SPPCON
(3)
SPPEPS
(3)
SPPCFG
SPPDATA
Legend: x = unknown, u = unchanged, - = unimplemented, q = value depends on condition. Shaded cells are unimplemented, read as ‘0’. Note 1: Bit 21 of the TBLPTRU allows access to the device Configuration bits.
(3)
2: The SBOREN bit is only available when BOREN<1:0> = 01; otherwise, the bit reads as ‘0’. 3: These registers and/or bits are not implemented on 28-pin devices and are read as ‘0’. Reset values are shown for 40/44-pin devices;
4: RA6 is configured as a port pin based on various primary oscillator modes. When the port pin is disabled, all of the associated bits read ‘0’. 5: RE3 is only available as a port pin when the MCLRE Configuration bit is clear; otherwise, the bit reads as ‘0’. 6: RC5 and RC4 are only available as port pins when the USB module is disabled (UCON<3> = 0). 7: I
ADDR6 ADDR5 ADDR4 ADDR3 ADDR2 ADDR1 ADDR0 -000 0000 55, 170
PPBRST SE0 PKTDIS USBEN RESUME SUSPND -0x0 000- 55, 164
ENDP3 ENDP2 ENDP1 ENDP0 DIR PPBI -xxx xxx- 55, 168
BTOEE DFN8EE CRC16EE CRC5EE PIDEE 0--0 0000 55, 182
BTOEF DFN8EF CRC16EF CRC5EF PIDEF 0--0 0000 55, 181
SOFIE STALLIE IDLEIE TRNIE ACTVIE UERRIE URSTIE -000 0000 55, 180
SOFIF STALLIF IDLEIF TRNIF ACTVIF UERRIF URSTIF -000 0000 55, 178
FRM10 FRM9 FRM8 ---- -xxx 55, 170
SPPOWN SPPEN ---- --00 55, 187
RDSPP WRSPP SPPBUSY ADDR3 ADDR2 ADDR1 ADDR0 00-0 0000 55, 191
CLKCFG1 CLKCFG0 CSEN CLK1EN WS3 WS2 WS1 WS0 0000 0000 55, 188
DATA7 DATA6 DATA5 DATA4 DATA3 DATA2 DATA1 DATA0 0000 0000 55, 192
individual unimplemented bits should be interpreted as ‘-’.
2
C Slave mode only.
Val ue o n
POR, BOR
Details
on page
DS39632C-page 70 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550

5.3.6 STATUS REGISTER

The STATUS register, shown in Register 5-2, contains the arithmetic status of the ALU. As with any other SFR, it can be the operand for any instruction.
If the STATUS register is the destination for an instruc­tion that affects the Z, DC, C, OV or N bits, the results of the instruction are not written; instead, the STATUS register is updated according to the instruction per­formed. Therefore, the result of an instruction with the STATUS register as its destination may be different than intended. As an example, CLRF STATUS will set the Z bit and leave the remaining Status bits unchanged (‘000u u1uu’).
It is recommended that only BCF, BSF, SWAPF, MOVFF and MOVWF instructions are used to alter the STATUS register because these instructions do not affect the Z, C, DC, OV or N bits in the STATUS register.
For other instructions that do not affect Status bits, see the instruction set summaries in Table 26-2 and Table 26-3.
Note: The C and DC bits operate as the Borrow
and Digit Borrow bits, respectively, in subtraction.
REGISTER 5-2: STATUS REGISTER
U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x
—NOVZDC
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
(1)
(2)
C
bit 7-5 Unimplemented: Read as ‘0’
bit 4 N: Negative bit
This bit is used for signed arithmetic (2’s complement). It indicates whether the result was negative (ALU MSB = 1).
1 = Result was negative 0 = Result was positive
bit 3 OV: Overflow bit
This bit is used for signed arithmetic (2’s complement). It indicates an overflow of the 7-bit magnitude which causes the sign bit (bit 7 of the result) to change state.
1 = Overflow occurred for signed arithmetic (in this arithmetic operation) 0 = No overflow occurred
bit 2 Z: Zero bit
1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero
(2)
(1)
bit
bit 1 DC: Digit Carry/Borrow
For ADDWF, ADDLW, SUBLW and SUBWF instructions:
1 = A carry-out from the 4th low-order bit of the result occurred 0 = No carry-out from the 4th low-order bit of the result
bit 0 C: Carry/Borrow
For ADDWF, ADDLW, SUBLW and SUBWF instructions:
1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred
Note 1: For Borrow
operand. For rotate (RRF, RLF) instructions, this bit is loaded with either bit 4 or bit 3 of the source register.
2: For Borrow
operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high or low-order bit of the source register.
, the polarity is reversed. A subtraction is executed by adding the 2’s complement of the second
, the polarity is reversed. A subtraction is executed by adding the 2’s complement of the second
bit
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 71
PIC18F2455/2550/4455/4550

5.4 Data Addressing Modes

Note: The execution of some instructions in the
core PIC18 instruction set are changed when the PIC18 extended instruction set is enabled. See Section 5.6 “Data
Memory and the Extended Instruction Set” for more information.
While the program memory can be addressed in only one way – through the program counter – information in the data memory space can be addressed in several ways. For most instructions, the addressing mode is fixed. Other instructions may use up to three modes, depending on which operands are used and whether or not the extended instruction set is enabled.
The addressing modes are:
• Inherent
• Literal
•Direct
•Indirect
An additional addressing mode, Indexed Literal Offset, is available when the extended instruction set is enabled (XINST Configuration bit = 1). Its operation is discussed in greater detail in Section 5.6.1 “Indexed Addressing with Literal Offset”.

5.4.1 INHERENT AND LITERAL ADDRESSING

Many PIC18 control instructions do not need any argument at all; they either perform an operation that globally affects the device or they operate implicitly on one register. This addressing mode is known as Inherent Addressing. Examples include SLEEP, RESET and DAW.
Other instructions work in a similar way but require an additional explicit argument in the opcode. This is known as Literal Addressing mode because they require some literal value as an argument. Examples include ADDLW and MOVLW, which respectively, add or move a literal value to the W register. Other examples include CALL and GOTO, which include a 20-bit program memory address.

5.4.2 DIRECT ADDRESSING

Direct Addressing mode specifies all or part of the source and/or destination address of the operation within the opcode itself. The options are specified by the arguments accompanying the instruction.
In the core PIC18 instruction set, bit-oriented and byte-oriented instructions use some version of Direct Addressing by default. All of these instructions include some 8-bit literal address as their Least Significant Byte. This address specifies either a register address in one of the banks of data RAM (Section 5.3.4 “General
Purpose Register File”) or a location in the Access Bank (Section 5.3.3 “Access Bank”) as the data source for the instruction.
The Access RAM bit ‘a’ determines how the address is interpreted. When ‘a’ is ‘1’, the contents of the BSR (Section 5.3.2 “Bank Select Register (BSR)”) are used with the address to determine the complete 12-bit address of the register. When ‘a’ is ‘0’, the address is interpreted as being a register in the Access Bank. Addressing that uses the Access RAM is sometimes also known as Direct Forced Addressing mode.
A few instructions, such as MOVFF, include the entire 12-bit address (either source or destination) in their opcodes. In these cases, the BSR is ignored entirely.
The destination of the operation’s results is determined by the destination bit ‘d’. When ‘d’ is ‘1’, the results are stored back in the source register, overwriting its origi­nal contents. When ‘d’ is ‘0’, the results are stored in the W register. Instructions without the ‘d’ argument have a destination that is implicit in the instruction; their destination is either the target register being operated on or the W register.

