15.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 135
17.0 CAN Module.............................................................................................................................................................................183
21.0 Low Voltage Detect .................................................................................................................................................................. 247
22.0 Special Features of the CPU......................................................................................... ...........................................................251
23.0 Instruction Set Summary.......................................................................................................................................................... 261
24.0 Development Support. .............................................................................................................................................................. 305
26.0 DC and AC Characteristics Graphs and Tables.......................................................................................................................341
Appendix D: Migrating from other PICmicro Devices................................... .... .. ......... .... .. .... ....... .... .... .. .. ......................................350
Appendix E:Development Tool Version Requirements.................................................................................................................351
Index ..................................................................................................................................................................................................353
PIC18CXX8 Product Identification System ........................................................................................................................................363
DS30475A-page 6Advanced Information 2000 Microchip Technology Inc.
PIC18CXX8
TO OUR VALUED CUSTOMERS
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DS30475A-page 8Advanced Information 2000 Microchip Technology Inc.
PIC18CXX8
1.0DEVICE OVERVIEW
This document contains device specific information for
the following three devices:
1. PIC18C658
2. PIC18C858
The PIC18C658 is ava ilable in 64- pin TQFP and 6 8-pin
PLCC packages. The PIC18C858 is available in 80-pin
TQFP and 84-pin PLCC packages.
An overview of features is shown in Table 1-1.
The following two figures are device block diagrams
sorted by pin count; 64/68-pin for Figure 1-1 and
80/84-pin for Figure 1-2. The 64/68-pin and 80/84-pin
pinouts are listed in Table 1-2.
TABLE 1-1:DEVICE FEATURES
FeaturesPIC18C658PIC18C858
Operating FrequencyDC - 40 MHzDC - 40 MHz
Bytes32 K32 K
Program Memory Internal
Data Memory (Bytes)15361536
Interrupt sources2121
I/O PortsPorts A – GPorts A – H, J, K
Timers44
Capture/Compare/PWM modules22
Serial Communications
Parallel CommunicationsPSPPSP
10-bit Analog-to-Digital Module12 input channels16 input channels
Analog Comparators22
RESETS (and Delays)
Programmable Low Voltage DetectYesYes
Programmable Brown-out ResetYesYes
CAN ModuleY esYes
In-Circuit Serial Programming (ICSP™)YesYes
Instruction Set75 Instructions75 Instructions
Legend:TTL = TTL com pat ibl e i nput CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels Analog = Analog input
I= Input O= Output
P= Power OD= Open Drain (no P diode to VDD)
PIC18C658PIC18C85 8
TQFP PLCC TQFP PLCCDescription
716920
—1, 22,
35, 52
39504962
40515063
43, 64
Pin
Type
I/O
Buffer
Type
I
P
——These pins should be left
IICMOS/ST
O
O
STMaster clear (RESET) input. This pin is
an active low RESET to th e device.
Programming voltage i nput
unconnected
Oscillator crystal input or external
clock source input. ST buffer when
configured in RC mode. O th er w i se
CMOS.
CMOS
—
—
TTL
External clock source input. Always
associated with pin function OSC1
(see OSC1/CLKI, OSC2/CLKO pins).
Oscillator crystal output.
Connects to crystal or resonator in
Crystal Oscillator mode.
In RC mode, OSC2 pin outputs CLKO,
which has 1/4 the freque ncy of OSC1
and denotes the instruct i on cycle rate
General purpose I/O pin
DS30475A-page 12Advanced Information 2000 Microchip Technology Inc.
