MICROCHIP PIC18F2458, PIC18F2553, PIC18F4458, PIC18F4553 DATA SHEET

PIC18F2458/2553/4458/4553
Data Sheet
28/40/44-Pin High-Performance,
Enhanced Flash, USB Microcontrollers
with 12-Bit A/D and nanoWatt Technology
© 2007 Microchip Technology Inc. Preliminary DS39887B
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron, dsPIC, K
EELOQ, KEELOQ logo, microID, MPLAB, PIC,
PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their respective companies.
© 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
®
MCUs and dsPIC® DSCs, KEELOQ
®
code hopping
DS39887B-page ii Preliminary © 2007 Microchip Technology Inc.
PIC18F2458/2553/4458/4553
28/40/44-Pin High-Performance, Enhanced Flash, USB
Microcontrollers with 12-Bit A/D and nanoWatt Technology

Universal Serial Bus Features:

• USB V2.0 Compliant
• Low Speed (1.5 Mb/s) and Full Speed (12 Mb/s)
• Supports Control, Interrupt, Isochronous and Bulk
Transfers
• Supports up to 32 Endpoints (16 bidirectional)
• 1-Kbyte Dual Access RAM for USB
• On-Chip USB Transceiver with On-Chip Voltage
Regulator
• Interface for Off-Chip USB Transceiver
• Streaming Parallel Port (SPP) for USB Streaming
Transfers (40/44-pin devices only)

Power-Managed Modes:

• Run: CPU On, Peripherals On
• Idle: CPU Off, Peripherals On
• Sleep: CPU Off, Peripherals Off
• Idle mode Currents Down to 5.8 μA Typical
• Sleep mode Currents Down to 0.1 μA Typical
• Timer1 Oscillator: 1.1 μA Typical, 32 kHz, 2V
• Watchdog Timer: 2.1 μA Typical
• Two-Speed Oscillator Start-up

Special Microcontroller Features:

• C Compiler Optimized Architecture with Optional
Extended Instruction Set
• 100,000 Erase/Write Cycle Enhanced Flash
Program Memory Typical
• 1,000,000 Erase/Write Cycle Data EEPROM
Memory Typical
• Flash/Data EEPROM Retention: > 40 Years
• Self-Programmable under Software Control
• Priority Levels for Interrupts
• 8 x 8 Single-Cycle Hardware Multiplier
• Extended Watchdog Timer (WDT):
- Programmable period from 41 ms to 131s
• Programmable Code Protection
• Single-Supply 5V In-Circuit Serial
Programming™ (ICSP™) via Two Pins
• In-Circuit Debug (ICD) via Two Pins
• Optional Dedicated ICD/ICSP Port (44-pin TQFP
package only)
• Wide Operating Voltage Range (2.0V to 5.5V)
Program Memory Data Memory
Device
PIC18F2458 24K 12288
PIC18F2553 32K 16384
PIC18F4458 24K 12288
PIC18F4553 32K 16384
Flash
(bytes)
# Single-Word
Instructions
SRAM
(bytes)
EEPROM
(bytes)
2048 256

Flexible Oscillator Structure:

• Four Crystal modes, Including High-Precision PLL for USB
• Two External Clock modes, up to 48 MHz
• Internal Oscillator Block:
- 8 user-selectable frequencies, from 31 kHz
to 8 MHz
- User-tunable to compensate for frequency drift
• Secondary Oscillator using Timer1 @ 32 kHz
• Dual Oscillator Options allow Microcontroller and USB module to Run at Different Clock Speeds
• Fail-Safe Clock Monitor:
- Allows for safe shutdown if any clock stops

Peripheral Highlights:

• High-Current Sink/Source: 25 mA/25 mA
• Three External Interrupts
• Four Timer modules (Timer0 to Timer3)
• Up to 2 Capture/Compare/PWM (CCP) modules:
- Capture is 16-bit, max. resolution 5.2 ns (T
- Compare is 16-bit, max. resolution 83.3 ns (T
- PWM output: PWM resolution is 1 to 10-bits
• Enhanced Capture/Compare/PWM (ECCP) module:
- Multiple output modes
- Selectable polarity
- Programmable dead time
- Auto-shutdown and auto-restart
• Enhanced USART module:
- LIN bus support
• Master Synchronous Serial Port (MSSP) module supporting 3-wire SPI (all 4 modes) and I Master and Slave modes
• 12-Bit, up to 13-Channel Analog-to-Digital Converter module (A/D) with Programmable Acquisition Time
• Dual Analog Comparators with Input Multiplexing
Note: This document is supplemented by
the “PIC18F2455/2550/4455/4550 Data
Sheet” (DS39632). See Section 1.0 “Device Overview”.
12-Bit
I/O
A/D (ch)
24 10 2/0 No
35 13 1/1 Yes
CCP/ECCP
(PWM)
SPP
CY/16)
CY)
2
C™
MSSP
Master
SPI
2
C™
I
YY121/3
EUSART
Comp.
Timers
8/16-Bit
© 2007 Microchip Technology Inc. Preliminary DS39887B-page 1
PIC18F2458/2553/4458/4553

Pin Diagrams

28-Pin SPDIP, SOIC
RA5/AN4/SS
40-Pin PDIP
MCLR/VPP/RE3
RA0/AN0
RA2/AN2/V
RA4/T0CKI/C1OUT/RCV
RC0/T1OSO/T13CKI
RC1/T1OSI/CCP2
RA1/AN1
REF-/CVREF
RA3/AN3/VREF+
/HLVDIN/C2OUT
OSC1/CLKI
OSC2/CLKO/RA6
(1)
/UOE
RC2/CCP1
V
V
USB
1 2 3 4 5 6 7
SS
8 9 10 11 12 13 14
PIC18F2458
28 27 26 25 24 23 22 21 20
PIC18F2553
19 18 17 16 15
RB7/KBI3/PGD RB6/KBI2/PGC RB5/KBI1/PGM RB4/AN11/KBI0 RB3/AN9/CCP2 RB2/AN8/INT2/VMO RB1/AN10/INT1/SCK/SCL RB0/AN12/INT0/FLT0/SDI/SDA V
DD
VSS RC7/RX/DT/SDO RC6/TX/CK RC5/D+/VP RC4/D-/VM
(1)
/VPO
MCLR/VPP/RE3
RA0/AN0
RA2/AN2/V
RA4/T0CKI/C1OUT/RCV
RA5/AN4/SS
RC0/T1OSO/T13CKI
RC1/T1OSI/CCP2
Note 1: RB3 is the alternate pin for CCP2 multiplexing.
RA1/AN1
REF-/CVREF
RA3/AN3/VREF+
/HLVDIN/C2OUT RE0/AN5/CK1SPP RE1/AN6/CK2SPP
RE2/AN7/OESPP
OSC2/CLKO/RA6
RC2/CCP1/P1A
V VSS
OSC1/CLKI
(1)
/UOE
V
USB
RD0/SPP0 RD1/SPP1
DD
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
PIC18F4458
PIC18F4553
40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21
RB7/KBI3/PGD RB6/KBI2/PGC RB5/KBI1/PGM RB4/AN11/KBI0/CSSPP RB3/AN9/CCP2 RB2/AN8/INT2/VMO RB1/AN10/INT1/SCK/SCL RB0/AN12/INT0/FLT0/SDI/SDA V
DD
VSS RD7/SPP7/P1D RD6/SPP6/P1C RD5/SPP5/P1B RD4/SPP4 RC7/RX/DT/SDO RC6/TX/CK RC5/D+/VP RC4/D-/VM RD3/SPP3 RD2/SPP2
(1)
/VPO
DS39887B-page 2 Preliminary © 2007 Microchip Technology Inc.

Pin Diagrams (Continued)

44-Pin TQFP
PIC18F2458/2553/4458/4553
/UOE
(1)
(2)
RC7/RX/DT/SDO
RD5/SPP5/P1B
RD6/SPP6/P1C RD7/SPP7/P1D
RB0/AN12/INT0/FLT0/SDI/SDA
RB1/AN10/INT1/SCK/SCL
RB2/AN8/INT2/VMO
RB3/AN9/CCP2
44-Pin QFN
RD4/SPP4
V VDD
(1)
/VPO
RC6/TX/CK
RC5/D+/VP
RC4/D-/VM
RD3/SPP3
4443424140
1 2 3 4 5
PIC18F4458
SS
6 7 8 9 10 11
121314
(2)
(2)
/ICPGC
(2)
(2)
NC/ICCK
PIC18F4553
15
/ICPGD
RB5/KBI1/PGM
NC/ICDT
RB4/AN11/KBI0/CSSPP
RD2/SPP2
RD1/SPP1
39
16
17
RB7/KBI3/PGD
RB6/KBI2/PGC
USB
RD0/SPP0
V
RC2/CCP1/P1A
RC1/T1OSI/CCP2
363435
37
38
1819202122
RA1/AN1
RA0/AN0
/VPP/RE3
REF-/CVREF
MCLR
RA2/AN2/V
NC/ICPORTS
(2)
33 32 31 30 29 28 27 26 25 24 23
RA3/AN3/VREF+
NC/ICRST RC0/T1OSO/T13CKI OSC2/CLKO/RA6 OSC1/CLKI V
SS
VDD RE2/AN7/OESPP RE1/AN6/CK2SPP RE0/AN5/CK1SPP RA5/AN4/SS RA4/T0CKI/C1OUT/RCV
/UOE
(1)
(2)
/ICVPP
/HLVDIN/C2OUT
15
RD2/SPP2
16
RB6/KBI2/PGC
USB
RD1/SPP1
RD0/SPP0
V
39
37
38
1819202122
17
RA0/AN0
/VPP/RE3
RB7/KBI3/PGD
MCLR
RC2/CCP1/P1A
363435
RA1/AN1
RC1/T1OSI/CCP2
REF-/CVREF
RA2/AN2/V
RC0/T1OSO/T13CKI
33 32 31 30 29 28 27 26 25 24 23
REF+
RA3/AN3/V
OSC2/CLKO/RA6 OSC1/CLKI
SS
V VSS VDD VDD RE2/AN7/OESPP RE1/AN6/CK2SPP RE0/AN5/CK1SPP RA5/AN4/SS RA4/T0CKI/C1OUT/RCV
RC6/TX/CK
RC5/D+/VP
RC4/D-/VM
RD3/SPP3
RC7/RX/DT/SDO
RD4/SPP4
RD5/SPP5/P1B RD6/SPP6/P1C RD7/SPP7/P1D
RB0/AN12/INT0/FLT0/SDI/SDA
RB1/AN10/INT1/SCK/SCL
RB2/AN8/INT2/VMO
Note 1: RB3 is the alternate pin for CCP2 multiplexing.
2: Special ICPORT features are available only in 44-pin TQFP packages. See Section 25.9 “Special ICPORT Features” in
the “PIC18F2455/2550/4455/4550 Data Sheet”’.
V VDD VDD
SS
4443424140
1 2 3 4 5 6 7 8 9 10 11
(1)
PIC18F4458 PIC18F4553
121314
NC
/VPO
RB5/KBI1/PGM
RB3/AN9/CCP2
RB4/AN11/KBI0/CSSPP
/HLVDIN/C2OUT
© 2007 Microchip Technology Inc. Preliminary DS39887B-page 3
PIC18F2458/2553/4458/4553