5.4.3 INDIRECT ADDRESSING

Indirect Addressing allows the user to access a location in data memory without giving a fixed address in the instruction. This is done by using File Select Registers (FSRs) as pointers to the locations to be read or written to. Since the FSRs are themselves located in RAM as Special Function Registers, they can also be directly manipulated under program control. This makes FSRs very useful in implementing data structures, such as tables and arrays in data memory.
The registers for Indirect Addressing are also implemented with Indirect File Operands (INDFs) that permit automatic manipulation of the pointer value with auto-incrementing, auto-decrementing or offsetting with another value. This allows for efficient code, using loops, such as the example of clearing an entire RAM bank in Example 5-5.
EXAMPLE 5-5: HOW TO CLEAR RAM
(BANK 1) USING INDIRECT ADDRESSING
LFSR FSR0, 100h ;
NEXT CLRF POSTINC0 ; Clear INDF
; register then ; inc pointer
BTFSS FSR0H, 1 ; All done with
; Bank1?
BRA NEXT ; NO, clear next
CONTINUE ; YES, continue
DS39632C-page 72 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550
5.4.3.1 FSR Registers and the INDF Operand
At the core of Indirect Addressing are three sets of registers: FSR0, FSR1 and FSR2. Each represents a pair of 8-bit registers: FSRnH and FSRnL. The four upper bits of the FSRnH register are not used, so each FSR pair holds a 12-bit value. This represents a value that can address the entire range of the data memory in a linear fashion. The FSR register pairs, then, serve as pointers to data memory locations.
Indirect Addressing is accomplished with a set of Indirect File Operands, INDF0 through INDF2. These can be thought of as “virtual” registers; they are
FIGURE 5-7: INDIRECT ADDRESSING
Using an instruction with one of the indirect addressing registers as the
operand....
...uses the 12-bit address stored in the FSR pair associated with that
register....
xxxx1110 11001100
ADDWF, INDF1, 1
mapped in the SFR space but are not physically imple­mented. Reading or writing to a particular INDF register actually accesses its corresponding FSR register pair. A read from INDF1, for example, reads the data at the address indicated by FSR1H:FSR1L. Instructions that use the INDF registers as operands actually use the contents of their corresponding FSR as a pointer to the instruction’s target. The INDF operand is just a convenient way of using the pointer.
Because Indirect Addressing uses a full 12-bit address, data RAM banking is not necessary. Thus, the current contents of the BSR and the Access RAM bit have no effect on determining the target address.
FSR1H:FSR1L
07
7
000h
Bank 0
100h
200h
300h
0
Bank 1
Bank 2
Bank 3
through
Bank 13
...to determine the data memory location to be used in that operation.
In this case, the FSR1 pair contains ECCh. This means the contents of location ECCh will be added to that of the W register and stored back in ECCh.
E00h
F00h
FFFh
Bank 14
Bank 14
Bank 15
Data Memory
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 73
PIC18F2455/2550/4455/4550
5.4.3.2 FSR Registers and POSTINC, POSTDEC, PREINC and PLUSW
In addition to the INDF operand, each FSR register pair also has four additional indirect operands. Like INDF, these are “virtual” registers that cannot be indirectly read or written to. Accessing these registers actually accesses the associated FSR register pair, but also performs a specific action on it stored value. They are:
• POSTDEC: accesses the FSR value, then
automatically decrements it by ‘1’ afterwards
• POSTINC: accesses the FSR value, then
automatically increments it by ‘1’ afterwards
• PREINC: increments the FSR value by ‘1’, then
uses it in the operation
• PLUSW: adds the signed value of the W register
(range of -127 to 128) to that of the FSR and uses the new value in the operation.
In this context, accessing an INDF register uses the value in the FSR registers without changing them. Sim­ilarly, accessing a PLUSW register gives the FSR value offset by that in the W register; neither value is actually changed in the operation. Accessing the other virtual registers changes the value of the FSR registers.
Operations on the FSRs with POSTDEC, POSTINC and PREINC affect the entire register pair; that is, rollovers of the FSRnL register, from FFh to 00h, carry over to the FSRnH register. On the other hand, results of these operations do not change the value of any flags in the STATUS register (e.g., Z, N, OV, etc.).
The PLUSW register can be used to implement a form of Indexed Addressing in the data memory space. By manipulating the value in the W register, users can reach addresses that are fixed offsets from pointer addresses. In some applications, this can be used to implement some powerful program control structure, such as software stacks, inside of data memory.
5.4.3.3 Operations by FSRs on FSRs
Indirect Addressing operations that target other FSRs or virtual registers represent special cases. For exam­ple, using an FSR to point to one of the virtual registers will not result in successful operations. As a specific case, assume that FSR0H:FSR0L contains FE7h, the address of INDF1. Attempts to read the value of INDF1, using INDF0 as an operand, will return 00h. Attempts to write to INDF1, using INDF0 as the operand, will result in a NOP.
On the other hand, using the virtual registers to write to an FSR pair may not occur as planned. In these cases, the value will be written to the FSR pair but without any incrementing or decrementing. Thus, writing to INDF2 or POSTDEC2 will write the same value to the FSR2H:FSR2L.
Since the FSRs are physical registers mapped in the SFR space, they can be manipulated through all direct operations. Users should proceed cautiously when working on these registers, particularly if their code uses Indirect Addressing.
Similarly, operations by Indirect Addressing are gener­ally permitted on all other SFRs. Users should exercise the appropriate caution that they do not inadvertently change settings that might affect the operation of the device.
DS39632C-page 74 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550

5.5 Program Memory and the Extended Instruction Set

The operation of program memory is unaffected by the use of the extended instruction set.
Enabling the extended instruction set adds eight additional two-word commands to the existing PIC18 instruction set: ADDFSR, ADDULNK, CALLW, MOVSF, MOVSS, PUSHL, SUBFSR and SUBULNK. These instructions are executed as described in
Section 5.2.4 “Two-Word Instructions”.

5.6 Data Memory and the Extended Instruction Set

Enabling the PIC18 extended instruction set (XINST Configuration bit = 1) significantly changes certain aspects of data memory and its addressing. Specifically, the use of the Access Bank for many of the core PIC18 instructions is different. This is due to the introduction of a new addressing mode for the data memory space. This mode also alters the behavior of Indirect Addressing using FSR2 and its associated operands.
What does not change is just as important. The size of the data memory space is unchanged, as well as its linear addressing. The SFR map remains the same. Core PIC18 instructions can still operate in both Direct and Indirect Addressing mode; inherent and literal instructions do not change at all. Indirect Addressing with FSR0 and FSR1 also remains unchanged.
5.6.1 INDEXED ADDRESSING WITH
LITERAL OFFSET
Enabling the PIC18 extended instruction set changes the behavior of Indirect Addressing using the FSR2 register pair and its associated file operands. Under the proper conditions, instructions that use the Access Bank – that is, most bit-oriented and byte-oriented instructions – can invoke a form of Indexed Addressing using an offset specified in the instruction. This special addressing mode is known as Indexed Addressing with Literal Offset or Indexed Literal Offset mode.
When using the extended instruction set, this addressing mode requires the following:
• The use of the Access Bank is forced (‘a’ = 0);
and
• The file address argument is less than or equal to 5Fh.
Under these conditions, the file address of the instruc­tion is not interpreted as the lower byte of an address (used with the BSR in Direct Addressing), or as an 8-bit address in the Access Bank. Instead, the value is interpreted as an offset value to an Address Pointer specified by FSR2. The offset and the contents of FSR2 are added to obtain the target address of the operation.
5.6.2 INSTRUCTIONS AFFECTED BY
INDEXED LITERAL OFFSET MODE
Any of the core PIC18 instructions that can use Direct Addressing are potentially affected by the Indexed Literal Offset Addressing mode. This includes all byte-oriented and bit-oriented instructions, or almost one-half of the standard PIC18 instruction set. Instruc­tions that only use Inherent or Literal Addressing modes are unaffected.
Additionally, byte-oriented and bit-oriented instructions are not affected if they use the Access Bank (Access RAM bit is ‘1’) or include a file address of 60h or above. Instructions meeting these criteria will continue to execute as before. A comparison of the different possible addressing modes when the extended instruction set is enabled in shown in Figure 5-8.
Those who desire to use byte-oriented or bit-oriented instructions in the Indexed Literal Offset mode should note the changes to assembler syntax for this mode. This is described in more detail in Section 26.2.1 “Extended Instruction Syntax”.
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 75
PIC18F2455/2550/4455/4550
FIGURE 5-8: COMPARING ADDRESSING OPTIONS FOR BIT-ORIENTED AND
BYTE-ORIENTED INSTRUCTIONS (EXTENDED INSTRUCTION SET ENABLED)
EXAMPLE INSTRUCTION: ADDWF, f, d, a (Opcode: 0010 01da ffff ffff)
When a = 0 and f 60h:
The instruction executes in Direct Forced mode. ‘f’ is inter­preted as a location in the Access RAM between 060h and 0FFh. This is the same as the SFRs or locations F60h to 0FFh (Bank 15) of data memory.
Locations below 60h are not available in this addressing mode.
When a = 0 and f5Fh:
The instruction executes in Indexed Literal Offset mode. ‘f’ is interpreted as an offset to the address value in FSR2. The two are added together to obtain the address of the target register for the instruction. The address can be anywhere in the data memory space.
Note that in this mode, the correct syntax is now:
ADDWF [k], d
where ‘k’ is the same as ‘f’.
000h
060h 080h
100h
F00h
F60h
FFFh
000h
080h
100h
F00h
F60h
FFFh
Bank 0
Bank 1
through
Bank 14
Bank 15
SFRs
Data Memory
Bank 0
Bank 1
through
Bank 14
Bank 15
SFRs
Data Memory
00h
60h
Access RAM
FSR2H FSR2L
FFh
ffffffff001001da
Valid range
for ‘f’
BSR
00000000
ffffffff001001da
When a = 1 (all values of f):
The instruction executes in Direct mode (also known as Direct Long mode). ‘f’ is inter­preted as a location in one of the 16 banks of the data memory space. The bank is designated by the Bank Select
000h
080h
100h
Bank 0
Bank 1
through
Bank 14
Register (BSR). The address can be in any implemented bank in the data memory space.
DS39632C-page 76 Preliminary © 2006 Microchip Technology Inc.
F00h
F60h
FFFh
Bank 15
SFRs
Data Memory
PIC18F2455/2550/4455/4550