PIC18CXX8
TABLE 1-2: PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number
Pin Name
RA0/AN0
RA0
AN0
RA1/AN1
RA1
AN1
RA2/AN2/V
RA3/AN3/V
RA4/T0CKI
RA5/AN4/SS
RA6See the OSC2/CLKO/RA6 pin
Legend:TTL = TTL com pat ibl e i nput CMOS = CMOS compatible input or output
REF-
RA2
AN2
V
REF-
REF+
RA3
AN3
REF+
V
RA4
T0CKI
/LVDIN
RA5
AN4
SS
LVDIN
ST = Schmitt Trigger input with CMOS levels Analog = Analog input
I= Input O= Output
P= Power OD= Open Drain (no P diode to V
PIC18C658PIC18C85 8
TQFP PLCC TQFP PLCCDescription
24343042
23332941
22322840
21312739
28393447
27383346
Pin
Type
I/O
I/O
I/O
I/O
I/O
I/O
Buffer
Type
PORTA is a bi-directional I/O port
TTL
I
Analog
TTL
I
Analog
TTL
I
Analog
I
Analog
TTL
I
Analog
I
Analog
ST/OD
I
I
I
I
ST
TTL
Analog
ST
Analog
Digital I/O
Analog input 0
Digital I/O
Analog input 1
Digital I/O
Analog input 2
A/D reference voltage (L ow) in put
Digital I/O
Analog input 3
A/D reference voltage (High) input
Digital I/O – Open drain when
configured as output
Timer0 external clock input
Digital I/O
Analog input 4
SPI slave select input
Low voltage detect input
RK0——3952I/OSTDigital I/O
RK1——4053I/OSTDigital I/O
RK2——4154I/OSTDigital I/O
RK3——4255I/OSTDigital I/O
V
SS9, 25,
DD10, 26,
V
VSS20302638P—Gro und reference for analog mod ul es
A
AVDD19292537P—Positive supply for analog modules
Legend:TTL = TTL com pat ibl e i nput CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels Analog = Analog input
I= Input O= Output
P= Power OD= Open Drain (no P diode to V
PIC18C658PIC18C85 8
TQFP PLCC TQFP PLCCDescription
—
—
—
—
—
—
—
—
41, 56
38, 57
—
—
—
—
—
—
—
—
19, 36,
53, 68
2, 20,
37, 49
62
—
61
—
60
—
59
—
11, 31,
51, 70
12, 32,
48, 71
23, 44,
65, 84
2, 24,
45, 61
Pin
Type
76
—
I/OSTDigital I/O
75
—
I/OSTDigital I/O
74
—
I/OSTDigital I/O
73
—
I/OSTDigital I/O
Buffer
Type
PORTJ is a bi-directional I/O port
PORTK is a bi-directional I/O p ort
P—Ground re fe re nce for logic and I/O pins
P—Positive supply for logic and I/O pins
DD)
DS30475A-page 20Advanced Information 2000 Microchip Technology Inc.
PIC18CXX8
2.0OSCILLATOR
CONFIGURATIONS
2.1Oscillator Types
The PIC18CXX8 can be operated in one of eight oscillator modes, programmable by three configuration bits
(FOSC2, FOSC1, and FOSC0).
1. LPLow Power Crystal
2. XTCrystal/Resonator
3. HSHigh Speed Crystal/Resonator
4. HS4High Speed Crystal/Resonator with
PLL enabled
5. RCExternal Resistor/Capac ito r
6. R CIOExternal Resisto r/Capac itor wi th I/O
pin enabled
7. ECExternal Clock
8. ECIOExternal Clock with I/O pin enabled
2.2Crystal Oscillator/Ceramic
Resonators
In XT, LP, HS or HS4 (PLL) oscillator modes, a crystal
or ceramic resonator is connected to the OSC1 and
OSC2 pins to establish oscillation. Figure2-1 shows
the pin connections . An external cloc k source may also
be connected to the OSC1 pin, as shown in Figure 2-3
and Figure 2-4.
The PIC18CXX8 oscillat or desi gn requ ires th e use o f a
parallel cut crystal.
Note:Use of a series cut crystal may give a fre-
quency out of the crystal manufacturer’s
specifications.
FIGURE 2-1:CRYSTAL/CERAMIC
RESONATOR OPERATION
(HS, XT OR LP
OSC CONFIGURATION)
These values are for design guidance only. See
notes on this page.
68 - 100 pF
15 - 68 pF
15 - 68 pF
10 - 68 pF
10 - 22 pF
TBD
TBD
TBD
10 - 68 pF
TBD
68 - 100 pF
15 - 68 pF
15 - 68 pF
10 - 68 pF
10 - 22 pF
TBD
TBD
TBD
10 - 68 pF
TBD
Resonators Used:
455 kHzPanasonic EFO-A455K04B± 0.3%
2.0 MHzMurata Erie CSA2.00MG
4.0 MHzMurata Erie CSA4.00MG
8.0 MHzMurata Erie CSA8.00MT
16.0 MHzMurata Erie CSA16.00MX
All resonators used did not have built-in capacitors.