Table of Contents

1.0 Device Overview .......................................................................................................................................................................... 5
2.0 12-Bit Analog-to-Digital Converter (A/D) Module ....................................................................................................................... 19
3.0 Special Features of the CPU...................................................................................................................................................... 29
4.0 Electrical Characteristics ............................................................................................................................................................ 31
5.0 Packaging Information................................................................................................................................................................ 35
Appendix A: Revision History............................................................................................................................................................... 37
Appendix B: Device Differences........................................................................................................................................................... 37
Appendix C: Migration From Mid-Range to Enhanced Devices........................................................................................................... 38
Appendix D: Migration From High-End to Enhanced Devices ............................................................................................................. 38
Index .................................................................................................................................................................................................... 39
The Microchip Web Site....................................................................................................................................................................... 41
Customer Change Notification Service ................................................................................................................................................ 41
Customer Support ................................................................................................................................................................................ 41
Reader Response ................................................................................................................................................................................ 42
Product Identification System............................................................................................................................................................... 43
TO OUR VALUED CUSTOMERS
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Most Current Data Sheet

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http://www.microchip.com
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An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
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DS39887B-page 4 Preliminary © 2007 Microchip Technology Inc.
PIC18F2458/2553/4458/4553

1.0 DEVICE OVERVIEW

This document contains device-specific information for the following devices:
• PIC18F2458 • PIC18F4458
• PIC18F2553 • PIC18F4553
Note: This data sheet documents only the
devices’ features and specifications that are in addition to the features and specifica­tions of the PIC18F2455/2550/4455/4550 devices. For information on the features and specifications shared by the PIC18F2458/2553/4458/4553 and PIC18F2455/2550/4455/4550 devices,
see the PIC18F2455/2550/4455/4550
Data Sheet” (DS39632).
The PIC18F4553 family of devices offers the advan­tages of all PIC18 microcontrollers – namely, high computational performance at an economical price – with the addition of high-endurance, Enhanced Flash program memory. In addition to these features, the PIC18F4553 family introduces design enhancements that make these microcontrollers a logical choice for many high-performance, power sensitive applications.

1.1 Special Features

12-Bit A/D Converter: The PIC18F4553 family implements a 12-bit A/D Converter. The A/D Converter incorporates programmable acquisi­tion time. This allows for a channel to be selected and a conversion to be initiated, without waiting for a sampling period and thus, reducing code overhead.

1.2 Details on Individual Family Members

The PIC18F2458/2553/4458/4553 devices are available in 28-pin and 40/44-pin packages. Block diagrams for the two groups are shown in Figure 1-1 and Figure 1-2.
The devices are differentiated from each other in the following ways:
1. Flash program memory (24 Kbytes for
PIC18FX458 devices, 32 Kbytes for PIC18FX553).
2. A/D channels (10 for 28-pin devices, 13 for
40-pin and 44-pin devices).
3. I/O ports (3 bidirectional ports and 1 input only
port on 28-pin devices, 5 bidirectional ports on 40-pin and 44-pin devices).
4. CCP and Enhanced CCP implementation
(28-pin devices have two standard CCP modules, 40-pin and 44-pin devices have one standard CCP module and one ECCP module).
5. Streaming Parallel Port (present only on
40/44-pin devices).
All other features for devices in this family are identical. These are summarized in Table 1-1.
The pinouts for all devices are listed in Table 1-2 and Table 1-3.
Members of the PIC18F4553 family are available as both standard and low-voltage devices. Standard devices with Enhanced Flash memory, designated with an “F” in the part number (such as PIC18F2458), accommodate an operating V Low-voltage parts, designated by “LF” (such as PIC18LF2458), function over an extended VDD range of 2.0V to 5.5V.
DD range of 4.2V to 5.5V.
© 2007 Microchip Technology Inc. Preliminary DS39887B-page 5
PIC18F2458/2553/4458/4553

TABLE 1-1: DEVICE FEATURES

Features PIC18F2458 PIC18F2553 PIC18F4458 PIC18F4553
Operating Frequency DC – 48 MHz DC – 48 MHz DC – 48 MHz DC – 48 MHz
Program Memory (Bytes) 24576 32768 24576 32768
Program Memory (Instructions)
Data Memory (Bytes) 2048 2048 2048 2048
Data EEPROM Memory (Bytes)
Interrupt Sources 19 19 20 20
I/O Ports Ports A, B, C, (E) Ports A, B, C, (E) Ports A, B, C, D, E Ports A, B, C, D, E
Timers 4 4 4 4
Capture/Compare/PWM Modules
Enhanced Capture/ Compare/PWM Modules
Serial Communications MSSP,
Universal Serial Bus (USB) Module
Streaming Parallel Port (SPP) No No Yes Yes
12-Bit Analog-to-Digital Converter Module
Comparators 2 2 2 2
Resets (and Delays) POR, BOR, WDT,
Programmable High/ Low-Voltage Detect
Programmable Brown-out Reset
Instruction Set 75 Instructions;
Packages 28-Pin SPDIP
Corresponding Devices with 10-Bit A/D
12288 16384 12288 16384
256 256 256 256
2 2 1 1
0 0 1 1
MSSP,
Enhanced USART
1 1 1 1
10 Input Channels 10 Input Channels 13 Input Channels 13 Input Channels
RESET Instruction,
Stack Full, Stack
Underflow, MCLR
(optional),
(PWRT, OST)
Yes Ye s Yes Ye s
Yes Ye s Ye s Yes
83 with Extended
Instruction Set
Enabled
28-Pin SOIC
PIC18F2455 PIC18F2550 PIC18F4455 PIC18F4550
Enhanced USART
POR, BOR, WDT,
RESET Instruction,
Stack Full, Stack
Underflow, MCLR
(optional),
(PWRT, OST)
75 Instructions;
83 with Extended
Instruction Set
Enabled
28-Pin SPDIP
28-Pin SOIC
MSSP,
Enhanced USART
POR, BOR, WDT,
RESET Instruction,
Stack Full, Stack
Underflow, MCLR
(optional),
(PWRT, OST)
75 Instructions;
83 with Extended
Instruction Set
Enabled
40-Pin PDIP 44-Pin QFN
44-Pin TQFP
MSSP,
Enhanced USART
POR, BOR, WDT,
RESET Instruction,
Stack Ful l, Stack
Underflow, MCLR
(optional),
(PWRT, OST)
75 Instructions;
83 with Extended
Instruction Set
Enabled
40-Pin PDIP
44-Pin QFN
44-Pin TQFP
DS39887B-page 6 Preliminary © 2007 Microchip Technology Inc.
PIC18F2458/2553/4458/4553

FIGURE 1-1: PIC18F2458/2553 (28-PIN) BLOCK DIAGRAM

Table Pointer<21>
inc/dec logic
21
Address Latch
Program Memory
(24/32 Kbytes)
Data Latch
Instruction Bus <16>
(2)
OSC1
(2)
OSC2
T1OSI
T1OSO
(1)
MCLR
VDD,
SS
V
USB
V
20
8
Tabl e L a t c h
Instruction
Internal
Oscillator
Block
INTRC
Oscillator
8 MHz
Oscillator
Single-Supply
Programming
In-Circuit
Debugger
PCLATH
PCLATU
PCH PCL
PCU
Program Counter
31 Level Stack
STKPTR
ROM Latch
IR
Decode &
Control
Start-up Timer
Clock Monitor
USB Voltage
Regulator
Data Bus<8>
8
8
State Machine Control Signals
Power-up
Timer
Oscillator
Power-on
Reset
Watchdog
Timer
Brown-out
Reset
Fail-Safe
Data Latch
Data Memory
(2 Kbytes)
Address Latch
12
Data Address<12>
44
12
FSR0 FSR1 FSR2
inc/dec
logic
Decode
8 x 8 Multiply
W
8
ALU<8>
Access
Bank
PRODLPRODH
8
8
12
8
BSR
Address
3
BITOP
8
Band Gap Reference
PORTA
RA0/AN0 RA1/AN1 RA2/AN2/VREF-/CVREF RA3/AN3/VREF+ RA4/T0CKI/C1OUT/RCV RA5/AN4/SS/HLVDIN/C2OUT OSC2/CLKO/RA6
PORTB
RB0/AN12/INT0/FLT0/SDI/SDA RB1/AN10/INT1/SCK/SCL RB2/AN8/INT2/VMO RB3/AN9/CCP2 RB4/AN11/KBI0 RB5/KBI1/PGM RB6/KBI2/PGC RB7/KBI3/PGD
PORTC
8
8
8
PORTE
RC0/T1OSO/T13CKI RC1/T1OSI/CCP2 RC2/CCP1 RC4/D-/VM RC5/D+/VP RC6/TX/CK RC7/RX/DT/SDO
MCLR/VPP/RE3
(3)
/VPO
(3)
(1)
/UOE
BOR
HLVD
Comparator
Note 1: RE3 is multiplexed with MCLR and is only available when the MCLR Resets are disabled.
2: OSC1/CLKI and OSC2/CLKO are only available in select oscillator modes and when these pins are not being used as digital I/O. 3: RB3 is the alternate pin for CCP2 multiplexing.
Data
EEPROM
CCP1
CCP2
MSSP
Timer2Timer1 Timer3Timer0
EUSART
ADC
12-Bit
USB
© 2007 Microchip Technology Inc. Preliminary DS39887B-page 7
PIC18F2458/2553/4458/4553