5.6.3 MAPPING THE ACCESS BANK IN INDEXED LITERAL OFFSET MODE

The use of Indexed Literal Offset Addressing mode effectively changes how the lower portion of Access RAM (00h to 5Fh) is mapped. Rather than containing just the contents of the bottom half of Bank 0, this mode maps the contents from Bank 0 and a user-defined “window” that can be located anywhere in the data memory space. The value of FSR2 establishes the lower boundary of the addresses mapped into the window, while the upper boundary is defined by FSR2 plus 95 (5Fh). Addresses in the Access RAM above 5Fh are mapped as previously described (see Section 5.3.3 “Access Bank”). An example of Access Bank remapping in this addressing mode is shown in Figure 5-9.
FIGURE 5-9: REMAPPING THE ACCESS BANK WITH INDEXED LITERAL
OFFSET ADDRESSING
Remapping of the Access Bank applies tions using the Indexed Literal Offset mode. Operations that use the BSR (Access RAM bit is ‘1’) will continue to use Direct Addressing as before. Any indirect or indexed operation that explicitly uses any of the indirect file operands (including FSR2) will continue to operate as standard Indirect Addressing. Any instruction that uses the Access Bank, but includes a register address of greater than 05Fh, will use Direct Addressing and the normal Access Bank map.

5.6.4 BSR IN INDEXED LITERAL OFFSET MODE

Although the Access Bank is remapped when the extended instruction set is enabled, the operation of the BSR remains unchanged. Direct Addressing, using the BSR to select the data memory bank, operates in the same manner as previously described.
only
to opera-
Example Situation:
ADDWF f, d, a
FSR2H:FSR2L = 120h
Locations in the region from the FSR2 Pointer (120h) to the pointer plus 05Fh (17Fh) are mapped to the bottom of the Access RAM (000h-05Fh).
Special Function Regis­ters at F60h through FFFh are mapped to 60h through FFh as usual.
Bank 0 addresses below 5Fh are not available in this mode. They can still be addressed by using the BSR.
000h
100h 120h 17Fh
200h
F00h
F60h
FFFh
Bank 0
Window
Bank 1
Bank 2
through
Bank 14
Bank 15
SFRs
Data Memory
00h
Bank 1 “Window”
5Fh 60h
SFRs
FFh
Access Bank
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 77
PIC18F2455/2550/4455/4550
NOTES:
DS39632C-page 78 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550

6.0 FLASH PROGRAM MEMORY

The Flash program memory is readable, writable and erasable, during normal operation over the entire V range.
A read from program memory is executed on one byte at a time. A write to program memory is executed on blocks of 32 bytes at a time. Program memory is erased in blocks of 64 bytes at a time. A Bulk Erase operation may not be issued from user code.
Writing or erasing program memory will cease instruction fetches until the operation is complete. The program memory cannot be accessed during the write or erase, therefore, code cannot execute. An internal programming timer terminates program memory writes and erases.
A value written to program memory does not need to be a valid instruction. Executing a program memory location that forms an invalid instruction results in a NOP.
DD

6.1 Table Reads and Table Writes

In order to read and write program memory, there are two operations that allow the processor to move bytes between the program memory space and the data RAM:
• Table Read (TBLRD)
• Table Write (TBLWT)
The program memory space is 16 bits wide, while the data RAM space is 8 bits wide. Table reads and table writes move data between these two memory spaces through an 8-bit register (TABLAT).
Table read operations retrieve data from program memory and place it into the data RAM space. Figure 6-1 shows the operation of a table read with program memory and data RAM.
Table write operations store data from the data memory space into holding registers in program memory. The procedure to write the contents of the holding registers into program memory is detailed in Section 6.5 “Writing to Flash Program Memory”. Figure 6-2 shows the operation of a table write with program memory and data RAM.
Table operations work with byte entities. A table block containing data, rather than program instructions, is not required to be word-aligned. Therefore, a table block can start and end at any byte address. If a table write is being used to write executable code into program memory, program instructions will need to be word-aligned.

FIGURE 6-1: TABLE READ OPERATION

Table Pointer
TBLPTRU
Note 1: Table Pointer register points to a byte in program memory.
TBLPTRH TBLPTRL
(1)
Program Memory (TBLPTR)
Instruction: TBLRD*
Program Memory
Table Latch (8-bit)
TAB LAT
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 79
PIC18F2455/2550/4455/4550

FIGURE 6-2: TABLE WRITE OPERATION

Instruction: TBLWT*
Program Memory
Table Pointer
TBLPTRU
Note 1: Table Pointer actually points to one of 32 holding registers, the address of which is determined by
TBLPTRH TBLPTRL
TBLPTRL<4:0>. The process for physically writing data to the program memory array is discussed in
Section 6.5 “Writing to Flash Program Memory”.
(1)
Program Memory (TBLPTR)
Holding Registers
Table Latch (8-bit)
TAB LAT

6.2 Control Registers

Several control registers are used in conjunction with the TBLRD and TBLWT instructions. These include the:
• EECON1 register
• EECON2 register
• TABLAT register
• TBLPTR registers