± 0.5%
± 0.5%
± 0.5%
± 0.5%
TABLE 2-2:CAPACITOR SELECTION FOR
Osc Type
CRYSTAL OSCILLATOR
Crystal
Freq
DS30475A-page 22Advanced Information 2000 Microchip Technology Inc.
PIC18CXX8
2.3RC Oscillator
For timing insensitive applications, the “RC” and
"RCIO" device options offer additional cost savings.
The RC oscillator frequency is a function of the supply
voltage, the resistor (R
EXT) and capacitor (CEXT) v al-
ues and the operating temperature. In addition to this,
the oscillator frequency will vary from unit to unit due
to normal process parameter variation. Furthermore,
the difference in lead frame capacitance between
package types will also affect the oscillation frequency ,
especially for low C
EXT values. The user also needs to
take into account variation due to tolerance of external
R and C components used. Figure 2-2 shows how the
R/C combination is connected.
In the RC oscillator mode, the oscillator frequency
divided by 4 is available on the OSC2 pin. This signal
may be used f or t e st pu r pos es or t o sy nc hr o n iz e ot he r
logic.
FIGURE 2-2:RC OSCILLATOR MODE
VDD
REXT
OSC1
CEXT
VSS
F
OSC/4
or I/O
Recommended values: 3 kΩ ≤ REXT≤ 100 kΩ
OSC2/CLKO/RA6
CEXT > 20pF
Internal
clock
PIC18CXX8
2.4External Clock Input
The EC and ECIO os c ill ato r m ode s req uire a n e xt erna l
clock source to be connected to the OSC1 pin. The
feedback device between OSC1 and OSC2 is turned
off in these mode s to save c urrent. The re is no os cill ator start-up time required after a Power-on Reset or
after a recovery from SLEEP mode.
In the EC oscillator mode, the oscillator frequency
divided by 4 is available on the OSC2 pin. This signal
may be used f or t e st pu r pos es or t o sy nc hr o n iz e ot he r
logic. Figure 2-3 shows the pin connecti ons for the EC
oscillator mode.
FIGURE 2-3:EXTERNAL CLOCK INPUT
OPERATION
(EC OSC CONFIGURATION)
Clock from
ext. system
F
OSC/4
The ECIO oscillator mode functions like the EC mode,
except that the OSC2 pin becomes an additional general purpose I/O pin. The I/O pin becomes bit 6 of
PORTA (RA6). Figure 2-4 shows the pin connections
for the ECIO oscillator mode.
OSC1
PIC18CXX8
OSC2
FIGURE 2-4:EXTERNAL CLOCK INPUT
OPERATION
(ECIO CONFIGURATION)
The RCIO oscillator mode functions like the RC mode,
except that the OSC2 pin becomes an additional general purpose I/O pin. The I/O pin becomes bit 6 of
PORTA (RA6).
A Phase Locked Loop circuit is provided as a programmable option for users that want to multiply the
frequency of the i nc om ing c rys tal o sc ill ato r s ig nal b y 4.
For an input clock frequency of 10 MHz, the internal
clock frequency will be multiplied to 40 MHz. This is
useful for customers who are concerned with EMI due
to high frequency crystals.
FIGURE 2-5:PLL BLOCK DIAGRAM
OSC2
Crystal
Osc
Phase
Comparator
IN
F
FOUT
The PLL can only be enabled when the oscillator configuration bits are programmed for HS mode. If they
are programmed for any other mode, the PLL is not
enabled and the system clock will come directly from
OSC1.
The PLL is one of the modes of the FOSC2:FOSC0
configuration bits . Th e o sc ill ato r mode is specified during device programming.
A PLL lock timer is used to ensure that the PLL has
locked before device execution starts. The PLL lock
timer has a time-out referred to as T
FOSC2:FOSC0 = ‘110’
Loop
Filter
PLL.
VCO
SYSCLK
OSC1
Divide by 4
MUX
DS30475A-page 24Advanced Information 2000 Microchip Technology Inc.
PIC18CXX8
2.6Oscillator Switching Feature
The PIC18CXX8 devices include a feature that allows
the system clock source to be switched from the main
oscillator t o an alternate lo w frequency clock s ource.