FIGURE 1-2: PIC18F4458/4553(40/44-PIN) BLOCK DIAGRAM

Table Pointer<21>
inc/dec logic
21
Address Latch
Program Memory
(24/32 Kbytes)
Data Latch
20
8
PCLATH
PCLATU
PCU
Program Counter
31 Level Stack
STKPTR
Table Latch
Data Bus<8>
8
PCH PCL
8
Data Latch
Data Memory
(2 Kbytes)
Address Latch
12
Data Address<12>
12
44
BSR
FSR0 FSR1 FSR2
inc/dec
logic
Access
Bank
12
PORTA
PORTB
RA0/AN0 RA1/AN1 RA2/AN2/VREF-/CVREF RA3/AN3/VREF+ RA4/T0CKI/C1OUT/RCV RA5/AN4/SS/HLVDIN/C2OUT OSC2/CLKO/RA6
RB0/AN12/INT0/FLT0/SDI/SDA RB1/AN10/INT1/SCK/SCL RB2/AN8/INT2/VMO RB3/AN9/CCP2
(4)
/VPO RB4/AN11/KBI0/CSSPP RB5/KBI1/PGM RB6/KBI2/PGC RB7/KBI3/PGD
Instruction Bus <16>
VDD, VSS
(2)
OSC1
(2)
OSC2
T1OSI
T1OSO
(3)
ICPGC
(3)
ICPGD
(3)
ICPORTS
(3)
ICRST
(1)
MCLR
V
USB
ROM Latch
IR
Instruction
Decode &
Internal
Oscillator
Block
INTRC
Oscillator
8 MHz
Oscillator
Single-Supply
Programming
In-Circuit
Debugger
Control
USB Voltage
Regulator
State Machine Control Signals
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
Brown-out
Reset
Fail-Safe
Clock Monitor
3
BITOP
8
Band Gap
Reference
Address Decode
8 x 8 Multiply
8
ALU<8>
PORTC
RC0/T1OSO/T13CKI RC1/T1OSI/CCP2
(4)
/UOE RC2/CCP1/P1A RC4/D-/VM RC5/D+/VP
8
RC6/TX/CK RC7/RX/DT/SDO
PRODLPRODH
PORTD
8
W
8
8
RD0/SPP0:RD4/SPP4 RD5/SPP5/P1B RD6/SPP6/P1C RD7/SPP7/P1D
8
8
PORTE
RE0/AN5/CK1SPP RE1/AN6/CK2SPP RE2/AN7/OESPP MCLR/VPP/RE3
(1)
BOR
HLVD
Comparator
Note 1: RE3 is multiplexed with MCLR
Data
EEPROM
ECCP1
Timer2Timer1 Timer3Timer0
CCP2
MSSP
EUSART
ADC
12-Bit
and is only available when the MCLR Resets are disabled.
USB
2: OSC1/CLKI and OSC2/CLKO are only available in select oscillator modes and when these pins are not being used as digital I/O. 3: These pins are only available on 44-pin TQFP packages under certain conditions. 4: RB3 is the alternate pin for CCP2 multiplexing.
DS39887B-page 8 Preliminary © 2007 Microchip Technology Inc.
PIC18F2458/2553/4458/4553

TABLE 1-2: PIC18F2458/2553 PINOUT I/O DESCRIPTIONS

Pin
Pin Name
M
CLR/VPP/RE3
MCLR
VPP RE3
OSC1/CLKI
OSC1 CLKI
OSC2/CLKO/RA6
OSC2
CLKO
RA6
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set.
Number
SPDIP,
SOIC
10
Pin
Buffer
Type
1
9
Type
I
ST
P
I
ST
IIAnalog
Analog
O
O
I/O
TTL
Master Clear (input) or programming voltage (input).
Master Clear (Reset) input. This pin is an active-low Reset to the device. Programming voltage input. Digital input.
Oscillator crystal or external clock input.
Oscillator crystal input or external clock source input. External clock source input. Always associated with pin function OSC1. (See OSC2/CLKO pin.)
Oscillator crystal or clock output.
Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. In select modes, OSC2 pin outputs CLKO which has 1/4 the frequency of OSC1 and denotes the instruction cycle rate. General purpose I/O pin.
Description
© 2007 Microchip Technology Inc. Preliminary DS39887B-page 9
PIC18F2458/2553/4458/4553
TABLE 1-2: PIC18F2458/2553 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin
Pin Name
RA0/AN0
RA0 AN0
RA1/AN1
RA1 AN1
RA2/AN2/VREF-/CVREF
RA2 AN2 VREF-
REF
CV
RA3/AN3/V
RA3 AN3 V
RA4/T0CKI/C1OUT/RCV
RA4 T0CKI C1OUT RCV
RA5/AN4/SS HLVDIN/C2OUT
RA5 AN4 SS HLVDIN C2OUT
RA6 See the OSC2/CLKO/RA6 pin.
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
REF+
REF+
/
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
2: Default assignment for CCP2 when CCP2MX Configuration bit is set.
Number
SPDIP,
SOIC
Pin
Buffer
Type
2
3
4
5
6
7
Type
I/OITTL
Analog
I/OITTL
Analog
I/O
I/O
I/O
I/O
TTL
I
Analog
I
Analog
O
Analog
TTL
I
Analog
I
Analog
ST
I
ST
O
I
I I I
O
TTL
TTL
Analog
TTL
Analog
PORTA is a bidirectional I/O port.
Digital I/O. Analog input 0.
Digital I/O. Analog input 1.
Digital I/O. Analog input 2. A/D reference voltage (low) input. Analog comparator reference output.
Digital I/O. Analog input 3. A/D reference voltage (high) input.
Digital I/O. Timer0 external clock input. Comparator 1 output. External USB transceiver RCV input.
Digital I/O. Analog input 4. SPI slave select input. High/Low-Voltage Detect input. Comparator 2 output.
Description
DS39887B-page 10 Preliminary © 2007 Microchip Technology Inc.
PIC18F2458/2553/4458/4553
TABLE 1-2: PIC18F2458/2553 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin
Pin Name
RB0/AN12/INT0/FLT0/ SDI/SDA
RB0 AN12 INT0 FLT0 SDI SDA
RB1/AN10/INT1/SCK/ SCL
RB1 AN10 INT1 SCK SCL
RB2/AN8/INT2/VMO
RB2 AN8 INT2 VMO
RB3/AN9/CCP2/VPO
RB3 AN9
(1)
CCP2 VPO
RB4/AN11/KBI0
RB4 AN11 KBI0
RB5/KBI1/PGM
RB5 KBI1 PGM
RB6/KBI2/PGC
RB6 KBI2 PGC
RB7/KBI3/PGD
RB7 KBI3 PGD
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set.
Number
SPDIP,
SOIC
21
22
23
24
25
26
27
28
Pin
Type
I/O
I I I I
I/O
I/O
I
I I/O I/O
I/O
I
I
O
I/O
I I/O
O
I/O
I
I
I/O
I I/O
I/O
I I/O
I/O
I I/O
Buffer
Type
TTL
Analog
ST ST ST ST
TTL
Analog
ST ST ST
TTL
Analog
ST
TTL
Analog
ST
TTL
Analog
TTL
TTL TTL
ST
TTL TTL
ST
TTL TTL
ST
Description
PORTB is a bidirectional I/O port. PORTB can be software programmed for internal weak pull-ups on all inputs.
Digital I/O. Analog input 12. External interrupt 0. PWM Fault input (CCP1 module). SPI data in.
2
C™ data I/O.
I
Digital I/O. Analog input 10. External interrupt 1. Synchronous serial clock input/output for SPI mode. Synchronous serial clock input/output for I
Digital I/O. Analog input 8. External interrupt 2. External USB transceiver VMO output.
Digital I/O. Analog input 9. Capture 2 input/Compare 2 output/PWM 2 output. External USB transceiver VPO output.
Digital I/O. Analog input 11. Interrupt-on-change pin.
Digital I/O. Interrupt-on-change pin. Low-Voltage ICSP™ Programming enable pin.
Digital I/O. Interrupt-on-change pin. In-Circuit Debugger and ICSP programming clock pin.
Digital I/O. Interrupt-on-change pin. In-Circuit Debugger and ICSP programming data pin.
2
C mode.
© 2007 Microchip Technology Inc. Preliminary DS39887B-page 11
PIC18F2458/2553/4458/4553
TABLE 1-2: PIC18F2458/2553 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin
Pin Name
RC0/T1OSO/T13CKI
RC0 T1OSO T13CKI
RC1/T1OSI/CCP2/UOE
RC1 T1OSI
(2)
CCP2 UOE
RC2/CCP1
RC2 CCP1
RC4/D-/VM
RC4 D­VM
RC5/D+/VP
RC5 D+ VP
RC6/TX/CK
RC6 TX CK
RC7/RX/DT/SDO
RC7 RX DT SDO
RE3 See MCLR
V
USB 14
V
SS 8, 19 P Ground reference for logic and I/O pins.
V
DD 20 P Positive supply for logic and I/O pins.
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set.
Number
SPDIP,
SOIC
11
12
13
15
16
17
18
Pin
Type
I/O
O
I
I/O
I
I/O
I/O I/O
I
I/O
I
I
I/O
O
I/O
O
I/O
I/O
I
I/O
O
O
P
Buffer
Type
ST
ST
ST
CMOS
ST
ST ST
TTL
TTL
TTL
TTL
ST
ST
ST ST ST
Description
PORTC is a bidirectional I/O port.
Digital I/O. Timer1 oscillator output. Timer1/Timer3 external clock input.
Digital I/O. Timer1 oscillator input. Capture 2 input/Compare 2 output/PWM2 output. External USB transceiver OE
Digital I/O. Capture 1 input/Compare 1 output/PWM1 output.
Digital input. USB differential minus line (input/output). External USB transceiver VM input.
Digital input. USB differential plus line (input/output). External USB transceiver VP input.
Digital I/O. EUSART asynchronous transmit. EUSART synchronous clock (see RX/DT).
Digital I/O. EUSART asynchronous receive. EUSART synchronous data (see TX/CK). SPI data out.
/VPP/RE3 pin.
Internal USB transceiver power supply.
When the internal USB regulator is enabled, V regulator output. When the internal USB regulator is disabled, V power input for the USB transceiver.
output.
USB is the
USB is the
DS39887B-page 12 Preliminary © 2007 Microchip Technology Inc.
PIC18F2458/2553/4458/4553