6.2.1 EECON1 AND EECON2 REGISTERS

The EECON1 register (Register 6-1) is the control register for memory accesses. The EECON2 register is not a physical register; it is used exclusively in the memory write and erase sequences. Reading EECON2 will read all ‘0’s.
The EEPGD control bit determines if the access will be a program or data EEPROM memory access. When clear, any subsequent operations will operate on the data EEPROM memory. When set, any subsequent operations will operate on the program memory.
The CFGS control bit determines if the access will be to the Configuration/Calibration registers or to program memory/data EEPROM memory. When set, subsequent operations will operate on Configuration registers regardless of EEPGD (see Section 25.0 “Special Features of the CPU”). When clear, memory selection access is determined by EEPGD.
The FREE bit, when set, will allow a program memory erase operation. When FREE is set, the erase operation is initiated on the next WR command. When FREE is clear, only writes are enabled.
The WREN bit, when set, will allow a write operation. On power-up, the WREN bit is clear. The WRERR bit is set in hardware when the WREN bit is set and cleared when the internal programming timer expires and the write operation is complete.
Note: During normal operation, the WRERR is
read as ‘1’. This can indicate that a write operation was prematurely terminated by a Reset or a write operation was attempted improperly.
The WR control bit initiates write operations. The bit cannot be cleared, only set, in software; it is cleared in hardware at the completion of the write operation.
Note: The EEIF interrupt flag bit (PIR2<4>) is set
when the write is complete. It must be cleared in software.
DS39632C-page 80 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550
REGISTER 6-1: EECON1: DATA EEPROM CONTROL REGISTER 1
R/W-x R/W-x U-0 R/W-0 R/W-x R/W-0 R/S-0 R/S-0
EEPGD CFGS
bit 7 bit 0
Legend: S = Settable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 EEPGD: Flash Program or Data EEPROM Memory Select bit
1 = Access Flash program memory 0 = Access data EEPROM memory
bit 6 CFGS: Flash Program/Data EEPROM or Configuration Select bit
1 = Access Configuration registers 0 = Access Flash program or data EEPROM memory
bit 5 Unimplemented: Read as ‘0’
bit 4 FREE: Flash Row Erase Enable bit
1 = Erase the program memory row addressed by TBLPTR on the next WR command (cleared by
completion of erase operation)
0 = Perform write-only
bit 3 WRERR: Flash Program/Data EEPROM Error Flag bit
1 = A write operation is prematurely terminated (any Reset during self-timed programming in normal
operation or an improper write attempt)
0 = The write operation completed
bit 2 WREN: Flash Program/Data EEPROM Write Enable bit
1 = Allows write cycles to Flash program/data EEPROM 0 = Inhibits write cycles to Flash program/data EEPROM
bit 1 WR: Write Control bit
1 = Initiates a data EEPROM erase/write cycle or a program memory erase cycle or write cycle
(The operation is self-timed and the bit is cleared by hardware once write is complete. The WR bit can only be set (not cleared) in software.)
0 = Write cycle to the EEPROM is complete
bit 0 RD: Read Control bit
1 = Initiates an EEPROM read (Read takes one cycle. RD is cleared in hardware. The RD bit can only
be set (not cleared) in software. RD bit cannot be set when EEPGD = 1 or CFGS = 1.)
0 = Does not initiate an EEPROM read
FREE WRERR
(1)
WREN WR RD
(1)
Note 1: When a WRERR occurs, the EEPGD and CFGS bits are not cleared. This allows tracing of the error
condition.
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 81
PIC18F2455/2550/4455/4550

6.2.2 TABLE LATCH REGISTER (TABLAT)

The Table Latch (TABLAT) is an 8-bit register mapped into the SFR space. The Table Latch register is used to hold 8-bit data during data transfers between program memory and data RAM.

6.2.3 TABLE POINTER REGISTER (TBLPTR)

The Table Pointer (TBLPTR) register addresses a byte within the program memory. The TBLPTR is comprised of three SFR registers: Table Pointer Upper Byte, Table Pointer High Byte and Table Pointer Low Byte (TBLPTRU:TBLPTRH:TBLPTRL). These three regis­ters join to form a 22-bit wide pointer. The low-order 21 bits allow the device to address up to 2 Mbytes of program memory space. The 22nd bit allows access to the device ID, the user ID and the Configuration bits.
The Table Pointer, TBLPTR, is used by the TBLRD and TBLWT instructions. These instructions can update the TBLPTR in one of four ways based on the table opera­tion. These operations are shown in Table 6-1. These operations on the TBLPTR only affect the low-order 21 bits.

6.2.4 TABLE POINTER BOUNDARIES

TBLPTR is used in reads, writes and erases of the Flash program memory.
When a TBLRD is executed, all 22 bits of the TBLPTR determine which byte is read from program memory into TABLAT.
When a TBLWT is executed, the five LSbs of the Table Pointer register (TBLPTR<4:0>) determine which of the 32 program memory holding registers is written to. When the timed write to program memory begins (via the WR bit), the 16 MSbs of the TBLPTR (TBLPTR<21:6>) determine which program memory block of 32 bytes is written to. For more detail, see Section 6.5 “Writing to Flash Program Memory”.
When an erase of program memory is executed, the 16 MSbs of the Table Pointer register (TBLPTR<21:6>) point to the 64-byte block that will be erased. The Least Significant bits (TBLPTR<5:0>) are ignored.
Figure 6-3 describes the relevant boundaries of the TBLPTR based on Flash program memory operations.
TABLE 6-1: TABLE POINTER OPERATIONS WITH TBLRD AND TBLWT INSTRUCTIONS
Example Operation on Table Pointer
TBLRD* TBLWT*
TBLRD*+ TBLWT*+
TBLRD*­TBLWT*-
TBLRD+* TBLWT+*
TBLPTR is incremented after the read/write
TBLPTR is decremented after the read/write
TBLPTR is incremented before the read/write
TBLPTR is not modified
FIGURE 6-3: TABLE POINTER BOUNDARIES BASED ON OPERATION
21 16 15 87 0
DS39632C-page 82 Preliminary © 2006 Microchip Technology Inc.
TBLPTRU
TABLE ERASE TBLPTR<21:6>
TABLE WRITE – TBLPTR<21:5>
TABLE READ – TBLPTR<21:0>
TBLPTRLTBLPTRH
PIC18F2455/2550/4455/4550

6.3 Reading the Flash Program Memory

The TBLRD instruction is used to retrieve data from program memory and places it into data RAM. Table reads from program memory are performed one byte at a time.
TBLPTR points to a byte address in program space. Executing TBLRD places the byte pointed to into TABLAT. In addition, TBLPTR can be modified automatically for the next table read operation.
The internal program memory is typically organized by words. The Least Significant bit of the address selects between the high and low bytes of the word. Figure 6-4 shows the interface between the internal program memory and the TABLAT.

FIGURE 6-4: READS FROM FLASH PROGRAM MEMORY

Program Memory
(Even Byte Address)
(Odd Byte Address)
TBLPTR = xxxxx1
Instruction Register
(IR)
FETCH
TBLRD

EXAMPLE 6-1: READING A FLASH PROGRAM MEMORY WORD

MOVLW CODE_ADDR_UPPER ; Load TBLPTR with the base MOVWF TBLPTRU ; address of the word MOVLW CODE_ADDR_HIGH MOVWF TBLPTRH MOVLW CODE_ADDR_LOW MOVWF TBLPTRL
READ_WORD
TBLRD*+ ; read into TABLAT and increment MOVF TABLAT, W ; get data MOVWF WORD_EVEN TBLRD*+ ; read into TABLAT and increment MOVF TABLAT, W ; get data MOVF WORD_ODD
TBLPTR = xxxxx0
TAB LAT
Read Register
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 83
PIC18F2455/2550/4455/4550

6.4 Erasing Flash Program Memory

The minimum erase block is 32 words or 64 bytes. Only through the use of an external programmer, or through ICSP control, can larger blocks of program memory be Bulk Erased. Word Erase in the Flash array is not supported.
When initiating an erase sequence from the micro­controller itself, a block of 64 bytes of program memory is erased. The Most Significant 16 bits of the TBLPTR<21:6> point to the block being erased. TBLPTR<5:0> are ignored.
The EECON1 register commands the erase operation. The EEPGD bit must be set to point to the Flash program memory. The WREN bit must be set to enable write operations. The FREE bit is set to select an erase operation.
For protection, the write initiate sequence for EECON2 must be used.
A long write is necessary for erasing the internal Flash. Instruction execution is halted while in a long write