For the PIC18CXX8 devices, this alternate clock
source is the Timer1 oscillator. If a l ow freque ncy c rystal (32 kHz, for example) has been attached to the
Timer1 oscillator pins and the Timer1 oscillator has
been enabled, the device can switch to a low power
execution mode. Figure 2-6 shows a block diagram of
the system clock so urc es. The clock switching feature
is enabled by programming the Oscillator Switching
Enable (OSCSEN
CONFIG1H to a ’0’. Clock switching is disabled in an
erased device. See Section 9 for further details of the
Timer1 oscillator. See Section 22.0 for Configuration
Register details.
) bit in Configuration register
FIGURE 2-6:DEVICE CLOCK SOURCES
2.6.1SYSTEM CLOCK SWITCH BIT
The system clock source switching is performed under
software control. The system clock switch bit, SCS
(OSCCON register), controls the clock switching. When
the SCS bit is ’0’, the system clock source comes from
the main oscillator selected by the FOSC2:FOSC0 configuration bits. When the SCS bit is set, the system clock
source will come from the T imer1 oscilla tor . The SCS bit
is cleared on all forms of RESET.
Note:The Timer 1 oscillator mu st be enabl ed to
switch the system clock source. The
Timer1 oscillator is enabled by setting the
T1OSCEN bit in the T imer1 cont rol register
(T1CON). If the Timer1 oscillator is not
enabled, any write to the SCS bit will be
ignored (SCS bit forced cleared) and the
main oscillator will continue to be the system clock source.
REGISTER 2-1:OSCCON REGISTER
U-0U-0U-0U-0U-0U-0U-0R/W-1
———————SCS
bit 7bit 0
bit 7-1Unimplemented: Read a s '0'
bit 0SCS: System Clock Switch bit
OSCSEN configuration bit = ’0’ and T1OSCEN bit is set:
when
1 = Switch to Timer1 Oscillator/Clock pin
0 = Use primary Oscillator/Clock input pin
2.6.2OSCILLATOR TRANSITIONS
The PIC18CXX8 devices contain circuitry to prevent
"glitches" when switching between oscillator sources.
Essentially, the circuitry waits for eight rising edges of
the clock source that the processor is switching to.
This ensures that the new clock source is stable and
that its pulse width will not be less than the shortest
pulse width of the two clock sources.
A timing diagram indicating the transition from the
main oscillator to the Timer1 oscillator is shown in
The sequence of events that takes place when switching from the Timer1 oscillator to the main oscillator will
depend on the mode of the main oscillator. In addition
to eight clock cycles of the main oscillator, additional
delays may take place.
If the main oscillator is configured for an external crystal (HS, XT, LP), the transition will take place after an
oscillator start-up time (T
OST) has occurred. A timing
diagram indicating the transition from the Timer1 oscillator to the main oscillator for HS, XT and LP modes is
shown in Figure 2-8.
Figure 2-7. The Timer1 oscillator is assumed to be
running all the time. After the SCS bit is set, the processor is frozen at the next occurring Q1 cycle. After
eight synchronization cycles are counted from the
Timer1 oscillator, operation resumes. No additional
delays are required after the synchronization cycles.
FIGURE 2-7:TIMING DIAGRAM FOR TRANSITION FROM OSC1 TO TIMER1 OSCILLATOR
Q1
T1OSI
OSC1
Internal
System
Clock
SCS
(OSCCON<0>)
Program
Counter
TOSC
Q1
TDLY
TT1P
21345678
Tscs
PC + 2PC
Q3Q2Q1Q4Q3Q2
Q4Q1
Q2Q3Q4Q1
PC + 4
Note 1:Delay on internal system clock is eight oscillator cycles for synchronization.
FIGURE 2-8:TIMING DIAGRAM FOR TRANSITION BETWEEN TIMER1 AND OSC1 (HS,XT,LP)
Q3Q4
T1OSI
OSC1
OSC2
Internal System
Clock
SCS
(OSCCON<0>)
Program Counter
Note 1:TOST = 1024TOSC (drawing not to scale).
PCPC + 2
Q1
TOST
TOSC
TT1P
12345678
TSCS
Q1 Q2 Q3 Q4 Q1 Q2
Q3
PC + 4
DS30475A-page 26Advanced Information 2000 Microchip Technology Inc.
PIC18CXX8
If the main oscill ator is confi gured for HS4 (PLL) m ode,
an oscillator start-up tim e (T
time-out (T
PLL) will occur. The PLL time-out is typicall y
OST) plus an additional PLL
2 ms and allows the PLL to lock to the main oscillator
frequency. A timing diagram indicating the transition
from the Timer1 oscilla tor to the main os cillator f or HS4
mode is shown in Figure 2-9.