TABLE 1-3: PIC18F4458/4553 PINOUT I/O DESCRIPTIONS

Pin Name
Pin Number
PDIP QFN TQFP
Pin
Type
Buffer
Type
Description
/VPP/RE3
MCLR
MCLR
VPP RE3
OSC1/CLKI
OSC1 CLKI
OSC2/CLKO/RA6
OSC2
CLKO
RA6
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set. 3: These pins are No Connect unless the ICPRT Configuration bit is set. For NC/ICPORTS, the pin is No
Connect unless ICPRT is set and the DEBUG
11818
13 32 30
14 33 31
I
ST
P
I
ST
IIAnalog
Analog
O
O
I/O
TTL
Configuration bit is cleared.
Master Clear (input) or programming voltage (input).
Master Clear (Reset) input. This pin is an active-low Reset to the device. Programming voltage input. Digital input.
Oscillator crystal or external clock input.
Oscillator crystal input or external clock source input. External clock source input. Always associated with pin function OSC1. (See OSC2/CLKO pin.)
Oscillator crystal or clock output.
Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. In RC mode, OSC2 pin outputs CLKO which has 1/4 the frequency of OSC1 and denotes the instruction cycle rate. General purpose I/O pin.
© 2007 Microchip Technology Inc. Preliminary DS39887B-page 13
PIC18F2458/2553/4458/4553
TABLE 1-3: PIC18F4458/4553 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
RA0/AN0
RA0 AN0
RA1/AN1
RA1 AN1
RA2/AN2/VREF-/ CV
REF
RA2 AN2
REF-
V
REF
CV
RA3/AN3/V
RA3 AN3 V
RA4/T0CKI/C1OUT/ RCV
RA4 T0CKI C1OUT RCV
RA5/AN4/SS HLVDIN/C2OUT
RA5 AN4 SS HLVDIN C2OUT
RA6 See the OSC2/CLKO/RA6 pin.
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
REF+
REF+
/
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
2: Default assignment for CCP2 when CCP2MX Configuration bit is set. 3: These pins are No Connect unless the ICPRT Configuration bit is set. For NC/ICPORTS, the pin is No
Connect unless ICPRT is set and the DEBUG
Pin Number
PDIP QFN TQFP
21919
32020
42121
52222
62323
72424
Pin
Buffer
Type
Type
I/OITTL
Analog
I/OITTL
Analog
I/O
I
Analog
I
Analog
O
Analog
I/O
I
Analog
I
Analog
I/O
I
O
I
I/O
I
Analog I I
Analog
O
PORTA is a bidirectional I/O port.
Digital I/O. Analog input 0.
Digital I/O. Analog input 1.
TTL
TTL
ST ST
TTL
TTL
TTL
Configuration bit is cleared.
Digital I/O. Analog input 2. A/D reference voltage (low) input. Analog comparator reference output.
Digital I/O. Analog input 3. A/D reference voltage (high) input.
Digital I/O. Timer0 external clock input. Comparator 1 output. External USB transceiver RCV input.
Digital I/O. Analog input 4. SPI slave select input. High/Low-Voltage Detect input. Comparator 2 output.
Description
DS39887B-page 14 Preliminary © 2007 Microchip Technology Inc.
PIC18F2458/2553/4458/4553
TABLE 1-3: PIC18F4458/4553 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
RB0/AN12/INT0/ FLT0/SDI/SDA
RB0 AN12 INT0 FLT0 SDI SDA
RB1/AN10/INT1/SCK/ SCL
RB1 AN10 INT1 SCK SCL
RB2/AN8/INT2/VMO
RB2 AN8 INT2 VMO
RB3/AN9/CCP2/VPO
RB3 AN9
(1)
CCP2 VPO
RB4/AN11/KBI0/CSSPP
RB4 AN11 KBI0 CSSPP
RB5/KBI1/PGM
RB5 KBI1 PGM
RB6/KBI2/PGC
RB6 KBI2 PGC
RB7/KBI3/PGD
RB7 KBI3 PGD
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set. 3: These pins are No Connect unless the ICPRT Configuration bit is set. For NC/ICPORTS, the pin is No
Connect unless ICPRT is set and the DEBUG
Pin Number
PDIP QFN TQFP
33 9 8
34 10 9
35 11 10
36 12 11
37 14 14
38 15 15
39 16 16
40 17 17
Pin
Type
I/O
I I I I
I/O
I/O
I
I I/O I/O
I/O
I
I
O
I/O
I I/O
O
I/O
I
I
O
I/O
I I/O
I/O
I I/O
I/O
I I/O
Buffer
Type
PORTB is a bidirectional I/O port. PORTB can be soft­ware programmed for internal weak pull-ups on all inputs.
TTL
Analog
ST ST ST ST
TTL
Analog
ST ST ST
TTL
Analog
ST
TTL
Analog
ST
TTL
Analog
TTL
TTL TTL
ST
TTL TTL
ST
TTL TTL
ST
Configuration bit is cleared.
Digital I/O. Analog input 12. External interrupt 0. Enhanced PWM Fault input (ECCP1 module). SPI data in.
2
C™ data I/O.
I
Digital I/O. Analog input 10. External interrupt 1. Synchronous serial clock input/output for SPI mode. Synchronous serial clock input/output for I
Digital I/O. Analog input 8. External interrupt 2. External USB transceiver VMO output.
Digital I/O. Analog input 9. Capture 2 input/Compare 2 output/PWM 2 output. External USB transceiver VPO output.
Digital I/O. Analog input 11. Interrupt-on-change pin. SPP chip select control output.
Digital I/O. Interrupt-on-change pin. Low-Voltage ICSP™ Programming enable pin.
Digital I/O. Interrupt-on-change pin. In-Circuit Debugger and ICSP programming clock pin.
Digital I/O. Interrupt-on-change pin. In-Circuit Debugger and ICSP programming data pin.
Description
2
C mode.
© 2007 Microchip Technology Inc. Preliminary DS39887B-page 15
PIC18F2458/2553/4458/4553
TABLE 1-3: PIC18F4458/4553 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
RC0/T1OSO/T13CKI
RC0 T1OSO T13CKI
RC1/T1OSI/CCP2/ UOE
RC1 T1OSI
(2)
CCP2 UOE
RC2/CCP1/P1A
RC2 CCP1 P1A
RC4/D-/VM
RC4 D­VM
RC5/D+/VP
RC5 D+ VP
RC6/TX/CK
RC6 TX CK
RC7/RX/DT/SDO
RC7 RX DT SDO
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set. 3: These pins are No Connect unless the ICPRT Configuration bit is set. For NC/ICPORTS, the pin is No
Connect unless ICPRT is set and the DEBUG
Pin Number
PDIP QFN TQFP
15 34 32
16 35 35
17 36 36
23 42 42
24 43 43
25 44 44
26 1 1
Pin
Type
I/O
O
I
I/O
I
I/O
O
I/O I/O
O
I
I/O
I
I
I/O
I
I/O
O
I/O
I/O
I
I/O
O
Buffer
Type
PORTC is a bidirectional I/O port.
ST
ST
ST
CMOS
ST
ST ST
TTL
TTL
TTL
TTL
TTL
ST
ST
ST ST ST
Configuration bit is cleared.
Digital I/O. Timer1 oscillator output. Timer1/Timer3 external clock input.
Digital I/O. Timer1 oscillator input. Capture 2 input/Compare 2 output/PWM2 output. External USB transceiver OE output.
Digital I/O. Capture 1 input/Compare 1 output/PWM1 output. Enhanced CCP1 PWM output, channel A.
Digital input. USB differential minus line (input/output). External USB transceiver VM input.
Digital input. USB differential plus line (input/output). External USB transceiver VP input.
Digital I/O. EUSART asynchronous transmit. EUSART synchronous clock (see RX/DT).
Digital I/O. EUSART asynchronous receive. EUSART synchronous data (see TX/CK). SPI data out.
Description
DS39887B-page 16 Preliminary © 2007 Microchip Technology Inc.
PIC18F2458/2553/4458/4553
TABLE 1-3: PIC18F4458/4553 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
RD0/SPP0
RD0 SPP0
RD1/SPP1
RD1 SPP1
RD2/SPP2
RD2 SPP2
RD3/SPP3
RD3 SPP3
RD4/SPP4
RD4 SPP4
RD5/SPP5/P1B
RD5 SPP5 P1B
RD6/SPP6/P1C
RD6 SPP6 P1C
RD7/SPP7/P1D
RD7 SPP7 P1D
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set. 3: These pins are No Connect unless the ICPRT Configuration bit is set. For NC/ICPORTS, the pin is No
Connect unless ICPRT is set and the DEBUG
Pin Number
PDIP QFN TQFP
19 38 38
20 39 39
21 40 40
22 41 41
27 2 2
28 3 3
29 4 4
30 5 5
Pin
Buffer
Type
Type
I/O I/OSTTTL
I/O I/OSTTTL
I/O I/OSTTTL
I/O I/OSTTTL
I/O I/OSTTTL
I/O I/O
O
I/O I/O
O
I/O I/O
O
Description
PORTD is a bidirectional I/O port or a Streaming Parallel Port (SPP). PORTD can be software programmed for internal weak pull-ups on all inputs. These pins have TTL input buffers when the SPP module is enabled.
Digital I/O. Streaming Parallel Port data.
Digital I/O. Streaming Parallel Port data.
Digital I/O. Streaming Parallel Port data.
Digital I/O. Streaming Parallel Port data.
Digital I/O. Streaming Parallel Port data.
ST
TTL
ST
TTL
ST
TTL
Configuration bit is cleared.
Digital I/O. Streaming Parallel Port data. ECCP1 PWM output, channel B.
Digital I/O. Streaming Parallel Port data. ECCP1 PWM output, channel C.
Digital I/O. Streaming Parallel Port data. ECCP1 PWM output, channel D.
© 2007 Microchip Technology Inc. Preliminary DS39887B-page 17
PIC18F2458/2553/4458/4553
TABLE 1-3: PIC18F4458/4553 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
Pin Number
PDIP QFN TQFP
RE0/AN5/CK1SPP
82525 RE0 AN5 CK1SPP
RE1/AN6/CK2SPP
92626 RE1 AN6 CK2SPP
RE2/AN7/OESPP
10 27 27 RE2 AN7 OESPP
RE3 See MCLR
VSS 12, 316, 30, 316, 29 P Ground reference for logic and I/O pins.
V
DD 11, 32 7, 8,
7, 28 P Positive supply for logic and I/O pins.
28, 29
V
USB 18 37 37
NC/ICCK/ICPGC
(3)
——12 ICCK ICPGC
NC/ICDT/ICPGD
(3)
——13 ICDT ICPGD
NC/ICRST
/ICVPP
——33
(3)
ICRST ICVPP
NC/ICPORTS
(3)
34 P No Connect or 28-pin device emulation. ICPORTS
NC 13 No Connect.
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
Note 1: Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared.
2: Default assignment for CCP2 when CCP2MX Configuration bit is set. 3: These pins are No Connect unless the ICPRT Configuration bit is set. For NC/ICPORTS, the pin is No
Connect unless ICPRT is set and the DEBUG
Pin
Buffer
Type
I/O
I
Analog
O
I/O
I
Analog
O
I/O
I
Analog
O
O
P
I/O I/OSTST
I/O I/OSTST
I
P
Type
Description
PORTE is a bidirectional I/O port.
ST
Digital I/O. Analog input 5.
ST
SPP clock 1 output.
Digital I/O. Analog input 6.
ST
SPP clock 2 output.
Digital I/O. Analog input 7.
SPP output enable output.
/VPP/RE3 pin.
Internal USB transceiver power supply.
When the internal USB regulator is enabled, V the regulator output.
When the internal USB regulator is disabled, VUSB is the power input for the USB transceiver.
No Connect or dedicated ICD/ICSP™ port clock.
In-Circuit Debugger clock. ICSP programming clock.
No Connect or dedicated ICD/ICSP port clock.
In-Circuit Debugger data. ICSP programming data.
No Connect or dedicated ICD/ICSP port Reset. — —
Master Clear (Reset) input. Programming voltage input.
Enable 28-pin device emulation when connected to V
SS.
Configuration bit is cleared.
USB is
DS39887B-page 18 Preliminary © 2007 Microchip Technology Inc.
PIC18F2458/2553/4458/4553

2.0 12-BIT ANALOG-TO-DIGITAL CONVERTER (A/D) MODULE

The Analog-to-Digital (A/D) Converter module has 10 inputs for the 28-pin devices and 13 for the 40-pin and 44-pin devices. This module allows conversion of an analog input signal to a corresponding 12-bit digital number.
The module has five registers:
• A/D Result High Register (ADRESH)
• A/D Result Low Register (ADRESL)
• A/D Control Register 0 (ADCON0)
• A/D Control Register 1 (ADCON1)
• A/D Control Register 2 (ADCON2)
The ADCON0 register, shown in Register 2-1, controls the operation of the A/D module. The ADCON1 register, shown in Register 2-2, configures the functions of the port pins. The ADCON2 register, shown in Register 2-3, configures the A/D clock source, programmed acquisition time and justification.