6.4.1 FLASH PROGRAM MEMORY ERASE SEQUENCE

The sequence of events for erasing a block of internal program memory is:
1. Load Table Pointer register with address of row
being erased.
2. Set the EECON1 register for the erase operation:
• set EEPGD bit to point to program memory;
• clear the CFGS bit to access program memory;
• set WREN bit to enable writes;
• set FREE bit to enable the erase.
3. Disable interrupts.
4. Write 55h to EECON2.
5. Write 0AAh to EECON2.
6. Set the WR bit. This will begin the Row Erase
cycle.
7. The CPU will stall for duration of the erase
(about 2 ms using internal timer).
8. Re-enable interrupts.
cycle. The long write will be terminated by the internal programming timer.
EXAMPLE 6-2: ERASING A FLASH PROGRAM MEMORY ROW
MOVLW CODE_ADDR_UPPER ; load TBLPTR with the base MOVWF TBLPTRU ; address of the memory block MOVLW CODE_ADDR_HIGH MOVWF TBLPTRH MOVLW CODE_ADDR_LOW
ERASE_ROW
Required MOVLW 55h Sequence MOVWF EECON2 ; write 55h
MOVWF TBLPTRL
BSF EECON1, EEPGD ; point to Flash program memory BCF EECON1, CFGS ; access Flash program memory BSF EECON1, WREN ; enable write to memory BSF EECON1, FREE ; enable Row Erase operation BCF INTCON, GIE ; disable interrupts
MOVLW 0AAh MOVWF EECON2 ; write 0AAh BSF EECON1, WR ; start erase (CPU stall) BSF INTCON, GIE ; re-enable interrupts
DS39632C-page 84 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550

6.5 Writing to Flash Program Memory

The minimum programming block is 16 words or 32 bytes. Word or byte programming is not supported.
Table writes are used internally to load the holding registers needed to program the Flash memory. There are 32 holding registers used by the table writes for programming.
Since the Table Latch (TABLAT) is only a single byte, the TBLWT instruction may need to be executed 32 times for each programming operation. All of the table write oper­ations will essentially be short writes because only the holding registers are written. At the end of updating the 32 holding registers, the EECON1 register must be written to in order to start the programming operation with a long write.
The long write is necessary for programming the internal Flash. Instruction execution is halted while in a long write cycle. The long write will be terminated by the internal programming timer.
The EEPROM on-chip timer controls the write time. The write/erase voltages are generated by an on-chip charge pump, rated to operate over the voltage range of the device.
Note: The default value of the holding registers on
device Resets and after write operations is FFh. A write of FFh to a holding register does not modify that byte. This means that individual bytes of program memory may be modified, provided that the change does not attempt to change any bit from a ‘0’ to a ‘1’. When modifying individual bytes, it is not necessary to load all 32 holding registers before executing a write operation.

FIGURE 6-5: TABLE WRITES TO FLASH PROGRAM MEMORY

TAB LAT
Write Register
8
Holding Register Holding Register Holding Register Holding Register
8 8 8

6.5.1 FLASH PROGRAM MEMORY WRITE SEQUENCE

The sequence of events for programming an internal program memory location should be:
1. Read 64 bytes into RAM.
2. Update data values in RAM as necessary.
3. Load Table Pointer register with address being
erased.
4. Execute the Row Erase procedure.
5. Load Table Pointer register with address of first
byte being written.
6. Write 32 bytes into the holding registers with
auto-increment.
7. Set the EECON1 register for the write operation:
• set EEPGD bit to point to program memory;
• clear the CFGS bit to access program memory;
• set WREN to enable byte writes.
TBLPTR = xxxx1FTBLPTR = xxxxx1TBLPTR = xxxxx0 TBLPTR = xxxxx2
Program Memory
8. Disable interrupts.
9. Write 55h to EECON2.
10. Write 0AAh to EECON2.
11. Set the WR bit. This will begin the write cycle.
12. The CPU will stall for duration of the write (about 2 ms using internal timer).
13. Re-enable interrupts.
14. Repeat steps 6 through 14 once more to write 64 bytes.
15. Verify the memory (table read).
This procedure will require about 8 ms to update one row of 64 bytes of memory. An example of the required code is given in Example 6-3.
Note: Before setting the WR bit, the Table
Pointer address needs to be within the intended address range of the 32 bytes in the holding register.
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 85
PIC18F2455/2550/4455/4550
EXAMPLE 6-3: WRITING TO FLASH PROGRAM MEMORY
MOVLW D'64’ ; number of bytes in erase block MOVWF COUNTER MOVLW BUFFER_ADDR_HIGH ; point to buffer MOVWF FSR0H MOVLW BUFFER_ADDR_LOW MOVWF FSR0L MOVLW CODE_ADDR_UPPER ; Load TBLPTR with the base MOVWF TBLPTRU ; address of the memory block MOVLW CODE_ADDR_HIGH MOVWF TBLPTRH MOVLW CODE_ADDR_LOW
READ_BLOCK
MODIFY_WORD
ERASE_BLOCK
Required MOVWF EECON2 ; write 55h Sequence MOVLW 0AAh
WRITE_BUFFER_BACK
WRITE_BYTE_TO_HREGS
MOVWF TBLPTRL
TBLRD*+ ; read into TABLAT, and inc MOVF TABLAT, W ; get data MOVWF POSTINC0 ; store data DECFSZ COUNTER ; done? BRA READ_BLOCK ; repeat
MOVLW DATA_ADDR_HIGH ; point to buffer MOVWF FSR0H MOVLW DATA_ADDR_LOW MOVWF FSR0L MOVLW NEW_DATA_LOW ; update buffer word MOVWF POSTINC0 MOVLW NEW_DATA_HIGH MOVWF INDF0
MOVLW CODE_ADDR_UPPER ; load TBLPTR with the base MOVWF TBLPTRU ; address of the memory block MOVLW CODE_ADDR_HIGH MOVWF TBLPTRH MOVLW CODE_ADDR_LOW MOVWF TBLPTRL BSF EECON1, EEPGD ; point to Flash program memory BCF EECON1, CFGS ; access Flash program memory BSF EECON1, WREN ; enable write to memory BSF EECON1, FREE ; enable Row Erase operation BCF INTCON, GIE ; disable interrupts MOVLW 55h
MOVWF EECON2 ; write 0AAh BSF EECON1, WR ; start erase (CPU stall) BSF INTCON, GIE ; re-enable interrupts TBLRD*- ; dummy read decrement MOVLW BUFFER_ADDR_HIGH ; point to buffer MOVWF FSR0H MOVLW BUFFER_ADDR_LOW MOVWF FSR0L MOVLW D’2’ MOVWF COUNTER1
MOVLW D’32’ ; number of bytes in holding register MOVWF COUNTER
MOVF POSTINC0, W ; get low byte of buffer data MOVWF TABLAT ; present data to table latch TBLWT+* ; write data, perform a short write
; to internal TBLWT holding register. DECFSZ COUNTER ; loop until buffers are full BRA WRITE_WORD_TO_HREGS
DS39632C-page 86 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550
EXAMPLE 6-3: WRITING TO FLASH PROGRAM MEMORY (CONTINUED)
PROGRAM_MEMORY
Required MOVWF EECON2 ; write 55h Sequence MOVLW 0AAh
BSF EECON1, EEPGD ; point to Flash program memory BCF EECON1, CFGS ; access Flash program memory BSF EECON1, WREN ; enable write to memory BCF INTCON, GIE ; disable interrupts MOVLW 55h
MOVWF EECON2 ; write 0AAh BSF EECON1, WR ; start program (CPU stall) DECFSZ COUNTER1 BRA WRITE_BUFFER_BACK BSF INTCON, GIE ; re-enable interrupts BCF EECON1, WREN ; disable write to memory

6.5.2 WRITE VERIFY

Depending on the application, good programming practice may dictate that the value written to the memory should be verified against the original value. This should be used in applications where excessive writes can stress bits near the specification limit.

6.5.3 UNEXPECTED TERMINATION OF WRITE OPERATION

If a write is terminated by an unplanned event, such as loss of power or an unexpected Reset, the memory location just programmed should be verified and repro­grammed if needed. If the write operation is interrupted by a MCLR Reset or a WDT Time-out Reset during normal operation, the user can check the WRERR bit and rewrite the location(s) as needed.

6.5.4 PROTECTION AGAINST SPURIOUS WRITES

To protect against spurious writes to Flash program memory, the write initiate sequence must also be followed. See Section 25.0 “Special Features of the
CPU” for more detail.
6.6 Flash Program Operation During
Code Protection
See Section 25.5 “Program Verification and Code Protection” for details on code protection of Flash
program memory.