If the main oscillato r is co nfigure d in th e RC, R CIO, EC
or ECIO modes, t here i s no os ci lla tor st art-u p time-out.
Operation will resume after eight cycles of the main
oscillator have been counted. A t iming diagram ind icating the transition from the Timer1 oscillator to the main
oscillator for RC, RCIO, EC and ECIO modes is shown
in Figure 2-10.
FIGURE 2-9:TIMING FOR TRANSITION BETWEEN TIMER1 AND OSC1 (HS WITH PLL)
Q4Q1
T1OSI
OSC1
TOST
Internal System
Clock
(OSCCON<0>)
Program Counter
Note 1:TOST = 1024TOSC (drawing not to scale).
SCS
PCPC + 2
Q1 Q2 Q3 Q4 Q1 Q2
FIGURE 2-10: TIMING FOR TRANSITION BETWEEN TIMER1 AND OSC1 (RC, EC)
2.7Effects of SLEEP Mode on the
On-chip Oscillator
When the device executes a SLEEP instruction, the
on-chip clocks and oscillator are turned off and the
device is held at the beginning of an instruction cycle
(Q1 state). With th e o scill ato r off, the OSC1 and OSC2
signals will stop oscillating. Since all the transistor
switching currents have been removed, SLEEP mode
achieves the lowest current consumption of the device
(only leakage currents). Enabling any on-chi p feature
that will operate duri ng SLEEP will i ncrease th e current
consumed during SLEEP. The user can wake from
SLEEP through external RESET, Watchdog Timer
Reset or through an interrupt.
2.8Power-up Delays
Power up del ays are contr olled by t wo timers, so that
no external RESET circuitry is required for most applications. The delays ensure that the device is kept in
RESET until the device powe r supply and clock ar e stable. For additional information on RESET operation,
see Section 3.0 RESET .
The first timer is the Power-up Timer (PWRT), which
optionally provides a fixed delay of T
#33) on power-up only (POR and BOR). The second
timer is the Osci llator Start-up T ime r (OST), intended to
keep the chip in RESET until the crystal oscillator is
stable.
With the PLL enabled (HS4 oscillator mode), the
time-out sequenc e following a Power-on Reset is diff erent from other oscil lator modes. The time-out se quence
is as follows: th e PWRT time-ou t is invoked a fter a POR
time delay has expired, then the Oscillator Start-up
Timer (OST) is invoked. However, this is still not a sufficient amount of time to allow the PLL to lock at high
frequencies. The PWRT timer is used to provide an
additional time -out. Th is ti me is called T
#7) to allow the PLL ample time to lo ck to the incom ing
clock frequency.
PWRT (parameter
PLL (parameter
TABLE 2-3:OSC1 AND OSC2 PIN STATES IN SLEEP MODE
OSC ModeOSC1 PinOSC2 Pin
RCFloating, external resistor should pull high At logic low
RCIOFloating, external resistor should pull high Configured as PORTA, bit 6
ECIOFloatingConfigured as PORTA, bit 6
ECFloatingAt logic low
LP, XT, and HSFeedback inverter disabled, at quiescent
voltage level
Note:See Table 3-1 in Section 3.0 RESET, for time-outs due to SLEEP and MCLR
Feedback inverter disabled, at quiescent
voltage level
Reset.
DS30475A-page 28Advanced Information 2000 Microchip Technology Inc.
PIC18CXX8
3.0RESET
The PIC18CXX8 differentiates between various kinds
of RESET:
a) Power-on Reset (POR)
b) MCLR
c) MCLR
d) Watchdog Timer (WDT) Reset (during normal
Most registers are unaff ected by a RESET. Their status
is unknown on POR and unchanged by all other
RESETs. The other registers are forced to a “RESET”
Reset during normal operation
Reset during SLEEP
operation)
state on Power-on Reset, MCLR
Brown-out Reset, MCLR
Reset during SLEEP and by
the RESET instruction.
Most registers are not affected by a WDT wake-up,
since this is viewed as the resumption of normal operation. Status bits from the RCON register, RI
and BOR are set or cleared differently in different
POR
RESET situations, as indicated i n Table 3-2. These bits
are used in software to determine the nature of the
RESET. See Table 3-3 for a full description of the
RESET states of all registers.