REGISTER 2-1: ADCON0: A/D CONTROL REGISTER 0

U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CHS3 CHS2 CHS1 CHS0 GO/DONE ADON
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0’
bit 5-2 CHS3:CHS0: Analog Channel Select bits
0000 = Channel 0 (AN0) 0001 = Channel 1 (AN1) 0010 = Channel 2 (AN2) 0011 = Channel 3 (AN3) 0100 = Channel 4 (AN4) 0101 = Channel 5 (AN5) 0110 = Channel 6 (AN6) 0111 = Channel 7 (AN7) 1000 = Channel 8 (AN8) 1001 = Channel 9 (AN9) 1010 = Channel 10 (AN10) 1011 = Channel 11 (AN11) 1100 = Channel 12 (AN12 1101 = Unimplemented 1110 = Unimplemented 1111 = Unimplemented
bit 1 GO/DONE
When ADON =
1 = A/D conversion in progress 0 = A/D Idle
bit 0 ADON: A/D On bit
1 = A/D Converter module is enabled 0 = A/D Converter module is disabled
: A/D Conversion Status bit
1:
(2)
(2)
(2)
(1,2)
(1,2)
(1,2)
Note 1: These channels are not implemented on 28-pin devices.
2: Performing a conversion on unimplemented channels will return a floating input measurement.
© 2007 Microchip Technology Inc. Preliminary DS39887B-page 19
PIC18F2458/2553/4458/4553

REGISTER 2-2: ADCON1: A/D CONTROL REGISTER 1

U-0 U-0 R/W-0 R/W-0 R/W-0 R/W
(1)
VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0’
bit 5 VCFG1: Voltage Reference Configuration bit (V
1 = V
REF- (AN2)
0 = V
SS
REF- source)
bit 4 VCFG0: Voltage Reference Configuration bit (VREF+ source)
REF+ (AN3)
1 = V
DD
0 = V
bit 3-0 PCFG3:PCFG0: A/D Port Configuration Control bits:
(2)
(2)
AN6
(2)
AN5
AN4
AN3
PCFG3:
PCFG0
(1)
0000
AN12
AN11
AN10
AN9
AN8
AN7
A A AAAAAAAAAAA
0001 AA A AAAAAAAAAA 0010 AA A AAAAAAAAAA 0011 DA AAAAAAAAAAA 0100 DDAAAAAAAAAAA 0101 DDDAAAAAAAAAA 0110 DDDDAAAAAAAAA
(1)
0111
DDDDDAAAAAAAA
1000 DDDDDDAAAAAAA 1001 DDDDDDDAAAAAA 1010 D D DDDDDDAAAAA 1011 D D DDDDDDDAAAA 1100 D D DDDDDDDDAAA 1101 D D DDDDDDDDDAA 1110 D D DDDDDDDDDDA 1111 D D DDDDDDDDDDD
A = Analog input D = Digital I/O
R/W
(1)
AN2
AN1
R/W
AN0
(1)
Note 1: The Reset value of the PCFG bits depends on the value of the PBADEN Configuration bit. When
PBADEN = 1, PCFG<3:0> = 0000; when PBADEN = 0, PCFG<3:0> = 0111.
2: AN5 through AN7 are available only on 40-pin and 44-pin devices.
DS39887B-page 20 Preliminary © 2007 Microchip Technology Inc.
PIC18F2458/2553/4458/4553

REGISTER 2-3: ADCON2: A/D CONTROL REGISTER 2

R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ADFM ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 ADFM: A/D Result Format Select bit
1 = Right justified 0 = Left justified
bit 6 Unimplemented: Read as ‘0’
bit 5-3 ACQT2:ACQT0: A/D Acquisition Time Select bits
111 = 20 T 110 = 16 TAD 101 = 12 TAD 100 = 8 TAD 011 = 6 TAD 010 = 4 TAD 001 = 2 TAD 000 = 0 TAD
bit 2-0 ADCS2:ADCS0: A/D Conversion Clock Select bits
111 = FRC (clock derived from A/D RC oscillator) 110 = F 101 = F 100 = F 011 = F 010 = F 001 = F 000 = F
AD
(1)
OSC/64 OSC/16 OSC/4 RC (clock derived from A/D RC oscillator) OSC/32 OSC/8 OSC/2
(1)
(1)
Note 1: If the A/D F
RC clock source is selected, a delay of one TCY (instruction cycle) is added before the A/D
clock starts. This allows the SLEEP instruction to be executed before starting a conversion.
© 2007 Microchip Technology Inc. Preliminary DS39887B-page 21
PIC18F2458/2553/4458/4553
The analog reference voltage is software selectable to either the device’s positive and negative supply voltage (VDD and VSS), or the voltage level on the RA3/AN3/
REF+ and RA2/AN2/VREF-/CVREF pins.
V
The A/D Converter has a unique feature of being able to operate while the device is in Sleep mode. To oper­ate in Sleep, the A/D conversion clock must be derived from the A/D’s internal RC oscillator.
The output of the sample and hold is the input into the Converter, which generates the result via successive approximation.

FIGURE 2-1: A/D BLOCK DIAGRAM

V
AIN
12-Bit
A/D
Converter
Reference
Voltage
(Input Voltage)
VCFG1:VCFG0
VREF+
VREF-
A device Reset forces all registers to their Reset state. This forces the A/D module to be turned off and any conversion in progress is aborted.
Each port pin associated with the A/D Converter can be configured as an analog input or as a digital I/O. The ADRESH and ADRESL registers contain the result of the A/D conversion. When the A/D conversion is com­plete, the result is loaded into the ADRESH:ADRESL register pair, the GO/DONE
bit (ADCON0 register) is cleared and the A/D Interrupt Flag bit, ADIF, is set. The block diagram of the A/D module is shown in Figure 2-1.
CHS3:CHS0
1100
1011
1010
1001
1000
0111
AN12
AN11
AN10
AN9
AN8
AN7
0110
AN6
0101
AN5
X0 X1
0100
0011
0010
0001
DD
V
0000
AN4
AN3
AN2
AN1
AN0
1X 0X
(1)
(1)
(1)
VSS
Note 1: Channels AN5 through AN7 are not available on 28-pin devices.
DS39887B-page 22 Preliminary © 2007 Microchip Technology Inc.
PIC18F2458/2553/4458/4553
The value in the ADRESH:ADRESL registers is unknown following Power-on and Brown-out Resets, and is not affected by any other Reset.
After the A/D module has been configured as desired, the selected channel must be acquired before the conversion is started. The analog input channels must have their corresponding TRIS bits selected as an input. To determine acquisition time, see Section 2.1 “A/D Acquisition Requirements”. After this acquisi­tion time has elapsed, the A/D conversion can be started. An acquisition time can be programmed to occur between setting the GO/DONE
bit and the actual
start of the conversion.
The following steps should be followed to perform an A/D conversion:
1. Configure the A/D module:
• Configure analog pins, voltage reference and digital I/O (ADCON1)
• Select A/D input channel (ADCON0)
• Select A/D acquisition time (ADCON2)
• Select A/D conversion clock (ADCON2)
• Turn on A/D module (ADCON0)
2. Configure A/D interrupt (if desired):
• Clear ADIF bit
• Set ADIE bit
• Set GIE bit
3. Wait the required acquisition time (if required).
4. Start conversion:
• Set GO/DONE
bit (ADCON0 register)
5. Wait for A/D conversion to complete, by either:
• Polling for the GO/DONE
bit to be cleared
OR
• Waiting for the A/D interrupt
6. Read A/D Result registers (ADRESH:ADRESL); clear bit ADIF, if required.
7. For next conversion, go to step 1 or step 2, as required. The A/D conversion time per bit is defined as T
AD. A minimum wait of 2 TAD is
required before the next acquisition starts.

FIGURE 2-2: A/D TRANSFER FUNCTION

FFFh
FFEh
003h
002h
Digital Code Output
001h
000h
1 LSB
0.5 LSB
1.5 LSB
Analog Input Voltage
3 LSB
2 LSB
2.5 LSB 4095 LSB
4094 LSB
4094.5 LSB
4095.5 LSB

FIGURE 2-3: ANALOG INPUT MODEL

VDD
T = 0.6V
ANx
Rs
VAIN
Legend: CPIN
VT ILEAKAGE
RIC SS C
HOLD
CPIN 5 pF
= Input Capacitance
= Threshold Voltage = Leakage Current at the pin due to
various junctions = Interconnect Resistance = Sampling Switch = Sample/Hold Capacitance (from DAC) = Sampling Switch ResistanceRSS
V
V
T = 0.6V
RIC 1k
I
LEAKAGE
±100 nA
Sampling
Switch
SS
6V 5V 4V
VDD
3V 2V
R
SS
Sampling Switch
CHOLD = 25 pF
V
SS
1234
(kΩ)
© 2007 Microchip Technology Inc. Preliminary DS39887B-page 23
PIC18F2458/2553/4458/4553

2.1 A/D Acquisition Requirements

For the A/D Converter to meet its specified accuracy, the charge holding capacitor (C to fully charge to the input channel voltage level. The analog input model is shown in Figure 2-3. The source impedance (R
S) and the internal sampling switch (RSS)
impedance directly affect the time required to charge the capacitor CHOLD. The sampling switch (RSS) impedance varies over the device voltage (V source impedance affects the offset voltage at the ana­log input (due to pin leakage current). The maximum
recommended impedance for analog sources is
2.5 kΩ. After the analog input channel is selected
(changed), the channel must be sampled for at least
HOLD) must be allowed
DD). The
To calculate the minimum acquisition time, Equation 2-1 may be used. This equation assumes that 1/2 LSb error is used (4096 steps for the 12-bit A/D). The 1/2 LSb error is the maximum error allowed for the A/D to meet its specified resolution.
Example 2-3 shows the calculation of the minimum required acquisition time, T based on the following application system assumptions:
HOLD = 25 pF
C Rs = 2.5 kΩ Conversion Error 1/2 LSb
DD =3V → Rss = 4 kΩ
V Temperature = 85°C (system max.)
the minimum acquisition time before starting a conversion.
Note: When the conversion is started, the
holding capacitor is disconnected from the input pin.