TABLE 6-2: REGISTERS ASSOCIATED WITH PROGRAM FLASH MEMORY

Reset
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
TBLPTRU
TBLPTRH Program Memory Table Pointer High Byte (TBLPTR<15:8>) 51
TBLPTRL Program Memory Table Pointer Low Byte (TBLPTR<7:0>) 51
TABLAT Program Memory Table Latch 51
INTCON GIE/GIEH PEIE/GIEL
EECON2 EEPROM Control Register 2 (not a physical register) 53
EECON1 EEPGD CFGS
IPR2 OSCFIP CMIP USBIP EEIP BCLIP HLVDIP TMR3IP CCP2IP 54
PIR2 OSCFIF CMIF
PIE2 OSCFIE CMIE
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used during Flash/EEPROM access. Note 1: Bit 21 of the TBLPTRU allows access to the device Configuration bits.
—bit 21
(1)
Program Memory Table Pointer Upper Byte (TBLPTR<20:16>) 51
TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 51
FREE WRERR WREN WR RD 53
USBIF EEIF BCLIF HLVDIF TMR3IF CCP2IF 54
USBIE EEIE BCLIE HLVDIE TMR3IE CCP2IE 54
Val ues
on page
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 87
PIC18F2455/2550/4455/4550
NOTES:
DS39632C-page 88 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550

7.0 DATA EEPROM MEMORY

The data EEPROM is a nonvolatile memory array, separate from the data RAM and program memory, that is used for long-term storage of program data. It is not directly mapped in either the register file or program memory space, but is indirectly addressed through the Special Function Registers (SFRs). The EEPROM is readable and writable during normal operation over the entire V
Four SFRs are used to read and write to the data EEPROM as well as the program memory. They are:
• EECON1
• EECON2
• EEDATA
• EEADR
The data EEPROM allows byte read and write. When interfacing to the data memory block, EEDATA holds the 8-bit data for read/write and the EEADR register holds the address of the EEPROM location being accessed.
The EEPROM data memory is rated for high erase/write cycle endurance. A byte write automatically erases the location and writes the new data (erase-before-write). The write time is controlled by an on-chip timer; it will vary with voltage and temperature as well as from chip to chip. Please refer to parameter D122 (Table 28-1 in Section 28.0 “Electrical Characteristics”) for exact limits.

7.1 EECON1 and EECON2 Registers

Access to the data EEPROM is controlled by two registers: EECON1 and EECON2. These are the same registers which control access to the program memory and are used in a similar manner for the data EEPROM.
The EECON1 register (Register 7-1) is the control register for data and program memory access. Control bit, EEPGD, determines if the access will be to program or data EEPROM memory. When clear, operations will access the data EEPROM memory. When set, program memory is accessed.
DD range.
Control bit, CFGS, determines if the access will be to the Configuration registers or to program memory/data EEPROM memory. When set, subsequent operations access Configuration registers. When CFGS is clear, the EEPGD bit selects either program Flash or data EEPROM memory.
The WREN bit, when set, will allow a write operation. On power-up, the WREN bit is clear. The WRERR bit is set in hardware when the WREN bit is set and cleared when the internal programming timer expires and the write operation is complete.
Note: During normal operation, the WRERR is
read as ‘1’. This can indicate that a write operation was prematurely terminated by a Reset or a write operation was attempted improperly.
The WR control bit initiates write operations. The bit cannot be cleared, only set, in software; it is cleared in hardware at the completion of the write operation.
Note: The EEIF interrupt flag bit (PIR2<4>) is set
when the write is complete. It must be cleared in software.
Control bits, RD and WR, start read and erase/write operations, respectively. These bits are set by firmware and cleared by hardware at the completion of the operation.
The RD bit cannot be set when accessing program memory (EEPGD = 1). Program memory is read using table read instructions. See Section 6.1 “Table Reads and Table Writes” regarding table reads.
The EECON2 register is not a physical register. It is used exclusively in the memory write and erase sequences. Reading EECON2 will read all ‘0’s.
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 89
PIC18F2455/2550/4455/4550
REGISTER 7-1: EECON1: DATA EEPROM CONTROL REGISTER 1
R/W-x R/W-x U-0 R/W-0 R/W-x R/W-0 R/S-0 R/S-0
EEPGD CFGS FREE WRERR
bit 7 bit 0
Legend: S = Settable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 EEPGD: Flash Program or Data EEPROM Memory Select bit
1 = Access Flash program memory 0 = Access data EEPROM memory
bit 6 CFGS: Flash Program/Data EEPROM or Configuration Select bit
1 = Access Configuration registers 0 = Access Flash program or data EEPROM memory
bit 5 Unimplemented: Read as ‘0’
bit 4 FREE: Flash Row Erase Enable bit
1 = Erase the program memory row addressed by TBLPTR on the next WR command (cleared by
completion of erase operation)
0 = Perform write-only
bit 3 WRERR: Flash Program/Data EEPROM Error Flag bit
1 = A write operation is prematurely terminated (any Reset during self-timed programming in normal
operation or an improper write attempt)
0 = The write operation completed
bit 2 WREN: Flash Program/Data EEPROM Write Enable bit
1 = Allows write cycles to Flash program/data EEPROM 0 = Inhibits write cycles to Flash program/data EEPROM
bit 1 WR: Write Control bit
1 = Initiates a data EEPROM erase/write cycle or a program memory erase cycle or write cycle
(The operation is self-timed and the bit is cleared by hardware once write is complete. The WR bit can only be set (not cleared) in software.)
0 = Write cycle to the EEPROM is complete
bit 0 RD: Read Control bit
1 = Initiates an EEPROM read (Read takes one cycle. RD is cleared in hardware. The RD bit can only
be set (not cleared) in software. RD bit cannot be set when EEPGD = 1 or CFGS = 1.)
0 = Does not initiate an EEPROM read
(1)
WREN WR RD
(1)
Note 1: When a WRERR occurs, the EEPGD and CFGS bits are not cleared. This allows tracing of the error
condition.
DS39632C-page 90 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550

7.2 Reading the Data EEPROM Memory

To read a data memory location, the user must write the address to the EEADR register, clear the EEPGD control bit (EECON1<7>) and then set control bit, RD (EECON1<0>). The data is available on the very next instruction cycle; therefore, the EEDATA register can be read by the next instruction. EEDATA will hold this value until another read operation or until it is written to by the user (during a write operation).
The basic process is shown in Example 7-1.

7.3 Writing to the Data EEPROM Memory

To write an EEPROM data location, the address must first be written to the EEADR register and the data written to the EEDATA register. The sequence in Example 7-2 must be followed to initiate the write cycle.
The write will not begin if this sequence is not exactly followed (write 55h to EECON2, write 0AAh to EECON2, then set WR bit) for each byte. It is strongly recommended that interrupts be disabled during this code segment.
Additionally, the WREN bit in EECON1 must be set to enable writes. This mechanism prevents accidental writes to data EEPROM due to unexpected code exe­cution (i.e., runaway programs). The WREN bit should be kept clear at all times except when updating the EEPROM. The WREN bit is not cleared by hardware.
After a write sequence has been initiated, EECON1, EEADR and EEDATA cannot be modified. The WR bit will be inhibited from being set unless the WREN bit is set. The WREN bit must be set on a previous instruc­tion. Both WR and WREN cannot be set with the same instruction.
At the completion of the write cycle, the WR bit is cleared in hardware and the EEPROM Interrupt Flag bit (EEIF) is set. The user may either enable this interrupt, or poll this bit. EEIF must be cleared by software.

7.4 Write Verify

Depending on the application, good programming practice may dictate that the value written to the memory should be verified against the original value. This should be used in applications where excessive writes can stress bits near the specification limit.