A simplified block diagram of the on-chip RESET circuit
is shown in Figure 3-1.
The Enhanced MCU devices have a MCLR
in the MCLR
Reset path. The filter will detect and
ignore small pulses.
A WDT Reset does not drive MCLR
FIGURE 3-1:SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
RESET
Instruction
Stack
Pointer
Stack Full/Underflow Reset
External Reset
, WDT Reset,
, TO, PD,
noise filter
pin low.
MCLR
WDT
Module
DD Rise
V
Detect
VDD
Brown-out
Reset
OST/PWRT
OST
OSC1
On-chip
RC OSC
Note 1: This is a separate oscillator from the RC oscillator of the CLKI pin.
A Power-on Reset pulse is generated on-chip when a
V
DD rise is detected. To take advan tage of th e POR cir-
cuitry, connect the MCLR
resistor) to V
DD. This will eliminate ext ernal RC compo-
pin directly (or through a
nents usually needed to create a Power-on Reset
delay . A minimum ris e rate for VDD is specified (parameter D004). For a slow rise time, see Figure 3-2.
When the device starts normal operation (exits the
RESET condition), device operating parameters (voltage, frequency, temperature,...) must be m et to en su re
operation. If these cond itions are not met, the d evice
must be held in RESET until the operating conditions
are met. Brown-out Reset may be used to meet the
voltage start-up condition.
FIGURE 3-2:EXTERNAL POWER-ON
RESET CIRCUIT (FOR SLOW
DD POWER-UP)
V
DD
V
D
R
R1
MCLR
C
Note 1: External Power-on Reset circuit is required
only if the V
DD power-up slope is too slow.
The diode D hel ps d isch arge th e ca pacito r
quickly when V
DD powers down.
2: R < 40 kΩ is recommended to make sure
that the voltage drop across R does not
violate the device’s electrical specification.
3: R1 = 100Ω to 1 kΩ will limit any current
flowing into MCLR
C in the even t of MCLR/
down due to Electrostatic Discharge
(ESD) or Electrical Overstress (EOS).
PIC18CXX8
from external capacitor
VPP pin break-
3.2Power-up Timer (PWRT)
The Power-up Timer provides a fixed nominal time-out
(parameter #33), only on power-up from the POR. The
Power-up Timer operates on an internal RC oscillator.
The chip is kept in RESET as long as the PWRT is
active. The PWRT ’s time delay allows V
acceptable level. A configuration bit (PWRTEN
DD to rise to an
in
CONFIG2L register) is provided to enable/disable the
PWRT.
The power-up time dela y will vary f rom chip to c hip due
DD, temperature and process variation. See DC
to V
parameter #33 for details.
3.3Oscillator Start-up Timer (OST)
The Oscillator Start-up Timer (OST) provides 1024
oscillator cycle (from OSC1 input) delay after the
PWRT delay is over (parameter #32). This ensures that
the crystal oscilla tor or res onator has started an d stabilized.
The OST time-out is invoked only for XT, LP, HS and
HS4 modes and only on Power-on Reset or wake-up
from SLEEP.
3.4PLL Lock Time-out
With the PLL enabled, the time-ou t sequen ce foll owin g
a Power-on Reset is different from other oscillator
modes. A portion of the Pow er-up T imer is used to provide a fixed time-out th at is suff icient for the PLL to lock
to the main oscillato r frequency. This PLL lock time-out
PLL) is typically 2 ms and follows the oscillator
(T
start-up time-out (OST).
3.5Brown-out Reset (BOR)
A configuration bit, BOREN, can disable (if
clear/programmed) or enable (if set) the Brown-out
Reset circuitry. If VDD falls below parameter D005 for
greater than parameter #35, the brown-out situation
resets the chip. A RESET may not occur if VDD falls
below parameter D005 for less than parameter #35.
The chip will remain in Bro wn-out Re set unt il V
above BV
DD. The Power-up T im er w ill th en be invoked
and will keep the chip in RESET an additional time
delay (parameter #33). If V
DD drops below BVDD while
the Power-up Timer is running, the chip will go back
into a Brown-out Reset and the Power-up Timer will be
initialized . Once V
DD rises above BVDD, the Power-up
Timer will execute the additional time delay.
DD rises
DS30475A-page 30Advanced Information 2000 Microchip Technology Inc.
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