EQUATION 2-1: ACQUISITION TIME

TACQ = Amplifier Settling Time + Holding Capacitor Charging Time + Temperature Coefficient
AMP + TC + TCOFF
=T
ACQ. This calculation is

EQUATION 2-2: A/D MINIMUM CHARGING TIME

VHOLD = (VREF – (VREF/4096)) • (1 – e or TC = -(CHOLD)(RIC + RSS + RS) ln(1/4096)
(-TC/CHOLD(RIC + RSS + RS))
)

EQUATION 2-3: CALCULATING THE MINIMUM REQUIRED ACQUISITION TIME

TACQ =TAMP + TC + TCOFF
TAMP =0.2 µs
COFF = (Temp – 25°C)(0.02 µs/°C)
T
(85°C – 25°C)(0.02 µs/°C)
1.2 µs
Temperature coefficient is only required for temperatures > 25°C. Below 25°C, T
C = -(CHOLD)(RIC + RSS + RS) ln(1/4096) µs
T
-(25 pF) (1 kΩ + 4 kΩ + 2.5 kΩ) ln(0.0002441) µs
1.56 µs
ACQ = 0.2 µs + 1.56 μs + 1.2 µs
T
2.96 µs
COFF = 0 µs.
DS39887B-page 24 Preliminary © 2007 Microchip Technology Inc.
PIC18F2458/2553/4458/4553

2.2 Selecting and Configuring Acquisition Time

The ADCON2 register allows the user to select an acquisition time that occurs each time the GO/DONE bit is set. It also gives users the option to use an automatically determined acquisition time.
Acquisition time may be set with the ACQT2:ACQT0 bits (ADCON2<5:3>), which provides a range of 2 to
AD. When the GO/DONE bit is set, the A/D module
20 T continues to sample the input for the selected acquisi­tion time, then automatically begins a conversion. Since the acquisition time is programmed, there may be no need to wait for an acquisition time between selecting a channel and setting the GO/DONE
Manual acquisition is selected when ACQT2:ACQT0 = 000. When the GO/DONE sampling is stopped and a conversion begins. The user is responsible for ensuring the required acquisition time has passed between selecting the desired input channel and setting the GO/DONE
bit. This option is also the default Reset state of the ACQT2:ACQT0 bits and is compatible with devices that do not offer programmable acquisition times.
In either case, when the conversion is completed, the GO/DONE
bit is cleared, the ADIF flag is set and the A/D begins sampling the currently selected channel again. If an acquisition time is programmed, there is nothing to indicate if the acquisition time has ended or if the conversion has begun.
bit.
bit is set,

2.3 Selecting the A/D Conversion Clock

The A/D conversion time per bit is defined as TAD. The A/D conversion requires 13 T The source of the A/D conversion clock is software selectable. There are seven possible options for T
OSC
•2 T
•4 TOSC
•8 TOSC
•16 TOSC
•32 TOSC
•64 TOSC
• Internal RC Oscillator
For correct A/D conversions, the A/D conversion clock
AD) must be as short as possible, but greater than the
(T minimum T
AD (see parameter 130 for more
information).
Table 2-1 shows the resultant T the device operating frequencies and the A/D clock source selected.
AD per 12-bit conversion.
AD:
AD times derived from

TABLE 2-1: TAD vs. DEVICE OPERATING FREQUENCIES

A/D Clock Source (TAD)
Operation ADCS2:ADCS0 Maximum F
2 TOSC 000 2.50 MHz
4 TOSC 100 5.00 MHz
OSC 001 10.00 MHz
8 T
16 TOSC 101 20.00 MHz
32 T
OSC 010 40.00 MHz
OSC 110 48.00 MHz
64 T
(1)
RC
x11 1.00 MHz
Note 1: The RC source has a typical TAD time of 2.5 μs.
2: For device frequencies above 1 MHz, the device must be in Sleep for the entire conversion or a F
divider should be used instead; otherwise, the A/D accuracy specification may not be met.
Assumes T
AD Min. = 0.8 μs
OSC
(2)
OSC
© 2007 Microchip Technology Inc. Preliminary DS39887B-page 25
PIC18F2458/2553/4458/4553

2.4 Operation in Power-Managed Modes

The selection of the automatic acquisition time and A/D conversion clock is determined in part by the clock source and frequency while in a power-managed mode.
If the A/D is expected to operate while the device is in a power-managed mode, the ADCS2:ADCS0 bits in ADCON2 should be updated in accordance with the clock source to be used. The ACQT2:ACQT0 bits do not need to be adjusted as the ADCS2:ADCS0 bits adjust the T entering the mode, an A/D acquisition or conversion may be started. Once started, the device should continue to be clocked by the same clock source until the conversion has been completed.
If desired, the device may be placed into the corresponding Idle mode during the conversion. If the device clock frequency is less than 1 MHz, the A/D RC clock source should be selected.
Operation in Sleep mode requires the A/D F be selected. If bits ACQT2:ACQT0 are set to ‘000’ and a conversion is started, the conversion will be delayed one instruction cycle to allow execution of the SLEEP instruction and entry to Sleep mode. The IDLEN bit (OSCCON<7>) must have already been cleared prior to starting the conversion.
AD time for the new clock speed. After
RC clock to

2.5 Configuring Analog Port Pins

The ADCON1, TRISA, TRISB and TRISE registers all configure the A/D port pins. The port pins needed as analog inputs must have their corresponding TRIS bits set (input). If the TRIS bit is cleared (output), the digital output level (V
The A/D operation is independent of the state of the CHS3:CHS0 bits and the TRIS bits.
Note 1: When reading the PORT register, all pins
OH or VOL) will be converted.
configured as analog input channels will read as cleared (a low level). Analog con­version on pins configured as digital pins can be performed. The voltage on the pin will be accurately converted.
2: Analog levels on any pin defined as a dig-
ital input may cause the digital input buffer to consume current out of the device’s specification limits.
3: The PBADEN bit in Configuration
Register 3H configures PORTB pins to reset as analog or digital pins by control­ling how the PCFG3:PCFG0 bits in ADCON1 are reset.
DS39887B-page 26 Preliminary © 2007 Microchip Technology Inc.
PIC18F2458/2553/4458/4553

2.6 A/D Conversions

Figure 2-4 shows the operation of the A/D Converter after the GO/DONE ACQT2:ACQT0 bits are cleared. A conversion is started after the following instruction to allow entry into Sleep mode before the conversion begins.
Figure 2-5 shows the operation of the A/D Converter after the GO/DONE ACQT2:ACQT0 bits are set to ‘010’, and selecting a 4TAD acquisition time before the conversion starts.
Clearing the GO/DONE the current conversion. The A/D Result register pair will NOT be updated with the partially completed A/D conversion sample. This means the ADRESH:ADRESL registers will continue to contain the value of the last completed conversion (or the last value written to the ADRESH:ADRESL registers).
bit has been set and the
bit has been set and the
bit during a conversion will abort
After the A/D conversion is completed or aborted, a
CY wait is required before the next acquisition can
2T be started. After this wait, acquisition on the selected channel is automatically started.
Note: The GO/DONE bit should NOT be set in
the same instruction that turns on the A/D. Code should wait at least 2 μs after enabling the A/D before beginning an acquisition and conversion cycle.

2.7 Discharge

The discharge phase is used to initialize the value of the holding capacitor. The array is discharged before every sample. This feature helps to optimize the unity gain amplifier, as the circuit always needs to charge the capacitor array, rather than charge/discharge based on previous measure values.

FIGURE 2-4: A/D CONVERSION TAD CYCLES (ACQT<2:0> = 000, TACQ = 0)

TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD11
b11
b10
b9
b8
b7
b6
b5
TAD9 TAD10TCY – TAD
b2
b3
b4
TAD13TAD12
b0b1
TAD1
Conversion starts
Holding capacitor is disconnected from analog input (typically 100 ns)
Set GO/DONE bit
On the following cycle: ADRESH:ADRESL are loaded, GO/DONE bit is cleared, ADIF bit is set, holding capacitor is connected to analog input.
FIGURE 2-5: A/D CONVERSION T
T
ACQT Cycles
2
1
Automatic
Acquisition
Time
Set GO/DONE bit (Holding capacitor continues acquiring input)
4
3
2
1
Conversion starts
(Holding capacitor is disconnected)
AD CYCLES (ACQT<2:0> = 010, TACQ = 4 TAD)
TAD Cycles
6 7
b9
5
b8
b7 b6
3 4
b10
On the following cycle: ADRESH:ADRESL are loaded, GO/DONE bit is cleared, ADIF bit is set, holding capacitor is connected to analog input.
8 13
b5
9
b4
10 b3
11 b2
12
b1
Discharge (typically 200 ns)
TAD1
b0b11
Discharge (typically 200 ns)
© 2007 Microchip Technology Inc. Preliminary DS39887B-page 27
PIC18F2458/2553/4458/4553

2.8 Use of the CCP2 Trigger

An A/D conversion can be started by the Special Event Trigger of the CCP2 module. This requires that the CCP2M3:CCP2M0 bits (CCP2CON<3:0>) be pro­grammed as ‘1011’ and that the A/D module is enabled (ADON bit is set). When the trigger occurs, the GO/
bit will be set, starting the A/D acquisition and
DONE conversion, and the Timer1 (or Timer3) counter will be reset to zero. Timer1 (or Timer3) is reset to automatically repeat the A/D acquisition period with minimal software
the desired location). The appropriate analog input
channel must be selected and the minimum acquisition
period is either timed by the user, or an appropriate T time selected before the Special Event Trigger sets the GO/DONE
bit (starts a conversion).
If the A/D module is not enabled (ADON is cleared), the Special Event Trigger will be ignored by the A/D module, but will still reset the Timer1 (or Timer3) counter.
overhead (firmware must move ADRESH:ADRESL to