EXAMPLE 7-1: DATA EEPROM READ

MOVLW DATA_EE_ADDR ; MOVWF EEADR ; Lower bits of Data Memory Address to read BCF EECON1, EEPGD ; Point to DATA memory BCF EECON1, CFGS ; Access EEPROM BSF EECON1, RD ; EEPROM Read MOVF EEDATA, W ; W = EEDATA

EXAMPLE 7-2: DATA EEPROM WRITE

MOVLW DATA_EE_ADDR ; MOVWF EEADR ; Lower bits of Data Memory Address to write MOVLW DATA_EE_DATA ; MOVWF EEDATA ; Data Memory Value to write BCF EECON1, EPGD ; Point to DATA memory BCF EECON1, CFGS ; Access EEPROM BSF EECON1, WREN ; Enable writes
Required MOVWF EECON2 ; Write 55h Sequence MOVLW 0AAh ;
BCF INTCON, GIE ; Disable Interrupts MOVLW 55h ;
MOVWF EECON2 ; Write 0AAh BSF EECON1, WR ; Set WR bit to begin write BSF INTCON, GIE ; Enable Interrupts
; User code execution
BCF EECON1, WREN ; Disable writes on write complete (EEIF set)
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 91
PIC18F2455/2550/4455/4550

7.5 Operation During Code-Protect

Data EEPROM memory has its own code-protect bits in Configuration Words. External read and write operations are disabled if code protection is enabled.
The microcontroller itself can both read and write to the internal data EEPROM regardless of the state of the code-protect Configuration bit. Refer to Section 25.0 “Special Features of the CPU” for additional information.

7.6 Protection Against Spurious Write

7.7 Using the Data EEPROM

The data EEPROM is a high endurance, byte address­able array that has been optimized for the storage of frequently changing information (e.g., program variables or other data that are updated often). Frequently changing values will typically be updated more often than specification D124 or D124A. If this is not the case, an array refresh must be performed. For this reason, variables that change infrequently (such as constants, IDs, calibration, etc.) should be stored in Flash program memory.
A simple data EEPROM refresh routine is shown in
There are conditions when the device may not want to
Example 7-3.
write to the data EEPROM memory. To protect against spurious EEPROM writes, various mechanisms have been implemented. On power-up, the WREN bit is cleared. In addition, writes to the EEPROM are blocked during the Power-up Timer period (T
PWRT,
parameter 33, Table 28-12).
The write initiate sequence and the WREN bit together help prevent an accidental write during brown-out, power glitch or software malfunction.

EXAMPLE 7-3: DATA EEPROM REFRESH ROUTINE

CLRF EEADR ; Start at address 0 BCF EECON1, CFGS ; Set for memory BCF EECON1, EEPGD ; Set for Data EEPROM BCF INTCON, GIE ; Disable interrupts BSF EECON1, WREN ; Enable writes
Loop ; Loop to refresh array
Required MOVWF EECON2 ; Write 55h Sequence MOVLW 0AAh ;
BSF EECON1, RD ; Read current address MOVLW 55h ;
MOVWF EECON2 ; Write 0AAh BSF EECON1, WR ; Set WR bit to begin write BTFSC EECON1, WR ; Wait for write to complete BRA $-2 INCFSZ EEADR, F ; Increment address BRA LOOP ; Not zero, do it again
Note: If data EEPROM is only used to store
constants and/or data that changes rarely, an array refresh is likely not required. See specification D124 or D124A.
BCF EECON1, WREN ; Disable writes BSF INTCON, GIE ; Enable interrupts
DS39632C-page 92 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550

TABLE 7-1: REGISTERS ASSOCIATED WITH DATA EEPROM MEMORY

Reset
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 51
EEADR EEPROM Address Register 53
EEDATA EEPROM Data Register 53
EECON2 EEPROM Control Register 2 (not a physical register) 53
EECON1 EEPGD CFGS
IPR2 OSCFIP CMIP USBIP EEIP BCLIP HLVDIP TMR3IP CCP2IP 54
PIR2 OSCFIF CMIF USBIF EEIF BCLIF HLVDIF TMR3IF CCP2IF 54
PIE2 OSCFIE CMIE
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used during Flash/EEPROM access.
FREE WRERR WREN WR RD 53
USBIE EEIE BCLIE HLVDIE TMR3IE CCP2IE 54
Values
on page
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 93
PIC18F2455/2550/4455/4550
NOTES:
DS39632C-page 94 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550

8.0 8 x 8 HARDWARE MULTIPLIER

8.1 Introduction

All PIC18 devices include an 8 x 8 hardware multiplier as part of the ALU. The multiplier performs an unsigned operation and yields a 16-bit result that is stored in the product register pair, PRODH:PRODL. The multiplier’s operation does not affect any flags in the STATUS register.
Making multiplication a hardware operation allows it to be completed in a single instruction cycle. This has the advantages of higher computational throughput and reduced code size for multiplication algorithms and allows the PIC18 devices to be used in many applica­tions previously reserved for digital signal processors. A comparison of various hardware and software multiply operations, along with the savings in memory and execution time, is shown in Table 8-1.

8.2 Operation

Example 8-1 shows the instruction sequence for an 8 x 8 unsigned multiplication. Only one instruction is required when one of the arguments is already loaded in the WREG register.
Example 8-2 shows the sequence to do an 8 x 8 signed multiplication. To account for the sign bits of the arguments, each argument’s Most Significant bit (MSb) is tested and the appropriate subtractions are done.
EXAMPLE 8-1: 8 x 8 UNSIGNED
MULTIPLY ROUTINE
MOVF ARG1, W ; MULWF ARG2 ; ARG1 * ARG2 ->
; PRODH:PRODL
EXAMPLE 8-2: 8 x 8 SIGNED MULTIPLY
ROUTINE
MOVF ARG1, W MULWF ARG2 ; ARG1 * ARG2 ->
; PRODH:PRODL BTFSC ARG2, SB ; Test Sign Bit SUBWF PRODH, F ; PRODH = PRODH
; - ARG1 MOVF ARG2, W BTFSC ARG1, SB ; Test Sign Bit SUBWF PRODH, F ; PRODH = PRODH
; - ARG2