TABLE 2-2: REGISTERS ASSOCIATED WITH A/D OPERATION

Reset
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF
(1)
PIR1
SPPIF
PIE1 SPPIE
IPR1 SPPIP
PIR2
OSCFIF CMIF USBIF EEIF BCLIF HLVDIF TMR3IF CCP2IF
ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF
(1)
ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE
(1)
ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP
PIE2 OSCFIE CMIE USBIE EEIE BCLIE HLVDIE TMR3IE CCP2IE
IPR2 OSCFIP CMIP USBIP EEIP BCLIP HLVDIP TMR3IP CCP2IP
ADRESH A/D Result Register High Byte
ADRESL A/D Result Register Low Byte
ADCON0
CHS3 CHS2 CHS1 CHS0 GO/DONE ADON 19
ADCON1 VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 20
ADCON2 ADFM
PORTA —RA6
TRISA TRISA6
ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0 21
(2)
RA5 RA4 RA3 RA2 RA1 RA0
(2)
PORTA Data Direction Control Register
PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0
TRISB PORTB Data Direction Control Register
LATB PORTB Data Latch Register (Read and Write to Data Latch)
PORTE
TRISE
(1)
LATE
(1)
RDPU —RE3
(1)
TRISE2 TRISE1 TRISE0
PORTE Data Latch Register
(3)
RE2
(1)
RE1
(1)
RE0
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for A/D conversion. Note 1: These registers and/or bits are not implemented on 28-pin devices and are read as ‘0’.
2: RA6 and its associated latch and data direction bits are enabled as I/O pins based on oscillator configuration;
otherwise, they are read as ‘0’.
3: RE3 port bit is available only as an input pin when the MCLRE Configuration bit is ‘0’.
4: For these Reset values, see the “PIC18F2455/2550/4455/4550 Data Sheet”.
Values
on Page:
(1) (4)
(4)
(4)
(4)
(4)
(4)
(4)
(4)
(4)
(4)
(4)
(4)
(4)
(4)
(4)
(4)
(4)
ACQ
DS39887B-page 28 Preliminary © 2007 Microchip Technology Inc.
PIC18F2458/2553/4458/4553

3.0 SPECIAL FEATURES OF THE CPU

Note: For additional details on the Con-
figuration bits, refer to the “PIC18F2455/2550/4455/4550 Data Sheet”, Section 25.1 “Configuration Bits”. Device ID information presented in this section is for PIC18F2458/2553/4458/4553 only.
PIC18F2458/2553/4458/4553 devices include several features intended to maximize reliability and minimize cost through elimination of external components. These include:
• Device ID Registers

3.1 Device ID Registers

The Device ID registers are “read-only” registers. They identify the device type and revision to device programmers, and can be read by firmware using table reads.

TABLE 3-1: DEVICE IDs

File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
3FFFFEh DEVID1 DEV2 DEV1 DEV0 REV4 REV3 REV2 REV1 REV0 xxxx xxxx
3FFFFFh DEVID2 DEV10 DEV9 DEV8 DEV7 DEV6 DEV5 DEV4 DEV3 xxxx xxxx
Legend: x = unknown, u = unchanged Note 1: See Register 3-1 and Register 3-2 for DEVID values. DEVID registers are read-only and cannot be programmed by the
user.
Default/
Unprogrammed
Value
(1)
(1)
© 2007 Microchip Technology Inc. Preliminary DS39887B-page 29
PIC18F2458/2553/4458/4553

REGISTER 3-1: DEVID1: DEVICE ID REGISTER 1 FOR PIC18F2458/2553/4458/4553 DEVICES

RRRRRRRR
DEV2 DEV1 DEV0 REV4 REV3 REV2 REV1 REV0
bit 7 bit 0
Legend:
R = Read-only bit P = Programmable bit U = Unimplemented bit, read as ‘0’
-n = Value when device is unprogrammed u = Unchanged from programmed state
bit 7-5 DEV2:DEV0: Device ID bits
See Register 3-2 for a complete listing.
bit 4-0 REV3:REV0: Revision ID bits
These bits are used to indicate the device revision.

REGISTER 3-2: DEVID2: DEVICE ID REGISTER 2 FOR PIC18F2458/2553/4458/4553 DEVICES

RRRRRRRR
DEV10 DEV9 DEV8 DEV7 DEV6 DEV5 DEV4 DEV3
bit 7 bit 0
Legend:
R = Read-only bit P = Programmable bit U = Unimplemented bit, read as ‘0’
-n = Value when device is unprogrammed u = Unchanged from programmed state
bit 7-0 DEV10:DEV3: Device ID bits
DEV10:DEV3
(DEVID2<7:0>)
0010 1010 011 PIC18F2458
0010 1010 010 PIC18F2553
0010 1010 001 PIC18F4458
0010 1010 000 PIC18F4553
DEV2:DEV0
(DEVID1<7:5>)
Device
DS39887B-page 30 Preliminary © 2007 Microchip Technology Inc.
PIC18F2458/2553/4458/4553

4.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to V
Voltage on V
Voltage on MCLR
Total power dissipation (Note 1) ...............................................................................................................................1.0W
Maximum current out of V
Maximum current into V
Input clamp current, I
Output clamp current, I
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports ..................................................................................................................200 mA
Note 1: Power dissipation is calculated as follows:
DD with respect to VSS ......................................................................................................... -0.3V to +7.5V
with respect to VSS (Note 2)......................................................................................... 0V to +13.25V
SS pin ...........................................................................................................................300 mA
DD pin ..............................................................................................................................250 mA
IK (VI < 0 or VI > VDD)......................................................................................................................±20 mA
OK (VO < 0 or VO > VDD) ..............................................................................................................±20 mA
Pdis = V
2: Voltage spikes below V
latch-up. Thus, a series resistor of 50-100Ω should be used when applying a “low” level to the MCLR RE3 pin, rather than pulling this pin directly to V
DD x {IDD∑ IOH} + {(VDD – VOH) x IOH} + ∑(VOL x IOL)
(†)
SS (except VDD and MCLR) ................................................... -0.3V to (VDD + 0.3V)
SS at the MCLR/VPP/RE3 pin, inducing currents greater than 80 mA, may cause
/VPP/
SS.
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
© 2007 Microchip Technology Inc. Preliminary DS39887B-page 31
PIC18F2458/2553/4458/4553

FIGURE 4-1: PIC18F2458/2553/4458/4553 VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)

6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
Volta ge
3.0V
2.5V
2.0V
PIC18F2458/2553/4458/4553
4.2V
48 MHz
Frequency

FIGURE 4-2: PIC18LF2458/2553/4458/4553 VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)

6.0V
5.5V
Voltage
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
2.0V
4 MHz
PIC18LF2458/2553/4458/4553
40 MHz
Frequency
For 2.0V ≤ VDD < 4.2V: FMAX = (16.36 MHz/V) (VDDAPPMIN – 2.0V) + 4 MHz For 4.2V ≤ VDD: FMAX = 48 MHz
Note: V
DDAPPMIN is the minimum voltage of the PIC
®
device in the application.
4.2V
48 MHz
DS39887B-page 32 Preliminary © 2007 Microchip Technology Inc.
PIC18F2458/2553/4458/4553
TABLE 4-1: A/D CONVERTER CHARACTERISTICS: PIC18F2458/2553/4458/4553 (INDUSTRIAL)
PIC18LF2458/2553/4458/4553 (INDUSTRIAL)
Param
A01 N
A03 E
A04 E
A06 E
A07 E
A10 Monotonicity Guaranteed
A20 ΔVREF Reference Voltage Range
A21 V
A22 V
A25 V
A30 Z
A50 I
Note 1: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes.
Sym Characteristic Min Typ Max Units Conditions
No.
R Resolution 12 bit ΔVREF 3.0V
IL Integral Linearity Error ±1 ±2.0 LSB VDD = 3.0V ΔVREF 3.0V
——±2.0LSBV
DL Differential Linearity Error ±1 +1.5/-1.0 LSB VDD = 3.0V ΔVREF 3.0V
——+1.5/-1.0LSBV
OFF Offset Error ±1 ±5 LSB VDD = 3.0V ΔVREF 3.0V
——±3LSBV
GN Gain Error ±1 ±1.25 LSB VDD = 3.0V ΔVREF 3.0V
——±2.00LSBV
(1)
REFH – VREFL)
3—V
(V
REFH Reference Voltage High VSS + 3.0V VDD + 0.3V V For 12-bit resolution
REFL Reference Voltage Low VSS – 0.3V VDD – 3.0V V For 12-bit resolution
AIN Analog Input Voltage VREFL —VREFH V
AIN Recommended
——2.5kΩ
DD – VSS V For 12-bit resolution
DD = 5.0V
DD = 5.0V
DD = 5.0V
DD = 5.0V
—VSS VAIN VREF
Impedance of Analog Voltage Source
REF VREF Input Current
(2)
— —
— —
5
150
μA μA
During VAIN acquisition. During A/D conversion cycle.
2: V
REFH current is from the RA3/AN3/VREF+ pin or VDD, whichever is selected as the VREFH source. REFL current is from the RA2/AN2/VREF-/CVREF pin or VSS, whichever is selected as the VREFL source.
V
© 2007 Microchip Technology Inc. Preliminary DS39887B-page 33
PIC18F2458/2553/4458/4553

FIGURE 4-3: A/D CONVERSION TIMING

BSF ADCON0, GO
A/D CLK
A/D DATA
Q4
(Note 2)
(1)
132
11 1 0 9 3 2 1
. . .
131
130
. . .
0
ADRES
ADIF
GO
SAMPLE
Note 1: If the A/D clock source is selected as RC, a time of T
This allows the SLEEP instruction to be executed.
2: This is a minimal RC delay (typically 100 ns), which also disconnects the holding capacitor from the analog input.
OLD_DATA
SAMPLING STOPPED
CY is added before the A/D clock starts.
NEW_DATA
TCY
DONE

TABLE 4-2: A/D CONVERSION REQUIREMENTS

Param
130 T
131 TCNV Conversion Time
132 TACQ Acquisition Time
135 T
137 T
Note 1: The time of the A/D clock period is dependent on the device frequency and the TAD clock divider.
Symbol Characteristic Min Max Units Conditions
No.
AD A/D Clock Period PIC18FXXXX 0.8 12.5
PIC18LFXXXX 1.4 25.0
(1)
μsTOSC based, VREF 3.0V
(1)
μsVDD = 3.0V;
OSC based, VREF full range
T
PIC18FXXXX 1 μs A/D RC mode
PIC18LFXXXX 3 μsV
(not including acquisition time)
(3)
SWC Switching Time from Convert → Sample (Note 4)
DIS Discharge Time 0.2 μs
(2)
13 14 TAD
1.4 μs
DD = 3.0V; A/D RC mode
2: ADRES registers may be read on the following TCY cycle. 3: The time for the holding capacitor to acquire the “New” input voltage when the voltage changes full scale
after the conversion (V
DD to VSS or VSS to VDD). The source impedance (RS) on the input channels is 50Ω.
4: On the following cycle of the device clock.
DS39887B-page 34 Preliminary © 2007 Microchip Technology Inc.
PIC18F2458/2553/4458/4553

5.0 PACKAGING INFORMATION

For packaging information, see the “PIC18F2455/ 2550/4455/4550 Data Sheet” (DS39632).
© 2007 Microchip Technology Inc. Preliminary DS39887B-page 35
PIC18F2458/2553/4458/4553
NOTES:
DS39887B-page 36 Preliminary © 2007 Microchip Technology Inc.
PIC18F2458/2553/4458/4553

APPENDIX A: REVISION HISTORY

APPENDIX B: DEVICE
DIFFERENCES

Revision A (May 2007)

Original data sheet for the PIC18F2458/2553/4458/ 4553 devices.

Revision B (June 2007)

Changes to Figure 4-2: PIC18LF2458/2553/4458/4553 Voltage-Frequency Graph (Industrial).

TABLE B-1: DEVICE DIFFERENCES

Features PIC18F2458 PIC18F2553 PIC18F4458 PIC18F4553
Program Memory (Bytes) 24576 32768 24576 32768
Program Memory (Instructions) 12288 16384 12288 16384
Interrupt Sources 19 19 20 20
I/O Ports Ports A, B, C, (E) Ports A, B, C, (E) Ports A, B, C, D, E Ports A, B, C, D, E
Capture/Compare/PWM Modules 2 2 1 1
Enhanced Capture/Compare/ PWM Modules
Parallel Communications (SPP) No No Yes Yes
12-Bit Analog-to-Digital Module 10 Input Channels 10 Input Channels 13 Input Channels 13 Input Channels
Packages 28-Pin SPDIP
0011
28-Pin SOIC
The differences between the devices listed in this data sheet are shown in Table B-1.
28-Pin SPDIP
28-Pin SOIC
40-Pin PDIP
44-Pin TQFP
44-Pin QFN
40-Pin PDIP
44-Pin TQFP
44-Pin QFN
© 2007 Microchip Technology Inc. Preliminary DS39887B-page 37
PIC18F2458/2553/4458/4553
APPENDIX C: MIGRATION FROM
MID-RANGE TO ENHANCED DEVICES
A detailed discussion of the differences between the mid-range MCU devices (i.e., PIC16CXXX) and the enhanced devices (i.e., PIC18FXXX) is provided in
AN716, “Migrating Designs from PIC16C74A/74B to PIC18C442”. The changes discussed, while device
specific, are generally applicable to all mid-range to enhanced device migrations.
This Application Note is available as Literature Number DS00716.
APPENDIX D: MIGRATION FROM
HIGH-END TO ENHANCED DEVICES
A detailed discussion of the migration pathway and differences between the high-end MCU devices (i.e., PIC17CXXX) and the enhanced devices (i.e., PIC18FXXX) is provided in AN726, “PIC17CXXX to PIC18CXXX Migration”.
This Application Note is available as Literature Number DS00726.
DS39887B-page 38 Preliminary © 2007 Microchip Technology Inc.

INDEX

PIC18F2458/2553/4458/4553
A
A/D .....................................................................................19
A/D Converter Interrupt, Configuring ......................... 23
Acquisition Requirements ..........................................24
ADCON0 Register ...................................................... 19
ADCON1 Register ...................................................... 19
ADCON2 Register ...................................................... 19
ADRESH Register ................................................ 19, 22
ADRESL Register ......................................................19
Analog Port Pins, Configuring ....................................26
Associated Registers ................................................. 28
Calculating the Minimum Required
Acquisition Time ................................................ 24
Configuring the Module .............................................. 23
Conversion Clock (T Conversion Status (GO/DONE
Conversions ............................................................... 27
Converter Characteristics .......................................... 33
Discharge ................................................................... 27
Operation in Power-Managed Modes ........................26
Selecting and Configuring Acquisition Time .............. 25
Special Event Trigger (CCP) ......................................28
Use of the CCP2 Trigger ............................................28
Absolute Maximum Ratings ............................................... 31
ADCON0 Register ..............................................................19
GO/DONE
ADCON1 Register ..............................................................19
ADCON2 Register ..............................................................19
ADRESH Register ..............................................................19
ADRESL Register ........................................................19, 22
Analog-to-Digital Converter. See A/D.
Bit ............................................................. 22
AD) .............................................25
Bit) ............................ 22
B
Block Diagrams
A/D ............................................................................. 22
Analog Input Model .................................................... 23
PIC18F2458/2553 ........................................................ 7
PIC18F4458/4553 ........................................................ 8
C
Compare (CCP Module)
Special Event Trigger .................................................28
Configuration Bits ............................................................... 29
Customer Change Notification Service .............................. 41
Customer Notification Service ............................................41
Customer Support .............................................................. 41
D
Device Differences ............................................................. 37
Device ID Registers ........................................................... 29
Device Overview .................................................................. 5
Other Special Features ................................................ 5
E
Electrical Characteristics ....................................................31
Equations
A/D Acquisition Time .................................................. 24
A/D Minimum Charging Time ..................................... 24
Errata ...................................................................................4
I
Internet Address ................................................................. 41
Interrupt Sources
A/D Conversion Complete .........................................23
M
Microchip Internet Web Site ............................................... 41
Migration from High-End to
Enhanced Devices ..................................................... 38
Migration from Mid-Range to
Enhanced Devices ..................................................... 38
P
Packaging Information ....................................................... 35
Pin Functions
Pinout I/O Descriptions
Power-Managed Modes
/VPP/RE3 ........................................................... 9
MCLR MCLR
/VPP/RE3 ......................................................... 13
NC/ICCK/ICPGC ....................................................... 18
NC/ICDT/ICPGD ........................................................ 18
NC/ICPORTS ............................................................ 18
NC/ICRST
OSC1/CLKI ............................................................ 9, 13
OSC2/CLKO/RA6 .................................................. 9, 13
RA0/AN0 .............................................................. 10, 14
RA1/AN1 .............................................................. 10, 14
RA2/AN2/V RA3/AN3/V
RA4/T0CKI/C1OUT/RCV ..................................... 10, 14
RA5/AN4/SS
RB0/AN12/INT0/FLT0/SDI/SDA .......................... 11, 15
RB1/AN10/INT1/SCK/SCL .................................. 11, 15
RB2/AN8/INT2/VMO ............................................ 11, 15
RB3/AN9/CCP2/VPO .......................................... 11, 15
RB4/AN11/KBI0 ......................................................... 11
RB4/AN11/KBI0/CSSPP ............................................ 15
RB5/KBI1/PGM .................................................... 11, 15
RB6/KBI2/PGC .................................................... 11, 15
RB7/KBI3/PGD .................................................... 11, 15
RC0/T1OSO/T13CKI ........................................... 12, 16
RC1/T1OSI/CCP2/UOE
RC2/CCP1 ................................................................. 12
RC2/CCP1/P1A ......................................................... 16
RC4/D-/VM .......................................................... 12, 16
RC5/D+/VP .......................................................... 12, 16
RC6/TX/CK .......................................................... 12, 16
RC7/RX/DT/SDO ................................................. 12, 16
RD0/SPP0 ................................................................. 17
RD1/SPP1 ................................................................. 17
RD2/SPP2 ................................................................. 17
RD3/SPP3 ................................................................. 17
RD4/SPP4 ................................................................. 17
RD5/SPP5/P1B ......................................................... 17
RD6/SPP6/P1C ......................................................... 17
RD7/SPP7/P1D ......................................................... 17
RE0/AN5/CK1SPP .................................................... 18
RE1/AN6/CK2SPP .................................................... 18
RE2/AN7/OESPP ...................................................... 18
DD ...................................................................... 12, 18
V
SS ...................................................................... 12, 18
V
USB .................................................................... 12, 18
V
PIC18F2458/2553 ....................................................... 9
PIC18F4458/4553 ..................................................... 13
and A/D Operation ..................................................... 26
/ICVPP ....................................................... 18
REF-/CVREF ....................................... 10, 14
REF+ .................................................. 10, 14
/HLVDIN/C2OUT ............................ 10, 14
....................................... 12, 16
© 2007 Microchip Technology Inc. Preliminary DS39887B-page 39
PIC18F2458/2553/4458/4553
R
Reader Response .............................................................. 42
Registers
ADCON0 (A/D Control 0) ........................................... 19
ADCON1 (A/D Control 1) ........................................... 20
ADCON2 (A/D Control 2) ........................................... 21
DEVID1 (Device ID 1) ................................................30
DEVID2 (Device ID 2) ................................................30
Revision History .................................................................37
S
Special Features of the CPU ..............................................29
T
Timing Diagrams
A/D Conversion .......................................................... 34
Timing Diagrams and Specifications
A/D Conversion Requirements .................................. 34
W
WWW Address .................................................................. 41
WWW, On-Line Support ...................................................... 4
DS39887B-page 40 Preliminary © 2007 Microchip Technology Inc.
PIC18F2458/2553/4458/4553

THE MICROCHIP WEB SITE

Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:
Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software
General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing
Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives

CUSTOMER CHANGE NOTIFICATION SERVICE

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
• Development Systems Information Line
Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.
Technical support is available through the web site at: http://support.microchip.com
Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest.
To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions.
© 2007 Microchip Technology Inc. Preliminary DS39887B-page 41
PIC18F2458/2553/4458/4553

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod­uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To :
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From:
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Would you like a reply? Y N
Device: Literature Number:
Questions:
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2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
Technical Publications Manager
Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
Total Pages Sent ________
FAX: (______) _________ - _________
DS39887BPIC18F2458/2553/4458/4553
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS39887B-page 42 Preliminary © 2007 Microchip Technology Inc.
PIC18F2458/2553/4458/4553

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X /XX XXX
Device
Range
Device PIC18F2458/2553
PIC18F2458/2553T V
DD range 4.2V to 5.5V
PIC18LF2458/2553 PIC18LF2458/2553T V
DD range 2.0V to 5.5V
(1)
, PIC18F4458/4553
(2)
, PIC18F4458/4553T
(1)
, PIC18LF4458/4553
(2)
, PIC18LF4458/4553T
PatternPackageTemperature
(1)
,
(2)
;
(1)
,
(2)
;
Examples:
a) PIC18LF4553-I/P 301 = Industrial temp., PDIP
package, Extended VDD limits, QTP pattern #301.
b) PIC18LF2458-I/SO = Industrial temp., SOIC
package, Extended V
c) PIC18F4458-I/P = Industrial temp., PDIP
package, normal V
DD limits.
DD limits.
Temperature Range I = -40°C to +85°C (Industrial)
Package PT = TQFP (Thin Quad Flatpack)
Pattern QTP, SQTP, Code or Special Requirements
E= -40°C to +125°C (Extended)
SO = SOIC SP = Skinny PDIP P=PDIP ML = QFN
(blank otherwise)
Note 1: F = Standard Voltage Range
LF = Wide Voltage Range
2: T = In tape and reel TQFP
packages only.
© 2007 Microchip Technology Inc. Preliminary DS39887B-page 43

WORLDWIDE SALES AND SERVICE

AMERICAS
Corporate Office
2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com
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Boston
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Tel: 86-10-8528-2100 Fax: 86-10-8528-2104
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Tel: 86-28-8665-5511 Fax: 86-28-8665-7889
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Tel: 91-11-4160-8631 Fax: 91-11-4160-8632
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EUROPE
Austria - Wels
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06/25/07
DS39887B-page 44 Preliminary © 2007 Microchip Technology Inc.
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