TABLE 8-1: PERFORMANCE COMPARISON FOR VARIOUS MULTIPLY OPERATIONS

Routine Multiply Method
8 x 8 unsigned
8 x 8 signed
16 x 16 unsigned
16 x 16 signed
Without hardware multiply 13 69 6.9 μs27.6 μs69 μs
Hardware multiply 1 1 100 ns 400 ns 1 μs
Without hardware multiply 33 91 9.1 μs36.4 μs91 μs
Hardware multiply 6 6 600 ns 2.4 μs6 μs
Without hardware multiply 21 242 24.2 μs96.8 μs 242 μs
Hardware multiply 28 28 2.8 μs 11.2 μs28 μs
Without hardware multiply 52 254 25.4 μs 102.6 μs 254 μs
Hardware multiply 35 40 4.0 μs16.0 μs40 μs
Program
Memory (Words)
Cycles
(Max)
@ 40 MHz @ 10 MHz @ 4 MHz
Time
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 95
PIC18F2455/2550/4455/4550
Example 8-3 shows the sequence to do a 16 x 16 unsigned multiplication. Equation 8-1 shows the algorithm that is used. The 32-bit result is stored in four registers (RES3:RES0).
EQUATION 8-1: 16 x 16 UNSIGNED
MULTIPLICATION ALGORITHM
RES3:RES0 = ARG1H:ARG1L ARG2H:ARG2L
= (ARG1H ARG2H 2
(ARG1H ARG2L 2 (ARG1L ARG2H 2 (ARG1L ARG2L)
16
) +
8
) +
8
) +
EXAMPLE 8-3: 16 x 16 UNSIGNED
MULTIPLY ROUTINE
MOVF ARG1L, W MULWF ARG2L ; ARG1L * ARG2L->
MOVFF PRODH, RES1 ; MOVFF PRODL, RES0 ;
;
MOVF ARG1H, W MULWF ARG2H ; ARG1H * ARG2H->
MOVFF PRODH, RES3 ; MOVFF PRODL, RES2 ;
;
MOVF ARG1L, W MULWF ARG2H ; ARG1L * ARG2H->
MOVF PRODL, W ; ADDWF RES1, F ; Add cross MOVF PRODH, W ; products ADDWFC RES2, F ; CLRF WREG ; ADDWFC RES3, F ;
;
MOVF ARG1H, W ; MULWF ARG2L ; ARG1H * ARG2L->
MOVF PRODL, W ; ADDWF RES1, F ; Add cross MOVF PRODH, W ; products ADDWFC RES2, F ; CLRF WREG ; ADDWFC RES3, F ;
Example 8-4 shows the sequence to do a 16 x 16 signed multiply. Equation 8-2 shows the algorithm used. The 32-bit result is stored in four registers (RES3:RES0). To account for the sign bits of the arguments, the MSb for each argument pair is tested and the appropriate subtractions are done.
; PRODH:PRODL
; PRODH:PRODL
; PRODH:PRODL
; PRODH:PRODL
EQUATION 8-2: 16 x 16 SIGNED
MULTIPLICATION ALGORITHM
RES3:RES0 = ARG1H:ARG1L ARG2H:ARG2L
= (ARG1H ARG2H 2
(ARG1H ARG2L 2 (ARG1L ARG2H 2 (ARG1L ARG2L) + (-1 ARG2H<7> ARG1H:ARG1L 2 (-1 ARG1H<7> ARG2H:ARG2L 2
16
) +
8
) +
8
) +
EXAMPLE 8-4: 16 x 16 SIGNED
MULTIPLY ROUTINE
MOVF ARG1L, W MULWF ARG2L ; ARG1L * ARG2L ->
MOVFF PRODH, RES1 ; MOVFF PRODL, RES0 ;
;
MOVF ARG1H, W MULWF ARG2H ; ARG1H * ARG2H ->
MOVFF PRODH, RES3 ; MOVFF PRODL, RES2 ;
;
MOVF ARG1L,W MULWF ARG2H ; ARG1L * ARG2H ->
MOVF PRODL, W ; ADDWF RES1, F ; Add cross MOVF PRODH, W ; products ADDWFC RES2, F ; CLRF WREG ; ADDWFC RES3, F ;
;
MOVF ARG1H, W ; MULWF ARG2L ; ARG1H * ARG2L ->
MOVF PRODL, W ; ADDWF RES1, F ; Add cross MOVF PRODH, W ; products ADDWFC RES2, F ; CLRF WREG ; ADDWFC RES3, F ;
;
BTFSS ARG2H, 7 ; ARG2H:ARG2L neg? BRA SIGN_ARG1 ; no, check ARG1 MOVF ARG1L, W ; SUBWF RES2 ; MOVF ARG1H, W ;
SUBWFB RES3 ; SIGN_ARG1
BTFSS ARG1H, 7 ; ARG1H:ARG1L neg?
BRA CONT_CODE ; no, done
MOVF ARG2L, W ;
SUBWF RES2 ;
MOVF ARG2H, W ;
SUBWFB RES3 ; CONT_CODE :
; PRODH:PRODL
; PRODH:PRODL
; PRODH:PRODL
; PRODH:PRODL
16
) +
16
)
DS39632C-page 96 Preliminary © 2006 Microchip Technology Inc.
PIC18F2455/2550/4455/4550

9.0 INTERRUPTS

The PIC18F2455/2550/4455/4550 devices have multiple interrupt sources and an interrupt priority feature that allows each interrupt source to be assigned a high priority level or a low priority level. The high priority interrupt vector is at 000008h and the low priority interrupt vector is at 000018h. High priority interrupt events will interrupt any low priority interrupts that may be in progress.
There are ten registers which are used to control interrupt operation. These registers are:
• RCON
•INTCON
• INTCON2
• INTCON3
• PIR1, PIR2
• PIE1, PIE2
• IPR1, IPR2
It is recommended that the Microchip header files supplied with MPLAB names in these registers. This allows the assembler/ compiler to automatically take care of the placement of these bits within the specified register.
Each interrupt source has three bits to control its operation. The functions of these bits are:
• Flag bit to indicate that an interrupt event occurred
• Enable bit that allows program execution to branch to the interrupt vector address when the flag bit is set
• Priority bit to select high priority or low priority
The interrupt priority feature is enabled by setting the IPEN bit (RCON<7>). When interrupt priority is enabled, there are two bits which enable interrupts globally. Setting the GIEH bit (INTCON<7>) enables all interrupts that have the priority bit set (high priority). Setting the GIEL bit (INTCON<6>) enables all interrupts that have the priority bit cleared (low priority). When the interrupt flag, enable bit and appropriate global interrupt enable bit are set, the interrupt will vector immediately to address 000008h or 000018h, depending on the priority bit setting. Individual inter­rupts can be disabled through their corresponding enable bits.
When the IPEN bit is cleared (default state), the interrupt priority feature is disabled and interrupts are compatible with PICmicro Compatibility mode, the interrupt priority bits for each source have no effect. INTCON<6> is the PEIE bit which enables/disables all peripheral interrupt sources. INTCON<7> is the GIE bit which enables/disables all interrupt sources. All interrupts branch to address 000008h in Compatibility mode.
®
IDE be used for the symbolic bit
®
mid-range devices. In
When an interrupt is responded to, the global interrupt enable bit is cleared to disable further interrupts. If the IPEN bit is cleared, this is the GIE bit. If interrupt priority levels are used, this will be either the GIEH or GIEL bit. High priority interrupt sources can interrupt a low priority interrupt. Low priority interrupts are not processed while high priority interrupts are in progress.
The return address is pushed onto the stack and the PC is loaded with the interrupt vector address (000008h or 000018h). Once in the Interrupt Service Routine, the source(s) of the interrupt can be deter­mined by polling the interrupt flag bits. The interrupt flag bits must be cleared in software before re-enabling interrupts to avoid recursive interrupts.
The “return from interrupt” instruction, RETFIE, exits the interrupt routine and sets the GIE bit (GIEH or GIEL if priority levels are used) which re-enables interrupts.
For external interrupt events, such as the INT pins or the PORTB input change interrupt, the interrupt latency will be three to four instruction cycles. The exact latency is the same for one or two-cycle instructions. Individual interrupt flag bits are set regardless of the status of their corresponding enable bit or the GIE bit.
Note: Do not use the MOVFF instruction to modify
any of the interrupt control registers while any interrupt is enabled. Doing so may cause erratic microcontroller behavior.

9.1 USB Interrupts

Unlike other peripherals, the USB module is capable of generating a wide range of interrupts for many types of events. These include several types of normal commu­nication and status events and several module level error events.
To handle these events, the USB module is equipped with its own interrupt logic. The logic functions in a manner similar to the microcontroller level interrupt fun­nel, with each interrupt source having separate flag and enable bits. All events are funneled to a single device level interrupt, USBIF (PIR2<5>). Unlike the device level interrupt logic, the individual USB interrupt events cannot be individually assigned their own priority. This is determined at the device level interrupt funnel for all USB events by the USBIP bit.
For additional details on USB interrupt logic, refer to Section 17.5 “USB Interrupts”.
© 2006 Microchip Technology Inc. Preliminary DS39632C-page 97
PIC18F2455/2550/4455/4550

FIGURE 9-1: INTERRUPT LOGIC

Peripheral Interrupt Flag bit Peripheral Interrupt Enable bit Peripheral Interrupt Priority bit
From USB Interrupt Logic
High Priority Interrupt Generation
Low Priority Interrupt Generation
Peripheral Interrupt Flag bit Peripheral Interrupt Enable bit Peripheral Interrupt Priority bit
TMR1IF TMR1IE TMR1IP
From USB Interrupt Logic
USBIF USBIE USBIP
TMR1IF TMR1IE TMR1IP
USBIF USBIE USBIP
Additional Peripheral Interrupts
Additional Peripheral Interrupts
IPEN
TMR0IF
TMR0IE TMR0IP
RBIF RBIE
RBIP
INT1IF
INT1IE INT1IP
INT2IF
INT2IE INT2IP
TMR0IF TMR0IE TMR0IP
IPEN
PEIE/GIEL
RBIF RBIE RBIP
INT0IF INT0IE
INT1IF INT1IE INT1IP INT2IF INT2IE INT2IP
IPEN
Wake-up if in Sleep Mode
PEIE/GIEL GIE/GIEH
Interrupt to CPU Vector to Location
0008h
GIE/GIEH
Interrupt to CPU Vector to Location 0018h
DS39632C-page 98 Preliminary © 2006 Microchip Technology Inc.
Loading...